Electroplating device and electroplating production line

Abstract

This invention discloses an electroplating apparatus and an electroplating production line, comprising: an electroplating tank and a clamping and conveying structure; wherein, the clamping and conveying structure is disposed on the open side of the electroplating tank; the clamping and conveying structure conveys the film to be coated along the conveying direction, and the clamping and conveying structure includes at least two sets of clamping and conveying mechanisms; each clamping and conveying mechanism includes an electroplating clamp, a closing clamp assembly, and an opening clamp assembly; on one clamping and conveying mechanism, the closing clamp assembly and the opening clamp assembly are disposed at both ends of the clamping and conveying mechanism along the conveying direction; along the conveying direction of the film to be coated, the closing clamp assembly and the opening clamp assembly of two adjacent clamping and conveying mechanisms are spaced apart and form an adjustable interval. This structure, by providing an adjustable interval, corrects the error caused by the asynchronous electroplating clamps in the previous clamping and conveying mechanism when the film to be coated enters the next stage of the clamping and conveying mechanism; thus greatly solving the synchronization problem.

Description

Technical Field

[0001] This invention relates to the field of metal plating technology, specifically to an electroplating apparatus and an electroplating production line. Background Technology

[0002] To improve the corrosion resistance, conductivity, and other properties of products, a plating treatment is applied to the surface of the product after molding. Current technology often uses electroplating, which uses an external direct current to deposit a metal or alloy layer on the surface of a conductive material. During electroplating, the anode of an electrode is electrically connected to a chemical solution, and the cathode is connected to the conductive workpiece. When current is applied, positively charged cations in the solution move towards the cathode of the circuit, undergoing reduction on the surface of the workpiece and forming an electroplated layer covering the workpiece surface.

[0003] To improve production efficiency, existing double-sided continuous electroplating production lines need to be extended. Compared to the original short line, the plates to be plated can run faster in the longer line while being electroplated in the solution for the same amount of time, thus improving efficiency.

[0004] However, extending the production line brings serious problems. Due to machining errors in the mechanical structure, a speed difference inevitably occurs between the two steel strips after running for a period of time, resulting in a lack of complete synchronization. Moreover, the longer the production line, the greater the deviation in synchronization. If the synchronization problem is significant, it will cause wrinkles on the plate surface, affecting the electroplating quality. Summary of the Invention

[0005] Therefore, the technical problem to be solved by this invention is that the extension of the production line brings about serious issues; due to the processing errors in the mechanical structure, a speed difference inevitably occurs between the two steel strips after running for a period of time, i.e., a problem of incomplete synchronization. Moreover, the longer the production line, the greater the deviation in synchronization. Once the synchronization problem is significant, it will cause wrinkles on the plate surface and affect the electroplating quality.

[0006] Therefore, the present invention provides an electroplating apparatus, comprising:

[0007] Electroplating tank;

[0008] A clamping and conveying structure is disposed on the opening side of the electroplating tank; the clamping and conveying structure conveys the film to be coated along the conveying direction, and the clamping and conveying structure includes at least two sets of clamping and conveying mechanisms;

[0009] The clamping and conveying mechanism includes an electroplating clamp, a closing clamp assembly, and an opening clamp assembly; the opening clamp assembly is used to drive the electroplating clamp to open, and the closing clamp assembly is used to drive the electroplating clamp to close; on a clamping and conveying mechanism, the closing clamp assembly and the opening clamp assembly are arranged at both ends of the clamping and conveying mechanism along the conveying direction;

[0010] Along the direction of film coating, the closed clamping components and open clamping components of two adjacent clamping and conveying mechanisms are spaced apart and form an adjustable interval.

[0011] Optionally, the electroplating apparatus described above includes a first electroplating state and a second electroplating state; in the first electroplating state, one of the two adjacent clamping and conveying mechanisms clamps the film to be plated at a first position of the film to be plated to electroplat the film; in the second electroplating state, the other of the two adjacent clamping and conveying mechanisms clamps the film to be plated at a second position of the film to be plated to electroplat the film.

[0012] The first position and the second position are arranged alternately on the film to be coated.

