Holder, top ring, and substrate processing apparatus
By designing multiple retainer bodies and magnetically fixing them to the top ring retaining component, the problem of high retainer replacement frequency is solved, the long service life of the retainer is achieved, and the maintenance cost of the substrate processing device is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- EBARA CORP
- Filing Date
- 2021-10-22
- Publication Date
- 2026-06-19
Smart Images
Figure CN116745891B_ABST
Abstract
Description
Technical Field
[0001] This application relates to a retainer, a top ring, and a substrate processing apparatus. Priority is claimed based on Japanese Patent Application No. 2020-218340, filed December 28, 2020. The entire disclosure of the specification, claims, drawings, and abstract of Japanese Patent Application No. 2020-218340 is incorporated herein by reference. Background Technology
[0002] One type of substrate processing equipment used in semiconductor manufacturing processes is the CMP (Chemical Mechanical Polishing) apparatus. CMP apparatuses are broadly classified into "face-up type" (where the surface to be polished on the substrate faces upwards) and "face-down type" (where the surface to be polished on the substrate faces downwards) based on the direction in which the polished surface of the substrate is facing.
[0003] A face-down chemical mechanical polishing (CMP) apparatus includes: a top ring holding a substrate; and a polishing table to which an polishing pad is bonded. The apparatus is configured to polish the substrate by rotating the top ring and the polishing table and pressing the substrate against the polishing pad. However, during the polishing process, the substrate may detach from the top ring and fly out of its original position.
[0004] For example, Patent Document 1 discloses a polishing apparatus in which a retainer is arranged around the substrate to prevent the substrate from flying outward when the top ring rotates. This polishing apparatus prevents the substrate from flying out by arranging the retainer, and at the same time, presses the polishing pad with the retainer to make the polishing profile of the substrate good.
[0005] Existing technical documents
[0006] Patent documents
[0007] Patent document 1: Japanese Patent Application Publication No. 2020-163529
[0008] The technical problem that the invention aims to solve
[0009] However, the technology described in Patent Document 1 did not take into account reducing the replacement frequency of the retainer.
[0010] That is, while placing retainers around the substrate can prevent it from flying out of the top ring, the substrate may move within the top ring and collide with the retainers during the rotation of the top ring. In particular, retainers placed around polygonal substrates may experience severe wear at the point of impact when the corners of the polygonal substrate collide with the retainers, resulting in concerns about the need for frequent replacement of the retainers. Summary of the Invention
[0011] Therefore, one objective of this application is to reduce the replacement frequency of the retainer.
[0012] Technical means for solving technical problems
[0013] One embodiment discloses a retainer disposed in a top ring that holds and presses a polygonal substrate toward an abrasive pad, thereby surrounding a retaining region of the polygonal substrate, and the retainer is pressed toward the abrasive pad. The retainer comprises a plurality of retainer bodies disposed around the retaining region in a manner corresponding to and independent of each side of the polygonal substrate and along the sides. At least one of the plurality of retainer bodies includes: a first fixing surface capable of being fixed to a retainer retaining member of the top ring; a first opposing surface opposite to the retaining region in a first state in which the first fixing surface is fixed to the retainer retaining member; a second fixing surface capable of being fixed to the retainer retaining member in a second state after the retainer body has been rotated from the first state; and a second opposing surface opposite to the retaining region in a state in which the second fixing surface is fixed to the retainer retaining member. Attached Figure Description
[0014] Figure 1 This is a top view showing the overall structure of a substrate processing apparatus according to one embodiment.
[0015] Figure 2 This is a perspective view that schematically illustrates the structure of a grinding unit in one embodiment.
[0016] Figure 3 This is a schematic cross-sectional view of the top ring in one embodiment.
[0017] Figure 4A This is a cross-sectional view showing the first state in which the retainer body is fixed to the retainer retaining member.
[0018] Figure 4B This is a cross-sectional view showing the second state in which the retainer body is fixed to the retainer retaining member.
[0019] Figure 4C This is a cross-sectional view showing the third state in which the retainer body is fixed to the retainer retaining member.
[0020] Figure 4D This is a cross-sectional view showing the fourth state in which the retainer body is fixed to the retainer retaining member.
[0021] Figure 5A yes Figure 4A A bottom view of the retainer body and retainer retaining components.
[0022] Figure 5B yes Figure 5A A cross-sectional view of the retainer body and retainer retaining member at line BB.
[0023] Figure 6A This is a bottom view of the retainer body and retainer retaining member in one embodiment.
[0024] Figure 6B yes Figure 6A A cross-sectional view of the retainer body and retainer retaining member at line BB.
[0025] Figure 7A This is a cross-sectional view showing a modified example of the retainer body and the retainer retaining member.
[0026] Figure 7B This is a cross-sectional view showing a modified example of the retainer body and the retainer retaining member.
[0027] Figure 7C This is a cross-sectional view showing a modified example of the retainer body and the retainer retaining member. Detailed Implementation
[0028] Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described with reference to the accompanying drawings. In the drawings, the same or equivalent elements are labeled with the same or equivalent reference numerals, and repeated descriptions of the same or equivalent elements are omitted in the descriptions of various embodiments. Furthermore, the features shown in the various embodiments can be applied to other embodiments as long as they do not contradict each other.
