Al@Cu composite material, preparation method and application thereof
By simplifying the chemical copper plating process to prepare Al@Cu composite materials on the surface of aluminum powder, the problems of cumbersome and high cost of traditional processes are solved. This achieves uniformity of copper plating and flexible production of aluminum-copper alloy powder, while reducing energy consumption and costs.
CN116536655BActive Publication Date: 2026-06-19KUNMING UNIV OF SCI & TECH
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KUNMING UNIV OF SCI & TECH
- Filing Date
- 2023-05-04
- Publication Date
- 2026-06-19
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Figure CN116536655B_ABST
Abstract
This invention relates to a method for preparing Al@Cu composite materials, belonging to the field of surface treatment technology. The Al@Cu composite material is a core-shell structured coating material with aluminum as the core and copper as the shell. Because copper has superior thermophysical properties and electrical conductivity, while aluminum has lower density and is cheaper, the Al@Cu composite material prepared by combining the advantages of both can be applied to conductive materials, silver-coated aluminum powder transition materials, electromagnetic shielding materials, and other fields. Furthermore, aluminum-copper alloy powders can be further prepared based on this material. This invention features a simple, low-cost, clean, energy-saving, and highly practical process with excellent application prospects.
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