Solid state drive, monitoring system, method, server, device and medium

Abstract

The application provides a solid state disk, a monitoring system, a method, a server, equipment and a medium, and the solid state disk comprises a microcontroller, a flash memory controller, a plurality of flash memory chips, a shell, a plurality of temperature sensors and a first integrated circuit bus; each temperature sensor is connected with the microcontroller through the first integrated circuit bus, and each temperature sensor is used for collecting temperature data at a temperature sensitive position; the microcontroller is used for reading the temperature data of the temperature sensor through the first integrated circuit bus and forwarding the temperature data to a target electronic device. The solid state disk, the monitoring system, the method, the server, the equipment and the medium provided by the application can realize self-monitoring of the working temperature without affecting the normal operation, the accuracy, flexibility and efficiency of the self-monitoring of the working temperature are higher, the operation stability of the solid state disk can be improved, and user perception can be improved.

Description

Technical Field

[0001] This invention relates to the field of computer technology, and in particular to a solid-state drive, a monitoring system, a method, a server, an equipment, and a medium. Background Technology

[0002] Solid-state drives (SSDs) are highly sensitive to temperature; the higher the operating temperature of an SSD, the worse its performance stability.

[0003] However, existing technologies struggle to accurately monitor the operating temperature of solid-state drives (SSDs) without affecting the normal operation of the system hosting the SSD. Therefore, how to more accurately monitor the operating temperature of SSDs without disrupting the normal operation of the system is a pressing technical problem that needs to be solved in this field. Summary of the Invention

[0004] This invention provides a solid-state drive (SSD), a monitoring system, a method, a server, a device, and a medium to address the shortcomings of existing technologies that make it difficult to accurately monitor the operating temperature of an SSD without affecting the normal operation of the system in which the SSD is located. This invention enables more accurate monitoring of the operating temperature of the SSD without affecting the normal operation of the system in which the SSD is located.

[0005] This invention provides a solid-state drive, comprising: a microcontroller, a flash memory controller, multiple flash memory chips, a casing, multiple temperature sensors, and a first integrated circuit bus;

[0006] Each of the temperature sensors is connected to the microcontroller via the first integrated circuit bus, and each temperature sensor is used to collect temperature information at its temperature-sensitive location.

[0007] The microcontroller is used to read temperature data from the temperature sensor via the first integrated circuit bus and forward the temperature data to the target electronic device.

[0008] Each of the temperature-sensitive locations is determined based on multiple factors, including the location of the target flash memory chip, the location of the heat dissipation holes on the housing, and the location of the flash memory controller; the target flash memory chip is the flash memory chip that is furthest from the housing among all the flash memory chips.

[0009] According to a solid-state drive provided by the present invention, the temperature sensor is further configured to send the temperature data collected by the temperature sensor to the microcontroller via the first integrated circuit bus upon receiving a first query request;

[0010] The first query request is used to request the temperature collected by the temperature sensor.

[0011] According to a solid-state drive provided by the present invention, the first query request is sent by the target electronic device to the temperature sensor through the microcontroller and the first integrated circuit bus after receiving the first input.

[0012] A solid-state drive according to the present invention further includes: a power backup management chip;

[0013] The backup power management chip is connected to the microcontroller via the first integrated circuit bus;

[0014] The microcontroller is also used to read the stored data in the backup power management chip through the first integrated circuit bus and forward the stored data to the target electronic device.

[0015] According to a solid-state drive provided by the present invention, the backup power management chip is further configured to, upon receiving a second query request, send the stored data to the microcontroller via the first integrated circuit bus, so that the microcontroller can forward the stored data to the target electronic device;

[0016] The second query request is used to request the stored data in the backup power management chip.

[0017] According to a solid-state drive provided by the present invention, the second query request is sent by the target electronic device to the backup power management chip through the microcontroller and the first integrated circuit bus after receiving the second input.

[0018] A solid-state drive according to the present invention further includes: a power consumption monitoring chip;

[0019] The power consumption monitoring chip is located in a preset position and is connected to the microcontroller via the first integrated circuit bus;

[0020] The power consumption monitoring chip is used to acquire the power consumption data of the solid-state drive;

[0021] The microcontroller is also configured to read the power consumption data via the first integrated circuit bus and forward the power consumption data to the target electronic device;

[0022] The preset position is determined based on the position of the voltage output pin of the backup power management chip.

[0023] According to a solid-state drive provided by the present invention, the power consumption monitoring chip is further configured to send the power consumption data to the microcontroller via the first integrated circuit bus upon receiving a third query request;

[0024] The third query request is used to request power consumption data obtained by the power consumption monitoring chip.

[0025] According to a solid-state drive provided by the present invention, the third query request is sent by the target electronic device to the power consumption monitoring chip through the microcontroller and the first integrated circuit bus when the target electronic device receives a third input.

[0026] A solid-state drive according to the present invention further includes: a universal asynchronous receiver / transmitter serial port;

[0027] The flash memory controller and the microcontroller are connected via a second integrated circuit bus; the universal asynchronous transceiver serial port is located on the second integrated circuit bus.

[0028] The universal asynchronous transceiver serial port is used to output a first abnormal information indicating that the flash controller is in an abnormal state when the flash controller is in an abnormal state.

[0029] The general asynchronous transceiver serial port is also used to output a second abnormal information indicating that the microcontroller is in an abnormal working state when the microcontroller is in an abnormal working state.

[0030] The universal asynchronous transceiver serial port is also used to output a third abnormality message indicating that the communication between the target electronic device and the temperature sensor has failed in the event of a communication failure between the target electronic device and the temperature sensor.

[0031] According to a solid-state drive provided by the present invention, it further includes: a connection component and a system management bus;

[0032] The connection component and the system management bus are used to connect the target electronic device and the flash memory controller;

[0033] The connection component and the system management bus are also used to connect the target electronic device and the microcontroller.

[0034] The present invention also provides a monitoring system, comprising: a solid-state drive as described above and a target electronic device; the target electronic device is respectively connected to a microcontroller and a flash memory controller in the solid-state drive;

[0035] The target electronic device is configured to, upon receiving a first input, read the operating status information of the microcontroller and the flash memory controller via a first integrated circuit bus; upon reading the target operating status information indicating that the microcontroller and the flash memory controller are in normal operating status, read the slave address of the temperature sensor via the microcontroller and the first integrated circuit bus; and upon reading the slave address of the temperature sensor, send a first query request to the temperature sensor via the microcontroller and the first integrated circuit bus.

[0036] The target electronic device is also used to receive temperature data returned by the temperature sensor via the first integrated circuit bus and the microcontroller.

[0037] According to a monitoring system provided by the present invention, the target electronic device is further configured to, upon receiving a second input, read the operating status information of the microcontroller and the flash memory controller via a first integrated circuit bus; upon reading the target operating status information, read the slave address of the backup power management chip via the microcontroller and the first integrated circuit bus; and upon reading the slave address of the backup power management chip, send a second query request to the backup power management chip via the microcontroller and the first integrated circuit bus.

[0038] The target electronic device is also used to receive stored data returned by the backup power management chip via the first integrated circuit bus and the microcontroller.

