Sensing device
By designing a sensing device that includes a substrate, a light guide plate, a light-emitting diode, and a photosensitive element, the problem of the inability of existing technologies to detect non-metallic foreign objects is solved, enabling effective detection and accurate identification of non-metallic foreign objects and reducing manufacturing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AU OPTRONICS CORP
- Filing Date
- 2023-05-26
- Publication Date
- 2026-06-23
Smart Images
Figure CN116719097B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a sensing device. Background Technology
[0002] Foreign Object Detection (FOD) technology is commonly used to detect metallic foreign objects. For example, in wireless charging technology, FOD can be used to detect metallic objects between the charger and receiver to prevent them from affecting charging efficiency. However, because current FOD technologies can only detect metallic objects, their application is limited. For instance, to use existing FOD technology to detect obstructions on a glass surface, since these obstructions could be objects of various materials (such as leaves, paper, etc.), it is necessary to overcome the current limitation of FOD technology in detecting materials other than metal. Summary of the Invention
[0003] This invention provides a sensing device that can improve the problem that traditional foreign object detection technology cannot detect materials other than metal.
[0004] At least one embodiment of the present invention provides a sensing device. The sensing device includes a substrate, a light guide plate, a light-emitting diode (LED), and a photosensitive element. The light guide plate includes a first portion, a second portion, and a transition portion. The first portion is located on a side surface of the substrate. The first portion has at least one cavity. The second portion is located on a first surface of the substrate. The transition portion connects the first portion and the second portion. The LED is located in the cavity. The photosensitive element is located in the cavity.
[0005] Based on the above, changes in light can be used to detect whether there are foreign objects on the first surface of the substrate. Attached Figure Description
[0006] Figure 1A , Figure 1B and Figure 1C This is a cross-sectional schematic diagram of a sensing device according to an embodiment of the present invention in different directions;
[0007] Figure 2A and Figure 2B This is a cross-sectional schematic diagram of a sensing device according to an embodiment of the present invention in different directions;
[0008] Figure 3 This is a cross-sectional schematic diagram of a sensing device according to an embodiment of the present invention;
[0009] Figure 4A This is a cross-sectional schematic diagram of a sensing device according to an embodiment of the present invention;
[0010] Figure 4B yes Figure 4AA magnified view of a portion of the image;
[0011] Figure 4C It is along Figure 4B A schematic diagram of the cross section of line A-A';
[0012] Figure 4D This is a partial three-dimensional schematic diagram of a sensing device according to an embodiment of the present invention;
[0013] Figure 5 This is a cross-sectional schematic diagram of a sensing device according to an embodiment of the present invention.
[0014] Symbol Explanation
[0015] 10A, 10B, 10C, 10D, 10E: Sensing devices
[0016] 100:Substrate
[0017] 102: First Page
[0018] 104: Second page
[0019] 106: Side view
[0020] 200: Light guide plate
[0021] 210: Part One
[0022] 210a: First containment space
[0023] 210b: Second containment space
[0024] 212,222,232,222A: Outer surface
[0025] 214a, 234b: Entrance light region
[0026] 214b,234a: light emission area
[0027] 220: Turning Point
[0028] 230: Part Two
[0029] 300: Reflective coating
[0030] 310: Filter layer
[0031] 320: Prism structure
[0032] 410: Circuit Board
[0033] 412a~412f: Electronic components
[0034] 420: Light Emitting Diode
[0035] 430: Photosensitive element
[0036] 440: Retaining wall structure
[0037] 510: Outer frame
[0038] 510a, 510b: Accommodation space
[0039] 520: Ornaments
[0040] 610: Display Module
[0041] A-A', B-B', C-C': Lines
[0042] D1: First Direction
[0043] D2: Second Direction
[0044] D3: Third direction
[0045] L1, L2: Light rays
[0046] P1, P1A: First protruding structure
[0047] P2: Second protrusion structure
[0048] R: Region
[0049] S: Sensing surface
[0050] T: Cavity
[0051] W1, W2: Width
[0052] θ1, θ2: included angle Detailed Implementation
[0053] Figure 1A , Figure 1B and Figure 1C This is a cross-sectional schematic diagram of a sensing device 10A according to an embodiment of the present invention in different directions, wherein Figure 1C Corresponding to Figure 1A and Figure 1B The position of the midline A-A', and Figure 1A and Figure 1B Corresponding to Figure 1C The positions of median line B-B' and line C-C'. Please refer to... Figures 1A to 1C The sensing device 10A includes a substrate 100, a light guide plate 200, a light-emitting diode 420, and a photosensitive element 430. In this embodiment, the sensing device 10A also includes a circuit board 410, a barrier structure 440, a reflective coating 300, a filter layer 310, and a prism structure 320 (or a brightness enhancement film).
