Method for manufacturing an LED display screen

Abstract

This application belongs to the field of display, and particularly relates to a method for manufacturing an LED display screen. The method for manufacturing the LED display screen includes: fabricating a circuit layer and pads on the back surface of a light-transmissive substrate, where the back surface and the front surface of the light-transmissive substrate are two opposite surfaces; mounting LED lamp beads on the back surface of the light-transmissive substrate. The LED lamp beads have opposite light-emitting surfaces and backlight surfaces, and the light-emitting surface of the LED lamp beads faces the back surface of the light-transmissive substrate. The solder legs of the LED lamp beads are led out from the backlight surface of the LED lamp beads and are bonded to the pads; forming a full-surface light-shielding layer on the back surface of the light-transmissive substrate to shield the LED lamp beads and the area around the LED lamp beads. The black light-shielding layer that fully shields the light-transmissive substrate with the LED lamp beads and the area around the LED lamp beads can ensure the black screen effect of the LED display screen. At the same time, fabricating the light-shielding layer on the full surface can also reduce the manufacturing difficulty of the light-shielding layer and the manufacturing cost of the LED display screen.

Description

Technical Field

[0001] This application belongs to the display field, and particularly relates to a method for manufacturing an LED display screen. Background Art

[0002] Currently, when manufacturing an LED (light-emitting diode) display screen, first, LED lamp beads are mounted on the PCB board to form the light-emitting surface of the display module, and electronic components such as driving ICs and resistors are mounted on the back of the PCB board to form the IC surface of the display module. Then, the gaps between the LED lamp beads are shielded with a black light-shielding material, and the light-emitting surface of the display module is potted to play a role in protection and light guiding. The bottom case is installed on the IC surface of the display module to form an LED display screen. The light-emitting surface of the LED lamp bead is opposite to the mounting surface direction, so that the LED lamp bead is affected by the mounting accuracy, resulting in a poor black screen effect. Summary of the Invention

[0003] The purpose of this application is to provide a method for manufacturing an LED display screen to improve the black screen effect of the LED display screen.

[0004] To achieve the above purpose, this application provides a method for manufacturing an LED display screen, including:

[0005] Manufacture a circuit layer and pads on the back of the light-transmitting substrate, where the back and the front of the light-transmitting substrate are two opposite surfaces;

[0006] Mount the LED lamp beads on the back of the light-transmitting substrate. The LED lamp bead has an opposite light-emitting surface and a backlight surface. The light-emitting surface of the LED lamp bead faces the back of the light-transmitting substrate, and the solder feet of the LED lamp bead are led out from the backlight surface of the LED lamp bead and bonded to the pads;

[0007] Form a whole-surface light-shielding layer on the back of the light-transmitting substrate to shield the LED lamp beads and the area around the LED lamp beads.

[0008] Optionally, when mounting the LED lamp beads, a gap is formed between the light-emitting surface of the LED lamp bead and the light-transmitting substrate, and a transparent potting layer is formed between the LED lamp bead and the light-transmitting substrate.

[0009] Optionally, when forming the transparent potting layer, epoxy resin is infiltrated into the gap between the LED lamp bead and the light-transmitting substrate, and the epoxy resin is cured to form the transparent potting layer.

[0010] Optionally, the epoxy resin is vacuum-cured to form the transparent potting layer.

[0011] Optionally, the method for manufacturing the LED display screen further includes:

[0012] Before manufacturing the circuit layer and the pad, at least the front and back surfaces of the light-transmissive substrate are subjected to atomization treatment.

[0013] Optionally, the method for manufacturing the LED display screen further includes:

[0014] After manufacturing the circuit layer and the pad, at least an optical film is formed on the front surface of the light-transmissive substrate.

[0015] Optionally, the optical film includes one or a combination of an anti-reflection film, an anti-glare film, an anti-fouling film, and an anti-moiré film.

[0016] Optionally, the method for manufacturing the LED display screen further includes:

[0017] A bottom case is installed on the back surface of the light-transmissive substrate. The edge area of the bottom case contacts the light-shielding layer in the area around the LED lamp beads. The middle part of the bottom case is recessed away from the light-transmissive substrate to form a receiving cavity, and the bottom of the receiving cavity contacts or forms a gap with the light-shielding layer on the LED lamp beads.

