A semiconductor refrigeration intelligent control device

Abstract

The present invention discloses a semiconductor refrigeration intelligent control device, which relates to the field of semiconductor refrigeration technology, and includes: a semiconductor refrigeration box, a moisture absorption component is arranged on one side inner wall of the semiconductor refrigeration box, and an embedded groove is opened inside the semiconductor refrigeration box. When the present invention is used, the humidity sensor is started to detect the humidity of the environment in the semiconductor refrigeration box, and the detection result is transmitted to the PLC controller. When the humidity data received by the PLC controller exceeds the maximum working threshold, the motor will be controlled to start, drive the rotating shaft to rotate counterclockwise, and then drive the conveying cylinder to rotate counterclockwise, so that the arc groove on the left side rotates to the bottom, and at this time, the diatomaceous earth moisture absorption rod falls into the feeding pipe through the feeding hole, and falls into the receiving frame, and the moisture in the air is adsorbed and absorbed into the diatomaceous earth, effectively reducing the water vapor in the air from entering the inside of the semiconductor refrigerator body.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration, and in particular to an intelligent control device for semiconductor refrigeration. Background Art

[0002] Semiconductor refrigeration, also known as electronic refrigeration or thermoelectric refrigeration, is a discipline on the edge of refrigeration technology and semiconductor technology. It uses PN junctions composed of special semiconductor materials to form thermocouple pairs to produce Peltier effect, that is, a new refrigeration method through DC refrigeration. It is known as the world's three major refrigeration methods along with compression refrigeration and absorption refrigeration. Semiconductor refrigerator refers to a device that uses the thermal-electric effect of semiconductors to produce cooling capacity, also known as a thermoelectric refrigerator. When two different metals are connected with a conductor and DC is turned on, the temperature at one junction decreases and the temperature at the other junction increases. Semiconductor refrigeration technology originated in the last century and is an important research material in the semiconductor industry and materials chemistry. Semiconductor refrigerators have the characteristics of no noise, no vibration, no need for refrigerants, small size, light weight, etc., and are reliable, easy to operate, and easy to adjust the cooling capacity.

[0003] In the prior art, during the use of a semiconductor refrigerator, a low temperature is generated through the cooling end and a high temperature is generated through the heating end. The cooling end of the semiconductor refrigerator is placed in a semiconductor refrigerator, so that the inside of the semiconductor refrigerator generates a low temperature, thereby enabling objects inside the semiconductor refrigerator to be preserved at a low temperature. When the temperature of the cooling end of the semiconductor refrigerator is lower than the dew point temperature of the environment, it is easy to cause water vapor in the air to condense into liquid water and enter the semiconductor refrigerator, causing a circuit short circuit or other damage.

[0004] Therefore, we proposed a semiconductor refrigeration intelligent control device to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor refrigeration intelligent control device to solve the problem that when the temperature of the refrigeration end of the semiconductor refrigerator is lower than the dew point temperature of the environment during use, it is easy to cause water vapor in the air to condense into liquid water and enter the semiconductor refrigerator, causing circuit short circuit or other damage.

[0006] To achieve the above object, the present invention provides the following technical solution: a semiconductor refrigeration intelligent control device, comprising: a semiconductor refrigeration box, a moisture absorption component is arranged on one inner wall of the semiconductor refrigeration box, an embedded groove is opened inside the semiconductor refrigeration box, and a semiconductor refrigerator body is arranged on the front surface wall of the embedded groove;

[0007] The desiccant assembly comprises a fixed cylinder, a motor is fixedly mounted on the front surface of the fixed cylinder via an auxiliary plate, a rotating shaft is fixedly mounted on the output end of the motor, a conveying cylinder is fixedly mounted on the outer surface of the rotating shaft, four arc grooves are equidistantly formed on the outer surface of the conveying cylinder, diatomaceous earth desiccant rods are movably embedded in two of the arc grooves, and a transparent desiccant box is arranged at the bottom of the fixed cylinder.

[0008] Preferably, a PLC controller is provided on the front wall of the embedded groove close to the bottom surface, a temperature sensor is installed on the top surface inside the semiconductor refrigeration box by screws, and a humidity sensor is installed on the inner wall of one side close to the top surface of the semiconductor refrigeration box by bolts.

[0009] Preferably, a feeding hole is provided on the outer surface of the fixed cylinder close to the top surface, a feeding box is fixedly connected to the outer surface of the feeding hole, and the width of the interior of the feeding box matches the width of the interior of the feeding hole.

