Innovative three-dimensional u-shaped architecture for aesa system transmit / receive modules

Abstract

The present invention relates to an active electronically steerable antenna (20, 30, 40, 7, 100, 200, 300, 400) comprising a planar or quasi-planar radiating array configured to transmit and / or receive radio frequency or microwave signals and a plurality of three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301), each arranged behind and coupled to a respective planar or quasi-planar radiating subarray of N radiating elements (502), the N radiating elements (502) being arranged in two rows or two columns, each row or column having N / 2 radiating elements (502), where N is an even number. Each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) includes: a respective bottom wall (11, 57); two respective side walls (12, 13, 51) orthogonally arranged about the respective bottom wall (11, 57) to form a respective three-dimensional U-shaped structure, and each is arranged behind a respective row or column of N / 2 radiating elements (502) of the respective planar or quasi-planar radiating subarray; and respective transmitting and / or receiving electronics distributed on the respective bottom wall (11, 57) and side walls (12, 13, 51) and configured to implement N respective transmitting and / or receiving modules; for each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301), the respective transmitting and / or receiving electronics includes: For each of its respective sidewalls (12, 13, 51), N / 2 respective transmit and / or receive front-end modules (59, 6) are mounted on the respective sidewalls (12, 13, 51) and coupled to the N / 2 radiating elements (502) of the respective rows or columns of the respective planar or quasi-planar radiating subarrays, and are configured to implement power amplifiers (121, 131, 92), low-noise amplifiers (122, 132, 93), and switches or circulators (122, 132, 91); and respective bottom-wall electronics are mounted on the respective bottom walls (11, 57), connected to the N respective transmit and / or receive front-end modules (59, 6), and configured to perform beam steering functions including signal phase shifting and attenuation and / or amplification functions.

Description

[0001] Cross-reference to related applications

[0002] This patent application claims priority to Italian patent application No. 102020000025723, filed on October 29, 2020, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The present invention generally relates to an active electronically steerable (or steerable) antenna (AESA) (sometimes also called an active electronically scanned array), and more specifically, to an innovative three-dimensional (3D) U-shaped architecture for a transmit and / or receive (T / R) module for an AESA (specifically, a planar or quasi-planar AESA). Background Technology

[0004] As is well known, there is a growing need for systems that offer greater flexibility, integration, and functionality for a wide range of radar, communications, data link, and electronic warfare (EW) applications, driving the continued demand for low-cost, compact, and modular AESA solutions.

[0005] Specifically, one of the most important current trends in electronic devices relates to improving system integration, flexibility, and functionality in order to achieve:

[0006] • Weight reduction and miniaturization to allow the platform to be equipped with a complete sensor suite, enabling it to perform tasks characterized by high operational performance and requirements;

[0007] • Reduce costs; and

[0008] • Low thickness and minimal impact on platform shape.

[0009] These aspects are particularly important for drone platforms because payload size, weight, and power consumption are significant limiting factors.

[0010] In any case, these aspects are also very meaningful and applicable to any other type of platform.

[0011] In this regard, it is worth noting that while on the one hand, AESA-based systems represent the only suitable solution to meet market requirements, on the other hand, traditional AESA systems are bulky and, of course, not thin, with high requirements in terms of cooling, power supply, and weight.

[0012] Figure 1 a) Describes an example of a traditional AESA architecture. Specifically, Figure 1 a) is a sectional view of a traditional planar AESA, whose main parts typically include:

[0013] • The flat panel assembly, which represents the front-loaded part of an AESA, provides controlled transmission and reception of radio frequency (RF) signals through a transmit and / or receive (T / R) module (hereinafter also referred to as TRM), which is the basic building block of any AESA;

[0014] • Radio frequency interface, which is designed to segment and / or combine radio frequency signals in transmission and / or reception;

[0015] • Radio frequency manifolds, or radio frequency networks, distribute radio frequency signals from the flat panel assembly to the radio frequency interface and vice versa; and

[0016] • The motherboard provides electronic (power and control) interfaces between the flat panel components and sub-components, and also functions as the external logic interface manager for AESA.

[0017] also, Figure 1 b) Sketch an example of a traditional flat panel component architecture in an assembled configuration to show how the number of components to be installed results in a large overall thickness of the flat panel component.

[0018] In fact, to achieve high performance, an AESA requires hundreds (or even thousands) of Transmitter Resonators (TRMs) arranged within a flat panel assembly and behind the AESA's radiating element. Each TRM includes electronic components such as a high-power amplifier (HPA), a low-noise amplifier (LNA), a T / R limiter, a core chip (which includes digitally controlled phase shifters and attenuators, drivers / preamplifiers, transmit / receive (Tx / Rx) switches), a controller, switches and / or circulators for routing RF signals between the transmit and receive paths, and other optional components (filters, preamplifier stages, etc.). Figure 2 An example of a typical TRM layout is shown, indicating some of the main electronic components.

[0019] Because of the large number of components and their integration, two main issues need to be considered:

[0020] 1) AESA's overall dimensions --In fact, on the one hand, the large number of components to be included in the T / R module will require a large space envelope, but on the other hand, the operating frequency also imposes limitations on the size of the AESA in terms of the distance between adjacent radiating elements; specifically, higher frequencies require tighter lattice spacing between active elements, making it increasingly difficult to fit all the electronic components into a single layer; this becomes even more challenging for applications that require λ / 2 spacing (i.e., half the wavelength at the transmission frequency) or smaller for wide scanning and reducing unwanted grating lobes; to meet both the constraints of accommodating all the electronic components of the T / R module and adapting to the lattice spacing, traditional planar architectures typically extend laterally to the radiating elements, thus increasing the overall thickness of the AESA;

[0021] 2) Power dissipation --In fact, due to the typical low power efficiency of T / R modules and the proximity of components, AESA typically needs to dissipate a large amount of heat, which must be properly extracted to avoid overheating and failure. Traditional air cooling systems are not suitable for the high component density of AESA. Therefore, modern AESA are liquid-cooled, which leads to increased power and weight requirements, which in turn limits the installability of AESA systems on air platforms.

[0022] In this regard, several known solutions related to power dissipation / thermal management of active phased arrays, AESA, antenna / RF systems, and electronic devices / equipment will be presented and briefly discussed below.

[0023] US 8,937,574 B2 relates to a lightweight, air-cooled transmitter / receiver unit and an active phased array including the unit. Specifically, the lightweight, air-cooled transmitter / receiver unit includes a first outer cover, opposing second outer covers, and a central housing unit including thermal management devices inserted between the first and second outer covers. A transmitter / receiver circuit board, including components for at least one channel and integrated and common radiating elements, is inserted between the first surface of the central housing unit and the first outer cover, and a controller circuit board and a power converter circuit board are inserted between opposing second surfaces of the central housing unit and the second outer cover.

