A circuit board assembly and vehicle camera module

Abstract

The application discloses a circuit board assembly and a vehicle-mounted camera module. The circuit board assembly comprises a photosensitive chip, a circuit board, a base, and the circuit board is electrically connected with the photosensitive chip. The circuit board has a through hole in the middle part, and the photosensitive chip is arranged in the through hole. The base comprises a base bottom surface and a protruding part in the middle part of the base bottom surface. The protruding part is arranged protruding relative to the plane where the base bottom surface is located. The part of the circuit board close to the through hole is mounted on the protruding part, so that the first gap is formed between the outer edge of the circuit board and the base bottom surface, and the photosensitive chip is carried by the protruding part. The protruding part of the base directly contacts the photosensitive chip, and the heat can be quickly conducted to the base to reduce the temperature of the photosensitive chip. The first gap is formed between the outer edge of the circuit board and the base bottom surface, which provides space for air convection, accelerates heat dissipation, and reduces the temperature of the circuit board.

Description

Technical Field

[0001] This application relates to the field of camera module technology, and more specifically to a circuit board assembly and an in-vehicle camera module. Background Technology

[0002] With the continued popularization of new energy vehicles, the market is placing increasingly higher demands on the imaging performance of in-vehicle cameras. To further improve imaging effects, camera modules are constantly being optimized within a limited photosensitive area: on the one hand, by reducing the size of individual pixels to accommodate more pixels, thereby improving the detail resolution of the image; on the other hand, since reducing the pixel size leads to a decrease in light sensitivity, especially in low-light environments where noise is easily generated, pixel binning technology is adopted to integrate multiple small pixels into an equivalent large pixel, thereby ensuring the advantages of high pixel count while also taking into account the sensor's light capture efficiency, achieving a comprehensive improvement in image quality. Utility Model Content

[0003] One objective of this application is to provide a circuit board assembly for an in-vehicle camera module to solve the problem of poor heat dissipation of the circuit board assembly.

[0004] Another objective of this application is to provide a vehicle-mounted camera module with higher stability.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: a circuit board assembly for an in-vehicle camera module, comprising: a photosensitive chip; a circuit board having a through hole in the middle, the photosensitive chip being disposed in the through hole, the circuit board being electrically connected to the photosensitive chip; and a base including a base bottom surface and a protrusion located in the middle of the base bottom surface, the protrusion being convex relative to the plane of the base bottom surface, the portion of the circuit board near the through hole being mounted on the protrusion, such that there is a first gap between the outer edge of the circuit board and the base bottom surface, and the photosensitive chip being supported by the protrusion.

[0006] As a preferred embodiment, the protrusion includes a first stepped portion and a second stepped portion surrounding the first stepped portion, the first stepped portion being higher than the second stepped portion, the circuit board being disposed on the second stepped portion, and the photosensitive chip being disposed on the first stepped portion.

[0007] As another preferred embodiment, the base is a one-piece molded metal part, the bottom surface of the photosensitive chip is bonded to the top surface of the first step portion by a first adhesive, and the bottom surface of the circuit board is bonded to the second step portion by a second adhesive.

[0008] Further preferably, the second step portion is recessed downward on the side near the first step portion to form a glue groove, and the inner diameter of the through hole of the circuit board is larger than the outer diameter of the first step portion, so that a second gap is formed between the inner wall of the through hole of the circuit board and the outer wall of the first step portion, and the glue groove and the second gap are provided with the second adhesive.

[0009] More preferably, the base further includes at least one support portion located at the bottom edge of the base, and the outer edge of the circuit board is connected to the support portion.

[0010] More preferably, the base includes at least two support portions, which are respectively disposed at diagonal positions on the bottom surface of the base, and the circuit board is connected to the support portions by screws or rivets.

[0011] Further preferably, the circuit board has circuit layers on both sides, the front side of the circuit board has upwardly protruding front electronic components, the back side of the circuit board has downwardly protruding back electronic components, and the back electronic components are located within the first gap.

[0012] Further preferably, the circuit board assembly also includes a filter holder disposed on the circuit board and a filter mounted on the filter holder, wherein the filter is located in the light path of the photosensitive chip.