[0010] Preferably, a sealing cover is provided on the top of the loading box, a sealing gasket is fixedly connected to the top surface inside the sealing cover, and an outer surface of the sealing gasket is in contact with an inner wall of the loading box close to the top.

[0011] Preferably, a material discharge hole is provided on the outer surface of the fixed cylinder away from the material discharge hole, and a material discharge pipe is fixedly connected to the outer surface of the material discharge hole.

[0012] Preferably, one side outer surface of the transparent desiccant box is fixedly mounted on one side inner wall of the semiconductor refrigeration box, a receiving frame is movably embedded inside the transparent desiccant box, a pull-out hole is opened on the front surface of the transparent desiccant box, and the outer surface of the receiving frame close to the front side is movably embedded inside the pull-out hole.

[0013] Preferably, a plurality of first flow holes are provided at the bottom of the transparent moisture absorbing box, and a plurality of second flow holes are provided on the other outer surface of the transparent moisture absorbing box.

[0014] Preferably, the outer surfaces of the fixing tube close to the front side and the rear side are fixedly mounted with cross-shaped frames, and the outer surfaces of the two cross-shaped frames are fixedly mounted on an inner wall of one side of the semiconductor refrigeration box.

[0015] Preferably, the output end of the motor movably penetrates into the interior of the fixed cylinder, one end of the rotating shaft is movably embedded in the rear surface wall of the fixed cylinder, and the width of the outer surface of the transmission cylinder matches the width of the interior of the fixed cylinder.

[0016] Preferably, a mounting groove is provided on the rear surface of the semiconductor refrigeration box, an inspection door is installed inside the mounting groove by screws, a plurality of heat dissipation holes are provided on the rear surface of the inspection door, and a box door is rotatably connected to the front surface of the semiconductor refrigeration box by hinges.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. When the present invention is used, the humidity sensor is started to detect the humidity of the environment in the semiconductor refrigeration box, and the detection result is transmitted to the PLC controller. When the humidity data received by the PLC controller exceeds the maximum working threshold, the motor will be controlled to start, driving the rotating shaft to rotate counterclockwise, and then driving the conveying cylinder to rotate counterclockwise, so that the arc groove on the left side rotates to the bottom. At this time, the diatomaceous earth moisture absorption rod falls into the discharge pipe through the discharge hole and falls into the receiving frame, adsorbing and absorbing the moisture in the air into the diatomaceous earth, thereby achieving the effect of moisture absorption, effectively reducing the water vapor in the air from entering the interior of the semiconductor refrigerator body, and preventing the occurrence of condensation.

[0019] 2. When in use, start the temperature sensor to detect the temperature inside the semiconductor refrigeration box in real time, and transmit the detection result to the PLC controller. The PLC controller can dynamically adjust the working temperature of the semiconductor refrigerator body, reduce or increase the working temperature threshold of the semiconductor refrigerator body, make it more sensitive to respond and enhance or reduce the refrigeration effect. When the refrigeration effect is reduced, it means that the temperature of the refrigeration end is improved, and an appropriate temperature difference is maintained with the environment to reduce condensation. Through the cooperation of the temperature sensor and the PLC controller, the temperature is detected in real time and the refrigeration effect is adjusted in time, which can avoid over-refrigeration or insufficient refrigeration and reduce energy waste.

[0020] 3. When in use, the feeding box is set at a certain height to store some spare diatomaceous earth desiccant rods, which does not require users to add them frequently. The spare diatomaceous earth desiccant rods and the desiccant assembly cooperate to achieve the effect of automatic feeding. The receiving frame is pulled out from the pull-out hole to facilitate the removal of the saturated diatomaceous earth desiccant rods. The moisture is removed by ventilation and drying or heating to restore the desiccant performance and can be used again. The top of the feeding box is sealed with a sealing cover to prevent the spare diatomaceous earth desiccant rods inside the feeding box from accidentally absorbing moisture in the air, resulting in poor desiccant effect during subsequent use. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a front perspective view of a semiconductor refrigeration intelligent control device of the present invention;

[0022] Figure 2 It is a structural unfolded stereogram of a semiconductor refrigeration intelligent control device of the present invention;

[0023] Figure 3 It is a structural cross-sectional expanded stereoscopic diagram of a semiconductor refrigeration box in a semiconductor refrigeration intelligent control device of the present invention;

[0024] Figure 4It is a cross-sectional and expanded stereoscopic view of the structure of a semiconductor refrigeration box in a semiconductor refrigeration intelligent control device of the present invention from another angle;

