Micro-led display and manufacturing method thereof

Abstract

The application provides a micro-LED display screen and a manufacturing method thereof. The micro-LED display screen comprises, from bottom to top, a circuit substrate and a transparent conductive layer, a plurality of RGB three-color chips are arranged between the circuit substrate and the transparent conductive layer, the light-emitting surface of the RGB three-color chip is arranged close to the transparent conductive layer, one side of each RGB three-color chip close to the circuit substrate is provided with a first electrode, one side of each RGB three-color chip close to the transparent conductive layer is provided with a second electrode, the first electrode of each RGB three-color chip is fixedly connected to the circuit substrate through a bonding pad, the second electrode of each RGB three-color chip is connected to the transparent conductive layer, and the micro-LED display screen is further provided with a metal mesh layer, wherein the metal mesh layer is connected to the transparent conductive layer. The application reduces a large number of bonding pads of a conventional substrate, and uses the transparent conductive layer and the metal mesh layer to connect all chip cathodes (anodes) in parallel and lead out from the side, thereby reducing the shielding of light emission of the chips.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a micro-LED display screen and its manufacturing method. Background Technology

[0002] With the development of technology, LEDs (Light Emitting Diodes) are widely used in electronic products such as televisions, computers, and mobile phones. An LED is a solid-state semiconductor device that converts electrical energy into visible light. Its light-emitting principle is electroluminescence, where a forward current is applied to a PN junction, causing free electrons and holes to recombine and emit light, thus directly converting electrical energy into light energy. As a new lighting source material, LEDs are widely used due to their advantages such as fast response speed, good shock resistance, long lifespan, energy saving, and environmental friendliness. They are currently widely applied in landscaping and indoor / outdoor lighting.

[0003] In existing technologies, most micro-LED displays use a flip-chip LED structure. The flip-chip LEDs are soldered to the circuit board via pads to achieve direct RGB display. However, due to the extremely small size of the flip-chip LEDs, the close proximity of the two pads during mass transfer and soldering can lead to soldering abnormalities or even short circuits, even with a displacement of a few micrometers. Furthermore, for micro-LED chips, the chip area is already small enough; placing two even smaller pads within this area further complicates subsequent soldering. In flip-chip LEDs, the single-sided placement of anode and cathode on such a tiny chip reduces the light-emitting area by more than 20%, resulting in low luminous efficiency. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a micro-LED display screen. This solution addresses the problems in existing technologies where the flip-chip used is too small. For flip-chip LEDs, the two pads are too close together, and even a few micrometers of misalignment during mass transfer and soldering can lead to soldering abnormalities or even short circuits. Furthermore, for micro-LED chips, the chip area is already small enough; placing two even smaller pads on this small area further increases the difficulty of subsequent soldering. In flip-chip LEDs, the single-sided placement of the anode and cathode on such a tiny chip reduces the chip's light-emitting area by more than 20%, resulting in low luminous efficiency.

[0005] To achieve the above objectives, the embodiments of the present invention are implemented through the following technical solutions:

[0006] On one hand, embodiments of the present invention provide a micro-LED display screen, which includes, from bottom to top, a circuit substrate and a transparent conductive layer. Multiple RGB three-color chips are disposed between the circuit substrate and the transparent conductive layer. The light-emitting surfaces of the RGB three-color chips are disposed close to the transparent conductive layer. Each RGB three-color chip has a first electrode on the side closest to the circuit substrate and a second electrode on the side closest to the transparent conductive layer. The first electrode of each RGB three-color chip is bonded and fixed to the circuit substrate via a pad. The second electrode of each RGB three-color chip is connected to the transparent conductive layer. A metal mesh layer is also provided within the micro-LED display screen. The metal mesh layer is connected to the transparent conductive layer and extends an epitaxial portion at its edge, which is connected to the circuit substrate.

[0007] Furthermore, each of the RGB three-color chips has a transparent conductive layer on its second electrode, and a metal mesh layer is provided between adjacent transparent conductive layers.

[0008] Furthermore, the second electrode of each of the RGB three-color chips is connected in parallel through a transparent conductive layer, and the metal mesh layer is disposed above the transparent conductive layer and located between adjacent RGB three-color chips.

[0009] Furthermore, an opaque layer is provided between adjacent RGB three-color chips.

[0010] Furthermore, a display screen filling protective layer is provided on the side of the metal mesh layer away from the RGB three-color chip, and a display screen glass substrate is provided on the side of the display screen filling protective layer away from the RGB three-color chip.

