Display structure and display device

Abstract

The present application discloses a display structure and a display device. Among them, the display structure includes a driving backplane and a plurality of light-emitting units arranged on the driving backplane, the light-emitting unit includes a light-emitting chip, the light-emitting chip is connected to the driving backplane, the surface of the light-emitting unit facing away from the driving backplane is the forward light-emitting surface, the surface of the light-emitting chip facing away from the driving backplane is the top surface, and the forward light-emitting surface of the light-emitting unit includes at least the top surface of the light-emitting chip; the light-emitting unit includes a reflective structure, the reflective structure is arranged on the side wall surface of the light-emitting chip, the reflective structure includes a reflective surface, the projection of the side wall surface of the light-emitting chip in the vertical reference plane is at least partially located in the projection of the reflective surface in the vertical reference plane, the vertical reference plane is perpendicular to the plate surface of the driving backplane, and the light emitted from the side wall surface of the light-emitting chip is directed toward the reflective surface, so that the light emitted from the side wall surface of the light-emitting chip is directed toward the forward light-emitting surface of the light-emitting unit. The technical solution of the present application can reduce color deviation under side viewing angles.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a display structure and a display device. Background Art

[0002] MicroLEDs (Light Emitting Diodes) emit light from both the front and side surfaces, but the side light emission coefficients of different MicroLED colors vary. When using red, green, and blue MicroLEDs for display, the intensity of the three colors is perfectly matched when viewed from the front. However, when viewed from the side, the MicroLED display will exhibit color deviation. Summary of the Invention

[0003] The purpose of this application is to provide a display structure and a display device that can reduce color deviation under side viewing angles.

[0004] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by practice of the present application.

[0005] According to one aspect of an embodiment of the present application, the present application provides a display structure, comprising a driving backplane and a plurality of light-emitting units, wherein the plurality of light-emitting units are provided on the driving backplane, the light-emitting units comprising light-emitting chips, the light-emitting chips being drivenly connected to the driving backplane, the surfaces of the light-emitting units facing away from the driving backplane being the forward light-emitting surfaces, the surfaces of the light-emitting chips facing away from the driving backplane being the top surfaces, and the forward light-emitting surfaces of the light-emitting units comprising at least the top surfaces of the light-emitting chips;

[0006] The light-emitting unit includes a reflective structure, which is arranged on the side wall of the light-emitting chip. The reflective structure includes a reflective surface. The projection of the side wall of the light-emitting chip in the vertical reference plane is at least partially located within the projection of the reflective surface on the vertical reference plane. The vertical reference plane is perpendicular to the surface of the driving backplane. The light emitted from the side wall of the light-emitting chip is emitted toward the reflective surface, so that the light emitted from the side wall of the light-emitting chip is emitted toward the forward light-emitting surface of the light-emitting unit.

[0007] In one aspect, the reflective surface includes at least two reflective layers, one end of one reflective layer is connected to the upper end of the side wall surface of the light-emitting chip, and one end of the other reflective layer is connected to the lower end of the side wall surface of the light-emitting chip, and a reflective space for reflecting light is defined between the two reflective layers;

[0008] The projection of the side wall surface of the light-emitting chip on the vertical reference plane is at least partially located within the projection of one of the reflective layers on the vertical reference plane.

[0009] In one aspect, the light-emitting unit includes a transparent filling layer, and the transparent filling layer is arranged between the two reflective layers.

[0010] In one aspect, the two reflective layers are mirror reflective surfaces;

[0011] Alternatively, the transparent filling layer is a light-dense medium, the two reflective layers are light-sparse media, the refractive index of the transparent filling layer is greater than the refractive index of the reflective layer, and the angle at which the light emitted from the side wall of the light-emitting chip is incident on the two reflective layers is greater than or equal to the critical angle of total reflection.

[0012] In one aspect, the reflective surface includes a first reflective layer and a second reflective layer, one end of the first reflective layer is connected to the upper end of the side wall of the light-emitting chip, one end of the second reflective layer is connected to the lower end of the side wall of the light-emitting chip, and the other ends of the first reflective layer and the second reflective layer away from the light-emitting chip are connected at an angle, and light emitted from the side wall of the light-emitting chip passes through the interior of the light-emitting chip and is emitted to the top surface of the light-emitting chip.