[0039] According to a monitoring system provided by the present invention, the target electronic device is further configured to, upon receiving a third input, read the operating status information of the microcontroller and the flash memory controller via a first integrated circuit bus; upon reading the target operating status information, read the slave address of the power consumption monitoring chip via the microcontroller and the first integrated circuit bus; and upon reading the slave address of the power consumption monitoring chip, send a third query request to the power consumption monitoring chip via the microcontroller and the first integrated circuit bus.

[0040] The target electronic device is also used to receive power consumption returned by the power consumption monitoring chip via the first integrated circuit bus and the microcontroller.

[0041] The present invention also provides a monitoring method, implemented based on any of the monitoring systems described above, comprising:

[0042] Upon receiving the first input, the operating status information of the microcontroller and flash memory controller in the solid-state drive is read through the first integrated circuit bus;

[0043] When the target operating status information indicating that the microcontroller and the flash memory controller are in normal working condition is read, the slave address of the temperature sensor is read through the microcontroller and the first integrated circuit bus;

[0044] Upon reading the slave address of the temperature sensor, the first query request is sent to the temperature sensor via the microcontroller and the first integrated circuit bus;

[0045] The temperature returned by the temperature sensor is received via the first integrated circuit bus and the microcontroller.

[0046] According to a monitoring method provided by the present invention, the method further includes:

[0047] Upon receiving a second input, the operating status information of the microcontroller and the flash memory controller is read via the first integrated circuit bus;

[0048] Upon reading the target operating status information, the slave address of the backup power management chip is read through the microcontroller and the first integrated circuit bus;

[0049] Upon reading the slave address of the backup power management chip, a second query request is sent to the backup power management chip via the microcontroller and the first integrated circuit bus;

[0050] The system receives stored data returned by the backup power management chip via the first integrated circuit bus and the microcontroller.

[0051] According to a monitoring method provided by the present invention, the method further includes:

[0052] Upon receiving a third input, the operating status information of the microcontroller and the flash memory controller is read via the first integrated circuit bus;

[0053] Upon reading the target operating status information, the slave address of the power consumption monitoring chip is read through the microcontroller and the first integrated circuit bus;

[0054] Upon reading the slave address of the power consumption monitoring chip, a third query request is sent to the power consumption monitoring chip via the microcontroller and the first integrated circuit bus;

[0055] The power consumption returned by the power monitoring chip is received through the first integrated circuit bus and the microcontroller.

[0056] The present invention also provides a server, including: a solid-state drive as described above.

[0057] The present invention also provides an electronic device, including a memory, a target electronic device, and a computer program stored in the memory and executable on the target electronic device, wherein the target electronic device implements the monitoring method described above when executing the program.

[0058] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a target electronic device, implements the monitoring method as described above.

[0059] The present invention also provides a computer program product, including a computer program that, when executed by a target electronic device, implements the monitoring method as described above.

[0060] The solid-state drive, monitoring system, method, server, device and medium provided by the present invention enable the solid-state drive to achieve self-monitoring of operating temperature without affecting normal operation. The accuracy, flexibility and efficiency of self-monitoring of operating temperature are higher, which can improve the operating stability of the solid-state drive and improve the user experience. Attached Figure Description

[0061] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0062] Figure 1 This is a schematic diagram of the solid-state drive provided by the present invention;

[0063] Figure 2 This is a communication diagram of the solid-state drive provided by the present invention;

[0064] Figure 3 A circuit diagram of a power backup management chip in a solid-state drive provided by the present invention;

[0065] Figure 4 This is one of the flowcharts of the monitoring method provided by the present invention;

[0066] Figure 5 This is the second flowchart illustrating the monitoring method provided by the present invention;

[0067] Figure 6 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0068] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0069] In the description of the invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0070] It should be noted that with the continuous development of computer technology, the demand for data storage is also increasing.

[0071] Solid-state drives (SSDs) are hard drives made using arrays of solid-state electronic storage chips. Compared to traditional hard disk drives (HDDs), SSDs offer advantages such as faster read / write speeds, lower noise, lower power consumption, shock and drop resistance, and portability, making them widely used in numerous fields including military, automotive, industrial control, video surveillance, network monitoring, network terminals, power, medical, aviation, and navigation equipment.

[0072] Solid-state drives (SSDs) are highly sensitive to temperature; the higher the operating temperature of an SSD, the worse its performance stability.

[0073] For enterprise-grade SSDs used in servers, compared to desktop SSDs, enterprise-grade SSDs handle larger data volumes and run for longer periods, resulting in higher operating temperatures. Furthermore, enterprise-grade SSDs have significantly higher performance and stability requirements than desktop SSDs. Therefore, accurately monitoring the operating temperature of SSDs is crucial for improving their performance and stability.

[0074] In related technologies, monitoring the operating temperature of solid-state drives (SSDs) often affects their normal operation, which in turn affects the normal operation of the system in which the SSD resides, and impacts user experience.

[0075] To address this issue, the present invention provides a solid-state drive (SSD). Based on the SSD provided by this invention, self-monitoring of the SSD's operating temperature can be achieved without affecting the normal operation of the SSD and the system on which it resides, thereby improving the SSD's operational stability and enhancing user experience.

[0076] Figure 1 This is a schematic diagram of the solid-state drive provided by the present invention. Figure 1 As shown, the solid-state drive 101 includes: a microcontroller 102, a flash memory controller 103, multiple flash memory chips 104, a casing 105, multiple temperature sensors 106, and a first integrated circuit bus 107;

[0077] Each temperature sensor 106 is connected to the microcontroller 102 via the first integrated circuit bus 107, and each temperature sensor 106 is used to collect temperature data at its temperature-sensitive location.

[0078] The microcontroller 102 is used to read the temperature of the temperature sensor 106 via the first integrated circuit bus 107 and forward the temperature to the target electronic device;

[0079] Each temperature-sensitive location includes the location of the target flash memory chip 111, the location of the heat dissipation hole 109 on the casing 105, and the location of the flash memory controller 103; the target flash memory chip 111 is the flash memory chip 104 that is furthest from the casing 105 among all flash memory chips 104.

[0080] It should be noted that the solid-state drive 101 in this embodiment of the invention can realize self-monitoring of operating temperature and can send the monitored temperature data to the target electronic device.

[0081] It should be noted that the target electronic device can be an electronic device used by a user. The type of target electronic device can be a computer, server, etc. The specific type of target electronic device is not limited in this embodiment of the invention.

[0082] Specifically, the Inter-Integrated Circuit (IIC) bus is a serial communication bus that uses a multi-master-slave architecture to achieve functions such as decision-making and synchronization of high-speed and low-speed devices required by multi-master systems.

[0083] Figure 2 This is a communication diagram of the solid-state drive provided by the present invention. For example... Figure 2 As shown, in this embodiment of the invention, the microcontroller 102 in the solid-state drive 101 is determined as the master device, and the temperature sensor 106 is determined as the slave device. The microcontroller 102 and each temperature sensor 106 are connected through the first integrated circuit bus 107.

[0084] It should be noted that there are multiple temperature-sensitive locations in this embodiment of the invention. A temperature sensor 106 can be installed at any temperature-sensitive location.

