Camera module

Abstract

A camera module according to an embodiment includes a circuit board including a cavity, a first plate including a first area overlapping the cavity in a vertical direction and a second area different from the first area, a second plate disposed on the first area of the first plate, and an image sensor disposed on the second plate, and wherein an upper surface of the second plate is positioned lower than an upper surface of the circuit board.

Description

TECHNICAL FIELD

[0001] Embodiments relate to a camera module and an optical device including the same. BACKGROUND

[0002] Recently, a miniature camera module has been developed, and the miniature camera module is widely used in small electronic products, such as smart phones, notebook computers, and game devices.

[0003] That is, most mobile electronic devices including smart phones are equipped with a camera device for acquiring an image from an object, and to facilitate portability, mobile electronic devices are gradually becoming smaller.

[0004] Such a camera device can generally include a lens through which light is incident, an image sensor that photographs light incident through the lens, and a plurality of components for transmitting and receiving an electrical signal of an image obtained from the image sensor to and from an electronic device equipped with the camera device. Further, these image sensors and components are generally mounted on a printed circuit board and connected to an external electronic device.

[0005] On the other hand, a conventional camera device uses a printed circuit board such that the image sensor is disposed at a high position. However, when the image sensor is directly mounted on the printed circuit board as described above, there is a problem in that heat generated by the image sensor cannot be dissipated, and thus there is a reliability problem due to heat generation. Recently, to achieve high resolution, the pixels or size of the image sensor are gradually increasing, and thus the heat generation problem of the image sensor further affects the performance of the camera device.

[0006] Further, in a conventional camera device, a printed circuit board is provided on a plate such as a stiffener, and an image sensor is provided on the plate and then connected to the printed circuit board through wire bonding. In this case, a cavity exposing a surface of the plate is formed in the printed circuit board. In this case, when the cavity-type printed circuit board and the plate are used, it is possible to solve a heat dissipation problem while increasing a height of the image sensor. In this camera device, an epoxy resin for bonding the image sensor is applied on the plate, and the image sensor is provided on the applied epoxy resin. However, the camera device as described above has a problem in that warpage occurs due to a difference between a thermal expansion coefficient of the image sensor, a thermal expansion coefficient of the printed circuit board, and a thermal expansion coefficient of the epoxy resin. For example, a heat curing process is performed in a state in which the image sensor is provided on the epoxy resin. In this case, when the heat curing process is performed, a structure including the plate, the epoxy resin, and the image sensor is thermally expanded and then shrinks, and thus there is a problem in that a serious warpage phenomenon occurs, like a shape of "∩". Further, when the warpage phenomenon of the image sensor occurs, there is a problem in that resolution performance of the camera device is deteriorated, thereby reducing a yield of the camera device.

[0007] Therefore, there is a need for a method capable of minimizing warpage of an image sensor. SUMMARY

[0008] TECHNICAL PROBLEM

[0009] The embodiments provide a camera module capable of minimizing a warpage phenomenon of an image sensor and an optical device including the same.

[0010] The technical problems addressed by the proposed embodiments are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by persons skilled in the art from the following description of the proposed embodiments.

[0011] TECHNICAL SOLUTION

[0012] The camera module according to an embodiment includes a circuit board including a cavity, a first plate including a first area overlapping the cavity in a vertical direction and a second area different from the first area, a second plate provided on the first area of the first plate, and an image sensor provided on the second plate, wherein an upper surface of the second plate is positioned lower than an upper surface of the circuit board.

[0013] Further, the camera module further includes a first adhesive member provided between the first plate and the image sensor.

[0014] Further, the first area of the first plate includes a 1-1 area in which the first adhesive member is provided, and a 1-2 area in which the second plate is provided, and wherein the second plate includes an opening overlapping the 1-1 area in the vertical direction.

[0015] Further, the lower surface of the image sensor includes a first portion in direct contact with the first adhesive member and a second portion in direct contact with the second plate.

[0016] Further, the upper surface of the second plate is located on the same plane as the upper surface of the first adhesive member.

[0017] Further, an area of the upper surface of the first adhesive member is smaller than an area of the lower surface of the image sensor.

[0018] Further, the second plate overlaps an outer region of the lower surface of the image sensor in a vertical direction.

[0019] Further, an outer side surface of the second plate is spaced apart from an inner wall of the cavity of the circuit board.

[0020] Further, an outer side surface of the second plate is in direct contact with an inner wall of the cavity of the circuit board.

[0021] Further, the image sensor includes a pixel region including an active pixel region and a dummy pixel region, and a passivation region surrounding the dummy pixel region; and wherein the upper surface of the second plate overlaps a corner region of a lower surface of the active pixel region in a vertical direction.

[0022] Further, the camera module further includes a second adhesive member disposed between the second region of the first plate and the circuit board, wherein the second adhesive member includes an opening overlapping the cavity of the circuit board in a vertical direction.

[0023] Further, the circuit board includes a first terminal, the image sensor includes a second terminal, and wherein the camera module further includes an electric wire connecting the first terminal and the second terminal.

[0024] Further, the camera module further includes a lens barrel, a holder disposed on the circuit board and including a seating portion in which the optical filter is seated, and a cover member disposed on the circuit board and accommodating the holder and the lens barrel.

[0025] Further, the holder includes a vent hole penetrating an inner surface and an outer surface.

[0026] On the other hand, the optical device according to the embodiment includes: a lens barrel; a retainer disposed below the lens barrel; a filter disposed in the retainer; a cover member accommodating the lens barrel, the retainer, and the filter; a circuit board including a cavity and having a cover member and a retainer disposed on its upper surface; a first plate including a first region overlapping the cavity in the vertical direction and a second region different from the first region; a second plate disposed on the first region of the first plate; and an image sensor disposed on the second plate; wherein the first region of the first plate includes a first-1 region; and includes a first-2 region other than the first-1 region overlapping the second plate in the vertical direction, the second plate including an opening overlapping the first-1 region in the vertical direction, wherein a first adhesive member is disposed in the opening, and the lower surface of the image sensor includes a first portion in direct contact with the first adhesive member and a second portion in direct contact with the second plate.

[0027] Invention Effects

[0028] The embodiment includes a first plate and a second plate. The second plate is disposed on a first region of the first plate, which overlaps vertically with a cavity in the circuit board. Furthermore, an image sensor is attached or fixed to the second plate. In this case, the second plate includes an opening in which an adhesive member for attaching the image sensor is disposed. That is, the adhesive member can be disposed on a region on the upper surface of the first plate that overlaps vertically with the opening of the second plate. Furthermore, in an embodiment where at least a portion of the lower surface of the image sensor is in direct contact with the upper surface of the second plate, the image sensor can be attached or fixed to the first plate by the adhesive member. According to this embodiment, at least a portion of the image sensor directly contacts the second plate, thereby minimizing warping of the image sensor. Furthermore, by having at least a portion of the image sensor in direct contact with the second plate, the heat generated by the image sensor can be effectively dissipated to the outside.

[0029] Furthermore, in this embodiment, the area of ​​the adhesive member disposed on the lower surface of the image sensor is smaller than the area of ​​the lower surface of the image sensor. Therefore, compared with the area of ​​the image sensor, the arrangement area of ​​the adhesive member in this embodiment is reduced, thus minimizing the warping phenomenon of the image sensor, which is proportional to the area of ​​the adhesive member.

[0030] Furthermore, this embodiment allows direct contact between the corner region of the lower surface of the active pixel region of the image sensor and the upper surface of the second plate. For example, at least a portion of the active pixel region of the image sensor overlaps with the second plate in the vertical direction. Therefore, this embodiment can solve the warping problem of the active pixel region of the image sensor, thereby improving the operational reliability of the camera module. Attached Figure Description

[0031] Fig. 1 is a view for explaining a warping phenomenon of a camera module of a comparative example.

[0032] Fig. 2 is an exploded perspective view of a camera module according to a first embodiment.

