Substrate assembly for selective laser melting and method of use

Abstract

The present application relates to the technical field of additive manufacturing, in particular to a substrate assembly for selective laser melting and a use method thereof. The substrate of the substrate assembly is installed on a backing plate. The backing plate is provided with a first mounting hole for installing a leveling mechanism and a second mounting hole for installing a deformation compensation mechanism. A leveling control module in an industrial computer is used to receive a first height value and a second height value measured by a distance measuring device, calculate the lifting height value of each first piezoelectric motor, and drive the lifting of the moving part of the first piezoelectric motor to level the substrate. A deformation compensation module is used to receive a real-time voltage signal fed back by a piezoelectric ceramic sheet, and drive the movement of the moving part of the second piezoelectric motor according to the difference between the real-time voltage signal and a first voltage signal to compensate for the deformation of the substrate. The substrate assembly for selective laser melting reduces the difficulty of substrate leveling operation, improves the leveling accuracy of the substrate, and realizes the compensation for the deformation of the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of additive manufacturing, and in particular to a substrate assembly for selective laser melting and a method of using the same. Background Art

[0002] Selective laser melting (SLM) is an advanced laser additive manufacturing technology developed based on the principles of prototyping. Using specialized software, SLM slices and layers a three-dimensional digital model of a part. After obtaining the contour data for each cross-section, a high-energy laser beam selectively melts metal powder layer by layer based on this contour data. This process creates a three-dimensional solid part by layering the powder, melting, solidifying, and accumulating it.

[0003] To ensure the quality of the parts formed using selective laser melting technology, the equipment must perform a leveling operation on the base plate used to support the parts before processing. If the base plate's support surface is not parallel to the top surface of the forming cylinder, the thickness of the first layer of powder on the base plate will be uneven, which can easily affect the quality of the part's molding. In the existing technology, the leveling operation of the base plate is mainly carried out through manual adjustment. For example, a motor is installed under the base plate, and a micrometer is used to measure and adjust the motor's lifting and lowering to ensure the level of the base plate. This method is cumbersome and very time-consuming.

[0004] A search revealed Chinese patent document CN205905433U, which discloses an automatic substrate leveling device for selective laser melting equipment. This device includes a distance measurement system, a control device, and at least one driver for adjusting the levelness of the formed substrate. The driver is controlled by the control device to level the substrate, addressing the drawback of traditional leveling methods that require manual insertion and removal of the substrate, thereby improving substrate leveling efficiency.

[0005] For example, Chinese patent document CN107457405A discloses an automatic substrate leveling system and method for selective laser melting (SLM) forming equipment. The leveling system includes a computer control system, a laser rangefinder, a motor system for fine-tuning the platform, a motor system for lifting the entire forming platform, and a scraper powder spreading system. Substrate leveling is achieved by driving the fine-tuning motor up and down.

[0006] However, the aforementioned substrate leveling devices lacked sufficient leveling accuracy. Due to the low precision of the lift motor's motion control, the substrate could even become unlevelable. Furthermore, as the part is formed, the substrate bears not only the weight of the part but also the weight of multiple layers of metal powder. The loose metal powder causes uneven force on the substrate, which can cause deformation after processing, making it difficult to disassemble. Summary of the Invention

[0007] The purpose of the present invention is to provide a substrate structure for the implementation of selective laser melting technology, so as to reduce the difficulty of substrate leveling operation, improve the leveling accuracy of the substrate, and compensate for substrate deformation during the part forming process.