[0085] It should be noted that, typically, when installing the SSD 101 board, the motherboard and secondary board need to be folded together. The surface of the flash memory chip 104 closest to the outer casing 105, after being coated with thermal gel 110, is in direct contact with the outer casing 105, thus allowing heat dissipation through the outer casing 105. However, the flash memory chip 104 further away from the outer casing 105 has no direct heat dissipation path. Therefore, compared to the flash memory chip 104 in direct contact with the outer casing 105, the flash memory chip 104 further away from the outer casing 105 has a higher operating temperature. To improve the operational stability of the SSD 101, it is necessary to obtain the operating temperature of the flash memory chip 104 further away from the outer casing 105 in a timely and accurate manner.

[0086] In this embodiment of the invention, the flash memory chip 104 that is furthest from the outer casing 105 in the solid-state drive 101 can be identified as the target flash memory chip 111.

[0087] In this embodiment of the invention, the location of the target flash memory chip 111 in the solid-state drive 101 can be determined as a temperature-sensitive location.

[0088] It should be noted that the solid-state drive 101 usually does not include mechanical cooling devices such as a cooling fan. It needs to be cooled by the cooling fan in the system in which the solid-state drive 101 is located. Therefore, the casing 105 of the solid-state drive 101 is usually provided with ventilation holes 109, which allows the air blown by the cooling fan in the system in which the solid-state drive 101 is located to pass through the inside of the solid-state drive 101 and carry away the heat inside the solid-state drive 101, thereby achieving heat dissipation of the solid-state drive 101.

[0089] In this embodiment of the invention, the location of the heat dissipation hole 109 on the outer shell 105 can be defined as a temperature-sensitive location.

[0090] It should be noted that, under normal circumstances, the component that generates the most heat during the operation of the solid-state drive 101 is the flash controller 103.

[0091] In this embodiment of the invention, the location of the flash memory controller 103 in the solid-state drive 101 can be determined as a temperature-sensitive location.

[0092] In any embodiment of the present invention, the temperature sensor 106 can be set at a location that is no more than a preset distance from the temperature-sensitive location and that meets the conditions for setting the temperature sensor 106.

[0093] The aforementioned preset distance can be determined based on prior knowledge and / or actual conditions; the conditions for setting the temperature sensor 106 may include the absence of other components and the ability to fix the temperature sensor 106.

[0094] Accordingly, in this embodiment of the invention, the temperature sensor 106 used to acquire temperature data of the target flash memory chip 111 can be referred to as the first temperature sensor 106; the temperature sensor 106 used to acquire temperature data at the heat dissipation hole 109 on the housing 105 can be referred to as the second temperature sensor 106; and the temperature sensor 106 used to acquire junction temperature data of the flash memory controller 103 can be referred to as the third temperature sensor 106.

[0095] Optionally, the first temperature sensor 106 can be a TMP112 temperature sensor 106, and the slave address of the first temperature sensor 106 can be set to 0X49.

[0096] Optionally, the second temperature sensor 106 can be a TMP112 temperature sensor 106, and the slave address of the second temperature sensor 106 can be set to 0X48.

[0097] Optionally, the third temperature sensor 106 can be a TMP421 temperature sensor 106, and the slave address of the third temperature sensor 106 can be set to 0X1C.

[0098] Any temperature sensor 106 can collect the temperature at its temperature-sensitive location.

[0099] In this embodiment of the invention, the microcontroller 102 can actively read the temperature of some or all of the temperature sensors 106 through the first integrated circuit bus 107 and forward the temperature to the target electronic device 201.

[0100] After receiving the temperature, the target electronic device 201 can determine whether the operating temperature of the solid-state drive 101 is within the preset temperature range and whether the solid-state drive 101 has any risk of failure. After receiving the temperature, the target electronic device 201 can also send the temperature to the display interface for display.

[0101] The solid-state drive in this embodiment of the invention can achieve self-monitoring of operating temperature without affecting normal operation. The accuracy, flexibility and efficiency of self-monitoring of operating temperature are higher, which can improve the operating stability of the solid-state drive and improve the user experience.

[0102] As an optional embodiment, the temperature sensor 106 is also used to send the temperature data collected by the temperature sensor 106 to the microcontroller 102 via the first integrated circuit bus 107 upon receiving a first query request.

[0103] The first query request is used to request temperature data collected by temperature sensor 106.

[0104] Specifically, in any of the temperature sensors 106 in this embodiment of the invention, upon receiving a first query request, the temperature data at the temperature-sensitive location is sent to the microcontroller 102 via the first integrated circuit bus 107.

[0105] Accordingly, after receiving the temperature data sent by the temperature sensor 106, the microcontroller 102 in this embodiment forwards the temperature data to the target electronic device 201.

[0106] Optionally, the first query request can be triggered under various circumstances. For example, the first query can be sent by the target electronic device 201 to the temperature sensor 106; or, the first query can be sent by the microcontroller 102 to the temperature sensor 106 at regular intervals.

[0107] In this embodiment of the invention, the temperature sensor, upon receiving a first query request, sends temperature data at its temperature-sensitive location to the microcontroller, which then sends the temperature data to the target electronic device. This better meets the user's query needs, further improves the flexibility of solid-state drive temperature self-monitoring, and enhances user experience.

[0108] As an optional embodiment, the first query request is sent by the target electronic device 201 to the temperature sensor 106 via the microcontroller 102 and the first integrated circuit bus 107 upon receiving the first input.

[0109] Specifically, when a user needs to check the operating temperature of the solid-state drive 101, they can enter the first input in the target electronic device 201.

[0110] After receiving the first input, the target electronic device 201 can read the working status information of the microcontroller 102 and the flash memory controller 103 in the solid-state drive 101.

[0111] When the target electronic device 201 reads the target operating status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal working condition, the target electronic device 201 can also read the slave address of the temperature sensor 106 through the first integrated circuit bus 107.

[0112] When the target electronic device 201 reads the slave address of the temperature sensor 106, it indicates that the target electronic device 201 has successfully communicated with the temperature sensor 106. The target electronic device 201 can send a first query request to the temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107.

[0113] As an optional embodiment, in this embodiment of the invention, the user can choose to obtain temperature data from some or all temperature-sensitive locations based on actual needs.

[0114] After determining the target location among various temperature-sensitive locations based on actual needs, the user can input a first input carrying the identification information of the target location into the target electronic device 201. The number of target locations can be one or more.

[0115] After receiving the first input, the target electronic device 201 can read the working status information of the microcontroller 102 and the flash memory controller 103 in the solid-state drive 101.

[0116] When the target electronic device 201 reads the target working status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal working state, the target electronic device 201 can also determine the target temperature sensor 106 set at the target location among the temperature sensors 106 based on the target location identifier carried in the first input, and then read the slave address of the target temperature sensor 106 through the first integrated circuit bus 107.

[0117] When the target electronic device 201 reads the slave address of the target temperature sensor 106, it indicates that the target electronic device 201 and the target temperature sensor 106 have successfully communicated. The target electronic device 201 can send a first query request to the target temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107.

[0118] For example, if the target temperature sensor 106 includes the first temperature sensor 106, and the target electronic device 201 reads 0X49 through the first integrated circuit bus 107, it means that the target electronic device 201 has successfully communicated with the first temperature sensor 106. The target electronic device 201 can send a first query request to the first temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107.

[0119] When the target temperature sensor 106 includes the second temperature sensor 106, if the target electronic device 201 reads 0X48 through the first integrated circuit bus 107, it indicates that the target electronic device 201 has successfully communicated with the second temperature sensor 106. The target electronic device 201 can send a first query request to the second temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107.