[0033] Fig. 3 is a cross-sectional view of a camera module according to an embodiment. Fig. 1

[0034] Fig. 4 is an enlarged view of a dotted portion of Fig. 3

[0035] Fig. 5 is a plan view showing a circuit board, a first board, and a second board in a state where an image sensor is removed according to a first embodiment.

[0036] Fig. 6 is a cross-sectional view of an embodiment of a camera module according to a second embodiment. Fig. 1

[0037] Fig. 7 is an exploded perspective view of a camera module according to a third embodiment.

[0038] Fig. 8 is a cross-sectional view of a camera module according to an embodiment. Fig. 7

[0039] Fig. 9 is an enlarged view of a dotted portion of Fig. 8

[0040] Fig. 10 is a plan view showing a circuit board, a board, and a first adhesive member in a state where an image sensor is removed according to a third embodiment.

[0041] Fig. 11 is a view showing a degree of warping according to an arrangement area of an adhesive member.

[0042] Fig. 12 is a view for explaining an arrangement relationship between a protruding portion of a board and an image sensor according to a third embodiment.

[0043] Fig. 13 is a perspective view of a portable terminal according to an embodiment.

[0044] Fig. 14 is a block diagram of the portable terminal shown in Fig. 13 DETAILED DESCRIPTION

[0045] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings. ​​​​​​

[0046] However, the spirit and scope of the present application are not limited to a part of the described embodiments, and can be implemented in various other forms, and one or more elements of the embodiments can be selectively combined and substituted within the spirit and scope of the present application.

[0047] Furthermore, unless explicitly defined and described otherwise, the terms used in the embodiments of the present application, including technical and scientific terms, can be interpreted the same as the meanings commonly understood by those of ordinary skill in the art to which the present application pertains, and those terms such as defined in a generally used dictionary can be interpreted as having meanings consistent with the meanings in the context of related fields. Furthermore, the terms used in the embodiments of the present application are used to describe the embodiments, and are not intended to limit the present application.

[0048] In the present specification, the singular form can also include the plural form, unless specifically stated and described otherwise, and when described in "at least one of (or a plurality of) A, B, and C," it can include at least one of all combinations that can be combined in A, B, and C. Furthermore, in describing elements of the embodiments of the present application, terms such as first, second, A, B, (A) and (B) can be used.

[0049] These terms are used only to distinguish the elements from other elements, and the terms are not limited to the nature, order or sequence of the elements. Furthermore, when one element is described as being "connected", "coupled", or "contacted" to another element, it can not only include the case where the element is directly "connected", "coupled", or "contacted" to the other element, but also the case where the element is "connected", "coupled", or "contacted" to the other element through another element.

[0050] Furthermore, when described as being "on (above)" or "under (below)" each element, "on (above)" or "under (below)" can not only include the case where the two elements are directly connected to each other, but also the case where one or more other elements are formed or disposed between the two elements. Furthermore, when expressed as "on (above)" or "under (below)", it can not only include the upward direction based on one element, but also the downward direction.

[0051] The optical axis direction used below is defined as the optical axis direction of a camera actuator and a lens coupled to a camera module, and the vertical direction can be defined as the direction perpendicular to the optical axis.

[0052] The "autofocus function" used below is defined as a function of automatically adjusting the focus on an object by adjusting the distance from an image sensor and moving the lens in the optical axis direction according to the distance of the object, so that a clear image of the object can be obtained on the image sensor.

[0053] Meanwhile, "auto focus" can correspond to "AF (Auto Focus)". Also, closed loop auto focus (CLAF) control can be defined as feedback control of a lens position in real time by sensing a distance between an image sensor and the lens to improve focus adjustment accuracy.

[0054] Also, before describing embodiments of the present application, a first direction can refer to an x-axis direction shown in the drawings, and a second direction can be a direction different from the first direction. For example, the second direction can mean a y-axis direction shown in the drawings, which is perpendicular to the first direction. Also, a third direction can be different from the first direction and the second direction. For example, the third direction can mean a z-axis direction shown in the drawings, which is perpendicular to the first direction and the second direction. Here, the third direction can refer to an optical axis direction.

[0055] Hereinafter, before describing embodiments of the present application, a structure in a comparative example and problems thereof will be described.

[0056] Fig. 1 is a view for explaining a warping phenomenon of a camera module of the comparative example.

[0057] Reference Fig. 1 The camera module of the comparative example has a structure including a board 10, an adhesive member 20, and an image sensor 30. The image sensor 30 is a sensor die constituting a sensor chip, and can generally be a silicon (Si) die.

[0058] In this case, coefficients of thermal expansion (CTEs) of the board 10, the adhesive member 20, and the image sensor 30 (specifically, the Si die) are different. Here, the coefficient of thermal expansion refers to a change in length per unit length according to a change in temperature per unit.

[0059] In a state in which the image sensor 30 is disposed on the board 10 using the adhesive member 20, the camera module of the comparative example as described above is subjected to a thermal curing process. Also, the image sensor 30 is attached or fixed to the board 10 through the thermal curing process.

[0060] In this case, referring to the first view of Fig. 1 , it can be seen that when the board 10, the adhesive member 20, and the image sensor 30 are sequentially stacked before heating, warping does not occur.

[0061] Also, referring to the second view of Fig. 1 , when heat is applied to perform the thermal curing process, both ends of each of the board 10, the adhesive member 20, and the image sensor 30 expand away from each other in a longitudinal direction.

[0062] Also, referring to the third view of Fig. 1of the third view, when the heat curing process is completed and the cooling process is continued (after cooling), each of the expanded plate 10, the bonding member 20, and the image sensor 30 is shrunk to a state before expansion.

[0063] In this case, the thermal expansion coefficients of the plate 10, the bonding member 20, and the image sensor 30 are different. The thermal expansion coefficients of each component are shown in Table 1 below.

[0064]

Table 1

[0065] Material CTE (10-6m / (m°C)) Silicon (image sensor chip) 3～5 Epoxy resin (adhesive member) 45～65 Copper alloy (plate material) 17.6

[0066] As described above, the thermal expansion coefficients of the plate 10, the bonding member 20, and the image sensor 30 are different. Therefore, when expansion and shrinkage are performed according to heat curing, the degree of shrinkage is different due to the difference in the thermal expansion coefficients, and thus, warping takes a "∩" shape.

[0067] In addition, when the warping phenomenon of the image sensor occurs, there is a problem in that the resolution performance of the camera device is deteriorated, thereby reducing the yield of the camera device.

[0068] Therefore, the present embodiment minimizes warping that occurs due to the difference in the thermal expansion coefficients between the plate 10, the image sensor 30, and the bonding member 20, and thus, it is possible to improve the performance of the camera device.

[0069] Fig. 2 is an exploded perspective view of a camera module according to the first embodiment, Fig. 3 is a cross-sectional view of the camera module according to the embodiment, Fig. 1 is a cross-sectional view of the camera module according to the first embodiment, and Fig. 4 is an enlarged view of a dotted portion of Fig. 3

[0070] Referring to Fig. 2 to Fig. 4 , the camera module 200 can include a lens or a lens barrel 400, a lens driving device 100, a filter 610, a holder 600, a circuit board 800, a plate 900, and an image sensor 810. Here, the "camera module" can be expressed as an alternative to "a photographing device" or "a photographer", and the holder 600 can be expressed as an alternative to "a filter base" or "an inner base".

[0071] In addition, the camera module 200 can further include a blocking member 1500 disposed on the filter 610.

[0072] In addition, the camera module 300 can further include a third bonding member 612.

[0073] In addition, the camera module 300 can further include a movement sensor 820, a control unit 830, and a connector 840.

[0074] ​The lens or lens barrel 400 can be mounted on the coil holder 110 of the lens driving apparatus 100.

[0075] The lens driving apparatus 100 can drive the lens or lens barrel 400.