[0025] Figure 5 It is a structural cross-sectional expanded stereoscopic diagram of a moisture absorption component in a semiconductor refrigeration intelligent control device of the present invention;

[0026] Figure 6 It is a structural cross-sectional expanded stereoscopic diagram of a fixing cylinder in a semiconductor refrigeration intelligent control device of the present invention;

[0027] Figure 7 It is a cross-sectional and expanded stereoscopic diagram of the structure of a sealing cover in a semiconductor refrigeration intelligent control device of the present invention;

[0028] Figure 8 It is a three-dimensional diagram of the structure of a receiving frame in a semiconductor refrigeration intelligent control device of the present invention.

[0029] In the figure: 1. semiconductor refrigeration box; 2. semiconductor refrigerator body; 3. desiccant assembly; 301. fixing cylinder; 302. bracket; 303. motor; 304. transparent desiccant box; 305. rotating shaft; 306. conveying cylinder; 307. arc groove; 308. unloading pipe; 309. loading box; 310. diatomaceous earth desiccant rod; 311. sealing cover; 312. receiving frame; 313. first circulation hole; 314. second circulation hole; 315. pulling hole; 316. loading hole; 317. unloading hole; 318. sealing pad; 4. humidity sensor; 5. temperature sensor; 6. box door; 7. embedded groove; 8. installation groove; 9. PLC controller; 10. inspection door; 11. heat dissipation hole. Implementation

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figure 1 - Figure 8 As shown, the present invention provides a technical solution: a semiconductor refrigeration intelligent control device, such as Figure 1As shown, the semiconductor refrigeration intelligent control device of this embodiment includes: a semiconductor refrigeration box 1, a desiccant component 3 is arranged on the inner wall of one side of the semiconductor refrigeration box 1, an embedded groove 7 is opened inside the semiconductor refrigeration box 1, a semiconductor refrigerator body 2 is arranged on the front surface wall of the embedded groove 7, the desiccant component 3 includes a fixed cylinder 301, a motor 303 is fixedly installed on the front surface of the fixed cylinder 301 through an auxiliary plate, a rotating shaft 305 is fixedly installed on the output end of the motor 303, a conveying cylinder 306 is fixedly installed on the outer surface of the rotating shaft 305, four arc grooves 307 are opened at equal intervals on the outer surface of the conveying cylinder 306, diatomaceous earth desiccant rods 310 are movably embedded in the inside of two of the arc grooves 307, and a transparent desiccant box 304 is arranged at the bottom of the fixed cylinder 301.

[0032] At the same time according to Figure 1 - Figure 4 As shown, a PLC controller 9 is provided on the front wall of the embedded groove 7 near the bottom surface, a temperature sensor 5 is installed on the top surface inside the semiconductor refrigeration box 1 by screws, and a humidity sensor 4 is installed on the inner wall of one side near the top surface of the semiconductor refrigeration box 1 by bolts. The temperature sensor 5 can detect the temperature inside the semiconductor refrigeration box 1 in real time, and transmit the detection result to the PLC controller 9 in the form of an electrical signal. The PLC controller 9 can dynamically adjust the working temperature of the semiconductor refrigerator body 2, reduce or increase the working temperature threshold of the semiconductor refrigerator body 2, and adjust the refrigeration effect in time to avoid over-refrigeration or insufficient refrigeration, thereby reducing energy waste. The humidity of the air can be detected in real time by the humidity sensor 4, and then the moisture absorption component 3 can be used to absorb moisture in time to reduce water vapor in the air.

[0033] according to Figure 1 , Figure 4 and Figure 7 As shown, a loading hole 316 is provided on the outer surface of the fixed cylinder 301 near the top surface, and a loading box 309 is fixedly connected to the outer surface of the loading hole 316. The width of the interior of the loading box 309 matches the width of the interior of the loading hole 316. The loading box 309 is used to store spare diatomaceous earth desiccant rods 310, and the diatomaceous earth desiccant rods 310 in the loading box 309 are sent to the arc groove 307 for transmission through the loading hole 316.

[0034] according to Figure 5 - Figure 7 As shown, a sealing cover 311 is provided on the top of the loading box 309, and a sealing gasket 318 is fixedly connected to the top surface inside the sealing cover 311. The outer surface of the sealing gasket 318 is in contact with the inner wall of the loading box 309 near the top. The top of the loading box 309 is sealed by the sealing cover 311 to prevent the spare diatomaceous earth desiccant rod 310 inside the loading box 309 from accidentally absorbing moisture in the air, resulting in poor desiccant effect during subsequent use. The sealing gasket 318 can increase the sealing performance.

