Radiation detector and method of manufacturing a radiation detector

Abstract

A radiation detector includes a sensor panel having a light-receiving surface, a first scintillator panel and a second scintillator panel disposed on the light-receiving surface in a state of being adjacent to each other along the light-receiving surface, and a bonding layer. The first scintillator panel has a first substrate and a first scintillator layer including a plurality of columnar crystals. The second scintillator panel has a second substrate and a second scintillator layer including a plurality of columnar crystals. The first scintillator layer reaches at least a first portion of the first substrate. The second scintillator layer reaches at least a second portion of the second substrate. The bonding layer is separated for each of the first scintillator panel and the second scintillator panel.

Description

Technical Field

[0001] This invention relates to radiation detectors and methods for manufacturing radiation detectors. Background Technology

[0002] A radiation detector is known, comprising: a sensor panel having a light-receiving surface; a scintillator panel disposed on the light-receiving surface; and an adhesive layer disposed between the light-receiving surface and the scintillator panel (see, for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 4018472 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] In radiation detectors like those described above, the increasing size of the sensor panel necessitates a larger radiation detection area. However, in scintillator panels where the scintillator layer is composed of granular phosphors and binder resin, while it's easy to increase the scintillator panel size to achieve a larger radiation detection area, obtaining high-resolution radiation images is difficult. On the other hand, in scintillator panels where the scintillator layer is composed of multiple columnar crystals, while obtaining high-resolution radiation images is easy, increasing the scintillator panel size to achieve a larger radiation detection area is challenging.

[0008] The object of the present invention is to provide a radiation detector capable of simultaneously achieving a large radiation detection area and a high resolution radiation image, and a method for manufacturing such a radiation detector.

[0009] Technical means for solving technical problems

[0010] An embodiment of the radiation detector of the present invention includes: a sensor panel having a light-receiving surface; a first scintillator panel and a second scintillator panel disposed adjacent to each other on the light-receiving surface; and an adhesive layer disposed between the light-receiving surface and the first scintillator panel and between the light-receiving surface and the second scintillator panel. The first scintillator panel has: a first substrate; and a first scintillator layer including a plurality of columnar crystals formed on the first substrate. The second scintillator panel has: a second substrate; and a second scintillator layer including a plurality of columnar crystals formed on the second substrate. The first scintillator panel emits a first scintillator. The first scintillator panel is located on the light-receiving side of the first substrate and is bonded to the light-receiving surface by an adhesive layer. The second scintillator panel is located on the light-receiving side of the second substrate and is bonded to the light-receiving surface by an adhesive layer. When viewed from the side of the first scintillator layer, the outer edge of the first substrate includes a first portion extending along the second scintillator panel, and the first scintillator layer at least reaches the first portion. When viewed from the side of the second scintillator layer, the outer edge of the second substrate includes a second portion extending along the first scintillator panel, and the second scintillator layer at least reaches the second portion. The adhesive layer is separated for each first scintillator panel and each second scintillator panel.

[0011] In one embodiment of the radiation detector of the present invention, a first scintillator panel and a second scintillator panel are disposed adjacent to each other on the light-receiving surface of a sensor panel. In both the first and second scintillator panels, the first scintillator layer reaches a first portion extending along the second scintillator panel at the outer edge of a first substrate, and the second scintillator layer reaches a second portion extending along the first scintillator panel at the outer edge of a second substrate. Therefore, the first and second scintillator panels can be configured with dimensions capable of reliably forming multiple columnar crystals, and a radiation detection area can be obtained through the first and second scintillator panels. Furthermore, adhesive layers disposed between the light-receiving surface of the sensor panel and the first scintillator panel, and between the light-receiving surface of the sensor panel and the second scintillator panel, are separated for each of the first and second scintillator panels. Therefore, the time the adhesive layer is exposed to the outside when the first scintillator panel and the second scintillator panel are respectively bonded to the light-receiving surface of the sensor panel can be shortened, and foreign objects can be prevented from biting into the space between the light-receiving surface of the sensor panel and the first scintillator panel, and between the light-receiving surface of the sensor panel and the second scintillator panel. Furthermore, the first scintillator panel and the second scintillator panel can be bonded to the light-receiving surface of the sensor panel with high precision. As described above, according to one aspect of the radiation detector of the present invention, both a large radiation detection area and a high resolution radiation image can be simultaneously achieved.

[0012] In one embodiment of the radiation detector of the present invention, the first substrate and the second substrate may each be flexible. This improves operating efficiency when the first scintillator panel and the second scintillator panel are respectively bonded to the light-receiving surface of the sensor panel.

[0013] In one embodiment of the radiation detector of the present invention, the first scintillator panel, when viewed from the thickness direction of the first substrate, is a rectangular shape with a side length of 300 mm or more, and the second scintillator panel, when viewed from the thickness direction of the second substrate, is a rectangular shape with a side length of 300 mm or more. By employing this structure, a large area of ​​radiation detection region can be easily and reliably achieved.

[0014] In one embodiment of the radiation detector of the present invention, the adhesive layer may comprise an adhesive (binder) or bonding agent. This allows the first scintillator panel and the second scintillator panel to be reliably bonded to the light-receiving surface of the sensor panel, respectively.

[0015] In one embodiment of the radiation detector of the present invention, the first scintillator panel may further have a first protective layer covering the first substrate and the first scintillator layer, and the second scintillator panel may further have a second protective layer covering the second substrate and the second scintillator layer. This allows protection of multiple columnar crystals that are deliquescent.

[0016] One embodiment of the radiation detector of the present invention may further include: a first moisture-proof layer disposed on a first scintillator panel on the side opposite to the sensor panel; a second moisture-proof layer disposed on a second scintillator panel on the side opposite to the sensor panel; a first protective layer covering the first scintillator panel and the first moisture-proof layer; and a second protective layer covering the second scintillator panel and the second moisture-proof layer. This allows for the protection of a plurality of deliquescent columnar crystals.