[0076] The camera module 200 can be any one of a camera module for auto focus AF and a camera module for optical image stabilizer OIS. The camera module for AF refers to a camera module capable of performing only an auto focus function, and the OIS camera module refers to a camera module capable of performing an auto focus function and an OIS (optical image stabilizer) function.

[0077] For example, the lens driving apparatus 100 can be a lens driving apparatus for AF or a lens driving apparatus for OIS, where the meanings of "for AF" and "for OIS" can be the same as those described in the camera module for AF and the camera module for OIS.

[0078] For example, the lens driving apparatus 100 of the camera module 200 can be a lens driving apparatus for OIS.

[0079] The lens driving apparatus 100 can include a housing 140, a coil holder 110 disposed in the housing 140 and configured to mount the lens or lens barrel 400, a first coil 120 disposed on the coil holder 110, a magnet 130 disposed in the housing 140 and facing the first coil 120, at least one upper elastic member (not shown) coupled to an upper portion of the coil holder 110 and an upper portion of the housing 140, at least one lower elastic member (not shown) coupled to a lower portion of the coil holder 110 and a lower portion of the housing 140, a second coil 230 disposed below the coil holder 110 (or / and the housing 140), a driving plate 250 disposed below the second coil 230, and a base 210 disposed below the driving plate 250.

[0080] In addition, the lens driving apparatus 100 can further include a cover member 300 coupled to the base 210 and providing a space for accommodating components of the lens driving apparatus 100 together with the base 210.

[0081] In addition, the lens driving apparatus 100 can further include a support member (not shown) that electrically connects the driving plate 250 and the upper elastic member and supports the housing 140 with respect to the base 210. Each of the first coil 120 and the second coil 230 can be electrically connected to the driving plate 250 and receive a driving signal (driving current) from the driving plate 250.

[0082] For example, the upper elastic member can include a plurality of upper springs, the support member can include a support member connected to the upper springs, and the first coil 120 can be electrically connected to the driving plate 250 through the upper springs and the support member. The driving plate 250 can include a plurality of terminals, and a portion of the plurality of terminals can be electrically connected to each of the first coil 120 and / or the second coil 230.

[0083] Due to the interaction between the first coil 120 and the magnet 130, the coil holder 110 and the lens or the lens barrel 400 coupled thereto can be moved in the optical axis direction by electromagnetic force, as a result, the displacement of the coil holder 110 in the optical axis direction is controlled, so that AF driving can be achieved.

[0084] In addition, due to the interaction between the second coil 230 and the magnet 130, the housing 140 can be moved in a direction perpendicular to the optical axis by electromagnetic force, as a result, image stabilization or OIS driving can be achieved.

[0085] In addition, the lens driving apparatus 100 of the camera module 200 can further include a sensing magnet (not shown) disposed on the coil holder 110 and an AF position sensor, for example, a Hall sensor (not shown) disposed on the housing 140 for AF feedback driving. In addition, the lens driving apparatus 100 can further include a circuit board (not shown) disposed on the housing and / or the base, on which the AF position sensor is disposed or mounted. In another embodiment, the AF position sensor can be disposed on the coil holder, and the sensing magnet can be disposed on the housing. In addition, the lens driving apparatus 100 can further include a balance magnet disposed on the coil holder 110 to correspond to the sensing magnet.

[0086] According to the movement of the coil holder 100, the AF position sensor can output an output signal according to the result of detecting the magnetic field strength of the sensing magnet. The AF position sensor can be electrically connected to the driving plate 250 through the upper elastic member (or the lower elastic member) and / or the support member. The driving plate 250 can provide a driving signal to the AF position sensor, and the output of the AF position sensor can be delivered to the driving plate 250.

[0087] In another embodiment, the lens driving apparatus 100 can be a lens driving apparatus for AF, and the AF lens driving apparatus can include a housing, a coil holder disposed inside the housing, a coil disposed on the coil holder, a magnet disposed on the housing, at least one elastic member coupled to the coil holder and the housing, and a base disposed below the coil holder (or / and the housing).

[0088] For example, the elastic member can include the upper elastic member and the lower elastic member described above.

[0089] A driving signal (e.g., a driving current) can be provided to the coil, and the coil holder can be moved in the optical axis direction by an electromagnetic force due to an interaction between the coil and the magnet.

[0090] In another embodiment, the coil can be provided on the housing, and the magnet can be provided on the coil holder.

[0091] In addition, the AF lens driving apparatus for AF feedback driving can further include a sensing magnet provided on the coil holder, an AF position sensor (e.g., a Hall sensor) provided on the housing, a circuit board provided or mounted on the housing and / or the base, and a circuit board on which the AF position sensor is provided and which is provided or mounted to the housing and / or the base. In another embodiment, the AF position sensor can be provided on the coil holder, and the sensing magnet can be provided on the housing.

[0092] The camera module according to another embodiment can include a housing coupled with the lens or the lens barrel 400, instead of the lens driving apparatus 100 of the lens or the lens barrel 400, and fixing the lens or the lens barrel 400. The housing can be coupled or attached to the upper surface of the holder 600. The housing attached or fixed to the holder 600 can not be moved, and the position thereof can be fixed while being attached to the holder 600. Fig. 1

[0093] The circuit board can be electrically connected with the coil and the auto focus position sensor, a driving signal can be provided to the coil and the auto focus position sensor through the circuit board, and an output of the auto focus position sensor can be transmitted to the circuit board.

[0094] The holder 600 can be disposed under the base 210 of the lens driving apparatus 100.

[0095] The optical filter 610 is mounted on the holder 600, and the holder 600 can include a seating portion 500 in which the optical filter 610 is seated.

[0096] The adhesive member 612 can couple or attach the base 210 of the lens driving apparatus 100 to the holder 600. For example, the third adhesive member 612 can be disposed between the lower surface of the base 210 and the upper surface of the holder 600, and can be adhered to each other.

[0097] In addition to the above-described adhesive action, the third adhesive member 612 can be used to prevent foreign substances from being introduced into the lens driving apparatus 100. For example, the third adhesive member 612 can be an epoxy resin, a thermosetting adhesive, or an ultraviolet curing adhesive. According to the present embodiment, the third adhesive member 612 can directly contact the cover member 300. The third adhesive member 612 can be an adhesive member for coupling the cover member 300 to the circuit board 800, as described below. ​

[0098] The filter 610 can be disposed in the seating portion 500 of the holder 600.

[0099] The seating portion 500 of the holder 600 can include a protrusion (not shown) protruding from the upper surface of the holder 600, but is not limited thereto. In another embodiment, the seating portion can be in the form of a groove, a cavity, or a hole recessed from the upper surface of the holder 600.

[0100] The protrusion of the seating portion 500 can serve to prevent the lower end of the lens or the lens barrel 400 from coming into contact with or colliding with the filter 610 (or / and the blocking member 1500).

[0101] The protrusion of the seating portion 500 can be formed to protrude along the side surface of the filter 610 in the optical axis direction. For example, the protrusion can be disposed around the side surface of the filter 610 to surround the side surface of the filter 610.

[0102] The inner surfaces of the protrusion can be disposed to face the side surface of the filter 610, and they can be spaced apart from each other. This is to secure a machining tolerance to facilitate the installation of the filter 610 inside the seating portion 500 of the holder 600.

[0103] In addition, the upper surface of the protrusion of the seating portion 500 can be higher than the upper surface of the filter 610 in the optical axis direction. This is to prevent the lower end of the lens or the lens barrel 400 from directly colliding with the filter 610 when the lens or the lens barrel 400 is installed on the lens driving apparatus 100 and moves in the optical axis direction or in a direction toward the filter 610 due to an external impact.

[0104] The shape of the protrusion of the seating portion 500 can match the shape of the filter 610 as viewed from the upper side, but is not limited thereto. In another embodiment, the shape of the protrusion of the seating portion 500 can be similar to or different from the shape of the filter 610.