[0054] In some embodiments, the substrate 100 is made of glass, quartz, organic polymer, or opaque / reflective materials (e.g., conductive materials, metals, wafers, ceramics, or other suitable materials) or other suitable materials. In some embodiments, the substrate 100 is, for example, a cover plate for a display module, but the invention is not limited thereto. The substrate 100 includes a first surface 102, a second surface 104, and a side surface 106 connecting the first surface 102 and the second surface 104.
[0055] The light guide plate 200 includes a first portion 210, a turning portion 220, and a second portion 230. In some embodiments, the material of the light guide plate 200 includes polymethyl methacrylate (PMMA), polycarbonate (PC), or other suitable materials.
[0056] The first portion 210 is located on the side surface 106 of the substrate 100 and is generally parallel to the side surface 106. The first portion 210 has at least one cavity T. The second portion 230 is located on the first surface 102 of the substrate 100 and is generally parallel to the first surface 102. A transition portion 220 connects the first portion 210 and the second portion 230. In some embodiments, the outer surface 212 of the first portion 210 and the outer surface 232 of the second portion 230 are parallel to the side surface 106 and the first surface 102 of the substrate 100, respectively.
[0057] In some embodiments, the first portion 210, the turning portion 220, and the second portion 230 are sequentially connected and integrally formed. In some embodiments, the first portion 210 and the second portion 230 extend along a first direction D1 and a second direction D2, respectively, wherein the first direction D1 is perpendicular to the second direction D2. In some embodiments, the angle θ1 between the outer surface 212 of the first portion 210 and the outer surface 222 of the turning portion 220 is 45 degrees, and the angle θ2 between the outer surface 232 of the second portion 232 and the outer surface 222 of the turning portion 220 is 45 degrees, but the present invention is not limited thereto. In other embodiments, the outer surface 222 of the turning portion 220 is an arc surface.
[0058] Multiple light-emitting diodes (LEDs) 420, multiple photosensitive elements 430, and multiple barrier structures 440 are located on a circuit board 410 and within the cavity T of the light guide plate 200. The LEDs 420 and photosensitive elements 430 are electrically connected to the circuit board 410. The LEDs 420, photosensitive elements 430, and barrier structures 440 are arranged along a third direction D3, wherein the barrier structures 440 divide the cavity T of the light guide plate 200 into multiple first receiving spaces 210a and second receiving spaces 210b. The first receiving spaces 210a and second receiving spaces 210b are arranged along the third direction D3. For example, the first receiving spaces 210a and second receiving spaces 210b are arranged alternately. The LEDs 420 and photosensitive elements 430 are respectively located in the first receiving spaces 210a and second receiving spaces 210b, and the barrier structures 440 are located between the LEDs 420 and photosensitive elements 430. In some embodiments, the barrier structure 440 includes a light-absorbing or reflective material, thereby preventing adjacent light-emitting diodes 420 and photosensitive elements 430 from interfering with each other.
[0059] In this embodiment, since the light-emitting diode 420 and the photosensitive element 430 can share the same circuit board 410 and the same light guide plate 200, the manufacturing cost of the sensing device 10A can be saved.
[0060] In this embodiment, the first portion 210 of the light guide plate 200 includes a plurality of first protrusion structures P1 and a plurality of second protrusion structures P2 located in the cavity T. The first protrusion structures P1 and the second protrusion structures P2 overlap the light-emitting diode 420 and the photosensitive element 430, respectively. The barrier structure 440 is located between the first protrusion structures P1 and the second protrusion structures P2. In some embodiments, the width W1 of the first protrusion structure P1 is greater than the width W2 of the second protrusion structure P2.
[0061] A reflective coating 300 is located on the transition portion 220. For example, the reflective coating 300 is located on the outer surface 222 of the transition portion 220. In some embodiments, the reflective coating 300 extends from the outer surface 222 of the transition portion 220 to the outer surface 232 of the second portion 230. In some embodiments, the light L1 emitted by the light-emitting diode 420 enters the light guide plate 200 from the light-incident area 214a of the first protrusion structure P1, is refracted at the transition portion 220 into the second portion 230, and then exits the light guide plate 200 from the light-outceasing area 234a of the second portion 230.
[0062] Furthermore, external light L2 (e.g., light formed by light L1 being reflected by an object on the first surface 102 of the substrate 100) enters the light guide plate 200 from the light entrance area 234b of the second part 230, and is refracted into the first part 210 at the turning point 220. Then, it leaves the light guide plate 200 from the light exit area 214b of the second protrusion structure P2 of the first part 210 and is received by the photosensitive element 430.