[0017] One embodiment of the radiation detector of the present invention may also include a granular phosphor disposed between the first scintillator panel and the second scintillator panel. This allows for suppression of image quality degradation of the radiation image at the junction of the first and second scintillator panels.

[0018] One aspect of the present invention is a method for manufacturing a radiation detector, comprising: a step of preparing a sensor panel; a step of preparing a first scintillator panel and a second scintillator panel; and an adhesive step of bonding each of the first scintillator panel and the second scintillator panel to a light-receiving surface by means of an adhesive layer, wherein in the adhesive step, the adhesive layer is separated according to each of the first scintillator panel and the second scintillator panel.

[0019] According to one aspect of the present invention, a method for manufacturing a radiation detector enables the radiation detector to be obtained easily and reliably.

[0020] In one embodiment of the method for manufacturing a radiation detector according to the present invention, an adhesive layer may be disposed on each of the first scintillator panel and the second scintillator panel in the bonding step before bonding each of the first scintillator panel and the second scintillator panel to the light-receiving surface. This allows the first scintillator panel and the adhesive layer to be processed in a state where they are integrated. Similarly, the second scintillator panel and the adhesive layer can be processed in a state where they are integrated.

[0021] In one embodiment of the method for manufacturing a radiation detector according to the present invention, an adhesive layer may be disposed on the light-receiving surface before each of the first scintillator panel and the second scintillator panel is bonded to the light-receiving surface in the bonding step. This allows the first scintillator panel and the second scintillator panel to be processed separately.

[0022] The effects of the invention

[0023] According to the present invention, a radiation detector capable of simultaneously achieving a large radiation detection area and a high resolution radiation image, and a method for manufacturing such a radiation detector, can be provided. Attached Figure Description

[0024] Figure 1 This is a cross-sectional view of a radiation detector according to one embodiment.

[0025] Figure 2 This is a cross-sectional view of a scintillator panel assembly according to one embodiment.

[0026] Figure 3 This is a cross-sectional view of a radiation detector in one step of a method for manufacturing a radiation detector according to one embodiment.

[0027] Figure 4 This is a cross-sectional view of a modified radiation detector.

[0028] Figure 5 This is a cross-sectional view of a portion of a modified radiation detector.

[0029] Figure 6 This is a cross-sectional view of a modified scintillator panel assembly.

[0030] Figure 7 This is a cross-sectional view of a modified radiation detector.

[0031] Figure 8 This is a cross-sectional view of a modified radiation detector.

[0032] Figure 9 This is a cross-sectional view of a modified scintillator panel assembly. Detailed Implementation

[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the various figures, the same or equivalent parts are given the same reference numerals, and repeated descriptions are omitted.

[0034] [Structure of a radiation detector]

[0035] like Figure 1 As shown, the radiation detector 1 includes: a sensor panel 2, a first scintillator panel 10, a second scintillator panel 20, an adhesive layer 3, a granular phosphor 4, a moisture-proof layer 5, an adhesive layer 6, and an encapsulation component 7. In the radiation detector 1, if radiation (e.g., X-rays) enters the first scintillator panel 10 and the second scintillator panel 20, scintillating light will be generated on the first scintillator panel 10 and the second scintillator panel 20, and this scintillating light can be detected by the sensor panel. The radiation detector 1 is used as a radiographic imaging device, for example, in medical radiographic imaging diagnostic devices or non-destructive examination devices.

[0036] The sensor panel 2 includes a plurality of photoelectric conversion elements (not shown) arranged along the light-receiving surface 2a. Each photoelectric conversion element constitutes a pixel and outputs an electrical signal corresponding to the incident flash light. The light-receiving surface 2a is provided on a main surface of the sensor panel 2. On this main surface, a frame-shaped region, i.e., surface 2b, surrounding the light-receiving surface 2a is provided. The sensor panel 2 is flexible. The material of the substrate on which the plurality of photoelectric conversion elements are provided in the sensor panel 2 is, for example, PI (polyimide), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PP (polypropylene), PE (polyester), or PMMA (polymethyl methacrylate).

[0037] The first scintillator panel 10 and the second scintillator panel 20 are disposed adjacent to each other on the light-receiving surface 2a. The first scintillator panel 10 has a first substrate 11, a first scintillator layer 12 and a first protective layer 13. The second scintillator panel 20 has a second substrate 21, a second scintillator layer 22 and a second protective layer 23.

[0038] The first substrate 11 and the second substrate 21 are both flexible. The materials of the first substrate 11 and the second substrate 21 are, for example, PET, PEN, PI, PP, PE, or PMMA. The thickness of the first substrate 11 and the second substrate 21 is, for example, 50 μm to 250 μm. Furthermore, functional films may be formed on the surface and back surface of the first substrate 11 and the second substrate 21. These functional films are, for example, easy-to-adhere coatings, anti-static coatings, or moisture-proof films (parylene films). These functional films may also be laminated films comprising multiple films, each with different functions.

[0039] The first scintillator layer 12 includes a plurality of columnar crystals formed on the first substrate 11. The second scintillator layer 22 includes a plurality of columnar crystals formed on the second substrate 21. The plurality of columnar crystals are formed on the first substrate 11 or the second substrate 21, for example, by evaporating scintillator material onto the first substrate 11 or the second substrate 21. The materials of the first scintillator layer 12 and the second scintillator layer 22 are, for example, CsI:TI (cesium iodide containing thallium as an activator), CsI:Na (cesium iodide containing sodium as an activator), CsI:Ce (cesium iodide containing cerium as an activator), or CsI:TI,Eu (cesium iodide containing thallium and europium as activators). The thickness of the first scintillator layer 12 and the second scintillator layer 22 is, for example, 100 μm or more and 1000 μm or less (preferably 400 μm or more and 800 μm or less).