[0013] Optionally, along the conveying direction, the electroplating current value of the clamping and conveying mechanism on the downstream side is greater than the electroplating current value in the clamping and conveying mechanism on the upstream side.

[0014] Optionally, the length of any of the above-described clamping and conveying mechanisms in the conveying direction is inversely proportional to the magnitude of the electroplating current value in the clamping and conveying mechanism.

[0015] Optionally, the conveying speed of any of the above-described clamping and conveying mechanisms is proportional to the magnitude of the electroplating current value in the clamping and conveying mechanism.

[0016] Optionally, the aforementioned clamping assembly includes a first conveying roller and a clamping guide; the clamping guide is arranged in an arc shape around the first conveying roller; the clamping guide is provided with a clamping guide surface for guiding the clamp to close.

[0017] Optionally, the clamping assembly includes a second conveying roller and a clamping guide; the clamping guide is arranged in an arc shape around the second conveying roller; the clamping guide is provided with an clamping guide surface for opening the clamp.

[0018] Optionally, the aforementioned clamping guide and the first conveying roller are coaxially arranged;

[0019] The clamping guide is coaxially arranged with the second conveyor roller.

[0020] Optionally, the clamping and conveying mechanism described above may also include a conveying steel belt and a conductive structure;

[0021] The two ends of the conveyor steel belt are respectively sleeved on the first conveyor roller and the second conveyor roller;

[0022] The conductive structure is connected to the conveyor steel belt, and the conveyor steel belt is electrically connected to the electroplating clamp.

[0023] Optionally, the above also includes a base frame; the conductive structure includes a conductive copper busbar and a conductive seat; the conductive copper busbar is disposed on the base frame, and the conductive seat is disposed on the conveyor steel belt; the conductive copper busbar is electrically connected to the conductive seat, and the conductive seat is electrically connected to the conveyor steel belt.

[0024] An electroplating production line includes a frame and the aforementioned electroplating apparatus, wherein the electroplating apparatus is mounted on the frame.

[0025] The technical solution provided by this invention has the following advantages:

[0026] 1. This embodiment provides an electroplating apparatus, including: an electroplating tank and a clamping and conveying structure; wherein, the clamping and conveying structure is disposed on the opening side of the electroplating tank; the clamping and conveying structure conveys the film to be coated along the conveying direction, and the clamping and conveying structure includes at least two sets of clamping and conveying mechanisms; the clamping and conveying mechanism includes an electroplating clamp, a closing clamp assembly, and an opening clamp assembly; the opening clamp assembly is used to drive the electroplating clamp to open, and the closing clamp assembly is used to drive the electroplating clamp to close; on one clamping and conveying mechanism, the closing clamp assembly and the opening clamp assembly are disposed at both ends of the clamping and conveying mechanism along the conveying direction; along the conveying direction of the film to be coated, the closing clamp assembly and the opening clamp assembly of two adjacent clamping and conveying mechanisms are spaced apart and form an adjustable interval.

[0027] This structure includes an electroplating tank and a clamping and conveying structure, with the clamping and conveying structure positioned above the electroplating tank. The clamping and conveying structure comprises at least two sets of clamping and conveying mechanisms. Each clamping and conveying mechanism is a double-sided conveyor, including several symmetrically arranged electroplating clamps, two closing clamping assemblies, and two opening clamping assemblies. A pair of closing clamping assemblies drives the electroplating clamps to close, clamping both sides of the film to be coated and conveying it along the conveying direction to the opening clamping assemblies. The opening clamping assemblies drive the electroplating clamps to open, releasing the film to be coated, which then continues to be transported along the conveying direction to the next clamping and conveying mechanism. In adjacent clamping and conveying mechanisms, the closing and opening clamping assemblies are spaced apart and arranged in a staggered pattern. An adjustable interval is established; that is, along the conveying direction, there is an adjustable interval between the opening clamping component in the previous clamping conveying mechanism and the closing clamping component in the subsequent clamping conveying mechanism; because the error in each clamping conveying mechanism is smaller than the error of the entire electroplating line; by setting the adjustable interval, at the adjustable interval position, there is no electroplating clamp on the film to be coated, and when the film to be coated enters the next stage clamping conveying mechanism, the error caused by the asynchronous electroplating clamps in the previous stage clamping conveying mechanism is corrected; compared with the existing technology, the error of a continuous long line is reduced to the error in only the last clamping conveying mechanism, which greatly solves the synchronization problem.

