Backlight module, display module and display device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2022-03-31
- Publication Date
- 2026-06-30
Smart Images
Figure CN116931319B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of display technology, and in particular to a backlight module, a display module, and a display device. Background Technology
[0002] With the rise and increasing maturity of Organic Light-Emitting Diode (OLED) technology, OLED products have gradually become the new favorite in the market. However, OLED products are expensive and have poor reliability. In order to achieve the high contrast and thinness of OLED products, while retaining the price and reliability advantages of Liquid Crystal Display (LCD) products, micro-LEDs have emerged as backlight products.
[0003] Micro LEDs include micro light-emitting diodes (Micro LEDs) and sub-millimeter light-emitting diodes (Mini LEDs). Micro LEDs have a size (e.g., length) of less than 50 micrometers, for example, 10 to 50 micrometers; Mini LEDs have a size (e.g., length) of 50 to 150 micrometers, for example, 80 to 120 micrometers.
[0004] LCD panels equipped with micro-LED backlighting offer advantages such as high peak brightness, high contrast, low power consumption, and high reliability, and have broad development prospects. Summary of the Invention
[0005] On the one hand, a backlight module is provided, including a light-emitting substrate, a flip-chip film, and a backplate.
[0006] The light-emitting substrate includes a signal line group and multiple light-emitting units, the multiple light-emitting units being electrically connected to the signal line group. A flip-chip film is disposed on the non-light-emitting side of the light-emitting substrate and is electrically connected to the signal line group. A backplate is disposed on the non-light-emitting side of the light-emitting substrate, and the flip-chip film is located between the backplate and the light-emitting substrate; the backplate has a groove, the opening of which faces the light-emitting substrate, and at least a portion of the flip-chip film is disposed within the groove.
[0007] In some embodiments, the flip-chip film includes a flexible film and a driver chip. The flexible film is electrically connected to the signal line group. The driver chip is electrically connected to the flexible film; the driver chip is disposed within the groove.
[0008] In some embodiments, the sidewall of the groove is a stepped structure, extending along the thickness direction of the light-emitting substrate and pointing from the groove opening to the bottom surface. The sidewall of the groove includes a first sub-wall surface, a stepped surface, and a second sub-wall surface connected in sequence, and both the first sub-wall surface and the second sub-wall surface intersect the stepped surface.
[0009] The groove includes a first sub-groove and a second sub-groove. The first sub-groove includes a first sub-wall surface and the stepped surface, and the second sub-groove includes a second sub-wall surface and the bottom surface of the groove. The driving chip is disposed in the second sub-groove, and at least a portion of the flexible film is disposed in the first sub-groove.
[0010] In some embodiments, the groove includes a plurality of second sub-grooves, which are arranged along a first direction; the first direction is parallel to the extension direction of the bonding side edge of the light-emitting substrate. The backlight module includes a plurality of flip-chip films, which are arranged sequentially along the first direction. Each flip-chip film includes at least one driving chip, and all driving chips belonging to the same flip-chip film are disposed within the same second sub-grooves.
[0011] In some embodiments, the groove includes a plurality of first sub-grooves, and the first sub-grooves and second sub-grooves are alternately arranged along the first direction. Along the first direction, the two side edges of the flexible film of each flip-chip film extend beyond the two side edges of the driving chip of the flip-chip film, and the two side edges of the flexible film are respectively located in two first sub-grooves on both sides of the second sub-grooves where the driving chip is located.
[0012] In some embodiments, the backlight module further includes a heat dissipation layer disposed between the bottom surface of the groove and the driver chip, and the heat dissipation layer is connected to the bottom surface of the groove.
[0013] In some embodiments, the backplate further includes a backplate body disposed around the groove, the top of the sidewall of the groove being connected to the backplate body. Along the thickness direction of the light-emitting substrate, the bottom surface of the groove is further away from the light-emitting substrate relative to the backplate body.
[0014] In some embodiments, the backlight module further includes a second flexible circuit board, one end of which is electrically connected to the light-emitting substrate. The backplate has a first opening, and the other end of the second flexible circuit board passes through the first opening, extending to the side of the backplate away from the light-emitting substrate.
[0015] In some embodiments, the first opening is located on the side of the groove near the bonding side of the light-emitting substrate.
[0016] In some embodiments, the backlight module further includes a first fixing adhesive layer disposed between the light-emitting substrate and the back plate; the first fixing adhesive layer is disposed away from the groove and the flip-chip film.
[0017] In some embodiments, the backlight module further includes an optical adjustment film and a frame. The optical adjustment film is disposed on the light-emitting side of the light-emitting substrate. The frame surrounds the optical adjustment film and is disposed on the light-emitting side of the light-emitting substrate.
[0018] In some embodiments, the backlight module further includes a second fixing adhesive layer disposed between the light-emitting substrate and the adhesive frame.
[0019] On the other hand, a display module is provided, including a display panel and a backlight module as described in any of the foregoing embodiments. The display panel is disposed on the light-emitting side of the backlight module.
[0020] In some embodiments, the display module further includes a circuit board disposed on the side of the backlight module away from the display panel and on one side of a groove in the backplate of the backlight module; the circuit board is electrically connected to a second flexible circuit board of the backlight module.
