A heat dissipation system, a control method, a storage medium and a lamp

Abstract

The application provides a heat dissipation system, a control method, a storage medium and a lamp. The heat dissipation system comprises a heat radiator, a detection module and a control module; the detection module comprises a first air pressure sensor and a second air pressure sensor, wherein the first air pressure sensor is used for detecting a first air pressure P1 of an air outlet side of a heat dissipation fan, and the second air pressure sensor is used for detecting a second air pressure P2 of an edge of a first heat conduction array module; and the control module is used for comparing P1 and P2 in real time, wherein when an absolute value ΔP of a difference between P1 and P2 exceeds a preset interval, the speed of the heat dissipation fan is dynamically adjusted to make ΔP be within the preset interval, and the temperature of a device to be cooled is not higher than a preset temperature. By monitoring the environmental state parameters P1 and P2 of the heat dissipation fan, the speed of the heat dissipation fan is controlled in real time, the irregular mutual collision of air between the first heat radiators is reduced, the pressure of invalid turbulent flow and chaotic flow is reduced, and the heat dissipation efficiency of the heat radiator is effectively improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation system, control method, storage medium and lamp. Background Technology

[0002] High-powered lighting fixtures and other electrical equipment generate a lot of heat during operation. To ensure the normal use of the lighting fixtures, heat sinks are needed to actively dissipate heat from the heat-generating components. During the operation of the heat sink fan, the airflow generated by the fan will collide with the heat sink, creating turbulence and ineffective air pressure. This prevents the airflow inside the heat sink from being efficiently exhausted, thus affecting the heat dissipation efficiency. Summary of the Invention

[0003] The purpose of this application is to overcome the deficiencies of the prior art and provide a heat dissipation system and a lamp to solve the problems in the prior art.

[0004] To address the aforementioned problems, the first aspect of this application provides a heat dissipation system, characterized in that it includes a heat sink, a detection module, and a control module;

[0005] The heat sink includes a main body, which includes a first end face and a second end face, wherein the first end face and the second end face are opposite to each other; the first end face is used to mount the device to be cooled; a first heat-conducting array module composed of a plurality of first heat sinks is disposed on the second end face, wherein there is a gap between any two adjacent first heat sinks to achieve four-way ventilation; a mounting cavity is disposed in the middle of the first heat-conducting array module, and a cooling fan is installed in the mounting cavity; the bottom surface of the mounting cavity is coplanar with the second end face, and the side surface of the mounting cavity is surrounded by the first heat-conducting array module;

[0006] The detection module includes a first air pressure sensor and a second air pressure sensor, wherein the first air pressure sensor is used to detect the first air pressure P1 on the air outlet side of the cooling fan, and the second air pressure sensor is used to detect the second air pressure P2 at the edge of the first heat conduction array module.

[0007] The control module is used to compare P1 and P2 in real time and obtain the absolute value ΔP of the difference between them. When ΔP exceeds a preset range, the speed of the cooling fan is dynamically adjusted so that ΔP is within the preset range and the temperature of the device to be cooled does not exceed a preset temperature.

[0008] As a further improvement to the above technical solution, dynamically adjusting the speed of the cooling fan includes:

[0009] The speed of the cooling fan is linearly adjusted according to the degree of deviation between the current temperature of the device to be cooled and the preset temperature;

[0010] When the temperature of the device to be cooled is higher than the preset temperature, while keeping ΔP constant within the preset range, the speed of the cooling fan is gradually reduced until the temperature of the device to be cooled reaches the preset temperature.

[0011] As a further improvement to the above technical solution, dynamically adjusting the speed of the cooling fan includes:

[0012] The temperature of the device to be cooled is adjusted non-linearly based on the degree of deviation between the current temperature and the preset temperature.

[0013] When the temperature of the device to be cooled is higher than the preset temperature, while keeping ΔP constant within the preset range, the speed of the cooling fan is kept at the maximum speed until the temperature of the device to be cooled reaches the preset temperature.

[0014] As a further improvement to the above technical solution, a second heat-conducting array module composed of multiple second heat sinks is provided on the bottom surface of the mounting cavity. The top of the second heat-conducting array module faces the cooling fan, wherein there is a gap between any two adjacent second heat sinks.

[0015] The top of the second heat sink faces the cooling fan, and the bottom of the second heat sink is connected to the second end face.

[0016] The cooling fan, together with the first and second heat sinks on the radiator, achieves a reasonable layout. The second heat sink keeps the cooling fan at a distance from the end face of the main body, which makes full use of the centrifugal and axial airflow of the cooling fan. This avoids the problem in traditional radiators where the fan is directly close to the end face of the main body, causing the axial airflow of the fan to diffuse into centrifugal pressure and resulting in excessive noise.