[0013] This application also provides an in-vehicle camera module, including the aforementioned circuit board assembly. The in-vehicle camera module further includes a lens disposed on the light-intake side of the photosensitive chip, and a housing that holds the lens on the circuit board assembly.

[0014] Further preferably, the base also includes a connecting portion extending upward from the bottom surface of the base, the connecting portion being connected to the housing, and the base also includes an electrical connection portion, the electrical connection portion including an outwardly extending plug portion and an electrical connection portion extending towards the circuit board, through which the electrical connection portion is used to realize the electrical connection between the circuit board and external devices.

[0015] Compared with the prior art, the beneficial effects of this application are as follows: (1) The temperature of the photosensitive chip and the circuit board rises during operation, generating heat. The protrusion of the base is in direct contact with the photosensitive chip, which can quickly conduct heat to the base to reduce the temperature of the photosensitive chip. There is a first gap between the outer edge of the circuit board and the bottom surface of the base to provide space for air convection, accelerate heat dissipation, and reduce the temperature of the circuit board. (2) The through holes of the circuit board are matched with the protrusions, and the photosensitive chip is set on the protrusions. No additional positioning structure is needed to achieve the relative alignment of the three, reduce assembly steps and errors, and improve production efficiency. Attached Figure Description

[0016] Figure 1 An exploded view of a vehicle-mounted camera module provided in an embodiment of this application.

[0017] Figure 2 This is a schematic diagram of a circuit board assembly provided in an embodiment of this application.

[0018] Figure 3 This is a schematic diagram of the structure of a base provided in an embodiment of this application.

[0019] Figure 4 This is a cross-sectional view of a circuit board assembly provided in an embodiment of this application.

[0020] Figure 5 This is a cross-sectional view of a vehicle-mounted camera module provided in an embodiment of this application.

[0021] Figure 6 This is a top-view structural diagram of a vehicle-mounted camera module provided in an embodiment of this application.

[0022] Figure 7 for Figure 6 A cross-sectional view along the AA direction.

[0023] In the diagram: 1. Vehicle-mounted camera module; 10. Circuit board assembly; 11. Photosensitive chip; 12. Circuit board; 121. Through hole; 1211. Inner wall of through hole; 122. First gap; 13. Base; 131. Bottom surface of base; 132. Protrusion; 1321. First step; 1322. Second step; 13221. Adhesive groove; 133. First adhesive; 134. Second adhesive; 135. Second gap; 136. Support; 137. Connecting part; 138. Electrical connection part; 1381. Plug-in part; 1382. Electrical connection part; 14. Filter; 15. Filter bracket; 151. Mounting part; 152. Abutting part; 20. Lens; 30. Housing. Detailed Implementation

[0024] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0025] In the description of this application, it should be noted that the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., which indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of this application.

[0026] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0027] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0028] In some embodiments, this application provides a circuit board assembly 10 for an in-vehicle camera module 1, the specific structure of which is as follows: Figure 1 and Figure 2 As shown. The circuit board assembly 10 includes: a photosensitive chip 11, a circuit board 12, and a base 13. The circuit board 12 has a through hole 121 in the middle, the photosensitive chip 11 is disposed in the through hole 121, and the circuit board 12 is electrically connected to the photosensitive chip 11. The base 13 includes a base bottom surface 131 and a protrusion 132 located in the middle of the base bottom surface 131. The protrusion 132 protrudes relative to the plane on which the base bottom surface 131 is located. The portion of the circuit board 12 near the through hole 121 is mounted on the protrusion 132, so that there is a first gap 122 between the outer edge of the circuit board 12 and the base bottom surface 131. The photosensitive chip 11 is supported by the protrusion 132.

[0029] In some embodiments, such as Figures 1-3As shown, the circuit board 12 has a through hole 121 in the middle, and the photosensitive chip 11 is disposed in the through hole 121. The base 13 has a base bottom surface 131 and a protrusion 132 protruding from the base bottom surface 131. The part of the circuit board 12 near the through hole 121 is mounted on the protrusion 132, which facilitates the determination of the installation position of the circuit board 12 and eliminates the need for additional positioning structures, thereby reducing the installation error of the circuit board 12 and ensuring the imaging quality of the vehicle camera module 1. Moreover, when the circuit board 12 is mounted on the protrusion 132, the photosensitive chip 11 and the protrusion 132 are in close contact. When the photosensitive chip 11 operates, its temperature rises and generates heat. The protrusion 132 is in direct contact with the photosensitive chip 11, which can quickly conduct heat to the base 13 to reduce the temperature of the photosensitive chip 11. A first gap 122 exists between the base bottom surface 131 and the outer edge of the circuit board 12, providing space for air convection, accelerating heat dissipation, reducing the temperature of the circuit board 12, and preventing the circuit board 12 from overheating and aging.