[0008] To achieve the above-mentioned object, the present invention adopts the following scheme: a substrate assembly for selective laser melting is proposed, comprising a substrate, a liner embedded in a forming cylinder, a distance measuring device, a leveling mechanism, a deformation compensation mechanism and an industrial control computer;

[0009] The base plate is mounted on the lining plate, and a locking mechanism is provided on the side wall of the base plate;

[0010] The lining plate is provided with a first mounting hole for mounting a leveling mechanism and a second mounting hole for mounting a deformation compensation mechanism, wherein a plurality of first mounting holes are arranged along the edge of the lining plate, and a plurality of second mounting holes are arranged in the middle of the lining plate;

[0011] The distance measuring device is located above the substrate, and is used to measure a first height value between a detection end surface of the distance measuring device and a top surface of the forming cylinder, and a second height value between the detection end surface of the distance measuring device and an edge of the substrate, and transmit the first height value and the second height value to the industrial computer;

[0012] The leveling mechanism includes a first piezoelectric motor for driving the substrate to move up and down, the first piezoelectric motor is embedded in the first mounting hole, and the moving component of the first piezoelectric motor supports the bottom of the substrate;

[0013] The deformation compensation mechanism includes a second piezoelectric motor and a piezoelectric ceramic sheet, wherein the piezoelectric ceramic sheet is placed between the substrate and the liner, and the second piezoelectric motor is embedded in the second mounting hole, and the moving component of the second piezoelectric motor supports the bottom of the substrate;

[0014] After the substrate is leveled, it is locked on the backing plate by a locking mechanism, and the piezoelectric ceramic piece is subjected to pre-pressure and generates a first voltage signal;

[0015] The industrial computer has a leveling control module and a deformation compensation module;

[0016] The leveling control module is used to receive the first height value and the second height value measured by the distance measuring device, calculate the lifting height value of each first piezoelectric motor according to the first height value and the second height value, and drive the moving parts of the first piezoelectric motor to lift and lower the corresponding lifting height value;

[0017] The deformation compensation module is used to record the first voltage signal and receive the real-time voltage signal fed back by the piezoelectric ceramic piece, and drive the moving part of the second piezoelectric motor to move according to the difference between the real-time voltage signal and the first voltage signal, so that the real-time voltage signal fed back by the piezoelectric ceramic piece is equal to the first voltage signal.

[0018] Preferably, the first mounting holes are arranged in a rectangular shape along the edge of the lining plate.

[0019] Preferably, the second mounting holes are arranged in an array on the lining plate.

[0020] Preferably, the piezoelectric ceramic sheets are attached to the top of the lining plate, and the piezoelectric ceramic sheets are arranged in an array on the lining plate.

[0021] Preferably, the distance measuring device is installed above the substrate via a frame, the frame is provided with a moving slide rail for driving the distance measuring device to move above the substrate, and the distance measuring device is installed on the moving slide rail.

[0022] Preferably, the locking mechanism includes a locking bolt for applying a locking force to the side wall of the lining plate, and a countersunk threaded hole for matching the locking bolt is provided on the side wall of the base plate.

[0023] The present invention also provides a method for using the substrate assembly for selective laser melting, comprising:

[0024] 1) Substrate leveling

[0025] The substrate is placed on the backing plate, and the first piezoelectric motor installed on the backing plate supports the bottom of the substrate;

[0026] A distance measuring device located above the substrate measures a first height value between a detection end surface of the distance measuring device and a top surface of the forming cylinder, and transmits the first height value to a leveling control module of the industrial computer. The leveling control module processes the first height values ​​to form a position reference plane for leveling the substrate.

[0027] The distance measuring device measures a second height value between the detection end face of the distance measuring device and the edge of the substrate, and transmits the second height value to the leveling control module of the industrial computer. The leveling control module calculates a deviation value of the substrate position relative to the current substrate position being parallel to the position reference plane based on the multiple second height values, and then drives the moving parts of each first piezoelectric motor to rise and fall by a corresponding height value based on the deviation value, so that the plane where the substrate is located is parallel to the position reference plane.

[0028] 2) Initialization of substrate locking

[0029] After leveling, the substrate is locked to the backing plate by a locking mechanism. The second piezoelectric motor supports the bottom of the substrate. The piezoelectric ceramic piece between the substrate and the backing plate is pre-stressed and generates a first voltage signal. The deformation compensation module of the industrial computer receives and records the first voltage signal.