[0017] As a further improvement to the above technical solution, the cooling fan includes a frameless fan or a centrifugal fan; a heat pipe is provided on the first end face, and the heat pipe is connected to the device to be cooled.

[0018] The heat pipe is connected to the device to be cooled, so that the heat of the device can be transferred to the heat pipe, thereby improving the heat dissipation efficiency of the device.

[0019] The second end face includes a protrusion and a guide surface; the protrusion is located at the geometric center of the second end face and protrudes toward a side away from the first end face; the guide surface is inclined from the protrusion toward the outer edge of the body.

[0020] As a further improvement to the above technical solution, a groove is provided on the first end face, and the heat-conducting pipe is installed in the groove;

[0021] The heat pipe includes a connecting part and an extension part. The connecting part is connected to the heat dissipation component. One end of the extension part is connected to the connecting part, and the other end extends to the edge of the first end face.

[0022] The connecting part is provided with a contact surface, and the device to be cooled is in contact with the contact surface, wherein the contact surface is flush with the first end face.

[0023] By using heat pipes, the heat from the device to be cooled is directed to the edge of the main body, thereby improving the efficiency of heat dissipation.

[0024] As a further improvement to the above technical solution, there are multiple heat pipes;

[0025] The extensions of the multiple heat pipes are distributed on the first end face, and the connecting portions are close to each other.

[0026] Multiple heat pipes are used, allowing heat from the device to be cooled to be transferred to different heat pipes, thereby improving heat conduction efficiency. The extensions of the multiple heat pipes are distributed on the first end face, allowing heat to diffuse in different directions and preventing localized overheating. The connecting parts are close to each other, ensuring that the connecting parts of each heat pipe can contact the device to be cooled.

[0027] A second aspect of this application provides a heat dissipation control method, based on the heat dissipation system described above, the method comprising:

[0028] Obtain the current environmental status parameters;

[0029] Input the current environmental state parameters into the trained model to obtain the control parameters output by the model;

[0030] Turn on the cooling fan to dissipate heat from the components to be cooled;

[0031] The first air pressure P1 on the exhaust side of the cooling fan and the second air pressure P2 at the edge of the first heat conduction array module are detected.

[0032] P1 and P2 are compared in real time to obtain the absolute value ΔP of their difference. When ΔP exceeds a preset range, the speed of the cooling fan is dynamically adjusted based on the control parameters so that ΔP is within the preset range and the temperature of the device to be cooled does not exceed a preset temperature.

[0033] A third aspect of this application provides a storage medium having a computer program stored thereon, which, when executed by a processor, implements the heat dissipation control method as described above.

[0034] A fourth aspect of this application provides a lamp, including a heating element and a heat dissipation system as described above, wherein the heat dissipation system is used to dissipate heat from the heating element.

[0035] The beneficial effects of this application include:

[0036] By monitoring the environmental state parameters P1 and P2 of the cooling fan, the speed of the cooling fan is controlled in real time, which reduces the irregular collisions of air between the first heat sink, reduces the pressure of ineffective turbulence and turbulence, and effectively improves the heat dissipation efficiency of the heat sink. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 A first isometric view of a radiator according to Embodiment 1 is shown;

[0039] Figure 2 It shows Figure 1 Second axial view of the radiator;

[0040] Figure 3 It shows Figure 1 First axonometric view of the main body;

[0041] Figure 4 A connection block diagram of a detection module, a control module, and a cooling fan is shown.

[0042] Figure 5 It shows Figure 1 Second axonometric view of the main body;

[0043] Figure 6 A schematic diagram of a cooling fan is shown;

[0044] Figure 7 A schematic diagram of a heat pipe is shown;

[0045] Figure 8 A flowchart of a heat dissipation control method is shown;

[0046] Figure 9 A first axonometric view of a radiator according to Embodiment 2 is shown;

[0047] Figure 10 It shows Figure 9 Second axial view of the radiator;

[0048] Figure 11 It shows Figure 9 Third axial view of the radiator;

[0049] Figure 12 It shows Figure 9 A schematic diagram of the main body;

[0050] Figure 13 A front view of a heat sink according to Embodiment 1 is shown.

[0051] Explanation of key component symbols:

[0052] 100-Main body; 101-First end face; 102-Second end face; 1021-Protrusion; 1022-Guide surface; 103-First heat sink; 104-Cooling fan; 105-Connecting post; 106-Connecting arm; 107-Second heat sink; 108-Heat pipe; 109-LED bead; 110-Heat conductive substrate; 111-Groove; 112-Connecting part; 113-Extension part; 114-Contact surface; 115-Post; 116-Washer; 117-Threaded connector; 118-Sink; 201-First pressure sensor; 202-Second pressure sensor; 203-Control module. Detailed Implementation

[0053] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0054] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0055] Example 1

[0056] In this embodiment, a heat dissipation system is proposed, including a heat sink, a detection module, and a control module.