[0030] In some embodiments, the protrusion 132 includes a first step portion 1321 and a second step portion 1322 surrounding the first step portion 1321. The first step portion 1321 is higher than the second step portion 1322. The circuit board 12 is disposed on the second step portion 1322, and the photosensitive chip 11 is disposed on the first step portion 1321.

[0031] In some embodiments, such as Figure 3 as well as Figure 4 As shown, the protrusion 132 includes a first step 1321 and a second step 1322. The second step 1322 is lower than the first step 1321 in the height direction. The through hole 121 of the circuit board 12 corresponds to the protrusion 132 in the height direction, and the periphery of the through hole 121 is placed on the second step 1322, which facilitates the determination of the installation position of the circuit board 12 and reduces installation errors. The photosensitive chip 11 is in close contact with the first step 1321, so that the heat generated by the photosensitive chip 11 can be directly conducted to the base 13 to reduce the problem of the photosensitive chip 11 and prevent the photosensitive chip 11 from overheating and accelerating aging.

[0032] In some embodiments, such as Figure 4 As shown, the bottom surface of the base 13 is a serrated surface to increase the contact area between the bottom surface of the base 13 and the air, thereby improving the heat dissipation effect of the base 13 and preventing heat concentration in the base 13.

[0033] In some embodiments, the thickness of the circuit board 12 is equal to the sum of the heights of the second step portion 1322 and the photosensitive chip 11. That is, the circuit board 12 can be on the same plane as the photosensitive chip 11, and the photosensitive chip 11 is electrically connected to the circuit board 12 to shorten the signal transmission path and reduce signal loss and interference.

[0034] In some embodiments, the base 13 is an integrally formed metal part, the bottom surface of the photosensitive chip 11 is bonded to the top surface of the first step portion 1321 by a first adhesive 133, and the bottom surface of the circuit board 12 is bonded to the second step portion 1322 by a second adhesive 134.

[0035] In some embodiments, such as Figure 4 As shown, the base 13 is a one-piece metal part. The environment in which the base 13 is located is subject to frequent vibration. If the base 13 is composed of multiple components spliced ​​or welded, the connection between the components may become loose and cracked due to vibration, resulting in the photosensitive chip 11 shifting position, poor image quality, and failure of electrical connection between the photosensitive chip 11 and the circuit board 12. Therefore, in order to improve the stability of the base 13, it is one-piece molded, which makes the rigidity of the base 13 more uniform, able to withstand vibration and impact, avoid local structural damage, and ensure the imaging quality of the vehicle camera module 1.

[0036] In some embodiments, such as Figure 4 As shown, the photosensitive chip 11 is bonded to the first step portion 1321 by a first adhesive 133. The first adhesive 133 is an insulating and thermally conductive material. On the one hand, it avoids direct rigid contact between the photosensitive chip 11 and the first step portion 1321. If the photosensitive chip 11 is in direct rigid contact with the base, a rigid impact will occur between the two during vibration. The encapsulation of the photosensitive chip 11 is generally a ceramic substrate or a glass cover plate. Under long-term vibration and impact, cracks are likely to appear, leading to the breakage of the wires connecting the photosensitive chip 11 and the circuit board 12, causing electrical connection failure. On the other hand, it can absorb the impact force generated during vibration through its own buffering performance, reducing the rigid collision between the photosensitive chip 11 and the base 13, and reducing the risk of damage to the encapsulation of the photosensitive chip 11 and breakage of the internal wires.