[0029] Figure 1 This is a top view showing the overall structure of a substrate processing apparatus 1000 according to one embodiment. Figure 1 The substrate processing apparatus 1000 shown includes a loading unit 100, a conveying unit 200, a polishing unit 300, a drying unit 500, and an unloading unit 600. In the illustrated embodiment, the conveying unit 200 has two conveying units 200A and 200B, and the polishing unit 300 has two polishing units 300A and 300B. In one embodiment, these units can be formed independently. By forming these units independently, substrate processing apparatus 1000s with different structures can be easily formed in any combination of the number of units. Furthermore, the substrate processing apparatus 1000 includes a control device 900, through which each component of the substrate processing apparatus 1000 is controlled. In one embodiment, the control device 900 may be a general computer equipped with input / output devices, arithmetic devices, storage devices, etc.
[0030] <Loading Unit>
[0031] The loading unit 100 is a unit used to introduce a substrate WF (surface mount equipment) into the substrate processing apparatus 1000 before it undergoes processes such as grinding and cleaning. In one embodiment, the loading unit 100 is configured based on the mechanical device interface specification (IPCSMEMA-9851) of SMEMA (Surface Mount Equipment Manufacturers Association).
[0032] In the illustrated embodiment, the conveying mechanism of the loading unit 100 includes: a plurality of conveying rollers 202; and a plurality of roller shafts 204 on which the conveying rollers 202 are mounted. Figure 1 In the illustrated embodiment, three conveyor rollers 202 are mounted on each roller shaft 204. The substrate WF is disposed on the conveyor rollers 202 and conveyed by rotating the conveyor rollers 202. The mounting position of the conveyor rollers 202 on the roller shaft 204 is not limited, as long as it is a position that can stably convey the substrate WF. However, since the conveyor rollers 202 are in contact with the substrate WF, they should be configured so that the conveyor rollers 202 contact areas that are not problematic even when in contact with the substrate WF being processed. In one embodiment, the conveyor rollers 202 of the loading unit 100 may be made of a conductive polymer. In one embodiment, the conveyor rollers 202 are electrically grounded via the roller shaft 204, etc. This is to prevent damage to electronic components on the substrate WF due to electrification. Furthermore, in one embodiment, an electrostatic eliminator (not shown) may be provided in the loading unit 100 to prevent the substrate WF from becoming electrified.
[0033] <Conveying Unit>
[0034] Figure 1 The substrate processing apparatus 1000 shown includes two transport units 200A and 200B. Since the two transport units 200A and 200B can have the same structure, they will be described together as transport unit 200 below.
[0035] The illustrated conveying unit 200 includes multiple conveying rollers 202 for conveying substrate WF. By rotating the conveying rollers 202, the substrate WF on the conveying rollers 202 can be conveyed in a predetermined direction. The conveying rollers 202 of the conveying unit 200 can be formed of a conductive polymer or a non-conductive polymer. The conveying rollers 202 are driven by a motor (not shown). The substrate WF is conveyed to the substrate transfer position via the conveying rollers 202.
[0036] In one embodiment, the conveying unit 200 has a cleaning nozzle 284. The cleaning nozzle 284 is connected to a cleaning fluid supply source (not shown). The cleaning nozzle 284 is configured to supply cleaning fluid to the substrate WF conveyed by the conveying roller 202.
[0037] <Drying Unit>
[0038] The drying unit 500 is a device for drying the substrate WF. Figure 1 In the substrate processing apparatus 1000 shown, the drying unit 500 dries the substrate WF that has been polished by the polishing unit 300 and cleaned by the cleaning unit of the transport unit 200. Figure 1 As shown, the drying unit 500 is located downstream of the conveying unit 200.
[0039] The drying unit 500 has a nozzle 530 for spraying gas toward the substrate WF being conveyed on the conveyor roller 202. The gas can be, for example, compressed air or nitrogen. The substrate WF can be dried by blowing away water droplets on the conveyed substrate WF by the drying unit 500.
[0040] <Unloading Unit>
[0041] The unloading unit 600 is used to remove the substrate WF, which has undergone grinding and cleaning processes, from the substrate processing apparatus 1000. Figure 1 In the substrate processing apparatus 1000 shown, the unloading unit 600 receives the substrate dried by the drying unit 500. For example... Figure 1 As shown, the unloading unit 600 is disposed downstream of the drying unit 500. In one embodiment, the unloading unit 600 is configured based on the SMEMA (Surface Mount Equipment Manufacturers Association) mechanical device interface specification (IPC-SMEMA-9851).
[0042] <Grinding Unit>
[0043] Figure 2 This is a perspective view that schematically illustrates the structure of a grinding unit 300 according to one embodiment. Figure 1 The substrate processing apparatus 1000 shown includes two polishing units 300A and 300B. Since the two polishing units 300A and 300B can have the same structure, they will be described together as polishing unit 300 below.
[0044] like Figure 2As shown, the polishing unit 300 includes: a polishing table 350; and a top ring 302 that holds the substrate, which is the object to be polished, and presses it against the polishing surface on the polishing table 350. The polishing table 350 is connected to a polishing table rotary motor (not shown) disposed below it via a table shaft 351, and is rotatable around the table shaft 351. A polishing pad 352 is adhered to the upper surface of the polishing table 350, and the surface 352a of the polishing pad 352 constitutes the polishing surface of the substrate. In one embodiment, the polishing pad 352 may also be adhered via a layer for easy peeling from the polishing table 350. Such a layer may include, for example, a silicone layer, a fluoropolymer resin layer, or a layer such as that described in Japanese Patent Application Publication No. 2014-176950.