[0028] 2. In this embodiment, the electroplating apparatus includes a first electroplating state and a second electroplating state; in the first electroplating state, one of two adjacent clamping and conveying mechanisms clamps the film to be plated at a first position of the film to be plated to electroplat the film; in the second electroplating state, the other of the two adjacent clamping and conveying mechanisms clamps the film to be plated at a second position of the film to be plated to electroplat the film; the first position and the second position are arranged alternately on the film to be plated.

[0029] This structure electroplats the film to be plated by setting two electroplating states in the electroplating device. In the first electroplating state, along the conveying direction, the first position of the film to be plated is clamped by the first of two adjacent clamping and conveying mechanisms for electroplating. At this time, since there is a certain contact area between the electroplating clamp and the film to be plated, the film to be plated on this contact area cannot be electroplated in the first electroplating state. Then, it enters the second electroplating state. The film to be plated after passing through the first electroplating state enters the second clamping and conveying mechanism. By setting a time difference between the two clamping and conveying mechanisms, the electroplating clamp in the second clamping and conveying mechanism clamps the second position between the two adjacent first positions for electroplating. This allows the first position to be electroplated in the second electroplating state, leaving no defects on the entire film to be plated, and the electroplating to be more uniform.

[0030] 3. In this embodiment, along the conveying direction, the electroplating current value of the clamping and conveying mechanism on the downstream side is greater than the electroplating current value of the clamping and conveying mechanism on the upstream side.

[0031] This structure sets the electroplating current value of the downstream clamping and conveying mechanism to be greater than that of the upstream clamping and conveying mechanism. This is because a thicker coating can withstand a larger current, and a larger current results in faster coating per unit time. In the first electroplating state, the first position is not coated; in the second electroplating state, the clamping position is the second position where a coating has already been applied. Due to the thickness of the coating, the current can be increased, accelerating coating formation and improving electroplating efficiency. When there are two clamping and conveying mechanisms, the electroplating position changes from the first position to the second position.

[0032] 4. In this embodiment, the length of the clamping conveyor in the conveying direction is inversely proportional to the electroplating current value in the clamping conveyor. This structure sets the length of the clamping conveyor in the conveying direction to be inversely proportional to the electroplating current value in the clamping conveyor; along the conveying direction, the electroplating current value in the clamping conveyor near the discharge end is greater than the electroplating current value in the clamping conveyor near the feed end; the greater the current, the faster the coating per unit time, the less time is required to achieve the same electroplating effect for each clamping conveyor, the shorter the electroplating stroke, and the shorter the length of the clamping conveyor in the conveying direction. Therefore, for two adjacent clamping conveyors, the length of the clamping conveyor near the discharge end is less than the length of the clamping conveyor near the feed end, thereby shortening the length of the entire clamping conveyor structure and saving space costs. Furthermore, the length of the clamping conveyor near the discharge end is shorter than that near the feed end. The final synchronization error of the coating is the error of the clamping conveyor near the discharge end. As the length of the clamping conveyor decreases, the synchronization error of the output coating becomes very small, which greatly solves the synchronization problem.