[0040] The first protective layer 13 covers the first substrate 11 and the first scintillator layer 12. The second protective layer 23 covers the second substrate 21 and the second scintillator layer 22. The material of each of the first protective layer 13 and the second protective layer 23 is, for example, parylene (trade name). The thickness of each of the first protective layer 13 and the second protective layer 23 is, for example, 0.5 μm or more and 20 μm or less.

[0041] The first scintillator panel 10 is disposed on the light-receiving surface 2a with the first scintillator layer 12 located on the light-receiving surface 2a side of the first substrate 11. When viewed from the thickness direction of the first substrate 11, the first scintillator panel 10 is rectangular with one side length of 300 mm or more. The second scintillator panel 20 is disposed on the light-receiving surface 2a with the second scintillator layer 22 located on the light-receiving surface 2a side of the second substrate 21. When viewed from the thickness direction of the second substrate 21, the second scintillator panel 20 is rectangular with one side length of 300 mm or more.

[0042] When viewed from the side of the first scintillator layer 12, the outer edge 11a of the first substrate 11 includes a first portion 11b extending along the second scintillator panel 20. The first scintillator layer 12 reaches the first portion 11b. In this embodiment, the first scintillator layer 12 reaches all portions of the outer edge 11a. When viewed from the side of the second scintillator layer 22, the outer edge 21a of the second substrate 21 includes a second portion 21b extending along the first scintillator panel 10. The second scintillator layer 22 reaches the second portion 21b. In this embodiment, the second scintillator layer 22 reaches all portions of the outer edge 21a. The first portion 11b of the outer edge 11a of the first substrate 11 is opposite to the second portion 21b of the outer edge 21a of the second substrate 21.

[0043] The first substrate 11 and the first scintillator layer 12 are obtained by cutting the substrate and the scintillator layer after forming a scintillator layer comprising a portion corresponding to a plurality of first substrates 11 on a substrate comprising a portion corresponding to a plurality of first substrates 11. The second substrate 21 and the second scintillator layer 22 are obtained by cutting the substrate and the scintillator layer after forming a scintillator layer comprising a portion corresponding to a plurality of second substrates 21 on a substrate comprising a portion corresponding to a plurality of second substrates 21. Alternatively, the first substrate 11 and the first scintillator layer 12 may be obtained by cutting out the substrate and the scintillator layer after forming a scintillator layer comprising a portion corresponding to a first substrate 11 on a substrate comprising a portion corresponding to a first substrate 11. The second substrate 21 and the second scintillator layer 22 can also be obtained by cutting out the substrate and the scintillator layer after forming a scintillator layer comprising a portion corresponding to a portion corresponding to a second substrate 21 on the substrate.

[0044] The first angle θ1 formed between the surface 10a of the sensor panel 2 side (the side of the first scintillator layer 12 relative to the first substrate 11) of the first scintillator panel 10 and the side surface 10b of the second scintillator panel 20 side of the first scintillator panel 10 is 45 degrees or more and less than 90 degrees. In this embodiment, the surface 10a forms an angle of 45 degrees or more and less than 90 degrees with the entire side surface of the first scintillator panel 10. The second angle θ2 formed between the surface 20a of the sensor panel 2 side (the side of the second scintillator layer 22 relative to the second substrate 21) of the second scintillator panel 20 and the side surface 20b of the first scintillator panel 10 side of the second scintillator panel 20 is 45 degrees or more and less than 90 degrees. In this embodiment, the surface 20a forms an angle of 45 degrees or more and less than 90 degrees with the entire side surface of the second scintillator panel 20. The corner of the first scintillator panel 10, formed by surface 10a and side 10b, contacts the corner of the second scintillator panel 20, formed by surface 20a and side 20b.

[0045] An adhesive layer 3 is disposed between the light-receiving surface 2a and the first scintillator panel 10, and between the light-receiving surface 2a and the second scintillator panel 20. The first scintillator panel 10 is bonded to the light-receiving surface 2a by the adhesive layer 3 when the first scintillator layer 12 is located on the light-receiving surface 2a side of the first substrate 11. The second scintillator panel 20 is bonded to the light-receiving surface 2a by the adhesive layer 3 when the second scintillator layer 22 is located on the light-receiving surface 2a side of the second substrate 21. The adhesive layer 3 is separated for each first scintillator panel 10 and each second scintillator panel 20. That is, the adhesive layer 3 disposed between the light-receiving surface 2a and the first scintillator panel 10, and the adhesive layer 3 disposed between the light-receiving surface 2a and the second scintillator panel 20, form an interface even when they are in contact with each other.

[0046] Adhesive layer 3 is an adhesive or bonding agent. An adhesive is one that does not cure after bonding. A bonding agent is one that cures after bonding. The material of adhesive layer 3 is, for example, a light-transmitting organic material (e.g., OCA (Optical Clear Adhesive)). The thickness of adhesive layer 3 is, for example, 0.1 μm to 100 μm (preferably 25 μm or less).

[0047] The granular phosphor 4 is disposed between the first scintillator panel 10 and the second scintillator panel 20. More specifically, the granular phosphor 4 is disposed within a V-shaped groove formed by the side surface 10b of the first scintillator panel 10 and the side surface 20b of the second scintillator panel 20. The material of the granular phosphor 4 is, for example, gadolinium oxysulfide (GOS).