[0045] A polishing slurry supply nozzle 354 is provided above the polishing table 350, through which polishing slurry can be supplied to the polishing pad 352 on the polishing table 350. Furthermore, as... Figure 2 As shown, a passage 353 for supplying polishing fluid is provided in the polishing table 350 and the table shaft 351. The passage 353 communicates with an opening 355 on the surface of the polishing table 350. At a position corresponding to the opening 355 of the polishing table 350, a through hole 357 is formed in the polishing pad 352. Polishing fluid passing through the passage 353 is supplied from the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 to the surface of the polishing pad 352. Furthermore, there may be one or more openings 355 of the polishing table 350 and through holes 357 of the polishing pad 352. The positions of the opening 355 of the polishing table 350 and the through holes 357 of the polishing pad 352 are not limited, but in one embodiment they are located near the center of the polishing table 350.
[0046] In one embodiment, the grinding unit 300 includes an atomizer 358 for spraying a liquid, or a mixture of liquid and gas, toward the grinding pad 352, but Figure 2 Not shown in the image (see reference) Figure 1 The liquid ejected from atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen.
[0047] The top ring 302 is connected to the top ring shaft 18, which is movable up and down relative to the swing arm 360 via a vertical movement mechanism 319. This vertical movement of the top ring shaft 18 allows the entire top ring 302 to be positioned relative to the swing arm 360. The top ring shaft 18 is rotated by a top ring rotary motor (not shown). This rotation of the top ring shaft 18 causes the top ring 302 to rotate around it. A rotary joint 323 is mounted on the upper end of the top ring shaft 18.
[0048] The top ring 302 is capable of holding the quadrilateral substrate with the polished surface facing downwards on its lower surface. In this embodiment, the top ring that holds the substrate with the polished surface facing downwards will be described, but it is not limited to this. The swing arm 360 is configured to rotate about the support shaft 362. The top ring 302 can move between the substrate junction position of the transport unit 200 and the top of the polishing table 350 by rotating the swing arm 360. By lowering the top ring shaft 18, the top ring 302 can be lowered to press the substrate against the surface (polishing surface) 352a of the polishing pad 352. At this time, the top ring 302 and the polishing table 350 are rotated respectively, and polishing liquid is supplied to the polishing pad 352 from the polishing liquid supply nozzle 354 provided above the polishing table 350 and / or from the opening 355 provided in the polishing table 350. In this way, the substrate WF can be pressed against the surface 352a of the polishing pad 352 to polish the surface of the substrate. In substrate WF polishing, the swing arm 360 can also be fixed or swung so that the top ring 302 passes through the center of the polishing pad 352 (covering the through hole 357 of the polishing pad 352).
[0049] The up-and-down motion mechanism 319 that causes the top ring shaft 18 and the top ring 302 to move up and down includes: a bridge 28 that rotatably supports the top ring shaft 18 via a bearing 321; a ball screw 32 mounted on the bridge 28; a support platform 29 supported by a support column 130; and a servo motor 38 mounted on the support platform 29. The support platform 29 supporting the servo motor 38 is fixed to the swing arm 360 via the support column 130.
[0050] The ball screw 32 includes a threaded shaft 32a connected to the servo motor 38, and a nut 32b for threading the threaded shaft 32a. The top ring shaft 18 and the bridge 28 are integrated and are movable up and down. Therefore, when the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, thereby causing the top ring shaft 18 and the top ring 302 to move up and down. The grinding unit 300 includes a distance sensor 70 as a position detection unit, which detects the distance below the bridge 28, i.e., the position of the bridge 28. By detecting the position of the bridge 28 by the distance sensor 70, the position of the top ring 302 can be detected. The distance sensor 70, together with the ball screw 32 and the servo motor 38, constitutes the up and down movement mechanism 319. In addition, the distance sensor 70 can be a laser sensor, an ultrasonic sensor, an eddy current sensor, or a linear scale sensor. Furthermore, each device in the grinding unit, including the ranging sensor 70 and the servo motor 38, is configured to be controlled by the control device 900.
[0051] One embodiment of the grinding unit 300 includes a dressing unit 356 for dressing the grinding surface 352a of the grinding pad 352. For example... Figure 2As shown, the dressing unit 356 includes: a dresser 50 that slides in contact with the grinding surface 352a; a dresser shaft 51 for connecting the dresser 50; an air cylinder 53 for driving the dresser shaft 51 to rise and fall; and a swing arm 55 that supports the dresser shaft 51 for rotational movement. A dressing member 50a is held at the lower part of the dresser 50, and needle-shaped diamond particles are electrodeposited on the lower surface of the dressing member 50a. The air cylinder 53 is disposed on a support platform 57 supported by supports 56, which are fixed to the swing arm 55.
[0052] The swing arm 55 is configured to rotate about a pivot 58, driven by a motor (not shown). The dresser shaft 51 is positioned opposite the grinding pad 352. Figure 2 In this process, the dresser shaft 51 is rotated by a motor (not shown), and the dresser 50 rotates around the dresser shaft 51 as a result of the rotation of the dresser shaft 51. The air cylinder 53 moves the dresser 50 up and down via the dresser shaft 51 and presses the dresser 50 against the grinding surface 352a of the grinding pad 352 with a specified pressing force.