[0024] US 9,172,145 B2 relates to a transmit / receive daughter card with an integrated circulator. Specifically, US 9,172,145B2 discloses a mixed-signal, multilayer printed circuit board (PWB) manufactured in a single lamination step. The PWB includes one or more radio frequency interconnects between different circuit layers on different circuit boards constituting the PWB. The PWB includes a number of unit cells with radiating elements, and a radio frequency cage placed around each unit cell to isolate the unit cell. Multiple flip-chip circuits are placed on the outer surface of the PWB, and a heat sink can be placed on the flip-chip component.

[0025] US 6,975,267 B2 and US 7,132,990 B2 relate to low-profile AESA for Ka-band radar systems. Specifically, US 6,975,267 B2 and US 7,132,990 B2 disclose a vertically integrated Ka-band AESA that, among other things, includes a transition radio frequency waveguide repositioning plate located behind a radiator panel and beam control tile arrays coupled to one of a plurality of transceiver modules via radio frequency manifolds. Each beam control tile includes its own plurality of high-power T / R units, as well as dielectric waveguides, radio frequency striplines, and coaxial transmission line elements. The waveguide repositioning plate is preferably stacked from diffuse-bonded copper laminates filled with dielectric material. The beam control tiles are preferably made by co-laminating multiple layers of low-temperature co-fired ceramic (LTCC) material. The waveguide repositioner panel and beam control tile are designed to route RF signals to and from the respective transceiver modules in the four transceiver modules and an orthogonal array of antenna radiators that match the free space formed in the panel. Planar metal spring washers are positioned between the interface layers to provide and ensure interconnection between the mutually facing waveguide ports and to prevent RF leakage from the periphery of the waveguide ports. Cooling of the various components is achieved through a pair of planar forced-air heat sinks located on either side of the beam control tile array. DC power and control for the T / R unit are provided by a printed circuit board assembly located near the beam control tile array, with solderless DC connections provided by arranged "fuzzy button" electronic connector elements.

[0026] US 7,859,835 B2 relates to methods and apparatus for thermal management of radio frequency (RF) systems. Specifically, US 7,859,835 B2 discloses a thermal management system comprising an air duct assembly including a supply air duct having an inlet, a return air duct having an outlet, and a plurality of distribution air ducts configured to fluidly communicate with the inlet of the supply air duct and the outlet of the return air duct. A fan is disposed within the air duct assembly to direct air from the inlet of the supply air duct through the supply air duct and out of the outlet of the return air duct. The fan and the supply air duct are positioned to direct air through a first surface of a heat sink. A second opposing surface of the heat sink is disposed above a plurality of active circuits on the first surface of the RF multilayer PWB and is configured to make thermal contact therewith.

[0027] US 8,355,255 B2 relates to cooling of coplanar active circuits. Specifically, US 8,355,255 B2 discloses a system comprising a first circuit board on which an integrated circuit is disposed, a first heat diffuser of the integrated circuit coupled to the first circuit board, a first compatible board coupled to the first circuit board, a second circuit board on which the integrated circuit is disposed, and a second heat diffuser of the integrated circuit coupled to the second circuit board. The first circuit board and the first heat diffuser have a first thickness. The second circuit board and the second heat diffuser have a second thickness. The system also includes a second compatible board coupled to the second circuit board, a board assembly coupled to the first and second compatible boards, and a cold plate assembly in contact with the first and second heat diffusers. Either the first or second compatible board is configured to expand or contract to account for the difference between the first and second thicknesses.

[0028] EP 2 368 291 A1 relates to a cooling architecture, particularly for active modular antennas. Specifically, EP 2 368 291 A1 relates to air circulation cooling of electronic equipment arranged in stacked rows within a rack or cabinet. More specifically, the solution according to EP 2 368 291 A1 relates to the structure of an active modular antenna and is designed to replace conventional ventilation systems that involve circulating airflow through rows of devices in series and carrying away heat dissipated by the devices as the airflow propagates therethrough. More specifically, the solution according to EP 2 368 291 A1 includes adding an air cooling device arranged in a manner that refreshes the forced airflow as it leaves one row of devices and before reaching the next row.

[0029] US 2008 / 0209931 A1 relates to a cooling system for cooling processing equipment in a data center. The cooling system includes a vertical conduit carrying a cooling fluid and an array of elongated thermally conductive elements (such as heat pipes) extending laterally outward from the conduit. The inner end portion of each thermally conductive element is in thermal contact with the cooling fluid flowing in the conduit, and the outer end portion of each thermally conductive element is adapted to make conductive thermal contact with at least one heat-generating electronic component.

[0030] WO 2016 / 065485 A1 relates to a heat dissipation system or apparatus that provides a method for mounting and electrically connecting heat dissipation electronic equipment (preferably in a radial geometry) while achieving good surface-to-surface clamping force (in variations of liquid cooling and / or air cooling).

[0031] US 2017 / 0323843 A1 relates to an air-cooled 3D integrated circuit (IC) with wireless interconnection, wherein the 3D IC includes two or more stacks of one or more active layers, an air-cooled layer separating the two or more stacks, and a wireless interconnection enabling communication between the two or more stacks.

[0032] WO 2014 / 206578 A2 relates to housings, cooling bodies, and methods for generating cooling bodies for cooling electrical and / or electronic components. Specifically, the convection cooling housing according to WO 2014 / 206578 A2 includes a plurality of openings on the upper side of the housing, and a cooling body including at least one fin arranged on the upper side of the housing in such a way that airflow through the housing is directly directed to the fin arranged above.

[0033] US 7,289,327 B2 relates to an active cooling method and apparatus for a module. Specifically, US 7,289,327 B2 discloses a circuit module including a system for reducing thermal variations and cooling the circuit module. The circuit module includes a thermally conductive rigid substrate having a first side and a second side, an edge, and an integrated cooling component. The integrated cooling component reduces thermal variations and cools the circuit module. A flexible circuit, filled with multiple integrated circuits and exhibiting connection facilities including multiple contacts for use with edge connectors, is wrapped around the edge of the thermally conductive substrate. Heat from the multiple integrated circuits is thermally conducted through the thermally conductive substrate to the integrated cooling component.

[0034] US 9,161,478 B2 relates to apparatus and methods for using active antenna heat sinks. Specifically, US 9,161,478 B2 teaches how to improve heat dissipation in a host equipment configuration for a vertical array setup by incorporating a heat sink with a shunting fin architecture. The shunting fin architecture comprises two or more sets of angled fins separated by a central duct, which allows convective cooling air to flow in and / or exhaust more efficiently above the heat sink. The shunting fin arrangement may include inwardly angled fins to draw convective cooling air inward from a horizontal inlet, in which case warm exhaust air is exhausted through the central duct. Conversely, the shunting fin arrangement may include outwardly angled fins that draw in convective cooling air from the central duct and exhaust warm air through a horizontal exhaust port. The shunting fin arrangement works well when the host equipment is horizontally configured, allowing for greater flexibility in host equipment configuration.