[0057] See Figure 1 and Figure 2 In this embodiment, the heat sink includes a body 100, which includes a first end face 101 and a second end face 102, wherein the first end face 101 and the second end face 102 are opposite to each other.

[0058] The main body 100 can be made of materials such as aluminum. The shape of the main body 100 can be customized as needed, such as a cuboid or a cylinder. (See reference) Figure 1 and Figure 2 In this embodiment, the main body 100 is generally rectangular, wherein the first end face 101 and the second end face 102 are respectively placed on both sides of the thickness direction of the main body 100.

[0059] like Figure 1 As shown, the first end face 101 of the main body 100 is used to mount the device to be cooled.

[0060] like Figure 2 As shown, a first heat-conducting array module composed of multiple first heat sinks 103 is provided on the second end face 102 of the main body 100. There is a gap between any two adjacent first heat sinks 103 to achieve four-way ventilation. This structure allows the airflow to flow more smoothly, and the airflow can flow through more first heat sinks 103 and carry away heat.

[0061] In this embodiment, the first heat sink 103 may have a columnar structure, and the first heat sink 103 is perpendicular to the first end face 101. The cross-sectional shape of the first heat sink 103 may be circular, elliptical, polygonal, etc.

[0062] The bottom of the first heat sink 103 is connected to the second end face 102, wherein each of the first heat sinks 103 can be parallel to each other. The first heat sink 103 and the main body 100 can be an integral structure, for example, the main body 100 and the first heat sink 103 can be integrally formed by casting or other processes.

[0063] Reference Figure 2 and Figure 3 In this embodiment, a mounting cavity is provided in the middle of the first heat-conducting array module, and a cooling fan 104 is installed in the mounting cavity. The fan rotation axis of the cooling fan 104 is perpendicular to the first end face 101 of the main body 100.

[0064] In this embodiment, the heat dissipation system also includes a detection module and a control module.

[0065] like Figure 4The diagram shown is a connection block diagram between the detection module, the control module 203, and the cooling fan 104.

[0066] The detection module includes a first air pressure sensor 201 and a second air pressure sensor 202. The first air pressure sensor 201 is used to detect the first air pressure P1 on the exhaust side of the cooling fan 104, and the second air pressure sensor 202 is used to detect the second air pressure P2 at the edge of the first heat conduction array module.

[0067] The control module 203 is used to compare P1 and P2 in real time and obtain the absolute value ΔP of the difference between them. When ΔP exceeds the preset range, the speed of the cooling fan 104 is dynamically adjusted so that ΔP is within the preset range and the temperature of the device to be cooled is not higher than the preset temperature.

[0068] In this embodiment, multiple second pressure sensors 202 may be provided and placed at different positions on the edge of the first heat-conducting array module. The second pressure P2 can be the average value of the values ​​detected by the multiple second pressure sensors 202 at the same time.

[0069] When dynamically adjusting the speed of the cooling fan 104, the change in the fan blade speed can be linearly adjusted according to the deviation between the current temperature of the device to be cooled and the preset temperature. For example, when the temperature of the device to be cooled is higher than the preset temperature, while keeping ΔP constant within the preset range, the speed of the cooling fan 104 can be gradually reduced until the temperature of the device to be cooled reaches the preset temperature.

[0070] In addition, the rotation adjustment of the cooling fan 104 is also non-linearly adjusted according to the deviation between the current temperature of the device to be cooled and the preset temperature. For example, as long as the temperature of the device to be cooled is higher than the preset temperature, the cooling fan 104 is kept at the maximum speed while keeping ΔP constant within the preset range until the temperature of the device to be cooled reaches the preset temperature.

[0071] In some embodiments, the following settings can be made:

[0072] The first set temperature is greater than the second set temperature, the first set temperature is greater than the preset temperature, and the second set temperature is greater than or equal to the preset temperature.

[0073] When the temperature of the device to be cooled is higher than the first set temperature, the rotation speed of the cooling fan 104 is first adjusted linearly; when the temperature of the device to be cooled is between the first set temperature and the second set temperature, the rotation speed of the cooling fan 104 is then adjusted non-linearly.

[0074] Reference Figure 2In the figure, arrow a indicates the location of the sensing probe of the first air pressure sensor 201, and arrow b indicates the location of the sensing probe of the second air pressure sensor 202.

[0075] The sensing probe of the first air pressure sensor 201 is located on the air outlet side of the cooling fan 104. In this embodiment, the sensing probe of the first air pressure sensor 201 can be disposed between the second heat sinks 107 and is flush with the top of the second heat sink 107.

[0076] The position of the second pressure sensor 202 can be set as needed. For example, the sensing probe of the second pressure sensor 202 can be set between two adjacent first heat sinks 103 on the outermost side of the first heat conduction array module.