[0053] The dressing of the grinding surface 352a of the grinding pad 352 is performed as follows. The dresser 50 is pressed against the grinding surface 352a by the air cylinder 53, while pure water is supplied to the grinding surface 352a by a pure water supply nozzle (not shown). In this state, the dresser 50 rotates about the dresser shaft 51, causing the lower surface (diamond particles) of the dressing member 50a to slide into contact with the grinding surface 352a. Thus, the grinding pad 352 is removed by the dresser 50, thereby dressing the grinding surface 352a.
[0054] Next, the top ring 302 in the grinding unit 300 of one embodiment will be described. Figure 3 This is a schematic cross-sectional view of the top ring 302 in one embodiment. Figure 3 The main components constituting the top ring 302 are only schematically illustrated. In addition, in this embodiment, an example is shown in which the top ring 302 holds a quadrilateral substrate on its lower surface, but it is not limited to this and can also hold a polygonal substrate.
[0055] like Figure 3As shown, the top ring 302 includes: a flange 17 mounted on the top ring shaft 18; and a retainer retaining member 37 mounted on the lower surface of the outer periphery of the flange 17. Furthermore, the top ring 302 also includes: a body 2 that presses the substrate WF against the polishing surface 352a; and a retainer 30 disposed around the substrate WF (the holding area of the substrate WF) held in the top ring 302. The body 2 is composed of a generally quadrilateral flat plate-shaped member, and the retainer 30 is disposed on the outer side of the body 2. In one embodiment, the retainer 30 is configured to be pressed towards the polishing pad 352 (polishing surface 352a). Furthermore, the retainer 30 includes a plurality (four in this embodiment) of retainer bodies 3 disposed around the holding area of the substrate WF in a manner corresponding to the four sides of the substrate WF, independently of each other and along the sides. The retainer bodies 3 are elongated rod-shaped members. The retainer bodies 3 are each fixed to the retainer retaining member 37.
[0056] The main body 2 is formed from a metal such as stainless steel (SUS) or a resin such as an engineering plastic (e.g., PEEK). An elastic membrane (diaphragm) 4, in contact with the back of the substrate, is mounted on the lower surface of the main body 2. In one embodiment, the elastic membrane (diaphragm) 4 is formed from a rubber material with excellent strength and durability, such as ethylene propylene diene monomer (EPDM), polyurethane rubber, or silicone rubber. In another embodiment, the elastic membrane (diaphragm) 4 can be formed from a rubber material using a metal mold. Alternatively, the main body 2 can also be constructed by combining multiple components.
[0057] like Figure 3 As shown, the elastic membrane (diaphragm) 4 has multiple concentric partition walls 4a, through which a circular central chamber 5, a square annular corrugated chamber 6 surrounding the central chamber 5, a square annular intermediate chamber 7 surrounding the corrugated chamber 6, a square annular outer chamber 8 surrounding the intermediate chamber 7, and a square annular edge chamber 9 surrounding the outer chamber 8 are formed between the upper surface of the elastic membrane 4 and the lower surface of the main body 2. That is, the central chamber 5 is formed at the center of the main body 2, and the corrugated chamber 6, intermediate chamber 7, outer chamber 8, and edge chamber 9 are formed concentrically from the center outwards. Figure 3 As shown, within the main body 2, flow paths 11 communicating with the central chamber 5, 12 communicating with the corrugated chamber 6, 13 communicating with the intermediate chamber 7, 14 communicating with the outer chamber 8, and 15 communicating with the edge chamber 9 are respectively formed. Furthermore, the flow paths 11 communicating with the central chamber 5, 12 communicating with the corrugated chamber 6, 13 communicating with the intermediate chamber 7, 14 communicating with the outer chamber 8, and 15 communicating with the edge chamber 9 are connected to a fluid supply source and a vacuum source via rotary joints (not shown).
[0058] In such Figure 3In the top ring 302 configured as shown, the fluid pressure supplied to the central chamber 5, corrugated chamber 6, intermediate chamber 7, outer chamber 8, and edge chamber 9 can be adjusted independently. This structure allows for adjustment of the pressing force on the substrate WF against the polishing pad 352 for each region. Furthermore, the elastic membrane 4 has multiple vacuum adsorption holes, enabling the substrate WF to be vacuum-adsorbed onto the top ring 302 using a vacuum source.
[0059] Next, the retainer body 3 and the retainer retaining member 37 will be described in detail. Furthermore, the retainer 30 of this embodiment includes four retainer bodies 3, but since they all have the same structure, only one retainer body 3 will be described. However, the four retainer bodies 3 may not have the same structure, or at least one of the four retainer bodies 3 may have the structure described below.
[0060] Figure 4A This is a cross-sectional view showing the first state in which the retainer body is fixed to the retainer retaining member. Figure 5A yes Figure 4A A bottom view of the retainer body and retainer retaining components. Figure 5B yes Figure 5A The retainer body and retainer retaining member are shown in a cross-sectional view along line BB. In this embodiment, the retainer body 3 has the shape of a regular square prism, such as... Figure 4A As shown, the cross-sectional shape of the main body 3 of the retainer, which is orthogonal to the extension direction, is a regular quadrilateral.
[0061] like Figure 4A As shown, the retainer body 3 has a first surface (first fixing surface) 3a that can be fixed to the retainer retaining member 37. Furthermore, the retainer body 3 has a second surface (first opposing surface) 3b that faces the retaining region 39 of the substrate WF in a first state where the first surface 3a is fixed to the retainer retaining member 37. The second surface 3b has an opposing portion 3b-1 facing the retaining region 39. The retainer body 3 has a first magnetic member 34-1 embedded in the first surface 3a for fixing the first surface 3a to the retainer retaining member 37. On the other hand, the retainer retaining member 37 includes a magnet 36 disposed on the opposing surface facing the retainer body 3. The first surface 3a is fixed to the retainer retaining member 37 by mutual attraction between the first magnetic member 34-1 and the magnet 36.