[0035] Finally, US 2009 / 231197 A1 discloses a digital beamforming antenna and an associated data link array, wherein the latter includes transmit array elements and receive array elements. Each array element includes a processor. Modulation and demodulation functions are performed on the processor of each array element. The modulation and demodulation functions utilize receive time offsets and phase shifts and transmit time offsets and phase shifts, respectively. The receive time offsets and phase shifts, as well as the transmit time offsets and phase shifts, are determined by a central processing unit to beamform the received and transmitted signals, respectively. The array elements are arranged in a daisy-chain manner to facilitate communication of control parameters, facilitate communication of bits to be transmitted and distributed, combine demodulated baseband samples from one array element to another, and communicate the combined samples to the central processing unit. Summary of the Invention

[0036] In view of the above, the applicant believes that in-depth research is needed to develop an innovative architecture for AESA systems (specifically, for planar or quasi-planar AESA) that focuses on improving power efficiency, reducing power requirements, air-cooled thermal management, reducing AESA thickness and weight to improve installation feasibility, facilitating testing and calibration, simplifying AESA control, and modularity and flexibility of the architecture, thus leading to the present invention.

[0037] Therefore, the object of this invention is to provide a low-cost architectural solution for planar or quasi-planar AESA systems that offers the same high performance as traditional planar or quasi-planar AESA solutions, and further, it can achieve:

[0038] • Improve power efficiency and reduce power requirements;

[0039] • Air-cooled thermal management;

[0040] • Reduce the thickness and weight of AESA to improve installation feasibility;

[0041] • Easy to test and calibrate;

[0042] • Simplify AESA control; and

[0043] • Modular and flexible architecture.

[0044] This invention achieves this and other objectives because it relates to an active electronically steerable antenna (AESA), as defined in the appended claims.

[0045] Specifically, the AESA according to the present invention includes a planar or quasi-planar radiating array configured to transmit and / or receive radio frequency or microwave signals, and a plurality of 3D U-shaped modules, each 3D U-shaped module being arranged behind and coupled to a respective planar or quasi-planar radiating subarray of N radiating elements, the N radiating elements being arranged in two rows or two columns, each row or column having N / 2 radiating elements, where N is an even number.

[0046] Each 3D U-shaped module includes:

[0047] • Each of their own bottom walls;

[0048] • Each of the two sidewalls,

[0049] - Arranged orthogonally to their respective base walls to form their respective 3D U-shaped structures, and

[0050] - Each element is arranged after its respective row or column of N / 2 radiating elements in its respective planar or quasi-planar radiating subarray; and

[0051] • Distributed on each of the bottom and side walls and configured to implement each of the N respective transmitting and / or receiving electronic devices for transmitting and / or receiving modules;

[0052] In addition, for each 3D U-shaped module, the respective transmitting and / or receiving electronics include:

[0053] For each of its respective sidewalls, there are N / 2 separate transmitting and / or receiving front-end modules, which are...

[0054] - Installed on their respective sidewalls

[0055] -N / 2 radiating elements coupled to their respective rows or columns of planar or quasi-planar radiating subarrays, and

[0056] -Configured to implement power amplifiers, low-noise amplifiers, and switches or circulators; and

[0057] • Each bottom-wall electronic device, mounted on its own bottom wall, is connected to N respective transmitting and / or receiving front-end modules and is configured to perform beam steering functions, including signal phase shifting, as well as attenuation and / or amplification functions. Attached Figure Description

[0058] To better understand the invention, preferred embodiments will now be described with reference to the accompanying drawings (all not to scale), which are intended to be exemplified purely by way of non-limiting means, wherein:

[0059] · Figure 1 a) and Figure 1b) Delineate the traditional AESA architecture in the exploded configuration and the traditional flat panel component architecture in the assembled configuration respectively;

[0060] · Figure 2 Delineate the traditional T / R module layout;

[0061] · Figure 3 a) and Figure 3 b) Outline the first 3D U-shaped module according to an exemplary embodiment of the present invention;

[0062] · Figure 4 a) and Figure 4 b) Delineate the second 3D U-shaped module and the corresponding AESA based thereon according to an exemplary embodiment of the present invention;

[0063] · Figure 5 a) and Figure 5 b) Delineate the third 3D U-shaped module and the corresponding AESA based thereon according to an exemplary embodiment of the present invention;

[0064] · Figure 6 Another example of an AESA according to an exemplary embodiment of the present invention is shown;

[0065] · Figure 7A and Figure 7B The 3D U-shaped module architecture in exploded configuration and assembled configuration according to exemplary embodiments of the present invention are shown respectively. Figure 7C and Figure 7D Its top and bottom views are shown respectively;

[0066] · Figure 8A and Figure 8B Outline Figure 7A , Figure 7B , Figure 7C and Figure 7D An example of the implementation of electronic components in a 3D U-shaped modular architecture;

[0067] · Figure 9 An example of an integrated Tx / Rx front-end module layout for a Tx / Rx front-end electronic device that can be advantageously used to implement a 3D U-shaped module is illustrated schematically according to an exemplary embodiment of the invention.

[0068] · Figure 10 An example of an AESA architecture using a 3D U-shaped module according to an exemplary embodiment of the present invention is described;

[0069] · Figure 11 An example of two 3D U-shaped modules arranged side by side according to an exemplary embodiment of the present invention is shown;

[0070] · Figure 12 , Figure 13 a) and Figure 13 b) shows the results of the first thermal analysis performed on a planar AESA antenna including a 3D U-shaped module;

[0071] · Figure 14 The results of a second thermal analysis performed on a planar AESA antenna including a 3D U-shaped module are shown.

[0072] · Figure 15 and Figure 16 Two alternative methods for forcing airflow through an AESA, including a 3D U-shaped module, are outlined.

[0073] · Figure 17 a) and Figure 17 b) shows the results of a third thermal analysis performed on a planar AESA antenna including a 3D U-shaped module; and

[0074] · Figure 18 a) and Figure 18 b) Sketch examples of possible combinations of 3D U-shaped modules used to obtain antennas with different shapes / sizes. Detailed Implementation

[0075] The following description is presented to enable those skilled in the art to make and use the invention. Various modifications to the embodiments will be apparent to those skilled in the art without departing from the scope of the invention as claimed. Therefore, the invention is not intended to be limited to the embodiments shown and described, but is given the broadest scope of protection consistent with the features defined in the appended claims.

[0076] The present invention relates to an innovative architecture for a transmit and / or receive (T / R) module for a planar or quasi-planar AESA (conveniently, a planar / quasi-planar full-fill AESA), which, among other things, allows for a reduction in the overall size of the AESA and optimization of cooling requirements.

[0077] Specifically, the innovative architecture is based on a 3D U-shaped modular structure, which includes a bottom wall and two side walls, preferably a bottom printed circuit board (PCB) and two side PCBs, wherein:

[0078] • All electronic components of the multiple T / R modules are distributed on the bottom and side walls (preferably on the bottom PCB and side PCB); and

[0079] • The three walls (preferably the three-sided PCB) are conveniently enclosed and mounted in a metal structure designed to facilitate heat exchange and cooling.

[0080] Therefore, depending on the desired AESA characteristics in terms of shape and number of radiating elements, a full-plane or quasi-plane AESA can be achieved by grouping an appropriate number of 3D U-shaped modules arranged side by side.