[0033] 5. When the thickness of the electroplated layer has a preset value; several electroplating tanks can be set, the number of which is the same as the number of clamping and conveying mechanisms, and they are set one-to-one; the length of the electroplating tank corresponding to any clamping and conveying mechanism is inversely proportional to the magnitude of the electroplating current value in that clamping and conveying mechanism, so that the length of the electroplating tank is the same as the length of the corresponding clamping and conveying mechanism. The length of the electroplating tank corresponding to any clamping and conveying mechanism is inversely proportional to the magnitude of the electroplating current value in that clamping and conveying mechanism, and the length of the clamping and conveying mechanism in the conveying direction is inversely proportional to the magnitude of the electroplating current value in that clamping and conveying mechanism, so that the coating at different electroplating stages can be electroplated in different electroplating tanks. When the conveying speed of the coating by different clamping and conveying mechanisms is the same, its electroplating rate and electroplating time are inversely proportional, ensuring that the coating thickness generated by each clamping and conveying mechanism is the same, and ensuring the uniformity of the coating. Attached Figure Description

[0034] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the electroplating production line provided in this embodiment;

[0036] Figure 2This is a schematic diagram of the installation of the clamping assembly, the opening assembly, and the conveyor belt provided in this embodiment;

[0037] Figure 3 This is a schematic diagram of the installation of the frame, clamping assembly, and clamping assembly provided in this embodiment;

[0038] Figure 4 This is a schematic diagram of the structure of the closing clamp assembly and the opening clamp assembly provided in this embodiment;

[0039] Figure 5 This is a schematic diagram of the closed clamping assembly at the feed end of the electroplating production line provided in this embodiment;

[0040] Figure 6 This is a schematic diagram of the opening clamping assembly at the discharge end of the electroplating production line provided in this embodiment;

[0041] Figure 7 This is a schematic diagram of the electroplating clamp, conveyor steel belt, and conductive structure provided in this embodiment;

[0042] Figure 8 This is a schematic diagram of the clamping positions of the first and second positions provided in this embodiment;

[0043] Explanation of reference numerals in the attached figures:

[0044] 1 – Clamping and conveying mechanism; 11 – Electroplating clamp; 12 – Clamping assembly; 121 – First conveyor roller; 122 – Clamping guide; 123 – Clamping guide surface; 13 – Clamping assembly; 131 – Second conveyor roller; 132 – Clamping guide; 133 – Clamping guide surface; 14 – Conveyor steel belt; 15 – Conductive structure; 151 – Conductive copper busbar; 152 – Conductive base;

[0045] 2 - Frame;

[0046] A – First position; B – Second position. Detailed Implementation

[0047] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0050] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0051] Example 1

[0052] This embodiment provides an electroplating apparatus, such as Figures 1 to 8 As shown, it includes: an electroplating tank and a clamping and conveying structure; wherein, the clamping and conveying structure is disposed on the open side of the electroplating tank; the clamping and conveying structure conveys the film to be coated along the conveying direction, and the clamping and conveying structure includes at least two sets of clamping and conveying mechanisms 1; the clamping and conveying mechanism 1 includes an electroplating clamp 11, a closing clamping assembly 12 and an opening clamping assembly 13; the opening clamping assembly 13 is used to drive the electroplating clamp 11 to open, and the closing clamping assembly 12 is used to drive the electroplating clamp 11 to close; on a clamping and conveying mechanism 1, the closing clamping assembly 12 and the opening clamping assembly 13 are disposed at both ends of the clamping and conveying mechanism 1 along the conveying direction; along the conveying direction of the film to be coated, the closing clamping assembly 12 and the opening clamping assembly 13 of two adjacent clamping and conveying mechanisms 1 are spaced apart and form an adjustable interval.

[0053] This structure includes an electroplating tank and a clamping and conveying structure, with the clamping and conveying structure positioned above the electroplating tank. The clamping and conveying structure comprises at least two sets of clamping and conveying mechanisms 1. Each clamping and conveying mechanism 1 is a double-sided conveyor, comprising several symmetrically arranged electroplating clamps 11, two closing clamping assemblies 12, and two opening clamping assemblies 13. A pair of closing clamping assemblies 12 drives the electroplating clamps 11 to close, clamping both sides of the film to be coated and conveying the film to be coated along the conveying direction to the opening clamping assemblies 13. Figure 1Arrow C indicates the conveying direction. The opening clamping assembly 13 drives the electroplating clamp 11 to open, releasing the film to be coated. The film continues to be transported along the conveying direction to the next clamping conveying mechanism 1. The closing clamping assembly 12 and the opening clamping assembly 13 in two adjacent clamping conveying mechanisms 1 are spaced apart and form an adjustment interval. That is, along the conveying direction, there is an adjustment interval between the opening clamping assembly 13 in the previous clamping conveying mechanism 1 and the closing clamping assembly 12 in the next clamping conveying mechanism 1. Because the error in each clamping conveying mechanism 1 is smaller than the error of the entire electroplating line, by setting the adjustment interval, there is no electroplating clamp 11 clamping the film to be coated at the adjustment interval position. When the film to be coated enters the next stage of the clamping conveying mechanism 1, the error caused by the asynchronous electroplating clamp 11 in the previous stage of the clamping conveying mechanism 1 is corrected. Compared with the existing technology, the error of the continuous long line is reduced to the error in the last clamping conveying mechanism, which greatly solves the problem of synchronization.