[0013] In one aspect, the first light reflecting layer and the second light reflecting layer are both planar;

[0014] Alternatively, one of the first light reflecting layer and the second light reflecting layer is a flat surface, and the other is a curved surface, and the curved surface is convex in a direction away from the light emitting chip.

[0015] In one aspect, the light-emitting unit includes a first flat layer, which is arranged between the light-emitting chip and the driving backplane, the first reflective layer extends downward from the upper end of the side wall surface of the light-emitting chip, and the second reflective layer is a plane, which is arranged on the side of the first flat layer away from the driving backplane.

[0016] In one aspect, the reflective surface includes a third reflective layer and a fourth reflective layer, one end of the third reflective layer is connected to the upper end of the side wall of the light-emitting chip, one end of the fourth reflective layer is connected to the lower end of the side wall of the light-emitting chip, and the third reflective layer and the fourth reflective layer extend in a direction away from the driving backplane;

[0017] The reflective structure includes a light emitting surface, the light emitting surface is located within the forward light emitting surface of the light emitting unit, and the light emitting surface deviates from the top surface of the light emitting chip;

[0018] The light-emitting unit further includes a supporting layer, and the supporting layer is arranged between the driving back plate and the fourth light-reflecting layer.

[0019] In one aspect, the light-emitting unit further includes a scattering portion, which is provided on the light emitting surface. The third and fourth light-reflecting layers are arc-shaped surfaces, and the third and fourth light-reflecting layers are convex in a direction away from the light-emitting chip.

[0020] In addition, in order to solve the above problems, the present application also provides a display device, which includes the display structure as described above, the driving backplane includes a substrate and a driving transistor, the driving transistor is arranged on the substrate, and the light-emitting unit and the driving transistor are driven and connected.

[0021] In this application, a reflective structure is provided on the sidewall of the light-emitting chip. Light from the sidewall of the light-emitting chip is directed toward the reflective surface of the reflective structure, which can change the propagation direction of the light. The reflective surface causes light emitted from the sidewall of the light-emitting chip to propagate toward the forward light-emitting surface of the light-emitting unit, reducing the light emitted from the sidewall of the light-emitting chip and directing it toward the forward light-emitting surface of the light-emitting unit. When adjusting the light intensity, the light emission from the forward light-emitting surface of the light-emitting unit is used as the basis, thereby reducing color deviation from the side view.

[0022] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0024] Figure 1 The structural diagram of the display structure in the first embodiment of the present application is schematically shown.

[0025] Figure 2 The application is schematically shown Figure 1 Schematic diagram of part of the structure of the light-emitting chip and reflective structure shown in the figure.

[0026] Figure 3 The schematic diagram shows a structure in which the first light reflecting layer of the display structure in the present application is a curved surface.

[0027] Figure 4 The application is schematically shown Figure 3 Schematic diagram of part of the structure of the light-emitting chip and reflective structure shown in the figure.

[0028] Figure 5The schematic diagram of the structure of the third light reflecting layer and the fourth light reflecting layer of the display structure in this application is shown schematically.

[0029] Figure 6 The application is schematically shown Figure 5 Schematic diagram of part of the structure of the light-emitting chip and reflective structure shown in the figure.

[0030] Figure 7 The structural diagram of the display device in the second embodiment of the present application is schematically shown.

[0031] The following are the descriptions of the reference numerals:

[0032] 10. Driving backplane; 20. Light-emitting unit; 30. Vertical reference plane;

[0033] 110, substrate; 120, driving transistor; 210, light-emitting chip; 220, reflective structure; 230, transparent filling layer; 240, second flat layer; 250, light emitting surface; 260, supporting layer; 270, scattering portion; 280, first flat layer; 290, sidewall surface;

[0034] 121. Source electrode; 122. Drain electrode; 123. Gate electrode; 124. Active layer; 201. Forward light-emitting surface; 211. Anode electrode; 212. Cathode electrode; 213. Top surface; 221. First light-reflecting layer; 222. Second light-reflecting layer; 223. Third light-reflecting layer; 224. Fourth light-reflecting layer. DETAILED DESCRIPTION

[0035] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0036] Example 1

[0037] See Figure 1 and Figure 2 As shown, the present application provides a display structure, which includes a driving backplane 10 and a plurality of light-emitting units 20. The plurality of light-emitting units 20 are provided on the driving backplane 10, and the light-emitting units 20 can be arranged at equal intervals on the driving backplane 10. Each light-emitting unit 20 includes at least one light-emitting chip 210, which is connected to the driving backplane 10 for driving. The light-emitting chip 210 has an anode 211 and a cathode 212, which are connected to the driving backplane 10. The driving backplane 10 provides an electrical signal to the anode 211 and cathode 212 of the light-emitting chip 210 to ensure that the light-emitting chip 210 can operate normally. The electrical signal can be a current or a voltage.