[0105] The holder 600 can include an opening 501 formed at a portion in which the filter 610 is installed or disposed, so that light passing through the filter 610 can be incident on the image sensor 810.

[0106] For example, the opening 501 can pass through the holder 600 in the optical axis direction, and can be expressed instead with "through-hole".

[0107] For example, the opening 501 can pass through the center of the holder 600, and can be disposed in the seating portion 500. In addition, the area of the opening 501 can be smaller than the area of the filter 610.

[0108] The holder 600 can include an exhaust hole 601. The exhaust hole 601 can be a communication hole that communicates the inside of the holder 600 and the outside of the holder 600. Specifically, the holder 600 is accommodated in the accommodation space of the cover member 300, and includes a filter arrangement space in which the filter 610 is disposed.

[0109] Further, the exhaust hole 601 can communicate the filter arrangement space of the holder 600 and the accommodation space of the cover member 300. The holder 600 is attached to the circuit board 800 by an adhesive member (not shown). Further, the filter 610 is attached to the holder 600 by an adhesive member (not shown). Further, in the state that the filter 610 is attached to the holder 600, there can be a gas generated in the process of forming the adhesive member (not shown) in the internal space of the holder 600. Further, the gas can affect the reliability of the filter 610 attached to the holder 600, and can further affect the overall performance of the camera module. Therefore, in the present embodiment, the exhaust hole 601 is formed in the holder 600, which can allow the gas present in the internal space of the holder 600 to be discharged to the outside.

[0110] For example, the filter 610 can be disposed in the seating portion 500 of the holder 600.

[0111] The filter 610 can function to block light of a specific band among light passing through the lens barrel 400 from entering the image sensor 810.

[0112] For example, the filter 610 can be an infrared cut filter, but is not limited thereto. For example, the filter 610 can be disposed parallel to an x-y plane perpendicular to the optical axis OA.

[0113] The filter 610 can be attached to the seating portion 500 of the holder 600 by an adhesive member (not shown) such as UV epoxy resin.

[0114] The circuit board 800 can be disposed below the holder 600, and the holder 600 can be disposed on the upper surface of the circuit board 800.

[0115] The holder 600 can be attached or fixed to the upper surface of the circuit board 800 by an adhesive member such as epoxy resin, a thermosetting adhesive, or a UV-cured adhesive. In this case, the adhesive member can be disposed between the lower surface of the holder 600 and the upper surface of the circuit board 800.

[0116] Further, the third adhesive member 612 can be disposed between the circuit board 800 and the cover member 300.

[0117] In other words, the present embodiment allows the cover member 300 to be attached or fixed to the circuit board 800 to be separated from the holder 600, rather than being provided on the holder 600.

[0118] Accordingly, the present embodiment can reduce the total thickness of the camera module by an amount corresponding to the height of the holder 600, thereby achieving thinness of the camera module.

[0119] The circuit board 800 can have a cavity 801 corresponding to the opening 501 of the holder 600. The cavity 801 of the circuit board 800 can be in the form of a through-hole passing through the circuit board 800 in the optical axis direction. For example, the circuit board 800 can include a cavity 801 overlapping the opening 501 of the holder 600 in the vertical direction. In this case, the vertical line can correspond to the optical axis.

[0120] The image sensor 810 can be provided in the cavity 801 of the circuit board 800.

[0121] The first plate 900 can be provided below the circuit board 800.

[0122] Further, the second plate 910 can be provided on the first plate 900. Preferably, the second plate 910 can be provided in a region of the upper surface of the first plate 900 overlapping the cavity 801 of the circuit board 800 in the vertical direction. Accordingly, the second plate 910 can overlap the cavity 801 of the circuit board 800 in the vertical direction.

[0123] The area of the second plate 910 can be smaller than the area of the first plate 900.

[0124] The first plate 900 and the second plate 910 are separate plates separated from each other. An adhesive member (not shown) can be provided between the first plate 900 and the second plate 910. Further, the second plate 910 can be attached and / or fixed to the upper surface of the first plate 900 by the adhesive member (not shown).

[0125] The second plate 910 can be a mounting portion in which the image sensor 810 is mounted.

[0126] The second plate 910 can protrude from a region of the upper surface of the first plate 900 in the optical axis direction or in the vertical direction.

[0127] The image sensor 810 is provided on the upper surface of the second plate 910. Accordingly, the image sensor 810 can overlap the cavity 801 of the circuit board 800 in the optical axis direction or in the vertical direction.

[0128] The image sensor 810 disposed on the second plate 910 can be electrically connected with the circuit board 800 through the electric wire 21. For example, the electric wire 21 can connect the terminal 813 of the image sensor 810 and the terminal 1830 of the circuit board 800 to each other.

[0129] The first plate 900 and the second plate 910 are plate-shaped members having predetermined thickness and hardness. The first plate 900 and the second plate 910 can also be referred to as "reinforcing plates". The first plate 900 and the second plate 910 can also be referred to as "heat dissipation plates". The first plate 900 and the second plate 910 can also be referred to as "supporting plates".

[0130] That is, the first plate 900 and the second plate 910 can stably support the image sensor 810 and function to prevent the image sensor from being damaged due to external impact or contact. Accordingly, the present embodiment can improve the physical reliability and the electrical reliability of the image sensor 810.

[0131] Further, the first plate 900 and the second plate 910 can perform a heat dissipation function of dissipating heat generated by the image sensor 810 to the outside. Accordingly, the present embodiment can improve the heat dissipation characteristics of the image sensor 810.

[0132] For example, at least one of the first plate 900 and the second plate 910 can be formed of a metal material (for example, SUS or aluminum) having high thermal conductivity, but is not limited thereto. In another embodiment, at least one of the first plate 900 and the second plate 910 can be formed of glass epoxy resin, plastic, or synthetic resin.

[0133] Further, by being electrically connected with the ground terminal of the circuit board 800, the first plate 900 can function as a ground portion to protect the camera module from electrostatic discharge protection (ESD).

[0134] The image sensor 810 can be a portion on which light rays passing through the optical filter 610 are incident to form an image contained in the light rays.

[0135] The circuit board 800 can be provided with various circuits, elements, control units, etc. in order to convert an image formed on the image sensor 810 into an electrical signal and transfer it to an external device. A circuit pattern electrically connected with the image sensor and various devices can be formed on the circuit board 800.

[0136] The holding member 600 can be represented by a first holding member, and the circuit board 800 can be represented by a second holding member.

[0137] The image sensor 810 can receive an image included in light rays incident through the lens driving apparatus 100 and convert the received image into an electrical signal.

[0138] The optical filter 610 and the image sensor 810 can be spaced apart to face each other in the optical axis OA direction or in the first direction or in the vertical direction.

[0139] The blocking member 1500 can be provided on the upper surface of the optical filter 610. The blocking member 1500 can be replaced with a "shading unit".

[0140] For example, the blocking member 1500 can be provided on a corner region of the upper surface of the optical filter 610 and function to block at least a portion of light rays incident toward the corner region of the optical filter 610 through the lens or the lens barrel 400 from passing through the optical filter 610. For example, the blocking member 1500 can be coupled or attached to the upper surface of the optical filter 610.

[0141] For example, the optical filter 610 can be formed in a rectangular shape as viewed from the optical axis direction, and the blocking member 1500 can be formed symmetrically with respect to the optical filter 610 along each side of the upper surface of the optical filter 610.

[0142] In this case, the blocking member 1500 can be formed to have a constant width on each side of the upper surface of the optical filter 1610.

[0143] The blocking member 1500 can be formed of an opaque material. For example, the blocking member 1500 can be provided in the form of an opaque adhesive material applied to the optical filter 610 or in the form of a thin film attached to the optical filter 610.

[0144] The optical filter 610 and the image sensor 810 can be disposed to face each other in the optical axis direction, and the blocking member 1500 can at least partially overlap the terminal 1830 and / or the electric wire 21 provided on the circuit board 800 in the optical axis direction.