[0063] In this embodiment, light is reflected back to the light guide plate 200 by an object on the first surface 102 of the substrate 100, and the photosensitive element 430 receives the light to generate a signal. Changes in the signal can identify the object on the first surface 102 of the substrate 100. In some embodiments, the bottom of the photosensitive element 430 is shielded to reduce the influence of stray light on the photosensitive element 430. For example, the bottom of the photosensitive element 430 is shielded by the circuit board 410 to reduce the influence of stray light on the photosensitive element 430.
[0064] In this embodiment, since light rays L1 and L2 can travel on the surface of substrate 100, very thin objects can be detected, and the energy utilization of light rays can be maximized.
[0065] In some embodiments, the light-emitting region 234a and the light-receiving region 234b are, for example, different regions on the same surface (e.g., the sensing surface S) of the second portion 230. In other words, the light-emitting region 234a and the light-receiving region 234b can be coplanar.
[0066] In this embodiment, light rays L1 and L2 are reflected by the reflective coating 300, but the present invention is not limited thereto. In other embodiments, other reflective structures besides the reflective coating 300 are provided on the turning portion 220, and light rays L1 and L2 are reflected by the aforementioned reflective structures.
[0067] A filter layer 310 is disposed on the second portion 230 and covers the light-emitting area 234a and the light-receiving area 234b on the sensing surface S. In some embodiments, the light-emitting diode 420 is an infrared light-emitting diode, the photosensitive element 430 is an infrared photosensitive element, and the filter layer 310 is a visible light filter layer, wherein the visible light filter layer can be used to prevent visible light from interfering with the photosensitive element 430. In some embodiments, the material of the filter layer 310 includes ink or other suitable materials.
[0068] The prism structure 320 is located on the filter layer 310 and is used to improve the collimation of the light L1 leaving the light guide plate 200 and the light L2 entering the light guide plate 200.
[0069] Figure 2A and Figure 2BThis is a cross-sectional schematic diagram of a sensing device 10B according to an embodiment of the present invention in different directions, wherein... Figure 2B Corresponding to Figure 2A The position of the midline A-A', and Figure 2A Corresponding to Figure 2B The location of the midline B-B'. It must be noted here that... Figure 2A and Figure 2B The embodiments follow Figures 1A to 1C The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.
[0070] Figure 2A and Figure 2B The sensing device 10B and Figures 1A to 1C The differences in the sensing device 10A include: the first protrusion structure P1A of the sensing device 10B includes a lens, and the first protrusion structure P1A is, for example, a total internal reflection lens.
[0071] Please refer to Figure 2A and Figure 2B The first portion 210 of the light guide plate 200 includes a plurality of first protrusion structures P1A and a plurality of second protrusion structures P2 located in the cavity T. The first protrusion structures P1A and the second protrusion structures P2 overlap the light-emitting diode 420 and the photosensitive element 430, respectively. In some embodiments, the light L1 emitted by the light-emitting diode 420 enters the light guide plate 200 from the light-incident area 214a of the first protrusion structure P1A, is refracted at the turning point 220 into the second portion 230, and then exits the light guide plate 200 from the light-exit area 234a of the second portion 230. The first protrusion structure P1A functions as a lens and can be used to improve the collimation of the light L1 entering the light guide plate 200.
[0072] Figure 3 This is a cross-sectional schematic diagram of a sensing device 10C according to an embodiment of the present invention. It should be noted that... Figure 3 The embodiments follow Figure 2A and Figure 2B The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.
[0073] Figure 3 The sensing device 10C and Figure 2A and Figure 2BThe differences in the sensing device 10B include: the outer surface 222A of the turning portion 220 of the sensing device 10C is an arc surface.
[0074] Please refer to Figure 3 The outer surface 222A of the transition portion 220 is curved, and the reflective coating 300 is located on the transition portion 220. For example, the reflective coating 300 is located on the outer surface 222A of the transition portion 220. In some embodiments, the reflective coating 300 extends from the outer surface 222A of the transition portion 220 to the outer surface 232 of the second portion 230. The curved outer surface 222A can improve the collimation of light.
[0075] Figure 4A This is a cross-sectional schematic diagram of a sensing device 10D according to an embodiment of the present invention. Figure 4B yes Figure 4A A magnified view of a portion of region R. Figure 4C It is along Figure 4B A schematic diagram of the cross section of line A-A'. Figure 4D This is a partial perspective view of a sensing device 10D according to an embodiment of the present invention. It must be noted here that... Figures 4A to 4D The embodiments follow Figures 1A to 1C The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.
