Thermal management system for wearable assembly

Abstract

In various embodiments, a wearable assembly configured to be worn on a head of a user is disclosed. The wearable assembly can include a wearable support and an electronic assembly coupled to or disposed within the wearable support. A thermal management structure in thermal communication with the electronic assembly can be provided. The thermal management structure can be configured to transfer heat away from the electronic assembly and away from the head of the user when the wearable support is disposed on the head of the user.

Description

Thermal management system for wearable components

[0001] This application is a divisional application of Chinese patent application No. 201780078221.2, entitled "Thermal Management System for Wearable Components" (filed on November 15, 2017).

[0002] Cross-references to related applications

[0003] This application claims priority to U.S. Provisional Patent Application No. 62 / 423,192, filed November 16, 2016, the entire contents of which are incorporated herein by reference and used for all purposes. Technical Field

[0004] This field relates to thermal management systems for wearable components, including thermal management systems for head-mounted augmented reality systems. Background Technology

[0005] Modern computing and display technologies have facilitated the development of virtual reality (“VR”), augmented reality (“AR”), and mixed reality (“MR”) systems. VR systems create simulated environments for users to experience. This is accomplished by presenting computer-generated images to the user through a head-mounted display. These images create a sensory experience that immerses the user in the simulated environment. VR scenes typically involve only the presentation of computer-generated images, rather than including actual, real-world images.

[0006] AR systems typically supplement the real-world environment with simulated elements. For example, an AR system can provide a user with a view of the surrounding real-world environment through a head-mounted display. However, computer-generated images can also be displayed to enhance the real-world environment. These computer-generated images can include elements relevant to the context of the real-world environment. These elements can include simulated text, images, objects, etc. MR systems are a type of AR system that also introduces simulated objects into the real-world environment, but these objects typically have a greater degree of interactivity. Simulated elements can often be interacted with in real time. Summary of the Invention

[0007] In one embodiment, a wearable component configured to be worn on a user's head is disclosed. The wearable component may include a wearable support and electronic components in thermal communication with the wearable support. A thermal management structure may be in thermal communication with the electronic components and is configured to transfer heat from the electronic components away from the user side of the wearable component.

[0008] In another embodiment, a wearable component configured to be worn on a user's head is disclosed. The wearable component may include an internal mechanical structure and a housing structure mechanically coupled to the internal mechanical structure, such that the internal mechanical structure is located between the user side of the wearable component and the housing structure. The internal mechanical structure may be configured to transfer heat away from the user side of the wearable component to the housing structure. Thermally conductive vias may extend from the internal mechanical structure at least partially through the thickness of the housing structure.

[0009] In another embodiment, a method of manufacturing a wearable component configured to be worn on a user's head is disclosed. The method may include providing an internal mechanical structure and thermally conductive vias extending from the internal mechanical structure at least partially through the thickness of an outer shell structure. The method may include mechanically coupling a rear surface of the outer shell structure to the internal mechanical structure such that the internal mechanical structure is located between the user side of the wearable component and the outer shell structure. The internal mechanical structure may be configured to transfer heat away from the user side of the wearable component to the outer shell structure.

[0010] Details of one or more embodiments of the subject matter described herein are set forth in the accompanying drawings and the following description. Other features, aspects, and advantages will become apparent from the description, drawings, and claims. Attached Figure Description

[0011] Figure 1 illustrates an augmented reality scene with some virtual reality objects and some physical objects viewed by a person.

[0012] Figures 2A-2D schematically illustrate examples of wearable systems.

[0013] Figure 3 schematically illustrates the coordination between cloud computing assets and local processing assets.

[0014] Figure 4 schematically illustrates examples of components of an embodiment of an AR system.

[0015] Figure 5A is a schematic perspective view of a wearable component according to various embodiments.

[0016] Figure 5B is a schematic perspective view of a wearable component according to various embodiments.

[0017] Figure 6A is a schematic side sectional view of a composite laminate structure that transfers heat asymmetrically with respect to a heat source.

[0018] Figure 6B is a schematic side sectional view of a thermal management structure according to various embodiments.

[0019] Figure 6C is a schematic diagram of a wearable component including the thermal management structure shown in Figure 6B.

[0020] Throughout the accompanying drawings, reference numerals may be used repeatedly to indicate the correspondence between reference elements. The drawings are provided to illustrate exemplary embodiments described herein and are not intended to limit the scope of this disclosure. Detailed Implementation

[0021] Overview of AR, VR, and Localization Systems

[0022] Figure 1 depicts an augmented reality scene (4) in which an AR user sees a real-world park-like setting (6) characterized by people, trees, buildings in the background, and a concrete platform (1120). In addition to these items, the AR user also perceives that he “sees” a robot statue (1110) standing on a real-world platform (1120) and an anthropomorphic flying cartoon-like avatar that appears to be a bumblebee (2), even though these elements (2, 1110) do not exist in the real world. The human visual perception system is very complex, and it is challenging to produce VR or AR technologies that facilitate a comfortable, natural, and rich presentation of virtual image elements within other virtual or real-world image elements.

[0023] Head-mounted VR or AR displays (or helmet-mounted displays or smart glasses) are typically at least loosely coupled to a user's head and therefore move as the user's head moves. If the display system detects the user's head movement, it can update the data being displayed to account for changes in head posture. As an example, if a user wearing a head-mounted display is viewing a virtual representation of a three-dimensional (3D) object on the display and walking around the area where the 3D object appears, the 3D object can be re-rendered for each viewpoint, making the user feel as if he or she is walking around an object that occupies real space. If the head-mounted display is used to present multiple objects within a virtual space (e.g., a rich virtual world), measurements of head posture (e.g., the position and orientation of the user's head) can be used to re-render the scene to match the user's dynamically changing head position and orientation, providing an enhanced sense of immersion in the virtual space.

[0024] In AR systems, head pose detection or calculation allows the display system to render virtual objects so that they appear to occupy space in the real world in a way that is meaningful to the user. Furthermore, the detection of the position and / or orientation of real objects associated with the user's head or the AR system (such as handheld devices (also called "totems"), haptic devices) or other real physical objects can facilitate the display system in presenting information to the user, enabling the user to effectively interact with certain aspects of the AR system. As the user's head moves in the real world, virtual objects can be re-rendered as a function of head pose, making them appear stable relative to the real world. At least for AR applications, the placement of virtual objects in spatial relationships with physical objects (e.g., presenting them as spatially close to physical objects in two or three dimensions) can be a non-trivial problem. For example, head movement can significantly complicate the placement of virtual objects in the view of the surrounding environment. This is true whether the view is captured as an image of the surrounding environment and then projected or displayed to the end user, or whether the end user directly perceives the surrounding environment. For example, head movement may cause a change in the end user's field of view, which may require updating the positions of various virtual objects displayed within the end user's field of view. Furthermore, head movements can occur within a wide range and speed. The speed of head movements can vary not only between different head movements, but also within the range of a single head movement or across the range of individual head movements. For example, the speed of a head movement can initially increase from a starting point (e.g., linearly or non-linearly) and can decrease upon reaching an endpoint, thus achieving a maximum speed somewhere between the start and end points of the head movement. Rapid head movements may even exceed the capabilities of a particular display or projection technology to render an image to the end user that appears to have uniform and / or smooth motion.