[0054] In this embodiment, as Figure 8 As shown; the electroplating apparatus includes a first electroplating state and a second electroplating state; in the first electroplating state, one of two adjacent clamping and conveying mechanisms 1 clamps the film to be plated at a first position A to electroplat the film; in the second electroplating state, the other of the two adjacent clamping and conveying mechanisms 1 clamps the film to be plated at a second position B to electroplat the film; the first position A and the second position B are arranged alternately on the film to be plated.

[0055] This structure electroplats the film to be plated by setting two electroplating states of the electroplating device. In the first electroplating state, along the conveying direction, the first position A of the film to be plated is clamped by the first of the two adjacent clamping conveying mechanisms 1 for electroplating. At this time, since there is a certain contact area between the electroplating clamp 11 and the film to be plated, the film to be plated on this contact area cannot be electroplated in the first electroplating state. Then, it enters the second electroplating state. The film to be plated after passing through the first electroplating state enters the second clamping conveying mechanism 1. By setting the start time difference between the two clamping conveying mechanisms 1, the electroplating clamp 11 in the second clamping conveying mechanism 1 clamps the second position B between the two adjacent first positions A for electroplating. This allows the first position A to be electroplated in the second electroplating state, leaving no defects on the entire film to be plated, and the electroplating to be more uniform.

[0056] In this embodiment, along the conveying direction, the electroplating current value of the clamping and conveying mechanism 1 on the downstream side is greater than the electroplating current value of the clamping and conveying mechanism 1 on the upstream side.

[0057] This structure sets the electroplating current value of the downstream clamping and conveying mechanism 1 to be greater than that of the upstream clamping and conveying mechanism 1. This is because a thicker coating can withstand a larger current, and a larger current results in faster coating per unit time. When there are two clamping and conveying mechanisms 1, the electroplating position changes from the first position A to the second position B. In the first electroplating state, the first position A is not coated; in the second electroplating state, the electroplating clamp 11 holds the coating at the already coated second position B. Due to the thickness of the coating, the current can be increased, accelerating coating formation and improving electroplating efficiency.

[0058] In this embodiment, the length of any clamping conveyor 1 in the conveying direction is inversely proportional to the electroplating current value in that clamping conveyor 1. This structure sets the length of the clamping conveyor 1 in the conveying direction to be inversely proportional to the electroplating current value in that clamping conveyor 1. Along the conveying direction, the electroplating current value of the downstream clamping conveyor 1 is greater than that of the upstream clamping conveyor 1. The greater the current, the faster the coating is per unit time, the less time is required to achieve the same electroplating effect for each clamping conveyor 1, the shorter the electroplating stroke, and the shorter the length of the clamping conveyor 1 in the conveying direction. Therefore, for two adjacent clamping conveyors 1, the length of the clamping conveyor 1 closer to the discharge end is less than the length of the clamping conveyor 1 closer to the feed end, thereby shortening the length of the entire clamping conveying structure and saving space costs. Moreover, the length of the clamping conveyor 1 near the discharge end is less than the length of the clamping conveyor 1 near the feed end. The final synchronization error of the coating is the error of the clamping conveyor 1 near the discharge end. The synchronization error of the clamping conveyor 1 decreases as the length of the clamping conveyor 1 decreases, eventually resulting in a very small synchronization error of the output coating, which greatly solves the synchronization problem.