[0048] A moisture-proof layer 5 covers the first scintillator panel 10 and the second scintillator panel 20 on the sensor panel 2. The moisture-proof layer 5 is disposed on the opposite side of the sensor panel 2 on the first scintillator panel 10 and the second scintillator panel 20, and is disposed continuously across the first scintillator panel 10 and the second scintillator panel 20. The outer edge 5a of the moisture-proof layer 5 reaches the surface 2b of the sensor panel 2 (the surface surrounding the light-receiving surface 2a).

[0049] The moisture-proof layer 5 has a main body layer 51 and an inorganic layer 52. The main body layer 51 is flexible. The inorganic layer 52 is disposed on the main body layer 51. The inorganic layer 52 is integrated with the main body layer 51, for example, by bonding it to the main body layer 51. The moisture-proof layer 5 is disposed on the first scintillator panel 10 and the second scintillator panel 20 with the inorganic layer 52 located on the side of the first scintillator panel 10 and the second scintillator panel 20 relative to the main body layer 51.

[0050] The material of the main layer 51 is, for example, PET, PEN, PI, PP, PE, or PMMA. The thickness of the main layer 51 is, for example, 50 μm to 250 μm. The material of the inorganic layer 52 is, for example, Al (aluminum), Cu (copper), Ti (titanium), Fe (iron), or SUS (stainless steel). The thickness of the inorganic layer 52 is, for example, 10 μm to 100 μm.

[0051] An adhesive layer 6 is disposed between the first scintillator panel 10 and the moisture-proof layer 5, between the second scintillator panel 20 and the moisture-proof layer 5, and between the surface 2b of the sensor panel 2 and the moisture-proof layer 5. The moisture-proof layer 5 is bonded to the surfaces 2b of the first scintillator panel 10, the second scintillator panel 20, and the sensor panel 2. The adhesive layer 6 is an adhesive or bonding agent. The thickness of the adhesive layer 6 is, for example, 0.1 μm to 100 μm (preferably 25 μm or less).

[0052] The encapsulation component (sealing component) 7 seals the outer edge 5a of the moisture-proof layer 5 on the surface 2b of the sensor panel 2. The encapsulation component 7 extends in a frame shape along the outer edge 5a. The material of the encapsulation component 7 is, for example, epoxy resin, silicone resin, fluororesin, polyurethane resin, or acrylic resin. The material of the encapsulation component 7 may also contain fillers made of inorganic materials such as glass. The filler material only needs to have higher moisture resistance than the main material of the encapsulation component 7, for example, SiO2 (silicon dioxide), Al2O3 (alumina), or TiO2 (titanium oxide).

[0053] As explained above, in the radiation detector 1, the first scintillator panel 10 and the second scintillator panel 20 are disposed adjacent to each other on the light-receiving surface 2a of the sensor panel 2. In the first scintillator panel 10 and the second scintillator panel 20, the first scintillator layer 12 reaches a first portion 11b extending along the second scintillator panel 20 in the outer edge 11a of the first substrate 11, and the second scintillator layer 22 reaches a second portion 21b extending along the first scintillator panel 10 in the outer edge 21a of the second substrate 21. Therefore, the first scintillator panel 10 and the second scintillator panel 20 can be configured with dimensions capable of reliably forming multiple columnar crystals, and a radiation detection area can be obtained through the first scintillator panel 10 and the second scintillator panel 20. Furthermore, the adhesive layer 3 disposed between the light-receiving surface 2a and the first scintillator panel 10, and between the light-receiving surface 2a and the second scintillator panel 20, is separated for each of the first scintillator panel 10 and the second scintillator panel 20. This shortens the time the adhesive layer 3 is exposed to the outside when the first scintillator panel 10 and the second scintillator panel 20 are respectively bonded to the light-receiving surface 2a, thus suppressing the ingress (mixing) of foreign matter between the light-receiving surface 2a and the first scintillator panel 10, and between the light-receiving surface 2a and the second scintillator panel 20. Moreover, the first scintillator panel 10 and the second scintillator panel 20 can be bonded to the light-receiving surface 2a with good precision. Even if one of the first scintillator panel 10 and the second scintillator panel 20 malfunctions, only that panel needs to be replaced. With the above structure, the radiation detector 1 can simultaneously achieve a large radiation detection area and a high resolution radiation image.

[0054] In the radiation detector 1, both the first substrate 11 and the second substrate 21 are flexible. This improves the working efficiency when the first scintillator panel 10 and the second scintillator panel 20 are respectively bonded to the light-receiving surface 2a.

[0055] In the radiation detector 1, when viewed from the thickness direction of the first substrate 11, the first scintillator panel 10 is a rectangle with a side length of 300 mm or more, and when viewed from the thickness direction of the second substrate 21, the second scintillator panel 20 is a rectangle with a side length of 300 mm or more. This allows for easy and reliable realization of a large-area radiation detection region.

[0056] In the radiation detector 1, the adhesive layer 3 contains an adhesive or bonding agent. This allows the first scintillator panel 10 and the second scintillator panel 20 to be reliably bonded to the light-receiving surface 2a, respectively.

[0057] In the radiation detector 1, the first scintillator panel 10 has a first protective layer 13 covering the first substrate 11 and the first scintillator layer 12, and the second scintillator panel 20 has a second protective layer 23 covering the second substrate 21 and the second scintillator layer 22. This allows protection of a plurality of columnar crystals that are hygroscopic.

[0058] In the radiation detector 1, a granular phosphor 4 is disposed between the first scintillator panel 10 and the second scintillator panel 20. As a result, image quality degradation of the radiation image can be suppressed at the junction of the first scintillator panel 10 and the second scintillator panel 20.