[0120] If the target temperature sensor 106 includes a third temperature sensor 106, and the target electronic device 201 reads 0X1C through the first integrated circuit bus 107, it indicates that the target electronic device 201 has successfully communicated with the third temperature sensor 106. The target electronic device 201 can send a first query request to the third temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107.

[0121] Upon receiving the first query request, the target temperature sensor 106 can acquire the temperature data at the target location and send the temperature data to the microcontroller 102 via the first integrated circuit bus 107.

[0122] After receiving the temperature data, the microcontroller 102 can forward the temperature data to the target electronic device 201.

[0123] The first query request in this embodiment of the invention is triggered based on the user's first input, which can better and more flexibly meet the user's query needs.

[0124] Based on the above embodiments, the solid-state drive 101 further includes: a power management chip 202;

[0125] The backup power management chip 202 is connected to the microcontroller 102 via the first integrated circuit bus 107;

[0126] The microcontroller 102 is also used to read stored data in the backup power management chip 202 via the first integrated circuit bus 107 and forward the stored data to the target electronic device 201.

[0127] Specifically, in order to reduce the adverse effects of sudden events such as temporary power outages on the operation of the solid-state drive 101 and ensure the high availability of the solid-state drive 101, the solid-state drive 101 in this embodiment of the invention also includes a backup power management chip 202.

[0128] like Figure 2 As shown, the backup power management chip 202 can be connected to the microcontroller 102 via the first integrated circuit bus 107.

[0129] Figure 3 This is a circuit diagram of the power backup management chip in a solid-state drive provided by the present invention. Figure 3As shown, to ensure compatibility with backup power management chips 202 from more manufacturers, the slave address of the backup power management chip 202 in this embodiment can be set to 0X59, 0X5A, and 0X5B. Specifically, a high level corresponds to slave address 0X59, a low level corresponds to slave address 0X5A, and a floating state corresponds to slave address 0X5B. This is achieved by adjusting the ADR OR gate resistor in the backup power management chip 202. Specifically, when R1 is active and R2 is not active, the slave address of the backup power management chip 202 is 0X59; when R1 is not active and R2 is active, the slave address is 0X5A; and when neither R1 nor R2 is active, the slave address is 0X5B.

[0130] Optionally, the backup power management chip 202 can be a 72001 type backup power management chip.

[0131] In this embodiment of the invention, the microcontroller 102 can actively read the stored data in the backup power management chip 202 through the first integrated circuit bus 107 and forward the stored data to the target electronic device 201.

[0132] After receiving the stored data, the target electronic device 201 can send the stored data to the display interface for display.

[0133] The solid-state drive in this embodiment of the invention includes a backup power management chip, which can reduce the adverse effects of sudden events such as temporary power outages on the operation of the solid-state drive and ensure its high availability.

[0134] As an optional embodiment, the backup power management chip 202 is also used to send the stored data to the microcontroller 102 via the first integrated circuit bus 107 when a second query request is received, so that the microcontroller 102 can forward the stored data to the target electronic device 201;

[0135] The second query request is used to request stored data in the backup power management chip 202.

[0136] Specifically, in this embodiment of the invention, when the backup power management chip 202 receives a second query request, it sends the stored data in the backup power management chip 202 to the microcontroller 102 through the first integrated circuit bus 107.

[0137] Accordingly, after receiving the stored data sent by the backup power management chip 202, the microcontroller 102 in this embodiment of the invention forwards the stored data to the target electronic device 201.

[0138] Optionally, the second query request can be triggered under various circumstances. For example, the second query can be sent by the target electronic device 201 to the backup power management chip 202; or, the second query can be sent by the microcontroller 102 to the backup power management chip 202 at regular intervals.

[0139] The backup power management chip in this embodiment of the invention sends stored data to the microcontroller upon receiving a second query request, so that the microcontroller can send the stored data to the target electronic device. This can better meet the user's query needs, further improve the flexibility of obtaining the stored data in the backup power management chip, and enhance the user's experience.

[0140] As an optional embodiment, the second query request is sent by the target electronic device 201 to the backup power management chip 202 via the microcontroller 102 and the first integrated circuit bus 107 upon receiving the second input.

[0141] Specifically, when a user needs to access the stored data in the backup power management chip 202, they can input a second input into the target electronic device 201.

[0142] After receiving the second input, the target electronic device 201 can read the working status information of the microcontroller 102 and flash memory controller 103 in the solid-state drive 101 through the first integrated circuit bus 107.

[0143] When the target electronic device 201 reads the target operating status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal working condition, the target electronic device 201 can also read the slave address of the backup power management chip 202 through the first integrated circuit bus 107.

[0144] If the target electronic device 201 reads any one of 0X59, 0X5A and 0X5B through the first integrated circuit bus 107, it indicates that the target electronic device 201 has successfully communicated with the backup power management chip 202. The target electronic device 201 can send a second query request to the backup power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107.

[0145] Upon receiving a second query request, the backup power management chip 202 can send the stored data stored in the backup power management chip 202 to the microcontroller 102 via the first integrated circuit bus 107.

[0146] After receiving the stored data, the microcontroller 102 can forward the stored data to the target electronic device 201.

[0147] The second query request in this embodiment of the invention is triggered based on the user's second input, which can better and more flexibly meet the user's query needs.

[0148] Based on the above embodiments, the solid-state drive 101 further includes: a power consumption monitoring chip 203;

[0149] The power consumption monitoring chip 203 is set in a preset position and is connected to the microcontroller 102 through the first integrated circuit bus 107.

[0150] The power consumption monitoring chip 203 is used to obtain the power consumption data of the solid-state drive 101;

[0151] The microcontroller 102 is also used to read power consumption data through the first integrated circuit bus 107 and forward the power consumption data to the target electronic device 201;

[0152] The preset position is determined based on the position of the voltage output pin of the backup power management chip 202.

[0153] Specifically, in order to achieve self-monitoring of the power consumption of the solid-state drive 101, the solid-state drive 101 in this embodiment of the invention also includes a power consumption monitoring chip 203.

[0154] Optionally, the preset position can be determined based on the position of the P12V output pin of the backup power management chip 202.

[0155] In this embodiment of the invention, a preset position can be defined as a position that is no more than a preset distance from the P12V output pin of the backup power management chip 202 and that meets the conditions for setting up the power consumption monitoring chip 203. The preset distance can be determined based on prior knowledge and / or actual conditions; meeting the conditions for setting up the backup power management chip 202 may include the absence of other components and the ability to fix the backup power management chip 202 in place.

[0156] like Figure 2 As shown, the power consumption monitoring chip 203 can be connected to the microcontroller 102 via the first integrated circuit bus 107.

[0157] Optionally, the power monitoring chip 203 can be a TPA626 power monitoring chip 203. The slave address of the power monitoring chip 203 can be set to 0x20.

[0158] In this embodiment of the invention, the microcontroller 102 can actively read the power consumption data obtained by the power consumption monitoring chip 203 through the first integrated circuit bus 107 and forward the power consumption data to the target electronic device 201.

[0159] After receiving the power consumption data, the target electronic device 201 can determine whether the solid-state drive 101 has power consumption abnormalities and whether the solid-state drive 101 has a risk of failure based on the power consumption data; after receiving the power consumption data, the target electronic device 201 can also send the power consumption data to the display interface for display.