[0037] Meanwhile, the first adhesive 133 has reliable bonding strength, which can fix the photosensitive chip 11 on the first step portion 1321. It can effectively suppress the relative displacement caused by thermal expansion and contraction, and avoid problems such as unclear imaging of the module caused by chip position changes. Moreover, the first adhesive 133 has insulating properties, which can prevent the chip from being broken down during EMC electrostatic testing. Furthermore, since the first adhesive 133 has good thermal conductivity, it can also assist the photosensitive chip 11 in heat dissipation and prevent the photosensitive chip 11 from aging due to excessive temperature.

[0038] Furthermore, even though the first step portion 1321 and the bottom surface of the photosensitive chip 11 are precision-machined, a micron-sized gap still exists when they are in direct contact. The air in the gap has an extremely low thermal conductivity, making it difficult for the heat from the photosensitive chip 11 to be quickly transferred to the base 13. The first adhesive 133 has a high thermal conductivity and is a fluid substance, which can fill the gap, eliminate the air in the gap, improve the thermal conductivity between the photosensitive chip 11 and the base 13, and ensure that the heat from the photosensitive chip 11 is quickly transferred to the base 13, and then dissipated through the base 13 to reduce the temperature of the photosensitive chip 11.

[0039] In some embodiments, the bottom surface of the circuit board 12 is bonded to the second step portion 1322 by a second adhesive 134. The second adhesive 134 is a flexible material, so that the part of the circuit board 12 that contacts the second step portion 1322 is in flexible contact, preventing the circuit board 12 from cracking when vibration or impact occurs, thus playing a buffering role.

[0040] In some embodiments, the base 13 may be made of aluminum alloy, magnesium alloy, or copper alloy. The first adhesive 133 and the second adhesive 134 may be made of silicone-based thermally conductive adhesive, and there is no limitation on this.

[0041] In some embodiments, the second step portion 1322 is recessed downward on the side near the first step portion 1321 to form a glue groove 13221, and the inner diameter of the through hole 121 of the circuit board 12 is larger than the outer diameter of the first step portion 1321, so that a second gap 135 is formed between the inner wall 1211 of the through hole of the circuit board 12 and the outer wall of the first step portion 1321. A second adhesive 134 is provided in the glue groove 13221 and the second gap 135.

[0042] In some embodiments, such as Figure 4 As shown, the second step portion 1322 is recessed downward to form a glue groove 13221. A second gap 135 is formed between the inner wall 1211 of the through hole and the outer wall of the first step portion 1321. The glue groove 13221 and the second gap 135 are interconnected to increase the amount of glue filling the second adhesive 134, thereby increasing the reliability of the connection between the circuit board 12 and the base 13.

[0043] Furthermore, since the inner diameter of the through hole 121 is larger than the outer diameter of the first stepped portion 1321, the circuit board 12 will wobble along the vertical direction Q1 and the horizontal direction Q2 after it is mounted on the base 13. Therefore, a second adhesive 134 is filled between the inner wall 1211 of the through hole and the first stepped portion 1321 to limit the wobble of the circuit board 12 along the horizontal direction Q2. Figure 4As shown, the opening of the adhesive groove 13221 faces the circuit board 12, so that the second adhesive 134 is in contact with the bottom surface of the circuit board 12, thereby restricting the movement of the circuit board 12 in the vertical direction Q1 and increasing the stability of the circuit board 12 installation.

[0044] In some embodiments, the inner wall of the adhesive groove 13221 may also be provided with serrated patterns to increase the amount of the second adhesive 134 adhered.

[0045] In some embodiments, the base 13 further includes at least one support portion 136 located at the edge of the base bottom surface 131, and the outer edge of the circuit board 12 is connected to the support portion 136, such as Figure 3 As shown, the base 13 also includes a support portion 136, which extends vertically so that when the circuit board 12 is mounted on the protrusion 132, the support portion 136 can support the circuit board 12 vertically. The circuit board 12 has poor bending resistance. If it is only supported by the protrusion 132 and fixed by the second adhesive 134, the circuit board 12 is prone to bending, warping, or breaking due to localized stress concentration when the vehicle camera module 1 is subjected to vibration. Therefore, multiple support portions 136 are provided on the edge of the bottom surface 131 of the base so that the edge of the circuit board 12 is supported by the support portions 136, thus preventing the circuit board 12 from breaking due to localized stress concentration.