[0076] Please refer to Figures 4A to 4D In this embodiment, the sensing device 10D includes a substrate 100, a light guide plate 200, a light-emitting diode 420, a photosensitive element 430, an outer frame 510, and a decorative element 520.
[0077] Please refer to Figures 4A to 4D A light guide plate 200, a light-emitting diode 420, and a photosensitive element 430 are disposed in the receiving space 510a of the outer frame 510. In some embodiments, the light guide plate 200 is fixed to the outer frame 510 by a fastener (not shown), such as a clamp, screw, or other suitable component. In some embodiments, the light guide plate 200 is directly fixed to the outer frame 510 by ultrasonic welding. In some embodiments, a reflective coating (not shown) is provided on the light guide plate 200. In some embodiments, a display module (not shown) is disposed in the receiving space 510b of the outer frame 510, and the substrate 100 can serve as a cover plate for the display module. In some embodiments, the receiving spaces 510a and 510b are separate from each other, but the invention is not limited thereto. In other embodiments, the receiving spaces 510a and 510b are connected together. A decorative element 520 is disposed on the outer frame 510 and is used to shield the edge of the outer frame 510.
[0078] In some embodiments, the sensing device 10D is, for example, a head-up display device for vehicles, and the light guide plate 200, light-emitting diode 420 and photosensitive element 430 in the sensing device 10D can be used to sense whether there are foreign objects (such as business cards, credit cards, pens, invoices, etc.) on the surface of the substrate 100. Since light rays L1 and L2 can travel on the surface of the substrate 100, thin and lightweight foreign objects (such as pieces of paper) can be detected.
[0079] Furthermore, since the light guide plate 200, the light-emitting diode 420, and the photosensitive element 430 are directly disposed within the outer frame 510 that houses the display module, there is no need for an additional camera for foreign object detection. Therefore, in addition to eliminating the need for costly camera image recognition technology, it also saves the space required for an additional camera.
[0080] Figure 5 This is a cross-sectional schematic diagram of a sensing device 10E according to an embodiment of the present invention. It must be noted that... Figure 5 The embodiments follow Figures 1A to 1C The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.
[0081] Figure 5 The sensing device 10E and Figures 1A to 1C The differences between the sensing device 10A and the sensing device 10E include: the sensing device 10E also includes a display module 610.
[0082] Please refer to Figure 5 The display module 610 is located below the second surface 104 of the substrate 100. The circuit board 410 is located below the display module 610. Electronic components 412a to 412f are disposed on the circuit board 410, and the display module 610 is electrically connected to at least one of the electronic components 412a to 412f via the circuit board 620. In some embodiments, the electronic components 412a to 412f include chips, passive components, or other electronic components.
[0083] In some embodiments, the circuit board 410 is, for example, the system circuit board of the display module 610, and the light-emitting diode 420 and the photosensitive element 430 are disposed on the system circuit board. Therefore, the production cost of the sensing device 10E can be reduced.
Claims
1. A sensing device, comprising: substrate; Light guide plate, including: A first portion, located on the side of the substrate, wherein the first portion has at least one cavity; and The second part is located on the first surface of the substrate; and A transition section connects the first part and the second part; A light-emitting diode, located in the at least one cavity; and The photosensitive element is located in the at least one cavity. The light emitted by the light-emitting diode is guided by the light guide plate, leaves the light guide plate from the second part, and travels along the first surface of the substrate; and the light reflected from the first surface of the substrate is guided by the light guide plate back into the at least one cavity and is received by the photosensitive element.
2. The sensing device as claimed in claim 1, further comprising: A reflective coating is located on this transition section.
3. The sensing device of claim 2, wherein the turning portion includes an arc surface.
4. The sensing device of claim 2, wherein the reflective coating extends from the turning portion to the second portion.
5. The sensing device of claim 1, wherein the first portion includes a first protrusion structure located in the at least one cavity, and the first protrusion structure overlaps the light-emitting diode.
6. The sensing device of claim 5, wherein the first portion includes a second protrusion structure overlapping the photosensitive element, wherein the width of the first protrusion structure is greater than the width of the second protrusion structure, and the first protrusion structure includes a lens.
7. The sensing device of claim 6, further comprising: A retaining wall structure is located between the light-emitting diode and the photosensitive element, and between the first protrusion structure and the second protrusion structure.
8. The sensing device of claim 7, wherein the barrier structure comprises a light-absorbing material or a reflective material.
9. The sensing device of claim 1, further comprising: A filter layer is disposed on the second part; as well as A prism structure is located on this filter layer.
10. The sensing device of claim 9, further comprising: The display module is located below the substrate; as well as A system circuit board is located below the display module, and the display module is electrically connected to the system circuit board, wherein the light-emitting diode and the photosensitive element are disposed on the system circuit board.