[0011] On the other hand, embodiments of the present invention also provide a method for manufacturing a micro-LED display screen, for manufacturing the above-mentioned micro-LED display screen, the method comprising:

[0012] A circuit board is provided, and multiple RGB three-color chips are transferred onto the circuit board, wherein the light-emitting surface of the RGB three-color chips is disposed away from the circuit board, and the side of the RGB three-color chips with a first electrode is disposed facing the circuit board;

[0013] The RGB three-color chip is fixed onto the circuit board;

[0014] A second electrode is fabricated on the side of the RGB three-color chip away from the circuit substrate;

[0015] A transparent conductive layer and a metal mesh layer are sequentially fabricated on the side of the RGB three-color chip where the second electrode is located;

[0016] The steps of sequentially fabricating a transparent conductive layer and a metal mesh layer on the side of the RGB three-color chip where the second electrode is located include:

[0017] Prepare a suspension of silver nanowires and coat the suspension of silver nanowires onto the surface of the second electrode. Bake the suspension of silver nanowires to form a mesh structure to obtain the transparent conductive layer.

[0018] A metal layer is magnetron sputtered onto the transparent conductive layer;

[0019] Photoresist is coated onto the metal layer, and the photoresist is exposed, developed, and then the copper layer is etched using a wet etching method before the photoresist is removed to form the metal mesh layer.

[0020] Furthermore, the concentration of the silver nanowire suspension is 0.01wt%–0.1wt%, the diameter of the silver nanowire is 10–50 nanometers, and the ratio of the length to the diameter of the silver nanowire is 500–200.

[0021] Furthermore, the step of fixing the RGB three-color chip onto the circuit board includes:

[0022] The RGB three-color chip is fixed to the circuit board by preparing pads through mass soldering or eutectic bonding.

[0023] Further, the step of forming an ohmic contact by fabricating a second electrode on the side of the RGB three-color chip away from the circuit substrate includes:

[0024] Photosensitive resin is used to coat, expose, develop, and pattern the side of the RGB chip away from the circuit substrate.

[0025] The patterned photosensitive resin metal is vapor-deposited to obtain a metal region;

[0026] The metal region at the target location is removed using a lift-off method to obtain the second electrode.

[0027] Furthermore, the method also includes:

[0028] An opaque layer is provided between the RGB three-color chips;

[0029] A display screen filling protective layer is prepared on the metal mesh layer;

[0030] A display glass substrate is prepared on the protective layer of the display screen.

[0031] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows:

[0032] In a display screen based on a vertical chip design, the anode and cathode of the RGB three-color chip are located on opposite sides of the chip. The electrode of the RGB three-color chip closest to the circuit board only needs to be connected to the circuit board through a single pad, reducing the number of pads on conventional boards and improving soldering yield. The electrode of the RGB three-color chip furthest from the circuit board uses a transparent conductive layer and a metal mesh layer to connect all the anodes (cathodes) of the RGB three-color chips in parallel and lead them out on the side through the extension portion of the metal mesh layer. The metal mesh layer is located above or on the same layer as the transparent conductive layer and between adjacent RGB three-color chips, which reduces the obstruction of light emitted by the chip while conducting electricity, thus improving luminous efficiency. Attached Figure Description

[0033] Figure 1 This is a cross-sectional view of the micro-LED display screen in the first embodiment of the present invention;

[0034] Figure 2 for Figure 1 A plan view of the metal mesh layer in the middle;

[0035] Figure 3 This is an enlarged view of the first electrode of the micro-LED display screen in this invention.

[0036] Figure 4 This is a cross-sectional view of the micro-LED display screen in the second embodiment of the present invention;

[0037] Figure 5 for Figure 4 A plan view of the metal mesh layer in the middle;

[0038] Figure 6 The process flow of the manufacturing method of the micro-LED display screen in the first and second embodiments of the present invention. Figure 1 ;

[0039] Figure 7 for Figure 6 Detailed flowchart of step S104;

[0040] Figure 8 for Figure 6 Detailed flowchart of step S102;

[0041] Figure 9 This is a detailed flowchart illustrating the micro-LED display screen in the first and second embodiments of the present invention, in which an opaque layer is provided between the RGB three-color chips;

[0042] Figure 10The process flow of the manufacturing method of the micro-LED display screen in the first and second embodiments of the present invention. Figure 2 ;

[0043] Explanation of key component symbols:

[0044] Circuit board 10 solder pads 20 RGB three-color chip 30 First electrode 34 Second electrode 35 transparent conductive layer 40 Metal mesh layer 50 extension 55 Display screen filler protective layer 60 Display glass substrate 70 Opaque layer 80

[0045] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0046] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of the invention are illustrated in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0047] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0049] Example 1

[0050] Please see Figures 1 to 3The image shows a micro-LED display screen according to the first embodiment of the present invention. From bottom to top, it includes a circuit substrate 10 and a transparent conductive layer 40. A plurality of RGB three-color chips 30 are disposed between the circuit substrate 10 and the transparent conductive layer 40. The light-emitting surface of the RGB three-color chips 30 is disposed close to the transparent conductive layer 40. Each RGB three-color chip 30 has a first electrode 34 on the side close to the circuit substrate 10 and a second electrode 35 on the side close to the transparent conductive layer 40. The first electrode 34 of each RGB three-color chip 30 is bonded and fixed to the circuit substrate 10 through a pad 20. The second electrode 35 of each RGB three-color chip 30 is connected to the transparent conductive layer 40. The micro-LED display screen also includes a metal mesh layer 50. The metal mesh layer 50 is connected to the transparent conductive layer 40 and extends an epitaxial portion 55 at its edge. The epitaxial portion 55 is connected to the circuit substrate 10.

[0051] Preferably, the metal mesh layer 50 is made of copper.

[0052] Understandably, this invention is based on a vertical chip design display screen. The first electrode 34 and the second electrode 35 are respectively disposed on both sides of the RGB three-color chip 30. The side of the RGB three-color chip 30 closest to the circuit board 10 only needs to be connected to the circuit board 10 through one pad 20, which reduces the number of pads 20 of conventional substrates. On the side of the RGB three-color chip 30 where the second electrode 35 is located, a transparent conductive layer 40 and a metal mesh layer 50 are used to connect the cathodes (anodes) of all the RGB three-color chips 30 together in parallel and lead them out on the side through the epitaxial portion 55 of the metal mesh layer 50, which reduces the obstruction of light emitted from the chip. Using copper as the metal mesh layer 50 can enhance the conductivity of the transparent conductive layer 40, and due to the opacity of metal, cross-lighting between chips can be further reduced.

[0053] Specifically, each of the RGB three-color chips 30 has a transparent conductive layer 40 on its second electrode 35, and a metal mesh layer 50 is provided between adjacent transparent conductive layers 40.

[0054] Understandably, the second electrode 35 of each of the RGB three-color chips 30 is first connected by the transparent conductive layer 40, and then the metal mesh layer 50 is used to connect each of the transparent conductive layers 40 in parallel at the edge of the transparent conductive layer 40, so as to realize the parallel connection between each of the RGB three-color chips 30.

[0055] Furthermore, an opaque layer 80 is provided between adjacent RGB three-color chips 30.

[0056] Preferably, the opaque layer 80 is made of a black resin material with a high OD value.

[0057] It should be noted that the RGB three-color chip 30 consists of a red light chip, a blue light chip, and a green light chip arranged at intervals.

[0058] Understandably, the opaque layer 80 disposed between the RGB three-color chips 30 can further prevent light transmission between the chips.

[0059] Furthermore, a display screen filling protective layer 60 is provided on the side of the metal mesh layer 50 away from the RGB three-color chip 30, and a display screen glass substrate 70 is provided on the side of the display screen filling protective layer 60 away from the RGB three-color chip 30.

[0060] Example 2

[0061] Please refer to Figures 4 to 5 The image shows a micro-LED display screen in the second embodiment of the present invention. The difference between the micro-LED display screen in this embodiment and the micro-LED display screen in the first embodiment is that:

[0062] The second electrode 35 of each of the RGB three-color chips 30 is connected in parallel through a transparent conductive layer 40, and the metal mesh layer 50 is disposed above the transparent conductive layer 40 and located between adjacent RGB three-color chips 30.

[0063] Understandably, the second electrode 35 of each of the RGB three-color chips 30 is first connected in parallel using the transparent conductive layer 40, and then the metal mesh layer 50 is disposed on the transparent conductive layer 40. The metal mesh layer 50 forms holes on the light-emitting surface of the RGB three-color chip 30 to avoid blocking the light emitted by the RGB three-color chip 30.