[0059] In the radiation detector 1, a moisture-proof layer 5 is disposed on the first scintillator panel 10 and the second scintillator panel 20 on the opposite side of the sensor panel 2, and is continuously provided across the first scintillator panel 10 and the second scintillator panel 20. This prevents moisture from penetrating the joint (connection portion) between the first scintillator panel 10 and the second scintillator panel 20, reliably protecting the multiple columnar crystals that are prone to deliquescence. Furthermore, even if a difference in expansion and contraction occurs between the sensor panel 2 and the first scintillator panel 10, and between the sensor panel 2 and the second scintillator panel 20, due to temperature changes, the joint portion between the first scintillator panel 10 and the second scintillator panel 20 can be prevented from peeling off (detaching) from the light-receiving surface 2a.

[0060] In the radiation detector 1, the moisture-proof layer 5 includes a flexible main layer 51 and an inorganic layer 52 disposed on the main layer 51. The moisture-proof layer 5 is disposed on the first scintillator panel 10 and the second scintillator panel 20 with the inorganic layer 52 positioned on the side of the first scintillator panel 10 and the second scintillator panel 20 relative to the main layer 51. Thus, the inorganic layer 52 can function as the moisture-proof layer 5, and the main layer 51 can function as a protective layer.

[0061] In the radiation detector 1, the first angle θ1 formed by the surface 10a on the sensor panel 2 side of the first scintillator panel 10 and the side surface 10b on the second scintillator panel 20 side of the first scintillator panel 10 is less than 90 degrees, and the second angle θ2 formed by the surface 20a on the sensor panel 2 side of the second scintillator panel 20 and the side surface 20b on the first scintillator panel 10 side of the second scintillator panel 20 is less than 90 degrees. This prevents the joint between the first scintillator panel 10 and the second scintillator panel 20 from peeling (detaching) from the light-receiving surface 2a due to thermal expansion of air. Furthermore, since the first scintillator layer 12 and the second scintillator layer 22 are close together, image quality degradation of the radiation image can be suppressed at the joint between the first scintillator panel 10 and the second scintillator panel 20.

[0062] In radiation detector 1, the first angle θ1 and the second angle θ2 are both greater than 45 degrees and less than 90 degrees. As a result, it is possible to more reliably prevent the joint between the first scintillator panel 10 and the second scintillator panel 20 from peeling off from the light-receiving surface 2a due to thermal expansion of air.

[0063] In the radiation detector 1, the first angle θ1 and the second angle θ2 are both less than 90 degrees, and the sensor panel 2 is flexible. Therefore, the radiation detector 1 can be flexed as a whole to accommodate different installation environments. Furthermore, when the radiation detector 1 is flexed so that the sensor panel 2 is positioned outwards relative to the first scintillator panel 10 and the second scintillator panel 20, physical interference between the first scintillator panel 10 and the second scintillator panel 20 can be prevented.

[0064] As an example, such as Figure 4 As shown, the radiation detector 1 can be bent as a whole by arranging the first scintillator panel 10 and the second scintillator panel 20 along the cylindrical surface S. At this time, since the first angle θ1 and the second angle θ2 are each less than 90 degrees, physical interference between the first scintillator panel 10 and the second scintillator panel 20 can be prevented. Figure 4 Although the radiation detector 1 shown does not include the granular phosphor 4, the moisture-proof layer 5, the adhesive layer 6, and the encapsulation component 7, these components may be included as needed.

[0065] [Structure of the scintillator panel assembly]

[0066] like Figure 2 As shown, one of the pair of scintillator panel assemblies 100 includes a first scintillator panel 10, an adhesive layer 3, and a release tab 8. The other scintillator panel assembly 100 in the pair includes a second scintillator panel 20, an adhesive layer 3, and a release tab 8. The pair of scintillator panel assemblies 100 are used, for example, in the manufacture of the aforementioned radiation detector 1.

[0067] In one scintillator panel assembly 100, a release tab 8 covers the adhesive layer 3 from the opposite side of the first scintillator panel 10. In another scintillator panel assembly 100, a release tab 8 covers the adhesive layer 3 from the opposite side of the second scintillator panel 20. The adhesive force of the adhesive layer 3 on the surface 8a of the release tab 8 is less than the adhesive force of the adhesive layer 3 on both the first scintillator panel 10 and the second scintillator panel 20. In the scintillator panel assembly 100, the adhesive layer 3 is an adhesive layer.

[0068] The first scintillator panel 10 is disposed on the adhesive layer 3 with the first scintillator layer 12 located on the adhesive layer 3 side of the first substrate 11. The second scintillator panel 20 is disposed on the adhesive layer 3 with the second scintillator layer 22 located on the adhesive layer 3 side of the second substrate 21. That is, the arrangement of the first scintillator panel 10 to the adhesive layer 3 of one scintillator panel assembly 100 is the same as the arrangement of the first scintillator panel 10 to the adhesive layer 3 of the radiation detector 1. The arrangement of the second scintillator panel 20 to the adhesive layer 3 of another scintillator panel assembly 100 is the same as the arrangement of the second scintillator panel 20 to the adhesive layer 3 of the radiation detector 1.

[0069] In one scintillator panel assembly 100, a first scintillator panel 10 has a first protective layer 13 covering a first substrate 11 and a first scintillator layer 12. In another scintillator panel assembly 100, a second scintillator panel 20 has a second protective layer 23 covering a second substrate 21 and a second scintillator layer 22. This allows protection of a plurality of columnar crystals that are deliquescent.

[0070] [Manufacturing method of radiation detector]

[0071] The method for manufacturing the radiation detector 1 described herein will be described. In this embodiment, the pair of scintillator panel assemblies 100 described herein are used.