[0160] The solid-state drive in this embodiment of the invention also includes a power consumption monitoring chip, which can realize self-monitoring of power consumption without affecting normal operation. The accuracy, flexibility and efficiency of power consumption self-monitoring are higher, which can improve the operating stability of the solid-state drive and improve the user experience.

[0161] As an optional embodiment, the power consumption monitoring chip 203 is also used to send power consumption data to the microcontroller 102 via the first integrated circuit bus 107 upon receiving a third query request;

[0162] The third query request is used to request power consumption data obtained by the power consumption monitoring chip 203.

[0163] Specifically, in this embodiment of the invention, when the power consumption monitoring chip 203 receives a third query request, it sends the power consumption data of the solid-state drive 101 obtained to the microcontroller 102 through the first integrated circuit bus 107.

[0164] Accordingly, after receiving the power consumption data sent by the power consumption monitoring chip 203, the microcontroller 102 in this embodiment forwards the power consumption data to the target electronic device 201.

[0165] Optionally, the aforementioned third query request may be triggered under various circumstances. For example, the aforementioned third query may be sent by the target electronic device 201 to the temperature sensor 106; or, the aforementioned third query may also be sent by the microcontroller 102 to the temperature sensor 106 at regular intervals.

[0166] The power consumption monitoring chip in this embodiment of the invention, upon receiving a third query request, sends the acquired power consumption data of the solid-state drive to the microcontroller so that the microcontroller can send the power consumption data to the target electronic device. This can better meet the user's query needs, further improve the self-monitoring flexibility of solid-state drive power consumption, and enhance the user's perception.

[0167] As an optional embodiment, the third query request is sent by the target electronic device 201 to the power consumption monitoring chip 203 via the microcontroller 102 and the first integrated circuit bus 107 upon receiving the third input.

[0168] Specifically, when a user needs to obtain the power consumption of the solid-state drive 101, they can input a third input into the target electronic device 201.

[0169] After receiving the third input, the target electronic device 201 can read the working status information of the microcontroller 102 and the flash memory controller 103 in the solid-state drive 101 through the first integrated circuit bus 107.

[0170] When the target electronic device 201 reads the target operating status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal working condition, the target electronic device 201 can also read the slave address of the power consumption monitoring chip 203 through the first integrated circuit bus 107.

[0171] If the target electronic device 201 reads 0x20 through the first integrated circuit bus 107, it means that the target electronic device 201 has successfully communicated with the power consumption monitoring chip 203. The target electronic device 201 can send a third query request to the backup power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107.

[0172] Upon receiving a third query request, the power consumption monitoring chip 203 can send the power consumption data of the solid-state drive 101 to the microcontroller 102 via the first integrated circuit bus 107.

[0173] After receiving the power consumption data, the microcontroller 102 can forward the power consumption data to the target electronic device 201.

[0174] It should be noted that the user's first, second, or third input described above can be manifested as touch output to the target electronic device 201, which may include, but is not limited to, click input, swipe input, and press input. The user's first, second, or third input can also be manifested as physical button input corresponding to the target electronic device 201. Furthermore, the user's first, second, or third input can also be manifested as voice input.

[0175] It is understood that the inputs listed above are merely exemplary, meaning that the embodiments of this application include, but are not limited to, the inputs listed above. In actual implementation, the user's first input may also include any other possible inputs, which can be specifically determined according to actual usage needs, and the embodiments of this application do not impose any limitations.

[0176] The third query request in this embodiment of the invention is triggered based on the user's third input, which can better and more flexibly meet the user's query needs.

[0177] Based on the above embodiments, the solid-state drive 101 further includes: a universal asynchronous transceiver serial port 205;

[0178] The flash memory controller 103 and the microcontroller 102 are connected via a second integrated circuit bus 208; the universal asynchronous transceiver serial port 205 is located on the second integrated circuit bus.

[0179] The Universal Asynchronous Receiver / Transmitter serial port 205 is used to output the first abnormal information indicating that the flash controller 103 is in an abnormal working state when the flash controller 103 is in an abnormal working state.

[0180] The Universal Asynchronous Receiver / Transmitter serial port 205 is also used to output a second abnormal information indicating that the microcontroller 102 is in an abnormal working state when the microcontroller 102 is in an abnormal working state.

[0181] The Universal Asynchronous Receiver / Transmitter serial port 205 is also used to output a third exception message indicating that communication between the target electronic device 201 and the temperature sensor 106 has failed in the event of a communication failure between the target electronic device 201 and the temperature sensor 106.

[0182] It should be noted that a Universal Asynchronous Receiver / Transmitter (UART) is a general-purpose asynchronous receiver / transmitter that can transmit data via serial communication.

[0183] Optionally, the Universal Asynchronous Receiver / Transmitter serial port 205 is also used to output a fourth exception message indicating that communication between the target electronic device 201 and the backup power management chip 202 has failed in the event of a communication failure between the target electronic device 201 and the backup power management chip 202.

[0184] Optionally, the Universal Asynchronous Receiver / Transmitter serial port 205 is also used to output a fifth exception message indicating that communication between the target electronic device 201 and the power consumption monitoring chip 203 has failed in the event of communication failure between the target electronic device 201 and the power consumption monitoring chip 203.

[0185] The solid-state drive in this embodiment of the invention can use a universal asynchronous receiver-transmitter serial port to output abnormal information more efficiently and conveniently, so that users can locate and repair the solid-state drive more efficiently and improve user experience.

[0186] Based on the above embodiments, the solid-state drive 101 further includes: a connection component 206 and a system management bus 207;

[0187] The connection components and system management bus are used to connect the target electronic device 201 and the flash memory controller 103;

[0188] The connection components and system management bus are also used to connect the target electronic device 201 and the microcontroller 102.

[0189] It should be noted that the System Management Bus (SMBus) is a two-wire interface that allows devices connected to the system management bus to communicate with each other.

[0190] In this embodiment of the invention, the flash memory controller 103 is connected to the connection component 206 via the system management bus 207, and the connection component 206 is connected to the target electronic device 201 via the system management bus 207.

[0191] Optionally, in this embodiment of the invention, the flash memory controller 103 can communicate with the connection component 206 via the PCIe protocol, and the connection component 206 can communicate with the target electronic device 201 via the PCIe protocol.

[0192] Optionally, the connection component 206 in this embodiment of the invention can be a U.2 connector.

[0193] Based on the above embodiments, the monitoring system includes: a solid-state drive 101 as described above and a target electronic device 201; the target electronic device 201 is connected to the microcontroller 102 and the flash memory controller 103 in the solid-state drive 101 respectively;

[0194] The target electronic device 201 is configured to, upon receiving a first input, read the operating status information of the microcontroller 102 and the flash memory controller 103 via the first integrated circuit bus 107; upon reading the target operating status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal operating status, read the slave address of the temperature sensor 106 via the microcontroller 102 and the first integrated circuit bus 107; and upon reading the slave address of the temperature sensor 106, send a first query request to the temperature sensor 106 via the microcontroller 102 and the first integrated circuit bus 107.

[0195] The target electronic device 201 is also used to receive temperature data returned by the temperature sensor 106 via the first integrated circuit bus 107 and the microcontroller 102.