[0018] Optionally, the method for manufacturing the LED display screen further includes:

[0019] After installing the bottom case, a thermally conductive potting adhesive is filled in the receiving cavity.

[0020] Optionally, the method for manufacturing the LED display screen further includes:

[0021] After installing the bottom case, at least a light-shielding protective layer is formed on the side surface of the light-transmissive substrate, and the side surface of the light-transmissive substrate connects the front and back surfaces of the light-transmissive substrate.

[0022] The method for manufacturing the LED display screen disclosed in the present application has the following beneficial effects:

[0023] In the present application, the circuit layer and the pad are manufactured on the back surface of the light-transmissive substrate. The light-emitting surface of the LED lamp beads is mounted on the back surface of the light-transmissive substrate. The welding feet of the LED lamp beads are led out from the backlight surface of the LED lamp beads and are bound to the pads. The black light-shielding layer entirely shields the LED lamp beads and the light-transmissive substrate in the area around the LED lamp beads. The welding feet are led out from the backlight surface of the LED lamp beads, which can avoid the welding feet from blocking the light-emitting surface; the light-emitting surface of the LED lamp beads is mounted on the back surface of the light-transmissive substrate, and with the protection of the hard light-transmissive substrate, the problem of inability to perform direct pen touch operation for a long time can be solved; the black light-shielding layer entirely shields the LED lamp beads and the light-transmissive substrate in the area around the LED lamp beads, which can ensure the black screen effect of the LED display screen. At the same time, manufacturing the light-shielding layer entirely can also reduce the manufacturing difficulty of the light-shielding layer and the manufacturing cost of the LED display screen.

[0024] Other features and advantages of the present application will become apparent from the following detailed description, or will be learned in part from the practice of the present application.

[0025] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. Brief Description of the Drawings

[0026] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0027] Figure 1 It is a flowchart of the method for manufacturing an LED display screen in an embodiment of the present application.

[0028] Figure 2 It is a schematic structural diagram of an LED display screen in an embodiment of the present application.

[0029] Figure 3 It is a schematic structural diagram of an LED lamp bead in an embodiment of the present application.

[0030] Figure 4 It is a schematic diagram of manufacturing a light-transmitting substrate in an embodiment of the present application.

[0031] Figure 5 It is a schematic diagram of mounting an LED lamp bead 200 in an embodiment of the present application.

[0032] Figure 6 It is a schematic diagram of forming a light-shielding layer in an embodiment of the present application.

[0033] Figure 7 It is a schematic diagram of installing a bottom case in an embodiment of the present application.

[0034] Description of the Reference Numerals:

[0035] 110, light-transmitting substrate; 111, atomization layer; 120, circuit layer;

[0036] 200, LED lamp bead; 210, main body part; 211, light-emitting surface; 212, backlight surface; 220, solder leg;

[0037] 300, light-shielding layer; 400, optical film; 500, transparent potting layer;

[0038] 600, bottom case; 601, accommodating cavity; 700, encapsulation layer; 800, light-shielding protection layer. Detailed Description of the Embodiments

[0039] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more complete and comprehensive, and will fully convey the concept of the example embodiments to those skilled in the art.

[0040] In addition, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of this application. However, those skilled in the art will realize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be employed. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of this application.

[0041] The present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted here that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as limiting the present application.

[0042] Figure 1 is a flowchart of the manufacturing method of the LED display screen in the embodiment of the present application, Figure 2 is a schematic structural diagram of the LED display screen in the embodiment of the present application, Figure 3 is a schematic structural diagram of the LED lamp bead in the embodiment of the present application. Refer to Figures 1 to 3 As shown, the manufacturing method of the LED display screen in this embodiment includes:

[0043] S100: Fabricate a circuit layer 120 and pads on the back surface of the light-transmitting substrate 110. The pads are connected to the circuit layer 120. The back surface and the front surface of the light-transmitting substrate 110 are two opposite surfaces thereof;

[0044] S200: Mount the LED lamp beads 200 on the back surface of the light-transmitting substrate 110. The LED lamp beads 200 have opposite light-emitting surfaces 211 and backlight surfaces 212. The light-emitting surface 211 of the LED lamp beads 200 faces the back surface of the light-transmitting substrate 110. The solder legs 220 of the LED lamp beads 200 are led out from the backlight surface 212 of the LED lamp beads 200 and are bonded to the pads;

[0045] S300: Form a whole-surface light-shielding layer 300 on the back surface of the light-transmitting substrate 110 to shield the LED lamp beads 200 and the area around the LED lamp beads 200.