[0072] First, prepare sensor panel 2 (steps for preparing sensor panel 2). Next, with... Figure 2 The state of the pair of scintillator panel assemblies 100 shown is such that the first scintillator panel 10 and the second scintillator panel 20 are prepared (steps for preparing the first scintillator panel 10 and the second scintillator panel 20). In the steps of preparing the first scintillator panel 10 and the second scintillator panel 20, the first angle θ1 and the second angle θ2 are both greater than 45 degrees and less than 90 degrees (refer to...). Figure 1 The steps of preparing sensor panel 2 and preparing first scintillator panel 10 and second scintillator panel 20 can be performed first, or both steps can be performed simultaneously.

[0073] Next, in a scintillator panel assembly 100, the release tab 8 is peeled off from the first scintillator panel 10 and the adhesive layer 3, as follows: Figure 3 As shown, the first scintillator panel 10 is bonded to the light-receiving surface 2a using adhesive layer 3 (bonding step). Furthermore, in another scintillator panel assembly 100, the release tab 8 is peeled off from the second scintillator panel 20 and adhesive layer 3, as shown. Figure 3As shown, the second scintillator panel 20 is bonded to the light-receiving surface 2a using adhesive layer 3 (bonding step). That is, the first scintillator panel 10 and the second scintillator panel 20 are respectively disposed on the light-receiving surface 2a (step of separately disposing of the first scintillator panel 10 and the second scintillator panel 20). In the bonding step, adhesive layer 3 is separated for each of the first scintillator panel 10 and the second scintillator panel 20. In the bonding step, before bonding the first scintillator panel 10 and the second scintillator panel 20 to the light-receiving surface 2a, adhesive layer 3 is disposed on each of the first scintillator panel 10 and the second scintillator panel 20.

[0074] During the bonding step, since the first substrate 11 and the second substrate 21 are both flexible, the first scintillator panel 10 and the second scintillator panel 20 can be gradually bonded to the light-receiving surface 2a from one side while each of them is flexed. At this time, the corner of the second scintillator panel 20 formed by the surface 20a and the side surface 20b can reliably contact the corner of the first scintillator panel 10 formed by the surface 10a and the side surface 10b.

[0075] Next, as Figure 1 As shown, a moisture-proof layer 5 covers the first scintillator panel 10 and the second scintillator panel 20 on the sensor panel 2. That is, the moisture-proof layer 5 is disposed on the first scintillator panel 10 and the second scintillator panel 20 on opposite sides of the sensor panel 2 (the step of disposing the moisture-proof layer 5). In the step of disposing the moisture-proof layer 5, the moisture-proof layer 5 is continuously disposed across the first scintillator panel 10 and the second scintillator panel 20. Next, the outer edge 5a of the moisture-proof layer 5 is sealed on the surface 2b of the sensor panel 2 using the encapsulation member 7, thus obtaining the radiation detector 1. In this embodiment, the steps of disposing the first scintillator panel 10 and the second scintillator panel 20 are performed before the step of disposing the moisture-proof layer 5.

[0076] Based on the above-described method for manufacturing radiation detector 1, the radiation detector 1 can be easily and reliably obtained.

[0077] Using the manufacturing method of the radiation detector 1, in the bonding step, before bonding the first scintillator panel 10 and the second scintillator panel 20 to the light-receiving surface 2a, adhesive layers 3 are respectively disposed on the first scintillator panel 10 and the second scintillator panel 20. Therefore, the first scintillator panel 10 and the adhesive layer 3 can be processed in a state where they are integrated. Similarly, the second scintillator panel 20 and the adhesive layer 3 can be processed in a state where they are integrated.

[0078] In the manufacturing method of the radiation detector 1, the steps of configuring the first scintillator panel 10 and the second scintillator panel 20 are performed before the step of configuring the moisture-proof layer 5. Therefore, when the moisture-proof layer 5 is configured on the first scintillator panel 10 and the second scintillator panel 20 on the opposite side of the sensor panel 2, these components can be processed in a state where the sensor panel 2 and the first scintillator panel 10 and the second scintillator panel 20 are integrated.

[0079] [Variation Example]

[0080] This invention is not limited to the embodiments described. In the radiation detector 1, it can also be as follows... Figure 5 As shown in (a), the first angle θ1 and the second angle θ2 are both 90 degrees. Alternatively, in radiation detector 1, it can also be as follows: Figure 5 As shown in (b), the first angle θ1 and the second angle θ2 both exceed 90 degrees. In this case, a granular phosphor 4 can be disposed between the side surface 10b of the first scintillator panel 10 and the side surface 20b of the second scintillator panel 20. Thus, the fact that the first angle θ1 and the second angle θ2 can both be 90 degrees or more is also the same in the manufacturing method of the scintillator panel assembly 100 and the radiation detector 1.

[0081] like Figure 6 As shown, the scintillator panel assembly 100 may also include: a moisture-proof layer 5 as a support layer; and a first scintillator panel 10 and a second scintillator panel 20 disposed adjacent to each other on the moisture-proof layer 5. Figure 6 The structure of the scintillator panel assembly 100 shown is as follows. Specifically, the moisture-proof layer 5 is continuously disposed across the first scintillator panel 10 and the second scintillator panel 20. The first scintillator panel 10 is disposed on the moisture-proof layer 5 with the first substrate 11 located on the moisture-proof layer 5 side of the first scintillator layer 12. The second scintillator panel 20 is disposed on the moisture-proof layer 5 with the second substrate 21 located on the moisture-proof layer 5 side of the second scintillator layer 22.