[0030] 3) Substrate deformation compensation

[0031] During the part forming process, the piezoelectric ceramic piece feeds back a real-time voltage signal to the deformation compensation module. At regular intervals, the deformation compensation module drives the moving part of the second piezoelectric motor to move based on the difference between the real-time voltage signal and the first voltage signal, so that the real-time voltage signal fed back by the piezoelectric ceramic piece is equal to the first voltage signal, thereby completing the compensation for the substrate deformation.

[0032] Preferably, during the substrate leveling process, the distance measuring device measures the second height value of a certain location on the edge of the substrate at least three times, and takes an average value of the multiple measurements as the second height value at that location.

[0033] Preferably, after completing the leveling of the substrate, the distance measuring device performs a review operation on the plane where the substrate is located. During the review operation, the distance measuring device repeatedly measures the second height value at each location on the edge of the substrate at least twice.

[0034] Preferably, the time interval for substrate deformation compensation is 30 min-60 min.

[0035] Compared with the prior art, the substrate assembly and method for selective laser melting provided by the present invention have the following outstanding substantive features and significant improvements:

[0036] 1. The substrate assembly for selective laser melting measures the height values ​​of the substrate to the top surface of the forming cylinder and the edge of the substrate respectively by using a distance measuring device arranged above the substrate. The leveling control module in the industrial computer processes the first height value to form a position reference plane for substrate leveling, and calculates the deviation value of the substrate position parallel to the position reference plane. The first piezoelectric motor installed on the liner is driven according to the deviation value to adjust the position of the substrate so that the plane where the substrate is located is parallel to the top surface of the forming cylinder, thereby reducing the difficulty of the substrate leveling operation and improving the leveling accuracy of the substrate.

[0037] 2、The substrate assembly for selective laser melting utilizes the piezoelectric ceramic sheet arranged between the substrate and the backing plate to feed the real-time voltage signal to the deformation compensation module in the industrial computer, so as to monitor the slight deformation of the substrate in the part forming process. Every time interval, the deformation compensation module drives the moving part of the second piezoelectric motor to move according to the difference between the real-time voltage signal and the first voltage signal, so that the real-time voltage signal fed back by the piezoelectric ceramic sheet is equal to the first voltage signal, the compensation of the substrate deformation is completed, and the uniformity of the substrate stress is ensured, the situation that the substrate is stuck with the backing plate due to the continuous accumulation of slight deformation is avoided, and the difficulty of disassembling the substrate from the backing plate is greatly reduced. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 is a structural schematic view of a substrate assembly for selective laser melting in an embodiment of the present application;

[0039] Figure 2 is a partial enlarged structural schematic view of A in Figure 1

[0040] Figure 3 is a partial enlarged structural schematic view of B in Figure 1

[0041] Figure 4 is a structural schematic view of a backing plate;

[0042] Figure 5 is an assembly structure schematic view of the substrate and the backing plate being locked;

[0043] Figure 6 is a structural schematic view of a substrate assembly for selective laser melting in an embodiment of the present application for measuring the first height value;

[0044] Figure 7 is a structural schematic view of a substrate assembly for selective laser melting in an embodiment of the present application for measuring the second height value.

[0045] Reference signs: 1, substrate; 2, forming cylinder; 3, backing plate; 4, distance measuring device; 5, leveling mechanism; 6, deformation compensation mechanism; 7, industrial computer; 8, locking bolt; 9, frame; 10, moving slide rail; 31, first mounting hole; 32, second mounting hole; 51, first piezoelectric motor; 61, second piezoelectric motor; 62, piezoelectric ceramic sheet. DETAILED DESCRIPTION

[0046] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0047] As Figure 1-7 ​​As shown, an embodiment of the present invention proposes a substrate assembly for selective laser melting, which aims to reduce the difficulty of substrate leveling operation, improve the leveling accuracy of the substrate, and compensate for substrate deformation during the part forming process.