[0038] The light-emitting chip 210 can be a Micro LED (micro light-emitting diode). The principle of Micro LED display is to thin-film, miniaturize, and array the LED structure, with a size of only about 1 to 10 μm. The LEDs are then transferred in large quantities to a driver backplane 10, which can be rigid, flexible, transparent, or opaque. The package is then completed using a physical deposition process. The smaller size of Micro LEDs facilitates higher device density.

[0039] The light-emitting chip 210 can also use a Mini LED (sub-millimeter light-emitting diode) as its light-emitting principle. The small chip structure of Mini LED facilitates finer resolution and higher contrast. Mini LED also achieves high brightness and uniform heat dissipation. In addition, the light-emitting chip 210 can also be other types of light-emitting diodes.

[0040] The light-emitting unit 20 has a forward light-emitting surface 201 for emitting light. The forward light-emitting surface 201 of the light-emitting unit 20 is arranged in the direction away from the driving backplane 10, that is, the forward light-emitting surface 201 of the light-emitting unit 20 is facing the user. The surface of the light-emitting chip 210 facing away from the driving backplane 10 is the top surface 213. The forward light-emitting surface 201 of the light-emitting unit 20 at least includes the top surface 213 of the light-emitting chip 210. The light-emitting unit 20 includes a reflective structure 220. The reflective structure 220 is arranged on the side wall surface 290 of the light-emitting chip 210. The reflective structure 220 includes a reflective surface. The projection of the side wall surface 290 of the light-emitting chip 210 on the vertical reference plane 30 is at least partially located within the projection of the reflective surface on the vertical reference plane 30, ensuring that the light emitted from the side wall surface 290 of the light-emitting chip 210 can be illuminated by the reflective surface. The vertical reference plane 30 is perpendicular to the plate surface of the driving backplane 10, and the driving backplane 10 is arranged horizontally.

[0041] Light from the sidewall 290 of the light-emitting chip 210 strikes the reflective surface and is reflected by it. This reflects along a path that extends from the sidewall 290 of the light-emitting chip 210 toward the forward light-emitting surface 201 of the light-emitting unit 20. Light emitted from the sidewall 290 of the light-emitting chip 210 strikes the reflective structure 220 and is reflected by the reflective surface of the reflective structure 220, thereby changing the light propagation path. This causes the light emitted from the sidewall 290 of the light-emitting chip 210 to strike the forward light-emitting surface 201 of the light-emitting unit 20.

[0042] In this embodiment, a reflective structure 220 is disposed on the sidewall 290 of the light-emitting chip 210. Light from the sidewall 290 of the light-emitting chip 210 is directed toward the reflective surface of the reflective structure 220, which redirects the light. The reflective surface directs light emitted from the sidewall 290 of the light-emitting chip 210 toward the forward light-emitting surface of the light-emitting unit 20, reducing side light emission from the light-emitting chip 210. This allows light intensity to be adjusted based on the light emission from the forward light-emitting surface of the light-emitting unit 20, minimizing color deviation from side views.

[0043] It is further explained that the light output coefficients of the top surface (front) and the side wall surface 290 of the light emitting chip 210 are different. If the light intensity distribution of the light emitting chip 210 is completed based on the light output from the top surface of the light emitting chip 210 at a positive viewing angle, it will be affected by the light output from the side wall surface 290 of the light emitting chip 210 at a side viewing angle. However, due to the setting of the reflective structure, no light will be emitted from the side wall surface 290 of the light emitting chip 210. The light output from the side wall surface 290 of the light emitting chip 210 is directed to the positive light output surface. When performing light intensity distribution, the basis is the light from the positive light output surface. Even when observed from a side perspective, the light comes from the positive light output surface of the light emitting unit 20, that is, the same surface, and there is no distinction between the front and side surfaces, thereby reducing color deviation at a side viewing angle.