[0081] In other words, the innovative architecture according to the invention is based on a 3D distribution of electronic components (i.e., T / R modules and other electronic components) required for realizing the transmit and / or receive (Tx / Rx) front-end, amplification and beam steering functions of an AESA, wherein 3D U-shaped modules are used as basic building blocks to manufacture planar or quasi-planar AESA.

[0082] The present invention has been conceived to alleviate some of the major problems affecting traditional AESA technology when high performance is required, namely:

[0083] • Utilizes liquid cooling, high-power supply, and heavy weight; and

[0084] • High thickness and strong influence on aircraft shape and installation.

[0085] In fact, as previously explained, for certain applications, these issues associated with traditional AESA technology can represent strong limitations in terms of installation feasibility.

[0086] Conversely, the innovative 3D distribution of the T / R module components according to the invention (under which all solid-state electronic components are conveniently mounted on a PCB arranged to form a U-shaped structure) enables the affordable implementation of front-end, amplification, and beam steering tasks for planar or quasi-planar AESA systems with less thickness, lower cost and weight, and less stringent cooling requirements.

[0087] To better understand the present invention, Figure 3 a) and Figure 3 b) Delineate the first 3D U-shaped module (represented by 1) according to an exemplary embodiment of the present invention.

[0088] Specifically, the first 3D U-shaped module 1 is elongated in the longitudinal direction, and it is orthogonal to the parallel plane on which the U-shape is defined / depends.

[0089] More specifically, Figure 3 a) is a schematic cross-sectional view of the first 3D U-shaped module 1 on the plane in which its U-shape is defined / depended (i.e., orthogonal to its longitudinal dimension), wherein the first 3D U-shaped module 1:

[0090] ·include

[0091] - Bottom PCB 11, and

[0092] - Two side PCBs 12 and 13 are orthogonally arranged relative to the bottom PCB 11 to form a 3D U-shaped structure elongated in the longitudinal direction; and

[0093] • It is designed to implement eight T / R modules, with its electronic components distributed between the bottom PCB and the side PCBs 11, 12, and 13.

[0094] also, Figure 3 (b) An example of the distribution of the electronic components of the eight T / R modules of the first 3D U-shaped module 1 on the bottom PCB and side PCBs 11, 12, 13 is shown. Specifically, two core chips 110 are mounted / mounted on the bottom PCB 11 and connected to the transmit and / or receive (Tx / Rx) front-end electronics mounted / mounted on the side PCBs 12, 13 to drive the Tx / Rx front-end electronics. More specifically, the two core chips 110 are conveniently configured to perform signal phase shifting, attenuation and / or amplification, switching and splitting and / or combining, while the Tx / Rx front-end electronics are conveniently configured to perform power amplification in transmit (Tx), low-noise amplification in receive (Rx), and Tx / Rx switching. In detail, the Tx / Rx front-end electronics include, for each of the two side PCBs 12, 13, four respective power amplifiers (PAs) 121, 131, four respective low-noise amplifiers (LNAs) 122, 132, and four respective Tx / Rx switches or circulators 123, 133, whereby each of the two side PCBs 12, 13 is designed to couple to and drive the four respective RF transmitting and receiving elements (i.e., radiating elements) of the AESA. Preferably, the two side PCBs 12, 13 are spaced apart at a distance of approximately λ / 2, where λ represents the operating wavelength.

[0095] To manufacture a complete AESA, the number and size of the 3D U-shaped modules used depend on the required dimensions of the complete AESA, i.e., the number of T / R modules required. In fact, each 3D U-shaped module comprises N of the total number of TRMs in the AESA. Due to the U-shaped layout, the Tx / Rx front ends of the N TRMs are divided between the two sidewalls of the 3D U-shaped module. When oriented horizontally, the 3D U-shaped module can be viewed as a small AESA comprising two rows and N / 2 columns, where N can be the number of TRMs required for the AESA, or a multiple thereof. Therefore, the total dimensions of the AESA can be achieved by grouping an appropriate number of identical basic 3D U-shaped modules arranged side-by-side in the vertical direction. In this respect, Figure 4 a) A second 3D U-shaped module 2 according to an exemplary embodiment of the present invention is outlined, wherein the second 3D U-shaped module 2 implements 24 TRMs arranged in 2 rows and 12 columns. Furthermore, Figure 4 b) Sketch an example of an AESA (represented by 20 for the whole), which includes three or more second 3D U-shaped modules 2 arranged side by side in the vertical direction (72 or more TRMs in total).

[0096] Similarly, a 3D U-shaped module can be viewed as a small AESA consisting of N / 2 rows and two columns; therefore, an AESA can be implemented as needed by grouping an appropriate number of identical basic 3D U-shaped modules side-by-side in the horizontal direction. In this respect, Figure 5 a) A third 3D U-shaped module 3 according to an exemplary embodiment of the present invention is outlined, wherein the third 3D U-shaped module 3 implements 24 TRMs arranged in 12 rows and 2 columns. Furthermore, Figure 5 b) Sketch an example of an AESA (represented by 30 for the whole), which includes three or more third 3D U-shaped modules 3 arranged side by side in the horizontal direction (72 or more TRMs in total).

[0097] Clearly, AESA can also be achieved by conveniently grouping an appropriate number of identical basic 3DU-shaped modules arranged side-by-side in both the vertical and horizontal directions. In this respect, Figure 6 Another example of an AESA (indicated by 40) according to an exemplary embodiment of the present invention is shown, which includes a plurality of identical basic 3DU-shaped modules arranged side by side in both the vertical and horizontal directions.

[0098] Using basic 3D U-shaped modules to form AESA offers significant benefits in simplifying design, manufacturing, testing, and verification, while also contributing to overall development and reducing production costs.

[0099] Therefore, as previously explained, the present invention relates to an innovative 3D architecture for grouping and distributing components for a TRM in a compact, air-cooled AESA antenna by mounting the components (preferably packaged COTS – i.e., commercially available or off-the-shelf components) on three different PCBs and arranging them in a U-shaped structure – for example, as Figure 3 a) and Figure 3 b) is illustrated schematically to fit all solid components into a fully filled AESA lattice.

[0100] Conveniently, the three independent PCBs are interconnected in the front area and supported by a specific metal structure, which ensures effective airflow through the T / R module to promote heat exchange and cooling. Fin profiles can also be easily used to improve cooling efficiency.

[0101] Figure 7AA more detailed 3D U-shaped module architecture in an exploded configuration according to an exemplary embodiment of the present invention is described.