[0077] The large amount of turbulent flow between the cooling fan 104 and the first heat sink 103, and between adjacent first heat sinks 103, directly affects the rotation of the fan blades of the cooling fan 104, causing fluctuations in the torque of the fan motor. By observing the turbulent flow as a disturbance and dynamically controlling the speed of the fan blades using the control module 203, the disturbance is partially offset, resulting in smoother torque and smaller current fluctuations. This optimizes the control of the heat sink and achieves the best heat dissipation efficiency.

[0078] By monitoring the first and second air pressures in real time, it is determined whether there is any ineffective turbulence, and the fan speed is controlled to reduce ineffective turbulence. When ΔP exceeds the preset range, it is determined that ineffective pressure has been formed, and the cooling fan 104 can be controlled and adjusted according to the degree of ineffective pressure.

[0079] In this embodiment, the cooling fan 104 generates airflow in both directions parallel and perpendicular to the fan's rotation axis, allowing the airflow to conduct heat away through the gaps between the first heat sinks 103. Simultaneously, the airflow generated by the cooling fan 104 flows through the first heat sinks 103, carrying the heat from the first heat sinks 103 into the environment. Therefore: Q = AK(TT) env ).

[0080] In the above formula: A represents the heat exchange area of ​​the radiator (m²) 2 ), where A is the area of ​​the heat sink used for heat dissipation; K represents the heat transfer coefficient of the heat sink (w / m²). 2 ·k), which is determined by the material of the radiator itself; T represents the heat exchange temperature of the radiator (°C); T env Represents ambient temperature (°C).

[0081] Reference Figure 2 and Figure 3In this embodiment, the heat exchange area of ​​the radiator is approximately equal to the sum of the areas of the outer surfaces of the main body 100, the first heat-conducting array module, and the second heat-conducting array module. When calculating the outer surface area of ​​the main body 100, the area occupied by the first heat-conducting array module and the second heat-conducting array module on the second end face 102 needs to be subtracted.

[0082] In this embodiment, for the heat sink, when the heat sink is working, the heat exchange temperature of the heat sink is the difference between the temperature of the first heat sink (which can be based on the temperature of the outermost first heat sink of the first heat conduction array module) and the outlet temperature: T = (T rad -T out ), where T rad T represents the temperature of the first heat sink. out This represents the temperature on the air outlet side.

[0083] The heat exchange temperature of a radiator is related to ΔP; that is, the larger ΔP is, the smaller T is, and the smaller ΔP is, the larger T is. Where ΔP = |P2 - P1|.

[0084] In this embodiment, there are no specific requirements for the arrangement of the first heat sink 103, but it is necessary to ensure that the middle of the first heat-conducting array module composed of the first heat sink 103 can form a mounting cavity that can accommodate the cooling fan 104 and has a space between the cooling fan 104 and the main body 100. The cooling fan 104 is not limited to being installed inside the mounting cavity. In other embodiments, the cooling fan 104 can be located outside the mounting cavity and directly opposite the mounting cavity.

[0085] In one specific embodiment, the cooling fan 104 includes a frameless fan or a centrifugal fan. Because it uses a frameless or centrifugal fan, the cooling fan 104 can generate airflow in both directions parallel and perpendicular to the fan's rotation axis. This allows the airflow to cover more areas of the main body 100 and the first heat-conducting array module, thereby improving the heat dissipation effect of the heat sink. When in use, the heat sink can achieve the required cooling effect without additionally increasing the operating power of the cooling fan 104, and avoids excessive noise caused by excessively high fan speeds.

[0086] The frameless cooling fan 104 is smaller and is installed in the mounting cavity in the middle of the first heat conduction array module, thus making the overall structure of the heat sink more compact. The wires of the cooling fan 104 can be led out from the top of the cooling fan 104 and connected to the power supply.

[0087] like Figure 3 As shown, a connecting post 105 can be provided on the second end face 102 of the main body 100. There are multiple connecting posts 105 that can be distributed in a ring array. The connecting posts 105 are perpendicular to the first end face 101. The connecting posts 105 are provided with threaded holes.

[0088] like Figure 6 As shown, a connecting arm 106 can be provided at the bottom of the cooling fan 104, and the connecting arm 106 corresponds one-to-one with the connecting post 105. The connecting arm 106 is provided with a mounting through hole. The direction of the cooling fan 104 can be adjusted as needed, that is, the air outlet direction can be directly facing the main body 100 or facing away from the main body 100.

[0089] When assembling the main body 100 and the cooling fan 104, adjust the relative positions between the main body 100 and the cooling fan 104 so that the connecting arm 106 contacts the corresponding connecting post 105. Simultaneously, align the mounting through hole on the connecting arm 106 with the threaded hole on the connecting post 105. Then, screw the screw through the mounting through hole into the threaded hole, thereby fixing the cooling fan 104 to the main body 100. It is important to note that the screw size should be appropriate and should not interfere with the rotation of the fan blades.