[0145] The electric wire 21 and the terminal 1830 can be formed of a conductive material such as gold (Au), silver (Ag), copper (Cu), a copper alloy, or the like, and such a conductive material can have a light reflecting property. Light passing through the optical filter 610 can be reflected by the terminal 1830 and the electric wire 21 of the circuit board 800, and the reflected light can cause a momentary flash (i.e., a flickering phenomenon), and such a flickering phenomenon can distort an image formed on the image sensor 810 or deteriorate image quality.

[0146] The blocking member 1500 is disposed such that at least a portion thereof overlaps the terminal 1830 and / or the electric wire 21 in the optical axis direction, and thus light rays directed to the terminal 1830 and / or the electric wire 21 among light rays passing through the lens or the lens barrel 400 can be blocked, thereby preventing a flickering phenomenon from occurring, and thus, image distortion or image quality deterioration formed on the image sensor 810 can be prevented.

[0147] The movement sensor 820 can be mounted or disposed on the circuit board 800 and can be electrically connected with the controller 830 through a circuit pattern disposed on the circuit board 800.

[0148] The movement sensor 820 outputs rotational angular velocity information through the motion of the camera module 200. The movement sensor 820 can be implemented as a 2-axis or 3-axis gyro sensor or an angular velocity sensor.

[0149] The control unit 830 is mounted or disposed on the circuit board 800.

[0150] The circuit board 800 can be electrically connected with the lens driving apparatus 100. For example, the circuit board 800 can be electrically connected with the driving board 250 of the lens driving apparatus 100.

[0151] For example, a driving signal can be provided to each of the first coil 120 and the second coil 230 of the lens driving apparatus 100 through the circuit board 800, and a driving signal can be provided to the AF position sensor (or the OIS position sensor). In addition, the output of the AF position sensor (or the OIS position sensor) can be delivered to the circuit board 800.

[0152] The connector 840 is electrically connected with the circuit board 800 and can include a port for electrical connection with an external apparatus.

[0153] In the first embodiment, the first adhesive member 1750 can be disposed between the lower surface of the image sensor 810 and the upper surface of the second board 910, and the image sensor 810 can be attached or fixed to the second board 910 through the first adhesive member 1750. The first adhesive member 1750 can be an epoxy resin, a thermosetting adhesive, an ultraviolet-cured adhesive, or an adhesive film, but is not limited thereto.

[0154] For example, the image sensor 810, the first adhesive member 1750, and the second board 910 of the first embodiment can overlap each other in the optical axis direction or in the vertical direction.

[0155] In the first embodiment, the area of the second plate 910 can be the same as the area of the lower surface of the image sensor 810. Also, the area of the first adhesive member 1750 disposed on the second plate 910 can be the same as the area of the lower surface of the image sensor 810. For example, the edge of the lower surface of the image sensor 810 can be located on the same vertical line as the edge of the upper surface of the second plate 910.

[0156] For example, the first plate 900 includes a first area S1 overlapping the image sensor 810 in the vertical direction. The first area S1 of the first plate 900 can overlap the cavity 801 of the circuit board 800 in the vertical direction. Also, the first plate 900 can include a second area S2 different from the first area S1. The second area S2 of the first plate 900 can overlap the circuit board 800 in the vertical direction.

[0157] The first area S1 of the first plate 900 can be an area in which the second plate 910 is disposed. Also, the second area S2 of the first plate 900 can be an area in which the circuit board 800 is disposed.

[0158] Also, the ratio H1:H2 of the first height H1 from the upper surface 900a of the first plate 900 to the upper surface of the second plate 910 and the second height H2 from the lower surface 900b of the first plate 900 to the upper surface 900a of the first plate 900 can be 1:0.67 to 1:2.1.

[0159] When the value H2 / H1 obtained by dividing the second height H2 by the first height H1 is less than 0.67, the first plate 900 is easily bent or deformed to an extent that the circuit board 800 cannot be stably supported.

[0160] Also, when the value H2 / H1 obtained by dividing the second height by the first height exceeds 2.1, the height of the second plate 910 is insufficient, so that the flatness of the first plate 900 and the flatness of the image sensor 810 can be deteriorated. Also, when the value H2 / H1 obtained by dividing the second height by the first height exceeds 2.1, since the step between the upper surface of the image sensor 810 and the upper surface of the circuit board 800 in the optical axis direction is increased, the reliability of wire bonding can be deteriorated.

[0161] Therefore, in the present embodiment, H1 can be 80 μm to 150 μm, and H2 can be 100 μm to 170 μm.

[0162] The upper surface of the second plate 910 can be positioned lower than the upper surface of the circuit board 800.

[0163] Meanwhile, the second plate 910 is disposed in the first area S1 of the first plate 900, and thus the thickness T1 in the first area S1 of the first plate 900 is greater than the thickness T2 in the second area S2 of the first plate 900 (T1 > T2). That is, the second plate 910 is additionally disposed in the second area S2, and thus T1 > T2. Accordingly, the present embodiment can improve the operation reliability of the image sensor 810 by improving the flatness of the image sensor 810, and further improve the optical performance of the camera module.

[0164] Meanwhile, even if the second plate 910 has a certain thickness, the total height of the camera module is not increased. This is because the second plate 910 is disposed in the first area S1 of the first plate 900, overlapping the cavity 801 of the circuit board 800 in the vertical direction.

[0165] Further, since the image sensor 810 is disposed on the upper surface of the second plate 910, the height between the optical filter 610 and the image sensor 810 can be easily adjusted by adjusting the thickness of the second plate 910, thereby improving the operation reliability.

[0166] Further, since the image sensor 810 is disposed on the upper surface of the second plate 910, the length of the electric wire for electrical connection between the circuit board 800 and the image sensor 810 is shortened, thereby improving the reliability of the electric wire bonding.

[0167] Meanwhile, the side surface of the second plate 910 can be spaced apart from the inner wall of the circuit board 800 by a predetermined distance. For example, the separation distance D1 between the side surface of the second plate 910 and the inner wall of the circuit board 800 can be 100 µm to 250 µm.

[0168] In the first embodiment of the present application, as described above, the separate second plate 910 is disposed on the first plate 900, and the image sensor 810 is attached or fixed to the disposed second plate 910.

[0169] Meanwhile, one plate can be etched to provide an integrated plate having a protrusion corresponding to the second plate 910 on the one plate. However, in the case of such an integrated plate, the size of the integrated plate and the circuit board can be increased due to attachment tolerances in the process of attaching the circuit board 800 to the integrated plate. For example, using an integrated plate including a protrusion, the tolerances of the positions at which the protrusion is formed, the size of the cavity 801 of the circuit board 800, the position at which the image sensor is mounted on the protrusion, and the tolerances that occur when the protrusion of the integrated plate is disposed on the circuit board 800 should be considered as a whole, and thus the size of the camera module can be increased as a whole.

[0170] In contrast, in the present embodiment, the circuit board 800 is provided on the first plate 900, and the second plate 910 is attached to a region of the upper surface of the first plate 900 that overlaps the cavity 801 of the circuit board 800 in the vertical direction. Therefore, the present embodiment does not have to consider various tolerances of the plate by etching as described above, and thus the overall size of the camera module can be reduced.

[0171] Fig. 5 is a plan view showing the circuit board, the first plate, and the second plate in a state where the image sensor is removed, according to the first embodiment.

[0172] Referring to Fig. 5 According to the first embodiment, the circuit board 800 includes the cavity 801.

[0173] Further, the first plate 900 is provided on the lower surface of the circuit board 800.

[0174] In this case, the first plate 900 includes a region that overlaps the cavity 801 of the circuit board 800 in the vertical direction. For example, the first region S1 of the first plate 900 can overlap the cavity 801 of the circuit board 800 in the vertical direction.