[0046] Specifically, the light-transmitting substrate 110 may include a glass substrate. The LED lamp bead 200 may include a main body portion 210 and a welding leg 220. The main body portion 210 has opposite light-emitting surfaces 211 and backlight surfaces 212. The welding leg 220 extends from the backlight surface 212 of the main body portion 210 to the light-emitting surface 211. The side of the welding leg 220 away from the backlight surface 212 may be flush with or slightly higher than the light-emitting surface 211, so that a fit or a small gap is formed between the light-emitting surface 211 and the back surface of the light-transmitting substrate 110. The welding leg 220 of the LED lamp bead 200 is fixed on the pad through a die bonding process with solder paste, and is electrically connected to the circuit layer 120 through the pad.

[0047] The light-shielding layer 300 shields the LED lamp bead 200 and the area around the LED lamp bead 200. That is to say, the light-shielding layer 300 shields the LED lamp bead 200, the gap between adjacent LED lamp beads 200, and the edge area of the light-transmitting substrate 110. The light-shielding layer 300 can be realized by processes such as inkjet, sputtering, evaporation coating, embossing, printing, coating, and dispensing. The material of the light-shielding layer 300 is a black light-absorbing material, which can be ink, paint, dry film, etc., and preferably black thermally conductive epoxy resin.

[0048] For some LED displays, the light-emitting surface of the LED light source is opposite to the mounting surface direction, so that the LED light source is affected by the mounting accuracy, resulting in a poor black screen effect. The black light-shielding material is arranged between adjacent LED light sources, which is difficult in process and also easily affects the black screen effect.

[0049] In this embodiment, the circuit layer 120 and the pads are made on the back surface of the light-transmitting substrate 110. The light-emitting surface 211 of the LED lamp bead 200 is mounted on the back surface of the light-transmitting substrate 110. The welding leg 220 of the LED lamp bead 200 extends from the backlight surface 212 of the LED lamp bead 200 and is bonded to the pad. The black light-shielding layer 300 entirely shields the LED lamp bead 200 and the light-transmitting substrate 110 in the area around the LED lamp bead 200. The welding leg 220 extends from the backlight surface 212 of the LED lamp bead 200, which can avoid the welding leg 220 blocking the light-emitting surface 211. The light-emitting surface 211 of the LED lamp bead 200 is mounted on the back surface of the light-transmitting substrate 110. With the protection of the hard light-transmitting substrate 110, the problem of inability to perform direct pen touch operation for a long time can be solved. The black light-shielding layer 300 entirely shields the LED lamp bead 200 and the light-transmitting substrate 110 in the area around the LED lamp bead 200, which can ensure the black screen effect of the LED display. At the same time, the light-shielding layer 300 is made entirely, which can also reduce the manufacturing difficulty of the light-shielding layer 300 and reduce the manufacturing cost of the LED display.

[0050] Figure 4 It is a schematic diagram of manufacturing a light-transmitting substrate in an embodiment of the present application. Refer to Figure 4As shown, the method for manufacturing the LED display screen further includes: before manufacturing the circuit layer 120 and the pads, at least the front and back surfaces of the light-transmitting substrate 110 are subjected to atomization treatment to form an atomization layer 111.

[0051] The side surface of the light-transmitting substrate 110 connects the front and back surfaces of the light-transmitting substrate 110. At least the front and back surfaces of the light-transmitting substrate 110 are subjected to atomization treatment. That is to say, the front and back surfaces of the light-transmitting substrate 110 can be subjected to atomization treatment, but not limited to this. The side surface of the light-transmitting substrate 110 can also be subjected to atomization treatment, which can be determined according to specific circumstances.