[0048] In an embodiment of the present invention, a substrate assembly for selective laser melting, proposed, uses a distance measuring device disposed above the substrate to measure its height from the top surface of the forming cylinder and the edge of the substrate. A leveling control module in an industrial computer drives a first piezoelectric motor mounted on a liner to adjust the position of the substrate, aligning the substrate plane with the top surface of the forming cylinder. This reduces the difficulty of the substrate leveling operation and improves the leveling accuracy. Furthermore, the substrate assembly utilizes a piezoelectric ceramic sheet disposed between the substrate and the liner to feed back a real-time voltage signal to a deformation compensation module in the industrial computer to monitor the minute deformations of the substrate during the part forming process. At regular intervals, the deformation compensation module drives the moving component of the second piezoelectric motor to compensate for the substrate deformation, thereby ensuring uniform force applied to the substrate.

[0049] Structure of a substrate assembly for selective laser melting]

[0050] like Figure 1 As shown, a substrate assembly for selective laser melting includes a substrate 1, a lining plate 3 embedded in a forming cylinder 2, a distance measuring device 4, a leveling mechanism 5, a deformation compensation mechanism 6 and an industrial computer 7.

[0051] The base plate 1 is mounted on the lining plate 3. A locking mechanism is provided on the side wall of the base plate 1.

[0052] like Figure 4 As shown, the lining plate 3 is provided with a first mounting hole 31 for mounting the leveling mechanism 5, and a second mounting hole 32 for mounting the deformation compensation mechanism 6. A plurality of first mounting holes 31 are arranged along the edge of the lining plate 3. A plurality of second mounting holes 32 are arranged in the middle of the lining plate 3. For example, Figure 4 As shown, a plurality of first mounting holes 31 are arranged in a rectangular shape along the edge of the lining plate 3. A plurality of second mounting holes 32 are arranged in an array on the lining plate 3.

[0053] like Figure 1 As shown, the distance measuring device 4 is located above the substrate 1. The distance measuring device 4 is used to measure a first height value between the detection end surface of the distance measuring device 4 and the top surface of the forming cylinder 2, and to measure a second height value between the detection end surface of the distance measuring device 4 and the edge of the substrate 1, and transmit the first height value and the second height value to the industrial computer 7.

[0054] like Figure 2As shown, the leveling mechanism 5 includes a first piezoelectric motor 51 for driving the substrate 1 to move up and down. The first piezoelectric motor 51 is embedded in the first mounting hole 31. The moving part of the first piezoelectric motor 51 supports the bottom of the substrate 1.

[0055] like Figure 3 As shown, the deformation compensation mechanism 6 includes a second piezoelectric motor 61 and a piezoelectric ceramic plate 62. The piezoelectric ceramic plate 62 is placed between the substrate 1 and the backing plate 3. The second piezoelectric motor 61 is embedded in the second mounting hole 32. The moving part of the second piezoelectric motor 61 supports the bottom of the substrate 1.

[0056] like Figure 5 As shown, after the substrate 1 is leveled, it is locked on the backing plate 3 by the locking mechanism. The piezoelectric ceramic piece 62 is subjected to pre-pressure and generates a first voltage signal.

[0057] The industrial computer 7 has a leveling control module and a deformation compensation module.

[0058] The leveling control module is used to receive the first height value and the second height value measured by the ranging device 4, and calculate the lifting height value of each first piezoelectric motor 51 based on the first height value and the second height value, and drive the moving parts of the first piezoelectric motor 51 to lift the corresponding lifting height value.

[0059] The deformation compensation module is used to record the first voltage signal and receive the real-time voltage signal fed back by the piezoelectric ceramic piece 62, and drive the moving parts of the second piezoelectric motor 61 to move according to the difference between the real-time voltage signal and the first voltage signal, so that the real-time voltage signal fed back by the piezoelectric ceramic piece 62 is equal to the first voltage signal.