[0025] Head tracking accuracy and latency (e.g., the time elapsed between when a user moves their head and when an image is updated and displayed to the user) have become challenges for VR and AR systems. This is particularly advantageous for display systems that fill most of the user's field of view with virtual elements, where high head tracking accuracy and very low overall system latency—from the first detection of head movement to the update of light transmitted from the display to the user's eyes—are beneficial. High latency can create mismatches between the user's vestibular and visual sensory systems, resulting in user-perceived scenarios that may lead to motion sickness or kinetosis. High system latency also makes the apparent positions of virtual objects appear unstable during rapid head movements.

[0026] Beyond head-mounted display systems, other display systems can benefit from accurate and low-latency head pose detection. These include head-tracking display systems, where the display is not worn on the user's body but rather mounted, for example, on a wall or other surface. The head-tracking display acts like a window onto a scene, and as the user moves their head relative to the "window," the scene is re-rendered to match the user's changing viewpoint. Other systems include head-mounted projection systems, where the head-mounted display projects light into the real world.

[0027] Furthermore, to provide a realistic augmented reality experience, AR systems can be designed to interact with users. For example, multiple users can play ball games with a virtual ball and / or other virtual objects. One user can "catch" the virtual ball and throw it back to another user. In another embodiment, a totem (e.g., a bat-like object communicatively coupled to the AR system) can be provided to the first user to hit the virtual ball. In other embodiments, a virtual user interface can be presented to the AR user to allow the user to select one of many options. Users can interact with the system using totems, haptic devices, wearable components, or simply by touching a virtual screen.

[0028] Detecting a user's head pose and orientation, as well as the physical location of real-world objects in space, enables AR systems to display virtual content effectively and enjoyably. However, while these capabilities are advantageous for AR systems, they can be challenging to implement. In other words, an AR system needs to identify the physical location of real-world objects (e.g., the user's head, totems, haptic devices, wearable components, the user's hands, etc.) and associate the physical coordinates of these real-world objects with the virtual coordinates of one or more virtual objects displayed to the user. This typically requires highly accurate sensors and sensor recognition systems that track the position and orientation of one or more objects at a rapid rate. Current methods may not be able to perform positioning at a satisfactory speed or accuracy standard. Therefore, a better positioning system is needed in the case of AR and VR devices.

[0029] Example AR and VR systems and components

[0030] Referring to Figures 2A-2D, some common component options are shown. In the detailed description following the discussion of Figures 2A-2D, various systems, subsystems, and components are presented to address the goal of providing high-quality, comfortable-feeling display systems for human VR and / or AR.

[0031] As shown in Figure 2A, the AR system user (60) is depicted wearing a head-mounted assembly (58) characterized by a frame (64) structure coupled to a display system (62) located in front of the user's eyes. A speaker (66) is coupled to the frame (64) in the configuration shown and is located near the user's ear canal (in one embodiment, another speaker, not shown, is located near the user's other ear canal to provide stereo / shape-shifting sound control). The display (62) is operatively coupled (68) to a local processing and data module (70) via, for example, a wired or wireless connection. The local processing and data module (70) can be mounted in various configurations, such as being fixedly attached to a frame (64), fixedly attached to a helmet or hat (80) as shown in the embodiment of FIG2B, embedded in headphones, detachably attached to the torso (82) of the user (60) in a backpack configuration as shown in the embodiment of FIG2C, or detachably attached to the hip (84) of the user (60) in a belt-coupled configuration as shown in the embodiment of FIG2D.

[0032] The local processing and data module (70) may include a power-efficient processor or controller, and a digital memory such as flash memory, both of which may be used to assist in processing, caching, and storing data that is: a) captured from sensors (such as image capture devices (such as cameras), microphones, inertial measurement units, accelerometers, compasses, GPS units, wireless devices, and / or gyroscopes) that may be operatively coupled to the frame (64); and / or b) acquired and / or processed using the remote processing module (72) and / or the remote data repository (74), possibly for transmission to the display (62) after such processing or retrieval. The local processing and data module (70) may be operatively coupled (76, 78) to the remote processing module (72) and the remote data repository (74), such that these remote modules (72, 74) are operatively coupled to each other and can be used as resources of the local processing and data module (70).

[0033] In one embodiment, the remote processing module (72) may include one or more relatively powerful processors or controllers configured to analyze and process data and / or image information. In one embodiment, the remote data warehouse (74) may include a relatively large-scale digital data storage facility accessible via the Internet or other network configurations in a “cloud” resource configuration. In one embodiment, storing all data and performing all computations in a local processing and data module allows for fully autonomous use from any remote module.

[0034] Referring now to Figure 3, a schematic diagram illustrates the coordination between cloud computing assets (46) and local processing assets, which may reside, for example, in a head-mounted component (58) coupled to the user's head (120) and a belt (308) coupled to the user (therefore component 70 may also be referred to as a "belt pouch" 70), as shown in Figure 3. In one embodiment, cloud (46) assets (such as one or more server systems (110)) are operatively directly (40, 42) coupled (115) to one or both of the local computing assets, such as the processor and memory configuration coupled to the user's head (120) and belt (308) as described above, such as via wired or wireless networks (wireless preferably for mobility, wired preferably for some high bandwidth or high data volume transmission that may be required). These computing assets, which are local to the user, may also be operatively coupled to each other via wired and / or wireless connection configurations (44) (such as wired coupling (68)). In one embodiment, in order to maintain the low inertia and small size of the subsystem mounted on the user's head (120), the main transmission between the user and the cloud (46) can be via a link between the subsystem mounted on the belt (308) and the cloud, wherein the head-mounted (120) subsystem primarily uses wireless connectivity (such as ultra-wideband (“UWB”) connectivity) to data communicate with the belt-based (308) subsystem, as is currently used in, for example, personal computing peripheral connectivity applications.