[0102] Specifically, Figure 7A A fourth 3D U-shaped module 5 is shown, which is elongated in a longitudinal direction orthogonal to the parallel plane on which the U-shape is defined / depended, and it includes:

[0103] • Two longitudinally elongated side PCBs 51, which are adapted to Tx / Rx front-end electronics (e.g., PA, LNA and circulator or switch) to perform Tx / Rx front-end functions;

[0104] • The vertically elongated bottom PCB is adapted to

[0105] - The core chip is configured to perform signal phase shifting, attenuation and / or amplification, switching and splitting and / or combining, and

[0106] -PCB controller 52, which is connected to the AESA main controller via connector 53 ( Figure 7A (Not shown in the image), used for distributed control of the TRM and a complete simplification of the interface with the AESA master controller (to put it simply, each U-shaped module can also be used for multiple PCB controllers, depending on the size);

[0107] • Two longitudinally elongated side mechanical supports 54 (preferably two metal side mechanical supports 54) are arranged / mounted on the outside of the side PCB 51 and are preferably equipped with heat sinks;

[0108] A longitudinally elongated U-shaped central mechanical support 55 (preferably a metal U-shaped central mechanical support 55) is arranged / mounted on / above the bottom PCB between the side PCBs 51 and adapted with longitudinally elongated air ducts (or channels) 551 for air delivery and therefore for air cooling of the bottom PCB and its electronic equipment, as well as the side PCBs 51 and their Tx / Rx front-end electronic equipment; and

[0109] • A longitudinally elongated bottom mechanical support 56 (preferably a metal bottom mechanical support 56) is arranged / mounted on the bottom PCB.

[0110] Figure 7BThe assembly configuration of the fourth 3D U-shaped module 5 is described, wherein the bottom PCB is mounted on the bottom mechanical bracket 56, the U-shaped central mechanical bracket 55 is mounted on / above the bottom PCB and inserted between the side PCBs 51 (specifically, between the upper / front surfaces on which the Tx / Rx front-end electronics are mounted / mounted), and two side mechanical brackets 54 are mounted on the outside of the side PCBs 51 (specifically, each located on the bottom / back side of its respective side PCB 51), thereby enclosing the 3D U-shaped structure formed by the bottom PCB and the side PCBs 51 within the 3D U-shaped metal structure formed by the bottom mechanical bracket 56 and the side mechanical brackets 54.

[0111] also, Figure 7C and Figure 7D The top and bottom views of the fourth 3D U-shaped module 5 are shown respectively, where:

[0112] ·like Figure 7C As shown, the airway 551 is closed at the top by a longitudinally elongated metal element 501;

[0113] · Figure 7C ( Figure 7D The diagram also shows twenty-four radiating elements 502 connected to Tx / Rx front-end electronics on the side PCB 51; and

[0114] · Figure 7D The diagram shows six input / output split / combination ports 503 connected to the core chip on the bottom PCB, preferably to six corresponding core chips, each designed to drive four respective radiating elements 502.

[0115] in this regard, Figure 8A An example of the implementation of electronic components mounted / hung on the two side PCBs 51 and the bottom PCB of the fourth 3D U-shaped module 5 is described, wherein:

[0116] The Tx / Rx front-end electronics (including PA, LNA, and circulators or switches) on the side PCB 51 are implemented using discrete components; and

[0117] The core chip on the bottom PCB (in) Figure 8A The entire chip (represented by 57) is implemented through a highly integrated quad-core chip (or IC), each of which is configured to control four radiating elements 502 and perform phase shifting, signal attenuation and / or pre-amplification, Tx / Rx switching, one-to-four signal distribution (in the Tx phase) and four-to-one beamforming (in the RX phase).

[0118] also:

[0119] ·exist Figure 8AThe lower left corner also schematically shows one of the quad-core chips (denoted by 58) mounted / mounted on the bottom PCB 57, wherein the quad-core IC 58 is provided with a single interface (I / F) and controls four respective Tx / Rx front-end modules 59 mounted / mounted on the side PCB 51 (each including its own PA, its own LNA and its own switch / circulator, which are implemented by discrete components);

[0120] · Figure 8B The paper also outlines the schematic layout of the quad-core 58 chip; and

[0121] ·exist Figure 8A The lower right corner also provides an enlarged image of the Tx / Rx front-end electronics (i.e., Tx / Rx front-end module 59) mounted / hung on one of the side PCBs 51.

[0122] Reference Figure 8A and Figure 8B Of particular note are the electronic device implementation architectures described herein and those previously described:

[0123] Each Tx / Rx front-end module 59 can be individually controlled by its own quad-core chip 58;

[0124] Currently, there are numerous quad-core packaged ICs available on the market, which can serve as a very suitable solution for this invention; and

[0125] • The packaged components allow for easy mounting and testing on the PCB.

[0126] As an alternative to using chips, bottom-side PCB electronics can also be easily implemented using discrete components, thus allowing for a wider bottom-side PCB (approximately the width of the PCB controller 52) while still ensuring the λ / 2 spacing between the side PCBs.

[0127] Furthermore, as an alternative to implementing Tx / Rx front-end electronics through discrete components, integrated Tx / Rx front-end modules can be conveniently used, combining multiple functions into a single package to reduce cost and design complexity, further shrinking the PCB footprint and minimizing thickness. In this regard, Figure 9 An example of an integrated Tx / Rx front-end module layout is illustrated, which can be advantageously used to implement a Tx / Rx front-end electronics device with a 3D U-shaped module.

[0128] Specifically, Figure 9 Outline the integrated Tx / Rx front-end module (represented by 6 for the whole), which includes:

[0129] • Port 61 is designed to be used as a Tx input, i.e., from the bottom PCB electronics ( Figure 9 (Not shown in the image) Receive the RF signal to be transmitted;

[0130] • Power amplifier 62, which is connected to the first port 61 and configured to amplify the power of the RF signal to be transmitted;

[0131] • LNA 63, which is configured to amplify the incoming RF signal with low noise;

[0132] • The second port 64, which is connected to the LNA 63, is designed to be used as an Rx output, that is, to provide the incoming RF signal amplified by the LNA 63 to the bottom PCB electronics.

[0133] • The third port 65 is designed as

[0134] -radiating element ( Figure 9 (Not shown) provides the RF signal to be transmitted, amplified by PA 62, and

[0135] - Receive the incoming RF signal received by the radiating element; and

[0136] • Switch 66, operable to selectively connect the third port 65 to PA 62 or LNA 63.

[0137] Thanks to the use of integrated Tx / Rx front-end modules, the height of the sidewalls (i.e., the side PCB) can be reduced, resulting in a corresponding reduction in the thickness of the 3D U-shaped module.

[0138] Figure 10 An example of an AESA architecture using a 3D U-shaped module according to an exemplary embodiment of the present invention is described. Specifically, Figure 10 This is an exploded view of an AESA (represented by 7 as the whole), which includes:

[0139] • Radiating plate 71, which is configured to perform RF radiation and echo reception functions and is coupled to shielding antenna 72;

[0140] • A component of the 3D U-shaped T / R module 73, which is coupled to the radiating plate 71 via the interface of the RF connector 74;

[0141] • RF combiner / shunt board 75, which is coupled to and configured with 3D U-shaped T / R module 73 as

[0142] - Segment the RF signal to be transmitted to feed the 3D U-shaped T / R module 73 during transmission, and

[0143] - Combine the RF signals from the 3D U-shaped T / R module 73 upon reception; and

[0144] • The AESA main controller and DC-DC board (represented as a whole by 76) are coupled to the T / R controller and module connector (represented as a whole by 77) and heat sink 78.