[0060] The piezoelectric ceramic pieces 62 are attached to the top of the liner 3 , and the piezoelectric ceramic pieces 62 are arranged in an array on the liner 3 .

[0061] like Figure 1 As shown, the distance measuring device 4 is mounted above the substrate 1 via a frame 9 . The frame 9 is provided with a moving slide 10 for driving the distance measuring device 4 to move above the substrate 1 . The distance measuring device 4 is mounted on the moving slide 10 .

[0062] like Figure 5 As shown, the locking mechanism includes a locking bolt 8 for applying a locking force to the side wall of the lining plate 3. A countersunk threaded hole for matching the locking bolt 8 is provided on the side wall of the base plate 1.

[0063] Substrate leveling principle]

[0064] like Figure 4As shown, the four first mounting holes 31 are arranged in a rectangular shape on the edge of the liner 3, with each first mounting hole 31 located at a vertex of the rectangle. A first piezoelectric motor 51 is installed in each first mounting hole 31, and the four first piezoelectric motors 51 collectively support the bottom of the substrate 1 below the substrate 1. For example, a linear piezoelectric motor is used as the first piezoelectric motor 51. A linear piezoelectric motor generates standing wave resonance or traveling wave motion as a whole by superimposing the vibration deformation of each piezoelectric plate, thereby driving the moving parts to perform linear motion.

[0065] Specifically, the industrial computer 7 controls the power supply to apply voltage to the piezoelectric plates in the first piezoelectric motors 51, causing the entire piezoelectric driver to generate standing wave resonance or traveling wave motion. This in turn drives the moving components of the first piezoelectric motors 51 to move linearly, thereby driving the substrate 1 to move up and down. The four first piezoelectric motors 51 coordinate their movement, adjusting the overall position of the substrate 1.

[0066] like Figure 6 As shown, the distance measuring device 4 moves along the motion rail 10 to measure the first height values ​​at multiple measurement points on the top surface of the building cylinder 2. The distance measuring device 4 selects at least three measurement points on the top surface of the building cylinder 2 for measurement and transmits the multiple measured first height values ​​to the leveling module of the industrial computer 7. The more measurement points selected on the top surface of the building cylinder 2, the closer the position reference plane fitted by the leveling module of the industrial computer 7 based on the first height values ​​is to the actual plane of the top surface of the building cylinder 2. The industrial computer 7 is an industrial computer or a programmable logic controller. The distance measuring device 4 is an infrared rangefinder or a laser rangefinder.

[0067] When measuring the first height value of a certain measuring point on the top surface of the forming cylinder 2, in order to improve the measurement accuracy, the measuring point is measured at least three times, and the average value of the multiple measurements is taken as the first height value at the measuring point.

[0068] The process of fitting the position reference plane according to the multiple first height values ​​by the leveling module in the industrial computer 7 is a prior art. For example, the leveling module uses a fitting plane passing through the most measurement points as the position reference plane representing the top surface of the forming cylinder 2.

[0069] like Figure 7 As shown, the distance measuring device 4 moves along the motion rail 10 to measure the second height values ​​at multiple measurement points on the substrate 1. The distance measuring device 4 selects at least three measurement points on the substrate 1 for measurement and transmits the measured second height values ​​to the leveling module of the industrial computer 7. Based on the multiple second height values, the leveling control module calculates the deviation of the substrate 1 position relative to the current position of the substrate 1 being parallel to the position reference plane. Based on the deviation value, the moving components of each first piezoelectric motor 51 are driven to raise or lower the corresponding height values, so that the plane on which the substrate 1 is located is parallel to the position reference plane.

[0070] Since the substrate 1 is not completely positioned and clamped relative to the backing plate 3, there are multiple solutions for the lifting height value of the first piezoelectric motor 51 driven by the leveling module based on the position reference plane leveling reference. Just select one of the leveling methods.