[0035] Through effective local and remote processing coordination, and with the aid of appropriate display devices for the user, such as the user interface or user display system (62) or variations thereof shown in Figure 2A, aspects of a world relating to the user's current real or virtual location can be transmitted or "transmitted" to the user and updated in an effective manner. In other words, a map of the world can be continuously updated at a storage location that may reside partly on the user's AR system and partly in cloud resources. The map (also known as a "walkable world model") can be a large database that includes raster images, 3-D and 2-D points, parametric information, and other information about the real world. As more and more AR users continuously capture information about their real-world environment (e.g., through cameras, sensors, IMUs, etc.), the map becomes increasingly accurate and complete.

[0036] Using the configuration described above, where a world model resides on and is distributed from cloud computing resources, this world can be "passed through" to one or more users in a relatively low-bandwidth manner, preferably attempting to deliver real-time video data, etc. The augmented experience of a person standing near the statue can be communicated via this cloud-based world model (e.g., as shown in Figure 1), where a subset can be passed down to them and their local display to complete the viewing. A person sitting at a remote display (this is as simple as a personal computer sitting at a desk) can efficiently download the same portion of information from the cloud and render it on their display. In practice, a person actually in the park near the statue might be walking in that park with a friend located further away, who joins via virtual and augmented reality. The system would need to know where the streets are, where the trees are, where the statue is—but using this information on the cloud, the joining friend can download it from the cloud aspect of the scene and then begin walking as a local augmented reality relative to the person actually in the park.

[0037] Three-dimensional (3D) points can be captured from the environment, and the pose of the camera capturing those images or points (e.g., vector and / or origin position information relative to the world) can be determined, allowing these points or images to be "tagged" or associated with that pose information. The pose of the second camera can then be determined using points captured by the second camera. In other words, the second camera can be oriented and / or positioned based on a comparison with a tagged image from the first camera. This knowledge can then be used to extract textures, create maps, and create a virtual copy of the real world (since two cameras are then registered around it).

[0038] Therefore, at a basic level, in one embodiment, a wearable system can be used to capture 3D points and generate a 2D image of those points, and these points and images can be sent to cloud storage and processing resources. They can also be cached locally with embedded pose information (e.g., cached labeled images); thus, the cloud can have prepared (e.g., in an available cache) labeled 2D images (e.g., labeled with 3D poses) as well as 3D points. If the user is observing something dynamic, additional information can also be sent up to the motion-related cloud (e.g., if viewing another person's face, the user can obtain a texture map of the face and push it up at an optimized frequency, even if the surrounding world is otherwise substantially static). More information about object recognizers and workable world models can be found in U.S. Patent Publication No. 2014 / 0306866 entitled “System and method for augmented and virtual reality,” which, along with the entire contents of the following appended disclosures, are incorporated herein by reference. The appended disclosures relate to augmented and virtual reality systems such as those developed by Magic Leap, Inc. of Plantation, Florida: U.S. Patent Publication No. 2015 / 0178939; U.S. Patent Publication No. 2015 / 0205126; U.S. Patent Publication No. 2014 / 0267420; U.S. Patent Publication No. 2015 / 0302652; U.S. Patent Publication No. 2013 / 0117377; and U.S. Patent Publication No. 2013 / 0128230, each of which is incorporated herein by reference in its entirety.

[0039] GPS and other localized information can be used as input for this processing. Accurate positioning of the user's head, totems, gestures, haptic devices, etc., can be advantageous in order to display appropriate virtual content to the user.

[0040] The head-mounted device (58) may include a display that can be positioned in front of the wearer's eyes. The display may include a light field display. The display may be configured to present images to the wearer at multiple depth planes. The display may include a planar waveguide with diffractive elements. Examples of displays, head-mounted devices, and other AR components that can be used with any of the embodiments disclosed herein are described in U.S. Patent Publication No. 2015 / 0016777. U.S. Patent Publication No. 2015 / 0016777 is incorporated herein by reference in its entirety.

[0041] Referring to Figure 4, a system configuration with numerous sensing components is shown. A head-mounted wearable component (58) is shown operatively coupled (68) to a local processing and data module (70), such as a shoulder bag, which uses physical multi-core leads and also has a control and quick-release module (86). The local processing and data module (70) is operatively coupled (100) to a handheld component (606), here via a wireless connection such as Bluetooth Low Energy; the handheld component (606) can also be operatively coupled (94) directly to the head-mounted wearable component (58), for example via a wireless connection such as Bluetooth Low Energy. Typically, high-frequency connections are required, such as in the range of hundreds or thousands of cycles per second or higher, when transmitting IMU data to coordinate the posture detection of various components; tens of cycles per second may be sufficient for electromagnetic positioning sensing, for example via a sensor (604) and transmitter (602) pair. A global coordinate system (10) is also shown, representing fixed objects in the real world around the user, such as a wall (8).

[0042] The cloud resource (46) can also be operatively coupled (42, 40, 88, 90) to the local processing and data module (70), to the head-mounted wearable component (58), and to other resources that can be coupled to a wall (8) or fixed relative to the global coordinate system (10). Resources coupled to the wall (8) or having a known location and / or orientation relative to the global coordinate system (10) may include a wireless transceiver (114), an electromagnetic transmitter (602) and / or a receiver (604), a beacon or reflector (112) configured to emit or reflect a given type of radiation (e.g., an infrared LED beacon), a cellular transceiver (110), a RADAR transmitter or detector (108), a LIDAR transmitter or detector (106), a GPS transceiver (118), a poster or marker (122) with a known detectable pattern, and a camera (124).

[0043] In addition to the light emitter (130) configured as an auxiliary camera (124) detector, for example, in addition to the infrared emitter (130) for the infrared camera (124), the head-mounted wearable component (58) has similar components as shown; the head-mounted wearable component (58) also has one or more strain gauges (116) which are fixedly coupled to the frame or mechanical platform of the head-mounted wearable component (58) and configured to determine the deflection of such platform between components such as electromagnetic receiver sensors (604) or display elements (62), wherein it can be valuable to understand whether the platform has been bent, for example at the thinning of the platform, such as the portion above the nose on the eyeglass-shaped platform shown in Figure 4.