[0059] In this embodiment, the conveying speed of any of the clamping conveyor mechanisms 1 is proportional to the electroplating current value within that clamping conveyor mechanism 1. This structure, by setting the speed of any of the clamping conveyor mechanisms 1 in the conveying direction to be proportional to the electroplating current value within that clamping conveyor mechanism 1, allows for faster film deposition per unit time when the current is higher. This reduces the time required to achieve the same electroplating effect for each clamping conveyor mechanism 1. Therefore, when each clamping conveyor mechanism 1 has the same length, the conveying speed of the clamping conveyor mechanism 1 closer to the downstream side can be greater than that of the clamping conveyor mechanism 1, thereby improving production efficiency.

[0060] In this embodiment, as Figures 2 to 6As shown; the clamping assembly 12 includes a first conveyor roller 121 and a clamping guide 122; the clamping guide 122 is arranged in an arc shape around the first conveyor roller 121; the clamping guide 122 is provided with a clamping guide surface 123 for guiding the clamp to close. The clamping assembly 13 includes a second conveyor roller 131 and an clamping guide 132; the clamping guide 132 is arranged in an arc shape around the second conveyor roller 131; the clamping guide 132 is provided with an clamping guide surface 133 for guiding the clamp to open. The clamping guide 122 and the first conveyor roller 121 are coaxially arranged; the clamping guide 132 and the second conveyor roller 131 are coaxially arranged.

[0061] This structure features a first conveyor roller 121 and a clamping guide 122. The clamping guide 122 is arranged in an arc shape around the first conveyor roller 121. The clamping guide 122 has a clamping guide surface 123 for closing the clamp. The electroplating clamp 11 slides on the clamping guide surface 123, thereby achieving the closing action and clamping the film to be coated. The clamping guide 122 and the first conveyor roller 121 are coaxially arranged so that the electroplating clamp 11 can... The clamping clamp 11 is always in contact with the clamping guide surface 123. By setting a second conveyor roller 131 and an opening guide 132, the opening guide 132 is provided with an opening guide surface 133 for opening the clamp. The electroplating clamp 11 slides on the opening guide surface 133 to realize the opening action and release the film to be plated. The opening guide 132 is coaxially set with the second conveyor roller 131. This is so that the electroplating clamp 11 can always be in contact with the opening guide surface 133 during the process of the electroplating clamp 11 being driven to move by the second conveyor roller 131.

[0062] In this embodiment, as Figure 7 As shown; the electroplating apparatus also includes a base frame; the clamping and conveying mechanism 1 also includes a conveying steel belt 14 and a conductive structure 15; the two ends of the conveying steel belt 14 are respectively sleeved on the first conveying roller 121 and the second conveying roller 131; the conductive structure 15 is connected to the conveying steel belt 14, and the conveying steel belt 14 is electrically connected to the electroplating clamp 11. The conductive structure 15 includes a conductive copper busbar 151 and a conductive seat 152; the conductive copper busbar 151 is disposed on the base frame, and the conductive seat 152 is disposed on the conveying steel belt 14; the conductive copper busbar 151 and the conductive seat 152 are electrically connected, and the conductive seat 152 is electrically connected to the conveying steel belt 14.

[0063] This structure involves fitting the two ends of the conveyor belt 14 onto the first conveyor roller 121 and the second conveyor roller 131 respectively, with the conveyor belt 14 placed on a base frame that provides support. A motor is installed on either the first conveyor roller 121 or the second conveyor roller 131 to drive the conveyor belt 14 to move on the first and second conveyor rollers 121 and 131. A conductive structure 15 is connected to the conveyor belt 14 and includes conductive copper busbars 151 and conductive bases 152. The conductive copper busbars 151 have two rows and are fixed. Fixed on the base frame, the conductive seat 152 is connected to the conveyor steel belt 14. As the conveyor steel belt 14 moves, the conductive seat 152 moves between two rows of conductive copper busbars 151. During the movement, the conductive seat 152 and the conductive copper busbars 151 are in contact, so that the conductive copper busbars 151 and the conductive seat 152 are electrically connected, the conductive seat 152 and the conveyor steel belt 14 are electrically connected, and the conveyor steel belt 14 is electrically connected to the electroplating clamp 11. One side of the electroplating clamp 11 is the positive electrode, and the other side is the negative electrode. The electroplating clamp 11 is energized to perform electroplating.