[0052] Specifically, the glass substrate can select the ultra-thin glass of the melting overflow technology with double original glass surfaces to reduce the subsequent processes such as grinding and polishing. The glass substrate is first sliced. For example, the size of the glass substrate of a 27-inch display screen is 600 mm × 337.5 mm × 0.7 mm, and then atomization treatment is carried out to form the light-transmitting substrate 110. When manufacturing the circuit layer 120 and the pads, the circuit layer 120 and the pads can be manufactured on the surface of the light-transmitting substrate 110, or the circuit layer 120 and the pads can be buried under the surface of the light-transmitting substrate 110, and the top surface of the pads exposes the surface of the light-transmitting substrate 110 to bond the LED lamp beads 200.

[0053] At least subjecting the front and back surfaces of the light-transmitting substrate 110 to atomization treatment can, to a certain extent, soften the color difference on the mounting surface of the LED lamp beads 200, improve the light intensity of the LED lamp beads 200 on the side when refracting inside the light-transmitting substrate 110, and reduce the atomization problem at both end surfaces of the light-transmitting substrate 110 to ensure the display effect. In addition, by subjecting the front and back surfaces of the light-transmitting substrate 110 to atomization treatment, the roughness of the front and back surfaces of the light-transmitting substrate 110 increases, which is beneficial to the combination of the light-shielding layer 300 and the back surface of the light-transmitting substrate 110, and the combination of the optical film 400 and the front surface of the light-transmitting substrate 110.

[0054] See Figure 4 As shown, the method for manufacturing the LED display screen further includes: after manufacturing the circuit layer 120 and the pads, at least form an optical film 400 on the front surface of the light-transmitting substrate 110. When manufacturing the optical film 400, the back surface of the light-transmitting substrate 110 can be entirely masked, and then the optical film 400 is formed.

[0055] Forming the optical film 400 on the front surface of the light-transmitting substrate 110 can further improve the display effect of the LED display screen.

[0056] It should be noted that the optical film 400 can be formed on the front surface of the light-transmitting substrate 110 when manufacturing the light-transmitting substrate 110, but not limited to this. The optical film 400 can also be adhered to the front surface of the light-transmitting substrate 110 after the LED display screen is assembled, which can be determined according to specific circumstances.

[0057] In some embodiments, the optical film 400 may include one or a combination of an anti-reflection (AR) film, an anti-glare film, an anti-smudge coating / anti-fingerprint (AF / AS) film, and an anti-moiré film. The positions of the anti-reflection film, the anti-glare film, and the anti-moiré film can be set as appropriate, and the anti-smudge film can be set on the outermost side.

[0058] The anti-reflection film and the anti-glare film can be directly formed on the light-transmitting substrate 110 or formed on a base film to reduce the manufacturing cost. The base film is adhered to the light-transmitting substrate 110. The base film can be a PET substrate or a TAC substrate. The anti-glare film can be prepared by processes such as etching, spraying, rolling, coating, or phase separation. The phase separation process is preferred. The surface of the anti-glare film obtained by phase separation is delicate and the particles are uniform, which can effectively reduce the color separation caused by refraction of the three primary colors of R / G / B. The anti-reflection film can be attached to the surface of the anti-glare film by processes such as magnetron sputtering, sol-gel method, or chemical vapor deposition. The materials include magnesium fluoride, titanium dioxide, silicon dioxide, aluminum oxide, zirconium dioxide, zinc sulfide, silicon carbide, silicon nitride, etc. The anti-glare film reduces the reflected light through the interference of the reflected light at the upper and lower interfaces.

[0059] For example, the optical film 400 includes an anti-reflection film, an anti-glare film, and an anti-smudge film. After manufacturing the circuit layer 120 and the pads, the back surface of the light-transmitting substrate 110 can be entirely masked. The anti-reflection film and the anti-glare film are sequentially formed on the front surface and the side surface of the light-transmitting substrate 110. The haze is preferably operated at 15% - 30%, and then the anti-smudge film is formed, and the overall glossiness is executed at 40 - 80.