[0044] The head-mounted wearable component (58) also includes a processor (128) and one or more IMUs (102). Each component is preferably operatively coupled to the processor (128). A handheld component (606) and a local processing and data module (70) with similar components are shown. As shown in Figure 4, such a system can be heavy, power-intensive, large, and relatively expensive due to the large number of sensors and connectivity devices. However, for illustrative purposes, such a system can be used to provide a very high level of connectivity, system component integration, and position / orientation tracking. For example, with such a configuration, the various main mobile components (58, 70, 606) can be positioned relative to a global coordinate system using WiFi, GPS, or cellular triangulation; beacons, electromagnetic tracking (as described herein), RADAR, and LIDAR systems can provide further position and / or orientation information and feedback. Markers and cameras can also be used to provide further information about relative and absolute position and orientation. For example, various camera components (124), such as those shown as camera components coupled to a head-mounted wearable component (58), can be used to capture data used in a simultaneous localization and mapping protocol or "SLAM" to determine the position of the component (58) and how it is oriented relative to other components.

[0045] Other features and embodiments of the head-mounted wearable component (58) and its sensors are described in U.S. Patent Application No. 15 / 683,664, filed August 22, 2017, entitled “AUGMENTED REALITY DISPLAY DEVICE WITH DEEP LEARNING SENSORS”, the entire contents of which are incorporated herein by reference.

[0046] As discussed herein, a head-mounted wearable AR / VR system (58) may include various sensors for determining the system’s position and / or orientation in three-dimensional space. For example, magnetic and optical sensors may be used for this purpose. Suitable magnetic sensors may include magnetometers, such as the electromagnetic sensor (604) discussed above, which can be used to help determine the position and / or orientation of the AR / VR system (58) based on the detection of a magnetic field from the transmitter (602). Another suitable magnetic sensor is a built-in magnetometer within an IMU (102), which can help determine the position and / or orientation of the AR / VR system (58) based on the detection of the Earth’s magnetic field. Meanwhile, suitable optical sensors may include, for example, outward-facing visible light or infrared cameras, which can also be used to help determine the position and / or orientation of the AR / VR system (58) and other objects.

[0047] Example of a thermal management system

[0048] The various embodiments disclosed herein relate to thermal management systems for wearable components, including, for example, head-mounted AR systems and devices for wearability. Referring to Figures 5A-6C, one of the challenges of a head-mounted wearable component (58) including various electronic components (e.g., embedded processors) is to conduct heat away from the component (58) and associated sub-components and away from the user's head. As shown in Figures 5A-5B, for example, the wearable component (58) may include a wearable support 373 comprising one or more support structures configured to provide mechanical support for system sub-components (e.g., such as those configured to provide AR, VR, and other functions as shown in Figure 4), with the wearable component 58 configured to conduct heat energy or heat away from the user's head. For example, as explained herein, the wearable component (58) may include one or more electronic components coupled to or disposed within the wearable support (373), including the electronic components shown and described in conjunction with Figure 4. Such electronic components can generate heat, and it may be desirable to conduct the generated heat away from the user's head.

[0049] It is also desirable to have a head-mounted wearable component (58) that is generally low in mass to achieve comfort and other ergonomic and operational advantages (e.g., low inertia and moment of inertia for easy homing with the user's head during head movements). In one embodiment, various components of the head-mounted wearable component (58) may include composite materials, such as reinforcing materials, like carbon fiber strands, and / or fabrics bonded to one or more matrix materials (e.g., epoxy resin). This construction may be designed to have specific structural moduli on various portions of the head-mounted wearable component (58) and may be relatively low in mass. Referring to FIG. 5A, in one embodiment, the wearable support (373) may include a mechanical internal structure (370) for limiting deflection in selected areas and providing a thermal path for transferring heat away from the user's head. The wearable support (373) may also include a shell assembly (372) that may include a multilayer composite material, such as a multilayer composite material comprising fabric bonded to epoxy resin or resin. Referring to Figure 5B, one or more mechanical internal structures (376) may be provided to act as deflection limiters in selected areas where relative stiffness is required; similar to the mechanical internal structure (370) shown in Figure 5A, the mechanical internal structure (376) of Figure 5B may also provide a thermal path for transferring heat away from the user's head. As shown in Figure 5B, strategic cuts or gaps (374) (e.g., grooves) may be formed in the various layers of the wearable support (373) to limit deflection to certain areas or zones (such as in a configuration referred to as a "movable hinge" across a portion of the structure) and to provide mechanical means for transferring heat away. In Figure 5B, for example, the cuts or gaps (374) may be formed partially through the thickness of the wearable support (373), for example, partially through the thickness of the internal structure of the support (373). In various embodiments, the cut or gap (374) can increase the amount of deflection near the gap (374) to focus the deflection on or near the gap (374), thereby limiting deflection in areas of the support (373) away from the gap (374). In various embodiments, the gap (374) can cause the support (373) to bend inward to fold the support (373) when not in use.

[0050] One of the challenges of certain composite materials is that while some constituent materials (often reinforcing materials such as fibers or fabrics) can have relatively high thermal conductivity, matrix materials such as epoxy resins typically have low thermal conductivity, resulting in a slightly lower overall thermal conductivity of the composite. The thermal conductivity of the composite material can be anisotropic, allowing the thermal conductivity in planes parallel to the reinforcing fiber planes to be greater than that in directions perpendicular to the reinforcing fiber planes.

[0051] Referring to Figure 6A, utilizing a conventional layered configuration of composite components, a matrix (384) layer is combined with a fiber or fabric (386) layer, where the fiber or fabric (386) can have a relatively high thermal conductivity, while the matrix (384) typically has a low thermal conductivity, thus preventing the efficient escape or transfer of heat (380) due to the repetitive and symmetrical layering. Figure 6A shows a simplified heat distribution diagram (382) across the composite structure from the source of heat (380), where more heat is transferred closer to the source.

[0052] Therefore, the various embodiments disclosed herein include thermal management structures or systems that are thermally connected to various electronic components of the wearable component (58). When the wearable support (373) is positioned on a user's head, the thermal management structure can be configured to transfer heat away from the electronic components away from the user's head, thereby away from the user side (392) of the wearable support (373). Referring to Figures 6B and 6C, various types of asymmetry can be provided in the composite construction of the housing structure (372), which may include a laminated structure, to better transfer heat across the construction and at specified geometric locations. In Figures 6A-6C, for example, the housing structure (372) may include a laminated structure having multiple alternating first and second layers, the first layer (e.g., layer (386)) having a higher thermal conductivity than the second layer (e.g., matrix layer (384)). In some arrangements, such as those shown in Figures 6B-6C, adjacent layers (386) may be separated by one or more (e.g., two) layers (384).