[0062] A rectangular recess for embedding the retainer body 3 is formed on the bottom surface of the retainer retaining member 37, and sidewalls 37a, 37b, 37c, and 37d are formed around the recess. The sidewall 37a of the retainer retaining member 37 has a first abutting surface 37a-1 that abuts against the fourth surface 3d of the retainer body 3. This prevents the retainer body 3 from displacing in the direction away from the retaining region 39. Furthermore, the sidewall 37b of the retainer retaining member 37 has a second abutting surface 37b-1 that abuts against the second surface 3b of the retainer body 3. This prevents the retainer body 3 from displacing in the direction approaching the retaining region 39. Moreover, the sidewalls 37c and 37d of the retainer retaining member 37 have third abutting surfaces 37c-1 and fourth abutting surfaces 37d-1 that abut against the bottom surfaces of the retainer body 3. This prevents the retainer body 3 from displacing in the extending direction.
[0063] When grinding the substrate WF in the first state where the holder body 3 is fixed to the holder holding member 37, the substrate WF moves within the top ring 302 as the top ring 302 rotates. Consequently, the sides and corners of the quadrilateral substrate WF collide with the opposing portion 3b-1 of the lower part of the second surface 3b of the holder body 3, causing wear on the opposing portion 3b-1 of the lower part of the second surface 3b. Figure 4A This indicates a state where the area is recessed approximately parallel to the retaining area 39 due to wear. However, in the retainer 30 of this embodiment, if the opposing portion 3b-1 exceeds the wear limit, it can continue to be used by rotating the retainer body 3 (changing its direction), thus reducing the frequency of replacement of the retainer 30. This will be explained below.
[0064] Figure 4B This is a cross-sectional view showing the second state in which the retainer body 3 is fixed to the retainer retaining member. The second state is characterized by the retainer body 3 being rotated 180 degrees about an imaginary axis of rotation along the extending direction of the retainer body 3. (Example...) Figure 4B As shown, the retainer body 3 includes: a third surface (second fixing surface) 3c, which is different from the first surface (first fixing surface) 3a and can be fixed to the retainer retaining member 37 in a second state; and a fourth surface (second opposing surface) 3d, which is different from the second surface 3b and is opposite to the retaining region 39 when the third surface 3c is fixed to the retainer retaining member 37. The fourth surface 3d has an opposing portion 3d-1 opposite to the retaining region 39. Furthermore, the retainer body 3 has a third magnetic member 34-3 embedded in the third surface 3c for fixing the third surface 3c to the retainer retaining member 37. The third surface 3c is fixed to the retainer retaining member 37 by mutual attraction between the third magnetic member 34-3 and the magnet 36.
[0065] When grinding the substrate WF in the second state where the holder body 3 is fixed to the holder holding member 37, the substrate WF moves within the top ring 302 as the top ring 302 rotates. However, the substrate WF collides with the unworn fourth surface 3d, not the worn second surface 3b. Therefore, the holder body 3 can continue to be used even after the second surface 3b is worn.
[0066] Furthermore, in the above embodiment, an example is shown where the holder body 3 is rotated 180 degrees about an imaginary rotation axis along the extending direction of the holder body 3. However, this is not a limitation; the holder body 3 can be rotated 90 degrees or 270 degrees about the imaginary rotation axis. That is, the holder body 3 has a second magnetic member 34-2 embedded in its second surface 3b and a fourth magnetic member 34-4 embedded in its fourth surface 3d. Therefore, the holder body 3 can be fixed to the holder retaining member 37 in both states where the holder body 3 is rotated 90 degrees and 270 degrees from the first state, respectively. In addition, since the surface opposite to the retaining region 39 (the surface worn by the substrate WF collision) is different in each state, it can continue to be used without replacing the holder body 3.
[0067] Alternatively, the retainer body 3 can be rotated to change the orientation of its extension direction, instead of rotating the retainer body 3 about an imaginary axis along its extension direction as described above. Furthermore, these two rotations can be combined to change the orientation of the retainer body 3.
[0068] Figure 4C This is a cross-sectional view showing the third state in which the retainer body is fixed to the retainer retaining member. The third state is a state in which the retainer body 3 is rotated in a manner that changes the orientation of the retainer body 3's extension direction in the horizontal plane, starting from the first state, and is thus fixed to the retainer retaining member 37. (As shown...) Figure 4C As shown, the retainer body 3 includes: a first surface 3a that can be fixed to the retainer retaining member 37; and a fourth surface (opposing surface) 3d that is opposite to the retaining region 39 and is different from the second surface 3b, when the first surface 3a is fixed to the retainer retaining member 37. Thus, when the orientation of the extending direction of the retainer body 3 is changed in the horizontal plane, although the surface fixed to the retainer retaining member 37 remains the same as in the first state, the surface opposite to the retaining region 39 is different from the first state. Therefore, the retainer body 3 can continue to be used.