[0046] In some embodiments, the base 13 includes at least two support portions 136, which are respectively disposed at diagonal positions on the bottom surface 131 of the base. The circuit board 12 is connected to the support portions 136 by screws or rivets, so that the support portions 136 can support and fix the circuit board 12. Figure 1 As shown, the support portion 136 is arranged along the diagonal of the base bottom surface 131 to form a larger support surface. If the two are connected by screws, the circuit board 12 is provided with mounting holes that cooperate with the support portion 136. The screws pass through the mounting holes to mount the circuit board 12 on the base 13, preventing the circuit board 12 from shifting due to vibration. Moreover, the connection method using screws or rivets is simpler and facilitates disassembly and installation.

[0047] In some embodiments, circuit layers are provided on both sides of the circuit board 12, and upwardly protruding front electronic components are provided on the front side of the circuit board 12, while downwardly protruding back electronic components are provided on the back side of the circuit board 12. The back electronic components are located within the first gap 122. Figure 4 As shown, when electronic components are placed on the side of the circuit board 12 closest to the base 13, the electronic components are located within the first gap 122 to avoid positional interference between the electronic components and the base 13. In some embodiments, the circuit board 12 is a double-sided FR4 substrate. It can be understood that circuits and components can be designed and soldered on both sides of the circuit board 12 to reduce the number of circuit board 12 laid out, greatly reducing the space occupied by the circuit board assembly 10. Moreover, vias are provided on the circuit board 12 to allow components on both sides to be directly connected, which greatly shortens the signal transmission distance and improves communication efficiency.

[0048] In some embodiments, such as Figure 5 As shown, the circuit board assembly 10 also includes a filter holder 15 disposed on the circuit board 12 and a filter 14 mounted on the filter holder 15, the filter 14 being located in the light path of the photosensitive chip 11.

[0049] In some embodiments, the filter holder 15 is mounted on the circuit board 12. The filter holder 15 has a mounting portion 151 and an abutment portion 152. The mounting portion 151 extends horizontally so that the filter 14 can be placed on the mounting portion 151. The mounting portion 151 abuts against the peripheral edge of the filter 14 only. That is, the mounting portion 151 is arranged in a ring to avoid affecting the filtering of the filter 14. The abutment portion 152 is arranged circumferentially around the mounting portion 151 to limit the horizontal displacement of the filter 14.

[0050] The filter 14 is disposed on the light path of the photosensitive chip 11. First, it improves the quality of the light entering the photosensitive chip 11 to reduce the impact of interference light on imaging or photosensitive effect, ensuring that the photosensitive chip 11 only receives effective light of the target wavelength, and ultimately improves the accuracy and stability of the circuit board assembly 10. Second, the filter 14 has a certain mechanical strength, which can block dust and small foreign objects from falling directly into the photosensitive area of ​​the photosensitive chip 11, avoiding bad pixels caused by foreign objects blocking the image, and ensuring the quality of the image.

[0051] This application also provides a vehicle-mounted camera module 1, such as... Figure 6 as well as Figure 7 As shown, where Figure 7 yes Figure 6 In the cross-sectional view along the AA direction, the vehicle-mounted camera module 1 includes the aforementioned circuit board assembly 10, a lens 20 disposed on the light-inlet side of the photosensitive chip 11, and a housing 30 that holds the lens 20 on the circuit board assembly 10. It can be understood that the housing 30 provides rigid support for the lens 20, so that when the vehicle-mounted camera module 1 is subjected to vibration, the lens 20 can be prevented from shaking, ensuring that the optical axis of the lens 20 is aligned with the center of the photosensitive chip 11, and avoiding image distortion caused by misalignment.

[0052] Lens 20 gathers ambient light, ensuring that effective light enters the vehicle camera module 1 efficiently. The filter 14 of the circuit board assembly 10 filters stray light, and the photosensitive chip 11 converts the light signal into an electrical signal. The two work together to ensure that the effective light gathered by lens 20 is ultimately converted into an electrical signal.

[0053] In some other embodiments, the base 13 further includes a connecting portion 137 extending upward from the bottom surface 131 of the base, the connecting portion 137 being connected to the housing 30. The base 13 also includes an electrical connection portion 138, which includes an outwardly extending plug portion 1381 and an electrical connection portion 1382 extending toward the circuit board 12, thereby enabling electrical connection between the circuit board 12 and external devices.