[0071] Substrate deformation compensation principle]

[0072] like Figure 7 As shown, the substrate 1 after leveling is locked on the backing plate 3 through the locking mechanism, and the second piezoelectric motor 61 supports the bottom of the substrate 1. Figure 4 As shown, the second mounting holes 32 are arranged in a 3x3 rectangular array in the center of the liner 3. A second piezoelectric motor 61 is mounted in each second mounting hole 32. The nine second piezoelectric motors 61 collectively support the bottom of the substrate 1 below the substrate 1. The number and arrangement of the second mounting holes 32 can be designed differently based on the size of the substrate 1.

[0073] The second piezoelectric motor 61 is also a linear piezoelectric motor. The difference between the second piezoelectric motor 61 and the first piezoelectric motor 51 is that the second piezoelectric motor 61 has a shorter stroke and a higher adjustment resolution.

[0074] like Figure 7 As shown, after leveling, the substrate 1 is locked on the lining plate 3 by a locking mechanism, and the piezoelectric ceramic piece 62 located between the substrate 1 and the lining plate 3 is subjected to pre-pressure and generates a first voltage signal. The deformation compensation module of the industrial computer 7 receives and records the first voltage signal.

[0075] Under completely ideal conditions, the substrate 1 does not deform at all during the part forming process, and there is no displacement between the substrate 1 and the liner 3 . The piezoelectric ceramic piece 62 will continuously feed back the first piezoelectric signal to the deformation compensation module of the industrial computer 7 .

[0076] However, in reality, as the molding process progresses, the upper surface of substrate 1 will contact an increasing amount of loose metal powder, which can easily lead to uneven force on substrate 1, causing slight deformation of substrate 1. These slight deformations of substrate 1 accumulate, ultimately making it difficult to remove substrate 1 from liner 3 after the part is completed. Furthermore, these slight deformations of substrate 1 can also affect the final molding quality of the part.

[0077] Therefore, during the part forming process, the piezoelectric ceramic piece 62 feeds back a real-time voltage signal to the deformation compensation module in real time. At regular intervals, the deformation compensation module drives the moving parts of the second piezoelectric motor 61 to move according to the difference between the real-time voltage signal and the first voltage signal, so that the real-time voltage signal fed back by the piezoelectric ceramic piece 62 is equal to the first voltage signal, thereby completing the compensation for the deformation of the substrate 1, thereby ensuring the uniformity of the force on the substrate 1, avoiding the situation where the substrate 1 is stuck with the lining plate 3 due to the continuous accumulation of small deformations, and greatly reducing the difficulty of removing the substrate 1 from the lining plate 3.

[0078] Method for using a substrate assembly for selective laser melting]

[0079] When a substrate assembly for selective laser melting proposed in the present invention is used, Figure 6-7 Shown, including:

[0080] 1) Substrate leveling

[0081] The substrate 1 is placed on the backing plate 3 , and the first piezoelectric motor 51 mounted on the backing plate 3 supports the bottom of the substrate 1 .

[0082] The distance measuring device 4 located above the substrate 1 measures the first height value of the detection end face of the distance measuring device 4 from the top surface of the forming cylinder 2, and transmits the first height value to the leveling control module of the industrial computer 7. The leveling control module processes the multiple first height values ​​to form a position reference plane for leveling the substrate 1.

[0083] The distance measuring device 4 measures the second height value of the detection end face of the distance measuring device 4 from the edge of the substrate 1, and transmits the second height value to the leveling control module of the industrial computer 7. The leveling control module calculates the deviation value of the position of the substrate 1 relative to the current position of the substrate 1 and the position reference plane based on multiple second height values, and then drives the moving parts of each first piezoelectric motor 51 to rise and fall by the corresponding lifting height value according to the deviation value, so that the plane where the substrate 1 is located is parallel to the position reference plane.

[0084] 2) Initialization of substrate locking

[0085] After leveling, the substrate 1 is locked on the lining plate 3 through a locking mechanism. The second piezoelectric motor 61 supports the bottom of the substrate 1. The piezoelectric ceramic piece 62 located between the substrate 1 and the lining plate 3 is subjected to pre-pressure and generates a first voltage signal. The deformation compensation module of the industrial computer 7 receives and records the first voltage signal.