[0175] The second plate 910 can be provided in the first region S1 of the first plate 900, overlapping the cavity 801 in the vertical direction. In this case, an adhesive member (not shown) can be applied between the first plate 900 and the second plate 910. Therefore, the second plate 910 can be fixed and / or attached to the first plate 900.

[0176] The area of the second plate 910 can be smaller than the area of the cavity 801 of the circuit board 800. The area can refer to a planar area.

[0177] Therefore, at least a portion of the first region S1 of the first plate 900 can not overlap the second plate 910 in the vertical direction. For example, the first region S1 of the first plate 900 can include an overlapping portion that overlaps the second plate 910 in the vertical direction and a non-overlapping portion that does not overlap the second plate 910 in the vertical direction.

[0178] For example, the second plate 910 can be spaced apart from the inner wall of the cavity 801 of the circuit board 800 by a predetermined distance. For example, the second plate 910 can be spaced apart from the inner wall of the cavity 801 of the circuit board 800 by a first distance W1 in the first direction or in the width direction. Further, the second plate 910 can be spaced apart from the inner wall of the cavity 801 of the circuit board 800 by a second distance W2 in the second direction or in the longitudinal direction. In this case, the first distance W1 and the second distance W2 can be the same as or different from each other.

[0179] Here, the first distance W1 and the second distance W2 can each have a range of between 100 μm and 250 μm.

[0180] Fig. 6 is a cross-sectional view of an embodiment of the camera module according to the second embodiment, Fig. 1

[0181] Referring to Fig. 6 , the camera module includes the first plate 900, the second plate 910A, the circuit board 800, the image sensor 810, the first adhesive member 1750, and the second adhesive member 1700.

[0182] The area of the second plate 910 of the first embodiment is smaller than the area of the cavity 801 of the circuit board 800. Accordingly, the cavity 801 of the circuit board 800 of the first embodiment includes an overlapping area overlapping the second plate 910 in the vertical direction and a non-overlapping area not overlapping the second plate 910 in the vertical direction.

[0183] For example, the second plate 910 of the first embodiment is spaced apart from the inner wall of the circuit board 800 by a predetermined distance.

[0184] Alternatively, the area of the second plate 910A of the second embodiment can be the same as the area of the cavity 801 of the circuit board 800. For example, the outer side surface of the second plate 910A can be in direct contact with the inner wall of the cavity 801 of the circuit board 800.

[0185] That is, in the present application, the first plate 900 and the second plate 910A are adhered to each other as separate components. Accordingly, when the plate and the circuit board are coupled, the present embodiment does not need to consider the alignment tolerance between the cavity 801 of the circuit board 800 and the second plate 910A. Thereby, the present embodiment can make the area of the cavity 801 and the area of the second plate 910A the same.

[0186] Fig. 7 is an exploded perspective view of a camera module according to the third embodiment, Fig. 8 is a cross-sectional view of a camera module according to the embodiment, Fig. 7 is an enlarged view of a dotted portion of Fig. 9 Fig. 8

[0187] Compared to the camera module shown in Fig. 2 to Fig. 4 , the camera module including Fig. 7 to Fig. 9 differs in the shape of the second plate 920, and thus, hereinafter, the second plate 920 will be described in detail with reference to Fig. 7 to Fig. 9

[0188] ​​​​That is, the second plate of the first and second embodiments has a plate-shaped member, and thus the first adhesive member 1750 is disposed on the upper surface of the second plate, and the image sensor 810 is attached or fixed to the adhesive member 1750. Accordingly, the lower surface of the image sensor 810 of the first and second embodiments has a structure in which only the first adhesive member 1750 is in direct contact.

[0189] Alternatively, in the third embodiment, a portion of the lower surface of the image sensor 810 can contact the second plate 920, and another portion of the lower surface of the image sensor 810 can contact the first adhesive member 1750. Accordingly, the third embodiment can further improve the flatness of the image sensor 810. In addition, the third embodiment can effectively dissipate heat generated from the image sensor 810.

[0190] To this end, the second plate 920 is disposed on the first area S1 of the first plate 900. In addition, the second plate 920 can include an opening 921 overlapping the first area S1 of the first plate 900 in the vertical direction. In other words, the opening 921 formed in the planar center of the second plate 920 can have a closed loop shape.

[0191] Accordingly, the first adhesive member 1750 can be disposed on the upper surface of the first plate 900, instead of the second plate 920. Specifically, the first adhesive member 1750 can be disposed on the first area S1 of the first plate 900, overlapping the opening 921 of the second plate 920 in the vertical direction. In addition, the second plate 920 can function as a dam to prevent the first adhesive member 1750 from spreading or overflowing. Accordingly, in the third embodiment, it can be easy to determine the position at which the first adhesive member 1750 is applied.

[0192] At least a portion of the lower surface of the image sensor 810 can be in direct contact with the upper surface of the second plate 920.

[0193] For example, a first portion of the lower surface of the image sensor 810 can be in direct contact with the second plate 920, and a second portion of the lower surface of the image sensor 810 can be in direct contact with the first adhesive member 1750. That is, when the first portion is supported by the second plate 920, the second portion of the image sensor 810 can be attached or fixed to the first adhesive member 1750. For example, the first portion of the lower surface of the image sensor 810 can overlap the second plate 920 in the vertical direction. In addition, the second portion of the lower surface of the image sensor 810 can overlap the first adhesive member 1750 in the vertical direction.

[0194] Accordingly, in the present embodiment, the first portion of the lower surface of the image sensor 810 directly contacts the second board 920, and thus the warping phenomenon of the image sensor 810 can be further improved. Further, in the present embodiment, at least a portion of the image sensor 810 directly contacts the second board 920 to further improve the heat dissipation characteristics of the image sensor 810.

[0195] Accordingly, the area of the image sensor 810 in the present embodiment can be greater than the area of the first adhesive member 1750. That is, only a portion of the lower surface of the image sensor 810 can contact the first adhesive member 1750. That is, in the third embodiment, the first portion of the lower surface of the image sensor 810 can contact the second board 920, and a second portion other than the first portion can contact the first adhesive member 1750.

[0196] Accordingly, the area of the upper surface of the second board 920 can be less than the area of the lower surface of the image sensor 810.

[0197] Meanwhile, the first region S1 of the first board 900 can include a 1-1 region S1-1 in which the first adhesive member 1750 is disposed and a 1-2 region S1-2 in which the second board 920 is disposed. That is, the 1-1 region S1-1 of the first region S1 of the first board 900 overlaps the opening 921 of the second board 920 in the optical axis direction. For example, the 1-1 region S1-1 of the first board 900 can overlap the first adhesive member 1750 in the vertical direction. For example, the 1-2 region S1-2 of the first board 900 can overlap the second board 920 in the vertical direction. Further, the first board 900 can include a region overlapping the cavity 801 in the vertical direction and not overlapping the second board 920 and the first adhesive member 1750 in the vertical direction.

[0198] Hereinafter, the structural relationship and arrangement relationship of the first board 900, the second board 920, the first adhesive member 1750, and the image sensor 810 according to the third embodiment will be described in detail.

[0199] Fig. 10 is a plan view showing the circuit board, the board, and the first adhesive member according to the third embodiment in a state in which the image sensor is removed, Fig. 11 is a view showing the degree of warping according to the arrangement region of the adhesive member, Fig. 12 is a view for explaining the disposition relationship between the protruding portion of the board and the image sensor according to the third embodiment.

[0200] Referring to Fig. 10 to Fig. 12 , the first board 900 includes a first region S1 and a second region S2.

[0201] Further, the first area S1 of the first plate 900 can overlap the cavity 801 of the circuit plate 800 in the vertical direction. The first area S1 can be an area in which the image sensor 810 is disposed in the cavity 801 of the circuit plate 800, and the second area S2 can be an area in which the circuit plate 800 is disposed.