[0069] Even when the retainer body 3 is rotated 90 degrees, 180 degrees, and 270 degrees respectively from the third state around an imaginary axis of rotation along the extending direction of the retainer body 3, the retainer body 3 can still be fixed to the retainer retaining member 37, and because the opposing parts opposite to the retaining region 39 are different, it can continue to be used. That is, in Figure 4BIn the example, the second opposing surface (fourth surface 3d) of the retainer body 3 in the second state is different from the first opposing surface (second surface 3b) of the retainer body 3 in the first state. On the other hand, the second opposing surface of the retainer body 3 in the second state may be the same as the first opposing surface. In this case, the second opposing surface becomes a surface with a different opposing portion from the opposing portion opposite to the retaining region 39 in the first state. An example where the second opposing surface is the same as the first opposing surface is explained below as the fourth state.
[0070] Figure 4D This is a cross-sectional view showing the fourth state in which the retainer body is fixed to the retainer retaining member. The fourth state is one in which the retainer body 3 is rotated to change the orientation of its extension direction in the vertical plane, as described in the first state, and thus fixed to the retainer retaining member 37. Figure 4D As shown, the retainer body 3 includes: a third surface 3c that can be fixed to the retainer retaining member 37; and a second surface 3b that faces the retaining region 39 when the third surface 3c is fixed to the retainer retaining member 37. In both the first and fourth states, the second surface 3b faces the retaining region 39. However, the worn-out opposing portion 3b-1 in the first state does not face the retaining region 39 in the fourth state. Furthermore, the opposing portion 3b-2 of the second surface 3b that faces the retaining region 39 is different from the opposing portion 3b-1 in the first state. Since the opposing portion 3b-2 is not worn, the retainer body 3 can continue to be used.
[0071] Based on the above description, the retainer body 3 of this embodiment can be used a total of eight times by rotating the retainer body 3. Therefore, according to this embodiment, the replacement frequency of the retainer 30 can be reduced.
[0072] Furthermore, the retainer body 3 of this embodiment can be stably fixed to the retainer retaining member 37 regardless of the type of polishing slurry. That is, to fix the retainer body 3 to the retainer retaining member 37, for example, it is possible to provide a threaded hole in the retainer body 3 and fix it to the retainer retaining member 37 with bolts. However, since the retainer body 3 of this embodiment can be rotated multiple times, it becomes necessary to provide threaded holes on the first surface 3a to the fourth surface 3d respectively. Thus, for example, when the first surface 3a is fixed to the retainer retaining member 37, the third surface 3c faces the polishing pad 352 and comes into contact with the polishing slurry during polishing. As a result, there is a concern that the polishing slurry may solidify in the threaded hole of the third surface 3c, making it impossible to fix the third surface 3c to the retainer retaining member 37.
[0073] In contrast, the retainer body 3 of this embodiment is fixed to the retainer retaining member 37 by the magnetic force between the magnetic member embedded in the retainer body 3 and the magnet 36 provided on the retainer retaining member 37. Therefore, the retainer body 3 can be stably fixed to the retainer retaining member 37 regardless of the type of polishing slurry. Alternatively, an electromagnet can be used instead of the magnet 36. In this case, when the retainer body 3 is installed on the retainer retaining member 37, the electromagnet is energized to fix the retainer body 3 to the retainer retaining member 37; on the other hand, when the orientation of the retainer body 3 is changed, the retainer body 3 can be easily removed from the retainer retaining member 37 by cutting off the energization to the electromagnet. Furthermore, the means for fixing the retainer body 3 to the retainer retaining member 37 are not limited to using magnetic force. For example, if there are no concerns about the solidification of the polishing slurry, the retainer body 3 can be fixed to the retainer retaining member 37 by bolts or other means.
[0074] Next, other embodiments of the retainer body 3 and the retainer retaining member 37 will be described. Figure 6A This is a bottom view of the retainer body and retainer retaining member in one embodiment. Figure 6B yes Figure 6A A cross-sectional view of the retainer body and retainer retaining member at line BB.
[0075] The retainer body 3 and retainer retaining member 37 of this embodiment have the same structure as the embodiments described in FIG4 and FIG5, except that a boss hole is formed in the retainer body 3 and a boss is provided in the retainer retaining member 37. Therefore, repeated descriptions are omitted.
[0076] like Figure 6A , Figure 6B As shown, a plurality of protruding holes 3e are formed along the extending direction on the third surface 3c of the holder body 3. Furthermore, as... Figure 6B As shown, a plurality of protruding holes 3f are formed along the extending direction on the first surface 3a of the retainer body 3. Protruding holes are also similarly formed on the second surface 3b and the fourth surface 3d of the retainer body 3. On the other hand, as... Figure 6B As shown, a plurality of protrusions 37e are provided on the surface of the retainer retaining member 37 opposite to the retainer body 3. The plurality of protrusions 37e are provided at positions corresponding to the protrusion holes of the retainer body 3.
[0077] According to this embodiment, since the retainer body 3 can be mounted to the retainer retaining member 37 by inserting the protrusion 37e into the protrusion hole 3f of the retainer body 3, the retainer body 3 can be easily positioned. Furthermore, by inserting the protrusion 37e into the protrusion hole 3f, displacement of the retainer body 3 can be suppressed during grinding. Additionally, as... Figure 6B As shown, multiple protruding holes 3f are formed at a position that is rotationally symmetrical with respect to the center of the extending direction of the retainer body 3. Therefore, even if the retainer body 3 is rotated 180° to change the orientation of its extending direction, the protrusion 37e can still be inserted into the protruding hole 3f, thereby fixing the retainer body 3 in the same position as before the rotation. Similarly, the multiple protruding holes 3e, and the multiple protruding holes formed on the second surface 3b and the fourth surface 3d of the retainer body 3, are also formed at a position that is rotationally symmetrical with respect to the center of the extending direction of the retainer body 3.