[0064] In summary, the micro-LED display screens in Embodiments 1 and 2 of this invention, based on a vertical chip design, reduce the number of solder pads 20 on conventional substrates. The solder pads 20 can be appropriately enlarged, which improves the soldering yield. The transparent conductive layer 40 and the metal mesh layer 50 are used to connect all the chip cathodes (anodes) together and lead them out on the side, reducing the obstruction of light emitted from the chips. Copper is used as the metal mesh layer 50 to enhance the conductivity of the conductive layer. Furthermore, due to the opacity of the metal, light crosstalk between chips can be further reduced. At the same time, the opaque layer 80 is disposed between the RGB three-color chips 30 to further prevent light crosstalk between chips.

[0065] Example 3

[0066] Please see Figure 6The diagram illustrates a method for manufacturing a micro-LED display screen according to the first and second embodiments of the present invention. This method, used to manufacture the aforementioned micro-LED display screen, includes steps S101 to S104.

[0067] S101, a circuit board is provided, and multiple RGB three-color chips are transferred onto the circuit board, wherein the light-emitting surface of the RGB three-color chips is disposed away from the circuit board, and the side of the RGB three-color chips with the first electrode is disposed facing the circuit board.

[0068] S102, fix the RGB three-color chip onto the circuit board;

[0069] S103, a second electrode is prepared on the side of the RGB three-color chip away from the circuit substrate;

[0070] S104, a transparent conductive layer and a metal mesh layer are sequentially prepared on the side of the RGB three-color chip where the second electrode is provided.

[0071] In practice, the RGB three-color chips can be transferred in large quantities onto the circuit board using laser or flexible stamping. The circuit board is a driving carrier board or a TFT substrate.

[0072] Further, please refer to Figure 7 The steps of sequentially fabricating a transparent conductive layer and a metal mesh layer on the side of the RGB three-color chip where the second electrode is provided include S1041 to S1043:

[0073] S1041, prepare a silver nanowire suspension, coat the silver nanowire suspension onto the surface of the second electrode, and bake the silver nanowire suspension to form a mesh structure to obtain the transparent conductive layer.

[0074] S1042, a metal layer is magnetron sputtered onto the transparent conductive layer;

[0075] S1043, Photoresist is coated on the metal layer, and the photoresist is exposed, developed, and the copper layer is etched by wet etching to remove the photoresist to form the metal mesh layer.

[0076] In specific implementation, the concentration of the silver nanowire suspension is 0.01wt%-0.1wt%, the diameter of the silver nanowire is 10-50 nanometers, the ratio of the length to the diameter of the silver nanowire is 500-200, the coating method is slit coating, and the silver nanowire with a final dry film thickness between 50-200 nanometers is the transparent conductive layer, and the light transmittance of the transparent conductive layer is 85%-95%.

[0077] The difference between the micro-LED displays in Embodiment 1 and Embodiment 2 in this step is as follows: In Embodiment 1, the transparent conductive layer and the metal mesh layer are on the same layer. The transparent conductive layer is connected to the second electrode of each of the RGB three-color chips. The metal mesh layer is then used to connect the transparent conductive layers in parallel at the edge of the transparent conductive layer to achieve parallel connection between the RGB three-color chips. In Embodiment 2, the metal mesh layer is above the transparent conductive layer. The transparent conductive layer connects the second electrode of each of the RGB three-color chips in parallel. The metal mesh layer is then placed on top of the transparent conductive layer. The metal mesh layer forms holes on the light-emitting surface of the RGB three-color chips to avoid blocking the light emitted by the RGB three-color chips.

[0078] The metal mesh layer is made of copper, and the wet etching process only etches copper and not other metals such as silver. The thickness of the metal mesh layer is 100-1000 nanometers and the line width is 10-50 micrometers.

[0079] Furthermore, the step of fixing the RGB three-color chip onto the circuit board includes:

[0080] The RGB three-color chip is fixed to the circuit board by preparing pads through mass soldering or eutectic bonding.

[0081] Further, please refer to Figure 8 The step of forming an ohmic contact by fabricating a second electrode on the side of the RGB three-color chip away from the circuit substrate includes S1021 to S1023:

[0082] S1021, Photosensitive resin is used to coat, expose, develop, and pattern the side of the RGB chip away from the circuit substrate;

[0083] S1022, the patterned photosensitive resin metal is vapor-deposited to obtain a metal region;

[0084] S1023, the metal region at the target location is removed by lift-off to obtain the second electrode.