[0053] Referring to Figure 6B, an internal mechanical structure (388) with relatively high thermal conductivity is shown, extending parallel to the adjacent surfaces of the composite structure (e.g., the shell structure (372)) across most of the composite structure. Additionally, a thermal management structure including "thermal vias" (390) is shown, positioned near a heat source (380) to specifically concentrate heat transfer from the source (380) onto at least one layer of the composite structure at that location. This is illustrated, for example, by a sample thermal distribution map (383), where larger arrows generally indicate that more heat is transferred than smaller arrows. In some embodiments, the thermal management structure directs heat from the heat source (380) away from the user side (392) of the support structure, e.g., away from the side of the wearable component (58) adjacent to or facing the user when worn on the user's head. In some embodiments, the internal mechanical structure (388) may be thermally coupled to the heat source (380), e.g., a portion of the structure (388), such as a component (389) described below, may contact portions of the source (380), such as electronic components, to conduct heat away from the source (380). It should be understood that the internal mechanical structure (388) shown in Figures 6B-6C may also include the mechanical structure shown in Figures 5A-5B, including, for example, gaps or grooves (374).

[0054] As shown in Figure 6B, for example, the internal mechanical structure (388) may include a thermally conductive planar member (389) coupled (e.g., adhered or otherwise mechanically connected) to the rear surface (393) of the housing structure (372). A thermally conductive via (390) may extend from the thermally conductive planar member (389) (e.g., may be coupled to or formed with the thermally conductive planar member (389)). As shown, the via (390) may be configured not to be parallel to the thermally conductive planar member (389) (e.g., substantially perpendicular to the thermally conductive planar member (389)). Furthermore, the thermally conductive via (390) may extend at least partially through the thickness of the housing structure (372). In the illustrated embodiment, for example, the via (390) extends partially through the thickness of the housing structure (372). In other embodiments, the via (390) may extend completely through the thickness of the housing structure (372). In some embodiments, the combined thickness of the housing (372) and the internal mechanical structure (388) may be in the range of 2 mm to 5 mm, or in the range of 2 mm to 4 mm, or in the range of 2 mm to 3 mm. In some embodiments, the length of the through-hole (390) may be less than the total thickness of the housing (372) and the mechanical structure (388). For example, in some embodiments, the length of the through-hole (390) may be less than 5 mm, less than 4 mm, less than 3 mm, or less than 2 mm. In some embodiments, the length of the through-hole (390) may be in the range of 0.5 mm to 5 mm, in the range of 0.5 mm to 3 mm, in the range of 0.5 mm to 2 mm, in the range of 0.5 mm to 1 mm, in the range of 0.25 mm to 2 mm, in the range of 0.25 mm to 1 mm, or in the range of 1 mm to 2 mm.

[0055] In some embodiments, as shown in Figures 6B-6C, one or more relatively low thermal conductivity layers (384) may be provided between the outer end or distal end of the through-hole (390) and the outer surface of the wearable component (58) or the outer surface of the housing (372), which can prevent hot spots on the outer surface of the component (58). When the wearable support (373) is worn on the user's head, an internal mechanical structure (388) may be disposed between the user's head and the housing structure (372). The support (373) may be advantageously configured to transfer heat from the electronic components away from the user's head to the housing structure (372).

[0056] Figure 6C is an exploded view in which the internal mechanical structure (388) is shown as separate from the housing structure (372) for ease of illustration. In various embodiments, the internal mechanical structure (388) and the through-hole (390) can be coupled to the housing (372) in any suitable manner. For example, in some embodiments, the laminated structure of the housing (372) (e.g., alternating layers 384, 386) may be laminated, deposited, or molded around the through-hole (390) in some embodiments. In other embodiments, the through-hole (390) may be inserted into or snapped into a corresponding opening in the housing structure (372). Other methods of coupling the through-hole (390) and the internal structure (388) to the housing structure (372) may be suitable. In various embodiments, as explained herein, the housing structure (372) may include the laminated structure shown in Figures 6B and 6C, such as alternating layers (384, 386). The outer shell structure (372) may also include other mechanical support and / or thermal management structures, including, for example, an external mechanical cover or layer above a laminated structure.

[0057] Figure 6C illustrates an embodiment of this configuration with an internal mechanical structure (388) that may be exposed to relatively high heat (380), such as from an embedded processor, camera, or other heat-generating electronic component. This heat can be directed away from the component using a thermal via (390), which may comprise a material with relatively high thermal conductivity. Suitable materials for relatively high thermal conductivity fibers or fabrics (e.g., for the first layer (386)) include carbon fibers (thermal conductivity between about 21 and 180 W / mK, expressed in watts per meter Kelvin); high-modulus mesophase pitch carbon fibers, in the fiber direction (500 W / mK). Glass has a thermal conductivity of about 1 W / mK. Typical epoxy matrix materials (e.g., for the second layer (384)) have relatively low thermal conductivity, as described above (between about 0.5 and 1.5 W / mK), although certain other components may be added to the epoxy matrix (e.g., the second layer (384)) to increase thermal conductivity. For example, in various embodiments, carbon nanotube materials (theoretical thermal conductivity of 3,500 W / mK); and / or graphene (theoretical thermal conductivity of 5,020 W / mK); and / or diamond (thermal conductivity of 2,500 W / mK); and / or metallic components, such as aluminum, copper, gold, or silver (210 W / mK, 398 W / mK, 315 W / mK, and 428 W / mK, respectively), can be added to the matrix material (i.e., combined with fibers or fabrics of the composite structure, and / or used as a thermally perforated structure) to improve its superconductivity, thereby helping to remove heat from the device and the user's head. As shown in FIG6C, for example, the heat distribution (383) at the surface of the shell (372) from which heat (380) is transferred can be more uniform than the distribution shown in FIG6A. Heat (380) transfer can also be better controlled. For example, heat (380) can be transferred over a smaller area (e.g., to the left and right of the via (390) in FIG. 6B), whereas in the absence of the via (390), heat would be transferred over a larger area. In some embodiments, the rate of heat transfer can also be faster. For example, the via (390) can rapidly conduct heat to each of three consecutive additional conductive layers (386), where heat can be received and dissipated away from the heat source (380). This can have the advantage of removing the thermal load from the electronic components, which can help keep the components cool, allowing them to operate efficiently and for longer periods. Furthermore, as shown in FIG. 6C, an array of multiple vias (390) can be coupled to the structure (388) to further improve heat transfer away from the user.

[0058] In another embodiment, strands or leads of conductive material can be layered into the overall composite structure to provide not only enhanced thermal conductivity but also electrical conductivity for use as power, signal, or other leads constructed or integrated into such a structure. The engineered composite structures disclosed herein can be fabricated layer by layer by hand or mechanically. In one embodiment, a mold can be formed into which various fiber and / or fabric layers and matrix materials can be placed for assembly and curing. In one embodiment, a powder coating can be placed first against the mold and last against the other side of the mold, such that both sides of the component are powder-coated when the cured component is removed. Powder coatings or other coatings, sealants, or varnishes can be particularly selected for relatively high thermal conductivity to facilitate heat dissipation away from such components.