[0060] Forming the anti-reflection film can reduce the reflectivity of the light-transmitting substrate 110 and increase the light transmittance of the light-transmitting substrate 110; forming the anti-glare film can reduce glare and improve the display effect; forming the anti-smudge film can reduce contamination such as fingerprints; forming the anti-moiré film can reduce moiré.

[0061] Figure 5 It is a schematic diagram of mounting the LED lamp beads 200 in the embodiment of the present application. Refer to Figure 5As shown in the figure, the manufacturing method of the LED display screen further includes: when mounting the LED lamp beads 200, a jig is used to carry and position the light-transmitting substrate 110, and then the LED lamp beads 200 are mounted. When mounting the LED lamp beads 200, a gap can be formed between the light-emitting surface 211 of the LED lamp beads 200 and the light-transmitting substrate 110, and a transparent potting layer 500 is formed between the LED lamp beads 200 and the light-transmitting substrate 110. The orthographic projection of the light-emitting surface 211 of the LED lamp beads 200 on the light-transmitting substrate 110 is located within the orthographic projection of the light-transmitting substrate 110 on the light-transmitting substrate 110. That is to say, the transparent potting layer 500 can completely cover the light-emitting surface 211 of the LED lamp beads 200.

[0062] The transparent potting layer 500 can be formed by using polymer materials such as silicone rubber, epoxy resin, epoxy dry film, acrylic glue, and hot-melt adhesive film. The polymer material of the transparent potting layer 500 has a transmittance of not less than 85%, preferably not less than 90%, such as epoxy resin.

[0063] Forming the transparent potting layer 500 between the LED lamp beads 200 and the light-transmitting substrate 110 can ensure that the light emitted by the LED lamp beads 200 does not enter the air, but directly enters the light-transmitting substrate 110, reducing the influence of the large refraction angle problem of the light after it comes out of the LED lamp beads 200.

[0064] See Figure 5 As shown in the figure, the manufacturing method of the LED display screen further includes: when forming the transparent potting layer 500, epoxy resin is infiltrated into the gap between the LED lamp beads 200 and the light-transmitting substrate 110, and the epoxy resin is cured to form the transparent potting layer 500. The epoxy resin can be a two-component epoxy resin with high temperature resistance and aging resistance.

[0065] First, mount the LED lamp beads 200, then infiltrate the epoxy resin into the gap between the LED lamp beads 200 and the light-transmitting substrate 110, and then cure the epoxy resin to form the transparent potting layer 500, which can avoid the epoxy resin affecting the bonding between the LED lamp beads 200 and the pads.

[0066] It should be noted that when using the process of first mounting the LED lamp beads 200 and then infiltrating the epoxy resin into the gap between the LED lamp beads 200 and the light-transmitting substrate 110, LED lamp beads 200 with the solder feet 220 higher than the light-emitting surface 211 on the side away from the backlight surface 212 can be used, so as to form a small gap between the light-emitting surface 211 and the back surface of the light-transmitting substrate 110, so that the epoxy resin can infiltrate into this gap to form the transparent potting layer 500. The epoxy resin can infiltrate into the gap between the LED lamp beads 200 and the light-transmitting substrate 110, but it is not limited to this. A layer of epoxy resin can also be made first, and after the LED lamp beads 200 are mounted, the epoxy resin is cured to form the transparent potting layer 500, which can be determined according to the specific situation.

[0067] In some embodiments, the epoxy resin is vacuum-cured to form a transparent potting layer 500. The vacuum-curing temperature is about 60°C and the curing time is about 60 minutes.

[0068] The epoxy resin is vacuum-cured to form a transparent potting layer 500, which can reduce or eliminate air bubbles in the epoxy resin, form a transparent potting layer 500 with high light transmittance, and improve the display effect of the LED display screen.

[0069] Figure 6 It is a schematic diagram of forming a light-shielding layer in an embodiment of the present application. Refer to Figure 6 As shown, when forming the light-shielding layer 300, the jig from the previous step can be used to form a black thermally conductive epoxy resin layer on the back surface of the light-transmitting substrate 110. The black thermally conductive epoxy resin layer can be formed by processes such as inkjet printing, brushing, or spraying. After forming the black thermally conductive epoxy resin layer, it can be cured at a temperature of 80°C to 90°C for more than 30 minutes to form the light-shielding layer 300.