[0082] exist Figure 6The scintillator panel assembly 100 shown has a moisture-proof layer 5 covering a first scintillator panel 10 and a second scintillator panel 20. An adhesive layer 6 is disposed between the first scintillator panel 10 and the moisture-proof layer 5, and between the second scintillator panel 20 and the moisture-proof layer 5. Furthermore, an adhesive layer 3 is disposed between the first scintillator panel 10 and the release tab 8, and between the second scintillator panel 20 and the release tab 8. An adhesive layer 6 is disposed between the outer edge 5a of the moisture-proof layer 5 and the release tab 8. Adhesive layers 3 and 6 are both adhesive layers. The adhesive force of adhesive layer 3 on the surface 8a of the release tab 8 is less than the adhesive force of adhesive layer 3 on the first scintillator panel 10 and the second scintillator panel 20. The adhesive force of adhesive layer 6 on the surface 8a of the release tab 8 is less than the adhesive force of adhesive layer 6 on the outer edge 5a of the moisture-proof layer 5. Figure 6 The scintillator panel assembly 100 shown can be used to process these components while integrating the first scintillator panel 10, the second scintillator panel 20, and the moisture-proof layer 5. Furthermore, Figure 6 The scintillator panel assembly 100 shown may also exclude the portion of adhesive layer 3 and adhesive layer 6 disposed on the outer edge 5a and the release tab 8.

[0083] like Figure 7 As shown, in the radiation detector 1, the outer edge of the moisture-proof layer 5 can be located on the first scintillator panel 10 and the second scintillator panel 20, and the encapsulation component 7 can seal the outer side of the first scintillator panel 10 and the second scintillator panel 20 and the outer side of the moisture-proof layer 5 on the surface 2b of the sensor panel 2.

[0084] It is also possible to Figure 8 As shown, in the radiation detector 1, a first moisture-proof layer 5A is disposed on the first scintillator panel 10 on the opposite side of the sensor panel 2, and a second moisture-proof layer 5B is disposed on the second scintillator panel 20 on the opposite side of the sensor panel 2. Alternatively, a first protective layer 13 may cover the first scintillator panel 10 and the first moisture-proof layer 5A, and a second protective layer 23 may cover the second scintillator panel 20 and the second moisture-proof layer 5B. The structures of the first moisture-proof layer 5A and the second moisture-proof layer 5B are the same as those of the moisture-proof layer 5 described above. Figure 8 The radiation detector 1 shown has an encapsulation component 7 that seals the outer sides of the first scintillator panel 10 and the second scintillator panel 20, as well as the outer sides of the first moisture-proof layer 5A and the second moisture-proof layer 5B, on the surface 2b of the sensor panel 2. According to... Figure 8 The radiation detector 1 shown is capable of protecting multiple columnar crystals that are deliquescent.

[0085] It is also possible to Figure 9 As shown, in the scintillator panel assembly 100, the outer edge of the moisture-proof layer 5 is located on the first scintillator panel 10 and the second scintillator panel 20. Figure 9In the scintillator panel assembly 100 shown, the adhesive layer 3 and the release tab 8 are separated from each of the first scintillator panel 10 and the second scintillator panel 20. Furthermore, Figure 9 The scintillator panel assembly 100 shown may also exclude the adhesive layer 3 and the release tab 8.

[0086] In the radiation detector 1 and scintillator panel assembly 100, the first substrate 11 and the second substrate 21 may each be non-flexible. In this case, the materials of the first substrate 11 and the second substrate 21 may be, for example, CFRP (carbon fiber reinforced plastic), aC (amorphous carbon), Al, Cu, or glass. When the materials of the first substrate 11 and the second substrate 21 are both metals, functional films (such as parylene films) may be formed on the surface and back side of the first substrate 11 and the second substrate 21, for example, as corrosion-resistant coatings. These functional films may also be laminated films comprising multiple films with different functions. As an example, when the materials of the first substrate 11 and the second substrate 21 are both Al, acid-resistant aluminum (anodic aluminum oxide) films and parylene films may be formed on the surface and back side of the first substrate 11 and the second substrate 21. In the radiation detector 1 and scintillator panel assembly 100, the first substrate 11 and the second substrate 21 may each be laminated substrates comprising multiple substrates (e.g., CFRP substrates and PET substrates).

[0087] In the radiation detector 1 and scintillator panel assembly 100, the first scintillator layer 12 may at least reach a first portion 11b of the outer edge 11a of the first substrate 11. Similarly, the second scintillator layer 22 may at least reach a second portion 21b of the outer edge 11a of the second substrate 21. In the radiation detector 1 and scintillator panel assembly 100, the first substrate 11 and the first scintillator layer 12 are not limited to being obtained by cutting or slicing; the first scintillator layer 12 may also reach the side of the first substrate 11. Similarly, the second substrate 21 and the second scintillator layer 22 are not limited to being obtained by cutting or slicing; the second scintillator layer 22 may also reach the side of the second substrate 21.

[0088] In the radiation detector 1, the sensor panel 2 may not be flexible. In this case, the material of the substrate on which the sensor panel 2 is provided with multiple photoelectric conversion elements may be, for example, a-Si (amorphous silicon), Si (silicon), or glass (e.g., alkali-free glass). In the radiation detector 1, the outer edge 5a of the moisture-proof layer 5 may reach the surface 2b of the sensor panel 2 surrounding the light-receiving surface 2a, and the encapsulation member 7 may seal the outer edge 5a of the moisture-proof layer 5 on the surface 2b of the sensor panel 2 while the area defined by the sensor panel 2 and the moisture-proof layer 5 is depressurized. In this case, the moisture-proof layer 5 can be tightly attached to the first scintillator panel 10 and the second scintillator panel 20 without the use of the adhesive layer 3. In the radiation detector 1, the moisture-proof layer 5, formed in a cap shape, may cover the first scintillator panel 10 and the second scintillator panel 20 on the sensor panel 2, and the encapsulation member 7 may seal the outer edge 5a of the moisture-proof layer 5 on the surface 2b of the sensor panel 2.