[0145] Figure 10 The AESA architecture shown represents an affordable and scalable solution for planar AESA.

[0146] According to the present invention, the use of a 3D U-shaped modular architecture offers many benefits (specifically, in terms of extremely efficient air cooling, reduced AESA thickness, reduced losses of radiating elements, ease of testing, simplified AESA control, architectural flexibility, and the possibility of multi-polarization operation), which will be described in detail below.

[0147] Specifically, the 3D U-shaped module architecture according to the invention facilitates heat exchange and supports efficient air cooling, through which air flows, both when multiple 3D U-shaped modules are combined to form an AESA and in the region between two adjacent 3D U-shaped modules with finned profiles. In this way, all PCBs are cooled on both sides, and liquid is unnecessary.

[0148] in this regard, Figure 11 An example is described of two 3D U-shaped modules arranged side by side (specifically, the first 3D U-shaped module as a whole, denoted by 81, and the second 3D U-shaped module as a whole, denoted by 82), wherein:

[0149] • The first air passage 83 (in the form of a rectangular channel) is located between the side PCBs of the first 3D U-shaped module 81 and above the base PCB;

[0150] • The second air passage 84 (in the form of a rectangular channel) is located between the side PCBs of the second 3D U-shaped module 82 and above the bottom PCB;

[0151] • The first fin (represented as a whole by 85) is arranged between the adjacent side PCBs of the first 3D U-shaped module and the second 3D U-shaped modules 81 and 82, while the second fin (represented as a whole by 86) is arranged outside the other side PCBs of the first 3D U-shaped module and the second 3D U-shaped modules 81 and 82.

[0152] In this way, air can flow through the first air passage 83, the second air passage 84, and the first and second fins 85 and 86, thereby cooling the side PCB on both sides.

[0153] Efficient air cooling also enables the use of high-power amplifiers (for example, it has been shown that using power amplifiers with up to 20W of output power per amplifier is feasible compared to conventional all-planar arrays), and improves antenna performance while keeping the antenna size small.

[0154] To demonstrate the advantages of this invention in terms of air cooling efficiency, the following report will present the results of different thermal analyses conducted by the applicant for different antenna sizes and power management requirements.

[0155] Specifically, Figure 12 , Figure 13 a) and Figure 13 b) shows the results of a first thermal analysis of a planar AESA antenna, including a 3D U-shaped module implementing 144 TRMs and adapted with a 10W peak power amplifier. The first thermal analysis was performed under the following conditions:

[0156] • Overall volumetric flow rate = 55 liters / second;

[0157] • Input air temperature = 25℃;

[0158] • Relative pressure = 250 Pa;

[0159] • Tx / Rx duty cycle (DC) = 10%;

[0160] • Transmitting power at 10% DC voltage = 144W (1440W peak);

[0161] • Power dissipation at 10% DC voltage = 529W;

[0162] • Power absorption at 10% DC current = 673W.

[0163] More specifically, Figure 12 It is shown that:

[0164] • Thermal diagram of the external mechanics of the antenna at the top; and,

[0165] • A heat map of hot spots on the PCB at the bottom.

[0166] To better understand Figure 12 In the bottom heat map of the hotspots on the side (or horizontal) PCB, reference number 91 indicates the switch / circulator, reference number 92 indicates the 10W peak power amplifier, reference number 93 indicates the LNA, and reference number 94 indicates the preamplifier; in addition, in the bottom heat map of the hotspots on the bottom (or central) PCB, reference number 95 indicates the core chip.

[0167] Regarding the thermal map of hot spots on the side (or lateral) PCB, it is worth noting that the 10W peak power amplifier 92 reaches the highest temperature, while the other components (i.e., the switch / circulator 91, LNA 93, and preamplifier 94) reach significantly lower temperatures.

[0168] Conversely, regarding the thermal map of the hot spots on the bottom (or central) PCB, it is noteworthy that all the core chips 95 operate at essentially the same temperature. This feature represents a significant technical advantage of the present invention. Indeed, as previously explained, the core chips on the bottom PCB also perform signal phase shifting in various functions. It is well known that phase shifters are highly sensitive to temperature; therefore, conventional AESA antenna designs typically have to account for and compensate for phase shifts caused by different operating temperatures of the phase shifters. In contrast, the present invention allows the core chips (and therefore the phase shifters) to operate at the same temperature, thus eliminating the need to consider phase shift compensation related to different operating temperatures of the phase shifters.

[0169] As for Figure 13 a) and Figure 13 b), the former shows the output air velocity, while the latter shows the output air temperature.

[0170] also, Figure 14 The results of a second thermal analysis are shown for a planar AESA antenna comprising a 3DU-shaped module implementing 704 TRMs and fitted with a rated peak power amplifier of 4.5W. The second thermal analysis was performed under the following conditions:

[0171] • Overall volumetric flow rate = 68 liters / second;

[0172] • Input air temperature = 25℃;

[0173] • Tx / Rx duty cycle (DC) = 10%;

[0174] • Net radiated power at 10% DC = 260W (net peak power is 2600W after a loss of 0.85dB after the nominal Tx peak power of 3168W);

[0175] • Power absorption at 10% DC = 1340W.

[0176] Specifically, Figure 14 A thermal diagram of the external mechanics of the antenna is shown.

[0177] Air can be like Figure 12 , Figure 13 a) Figure 13 b) and Figure 14As illustrated in the example reported, air is forced to flow through any 3D U-shaped module in the same direction, or, where convenient, alternately in a forward and backward direction between two adjacent components. In this regard, it is worth noting that this second method of forcing air to flow through the 3D U-shaped modules (i.e., alternating directions) may be preferred when an AESA comprises a large number of 3D U-shaped modules arranged along a particular dimension (e.g., a large antenna for surveillance missions), as... Figure 15 and Figure 16 As reported in the example shown, in the exemplary large AESA antenna 100 including a 3D U-shaped module, air can be forced through the column from one side ( Figure 15 ) or from the opposite side ( Figure 16 ) flows through the 3D U-shaped module.

[0178] also, Figure 17 a) and Figure 17 b) shows the results of a third thermal analysis of a planar AESA antenna comprising a 3D U-shaped module implementing 432 TRMs, adapted with a 7W peak power amplifier and operating at a 10% duty cycle (DC), with air forced to flow in opposite directions through the 3D U-shaped module. Specifically, Figure 17 a) Draw the air-cooling layout of the planar AESA antenna (represented by 200 for the whole), and Figure 17 b) shows the corresponding thermal diagram of the external mechanics of the antenna.

[0179] Due to the use of this invention, the dimensions of the AESA antenna are significantly reduced, increasing the feasibility of installation on a wide range of airborne platforms, including unmanned aerial vehicles (UAVs).

[0180] In fact, the 3D U-shaped modular architecture according to the invention allows all electronic components of the T / R module to be fitted within the array lattice spacing, positioning each TRM behind the associated radiating element, and limiting the need for lateral expansion, which typically occurs in conventional planar architectures—in this respect, for example, references Figure 1 a) and Figure 1 b).