[0070] The light-shielding layer 300 is formed on the entire back surface of the light-transmitting substrate 110 and can be fabricated using processes such as back spraying. Compared with forming the light-shielding layer 300 between adjacent LED beads 200, the manufacturing cost of the light-shielding layer 300 is significantly reduced, and a good consistency and better black substrate can be achieved. In addition, the light-shielding layer 300 covers all the LED beads 200, connecting all the LED beads 200 together. Moreover, since the light-shielding layer 300 is made of black thermally conductive epoxy resin, it is beneficial to the heat dissipation of the LED beads 200 and can improve the thermal stability of the LED display screen; the light-shielding layer 300 covers the LED beads 200 or the light-transmitting substrate 110, and the LED beads 200 cause the light-shielding layer 300 to be uneven, further increasing the heat dissipation area and enhancing the heat dissipation ability.

[0071] Figure 7 It is a schematic diagram of installing a bottom case in an embodiment of the present application. Refer to Figure 7 As shown, the method for manufacturing an LED display screen further includes: after forming the light-shielding layer 300, the same jig from the previous step can be used to install a bottom case 600 on the back surface of the light-transmitting substrate 110. The edge area of the bottom case 600 contacts the light-shielding layer 300 around the LED beads 200. A receiving cavity 601 is formed by the middle part of the bottom case 600 recessing away from the light-transmitting substrate 110. The bottom of the receiving cavity 601 contacts or forms a gap with the light-shielding layer 300 on the LED beads 200.

[0072] When the bottom of the receiving cavity 601 contacts the light-shielding layer 300, the heat of the LED beads 200 can be directly conducted to the bottom case 600 through the light-shielding layer 300, which is beneficial to the heat dissipation of the LED display screen. When a gap is formed between the bottom of the receiving cavity 601 and the light-shielding layer 300, it can ensure that the edge area of the bottom case 600 contacts the light-shielding layer 300, which is beneficial to the bonding of the bottom case 600 and the light-shielding layer 300.

[0073] See Figure 7 As shown, the manufacturing method of the LED display screen further includes: after installing the bottom case 600, filling the accommodating cavity 601 with a thermally conductive potting adhesive, and curing the thermally conductive potting adhesive to form a packaging layer 700. The thermally conductive potting adhesive can be a black thermally conductive low-curing shrinkage rate low-temperature curing adhesive.

[0074] Filling the accommodating cavity 601 with a thermally conductive potting adhesive, and curing the thermally conductive potting adhesive to form a packaging layer 700. The packaging layer 700 can evacuate the air in the accommodating cavity 601, and the heat of the LED lamp beads 200 can be conducted to the bottom case 600 through the light-shielding layer 300 and the packaging layer 700, which is beneficial to the heat dissipation of the LED display screen. In addition, the thermally conductive potting adhesive adopts a structural adhesive with an ultra-low curing shrinkage rate, which can avoid the situation that the accommodating cavity 601 cannot be filled due to the curing shrinkage of the thermally conductive potting adhesive, affecting the heat dissipation of the LED display screen and the adhesion between the packaging layer 700 and the bottom case 600.

[0075] It should be noted that the accommodating cavity 601 can be filled with a thermally conductive potting adhesive, but it is not limited to this. The accommodating cavity 601 can also be filled with a fireproof potting epoxy resin, etc., which can be determined according to the specific situation. Filling the accommodating cavity 601 with a fireproof potting epoxy resin can improve the fireproof performance of the LED display screen.

[0076] See Figure 2 As shown, the manufacturing method of the LED display screen further includes: after installing the bottom case 600, forming at least a light-shielding protective layer 800 on the side surface of the light-transmitting substrate 110. The side surface of the light-transmitting substrate 110 connects the front surface and the back surface of the light-transmitting substrate 110. Forming at least a light-shielding protective layer 800 on the side surface of the light-transmitting substrate 110 means that the light-shielding protective layer 800 can be formed only on the side surface of the light-transmitting substrate 110, but it is not limited to this. The light-shielding protective layer 800 can also extend to cover the optical film 400 and the light-shielding layer 300, which can be determined according to the specific situation. The light-shielding protective layer 800 can be made of a black epoxy resin, etc., and is formed by spraying on the side surface of the light-transmitting substrate 110.