[0044] Furthermore, light from the sidewall surface 290 of the light-emitting chip 210 is sometimes difficult to emit and is easily blocked by other structures or components, resulting in the light from the sidewall surface 290 of the light-emitting chip 210 sometimes being unusable. The reflective structure 220 can direct the light from the sidewall surface 290 of the light-emitting chip 210 toward the positive light-emitting surface, ensuring that the light from the sidewall surface 290 of the light-emitting chip 210 can be smoothly emitted, thereby increasing the overall light intensity of the display screen and fully utilizing the light from the sidewall surface 290. This application can also improve light utilization.

[0045] The reflective surface includes at least two reflective layers. One reflective layer has one end connected to the upper end of the sidewall 290 of the light-emitting chip 210, and the other reflective layer has one end connected to the lower end of the sidewall 290 of the light-emitting chip 210. The two reflective layers seal the upper and lower ends of the sidewall 290 of the light-emitting chip 210, reducing light leakage from the upper and lower ends of the sidewall 290 of the light-emitting chip 210. A reflective space for reflecting light is defined between the two reflective layers, and light from the sidewall 290 of the light-emitting chip 210 propagates within the reflective space.

[0046] To ensure that light from the sidewall surface 290 of the light-emitting chip 210 can accurately be directed toward the reflective surface, the projection of the sidewall surface 290 of the light-emitting chip 210 on the vertical reference plane is at least partially located within the projection of one of the reflective layers on the vertical reference plane. This can be done by either the projection of the sidewall surface 290 of the light-emitting chip 210 on the vertical reference plane being located within the projection of one of the reflective layers on the vertical reference plane, or by partially the projection of one of the reflective layers on the vertical reference plane and partially the projection of the other reflective layer on the vertical reference plane.

[0047] Furthermore, to ensure a more secure structure between the first and second light-reflecting layers 221 and 222, the light-emitting unit 20 includes a transparent filling layer 230 disposed between the first and second light-reflecting layers 221 and 222. The transparent filling layer 230 itself has a certain degree of hardness. One side of the transparent filling layer 230 supports the first light-reflecting layer 221, while the other side contacts the second light-reflecting layer 222. This supports the first and second light-reflecting layers 221 and 222, further strengthening the structure. The transparent filling layer 230 can be made of PI (polyimide), PMMA (polymethyl methacrylate), silicon oxide, or silicon nitride, among others.

[0048] In order to ensure that the reflective structure 220 can function, the two reflective layers are mirror reflective surfaces, which reflect light by mirror reflection, so that light of various incident angles can be reflected from the sidewall surface 290 of the light emitting chip 210 .

[0049] In addition to the above-mentioned mirror reflection, the present application also provides a total reflection structure, in which the transparent filling layer 230 is a light-dense medium, and the two reflective layers are both light-sparse media. The refractive index of the transparent filling layer 230 is greater than the refractive index of the reflective layer, and the angle at which the light emitted from the side wall 290 of the light-emitting chip 210 is incident on the two reflective layers is greater than or equal to the critical angle of total reflection.

[0050] Based on the principle of total internal reflection (TIR), the angle at which light emitted from the sidewall 290 of the light-emitting chip 210 strikes the reflective layer satisfies the critical angle for TIR. Furthermore, as light propagates within the transparent filling layer 230, it travels from a denser medium to a less dense medium, satisfying the TIR condition. This allows for TIR, ensuring that the light is redirected and directed toward the forward-facing light-emitting surface of the light-emitting unit 20.

[0051] Regarding the provision of a reflective surface, the present application provides a method for reflecting light through the light-emitting chip 210. Specifically, the reflective surface includes a first reflective layer 221 and a second reflective layer 222. One end of the first reflective layer 221 is connected to the upper end of the side wall 290 of the light-emitting chip 210, and one end of the second reflective layer 222 is connected to the lower end of the side wall 290 of the light-emitting chip 210. By connecting the upper and lower ends of the side wall 290 of the light-emitting chip 210, light emitted from the side wall 290 of the light-emitting chip 210 is ensured to be emitted toward the first reflective layer 221 and the second reflective layer 222, while also preventing light from the side wall 290 of the light-emitting chip 210 from leaking out. The first and second reflective layers 221 and 222 are connected at an angle at the ends away from the light-emitting chip 210. Thus, at the end away from the light-emitting chip 210, the first and second reflective layers 221 and 222 are enclosed, further ensuring that light emitted from the sidewall 290 of the light-emitting chip 210 can only propagate between the first and second reflective layers 221 and 222. Typically, the angle ranges from 0° to 90°. The sidewall 290 of the light-emitting chip 210 extends sequentially through the interior of the light-emitting chip 210 and the top surface 213 of the light-emitting chip 210.