[0202] Specifically, the first area S1 of the first plate 900 can include a 1-1 area S1-1 in which the first adhesive member 1750 is disposed and a 1-2 area S1-2 in which the second plate 920 is disposed. The 1-2 area S1-2 can be an area surrounding the 1-1 area S1-1.

[0203] The first area S1 can correspond to the shape of the image sensor 810. For example, the first area S1 can have a rectangular shape corresponding to the shape of the image sensor 810, but is not limited thereto.

[0204] The second plate 920 includes an opening 921 overlapping the 1-2 area S1-2 in the vertical direction, and can be disposed in the 1-2 area S1-2. The 1-2 area S1-2 can overlap a corner area of a lower surface of the image sensor 810 in the optical axis direction or in the vertical direction in the first area S1. Accordingly, the 1-2 area S1-2 can be an area overlapping the corner area of the lower surface of the image sensor 810 in the optical axis direction or in the vertical direction.

[0205] The first adhesive member 1750 can be disposed in the 1-1 area S1-1. For example, the first adhesive member 1750 can be disposed in an area of the first area S1 overlapping the opening 921 of the second plate 920 in the vertical direction. The first adhesive member 1750 can not be disposed in the 1-2 area S1-2. For example, the first adhesive member 1750 can not overlap the second plate 920 in the vertical direction.

[0206] In the present embodiment, in a state in which the edge area of the lower surface of the image sensor 810 is supported by the second plate 920 as described above, the image sensor 810 is attached or fixed to the first plate 900 by the first adhesive member 1750.

[0207] For example, in the comparative example, the first adhesive member is formed on the plate, and thus the image sensor is attached to the first adhesive member. Specifically, in the comparative example, the first adhesive member is applied to the entire area overlapping the image sensor in the optical axis direction.

[0208] Optionally, in this embodiment, the first adhesive member 1750 may be formed only on a portion of the lower surface of the image sensor 810. Therefore, the area of ​​the lower surface of the image sensor 810 in this embodiment may be larger than the area of ​​the upper surface of the first adhesive member 1750. For example, the area of ​​the upper surface of the first adhesive member 1750 may be less than 95% of the area of ​​the lower surface of the image sensor 810. For example, the area of ​​the upper surface of the first adhesive member 1750 may be 80% or less of the area of ​​the lower surface of the image sensor 810. For example, the area of ​​the upper surface of the first adhesive member 1750 may be 70% or less of the area of ​​the lower surface of the image sensor 810. For example, the area of ​​the upper surface of the first adhesive member 1750 may be 60% or less of the area of ​​the lower surface of the image sensor 810. For example, the area of ​​the upper surface of the first adhesive member 1750 may be 50% or less of the area of ​​the lower surface of the image sensor 810.

[0209] Preferably, the area of ​​the upper surface of the first adhesive member 1750 is less than 50% of the area of ​​the lower surface of the image sensor 810. Accordingly, compared with the area of ​​the image sensor 810, this embodiment reduces the arrangement area of ​​the first adhesive member 1750, and thus minimizes the warping phenomenon that increases proportionally to the area of ​​the first adhesive member 1750.

[0210] However, the area of ​​the upper surface of the first adhesive member 1750 exceeds 40% of the area of ​​the lower surface of the image sensor 810. For example, when the area of ​​the upper surface of the first adhesive member 1750 is less than 40% of the area of ​​the lower surface of the image sensor 810, the adhesion of the image sensor 810 is reduced, and physical reliability problems such as separation of the image sensor 810 from various factors may occur.

[0211] In other words, referencing Fig. 11 If the area of ​​the first adhesive member 1750 is 75% or more of the area of ​​the lower surface of the image sensor 810, the degree of warpage of the image sensor 810 is 100%, and if the area of ​​the first adhesive member 1750 is 50% of the area of ​​the lower surface of the image sensor 810, the degree of warpage of the image sensor 810 is 88%.

[0212] In other words, it can be seen that as the contact area between the first adhesive member 1750 and the image sensor 810 decreases, the influence on the coefficient of thermal expansion decreases, and the degree of warping decreases. Therefore, in this embodiment, the area of ​​the portion of the image sensor in contact with the first adhesive member 1750 is less than 95% compared to the total area of ​​the lower surface of the image sensor 810, thereby minimizing the occurrence of warping of the image sensor 810.

[0213] However, when the contact area between the first adhesive member 1750 and the image sensor 810 is not reduced at all, there is a problem in that the adhesive strength is reduced, and thus the image sensor 810 is separated from the board 900. In addition, the contact area between the first adhesive member 1750 and the image sensor 810 needs to consider various factors, such as wire bonding overhang. Accordingly, the area of the upper surface of the first adhesive member 1750 is set in the range of 40% to 90% compared to the area of the lower surface of the image sensor 810.

[0214] As described above, in the present embodiment, only a portion of the lower surface of the image sensor 810 is in contact with or overlaps in the vertical direction with the first adhesive member 1750, and thus the occurrence of warping of the image sensor 810 can be minimized, and thus the performance of the image sensor can be improved.

[0215] Meanwhile, the first adhesive member 1750 can be formed on the first area S1-1 of the first area S1 of the first board 900. For example, the first adhesive member 1750 can be formed in the remaining area of the first area S1 of the board 900 except for the corner area. For example, the first adhesive member 1750 can have a shape corresponding to the opening 921 of the second board 920.

[0216] The second board 920 can be formed on the first-2 area S1-2 of the first area S1 of the first board 900. For example, the second board 920 can have an opening 921 overlapping the first area S1-1 of the first board 900 in the vertical direction.

[0217] Accordingly, the second board 920 can overlap the edge area of the first area S1 in the vertical direction, and not overlap the center area of the first area S1 of the first board 900 in the vertical direction.

[0218] The second board 920 can be spaced apart from the inner wall of the cavity 801 of the circuit board 800 by a predetermined distance. For example, the second board 920 can be spaced apart from the inner wall of the cavity 801 of the circuit board 800 by a first distance W1a in the first direction. In addition, the second board 920 can be spaced apart from the inner wall of the cavity 801 of the circuit board 800 by a second distance W2a in the second direction. In this case, the first distance W1a and the second distance W2a can be the same as or different from each other.

[0219] The second board 920 can overlap a specific area of the image sensor 810 in the optical axis direction or in the vertical direction.

[0220] For example, the image sensor 810 can include a pixel area composed of a plurality of pixels for detecting an image (image information) of light incident through a lens, and a passivation area 812 other than the pixel area.

[0221] In this case, the second plate 920 can overlap at least a portion of the pixel area 810 in the vertical direction. For example, the second plate 920 can overlap a corner area of the pixel area 810 in the vertical direction.

[0222] For example, the second plate 920 can be formed in one area of the first area S1 of the first plate 900, overlapping a corner area of the pixel area of the image sensor 810 in the optical axis direction OA or in the vertical direction.

[0223] Specifically, the pixel area of the image sensor 810 can include an active pixel area 811-1 for sensing actual image information and a dummy pixel area 811-2 other than the active pixel area 811-1. The active pixel area 811-1 can be used to generate image information with incident light. The dummy pixel area 811-2 is not used to generate image information, but can have the same structure as the active pixel area 811-1. That is, the image sensor 810 includes the dummy pixel area 811-2 between the active pixel area 811-1 that generates actual image information and a passivation area 812 for protecting the same, in order to increase reliability of generating image information.

[0224] Further, the second plate 920 according to the embodiment can overlap at least a portion of the active pixel area 811-1 of the image sensor in the optical axis direction or in the vertical direction. For example, the second plate 920 can overlap a corner area of the active pixel area 811-1 in the vertical direction. That is, the most important area of the image sensor 810 is the active pixel area 811-1, and the flatness of the active pixel area 811-1 substantially determines the performance and operational reliability of the image sensor 810.