[0059] As described above in Figure 4, various components can be coupled to the head-mounted wearable component (58). In various embodiments, these components can be physically integrated within the composite layer, such that they are embedded within these components.

[0060] For example, in one embodiment, it may be desirable to have one or more copper ring flux trapping circuits embedded at a specific location adjacent to the outer surface for electromagnetic tracking. In another embodiment, it may be desirable to use one or more conductive leads as a radio frequency antenna, and it may be desirable to position such an antenna, whether it is a transmitter or a receiver, on the opposite side of such an assembly relative to the user's skin for the sake of a specific absorption rate (“SAR”). In yet another embodiment, fiber optic and / or fabric positioning may be specifically designed to provide a ring-shaped structural reinforcement around the location of an opening created within the construction, such as for camera lenses or other devices.

[0061] In one embodiment, various thermal components can be specifically designed not only to remove heat from certain components and away from the user, but also to eliminate certain conventional components such as vents, fans, etc. Therefore, in various embodiments, the wearable component (58) may not include any fans and / or may not include any vents. For example, a structure can be provided in which all or most of the heat is transferred through a solid structure rather than through channels or holes. An component can be provided in which all or most of the heat is transferred by conduction, and no heat is transferred through the structure by convection. An component can be provided in which all or most of the heat is transferred through the structure by conduction and by convection at the outer surface, but no heat is transferred by thermal advection.

[0062] Other aspects

[0063] In a first aspect, a wearable component configured to be worn on a user's head is disclosed. The wearable component may include a wearable support and an electronic component in thermal communication with the wearable support. A thermal management structure may be in thermal communication with the electronic component and is configured to transfer heat from the electronic component away from the user side of the wearable component.

[0064] In a second aspect, the wearable component according to aspect 1, wherein the thermal management structure includes a mechanical structure disposed in or on the wearable support and in thermal communication with the electronic components.

[0065] In a third aspect, the wearable component according to aspect 2 further includes one or more grooves formed through at least a portion of the thickness of the mechanical structure, the one or more grooves being configured to control the deflection of the mechanical structure.

[0066] In a fourth aspect, the wearable component according to any one of aspects 2 to 3, wherein the thermal management structure includes a housing coupled to a mechanical structure such that the mechanical structure is located between the user side of the wearable component and the housing structure, and wherein the mechanical structure is configured to transfer heat from the electronic components to the housing.

[0067] In a fifth aspect, the wearable component according to aspect 4 further includes a thermally conductive via that extends from the mechanical structure at least partially through the thickness of the housing.

[0068] In a sixth aspect, the wearable component according to aspect 5, wherein the mechanical structure includes a thermally conductive planar member coupled to the rear surface of the housing.

[0069] In a seventh aspect, the wearable component according to aspect 6, wherein a thermally conductive via is coupled to or formed together with a thermally conductive planar member, and the thermally conductive via is disposed non-parallel to the thermally conductive planar member.

[0070] In the eighth aspect, the wearable component according to any one of aspects 4 to 7, wherein the housing comprises a laminated structure.

[0071] In a ninth aspect, the wearable component according to aspect 8, wherein the laminated structure comprises a plurality of alternating first and second layers, the first layer having a higher thermal conductivity than the second layer.

[0072] In a 10th aspect, the wearable component according to aspect 9, wherein the first layer comprises a reinforcing material.

[0073] In the 11th aspect, the wearable component according to aspect 10, wherein the reinforcing material comprises fibers or fabrics.

[0074] In the 12th aspect, the wearable component according to aspect 11, wherein the first layer comprises carbon fiber.

[0075] In aspect 13, the wearable component according to any one of aspects 9 to 12, wherein the second layer comprises epoxy resin.

[0076] In aspect 14, the wearable component according to aspect 13 further includes one or more thermally conductive components within an epoxy resin.

[0077] In aspect 15, the wearable component according to aspect 14, wherein one or more thermally conductive components include at least one of carbon nanotubes, graphene, or metal.

[0078] In the 16th aspect, the wearable component according to any one of aspects 1 to 15, wherein the electronic component includes at least one of a processor and a camera.

[0079] In the 17th aspect, the wearable component according to any one of aspects 1 to 16, wherein the wearable component includes an augmented reality device.

[0080] In the 18th aspect, the wearable component according to any one of aspects 1 to 17 further includes one or more electrical components embedded in the thermal management system.

[0081] In aspect 19, the wearable component according to any one of aspects 1 to 18, wherein the thermal management system does not include any fan.

[0082] In aspect 20, the wearable component according to any one of aspects 1 to 19, wherein the thermal management system does not include any vents.

[0083] In a 21st aspect, a wearable component configured to be worn on a user's head is disclosed. The wearable component may include an internal mechanical structure and a housing structure mechanically coupled to the internal mechanical structure, such that the internal mechanical structure is located between the user side of the wearable component and the housing structure. The internal mechanical structure may be configured to transfer heat away from the user side of the wearable component to the housing structure. Thermally conductive vias may extend from the internal mechanical structure at least partially through the thickness of the housing structure.

[0084] In aspect 22, the wearable component according to aspect 21, wherein the internal mechanical structure includes a thermally conductive planar member coupled to the rear surface of the housing structure.

[0085] In aspect 23, the wearable component according to aspect 22, wherein a thermally conductive via is coupled to or formed together with a thermally conductive planar member, and the thermally conductive via is disposed non-parallel to the thermally conductive planar member.

[0086] In aspect 24, the wearable component according to any one of aspects 21 to 23, wherein the housing structure includes a laminated structure and thermally conductive vias extend through a plurality of layers of the laminated structure.

[0087] In aspect 25, the wearable component according to aspect 24, wherein the laminated structure comprises a plurality of alternating first and second layers, the first layer having a higher thermal conductivity than the second layer.

[0088] In the 26th aspect, the wearable component according to any one of aspects 21 to 25 further includes an electronic component coupled to the wearable component, wherein the internal mechanical structure is configured to transfer heat from the electronic component to the housing structure.

[0089] In aspect 27, the wearable component according to any one of aspects 25 to 26, wherein when the wearable component is worn on a user's head, heat is conducted through thermally conductive vias and through a plurality of alternating first and second layers to conduct heat away from the user's head.