[0086] 3) Substrate deformation compensation

[0087] During the part forming process, the piezoelectric ceramic piece 62 feeds back a real-time voltage signal to the deformation compensation module in real time. At regular intervals, the deformation compensation module drives the moving parts of the second piezoelectric motor 61 to move according to the difference between the real-time voltage signal and the first voltage signal, so that the real-time voltage signal fed back by the piezoelectric ceramic piece 62 is equal to the first voltage signal, thereby completing the compensation for the deformation of the substrate 1.

[0088] During the substrate leveling process, the distance measuring device 4 measures the second height value of a certain location on the edge of the substrate 1 at least three times, and takes the average value of the multiple measurements as the second height value of the location.

[0089] After the substrate is leveled, the distance measuring device 4 verifies the plane of the substrate 1. During this verification, the distance measuring device 4 repeatedly measures the second height value at each point along the edge of the substrate 1 at least twice. This ensures that the substrate 1 is leveled, or that the parallelism between the plane of the substrate 1 after leveling and the top surface of the forming cylinder 2 meets the processing requirements.

[0090] The time interval for substrate deformation compensation is 30min-60min.

[0091] The present invention is not limited to the specific technical solutions described in the above embodiments. In addition to the above embodiments, the present invention may also have other implementation methods. For those skilled in the art, any technical solutions formed by modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A substrate assembly for selective laser melting, characterized in that: It comprises a base plate (1), a lining plate (3) embedded in a forming cylinder (2), a distance measuring device (4), a leveling mechanism (5), a deformation compensation mechanism (6) and an industrial control computer (7); The base plate (1) is mounted on a lining plate (3), and a locking mechanism is provided on a side wall of the base plate (1); The lining plate (3) is provided with a first mounting hole (31) for mounting the leveling mechanism (5), and a second mounting hole (32) for mounting the deformation compensation mechanism (6), a plurality of first mounting holes (31) are arranged along the edge of the lining plate (3), and a plurality of second mounting holes (32) are arranged in the middle of the lining plate (3); The distance measuring device (4) is located above the substrate (1), and is used to measure a first height value between a detection end face of the distance measuring device (4) and the top face of the forming cylinder (2), and a second height value between the detection end face of the distance measuring device (4) and the edge of the substrate (1), and transmit the first height value and the second height value to the industrial control computer (7); The leveling mechanism (5) comprises a first piezoelectric motor (51) for driving the substrate (1) to perform lifting motion, the first piezoelectric motor (51) being embedded in the first mounting hole (31), and a moving part of the first piezoelectric motor (51) supporting the bottom of the substrate (1); The deformation compensation mechanism (6) includes a second piezoelectric motor (61) and a piezoelectric ceramic sheet (62), wherein the piezoelectric ceramic sheet (62) is placed between the substrate (1) and the lining plate (3), the second piezoelectric motor (61) is embedded in the second mounting hole (32), and the moving part of the second piezoelectric motor (61) forms a support for the bottom of the substrate (1); After the substrate (1) is leveled, it is locked on the lining plate (3) through a locking mechanism, and the piezoelectric ceramic piece (62) is subjected to pre-pressure and generates a first voltage signal; The industrial control computer (7) has a leveling control module and a deformation compensation module; The leveling control module is used to receive the first height value and the second height value measured by the distance measuring device (4), calculate the lifting height value of each first piezoelectric motor (51) based on the first height value and the second height value, and drive the moving parts of the first piezoelectric motor (51) to lift and lower the corresponding lifting height value; The deformation compensation module is used to record the first voltage signal and receive the real-time voltage signal fed back by the piezoelectric ceramic piece (62), and drive the moving part of the second piezoelectric motor (61) to move according to the difference between the real-time voltage signal and the first voltage signal, so that the real-time voltage signal fed back by the piezoelectric ceramic piece (62) is equal to the first voltage signal.