[0181] For example, for X-band operation, the thickness of the 3D U-shaped module can be as small as 2.5 cm (or less), and the weight less than 0.5 kg. The thickness is primarily related to the peak power value of the power amplifier (PA) and cooling requirements. Operation across different frequency bands allows for easy scaling to accommodate varying dimensions.

[0182] Furthermore, as an additional advantage of the present invention, it is worth noting that since the high-power amplifier (which generates the RF signal to be transmitted) and the low-noise amplifier (LNA) (which determines the receiver sensitivity) of the T / R module are very close to the radiating element, the losses in both the transmission and reception paths are reduced.

[0183] In addition, each 3D U-shaped module can be easily equipped with power and control connectors, which can be advantageously used for automated testing and calibration by connecting the TRM connector to the appropriate RF measurement equipment, thus achieving significant convenience in testing and calibration.

[0184] Furthermore, it is preferable to install a dedicated controller on each 3D U-shaped module, which distributes a portion of the programming and control of the TRM to the 3D U-shaped module itself via a dedicated field-programmable gate array (FPGA) that interfaces with the AESA main controller. In this way, distributed control of the overall AESA function is achieved, simplifying the task of the AESA main controller.

[0185] The modular architecture according to the invention allows for the construction of AESA antennas of different shapes / sizes by appropriately combining 3D U-shaped basic components. This enables the reuse of the same (or fewer) modules to form larger antennas or antennas of different shapes, depending on the application, performance requirements, and / or installation constraints. For example, for UAV applications (where payload weight and power consumption are significant limiting factors), small but high-performance rectangular antennas comprising a limited number of radiating elements are the most suitable solution, while circular antennas are preferred for fighter jet applications to provide symmetry in both azimuth and elevation directions and to fit the aircraft's nose; when applications require even better performance, large antennas can be achieved by grouping an appropriate number of basic 3D U-shaped modules arranged longitudinally side-by-side.

[0186] in this regard, Figure 18 a) and Figure 18 b) Sketch two examples of possible combinations of 3D U-shaped modules used to obtain antennas of different shapes / sizes. Specifically, Figure 18 a) A small rectangular AESA antenna 300 including six 3D U-shaped modules 301 is shown; Figure 18 (b) illustrates a circular AESA antenna 400 obtained by combining 3D U-shaped modules of different sizes for fighter jet applications. The vertical dimension of the AESA can be obtained by using, for example, a single 3D U-shaped module with 2×24 elements or two 3D U-shaped modules (each with one or two T / R controllers) arranged in a vertical row.

[0187] In addition to the benefits of flexibility, the modular architecture according to the invention also simplifies system integration, enables rapid maintenance, and reduces costs.

[0188] Furthermore, it is worth noting that the U-shaped design and application of highly integrated components (i.e., integrated Tx / Rx front-end modules, quad-core ICs, etc.) allow for space savings while maintaining the overall compactness of the AESA. Therefore, multi-polarization operation can be supported by adding switches (within the "saved" space) to feed different polarizations to two different radiating elements.

[0189] In view of the above, the technical advantages and innovative features of the present invention are clear to those skilled in the art.

[0190] Specifically, and this is important to emphasize, the present invention relates to an innovative 3D U-shaped architecture for a T / R module for an AESA antenna (specifically a planar or quasi-planar AESA), which allows all electronic components performing amplification, Tx / Rx front-end, and beam steering tasks to be adapted within the grid space of a fully filled AESA (conveniently, the element spacing is approximately half the operating wavelength).

[0191] Arranging solid-state components on three different PCBs to form a 3D U-shaped structure achieves equivalent AESA technology, but with less thickness, lower cost, smaller size, higher cooling efficiency, better performance, and easier testing and calibration configuration.

[0192] Specifically, the 3D U-shaped modular architecture according to the present invention allows for reductions in AESA cost, size, and cooling requirements, while ensuring high performance similar to traditional planar or quasi-planar AESA architectures.

[0193] More specifically, using the 3D U-shaped module according to the invention to form an AESA brings several significant benefits, including:

[0194] • Highly efficient air cooling (even under high-performance requirements) also enables the use of high-power amplifiers;

[0195] • Compact and cost-effective configuration (easily achieved through the use of COTS components and highly integrated technology);

[0196] • Improve power efficiency and reduce power requirements;

[0197] • Reduce the overall thickness and weight of the AESA, thereby improving installation feasibility;

[0198] • Modular and flexible architecture;

[0199] • Simplify design, manufacturing, testing, and verification;

[0200] • Components that are easy to assemble and package on a PCB;

[0201] • Easy to install, integrate, test, calibrate, and mass-produce;

[0202] • Simplify AESA control;

[0203] • Reduce development and production costs, specifically by reusing 3D U-shaped modules and using them as a universal module for other AESA antennas of different sizes and for different applications, thereby reducing the development costs of new AESA antennas; and

[0204] • Reduce the loss of radiating elements.

[0205] Because this invention allows for the design of low-cost, small-size, low-power, air-cooled, and high-performance AESA systems, the AESA systems can be advantageously installed on any type of platform, even medium or small aircraft, with little impact on the platform on which the AESA system is installed.

[0206] It is also worth noting that none of the known solutions teach, imply, or disclose the unique 3D U-shaped modular architecture according to the present invention, or its aforementioned technical advantages.

[0207] For example, the solution according to US 8,937,574 B2 uses two parallel PCBs: one containing the TRM electronics (including the core chip), and the other containing the control and power supply components. The PCB containing the TRM electronics is connected to another parallel structure housing the beamforming network. Because AESA operation mandates a maximum spacing between radiating elements (i.e., approximately half the operating wavelength), the solution according to US 8,937,574 B2 forces electronic and mechanical assembly within a very confined space, which becomes impractical or extremely dangerous as the operating frequency increases.

[0208] Conversely, according to the present invention, two parallel PCBs house the TRM's Tx / Rx front-end electronics, while a third orthogonal PCB houses the core chip for signal phase shifting, attenuation / amplification, switching, and splitting / combining, as well as the module control device. In this way, the spacing between radiating elements required for AESA operation can be easily achieved.

[0209] Furthermore, the cooling mechanism according to US 8,937,574 B2 differs structurally from the mechanism according to the present invention. In fact, according to US 8,937,574 B2, the T / R unit is cooled by a secondary airflow generated by the main airflow through a structure adapted with openings and orthogonal to the main airflow. With respect to the present invention, this mechanism reduces cooling efficiency and also leads to an increase in the thickness of the AESA, whereas in the present invention, the main airflow directly cools the electronic components without requiring additional structures or secondary airflows.

[0210] In contrast, the solution according to US 9,172,145 B2 relates to the well-known AESA tile architecture, where the basic tile consists of several planar layers implementing the electrical, electronic, mechanical, and RF functions of AESA. Therefore, unlike the present invention, this architectural solution does not utilize any 3D distribution of TRM components / functions on the U-shaped structure. Furthermore, also unlike the present invention, the cooling mechanism according to US 9,172,145 B2 is achieved through a heat sink applied to the outer surface of the tile and coupled via a cold plate.