[0077] Forming a light-shielding protective layer 800 on the side surface of the light-transmitting substrate 110 can block light and reduce the influence of external ambient light. At the same time, the light-shielding protective layer 800 is connected to the light-shielding layer 300, which can achieve an integrated black color.

[0078] It should be noted that when manufacturing the LED display screen in this embodiment, the same jig can be used for each process, which helps the transfer and protection of the product, reduces the risks of secondary pollution and quality decline, etc., and thus ensures the production of the LED display screen.

[0079] The terms "first", "second", etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically and clearly defined.

[0080] In this application, unless otherwise clearly specified and defined, the terms "assemble", "connect", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0081] In the description of this specification, the descriptions with reference to terms such as "some embodiments", "exemplarily", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0082] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting this application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and the description of this application shall fall within the scope covered by the patent of this application.

Claims

1. A manufacturing method of an LED display screen, characterized in that, Including: Fabricate a circuit layer and pads on the back surface of the light-transmissive substrate, where the back surface and the front surface of the light-transmissive substrate are two opposite surfaces thereof; Mount the LED lamp beads on the back surface of the light-transmissive substrate. The LED lamp beads have opposite light-emitting surfaces and backlight surfaces. The light-emitting surface of the LED lamp beads faces the back surface of the light-transmissive substrate. The solder legs of the LED lamp beads are led out from the backlight surface of the LED lamp beads and are bonded to the pads; Form a whole-surface light-shielding layer on the back surface of the light-transmissive substrate to shield the LED lamp beads and the area around the LED lamp beads. The light-shielding layer material is a black light-absorbing material; The method for manufacturing the LED display screen further includes: Mount a bottom case on the back surface of the light-transmissive substrate. The edge area of the bottom case contacts the light-shielding layer in the area around the LED lamp beads. The middle part of the bottom case is recessed away from the light-transmissive substrate to form a receiving cavity. The bottom of the receiving cavity contacts or forms a gap with the light-shielding layer on the LED lamp beads; After mounting the bottom case, form a light-shielding protective layer at least on the side surface of the light-transmissive substrate. The side surface of the light-transmissive substrate connects the front surface and the back surface of the light-transmissive substrate.

2. The manufacturing method of the LED display screen according to claim 1, wherein, When mounting the LED lamp beads, form a gap between the light-emitting surface of the LED lamp beads and the light-transmissive substrate, and form a transparent potting layer between the LED lamp beads and the light-transmissive substrate.

3. The manufacturing method of the LED display screen according to claim 2, wherein, When forming the transparent potting layer, infiltrate epoxy resin into the gap between the LED lamp beads and the light-transmissive substrate, and cure the epoxy resin to form the transparent potting layer.

4. The manufacturing method of the LED display screen according to claim 3, characterized in that, The epoxy resin is vacuum-cured to form the transparent potting layer.

5. The manufacturing method of the LED display screen according to claim 1, characterized in that, The method for manufacturing the LED display screen further includes: Before fabricating the circuit layer and the pads, at least perform atomization treatment on the front surface and the back surface of the light-transmissive substrate.

6. The manufacturing method of the LED display screen according to claim 5, characterized in that, The method for manufacturing the LED display screen further includes: After fabricating the circuit layer and the pads, form an optical film sheet at least on the front surface of the light-transmissive substrate.

7. The manufacturing method of the LED display screen according to claim 6, characterized in that, The optical film sheet includes one or a combination of an anti-reflection film, an anti-glare film, an anti-fouling film, and an anti-Moiré film.

8. The manufacturing method of the LED display screen according to claim 1, characterized in that, The method for manufacturing the LED display screen further includes: After mounting the bottom case, fill the receiving cavity with a thermal conductive potting adhesive.

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