[0035] according to Figure 5 - Figure 7 As shown, a discharge hole 317 is provided on the outer surface of the fixed cylinder 301 away from the loading hole 316, and a discharge pipe 308 is fixedly connected to the outer surface of the discharge hole 317. The diatomaceous earth desiccant rod 310 is conveniently delivered into the discharge pipe 308 through the discharge hole 317. The discharge pipe 308 is located above the receiving frame 312, so that the diatomaceous earth desiccant rod 310 in the discharge pipe 308 falls into the receiving frame 312.

[0036] according to Figure 1 and Figure 4 - Figure 8 As shown, one side outer surface of the transparent desiccant box 304 is fixedly mounted on one side inner wall of the semiconductor refrigeration box 1, a receiving frame 312 is movably embedded inside the transparent desiccant box 304, a pull-out hole 315 is opened on the front surface of the transparent desiccant box 304, the outer surface of the receiving frame 312 close to the front side is movably embedded inside the pull-out hole 315, the diatomaceous earth desiccant rod 310 is received by the receiving frame 312, and then comes into contact with the air inside the semiconductor refrigeration box 1 to absorb moisture, a pull rod is installed on the front surface of the receiving frame 312, and the receiving frame 312 can be pulled out of the pull-out hole 315 by the pull rod, so that the user can take out the saturated diatomaceous earth desiccant rod 310.

[0037] according to Figure 1 , Figure 4 - Figure 6 and Figure 8 As shown, a plurality of first flow holes 313 are provided at the bottom of the transparent desiccant box 304, and a plurality of second flow holes 314 are provided on the other outer surface of the transparent desiccant box 304. The transparent desiccant box 304 is provided with the first flow holes 313 and the second flow holes 314 so that the diatomaceous earth desiccant rod 310 can fully contact with the air, thereby improving the desiccant effect.

[0038] according to Figure 1 and Figure 4 - Figure 6 As shown, the outer surfaces of the fixed cylinder 301 near the front and rear sides are fixedly installed with cross-shaped frames 302, and the outer surfaces of the two cross-shaped frames 302 are fixedly installed on one inner wall of the semiconductor refrigeration box 1, so that the fixed cylinder 301 can be fixedly installed through the cross-shaped frames 302.

[0039] according to Figure 1 - Figure 4 - Figure 7As shown, the output end of the motor 303 is movably penetrated into the interior of the fixed cylinder 301, and one end of the rotating shaft 305 is movably embedded in the rear surface wall of the fixed cylinder 301. The width of the outer surface of the conveying cylinder 306 matches the width of the interior of the fixed cylinder 301, so that when the motor 303 drives the rotating shaft 305 to rotate, the conveying cylinder 306 is driven to rotate, and the diatomaceous earth desiccant rod 310 is conveyed to the discharge hole 317.

[0040] according to Figure 1 - Figure 3 As shown, a mounting groove 8 is provided on the rear surface of the semiconductor refrigeration box 1, and an inspection door 10 is installed inside the mounting groove 8 by screws. A plurality of heat dissipation holes 11 are provided on the rear surface of the inspection door 10. A box door 6 is rotatably connected to the front surface of the semiconductor refrigeration box 1 by hinges. The inspection door 10 facilitates disassembly or maintenance of the equipment inside the embedded groove 7, and the heat dissipation holes 11 facilitate the radiator on the semiconductor refrigerator body 2 to discharge hot air to the outside.