[0211] The solutions according to US 6,975,267 B2 and US 7,132,990 B2 are very similar to the solution according to US 9,172,145 B2, in which multiple parallel layers of circuit elements are sandwiched together on the antenna panel. Therefore, in this case, there is no 3D distribution of TRM components / functions on the U-shaped structure. Furthermore, in US 6,975,267 B2 and US 7,132,990 B2, cooling is achieved through a pair of planar forced-air radiator components located on either side of the array beam control tile, thus this cooling mechanism is completely different from the cooling mechanism according to the invention.

[0212] Furthermore, the solutions according to US 8,355,255 B2 and US 9,172,145 B2 are related, resulting in architectural and cooling solutions that are completely different from those of the present invention.

[0213] Furthermore, it is worth noting that US 7,859,835 B2, EP 2 368 291 A1, US 2008 / 0209931A1, WO 2016 / 065485 A1, US 2017 / 0323843 A1, WO 2014 / 206578 A2, US 7,289,327B2, and US 9,161,478 B2 also relate to architectural and cooling solutions that are completely different from the present invention.

[0214] Finally, it is worth noting that the antenna architecture according to US 2009 / 231197 A1 is completely different from the AESA architecture according to the present invention.

[0215] In summary, it is clear that many modifications and variations can be made to the invention, all of which fall within the scope of the invention as defined in the appended claims.

Claims

1. An active electronically steerable antenna (20, 30, 40, 7, 100, 200, 300, 400) comprising a planar or quasi-planar radiating array configured to transmit and / or receive radio frequency or microwave signals; Its features are, It further includes multiple three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301), each arranged behind and coupled to the respective planar or quasi-planar radiating subarray of N radiating elements (502), the N radiating elements (502) being arranged in two rows or two columns, each row or column having N / 2 radiating elements (502), where N is an even number; Each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) includes: • Each of their respective base walls (11, 57); • The two respective sidewalls (12, 13, 51), their - The respective bottom walls (11, 57) are orthogonally arranged to form their respective three-dimensional U-shaped structures, and - Each is arranged behind its respective row or column of N / 2 radiating elements (502) in its respective planar or quasi-planar radiating subarray; and • Each of the respective transmitting and / or receiving electronic devices is distributed on the respective bottom wall (11, 57) and side wall (12, 13, 51) and is configured to implement N respective transmitting and / or receiving modules; For each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301), the respective transmitting and / or receiving electronic device includes: • For each of its respective sidewalls (12, 13, 51), N / 2 separate transmitting and / or receiving front-end modules (59, 6) are... - Installed on their respective sidewalls (12, 13, 51), - The N / 2 radiating elements (502) coupled to their respective rows or columns of the respective planar or quasi-planar radiating subarrays, and -Configured to implement power amplifiers (121, 131, 92), low-noise amplifiers (122, 132, 93), and switches or circulators (122, 132, 91); and • Each of the bottom wall electronics, which is mounted on its respective bottom wall (11, 57), is connected to N respective transmitting and / or receiving front-end modules (59, 6) and is configured to perform beam steering functions including signal phase shifting and attenuation and / or amplification functions.

2. The active electronically steerable antenna according to claim 1, wherein, The respective bottom-wall electronics of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) are configured to also perform switching and signal splitting and / or combining functions.

3. The active electronically steerable antenna according to claim 1 or 2, wherein, The respective bottom wall electronics of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) includes a control electronics (52) configured to control the operation of the three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) and designed to be coupled to the main controller (76) of the active electronically steerable antenna (20, 30, 40, 7, 100, 200, 300, 400).

4. The active electronically steerable antenna according to claim 1, wherein, The respective transmitting and / or receiving front-end modules (59, 6) of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) are configured to each implement a respective power amplifier (121, 131, 92), a respective low-noise amplifier (122, 132, 93), and a respective switch or circulator (122, 132, 91).

5. The active electronically steerable antenna according to claim 1, wherein, The respective bottom-wall electronics of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) are implemented by multiple packaged integrated circuits or core chips (110, 58, 95), each connected to its respective transmitting and / or receiving front-end module (59, 6).

6. The active electronically steerable antenna according to claim 1, wherein, The respective bottom wall electronics of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) are implemented by discrete electronic components.

7. The active electronically steerable antenna according to claim 1, wherein, The respective transmitting and / or receiving front-end modules (59, 6) of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) are implemented by packaged integrated circuits or discrete electronic components.

8. The active electronically steerable antenna according to claim 1, wherein, The respective bottom wall (11, 57) and the respective side wall (12, 13, 51) of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) are printed circuit boards.

9. The active electronically steerable antenna according to claim 1, wherein, Each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) has its respective three-dimensional U-shaped structure enclosed within its own three-dimensional U-shaped metal structure, which includes: • Each of the respective bottom mechanical supports (56), on which the respective bottom walls (11, 57) are mounted; and • Two respective side mechanical supports (54) are mounted on the exterior of the respective sidewalls (12, 13, 51); Each of the three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301) further includes a respective central metal structure (55) mounted on or above the respective bottom wall (11, 57) between the respective side walls (12, 13, 51) and adapted with respective air ducts (551, 83, 84) for air cooling of the respective bottom wall (11, 57) and the respective side walls (12, 13, 51) as well as the respective transmitting and / or receiving electronic equipment.

10. The active electronically steerable antenna according to claim 9, wherein, The respective three-dimensional U-shaped structure of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) is elongated in a longitudinal direction orthogonal to the plane in which the U-shape of the three-dimensional U-shaped structure is defined; Furthermore, for each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301), the respective bottom mechanical support (56), the respective side mechanical support (54), the respective central metal structure (55), and the respective air passages (551, 83, 84) are also elongated in the longitudinal direction.

11. The active electronically steerable antenna according to claim 9 or 10, wherein, For each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301), the respective side mechanical support (54) is provided with its own fins (85, 86) for further air cooling of the respective sidewalls (12, 13, 51) and the respective transmitting and / or receiving front-end modules (59, 6).

12. The active electronically steerable antenna according to claim 1, wherein, The three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301) are arranged side by side along the horizontal direction, the vertical direction, or both the horizontal and vertical directions; and wherein the three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301) have the same size or have different sizes.

13. The active electronically steerable antenna (20, 30, 40, 7, 100, 200, 300, 400) according to claim 9, further comprising means configured to generate airflow through the respective air passages (551, 83, 84) of each three-dimensional U-shaped module (1, 2, 3, 5, 81, 82, 301) for air cooling thereon.

14. The active electronically steerable antenna according to claim 13, wherein, The airflow is generated from: • For all the aforementioned three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301), they are in the same direction; or • In two opposite directions, it includes a first direction for some of the three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301) and a second opposite direction for the other three-dimensional U-shaped modules (1, 2, 3, 5, 81, 82, 301).

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