[0225] Further, the second plate 920 overlaps at least a portion (or a corner area) of the active pixel area 811-1 in the optical axis direction or in the vertical direction. Accordingly, in the present embodiment, at least a portion of the active pixel area 811-1 of the lower surface of the image sensor 810 can be supported by the second plate 920. Accordingly, according to the present embodiment, warping of the active pixel area 811-1 of the image sensor 810 can be minimized, and thus the performance of the image sensor 810 can be further improved.

[0226] That is, when the second plate 920 overlaps at least a portion of the active pixel area 811-1 in the optical axis direction or in the vertical direction, the overall flatness of the active pixel area 811-1 can be maintained. Accordingly, warping phenomenon of the image sensor 810 can be minimized.

[0227] Meanwhile, although in the above-described embodiment, the second plate 920 is formed in the first area S1 of the first plate 900, the present embodiment is not limited thereto. For example, the second plate 920 can be formed in the second area S2 of the first plate 900. Fig. 9The description already indicates that the outer surface of the second plate 920 is spaced a predetermined distance from the inner wall of the cavity 801 of the circuit board 800, but this is not the only possibility. Specifically, as in the second embodiment, the outer surface of the second plate 920 may be in direct contact with the inner wall of the cavity 801 of the circuit board 800.

[0228] Fig. 13 This is a perspective view of the portable terminal 200A according to the embodiment. Fig. 14 yes Fig. 13 The diagram shows a block diagram of a portable terminal.

[0229] Reference Fig. 13 and Fig. 14 The portable terminal (200A, hereinafter referred to as the "terminal") may include a body 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / output unit 750, a storage unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

[0230] Fig. 13 The body 850 shown is in the form of a rod, but is not limited to this, and can have various structures, such as sliding type, folding type, swing type, rotating type, in which two or more sub-bodies are connected to be movable relative to each other.

[0231] The body 850 may include a housing (outer cover, outer shell, cover, etc.) forming the exterior. For example, the body 850 may be divided into a front housing 851 and a rear housing 852. Various electronic components of the terminal may be embedded in the space formed between the front housing 851 and the rear housing 852.

[0232] The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network in which the terminal 200A resides. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a short-range communication module 714, and a location information module 715.

[0233] The A / V (audio / video) input unit 720 is used to input audio or video signals and may include a camera 721 and a microphone 722, etc.

[0234] Camera 721 may include according to Fig. 3 The camera module of the embodiment shown.

[0235] The sensing unit can detect a current state of the terminal 200A, such as the opened / closed state of the terminal 200A, the location of the terminal 200A, the presence or absence of user contact, the direction of the terminal 200A, the acceleration / deceleration of the terminal 200A, and the like, and generate a sensing signal for controlling the operation of the terminal 200A. For example, when the terminal 200A is in the form of a slide phone, it can sense whether the slide phone is open or closed. In addition, it can be responsible for sensing a function related to whether a power source unit 790 is powered, whether the interface unit 770 is coupled with an external device, and the like.

[0236] The input / output unit 750 is for generating an input or output related to a visual, an auditory, or a tactile. The input / output unit 750 can generate input data for operation control of the terminal 200A, and can also display information processed by the terminal 200A.

[0237] The input / output unit 750 can include a keypad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keypad unit 730 can generate input data in response to a keypad input.

[0238] The display module 751 can include a plurality of pixels whose colors change according to an electrical signal. For example, the display module 751 can include at least one of a liquid crystal display, a thin film transistor-liquid crystal display, an organic light emitting diode, a flexible display, a three-dimensional display (3D display).

[0239] The sound output module 752 can output audio data received from the wireless communication unit 710 in a call signal reception mode, a call mode, a record mode, a voice recognition mode, or a broadcast reception mode, or the like; or audio data stored in the storage unit 760.

[0240] The touch screen panel 753 can convert a change in capacitance, which is generated by a user's touch on a specific region of the touch screen, into an electrical input signal.

[0241] The storage unit 760 can store a program for processing and control of the controller 780, and can temporarily store input / output data (e.g., a phonebook, a message, audio, a still image, a photograph, a video, and the like). For example, the storage unit 760 can store an image, such as a photograph or a video, captured by the camera 721.

[0242] The interface unit 770 serves as a passageway connected to an external device connected to the terminal 200A. The interface unit 770 receives data from the external device, receives power and transmits it to each component inside the terminal 200A, or transmits data of the terminal 200A to the external device. For example, the interface unit 770 can include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device having an identification module, an audio I / O (input / output) port, a video I / O (input / output) port, and a headphone port, etc.

[0243] The controller (control unit, 780) can control the overall operation of the terminal 200A. For example, the controller 780 can perform related control and processing of a voice call, data communication, a video call, etc.

[0244] The controller 780 can include a multimedia module 781 for playing multimedia. The multimedia module 781 can be implemented within the controller 180, or can be implemented separately from the controller 780.

[0245] The controller 780 can perform a pattern recognition process capable of recognizing a handwriting input or a drawing input performed on the touch screen as a character and an image, respectively.

[0246] The power supply unit 790 can receive external power or internal power under the control of the control unit 780 to provide power required for the operation of each component.

[0247] Although embodiments of the present application have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that the present application can be embodied in other specific forms without modifying the technical spirit and essential features of the present application. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and are not restrictive.

Claims

1. A camera module, comprising: Circuit board, including cavities; The first plate is disposed below the circuit board and includes a first region that overlaps with the cavity in the vertical direction and a second region other than the first region; The second plate is disposed above the first region of the first plate and includes an opening that overlaps in the vertical direction with at least a portion of the cavity; A first adhesive member is disposed on a first region of the first plate and in the opening of the second plate; as well as An image sensor is disposed on the second plate and the first adhesive member; The upper surface of the second plate is positioned lower than the upper surface of the circuit board. The second plate comprises metal, and The lower surface of the image sensor is in direct contact with the metal of the second plate and the first adhesive component.

2. The camera module according to claim 1, wherein, The second plate is configured to surround the outer side of the first adhesive member.

3. The camera module according to claim 2, wherein, The first region of the first plate includes: Region 1-1 is provided with the first adhesive component; and The second plate is installed in area 1-2; The opening of the second plate overlaps with the first-1 region in the vertical direction.

4. The camera module according to claim 3, wherein, The lower surface of the image sensor includes a first portion that is in direct contact with the first adhesive member and a second portion that is in direct contact with the second plate.

5. The camera module according to claim 3, wherein, The upper surface of the second plate is positioned on the same plane as the upper surface of the first adhesive member.

6. The camera module according to claim 3, wherein, The area of ​​the upper surface of the first adhesive member is smaller than the area of ​​the lower surface of the image sensor.

7. The camera module according to claim 3, wherein, The second plate overlaps vertically with the outer contour region of the lower surface of the image sensor.

8. The camera module according to claim 1, wherein, The outer surface of the second plate is separated from the inner wall of the cavity of the circuit board.

9. The camera module according to claim 1, wherein, The outer surface of the second plate is in direct contact with the inner wall of the cavity of the circuit board.

10. The camera module according to claim 3, wherein, The image sensor includes a pixel region and a passivation region. The pixel region includes an active pixel region and a virtual pixel region. The passivation region surrounds the virtual pixel region. as well as The upper surface of the second plate overlaps with the corner region of the lower surface of the active pixel region in the vertical direction.

11. The camera module according to claim 6, wherein, The area of ​​the upper surface of the first adhesive member accounts for 40% to 90% of the area of ​​the lower surface of the image sensor.

12. The camera module according to claim 1, wherein, The second plate has a closed-loop shape including the opening.

13. The camera module according to claim 1, further comprising: The second adhesive component is disposed between the first plate and the circuit board.

14. The camera module according to claim 1, further comprising: Lens tube; A retainer is disposed on the circuit board and includes a mounting portion thereon on which a filter is mounted; as well as A cover member is disposed on the circuit board and houses the retainer and the lens barrel.

15. The camera module according to claim 14, wherein, The retainer includes vent holes that pass through the inner and outer surfaces of the retainer.

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