[0090] In this embodiment, the top surface of the mounting cavity is flush with the top of the first heat-conducting array module, the bottom surface of the mounting cavity is coplanar with the second end face 102, and the side surface of the mounting cavity is surrounded by the first heat-conducting array module. The fan blades of the cooling fan 104 are located inside the mounting cavity.

[0091] The top of the first thermal array module is the side away from the second end face 102.

[0092] Since the fan blades are located inside the mounting cavity, when the cooling fan 104 is started, the airflow generated by the cooling fan 104 perpendicular to the fan rotation axis will be blown towards the first heat conduction array module. Thus, the airflow in this direction can be maximized, thereby improving the heat dissipation effect.

[0093] Furthermore, to improve heat conduction and dissipation, a second heat conduction array module, composed of multiple second heat sinks 107, is provided on the bottom surface of the mounting cavity. The second heat conduction array module is located inside the mounting cavity, and its top faces the cooling fan 104. The second heat conduction array module does not contact the blades of the cooling fan 104.

[0094] To ensure smoother airflow through the second heat-conducting array module, a gap exists between any two adjacent second heat sinks 107. When airflow flows towards the second heat-conducting array module, it can pass through more second heat sinks 107 through the gaps between them, thereby carrying away more heat from the second heat sinks 107.

[0095] In this embodiment, the top of the second heat sink 107 faces the cooling fan 104, and the bottom of the second heat sink 107 is connected to the second end face 102.

[0096] The second heat sink 107 can be an integral structure with the main body 100. The second heat sink and the main body 100 can be integrally formed by processes such as casting.

[0097] The second heat sink 107 can be configured as a columnar structure. The cross-sectional shape of the second heat sink 107 can be circular, elliptical, polygonal, etc.

[0098] The first heat sink 103 may be parallel to the second heat sink 107, and both are perpendicular to the first end face 101. The height of the first heat-conducting array module is greater than the height of the second heat-conducting array module.

[0099] In this embodiment, the first heat sink 103 and the second heat sink 107 are arranged in a rectangular array on a projection perpendicular to the first end face 101. In other embodiments, the first heat sink 103 and the second heat sink 107 can be arranged in other forms as needed.

[0100] like Figure 1 As shown, in order to transfer the heat generated by the device to be cooled to the heat sink more efficiently, a heat pipe 108 can be provided on the first end face 101, wherein the heat pipe 108 is connected to the device to be cooled.

[0101] The device to be cooled can be an LED chip 109, a processor, etc. For ease of description, in this embodiment, the LED chip 109 will be used as an example.

[0102] The heat pipe 108 can be made of copper or other materials.

[0103] like Figure 5 As shown, a groove 111 is provided on the first end face 101 for mounting the heat pipe 108, wherein the heat pipe 108 is mounted in the groove 111. The heat pipe 108 can be mounted in the groove 111 by embedding or bonding with thermally conductive adhesive.

[0104] like Figure 7 The diagram shown is a schematic of a heat pipe 108. The heat pipe 108 includes a connecting portion 112 and an extension portion 113. The connecting portion 112 is connected to the component to be cooled. One end of the extension portion 113 is connected to the connecting portion 112, and the other end extends to the edge of the first end face 101. It should be noted that due to the installation location, the size and shape of different heat pipes 108 may vary.

[0105] The heat pipe 108 can be a symmetrical structure, wherein there are two extensions 113 and they are symmetrically arranged at both ends of the connecting part 112.

[0106] During installation, the heat-conducting substrate 110 of the LED bead 109 can be fixed to the first end face 101 by screws. The connecting portion 112 can be connected to the heat-conducting substrate 110 of the LED bead 109 by contact. When the LED bead 109 is working, the heat generated by the LED bead 109 is transferred to the connecting portion 112 through the heat-conducting substrate 110. The heat on the connecting portion 112 is transferred to the edge of the first end face 101 through the extension portion 113, so that the heat diffuses to the edge of the heat sink, thereby improving the heat dissipation efficiency.

[0107] To facilitate the contact between the heat-conducting substrate 110 of the LED bead 109 and the connecting portion 112, a contact surface 114 may be provided on the connecting portion 112 of the heat-conducting pipe 108, wherein the contact surface 114 is used to contact the heat-conducting substrate 110 of the LED bead 109. The heat-conducting substrate 110 may be made of metal materials such as aluminum.

[0108] To increase the heat conduction area, the contact surface 114 is flush with the first end face 101. Thus, both the contact surface 114 of the heat pipe 108 and the first end face 101 of the main body 100 can contact the heat-conducting substrate 110 of the lamp bead 109. When the lamp bead 109 is activated, the heat generated by the lamp bead 109 is transferred to the heat pipe 108 and the main body 100 through the heat-conducting substrate 110, thereby improving the heat conduction efficiency and enhancing the heat dissipation effect of the lamp bead 109.