2. The substrate assembly for selective laser melting according to claim 1, characterized in that: The first mounting holes (31) are arranged in a rectangular shape along the edge of the lining plate (3).

3. The substrate assembly for selective laser melting according to claim 1, characterized in that: The second mounting holes (32) are arranged in an array on the lining plate (3).

4. The substrate assembly for selective laser melting according to claim 1, characterized in that: The piezoelectric ceramic pieces (62) are attached to the top of the lining plate (3), and the piezoelectric ceramic pieces (62) are arranged in an array on the lining plate (3).

5. The substrate assembly for selective laser melting according to claim 1, characterized in that: The distance measuring device (4) is mounted above the substrate (1) via a frame (9); a moving slide rail (10) is provided on the frame (9) for driving the distance measuring device (4) to move above the substrate (1); and the distance measuring device (4) is mounted on the moving slide rail (10).

6. The substrate assembly for selective laser melting according to claim 1, characterized in that: The locking mechanism comprises a locking bolt (8) for applying a locking force to the side wall of the lining plate (3), and a countersunk threaded hole for matching the locking bolt (8) is provided on the side wall of the base plate (1).

7. The method for using a substrate assembly for selective laser melting according to any one of claims 1 to 6, characterized in that: include: 1) Substrate leveling The substrate (1) is placed on the lining plate (3), and a first piezoelectric motor (51) mounted on the lining plate (3) supports the bottom of the substrate (1); A distance measuring device (4) located above the substrate (1) measures a first height value between a detection end face of the distance measuring device (4) and a top face of the forming cylinder (2), and transmits the first height value to a leveling control module of an industrial control computer (7). The leveling control module processes the first height values ​​to form a position reference plane for leveling the substrate (1); The distance measuring device (4) measures a second height value of the detection end face of the distance measuring device (4) from the edge of the substrate (1), and transmits the second height value to the leveling control module of the industrial control computer (7). The leveling control module calculates a deviation value of the position of the substrate (1) parallel to the position reference plane relative to the current position of the substrate (1) based on the multiple second height values, and then drives the moving parts of each first piezoelectric motor (51) to rise and fall by a corresponding lifting height value based on the deviation value, so that the plane where the substrate (1) is located is parallel to the position reference plane; 2) Initialization of substrate locking After the leveling is completed, the substrate (1) is locked on the lining plate (3) by a locking mechanism, the second piezoelectric motor (61) forms a support for the bottom of the substrate (1), the piezoelectric ceramic piece (62) located between the substrate (1) and the lining plate (3) is subjected to pre-pressure and generates a first voltage signal, and the deformation compensation module of the industrial control computer (7) receives and records the first voltage signal; 3) Substrate deformation compensation During the part forming process, the piezoelectric ceramic piece (62) feeds back a real-time voltage signal to the deformation compensation module in real time. At regular intervals, the deformation compensation module drives the moving part of the second piezoelectric motor (61) to move according to the difference between the real-time voltage signal and the first voltage signal, so that the real-time voltage signal fed back by the piezoelectric ceramic piece (62) is equal to the first voltage signal, thereby completing the compensation for the deformation of the substrate (1).

8. The method for using the substrate assembly for selective laser melting according to claim 7, characterized in that: During the substrate leveling process, the distance measuring device (4) measures the second height value of a certain location on the edge of the substrate (1) at least three times, and takes the average value of the multiple measurements as the second height value at that location.

9. The method for using the substrate assembly for selective laser melting according to claim 7, characterized in that: After the substrate (1) is leveled, the distance measuring device (4) performs a recheck operation on the plane where the substrate (1) is located. During the recheck operation, the distance measuring device (4) repeatedly measures the second height value at each location on the edge of the substrate (1) at least twice.

10. The method for using the substrate assembly for selective laser melting according to claim 7, wherein: The time interval for the substrate deformation compensation is 30 minutes to 60 minutes.

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