[0196] As an optional embodiment, the target electronic device 201 is further configured to, upon receiving a second input, read the operating status information of the microcontroller 102 and the flash memory controller 103 via the first integrated circuit bus 107; upon reading the target operating status information, read the slave address of the backup power management chip 202 via the microcontroller 102 and the first integrated circuit bus 107; and upon reading the slave address of the backup power management chip 202, send a second query request to the backup power management chip 202 via the microcontroller 102 and the first integrated circuit bus 107.

[0197] The target electronic device 201 is also used to receive stored data returned by the backup power management chip 202 via the first integrated circuit bus 107 and the microcontroller 102.

[0198] As an optional embodiment, the target electronic device 201 is further configured to, upon receiving a third input, read the operating status information of the microcontroller 102 and the flash memory controller 103 via the first integrated circuit bus 107; upon reading the target operating status information, read the slave address of the power consumption monitoring chip 203 via the microcontroller 102 and the first integrated circuit bus 107; and upon reading the slave address of the power consumption monitoring chip 203, send a third query request to the power consumption monitoring chip 203 via the microcontroller 102 and the first integrated circuit bus 107.

[0199] The target electronic device 201 is also used to receive power consumption returned by the power consumption monitoring chip 203 via the first integrated circuit bus 107 and the microcontroller 102.

[0200] It should be noted that the monitoring system in this embodiment of the invention includes a solid-state drive 101 and a target electronic device 201. The specific process of the interaction between the solid-state drive 101 and the target electronic device 201 and the self-monitoring of the operating temperature of the solid-state drive 101 can be found in the above embodiments, and will not be repeated in this embodiment of the invention.

[0201] The monitoring system in this embodiment of the invention includes a solid-state drive (SSD) and a target electronic device. It can achieve self-monitoring of the SSD's operating temperature without affecting the normal operation of the SSD. The accuracy, flexibility and efficiency of the self-monitoring of operating temperature are higher, which can improve the operating stability of the SSD and improve the user experience.

[0202] Figure 4 This is one of the flowcharts illustrating the monitoring method provided by this invention. The following is in conjunction with... Figure 4 The monitoring method provided by this invention is described, and is implemented based on the monitoring system described above. For example... Figure 4As shown, the method includes: step 401, upon receiving the first input, reading the working status information of the microcontroller 102 and the flash memory controller 103 in the solid-state drive 101 through the first integrated circuit bus 107;

[0203] Step 402: When the target working status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal working state is read, the slave address of the temperature sensor 106 is read through the microcontroller 102 and the first integrated circuit bus 107.

[0204] Step 403: After reading the slave address of the temperature sensor 106, send a first query request to the temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107.

[0205] Step 404: Receive temperature data returned by temperature sensor 106 via the first integrated circuit bus 107 and microcontroller 102.

[0206] It should be noted that the execution subject of this embodiment of the invention can be the target electronic device 201.

[0207] It should be noted that the monitoring method provided by the present invention is based on the monitoring system described above. The specific execution steps can be found in the contents of the above embodiments, and will not be repeated in the embodiments of the present invention.

[0208] Upon receiving the first input, this embodiment of the invention determines that the microcontroller and flash memory controller in the solid-state drive are in normal working condition and that communication with the temperature sensor is normal. Then, it sends a first query request to the temperature sensor via the microcontroller and the first integrated circuit, and receives temperature data returned by the temperature sensor via the first integrated circuit bus and the microcontroller. This allows for more accurate, flexible, and efficient monitoring of the solid-state drive's operating temperature without affecting the normal operation of the solid-state drive and the system it resides in. This improves the operational stability of the solid-state drive and enhances user experience.

[0209] Based on the above embodiments, the method further includes: upon receiving a second input, reading the operating status information of the microcontroller 102 and the flash memory controller 103 via the first integrated circuit bus 107;

[0210] Upon receiving the target operating status information, the slave address of the backup power management chip 202 is read through the microcontroller 102 and the first integrated circuit bus 107.

[0211] Upon reading the slave address of the backup power management chip 202, a second query request is sent to the backup power management chip 202 via the microcontroller 102 and the first integrated circuit bus 107;

[0212] The system receives stored data returned by the backup power management chip 202 via the first integrated circuit bus 107 and the microcontroller 102.

[0213] In this embodiment of the invention, upon receiving the second input, after determining that the microcontroller and flash memory controller in the solid-state drive are in normal working condition and that communication with the backup power management chip is normal, a second query request is sent to the backup power management chip through the microcontroller and the first integrated circuit, and the storage data returned by the backup power management chip is received through the first integrated circuit bus and the microcontroller. This can reduce the adverse effects of sudden events such as temporary power outages on the operation of the solid-state drive and ensure the high availability of the solid-state drive.

[0214] Based on the above embodiments, the method further includes: upon receiving a third input, reading the operating status information of the microcontroller 102 and the flash memory controller 103 through the first integrated circuit bus 107;

[0215] Upon receiving the target operating status information, the slave address of the power consumption monitoring chip 203 is read through the microcontroller 102 and the first integrated circuit bus 107.

[0216] Upon reading the slave address of the power consumption monitoring chip 203, a third query request is sent to the power consumption monitoring chip 203 via the microcontroller 102 and the first integrated circuit bus 107.

[0217] The power consumption is received from the power consumption monitoring chip 203 via the first integrated circuit bus 107 and the microcontroller 102.

[0218] In this embodiment of the invention, upon receiving a third input, after determining that the microcontroller and flash memory controller in the solid-state drive are in normal working condition and that communication with the power monitoring chip is normal, a third query request is sent to the power monitoring chip through the microcontroller and the first integrated circuit, and the storage data returned by the power monitoring chip is received through the first integrated circuit bus and the microcontroller. This enables more accurate and efficient acquisition of the power consumption of the solid-state drive, improves the operational stability of the solid-state drive, and enhances the user experience.

[0219] To facilitate understanding of the monitoring method provided by this invention, an example is given below to illustrate the monitoring method provided by this invention. Figure 5 This is the second flowchart of the monitoring method provided by the present invention.

[0220] like Figure 5As shown, after receiving the first input, the target electronic device 201 can send a request message to the microcontroller 102 and flash memory controller 103 in the solid-state drive 101 to read the working status information of the microcontroller 102 and flash memory controller 103 in the solid-state drive 101.

[0221] Upon receiving the aforementioned request message, the microcontroller 102 and flash memory controller 103 in the solid-state drive 101 can return working status information indicating the working status of the microcontroller 102 and flash memory controller 103 to the target electronic device 201.

[0222] If the target electronic device 201 receives working status information indicating that the microcontroller 102 and the flash memory controller 103 are in an abnormal working state, the universal asynchronous transceiver serial port 205 can output abnormal information indicating that the microcontroller 102 and / or the flash memory controller 103 are in an abnormal working state.

[0223] If the target electronic device 201 receives target operating status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal working condition, it can determine the target temperature sensor 106 set at the target location among the temperature sensors 106 based on the target location identifier carried in the first input, and then read the slave address of the target temperature sensor 106 through the first integrated circuit bus 107.