[0109] Furthermore, thermally conductive silicone may be provided between the contact surface 114 and the first end face 101 and the thermally conductive substrate 110 of the lamp bead 109.

[0110] To improve heat conduction efficiency, multiple heat conduction pipes 108 are provided, wherein the extensions of these heat conduction pipes 108 are distributed on the first end face 101, and the connecting parts 112 are close to each other.

[0111] In addition, refer to Figure 13 In this embodiment, the second end face 102 includes a protrusion 1021 and a guide surface 1022. The protrusion 1021 is located at the geometric center of the second end face 102, and the protrusion 1021 protrudes toward the side away from the first end face 101. The guide surface 1022 is inclined from the protrusion 1021 toward the outer edge of the body 100. It should be noted that, for ease of observation, Figure 13 The portion of the second end face 102 that is obscured by the first heat sink 103 is filled in with solid lines.

[0112] In this embodiment, since the main body 100 has four sides, to avoid turbulence, the second end face 102 may include four sequentially connected guide surfaces 1022, each guide surface 1022 corresponding to one side of the main body 100. Adjacent guide surfaces 1022 are smoothly connected via curved surfaces or other structures. In other embodiments, the number of guide surfaces 1022 can be set according to the shape of the main body 100 and other factors. For example, the guide surface 1022 may be the second end face and a portion of a sphere.

[0113] The guide surface 1022 can be a plane or a curved surface that is concave towards the second end face 102.

[0114] When the heat sink is working, the fan is started. When the airflow generated by the fan passes through the second end face 102, the airflow flows along the guide surface 1022 and is discharged to the outside of the first heat conduction array module after passing the outer edge of the main body 100. The guide surface 1022 can quickly discharge the airflow generated by the fan, realizing rapid cooling of the LED beads or other heat-dissipating devices mounted on the first end face 101, thereby effectively improving the heat dissipation efficiency.

[0115] In this embodiment, the structure of the second end face 102 has the function of quickly discharging the airflow produced by the fan. While the airflow is continuously discharged, it can quickly carry away the heat generated by the device to be cooled, thereby achieving control of the heat sink temperature and providing a suitable operating temperature for the device to be cooled, effectively improving the service life of the device to be cooled.

[0116] See Figure 8 In this embodiment, a heat dissipation control method is also proposed. Based on the heat dissipation system described above, the method includes:

[0117] S1, Start the cooling fan 104 to dissipate heat from the device to be cooled;

[0118] S2, detect the air pressure P1 on the exhaust side of the cooling fan 104, and detect the air pressure P2 at the edge of the first heat conduction array module;

[0119] S3 compares P1 and P2 in real time and obtains the absolute value ΔP of the difference between them. When ΔP exceeds the preset range, the speed of the cooling fan 104 is dynamically adjusted so that ΔP is within the preset range and the temperature of the device to be cooled does not exceed the preset temperature.

[0120] In this embodiment, the speed model of the cooling fan 104 can be obtained through the following adjustment method, thereby achieving dynamic adjustment of the speed of the cooling fan 104. The adjustment method includes:

[0121] Obtain the current environmental status parameters of the device to be cooled;

[0122] Input the current environmental state parameters into the trained model to obtain the control parameters output by the model;

[0123] The cooling fan is controlled based on control parameters to optimize the heat dissipation of the lamp and ensure that the temperature of the components to be cooled does not exceed the preset temperature.

[0124] In this embodiment, the model is obtained by training a neural network model using sample data labeled with environmental state parameters, control parameters, and final temperature, and based on a loss function that minimizes the pressure difference between the inlet and outlet corresponding to the environmental state parameters.

[0125] The environmental state parameters, control parameters, and sample data of the final temperature are input into the model, and the model is trained through a neural network to find the loss function that minimizes the pressure difference between the inlet and outlet.

[0126] The fan speed can be controlled using FOC technology. FOC (Field-Oriented Control), also known as vector frequency conversion, is currently the best choice for efficiently controlling brushless DC motors (BLDC) and permanent magnet synchronous motors (PMSM).

[0127] FOC precisely controls the magnitude and direction of the magnetic field, resulting in smooth motor torque, low noise, high efficiency, and high-speed dynamic response.

[0128] Environmental parameters include: lamp orientation, air density, air velocity at a preset position on the lamp, wind noise at a preset position on the lamp, and wind pressure at a preset position on the lamp.

[0129] Alternatively, the lamp's posture can be detected using devices such as angle sensors and gyroscopes.

[0130] Alternatively, air density can be detected using devices such as gas density sensors.