[0089] The radiation detector 1 and scintillator panel assembly 100 may also exclude the moisture-proof layers 5, 5A, and 5B. The radiation detector 1 and scintillator panel assembly 100 may also exclude the first protective layer 13 and the second protective layer 23.

[0090] In the manufacturing method of the radiation detector 1, during the bonding step, the adhesive layer 3 can be disposed on the light-receiving surface 2a before the first scintillator panel 10 and the second scintillator panel 20 are respectively bonded to the light-receiving surface 2a. In this case, the first scintillator panel 10 and the second scintillator panel 20 can be processed separately. In the manufacturing method of the radiation detector 1, the step of disposing of the moisture-proof layer 5 can also be performed before the step of separately disposing of the first scintillator panel 10 and the second scintillator panel 20. In this case, when the first scintillator panel 10 and the second scintillator panel 20 are respectively disposed on the light-receiving surface 2a, these components can be processed in a state where the first scintillator panel 10, the second scintillator panel 20, and the moisture-proof layer 5 are integrated.

[0091] All embodiments and variations of the radiation detector 1, scintillator panel assembly 100, and manufacturing method of the radiation detector 1 described above can be configured as multiple scintillator panels arranged in one-dimensional or two-dimensional form, including a first scintillator panel 10 and a second scintillator panel 20. For example, when three scintillator panels are arranged in one-dimensional form, any two adjacent scintillator panels can be used as the first scintillator panel 10 and the second scintillator panel 20. Furthermore, when four scintillator panels are arranged in two-dimensional form, any two adjacent scintillator panels can be used as the first scintillator panel 10 and the second scintillator panel 20.

[0092] Explanation of reference numerals in the attached figures

[0093] 1: Radiation detector; 2: Sensor panel; 2a: Light-receiving surface; 3: Adhesive layer; 4: Granular phosphor; 5A: First moisture-proof layer; 5B: Second moisture-proof layer; 10: First scintillator panel; 11: First substrate; 11a: Outer edge; 11b: First part; 12: First scintillator layer; 13: First protective layer; 20: Second scintillator panel; 21: Second substrate; 21a: Outer edge; 21b: Second part; 22: Second scintillator layer; 23: Second protective layer.

Claims

1. A radiation detector, comprising: A sensor panel with a light-receiving surface; A first scintillator panel and a second scintillator panel are arranged adjacent to each other on the light-receiving surface; and An adhesive layer is disposed between the light-receiving surface and the first scintillator panel, and between the light-receiving surface and the second scintillator panel. The first scintillator panel has: a first substrate; and a first scintillator layer comprising a plurality of columnar crystals formed on the first substrate. The second scintillator panel has: a second substrate; and a second scintillator layer comprising a plurality of columnar crystals formed on the second substrate. The first scintillator panel is bonded to the light-receiving surface of the first substrate by the adhesive layer, with the first scintillator layer located on the light-receiving surface side of the first substrate. The second scintillator panel is bonded to the light-receiving surface of the second substrate by the adhesive layer, with the second scintillator layer located on the light-receiving surface side of the second substrate. Viewed from the side of the first scintillator layer, the outer edge of the first substrate includes a first portion extending along the second scintillator panel, and the first scintillator layer at least reaches the first portion. Viewed from the side of the second scintillator layer, the outer edge of the second substrate includes a second portion extending along the first scintillator panel, and the second scintillator layer at least reaches the second portion. On one of the sensor panels, at least one first scintillator panel serving as the first scintillator panel and one second scintillator panel serving as the second scintillator panel are configured via the adhesive layer. The adhesive layer is on the sensor panel, separated from each of the first scintillator panel and the second scintillator panel.

2. The radiation detector as claimed in claim 1, wherein, The first substrate and the second substrate are each flexible.

3. The radiation detector as described in claim 1 or 2, wherein, When viewed from the thickness direction of the first substrate, the first scintillator panel is a rectangular shape with a side length of 300 mm or more. When viewed from the thickness direction of the second substrate, the second scintillator panel is a rectangular shape with a side length of 300 mm or more.

4. The radiation detector according to any one of claims 1 to 3, wherein, The adhesive layer contains an adhesive or bonding agent.

5. The radiation detector according to any one of claims 1 to 4, wherein, The first scintillator panel also has a first protective layer covering the first substrate and the first scintillator layer. The second scintillator panel also has a second protective layer covering the second substrate and the second scintillator layer.

6. The radiation detector according to any one of claims 1 to 4, further comprising: A first moisture-proof layer is disposed on the first scintillator panel on the side opposite to the sensor panel; A second moisture-proof layer is disposed on the second scintillator panel on the side opposite to the sensor panel; A first protective layer covering the first scintillator panel and the first moisture-proof layer; and A second protective layer covering the second scintillator panel and the second moisture-proof layer.

7. The radiation detector according to any one of claims 1 to 6, further comprising: A granular phosphor disposed between the first scintillator panel and the second scintillator panel.

8. A method for manufacturing a radiation detector, used to manufacture the radiation detector according to any one of claims 1 to 7, the method comprising: The steps for preparing the sensor panel; The steps for preparing the first scintillator panel and the second scintillator panel; and The bonding step involves using the adhesive layer to bond each of the first scintillator panel and the second scintillator panel to the light-receiving surface. In the bonding step, the adhesive layer is separated at each of the first scintillator panel and the second scintillator panel.

9. The method for manufacturing a radiation detector as described in claim 8, wherein, In the bonding step, before bonding each of the first scintillator panel and the second scintillator panel to the light-receiving surface, the adhesive layer is disposed on each of the first scintillator panel and the second scintillator panel.

10. The method for manufacturing a radiation detector as described in claim 8, wherein, In the bonding step, the adhesive layer is disposed on the light-receiving surface before each of the first scintillator panel and the second scintillator panel is bonded to the light-receiving surface.

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