[0052] The light-emitting chip 210 itself is transparent. The reflective structure 220 directs light emitted from the sidewalls 290 of the light-emitting chip 210 into the interior of the light-emitting chip 210. After reflection within the light-emitting chip 210, the light is emitted from the top surface 213 of the light-emitting chip 210. As a result, light is no longer emitted from the sidewalls 290 of the light-emitting chip 210. When performing light intensity matching, color matching only needs to be performed at a normal viewing angle. Since the sidewalls 290 do not emit light, color deviation from the viewing angle of the sidewalls 290 is reduced.

[0053] There are at least two ways to arrange the first and second light-reflecting layers 221, 222. In one arrangement, both the first and second light-reflecting layers 221, 222 are planar. Planar reflective surfaces are easy to machine and facilitate determining the angle between the first and second light-reflecting layers 221, 222. This allows light emitted from the sidewalls 290 of the light-emitting chip 210 to be more quickly emitted from the top surface 213 of the light-emitting chip 210 by adjusting the angle. The first and second light-reflecting layers 221, 222 can form a triangular structure with the sidewalls 290 of the light-emitting chip 210. The first and second light-reflecting layers 221, 222 can be arranged perpendicular to the sidewalls 290 of the light-emitting chip 210, or the second light-reflecting layer 222 can be arranged perpendicular to the sidewalls 290 of the light-emitting chip 210. Alternatively, the first and second light-reflecting layers 221, 222 can form an equilateral triangle with the sidewalls 290 of the light-emitting chip 210.

[0054] See Figure 3 and Figure 4As shown, another configuration is that one of the first and second reflective layers 221, 222 is flat, and the other is curved, with the curved surface convex toward the direction away from the light-emitting chip 210. For example, the first reflective layer 221 is curved, and the second reflective layer 222 is flat. Alternatively, the first reflective layer 221 is flat, and the second reflective layer 222 is curved. This curved surface configuration can achieve a certain degree of light convergence, converging the light as much as possible and concentrating it toward the top surface 213 of the light-emitting chip 210.

[0055] The first light reflecting layer 221 and the second light reflecting layer 222 are both made of highly reflective materials, such as silver or aluminum, and can be processed by physical vapor deposition or evaporation.

[0056] Furthermore, the light-emitting unit 20 includes a first planar layer 280, which is disposed between the light-emitting chip 210 and the driver backplane 10. A first reflective layer 221 extends downward from the upper end of the sidewall surface 290 of the light-emitting chip 210. A second reflective layer 222 is a flat surface and is disposed on the side of the first planar layer 280 facing away from the driver backplane 10. The first planar layer 280 is used to support the second reflective layer 222. The cathode and anode of the light-emitting chip 210 pass through the first planar layer 280 to connect to the driver backplane 10.

[0057] See Figure 5 and Figure 6 As shown, the present application also provides another method for setting the reflective surface that does not require penetrating the light-emitting chip 210. The reflective surface includes a third reflective layer 223 and a fourth reflective layer 224. One end of the third reflective layer 223 is connected to the upper end of the side wall 290 of the light-emitting chip 210, and one end of the fourth reflective layer 224 is connected to the lower end of the side wall 290 of the light-emitting chip 210. The other ends of the third reflective layer 223 and the fourth reflective layer 224 extend away from the driving backplane 10.

[0058] The reflective structure 220 includes a light emitting surface 250, which is located within the forward light emitting surface 201 of the light emitting unit 20, and the light emitting surface 250 deviates from the top surface 213 of the light emitting chip 210; the light passing through the reflective structure 220 does not need to pass through the interior of the light emitting chip, thereby reducing the impact on the internal light emission of the light emitting chip 210.

[0059] The light-emitting unit 20 further includes a support layer 260, which is disposed between the driving backplane 10 and the fourth reflective layer 224. The support layer 260 is used to support the entire reflective structure 220, making the reflective structure 220 more secure. The transparent filling layer 230 can be made of polyimide, polymethyl methacrylate, silicon oxide, or silicon nitride.