[0224] When the target temperature sensor 106 is located within the first temperature sensor 106, if the target electronic device 201 reads 0X49 through the first integrated circuit bus 107, it indicates that the target electronic device 201 has successfully communicated with the first temperature sensor 106. The target electronic device 201 can send a first query request to the first temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107. If the target electronic device 201 does not read 0X49 through the first integrated circuit bus 107, it indicates that the target electronic device 201 has failed to communicate with the first temperature sensor 106. An error message indicating the failure to communicate with the first temperature sensor 106 can be output through the universal asynchronous transceiver serial port 205.

[0225] When the target temperature sensor 106 includes a second temperature sensor 106, if the target electronic device 201 reads 0x48 through the first integrated circuit bus 107, it indicates that the target electronic device 201 has successfully communicated with the second temperature sensor 106. The target electronic device 201 can send a first query request to the second temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107. If the target electronic device 201 does not read 0x48 through the first integrated circuit bus 107, it indicates that the target electronic device 201 has failed to communicate with the second temperature sensor 106. An abnormal message indicating the failure to communicate with the second temperature sensor 106 can be output through the universal asynchronous transceiver serial port 205.

[0226] When the target temperature sensor 106 includes a third temperature sensor 106, if the target electronic device 201 reads 0X1C through the first integrated circuit bus 107, it indicates that the target electronic device 201 has successfully communicated with the third temperature sensor 106. The target electronic device 201 can send a first query request to the third temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107. If the target electronic device 201 does not read 0X1C through the first integrated circuit bus 107, it indicates that the target electronic device 201 has failed to communicate with the third temperature sensor 106. An abnormal message indicating the failure to communicate with the third temperature sensor 106 can be output through the universal asynchronous transceiver serial port 205.

[0227] Upon receiving the first query request, the target temperature sensor 106 can acquire the temperature data at the target location and send the temperature data to the microcontroller 102 via the first integrated circuit bus 107.

[0228] After receiving the temperature data, the microcontroller 102 can forward the temperature data to the target electronic device 201.

[0229] After receiving the second input, the target electronic device 201 can read the working status information of the microcontroller 102 and flash memory controller 103 in the solid-state drive 101 through the first integrated circuit bus 107.

[0230] When the target electronic device 201 reads the target operating status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal working condition, the target electronic device 201 can also read the slave address of the backup power management chip 202 through the first integrated circuit bus 107.

[0231] If the target electronic device 201 reads any one of 0X59, 0X5A, and 0X5B through the first integrated circuit bus 107, it indicates that the target electronic device 201 has successfully communicated with the backup power management chip 202. The target electronic device 201 can send a second query request to the backup power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107. If the target electronic device 201 does not read any one of 0X59, 0X5A, and 0X5B through the first integrated circuit bus 107, it indicates that the target electronic device 201 has failed to communicate with the backup power management chip 202. The universal asynchronous transceiver serial port 205 can output an exception message indicating that the communication with the backup power management chip 202 has failed.

[0232] Upon receiving a second query request, the backup power management chip 202 can send the stored data in the backup power management chip 202 to the microcontroller 102 via the first integrated circuit bus 107.

[0233] After receiving the stored data, the microcontroller 102 can forward the stored data to the target electronic device 201.

[0234] After receiving the third input, the target electronic device 201 can read the working status information of the microcontroller 102 and flash memory controller 103 in the solid-state drive 101 through the first integrated circuit bus 107.

[0235] When the target electronic device 201 reads the target operating status information indicating that the microcontroller 102 and the flash memory controller 103 are in normal working condition, the target electronic device 201 can also read the slave address of the power consumption monitoring chip 203 through the first integrated circuit bus 107.

[0236] If the target electronic device 201 reads 0x20 through the first integrated circuit bus 107, it indicates that the target electronic device 201 has successfully communicated with the power consumption monitoring chip 203. The target electronic device 201 can send a third query request to the backup power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107. If the target electronic device 201 does not read 0x20 through the first integrated circuit bus 107, it indicates that the target electronic device 201 has failed to communicate with the power consumption monitoring chip 203. The universal asynchronous transceiver serial port 205 can output an abnormal message indicating that the communication with the power consumption monitoring chip 203 has failed.

[0237] Upon receiving a third query request, the power consumption monitoring chip 203 can send the power consumption data of the solid-state drive 101 to the microcontroller 102 via the first integrated circuit bus 107.

[0238] After receiving the power consumption data, the microcontroller 102 can forward the power consumption data to the target electronic device 201.

[0239] According to the above embodiments, a server includes any of the solid-state drives 101 described above.

[0240] Specifically, the server in this embodiment of the invention includes a solid-state drive 101, which can achieve self-detection of operating temperature without affecting the normal operation of the server.

[0241] It should be noted that the specific process of the solid-state drive 101's self-monitoring of operating temperature can be found in the above embodiments, and will not be repeated in this embodiment.

[0242] The server in this embodiment of the invention includes a solid-state drive (SSD). The SSD can achieve self-monitoring of operating temperature without affecting the normal operation of the server. The accuracy, flexibility and efficiency of self-monitoring of operating temperature are higher, which can improve the operational stability of the server and improve the user experience.

[0243] Figure 6 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 6 As shown, the electronic device may include a processor 610, a communications interface 620, a memory 630, and a communication bus 640, wherein the processor 610, communications interface 620, and memory 630 communicate with each other via the communication bus 640. The processor 610 can invoke logical instructions in the memory 630 to execute a monitoring method, which includes: upon receiving a first input, reading the operating status information of the microcontroller and flash memory controller in the solid-state drive via a first integrated circuit bus; upon reading target operating status information indicating that the microcontroller and flash memory controller are in normal operating condition, reading the slave address of the temperature sensor via the microcontroller and the first integrated circuit bus; upon reading the slave address of the temperature sensor, sending a first query request to the temperature sensor via the microcontroller and the first integrated circuit bus; and receiving temperature data returned by the temperature sensor via the first integrated circuit bus and the microcontroller.

[0244] Furthermore, the logical instructions in the aforementioned memory 630 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0245] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can perform the monitoring methods provided by the above methods. The method includes: upon receiving a first input, reading the operating status information of the microcontroller and flash memory controller in the solid-state drive via a first integrated circuit bus; upon reading target operating status information indicating that the microcontroller and flash memory controller are in normal operating state, reading the slave address of the temperature sensor via the microcontroller and the first integrated circuit bus; upon reading the slave address of the temperature sensor, sending a first query request to the temperature sensor via the microcontroller and the first integrated circuit bus; and receiving temperature data returned by the temperature sensor via the first integrated circuit bus and the microcontroller.

[0246] In another aspect, the present invention also provides a non-transitory computer-readable storage medium storing a computer program thereon, which, when executed by a processor, is implemented to perform the monitoring methods provided by the above methods. The method includes: upon receiving a first input, reading operating status information of a microcontroller and a flash memory controller in a solid-state drive via a first integrated circuit bus; upon reading target operating status information indicating that the microcontroller and flash memory controller are in normal operating condition, reading the slave address of a temperature sensor via the microcontroller and the first integrated circuit bus; upon reading the slave address of the temperature sensor, sending a first query request to the temperature sensor via the microcontroller and the first integrated circuit bus; and receiving temperature data returned by the temperature sensor via the first integrated circuit bus and the microcontroller.