[0078] In the above embodiments, a retainer body 3 with a regular square prism shape is used as an example for explanation, but the shape of the retainer body 3 is not limited to this. Figure 7A , Figure 7B , Figure 7C This is a cross-sectional view showing a modified example of the retainer body and the retainer retaining member.
[0079] like Figure 7A As shown, the holder body 3 can also have the shape of a regular triangular prism. In this case, magnetic members 34 are embedded in the three sides of the holder body 3. On the other hand, a recess corresponding to the shape of the holder body 3 is formed on the bottom surface of the holder member 37. Magnets 36-1 and 36-2 are provided on the opposite surfaces of the holder member 37 to the holder body 3. The holder member 37 has a first abutting surface 37a-1 that abuts against the holder body 3 to prevent the holder body 3 from displacing in the direction away from the holding region 39 of the substrate; and a second abutting surface 37b-1 that abuts against the holder body 3 to prevent the holder body 3 from displacing in the direction approaching the holding region 39 of the substrate.
[0080] like Figure 7B As shown, the holder body 3 can also have the shape of a regular pentagonal prism. In this case, magnetic members 34 are embedded in each of the five sides of the holder body 3. On the other hand, a recess corresponding to the shape of the holder body 3 is formed on the bottom surface of the holder member 37. Magnets 36-1 and 36-2 are provided on the opposite surfaces of the holder member 37 to the holder body 3. The holder member 37 has a first abutting surface 37a-1 that abuts against the holder body 3 to prevent the holder body 3 from displacing in the direction away from the holding area 39 of the substrate; and a second abutting surface 37b-1 that abuts against the holder body 3 to prevent the holder body 3 from displacing in the direction approaching the holding area 39 of the substrate.
[0081] like Figure 7CAs shown, the holder body 3 can also have the shape of a regular hexagonal prism. In this case, magnetic members 34 are embedded in the six sides of the holder body 3. On the other hand, a recess corresponding to the shape of the holder body 3 is formed on the bottom surface of the holder member 37. Magnets 36-1, 36-2, and 36-3 are provided on the opposite surfaces of the holder member 37 to the holder body 3. The holder member 37 has a first abutting surface 37a-1 that abuts against the holder body 3 to prevent the holder body 3 from displacing in the direction away from the holding area 39 of the substrate; and a second abutting surface 37b-1 that abuts against the holder body 3 to prevent the holder body 3 from displacing in the direction approaching the holding area 39 of the substrate. Alternatively, it is also possible to... Figure 7A , Figure 7B , Figure 7C The retainer body 3 of the modified example shown is formed Figure 6A , Figure 6B The protruding hole shown, and Figure 7A , Figure 7B , Figure 7C The retainer retaining member 37 of the modified example shown is formed Figure 6A , Figure 6B The protrusion shown. Furthermore, not limited to the above-described variations, the retainer body 3 may have a regular polygonal prism shape. Moreover, the retainer body 3 is not limited to a regular polygonal prism shape. The retainer body 3 may also be various shapes, such as a columnar shape with an L-shaped cross-section.
[0082] The foregoing has described several embodiments of the present invention. However, the embodiments disclosed above are for ease of understanding of the present invention and are not intended to limit the present invention. The present invention can be modified and improved without departing from its main interest, and the present invention naturally includes its equivalents. Furthermore, within the scope of solving at least a portion of the above-mentioned technical problems, or within the scope of achieving at least a portion of the effects, the scope of the patent claims and the constituent elements described in the specification can be arbitrarily combined or omitted.
[0083] This application discloses, as one embodiment, a retainer configured in a top ring that holds and presses a polygonal substrate toward an abrasive pad to surround a holding region of the polygonal substrate. The retainer is pressed toward the abrasive pad. The retainer comprises a plurality of retainer bodies configured around the holding region in a manner corresponding to and independent of each side of the polygonal substrate, along the sides. At least one of the plurality of retainer bodies includes: a first fixing surface capable of being fixed to a retainer holding member of the top ring; a first opposing surface opposite to the holding region in a first state in which the first fixing surface is fixed to the retainer holding member; a second fixing surface capable of being fixed to the retainer holding member in a second state after the retainer body has been rotated from the first state; and a second opposing surface opposite to the holding region in a state in which the second fixing surface is fixed to the retainer holding member.
[0084] Furthermore, this application discloses a retainer as one embodiment, wherein the second state is a state in which the retainer body in the first state is rotated about an imaginary axis of rotation extending in the extending direction of the retainer body, or a state in the first state in which the retainer body is rotated by changing the orientation of the extending direction of the retainer body, or a state different from the first state after rotation by a combination of these methods, wherein the second opposing surface is a surface different from the first opposing surface, or although it is the same surface as the first opposing surface, the opposing portion opposite to the retaining area has a different opposing portion opposite to the retaining area in the first state.
[0085] Furthermore, this application discloses a retainer as one embodiment, wherein at least one of the plurality of retainer bodies includes: a magnetic member embedded in the first fixing surface for fixing the first fixing surface to the retainer retaining member, and a magnetic member embedded in the second fixing surface for fixing the second fixing surface to the retainer retaining member.