[0060] The light-emitting unit 20 includes a second flat layer 240, which covers the top surface 213 of the light-emitting chip 210. The forward light-emitting surface 201 of the light-emitting unit 20 is located on the side of the second flat layer 240 facing away from the driver backplane 10, that is, the forward light-emitting surface 201 of the light-emitting unit 20 is located in front of the top surface 213 of the light-emitting chip 210. The second flat layer 240 is made of a transparent organic material, ensuring that light from the top surface 213 of the light-emitting chip 210 can be smoothly emitted. In addition, the second flat layer 240 can also protect the top surface 213 of the light-emitting chip 210 and seal the light-emitting chip 210, preventing damage to the light-emitting chip 210 and the ingress of moisture and dust. Furthermore, the refractive index of the second flat layer 240 can be set to a low refractive index, thereby forming a high-low refractive index variation on the top surface 213 of the light-emitting chip 210, thereby achieving an anti-reflection effect and facilitating the emission of more light from the light-emitting chip 210.

[0061] To increase the viewing angle, the light-emitting unit 20 also includes a scattering portion 270. This scattering portion 270 is located on the light-emitting surface 250 of the reflective structure 220. The light-emitting surface 250 and the forward light-emitting surface 201 of the light-emitting unit 20 are coextensive. Light traveling along the reflection path, after being reflected by the third and fourth reflective layers 223 and 224, exits the light-emitting surface of the transparent filler layer 230. The scattering portion 270 disperses the light in all directions after it enters the scattering portion 270. The scattering portion 270 can be formed of a plurality of raised portions, each of which can be triangular in shape.

[0062] Furthermore, the third and fourth light reflecting layers 223 and 224 are arcuate surfaces that protrude away from the top surface 213 of the light emitting chip 210. The arcuate configuration of the third and fourth light reflecting layers 223 and 224 can reduce the reflection path from extending toward other light emitting units 20, thereby preventing interference with other light emitting units 20.

[0063] The arc lengths of the third light reflecting layer 223 and the fourth light reflecting layer 224 can be the same, and a fixed distance can be maintained between the third light reflecting layer 223 and the fourth light reflecting layer 224. For example, the arc length of the third light reflecting layer 223 and the fourth light reflecting layer 224 can be one-quarter of the circumference of a circle, that is, the arc length of the third light reflecting layer 223 and the fourth light reflecting layer 224 is π / 2.

[0064] In addition, the third light reflecting layer 223 and the fourth light reflecting layer 224 can also be planes. If the third light reflecting layer 223 and the fourth light reflecting layer 224 are planes, the third light reflecting layer 223 and the fourth light reflecting layer 224 remain parallel. The third light reflecting layer 223 and the fourth light reflecting layer 224 are arranged parallel to each other.

[0065] Example 2

[0066] See Figure 7 As shown, the present application also provides a display device, which includes the display structure described above. The driving backplane 10 includes a substrate 110 and a driving transistor 120. The driving transistor 120 is a thin film transistor (TFT). The driving transistor 120 is provided on the substrate 110, and the light-emitting unit 20 is connected to the driving transistor 120. Specifically, an active layer 124 is provided on the substrate 110, a gate 123 is provided above the active layer 124, a source electrode 121 and a drain electrode 122 are provided above the gate 123, an insulating layer is provided between the gate 123 and the active layer 124, and an insulating layer is also provided between the gate 123 and the source electrode 121 and the drain electrode 122. The source electrode 121 and the drain electrode 122 have through holes on the insulating layer, and the source electrode 121 and the drain electrode 122 are respectively connected to the active layer 124 through their respective through holes. The insulating layer between the gate electrode 123 and the active layer 124 can be the same as or different from the insulating layer between the source electrode 121 and the gate electrode 123. The anode 211 of the light-emitting unit 20 can be connected to the drain electrode 122 of the driving transistor 120. The cathode 212 of the light-emitting unit 20 can also be connected to another driving transistor 120 or to another circuit layer. The driving backplane 10 also includes a first flat layer 280, which is arranged between the light-emitting unit 20 and the driving transistor 120. The second flat layer 240 and the first flat layer 280 are made of the same material. The second flat layer 240 is used to protect the light-emitting chip 210, and the first flat layer 280 is used to protect the driving backplane 10. The material of the second flat layer 240 and the first flat layer 280 can include one of polyimide, polymethyl methacrylate, silicon oxide, or silicon nitride. The anode 211 and cathode 212 of the light-emitting chip 210 are connected to the driving transistor 120 through the first flat layer 280.

[0067] The specific implementation and beneficial effects of the display device can be referred to the embodiment of the above-mentioned display structure, which will not be described in detail here.