[0131] Alternatively, air velocity can be detected using devices such as gas velocity sensors.

[0132] Alternatively, wind noise can be detected using devices such as a decibel meter.

[0133] Alternatively, wind pressure can be detected using devices such as wind pressure sensors.

[0134] In this embodiment, the control parameters include the fan speed.

[0135] Taking lighting fixtures as an example, by controlling the fan speed, the pressure difference between the air inlet and outlet is kept to a minimum, ensuring that the fixture temperature is less than or equal to the final temperature. This reduces irregular collisions of air within the airflow path, significantly lowering turbulent pressure and allowing heat to be expelled more quickly from the outlet. This heat dissipation control method reduces the impact of turbulence, maintaining stable laminar airflow within the flow path and effectively improving heat dissipation efficiency. Therefore, with a fixed fixture power, better heat dissipation can be achieved without replacing the fan with a higher speed or a larger heat sink.

[0136] Furthermore, in this embodiment, a storage medium is also proposed, on which a computer program is stored, and when the computer program is executed by the processor, it implements the above-mentioned heat dissipation control method.

[0137] In this embodiment, a lamp is also proposed, including a heating element and a heat dissipation system as described above, the heat dissipation system being used to dissipate heat from the heating element. The heating element is the device to be cooled mentioned above.

[0138] The heating element can be set as an LED bead 109. The LED bead 109 is mounted on a heat-conducting substrate 110, and the heat-conducting surface of the heat-conducting substrate 110 is in contact with the first end face 101, wherein the area of ​​the heat-conducting surface is less than or equal to the area of ​​the first end face 101.

[0139] In this embodiment, the center of the heat-conducting surface is located on the central axis of the first end face 101. The central axis of the first end face 101 is a straight line passing through the geometric center of the first end face 101 and perpendicular to the first end face 101.

[0140] The heat from the LED chip 109 is transferred to the first end face 101 of the heat sink via the thermally conductive substrate 110, thereby achieving heat dissipation for the LED chip 109. The larger the area of ​​the thermally conductive surface of the thermally conductive substrate 110, the better the thermal conductivity. However, if the area of ​​the thermally conductive surface is larger than the area of ​​the first end face 101, it will affect the heat transfer between the thermally conductive substrate 110 and the heat sink, and thus affect the heat dissipation effect of the LED chip 109. Therefore, the area of ​​the thermally conductive surface is less than or equal to the area of ​​the first end face.

[0141] Preferably, the area of ​​the heat-conducting surface is equal to the area of ​​the first end face 101.

[0142] In this embodiment, when the area of ​​the heat-conducting surface is smaller than the area of ​​the first end face 101, the heat-conducting substrate 110 is completely located within the first end face 101 when projected perpendicular to the first end face 101; when the area of ​​the heat-conducting surface is equal to the area of ​​the first end face 101, the heat-conducting substrate 110 coincides with the first end face 101 when projected perpendicular to the first end face 101.

[0143] Example 2

[0144] See Figures 9-12 The main difference between this embodiment and Embodiment 1 is that the first heat sink 103 adopts a plate-like structure and is parallel to the second end face 102. The second heat sink 107 is perpendicular to the first end face 101, and the second end face 102 is planar and parallel to the first end face 101.

[0145] like Figure 9 As shown, the first heat sinks 103 are arranged in parallel from top to bottom, thus forming the first heat-conducting array module. A through hole is provided in the middle of the first heat sink module, which passes through all the first heat sinks 103 and ends at the second end face 102 of the main body 100. This through hole is the mounting cavity.

[0146] like Figure 12 As shown, in this embodiment, a plurality of pillars 115 are provided on the second end face 102. The pillars 115 can be made of materials with high thermal conductivity, such as copper or aluminum. The pillars 115 are inserted into and penetrate each of the first heat sinks 103 of the first heat conduction array module, thereby realizing the installation of the first heat conduction array module.

[0147] The column 115 is perpendicular to the first end face 101. The column 115 and the main body 100 can be an integral structure, or the column 115 and the main body 100 can be connected by means of threaded connection, plug-in connection or other means.

[0148] like Figure 10 As shown, in order to ensure the gap between adjacent first heat sinks 103, washers 116 can be fitted on the column 115. Specifically, washers 116 can be provided between any two adjacent first heat sinks 103 on the column 115.

[0149] After the installation of the topmost heat sink 103 is completed, a threaded connector 117 can be screwed onto the top of the column 115 to fix the first heat conduction array module. The threaded connector 117 can be a nut or a bolt.

[0150] In other embodiments, the column 115 may extend to the first end face 101 and contact the device to be cooled. In this way, the heat from the device to be cooled can be transferred to the first heat-conducting array module through the column 115.