[0090] In aspect 28, a method for manufacturing a wearable component is disclosed, the wearable component being configured to be worn on a user's head. The method may include: providing an internal mechanical structure and a thermally conductive via extending from the internal mechanical structure at least partially through the thickness of a housing structure. The method may include: mechanically coupling a rear surface of the housing structure to the internal mechanical structure such that the internal mechanical structure is located between the user side of the wearable component and the housing structure. The internal mechanical structure may be configured to transfer heat away from the user side of the wearable component to the housing structure.

[0091] In aspect 29, the method according to aspect 28 further includes providing an electronic component that is thermally connected to the internal mechanical structure.

[0092] In aspect 30, the method according to aspect 28 or 29 further includes forming one or more grooves through at least a portion of the thickness of the internal mechanical structure, the one or more grooves being configured to control the deflection of the internal mechanical structure.

[0093] Other considerations

[0094] Each of the processes, methods, and algorithms depicted in this description and / or the accompanying drawings may be embodied in a code module executed by one or more physical computing systems, hardware computer processors, dedicated circuitry, and / or electronic hardware configured to execute specific and particular computer instructions, and may be fully or partially automated by the code module. For example, a computing system may include a general-purpose computer (e.g., a server) programmed with specific computer instructions or dedicated computers, dedicated circuitry, etc. The code module may be compiled and linked into an executable program, installed in a dynamic link library, or written in an interpreted programming language. In some implementations, specific operations and methods may be performed by circuitry specific to a given function.

[0095] Furthermore, certain embodiments of the functionality of this disclosure are mathematically, computationally, or technically complex enough that it may be necessary to use dedicated hardware or one or more physical computing devices (using appropriate dedicated executable instructions) to perform the functionality, for example, due to the amount or complexity of the computations involved or the need to provide results substantially in real time. For example, video may comprise many frames, each with millions of pixels, and requires specially programmed computer hardware to process the video data to provide the required image processing tasks or applications within a commercially reasonable timeframe.

[0096] Code modules or any type of data can be stored on any type of non-transitory computer-readable medium, such as physical computer storage devices including hard disk drives, solid-state storage, random access memory (RAM), read-only memory (ROM), optical disks, volatile or non-volatile storage devices, combinations thereof, etc. Methods and modules (or data) can also be transmitted as generated data signals (e.g., as part of a carrier wave or other analog or digital propagation signal) on various computer-readable transmission media (including wireless-based and wired / cable-based media), and can take many forms (e.g., as part of a single or multiplexed analog signal, or as multiple discrete digital packets or frames). The results of the disclosed processes or process steps can be persistently or otherwise stored in any type of non-transitory tangible computer storage device, or can be transmitted via a computer-readable transmission medium.

[0097] Any process, block, state, step, or function depicted in the flowcharts described herein and / or the accompanying drawings should be understood to represent code modules, code segments, or code portions, including one or more executable instructions for implementing a particular function (e.g., logic or arithmetic) or step in a process. Various processes, blocks, states, steps, or functions can be combined, rearranged, added, deleted, modified, or otherwise changed with the illustrative examples provided herein. In some embodiments, additional or different computing systems or code modules may perform some or all of the functions described herein. The methods and processes described herein are not limited to any particular sequence, and the blocks, steps, or states associated with them may be executed in other suitable orders, such as serially, in parallel, or in some other manner. Tasks or events may be added to or removed from the disclosed example embodiments. Furthermore, the separation of various system components in the embodiments described herein is for illustrative purposes and should not be construed as requiring such separation in all embodiments. It should be understood that the described program components, methods, and systems can generally be integrated together in a single computer product or packaged into multiple computer products. Many variations of implementation are possible.

[0098] Processes, methods, and systems can be implemented in a networked (or distributed) computing environment. Networked environments include enterprise-wide computer networks, intranets, local area networks (LANs), wide area networks (WANs), personal area networks (PANs), cloud computing networks, crowdsourced computing networks, the Internet, and the World Wide Web. The network can be wired or wireless, or any other type of communication network.

[0099] This invention includes methods that can be performed using this device. The method may include the act of providing such a suitable device. This provision may be performed by an end user. In other words, the act of "providing" requires only that the end user obtain, access, approach, locate, set, activate, power on, or otherwise act to provide the necessary device in this method. The methods described herein may be performed in any order of events, which is logically possible and arranged in the order of the events.

[0100] The systems and methods disclosed herein each have several innovative aspects, none of which individually claims or requires the desired properties disclosed herein. The various features and processes described above can be used independently of each other or combined in various ways. All possible combinations and sub-combinations are intended to fall within the scope of this disclosure. Various modifications to the embodiments described herein will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments without departing from the spirit or scope of this disclosure. Therefore, the claims are not intended to be limited to the embodiments shown herein, but are consistent with the widest scope according to this disclosure, the principles disclosed herein, and the novel features.

[0101] In the context of individual implementations, certain features described herein may also be implemented in combination in a single implementation. Conversely, the various features described in the context of a single implementation may also be implemented individually or in any suitable sub-combination in multiple implementations. Furthermore, although the features described above may be described as functioning in certain combinations and even initially claimed in this way, in some cases one or more features from the claimed combination may be removed from the combination, and the claimed combination may be for sub-combinations or variations thereof. For each and all embodiments, the need for a single feature or group of features is neither necessary nor essential.

[0102] Unless otherwise stated, or otherwise understood in the context in which they are used, the conditional language used herein, such as “can,” “may,” “possibly,” “may,” “e.g.,” etc., is generally intended to convey that some embodiments include certain features, elements, and / or steps, while other embodiments do not include certain features, elements, and / or steps. Therefore, such conditional language is not generally intended to imply that one or more embodiments require features, elements, and / or steps in any way, or that one or more embodiments must include logic for determining whether such features, elements, and / or steps are included or will be performed in any particular embodiment (whether or not the author has entered or prompted). The terms “comprising,” “including,” “having,” etc., are synonymous and used in an open-ended manner, and do not exclude additional elements, features, actions, operations, etc. Furthermore, the term “or” is used in its inclusive sense (rather than in its exclusive sense), and thus, when used, for example, to connect a list of elements, the term “or” means one, some, or all of the elements in the list. Additionally, unless otherwise stated, the articles “a,” “an,” and “the” used in this application and the appended claims should be understood to mean “one or more” or “at least one.” Unless specifically defined herein, all technical and scientific terms used herein are given the meaning as broadly as commonly understood while preserving the validity of the claims. It should also be noted that claims may be drafted to exclude any optional elements.