[0041] The effect achieved by the entire mechanism is as follows: when in use, the semiconductor refrigerator body 2, the motor 303, the humidity sensor 4, the temperature sensor 5 and the PLC controller 9 are electrically connected, the external power supply is turned on, the PLC controller 9, the semiconductor refrigerator body 2, the humidity sensor 4 and the temperature sensor 5 are started, the semiconductor refrigerator body 2 is composed of a P-type semiconductor material, an N-type semiconductor material, an electrode and a heat sink, when current passes through the semiconductor material, the electrons of the P-type semiconductor will flow from the cold end to the hot end, absorb heat, and increase the temperature of the hot end, at the same time, the holes of the N-type semiconductor will flow from the hot end to the cold end, release heat, and reduce the temperature of the cold end, thereby making the internal temperature of the semiconductor refrigerator 1 The temperature sensor 5 detects the temperature inside the semiconductor refrigerator 1 in real time, and transmits the detection result to the PLC controller 9 in the form of an electrical signal. The maximum and minimum working thresholds of the temperature are set in advance inside the PLC controller 9. The PLC controller 9 identifies and compares the received temperature data. When the received temperature value exceeds the maximum working threshold, the PLC controller 9 can dynamically adjust the working temperature of the semiconductor refrigerator body 2, reduce the working temperature threshold of the semiconductor refrigerator body 2, make it more sensitive to respond and enhance the cooling effect. When the temperature value received by the PLC controller 9 is lower than the minimum working threshold, the PLC controller 9 increases the semiconductor refrigerator body 2. The working temperature threshold is set to increase the temperature of the refrigeration end so that an appropriate temperature difference is maintained between the refrigeration end and the internal environment of the semiconductor refrigeration box 1 to avoid the refrigeration end temperature being too low, which is prone to condensation. The temperature sensor 5 and the PLC controller 9 are used to detect the temperature in real time and adjust the refrigeration effect in time to avoid over-refrigeration or under-refrigeration, thereby reducing energy waste, improving the energy efficiency of the refrigerator, and saving energy costs. At the same time, the humidity sensor 4 is started to detect the humidity of the environment in the semiconductor refrigeration box 1 in real time through the humidity sensor 4, and the detection result is transmitted to the PLC controller 9 in the form of an electrical signal. The maximum and minimum working thresholds of the humidity are set in advance inside the PLC controller 9. The PLC controller 9 identifies the humidity data received and compares it with the maximum working threshold value set in advance. When the humidity data received exceeds the maximum working threshold value, it indicates that the water vapor content inside the semiconductor refrigeration box 1 is relatively large. The PLC controller 9 controls the motor 303 to start, and drives the rotating shaft 305 to rotate counterclockwise through the output end of the motor 303, and then drives the conveying cylinder 306 to rotate counterclockwise. The rotation path of the output end of the motor 303 is set in advance, and it will automatically pause after each rotation of ninety degrees. A spare diatomaceous earth desiccant rod 310 is stored in the loading box 309. The diatomaceous earth desiccant rod 310 is received in the arc grooves 307 on the top and left of the four arc grooves 307. Figure 6As shown, when the output end of the motor 303 rotates 90 degrees and automatically pauses, the arc groove 307 with the diatomaceous earth moisture absorption rod 310 on the top rotates to the left, and the arc groove 307 on the left rotates to the bottom and is located directly above the discharge hole 317. At this time, the diatomaceous earth moisture absorption rod 310 inside it enters the discharge pipe 308 through the discharge hole 317 under the action of gravity. The discharge pipe 308 is located above the receiving frame 312, so that the diatomaceous earth moisture absorption rod 310 in the discharge pipe 308 falls into the receiving frame 312. At this time, the diatomaceous earth moisture absorption rod 310 can contact with the air inside the semiconductor refrigeration box 1. Diatomaceous earth is a natural porous material. , its surface has a large number of tiny pores and micropores. This porous structure makes diatomite have a large specific surface area, which can better adsorb, absorb and store moisture. Diatomite also contains a certain proportion of moisture adsorbents, such as calcium chloride. These moisture absorbents can adsorb and absorb moisture in the air into diatomite through hygroscopic action, thereby achieving the effect of moisture absorption, effectively reducing the water vapor in the air from entering the semiconductor refrigerator body 2, preventing the occurrence of condensation, and solving the problem that when the temperature of the cooling end of the semiconductor refrigerator is lower than the dew point temperature of the environment during use, it is easy to cause the water vapor in the air to condense into liquid water and enter the semiconductor. In the refrigerator, there is a problem of circuit short circuit or other damage. The loading box 309 is made of transparent material, and the stock status of the diatomaceous earth desiccant rod 310 in the loading box 309 can be seen in real time, which is convenient for the user to replenish the diatomaceous earth desiccant rod 310 in time. The loading box 309 is set at a certain height, and some spare diatomaceous earth desiccant rods 310 can be stored, and the user does not need to add them frequently. Through the cooperation of the spare diatomaceous earth desiccant rod 310 and the desiccant component 3, the effect of automatic feeding is achieved. A pull rod is installed on the front surface of the receiving frame 312, and the receiving frame 312 can be pulled out from the pull-out hole 315 by the pull rod, which is convenient for the user to absorb The saturated diatomaceous earth desiccant stick 310 is taken out and placed in an external environment for ventilation and drying, or the adsorbed moisture is removed by heating to restore the desiccant performance of the diatomaceous earth and can be used again to reduce waste. The transparent desiccant box 304 is provided with a first flow hole 313 and a second flow hole 314 to facilitate the diatomaceous earth desiccant stick 310 to fully contact the air and improve the desiccant effect. The top of the loading box 309 is sealed by the sealing cover 311 to prevent the spare diatomaceous earth desiccant stick 310 inside the loading box 309 from accidentally absorbing moisture in the air, resulting in poor desiccant effect during subsequent use. The sealing gasket 318 can increase the sealing performance.