[0151] like Figure 11 As shown, in this embodiment, a recessed groove 118 may be provided on the first end face 101, wherein the heat-conducting substrate 110 of the lamp bead 109 may be threadedly connected to the bottom surface of the groove 118.

[0152] The shape of the settling tank 118 can be cylindrical. Specifically, the shape of the settling tank 118 can also be set as needed, such as cuboid.

[0153] The heat sink is not limited to having only one first heat conduction array module and one second heat conduction array module, one mounting cavity and one fan. Multiple sets of first and second heat conduction array modules and fans are all within the protection range on one main body.

[0154] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0155] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A heat dissipation system, characterized by, Includes a heat sink, a detection module, and a control module; The heat sink includes a main body, which includes a first end face and a second end face, wherein the first end face and the second end face are opposite to each other; the first end face is used to mount the device to be cooled; a first heat-conducting array module composed of multiple first heat sinks is disposed on the second end face, wherein there is a gap between any two adjacent first heat sinks to achieve four-way ventilation; a mounting cavity is disposed in the middle of the first heat-conducting array module, and a cooling fan is installed in the mounting cavity; the bottom surface of the mounting cavity is coplanar with the second end face, and the sides of the mounting cavity are surrounded by the first heat-conducting array module; a second heat-conducting array module composed of multiple second heat sinks is disposed on the bottom surface of the mounting cavity, the top of the second heat-conducting array module faces the cooling fan, wherein there is a gap between any two adjacent second heat sinks; the top of the second heat sink faces the cooling fan, and the bottom of the second heat sink is connected to the second end face; The detection module includes a first air pressure sensor and a second air pressure sensor, wherein the first air pressure sensor is used to detect the first air pressure P1 on the air outlet side of the cooling fan, and the second air pressure sensor is used to detect the second air pressure P2 at the edge of the first heat conduction array module. The control module is used to compare P1 and P2 in real time and obtain the absolute value ΔP of the difference between them. When ΔP exceeds a preset range, the speed of the cooling fan is dynamically adjusted so that ΔP is within the preset range and the temperature of the device to be cooled does not exceed a preset temperature.

2. The heat dissipation system of claim 1, wherein, Dynamically adjusting the speed of the cooling fan includes: The speed of the cooling fan is linearly adjusted according to the degree of deviation between the current temperature of the device to be cooled and the preset temperature; When the temperature of the device to be cooled is higher than the preset temperature, while keeping ΔP constant within the preset range, the speed of the cooling fan is gradually reduced until the temperature of the device to be cooled reaches the preset temperature.

3. The heat dissipation system of claim 1, wherein, Dynamically adjusting the speed of the cooling fan includes: The temperature of the device to be cooled is adjusted non-linearly based on the degree of deviation between the current temperature and the preset temperature. When the temperature of the device to be cooled is higher than the preset temperature, while keeping ΔP constant within the preset range, the speed of the cooling fan is kept at the maximum speed until the temperature of the device to be cooled reaches the preset temperature.

4. The heat dissipation system of claim 1, wherein, The cooling fan includes a frameless fan or a centrifugal fan; a heat pipe is provided on the first end face, and the heat pipe is connected to the device to be cooled. The second end face includes a protrusion and a guide surface; The protrusion is located at the geometric center of the second end face, and the protrusion protrudes toward the side away from the first end face; The guide surface is inclined from the protrusion toward the outer edge of the main body.

5. The heat dissipation system of claim 4, wherein, A groove is provided on the first end face, and the heat pipe is installed in the groove; The heat pipe includes a connecting part and an extension part. The connecting part is connected to the heat dissipation component. One end of the extension part is connected to the connecting part, and the other end extends to the edge of the first end face. The connecting part is provided with a contact surface, and the device to be cooled is in contact with the contact surface, wherein the contact surface is flush with the first end face.

6. The heat dissipation system of claim 5, wherein, There are multiple heat pipes; The extensions of the multiple heat pipes are distributed on the first end face, and the connecting portions are close to each other.

7. A heat dissipation control method based on the heat dissipation system according to any one of claims 1 to 6, characterized by, The method includes: Obtain the current environmental status parameters; Input the current environmental state parameters into the trained model to obtain the control parameters output by the model; Turn on the cooling fan to dissipate heat from the components to be cooled; The first air pressure P1 on the exhaust side of the cooling fan and the second air pressure P2 at the edge of the first heat conduction array module are detected. P1 and P2 are compared in real time to obtain the absolute value ΔP of their difference. When ΔP exceeds a preset range, the speed of the cooling fan is dynamically adjusted based on the control parameters so that ΔP is within the preset range and the temperature of the device to be cooled does not exceed a preset temperature.

8. A storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the heat dissipation control method as described in claim 7.

9. A lamp, characterized in that, It includes a heating element and a heat dissipation system according to any one of claims 1-6, wherein the heat dissipation system is used to dissipate heat from the heating element.

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