[0068] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this application and include common knowledge or customary techniques in the art that are not disclosed herein.

[0069] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A display structure comprising a driving backplane and a plurality of light-emitting units, wherein the plurality of light-emitting units are provided on the driving backplane, the light-emitting units comprising light-emitting chips, and the light-emitting chips are connected to the driving backplane, characterized in that: The surface of the light-emitting unit facing away from the driving backplane is the forward light-emitting surface, the surface of the light-emitting chip facing away from the driving backplane is the top surface, and the forward light-emitting surface of the light-emitting unit at least includes the top surface of the light-emitting chip; The light-emitting unit includes a reflective structure, which is provided on a side wall surface of the light-emitting chip. The reflective structure includes a reflective surface. The projection of the side wall surface of the light-emitting chip on a vertical reference plane is at least partially located within the projection of the reflective surface on the vertical reference plane. The vertical reference plane is perpendicular to the plate surface of the driving backplane. The light emitted from the side wall surface of the light-emitting chip is emitted toward the reflective surface, so that the light emitted from the side wall surface of the light-emitting chip is emitted toward the forward light-emitting surface of the light-emitting unit. The reflective surface includes at least two reflective layers, one end of one reflective layer is connected to the upper end of the side wall of the light-emitting chip, and one end of the other reflective layer is connected to the lower end of the side wall of the light-emitting chip, and a reflective space for reflecting light is provided between the two reflective layers; The projection of the side wall surface of the light-emitting chip on the vertical reference plane is at least partially located within the projection of one of the reflective layers on the vertical reference plane.

2. The display structure according to claim 1, wherein: The light-emitting unit includes a transparent filling layer, and the transparent filling layer is arranged between the two reflective layers.

3. The display structure according to claim 2, wherein: The two reflective layers are mirror reflective surfaces; Alternatively, the transparent filling layer is a light-dense medium, the two reflective layers are light-sparse media, the refractive index of the transparent filling layer is greater than the refractive index of the reflective layer, and the angle at which the light emitted from the side wall of the light-emitting chip is incident on the two reflective layers is greater than or equal to the critical angle of total reflection.

4. The display structure according to claim 1, wherein: The reflective surface includes a first reflective layer and a second reflective layer, one end of the first reflective layer is connected to the upper end of the side wall of the light-emitting chip, one end of the second reflective layer is connected to the lower end of the side wall of the light-emitting chip, and the other ends of the first reflective layer and the second reflective layer away from the light-emitting chip are connected at an angle, and light emitted from the side wall of the light-emitting chip passes through the interior of the light-emitting chip and is emitted to the top surface of the light-emitting chip.

5. The display structure according to claim 4, wherein: The first light reflecting layer and the second light reflecting layer are both plane; Alternatively, one of the first light reflecting layer and the second light reflecting layer is a flat surface, and the other is a curved surface, and the curved surface is convex in a direction away from the light emitting chip.

6. The display structure according to claim 5, characterized in that: The light-emitting unit includes a first flat layer, which is arranged between the light-emitting chip and the driving backplane. The first reflective layer extends downward from the upper end of the side wall of the light-emitting chip. The second reflective layer is a plane and is arranged on the side of the first flat layer away from the driving backplane.

7. The display structure according to claim 1, wherein: The reflective surface includes a third reflective layer and a fourth reflective layer, one end of the third reflective layer is connected to the upper end of the side wall of the light-emitting chip, one end of the fourth reflective layer is connected to the lower end of the side wall of the light-emitting chip, and the third reflective layer and the fourth reflective layer extend in a direction away from the driving backplane; The reflective structure includes a light emitting surface, the light emitting surface is located within the forward light emitting surface of the light emitting unit, and the light emitting surface deviates from the top surface of the light emitting chip; The light-emitting unit further includes a supporting layer, and the supporting layer is arranged between the driving back plate and the fourth light-reflecting layer.

8. The display structure according to claim 7, wherein: The light-emitting unit further includes a scattering portion, which is provided on the light emitting surface. The third and fourth light-reflecting layers are arc-shaped surfaces, and the third and fourth light-reflecting layers are convex in a direction away from the light-emitting chip.

9. A display device, characterized in that: The display device comprises the display structure according to any one of claims 1 to 8, the driving backplane comprises a substrate and a driving transistor, the driving transistor is provided on the substrate, and the light emitting unit is drivingly connected to the driving transistor.

Images