[0042] Among them, the semiconductor refrigerator body 2, the motor 303, the humidity sensor 4, the temperature sensor 5 and the PLC controller 9 are all existing technologies, and their components and operating principles are all public technologies, which will not be explained in detail here.

[0043] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor refrigeration intelligent control device, characterized in that: include: A semiconductor refrigeration box (1), wherein a moisture absorption component (3) is arranged on an inner wall of one side of the semiconductor refrigeration box (1), an embedded groove (7) is provided inside the semiconductor refrigeration box (1), and a semiconductor refrigerator body (2) is arranged on a front surface wall of the embedded groove (7); The moisture absorption component (3) comprises a fixed cylinder (301), a motor (303) is fixedly mounted on the front surface of the fixed cylinder (301) via an auxiliary plate, a rotating shaft (305) is fixedly mounted on the output end of the motor (303), a transmission cylinder (306) is fixedly mounted on the outer surface of the rotating shaft (305), four arc-shaped grooves (307) are equidistantly formed on the outer surface of the transmission cylinder (306), two of the arc-shaped grooves (307) are movably embedded with diatomaceous earth moisture absorption rods (310), and a transparent moisture absorption box (304) is arranged at the bottom of the fixed cylinder (301); A loading hole (316) is provided on the outer surface of the fixed cylinder (301) close to the top surface, a loading box (309) is fixedly connected to the outer surface of the loading hole (316), and the width of the interior of the loading box (309) matches the width of the interior of the loading hole (316); A sealing cover (311) is provided on the top of the loading box (309), a sealing gasket (318) is fixedly connected to the top surface inside the sealing cover (311), and an outer surface of the sealing gasket (318) is in contact with an inner wall of the loading box (309) near the top; A material discharge hole (317) is formed on the outer surface of the fixed cylinder (301) away from the material discharge hole (316), and a material discharge pipe (308) is fixedly connected to the outer surface of the material discharge hole (317); One side outer surface of the transparent moisture absorbing box (304) is fixedly mounted on one side inner wall of the semiconductor refrigeration box (1); a receiving frame (312) is movably embedded inside the transparent moisture absorbing box (304); a pull-out hole (315) is provided on the front surface of the transparent moisture absorbing box (304); and the outer surface of the receiving frame (312) close to the front side is movably embedded inside the pull-out hole (315); A plurality of first circulation holes (313) are provided at the bottom of the transparent moisture absorption box (304), and a plurality of second circulation holes (314) are provided on the other outer surface of the transparent moisture absorption box (304); The outer surfaces of the fixed cylinder (301) close to the front side and the rear side are fixedly mounted with cross-shaped frames (302), and the outer surfaces of the two cross-shaped frames (302) are fixedly mounted on the inner wall of one side of the semiconductor refrigeration box (1); The output end of the motor (303) movably penetrates into the interior of the fixed cylinder (301), one end of the rotating shaft (305) is movably embedded in the rear surface wall of the fixed cylinder (301), and the width of the outer surface of the transmission cylinder (306) matches the width of the interior of the fixed cylinder (301).

2. The semiconductor refrigeration intelligent control device according to claim 1, characterized in that: A PLC controller (9) is provided on the front surface wall of the embedded groove (7) close to the bottom surface, a temperature sensor (5) is installed on the top surface inside the semiconductor refrigeration box (1) via screws, and a humidity sensor (4) is installed on the inner wall of one side close to the top surface of the semiconductor refrigeration box (1) via bolts.

3. The semiconductor refrigeration intelligent control device according to claim 1, characterized in that: The semiconductor refrigeration box (1) has a mounting groove (8) on its rear surface, an inspection door (10) is installed inside the mounting groove (8) by means of screws, a plurality of heat dissipation holes (11) are provided on the rear surface of the inspection door (10), and a box door (6) is rotatably connected to the front surface of the semiconductor refrigeration box (1) by means of a hinge.

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