[0054] like Figure 7 As shown, the connecting part 137 extends upward from the bottom surface 131 of the base and cooperates with the housing 30 to confine the circuit board assembly 10 between the base 13 and the housing 30, preventing damage to the circuit board assembly 10. It can be understood that the base 13 not only serves to fix the circuit board 12, but also cooperates directly with the housing 30 through the connecting part 137, thereby protecting the circuit board assembly 10, reducing the number of parts in the vehicle camera module 1, compressing the overall volume of the vehicle camera module 1, and reducing the space it occupies.

[0055] like Figure 7 As shown, the base 13 also includes an electrical connection portion 138, which includes an outwardly extending plug portion 1381 and an electrical connection portion 1382 extending towards the circuit board 12. The electrical connection portion 138 is directly mounted on the base 13 to reduce the number of parts and the size of the vehicle camera module 1, thus adapting it to a compact installation environment. The plug portion 1381 is electrically connected to external devices, and the electrical connection portion 1382 is electrically connected to the circuit board 12, thereby realizing the electrical connection between the circuit board 12 and external devices. No additional wiring between the circuit board 12 and external devices is required, facilitating installation and making the vehicle camera module 1 more aesthetically pleasing after installation.

[0056] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A circuit board assembly for a vehicle-mounted camera module, characterized in that, include: Photosensitive chip; A circuit board having a through hole in the middle, a photosensitive chip disposed in the through hole, and the circuit board being electrically connected to the photosensitive chip; The base includes a base bottom surface and a protrusion located in the middle of the base bottom surface. The protrusion protrudes relative to the plane on which the base bottom surface is located. The portion of the circuit board near the through hole is mounted on the protrusion so that there is a first gap between the outer edge of the circuit board and the base bottom surface. The photosensitive chip is supported by the protrusion.

2. The circuit board assembly as claimed in claim 1, characterized in that, The protrusion includes a first stepped portion and a second stepped portion surrounding the first stepped portion. The first stepped portion is higher than the second stepped portion. The circuit board is disposed on the second stepped portion, and the photosensitive chip is disposed on the first stepped portion.

3. The circuit board assembly as described in claim 2, characterized in that, The base is a one-piece metal part. The bottom surface of the photosensitive chip is bonded to the top surface of the first step portion by a first adhesive, and the bottom surface of the circuit board is bonded to the second step portion by a second adhesive.

4. The circuit board assembly as claimed in claim 3, characterized in that, The second step portion is recessed downward on the side near the first step portion to form a glue groove. The inner diameter of the through hole of the circuit board is larger than the outer diameter of the first step portion, so that a second gap is formed between the inner wall of the through hole of the circuit board and the outer wall of the first step portion. The glue groove and the second gap are provided with the second adhesive.

5. The circuit board assembly as claimed in claim 1, characterized in that, The base also includes at least one support portion located at the bottom edge of the base, and the outer edge of the circuit board is connected to the support portion.

6. The circuit board assembly as claimed in claim 5, characterized in that, The base includes at least two support portions, which are respectively disposed at diagonal positions on the bottom surface of the base. The circuit board is connected to the support portions by screws or rivets.

7. The circuit board assembly as claimed in claim 1, characterized in that, The circuit board has circuit layers on both sides, and the front side of the circuit board has upward-protruding front electronic components, and the back side of the circuit board has downward-protruding back electronic components, which are located within the first gap.

8. The circuit board assembly as claimed in claim 1, characterized in that, It also includes a filter holder disposed on the circuit board and a filter mounted on the filter holder, wherein the filter is located in the light path of the photosensitive chip.

9. A vehicle-mounted camera module, characterized in that, The circuit board assembly according to any one of claims 1-8 further includes a lens disposed on the light-inlet side of the photosensitive chip, and a housing holding the lens on the circuit board assembly.

10. The vehicle-mounted camera module as described in claim 9, characterized in that, The base also includes a connecting portion extending upward from the bottom surface of the base, the connecting portion being connected to the housing, and the base also includes an electrical connection portion, the electrical connection portion including an outwardly extending plug portion and an electrical connection portion extending towards the circuit board, through which the electrical connection portion is used to realize the electrical connection between the circuit board and external devices.

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