[0103] As used herein, the phrase “at least one” in the list of items means any combination of those items, including individual members. For example, “at least one of A, B, or C” is intended to cover: A, B, C, A and B, A and C, B and C, and A, B, and C. Unless otherwise specifically stated, union language such as the phrase “at least one of X, Y, and Z” is otherwise understood by context as generally used to convey that an item, term, etc., may be at least one of X, Y, or Z. Therefore, such union language is not generally intended to imply that certain embodiments require the presence of at least one of X, at least one of Y, and at least one of Z.

[0104] Similarly, while operations may be depicted in the accompanying drawings in a specific order, it should be understood that it is not necessary to perform these operations in the specific order shown or sequentially, or to perform all of the shown operations, to achieve the desired result. Furthermore, the drawings may schematically depict one or more example processes in the form of flowcharts. However, other operations not shown may be included in the schematically shown example methods and processes. For example, one or more additional operations may be performed before, after, simultaneously with, or between any of the shown operations. Additionally, operations may be rearranged or reordered in other embodiments. In some cases, multitasking and parallel processing may be advantageous. Furthermore, the separation of various system components in the above embodiments should not be construed as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products. Additionally, other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims may be performed in a different order and still achieve the desired result.

Claims

1. A wearable component configured to be worn on a user's head, the wearable component including a user surface configured to face the user's head when worn by the user and an outer surface opposite to the user surface and spaced apart from the user surface along a first direction not parallel to the user surface, the outer surface being configured to face away from the user's head when worn by the user, the wearable component comprising: A wearable support member having a thickness along the first direction; Electronic components that are in thermal communication with the wearable support; The thermal management structure is in thermal communication with the electronic component. The thermal management structure includes a thermally conductive structure extending through at least a portion of the thickness of the wearable support and configured to transfer heat along a first direction from the user surface of the electronic component away from the wearable component toward the outer surface of the wearable component. The thermally conductive structure includes a thermally conductive planar member in thermal communication with the electronic component and a thermally conductive via coupled to or formed together with the planar member. The thermally conductive via extends non-parallel from the planar member such that the planar member is disposed between the thermally conductive via and the electronic component. The thermal management structure includes multiple layers disposed around the thermally conductive via.

2. The wearable component according to claim 1, wherein, The thermal management structure includes a mechanical structure disposed in or on the wearable support and in thermal communication with the electronic components.

3. The wearable component according to claim 2, further comprising: One or more grooves are formed through at least a portion of the thickness of the mechanical structure, and the one or more grooves are configured to control the deflection of the mechanical structure.

4. The wearable component according to claim 2, wherein, The thermal management structure includes a housing coupled to the mechanical structure such that the mechanical structure is located between the user side of the wearable component and the housing structure, and wherein the mechanical structure is configured to transfer heat from the electronic component to the housing, the housing including the plurality of layers.

5. The wearable component according to claim 4, wherein, The thermally conductive via extends at least partially through the thickness of the housing.

6. The wearable component according to claim 5, wherein, The thermally conductive planar component is coupled to the rear surface of the housing.

7. The wearable component according to claim 4, wherein, The outer shell includes a laminated structure.

8. The wearable component according to claim 7, wherein, The laminated structure comprises multiple alternating first and second layers, wherein the first layer has a higher thermal conductivity than the second layer.

9. The wearable component according to claim 8, wherein, The first layer includes reinforcing material.

10. The wearable component of claim 9, wherein, The reinforcing material includes fibers or fabrics.

11. The wearable component of claim 10, wherein, The first layer comprises carbon fiber.

12. The wearable component of claim 8, wherein, The second layer comprises epoxy resin.

13. The wearable component of claim 12, further comprising: One or more thermally conductive components within the epoxy resin.

14. The wearable component of claim 13, wherein, The one or more thermally conductive components include at least one of carbon nanotubes, graphene, or metal.

15. The wearable component of claim 1, wherein, The electronic components include at least one of a processor and a camera.

16. The wearable component of claim 1, wherein, The wearable components include augmented reality devices.

17. The wearable component of claim 1, further comprising: One or more electronic components embedded in the thermal management structure.

18. The wearable component of claim 1, wherein, The thermal management structure does not include any fans.

19. The wearable component of claim 1, wherein, The thermal management structure does not include any vents.

20. A wearable component configured to be worn on a user's head, the wearable component including a user surface configured to face the user's head when worn by the user and an outer surface opposite to the user surface and spaced apart from the user surface along a first direction not parallel to the user surface, the outer surface being configured to face away from the user's head when worn by the user, the wearable component comprising: A wearable support having a thickness along the first direction; electronic components in thermal communication with the wearable support; A thermally conductive planar component that is in thermal communication with the electronic components; An array of multiple thermally conductive vias, which are in thermal communication with the electronic component and configured to transfer heat along the first direction from the electronic component away from the user surface of the wearable component through at least a portion of the thickness, the multiple thermally conductive vias being coupled to or formed together with the planar member, the multiple thermally conductive vias extending non-parallel from the planar member such that the planar member is disposed between the multiple thermally conductive vias and the electronic component; And multiple layers, which are disposed around the multiple thermally conductive vias.

21. The wearable component of claim 20, further comprising a mechanical structure and a housing, the mechanical structure being disposed in or on the wearable support and in thermal communication with the electronic component, and the housing being coupled to the mechanical structure such that the mechanical structure is located between the user surface of the wearable component and the housing structure, wherein, The mechanical structure is configured to transfer heat from the electronic components to the housing, and the array of the plurality of thermally conductive vias extends at least partially through the thickness of the housing, which includes the plurality of layers.

22. A wearable component configured to be worn on a user's head, the wearable component including a user surface configured to face the user's head when worn by the user and an outer surface opposite to the user surface and spaced apart from the user surface along a first direction not parallel to the user surface, the outer surface being configured to face away from the user's head when worn by the user, the wearable component comprising: A wearable support member having a thickness along the first direction; Electronic components that are in thermal communication with the wearable support; The device also includes a thermal management structure in thermal communication with the electronic component, the thermal management structure comprising a thermally conductive structure extending through at least a portion of the thickness of the wearable support and configured to transfer heat along the first direction from the user surface of the electronic component away from the wearable component toward the outer surface of the wearable component, wherein the thermally conductive structure comprises: a thermally conductive planar member in thermal communication with the electronic component, and a thermally conductive via coupled to or formed together with the planar member, the thermally conductive via extending substantially perpendicularly from the planar member such that the planar member is disposed between the thermally conductive via and the electronic component.

23. The wearable component of claim 22, further comprising: A plurality of alternating first and second layers are arranged around the thermally conductive via, wherein the first layer has a higher thermal conductivity than the second layer.

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