[0085] Further, please refer to Figure 9 Methods for manufacturing micro-LED displays also include:

[0086] Prior to step S103, an opaque layer is provided between the RGB three-color chips. Specific steps include S201 to S203:

[0087] S201, providing an opaque material, and filling the gap between the RGB three-color chips with the opaque material;

[0088] S202, the opaque material is homogenized, exposed, and developed to obtain the target filling part;

[0089] S203, remove excess opaque material from the non-target filling portion of the RGB three-color chip surface.

[0090] In specific implementation, the opaque material is a black resin material with a high OD value. Spin coating or molding can be used to fill it instead of step S202. The opaque material can be removed by oxygen etching.

[0091] Further, please refer to Figure 10 The method for manufacturing a micro-LED display also includes S105 to S106:

[0092] After step S104,

[0093] S105, a display screen filling protective layer is prepared on the metal mesh layer;

[0094] S106, Prepare a display glass substrate on the display screen filling protective layer;

[0095] This will allow you to obtain a micro-LED display screen.

[0096] In practice, the protective layer filling the display screen can be made of OCA optical adhesive.

[0097] In summary, the manufacturing method of the micro-LED display screen in Embodiment 3 of the present invention is based on a vertical chip design display screen. The first electrode and the second electrode are respectively disposed on both sides of the RGB three-color chip. The side of the RGB three-color chip closest to the circuit board only needs to be connected to the circuit board through one pad, which reduces the number of pads of conventional substrates. On the side of the RGB three-color chip where the second electrode is located, a transparent conductive layer and a metal mesh layer are used to connect the cathodes (anodes) of all the RGB three-color chips together in parallel and lead them out on the side through the epitaxial portion of the metal mesh layer, which reduces the obstruction of light emitted from the chip. Using copper as the metal mesh layer can enhance the conductivity of the transparent conductive layer, and due to the opacity of the metal, it can further reduce light crosstalk between chips. At the same time, the opaque layer disposed between the RGB three-color chips can further prevent light crosstalk between chips.

[0098] Comparative Example 1

[0099] This embodiment is a micro-LED display screen designed with flip-chip.

[0100] Comparative Example 2

[0101] This embodiment is basically the same as Embodiment 1, except that the metal mesh layer is removed.

[0102] Comparative Example 3

[0103] This embodiment is basically the same as Embodiment 1, except that the opaque layer is removed.

[0104] The results are shown in Table 1.

[0105] Table 1

[0106] Welding yield (%) Conductivity improvement (%) Light transmittance (%) Example 1(a) ＞99.999 100 93.987 Example 1(b) ＞99.999 100 93.856 Example 1(c) ＞99.999 100 94.063 Comparative Example 1 97.978 100 82.547 Comparative Example 2 ＞99.999 95.677 94.624 Comparative Example 3 ＞99.999 100 89.542

[0107] As can be seen from Table 1, in Comparative Example 1, the conventional flip chip has both anode and cathode arranged on the side closest to the circuit board, and two pads are set up, which increases the difficulty of soldering and leads to a 2% decrease in soldering yield. At the same time, the arrangement of anode and cathode on one side blocks the light emitted by the chip, resulting in a 10% decrease in light transmittance.

[0108] In Comparative Example 2, the conductivity of the conventional vertical chip decreased by 5%, but the light transmittance increased by 1% due to the absence of a metal mesh layer. The metal mesh layer of the present invention is located outside the light-emitting surface of the RGB three-color chip, which effectively reduces the obstruction of the RGB three-color chip's light emission by the metal.

[0109] In Comparative Example 3, the opaque layer was not provided between adjacent RGB three-color chips, resulting in severe light crosstalk between the chips, which led to a decrease in light transmittance and a reduction in light emission performance.

[0110] In summary, the micro-LED display screen of this invention is based on a vertical chip design, with anodes and cathodes arranged on both sides of the RGB three-color chips. This improves the soldering yield while reducing light shading. On the side of the RGB three-color chips away from the circuit board, the conductivity is reduced because it is not directly connected to the circuit board. Therefore, a transparent conductive layer and a metal mesh layer are provided on it to connect the electrodes on this side in parallel, increasing conductivity. At the same time, the metal mesh layer is located outside the light-emitting surface of the RGB three-color chips and does not block the light emitted by the RGB three-color chips. Instead, it further reduces light crosstalk between adjacent RGB three-color chips.

[0111] Comparative Example 4

[0112] The comparison between Example 1 and Example 2 is shown in Table 2.