[0086] Furthermore, this application discloses a retainer as one embodiment, wherein at least one of the plurality of retainer bodies has the shape of a regular polygonal prism, and the sides of the regular polygonal prism respectively include magnetic members embedded in the sides for fixing the sides to the retainer retaining members.
[0087] Furthermore, this application discloses, as one embodiment, a top ring that holds and presses a polygonal substrate toward a polishing pad. The top ring includes: a rotating shaft; a flange fixed to the rotating shaft; a retainer member mounted on the flange; and a retainer of any of the above, mounted on the retainer member.
[0088] Furthermore, this application discloses a top ring as one embodiment, wherein the retainer retaining member comprises a magnet or electromagnet disposed on an opposing surface opposite to the retainer body.
[0089] Furthermore, this application discloses a top ring as one embodiment, wherein the retainer retaining member has an abutting surface that abuts against the retainer body to prevent the retainer body from displacing in a direction away from the retaining region.
[0090] Furthermore, this application discloses a top ring as one embodiment, wherein a plurality of protruding holes are formed on the first fixing surface and the second fixing surface of the retainer body along the extending direction of the retainer body, and a plurality of protrusions are provided on the opposite surface of the retainer retaining member opposite to the retainer body, at positions corresponding to the protruding holes on the first fixing surface and the second fixing surface of the retainer body.
[0091] Furthermore, this application discloses a top ring as one embodiment, wherein the plurality of protruding holes are formed at a position that is rotationally symmetrical with respect to the extension direction of the retainer body.
[0092] Furthermore, this application discloses a substrate processing apparatus as one embodiment, comprising: a top ring of any of the above; and a polishing table configured to hold a polishing pad.
[0093] Symbol Explanation
[0094] 3: Retainer body
[0095] 3a: First page
[0096] 3b: Second page
[0097] 3c: The Third Side
[0098] 3D: The Fourth Side
[0099] 3e: Protruding hole
[0100] 3f: Protruding hole
[0101] 17: Flange
[0102] 18: Top ring shaft
[0103] 30: Holder
[0104] 34: Magnetic components
[0105] 36: Magnet
[0106] 37: Retainer retaining component
[0107] 37a: Sidewall
[0108] 37a-1: First contact surface
[0109] 37b: Sidewall
[0110] 37b-1: Second contact surface
[0111] 37e: Protrusion
[0112] 39: Maintain the area
[0113] 300: Grinding Unit
[0114] 302: Top Ring
[0115] 350: Grinding table
[0116] 352: Grinding Pad
[0117] 1000: Substrate processing apparatus
[0118] WF: substrate
Claims
1. A retainer disposed in a top ring that holds and presses toward a polygonal substrate to surround a holding region of the polygonal substrate, and the retainer is pressed toward the polishing pad, characterized in that, It includes a plurality of retainer bodies, which are arranged independently of each other and along the edges of the polygonal substrate around the retaining area. At least one of the plurality of retainer bodies includes: a first fixing surface capable of being fixed to a retainer retaining member of the top ring; a first opposing surface, which is opposite to the retaining area in a first state in which the first fixing surface is fixed to the retainer retaining member; and a second fixing surface capable of being fixed to the retainer retaining member in a second state after the retainer body has been rotated from the first state. And a second opposing surface, which faces the retaining area when the second fixing surface is fixed to the retainer retaining member. The second state is a state different from the first state, in which the retainer body in the first state is rotated about an imaginary axis of rotation extending in the extending direction of the retainer body, or in which the retainer body in the first state is rotated to reverse the orientation of the extending direction of the retainer body, or in a combination of these methods. The second opposing surface is a surface different from the first opposing surface, or although it is the same as the first opposing surface, the opposing part opposite to the holding area is different from the opposing part opposite to the holding area in the first state.
2. The retainer according to claim 1, characterized in that, At least one of the plurality of retainer bodies includes: a magnetic member embedded in the first fixing surface for fixing the first fixing surface to the retainer retaining member, and a magnetic member embedded in the second fixing surface for fixing the second fixing surface to the retainer retaining member.
3. The retainer according to claim 1, characterized in that, At least one of the plurality of retainer bodies has a regular polygonal prism shape. The sides of the regular polygonal prism each include a magnetic component embedded in the side for fixing the side to the retainer retaining member.
4. A top ring for holding and pressing a polygonal substrate toward an abrasive pad, characterized in that, Include: Rotating shaft; A flange, which is fixed to the rotating shaft; A retainer retaining member, which is mounted on the flange; and The retainer of claim 1, wherein the retainer is mounted on the retainer retaining member.
5. The top ring according to claim 4, characterized in that, The retainer retaining member includes a magnet or electromagnet disposed on an opposing surface opposite to the retainer body.
6. The top ring according to claim 4, characterized in that, The retainer retaining member has an abutting surface that abuts against the retainer body to prevent the retainer body from displacing in a direction away from the retaining area.
7. The top ring according to claim 4, characterized in that, Multiple protruding holes are formed on the first fixing surface and the second fixing surface of the retainer body along the extending direction of the retainer body. On the opposite surface of the retainer retaining member that is opposite to the retainer body, a plurality of protrusions are provided at positions corresponding to the protrusion holes on the first fixing surface and the second fixing surface of the retainer body.
8. The top ring according to claim 7, characterized in that, The plurality of protruding holes are formed at a position that is rotationally symmetrical with respect to the center of the extension direction of the retainer body.
9. A substrate processing apparatus comprising: The top ring as described in claim 4; and A grinding table configured to hold a grinding pad.