[0064] The working principle of the electroplating apparatus provided in this embodiment is as follows:

[0065] In two adjacent clamping and conveying mechanisms 1, the closing clamping component 12 and the opening clamping component 13 are spaced apart and form an adjustment interval; that is, along the conveying direction, there is an adjustment interval between the opening clamping component 13 in the previous clamping and conveying mechanism 1 and the closing clamping component 12 in the next clamping and conveying mechanism 1; because the error in each clamping and conveying mechanism 1 is smaller than the error of the entire clamping and conveying mechanism 1; by setting the adjustment interval, at the adjustment interval position, there is no electroplating clamp 11 clamping the film to be coated, and when the film to be coated enters the next stage of the clamping and conveying mechanism 1, the error caused by the asynchronous electroplating clamp 11 in the previous stage of the clamping and conveying mechanism 1 is corrected; compared with the existing technology, the error of the continuous long line body is reduced to the error of only the last clamping and conveying mechanism 1, which greatly solves the problem of synchronization.

[0066] In other alternative embodiments, the start-up time of different clamping and conveying mechanisms 1 in the electroplating apparatus can also be the same, so that the electroplating clamps 11 in different clamping and conveying mechanisms 1 are always clamped at the first position A for electroplating. At this time, the electroplating current value in different clamping and conveying mechanisms 1 should be the same and should not be increased to prevent the film to be plated from being broken down.

[0067] In other alternative embodiments, the electroplating current values ​​in the different clamping and conveying mechanisms 1 of the electroplating apparatus are the same, ensuring that the electroplating rate is in a stable state.

[0068] In other optional embodiments, when the number of clamping and conveying mechanisms 1 is greater than or equal to two, the film to be coated moves from the first clamping and conveying mechanism 1 to the second clamping and conveying mechanism 1, the electroplating position changes from the first position A to the second position B, the film to be coated moves from the second clamping and conveying mechanism 1 to the next clamping and conveying mechanism 1, the electroplating position can change from the second position B back to the first position A for electroplating, or it can remain at the second position B for electroplating; or it can change to another position with a thicker coating than the second position B. When changing to another position with a thicker coating, the electroplating current value can be further increased, making the electroplating efficiency higher.

[0069] In other optional embodiments, when the thickness of the electroplated layer has a preset value, several electroplating tanks can be provided, the number of electroplating tanks being the same as the number of clamping and conveying mechanisms 1, and they are arranged one-to-one. The length of the electroplating tank corresponding to any clamping and conveying mechanism 1 is inversely proportional to the magnitude of the electroplating current value in that clamping and conveying mechanism 1, so that the length of the electroplating tank is the same as the length of the corresponding clamping and conveying mechanism 1. The length of the electroplating tank corresponding to any clamping and conveying mechanism 1 is inversely proportional to the magnitude of the electroplating current value in that clamping and conveying mechanism 1, and the length of the clamping and conveying mechanism 1 in the conveying direction is inversely proportional to the magnitude of the electroplating current value in that clamping and conveying mechanism 1, so that the coatings of different electroplating stages can be electroplated in different electroplating tanks. When the conveying speed of the coatings by different clamping and conveying mechanisms 1 is the same, the electroplating rate and the electroplating time are inversely proportional, ensuring that the coating thickness generated by each clamping and conveying mechanism 1 is the same, and ensuring the uniformity of the coating.

[0070] Example 2

[0071] This embodiment provides an electroplating production line, such as Figure 1 As shown, the device includes a frame 2 and the electroplating apparatus described in Embodiment 1, with the electroplating apparatus mounted on the frame 2. A first conveyor roller 121 and a second conveyor roller 131 are mounted on the frame 2 and rotatably connected to it. The electroplating tank is located below the clamping and conveying mechanism 1. It has all the beneficial effects of the electroplating apparatus described in Embodiment 1, and the electroplating production line has high electroplating efficiency, which can improve production efficiency.