[0113] Table 2

[0114] Welding yield (%) Conductivity improvement (%) Light transmittance (%) Example 1 ＞99.999 100 93.987 Example 2 ＞99.999 100 91.165

[0115] When the metal mesh layer is on top of the transparent conductive layer, the transparent conductive layer will be thicker. As can be seen from Table 2, the light transmittance decreases from 93.987% to 91.165%, a decrease of 3%.

[0116] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0117] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A micro-LED display screen, characterized in that, The micro-LED display comprises, from bottom to top, a circuit board and a transparent conductive layer. Multiple RGB three-color chips are disposed between the circuit board and the transparent conductive layer. The light-emitting surfaces of the RGB three-color chips are positioned close to the transparent conductive layer. Each RGB three-color chip has a first electrode on the side facing the circuit board and a second electrode on the side facing the transparent conductive layer. The first electrode of each RGB three-color chip is bonded to the circuit board via a pad. The second electrode of each RGB three-color chip is connected to the transparent conductive layer. A metal mesh layer is also provided within the micro-LED display. The metal mesh layer is connected to the transparent conductive layer and extends an epitaxial portion at its edge, which is connected to the circuit board.

2. The micro-LED display screen according to claim 1, characterized in that, Each of the RGB three-color chips has a transparent conductive layer on its second electrode, and a metal mesh layer is provided between adjacent transparent conductive layers.

3. The micro-LED display screen according to claim 1, characterized in that, The second electrode of each of the RGB three-color chips is connected in parallel through a transparent conductive layer, and the metal mesh layer is disposed above the transparent conductive layer and located between adjacent RGB three-color chips.

4. The micro-LED display screen according to any one of claims 1 to 3, characterized in that, An opaque layer is provided between adjacent RGB three-color chips.

5. The micro-LED display screen according to any one of claims 1 to 3, characterized in that, A display screen filling protective layer is provided on the side of the metal mesh layer away from the RGB three-color chip, and a display screen glass substrate is provided on the side of the display screen filling protective layer away from the RGB three-color chip.

6. A method for manufacturing a micro-LED display screen, used to manufacture the micro-LED display screen according to any one of claims 1 to 5, characterized in that, The method includes: A circuit board is provided, and multiple RGB three-color chips are transferred onto the circuit board, wherein the light-emitting surface of the RGB three-color chips is disposed away from the circuit board, and the side of the RGB three-color chips with a first electrode is disposed facing the circuit board; The RGB three-color chip is fixed onto the circuit board; A second electrode is fabricated on the side of the RGB three-color chip away from the circuit substrate; A transparent conductive layer and a metal mesh layer are sequentially fabricated on the side of the RGB three-color chip where the second electrode is located; The steps of sequentially fabricating a transparent conductive layer and a metal mesh layer on the side of the RGB three-color chip where the second electrode is located include: Prepare a suspension of silver nanowires and coat the suspension of silver nanowires onto the surface of the second electrode. Bake the suspension of silver nanowires to form a mesh structure to obtain the transparent conductive layer. A metal layer is magnetron sputtered onto the transparent conductive layer; Photoresist is coated onto the metal layer, and the photoresist is exposed, developed, and then the metal layer is etched using a wet etching method to remove the photoresist to form the metal mesh layer.

7. The method for manufacturing a micro-LED display screen according to claim 6, characterized in that, The concentration of the silver nanowire suspension is 0.01wt%–0.1wt%, the diameter of the silver nanowire is 10–50 nanometers, and the ratio of the length to the diameter of the silver nanowire is 500–200.

8. The method for manufacturing a micro-LED display screen according to claim 6, characterized in that, The step of fixing the RGB three-color chip onto the circuit board includes: The RGB three-color chip is fixed to the circuit board by preparing pads through mass soldering or eutectic bonding.

9. The method for manufacturing a micro-LED display screen according to claim 6, characterized in that, The step of forming an ohmic contact by fabricating a second electrode on the side of the RGB three-color chip away from the circuit substrate includes: Photosensitive resin is used to coat, expose, develop, and pattern the side of the RGB three-color chip away from the circuit substrate; The patterned photosensitive resin metal is vapor-deposited to obtain a metal region; The metal region at the target location is removed using a lift-off method to obtain the second electrode.

10. The method for manufacturing a micro-LED display screen according to claim 6, characterized in that, The method further includes: An opaque layer is provided between the RGB three-color chips; A display screen filling protective layer is prepared on the metal mesh layer; A display glass substrate is prepared on the protective layer of the display screen.

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