[0247] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0248] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0249] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A solid-state drive, characterized in that, include: Microcontroller, flash memory controller, multiple flash memory chips, housing, multiple temperature sensors, and first integrated circuit bus; Each of the temperature sensors is connected to the microcontroller via the first integrated circuit bus; The temperature sensor is used to collect temperature data at the temperature-sensitive location. The microcontroller is used to read temperature data from the temperature sensor via the first integrated circuit bus and forward the temperature data to the target electronic device. Each of the temperature-sensitive locations includes the location of the target flash memory chip, the location of the heat dissipation holes on the casing, and the location of the flash memory controller; The target flash memory chip is the flash memory chip that is furthest from the casing among all the flash memory chips; The solid-state drive also includes: a power management chip; The backup power management chip is connected to the microcontroller via the first integrated circuit bus; The microcontroller is also configured to read stored data in the backup power management chip via the first integrated circuit bus and forward the stored data to the target electronic device; The solid-state drive also includes: a power consumption monitoring chip; The power consumption monitoring chip is located in a preset position and is connected to the microcontroller via the first integrated circuit bus; The power consumption monitoring chip is used to acquire the power consumption data of the solid-state drive; The microcontroller is also configured to read the power consumption data via the first integrated circuit bus and forward the power consumption data to the target electronic device; The preset position is determined based on the position of the voltage output pin of the backup power management chip; The solid-state drive also includes: a universal asynchronous receiver / transmitter serial port; The flash memory controller and the microcontroller are connected via a second integrated circuit bus; the universal asynchronous transceiver serial port is located on the second integrated circuit bus. The universal asynchronous transceiver serial port is used to output a first abnormal information indicating that the flash controller is in an abnormal state when the flash controller is in an abnormal state. The general asynchronous transceiver serial port is also used to output a second abnormal information indicating that the microcontroller is in an abnormal working state when the microcontroller is in an abnormal working state. The universal asynchronous transceiver serial port is also used to output a third abnormality message indicating that the communication between the target electronic device and the temperature sensor has failed in the event of a communication failure between the target electronic device and the temperature sensor.

2. The solid-state drive according to claim 1, characterized in that, The temperature sensor is also used to send the temperature data collected by the temperature sensor to the microcontroller via the first integrated circuit bus when a first query request is received. The first query request is used to request temperature data collected by the temperature sensor.

3. The solid-state drive according to claim 2, characterized in that, The first query request is sent by the target electronic device to the temperature sensor via the microcontroller and the first integrated circuit bus after receiving the first input.

4. The solid-state drive according to claim 1, characterized in that, The backup power management chip is also used to send the stored data to the microcontroller via the first integrated circuit bus when a second query request is received, so that the microcontroller can forward the stored data to the target electronic device; The second query request is used to request the stored data in the backup power management chip.

5. The solid-state drive according to claim 4, characterized in that, The second query request is sent by the target electronic device to the backup power management chip through the microcontroller and the first integrated circuit bus after receiving the second input.

6. The solid-state drive according to claim 1, characterized in that, The power consumption monitoring chip is also used to send the power consumption data to the microcontroller via the first integrated circuit bus when a third query request is received; The third query request is used to request power consumption data obtained by the power consumption monitoring chip.

7. The solid-state drive according to claim 6, characterized in that, The third query request is sent by the target electronic device to the power consumption monitoring chip through the microcontroller and the first integrated circuit bus after receiving the third input.

8. The solid-state drive according to any one of claims 1 to 7, characterized in that, Also includes: Connecting components and the system management bus; The connection component and the system management bus are used to connect the target electronic device and the flash memory controller; The connection component and the system management bus are also used to connect the target electronic device and the microcontroller.

9. A monitoring system, characterized in that, include: The solid-state drive and the target electronic device as described in any one of claims 1 to 8; the target electronic device is connected to the microcontroller and the flash memory controller in the solid-state drive, respectively; The target electronic device is configured to, upon receiving a first input, read the operating status information of the microcontroller and the flash memory controller via a first integrated circuit bus; upon reading the target operating status information indicating that the microcontroller and the flash memory controller are in normal operating status, read the slave address of the temperature sensor via the microcontroller and the first integrated circuit bus; and upon reading the slave address of the temperature sensor, send a first query request to the temperature sensor via the microcontroller and the first integrated circuit bus. The target electronic device is also used to receive temperature data returned by the temperature sensor via the first integrated circuit bus and the microcontroller.

10. The monitoring system according to claim 9, characterized in that, The target electronic device is further configured to, upon receiving a second input, read the operating status information of the microcontroller and the flash memory controller via the first integrated circuit bus; upon reading the target operating status information, read the slave address of the backup power management chip via the microcontroller and the first integrated circuit bus; and upon reading the slave address of the backup power management chip, send a second query request to the backup power management chip via the microcontroller and the first integrated circuit bus. The target electronic device is also used to receive stored data returned by the backup power management chip via the first integrated circuit bus and the microcontroller.

11. The monitoring system according to claim 9 or 10, characterized in that, The target electronic device is further configured to, upon receiving a third input, read the operating status information of the microcontroller and the flash memory controller via the first integrated circuit bus; upon reading the target operating status information, read the slave address of the power consumption monitoring chip via the microcontroller and the first integrated circuit bus; and upon reading the slave address of the power consumption monitoring chip, send a third query request to the power consumption monitoring chip via the microcontroller and the first integrated circuit bus. The target electronic device is also used to receive power consumption returned by the power consumption monitoring chip via the first integrated circuit bus and the microcontroller.

12. A monitoring method, implemented based on the monitoring system as described in any one of claims 9 to 11, characterized in that, include: Upon receiving the first input, the operating status information of the microcontroller and flash memory controller in the solid-state drive is read through the first integrated circuit bus; When the target operating status information indicating that the microcontroller and the flash memory controller are in normal working condition is read, the slave address of the temperature sensor is read through the microcontroller and the first integrated circuit bus; Upon reading the slave address of the temperature sensor, the first query request is sent to the temperature sensor via the microcontroller and the first integrated circuit bus; The temperature data returned by the temperature sensor is received via the first integrated circuit bus and the microcontroller.

13. The monitoring method according to claim 12, characterized in that, The method further includes: Upon receiving a second input, the operating status information of the microcontroller and the flash memory controller is read via the first integrated circuit bus; Upon reading the target operating status information, the slave address of the backup power management chip is read through the microcontroller and the first integrated circuit bus; Upon reading the slave address of the backup power management chip, a second query request is sent to the backup power management chip via the microcontroller and the first integrated circuit bus; The system receives stored data returned by the backup power management chip via the first integrated circuit bus and the microcontroller.

14. The monitoring method according to claim 12 or 13, characterized in that, The method further includes: Upon receiving a third input, the operating status information of the microcontroller and the flash memory controller is read via the first integrated circuit bus; Upon reading the target operating status information, the slave address of the power consumption monitoring chip is read through the microcontroller and the first integrated circuit bus; Upon reading the slave address of the power consumption monitoring chip, a third query request is sent to the power consumption monitoring chip via the microcontroller and the first integrated circuit bus; The power consumption returned by the power monitoring chip is received through the first integrated circuit bus and the microcontroller.

15. A server, characterized in that, Including solid-state drives as described in any one of claims 1 to 8.

16. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the monitoring method as described in any one of claims 12 to 14.

17. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the target electronic device, it implements the monitoring method as described in any one of claims 12 to 14.

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