[0072] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. An electroplating apparatus, characterized in that, include: Electroplating tank; A clamping and conveying structure is disposed on the opening side of the electroplating tank; the clamping and conveying structure conveys the film to be plated along the conveying direction, and the clamping and conveying structure includes at least two sets of clamping and conveying mechanisms (1). The clamping and conveying mechanism (1) includes an electroplating clamp (11), a closing clamp assembly (12), and an opening clamp assembly (13); the opening clamp assembly (13) is used to drive the electroplating clamp (11) to open, and the closing clamp assembly (12) is used to drive the electroplating clamp (11) to close; on a clamping and conveying mechanism (1), the closing clamp assembly (12) and the opening clamp assembly (13) are arranged at both ends of the clamping and conveying mechanism (1) along the conveying direction; Along the direction of film coating, the closed clamping assembly (12) and the open clamping assembly (13) of two adjacent clamping and conveying mechanisms (1) are spaced apart and form an adjustable interval; The electroplating apparatus includes a first electroplating state and a second electroplating state; in the first electroplating state, one of the two adjacent clamping and conveying mechanisms (1) clamps the film to be plated at a first position of the film to be plated to electroplat the film to be plated; in the second electroplating state, the other of the two adjacent clamping and conveying mechanisms (1) clamps the film to be plated at a second position of the film to be plated to electroplat the film to be plated. The first position and the second position are arranged alternately on the film to be coated; Along the conveying direction, the electroplating current value of the clamping conveying mechanism (1) on the downstream side is greater than the electroplating current value in the clamping conveying mechanism (1) on the upstream side.

2. The electroplating apparatus according to claim 1, characterized in that, The length of any of the clamping and conveying mechanisms (1) in the conveying direction is inversely proportional to the magnitude of the electroplating current value in the clamping and conveying mechanism (1).

3. The electroplating apparatus according to claim 1, characterized in that, The conveying speed of any of the clamping and conveying mechanisms (1) is proportional to the magnitude of the electroplating current value in the clamping and conveying mechanism (1).

4. The electroplating apparatus according to claim 1, characterized in that, The clamping assembly (12) includes a first conveying roller (121) and a clamping guide (122); the clamping guide (122) is arranged in an arc shape around the first conveying roller (121); the clamping guide (122) is provided with a clamping guide surface (123) for guiding the clamp to close.

5. The electroplating apparatus according to claim 4, characterized in that, The clamping assembly (13) includes a second conveying roller (131) and a clamping guide (132); the clamping guide (132) is arranged in an arc shape around the second conveying roller (131); the clamping guide (132) is provided with a clamping guide surface (133) for opening the clamp.

6. The electroplating apparatus according to claim 5, characterized in that, The clamping guide (122) and the first conveying roller (121) are coaxially arranged; The clamping guide (132) is coaxially arranged with the second conveying roller (131).

7. The electroplating apparatus according to claim 5, characterized in that, The clamping and conveying mechanism (1) also includes a conveying steel belt (14) and a conductive structure (15); The two ends of the conveyor steel belt (14) are respectively sleeved on the first conveyor roller (121) and the second conveyor roller (131); The conductive structure (15) is connected to the conveying steel belt (14), and the conveying steel belt (14) is electrically connected to the electroplating clamp (11).

8. The electroplating apparatus according to claim 7, characterized in that, It also includes a base frame; the conductive structure (15) includes a conductive copper busbar (151) and a conductive seat (152); the conductive copper busbar (151) is disposed on the base frame, and the conductive seat (152) is disposed on the conveyor steel belt (14); the conductive copper busbar (151) is electrically connected to the conductive seat (152), and the conductive seat (152) is electrically connected to the conveyor steel belt (14).

9. An electroplating production line, characterized in that, It includes a frame (2) and an electroplating apparatus as described in any one of claims 1-8, the electroplating apparatus being mounted on the frame (2).

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