[0021] In some embodiments, the display module further includes a third flexible circuit board, through which the display panel is electrically connected to the circuit board.
[0022] In some embodiments, the display module further includes a connector disposed on the side of the circuit board away from the backlight module; the second flexible circuit board is inserted into the connector.
[0023] On the other hand, a display device is provided, including the display module described in any of the foregoing embodiments. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.
[0025] Figure 1 This is a structural diagram of a backlight module according to some embodiments;
[0026] Figure 2 This is a top view of a light-emitting substrate provided according to some embodiments;
[0027] Figure 3 A rear view of a backlight module provided according to some embodiments;
[0028] Figure 4 This is a rear view of a light-emitting substrate after a flip-chip film has been disposed on the backlight side, according to some embodiments.
[0029] Figure 5 For along Figure 3 A cross-sectional view of the back plate with section line A-A' in the diagram;
[0030] Figure 6 For along Figure 3 A cross-sectional view of the backlight module with section line A-A' in the diagram;
[0031] Figure 7 For along Figure 3 Another cross-sectional view of the back plate along section line A-A' in the diagram;
[0032] Figure 8 For along Figure 3 Another cross-sectional view of the backlight module with section line A-A' in the diagram;
[0033] Figure 9 For along Figure 3 A cross-sectional view of the backlight module with section line B-B' in the diagram;
[0034] Figure 10 For along Figure 3 A cross-sectional view of the back plate with section line C-C' in the diagram;
[0035] Figure 11 For along Figure 3 A cross-sectional view of the backlight module with section line C-C' in the image;
[0036] Figure 12 For along Figure 3 Another cross-sectional view of the backlight module with section line B-B' in the diagram;
[0037] Figure 13 For along Figure 3 Another cross-sectional view of the backlight module with section line B-B' in the diagram;
[0038] Figure 14 This is a rear view of a display module provided according to some embodiments;
[0039] Figure 15 For along Figure 14 A cross-sectional view of the display module with section line D-D' in the image;
[0040] Figure 16 For along Figure 14 Another cross-sectional view of the display module with section line D-D' in the middle;
[0041] Figure 17 For along Figure 14 The cross-sectional view of the module shown by section line E-E' in the figure;
[0042] Figure 18 This is a top view of a display device provided according to some embodiments. Detailed Implementation
[0043] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.
[0044] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.
[0045] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.
[0046] In describing some embodiments, the terms "electrical connection" and "connection" and their derivatives may be used. For example, the term "electrical connection" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.
[0047] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.
[0048] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.
[0049] The use of “configured as” in this article implies an open and inclusive language that does not exclude the applicability to or configuration of devices to perform additional tasks or steps.
[0050] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).
[0051] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.
[0052] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.
[0053] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.
[0054] In related technologies, Mini LED backlight modules mostly adopt a passive driving method.
[0055] In backlight modules employing passive driving, one output channel of the driver chip sequentially illuminates multiple light-emitting units on the light-emitting substrate, resulting in relatively low cost. However, the inventors of this disclosure have discovered several drawbacks in Mini LED display devices using passive driving, as detailed below:
[0056] 1. The refresh rate is low, which may cause screen flickering during display;
[0057] 2. There is a significant signal delay issue;
[0058] 3. There is a serious feedback problem;
[0059] 4. The backlight module 10' requires a large amount of space for wiring design, and the corresponding circuit board assembled with the backlight module 10' is also large in size;
[0060] 5. High power consumption and high heat generation can easily cause problems such as diaphragm bulging and cleaning points in the display device;
[0061] 6. The backlight module 10' has a large number of traces, which in turn leads to a large number of pins. Assembling the backlight module 10' with the circuit board via the pins is difficult and results in a low yield rate.
[0062] 7. The backlight module 10' has relatively weak structural strength and undergoes large deformation under external force.
[0063] To solve the above technical problems, such as Figure 1 As shown, some embodiments of this disclosure provide a backlight module 10, including a light-emitting substrate 1, a flip-chip film 2, and a backplate 3.
[0064] For example, such as Figure 1As shown, the light-emitting substrate 1 includes a light-emitting side 1a and a backlight side 1b. The light-emitting side 1a is the side of the light-emitting substrate 1 that emits light, and the light generated by the light-emitting substrate 1 is emitted toward the light-emitting side 1a. The backlight side 1b is the side that is away from the light-emitting side 1a.
[0065] like Figure 2 As shown, the light-emitting substrate 1 includes a signal line group 11 and a plurality of light-emitting units 12.
[0066] For example, such as Figure 2 As shown, signal line group 11 may include multiple signal lines D.
[0067] Signal line D is configured to transmit a light emission control signal.
[0068] Signal line D is electrically connected to light-emitting unit 12 to drive light-emitting unit 12 to emit light. For example, each signal line D is electrically connected to one light-emitting unit 12, which can realize individual control of each light-emitting unit 12.
[0069] For example, the light-emitting unit 12 may include at least one light-emitting element G, and the at least one light-emitting element G is electrically connected to each other. For example, the multiple light-emitting elements G in a light-emitting unit 12 may adopt two connection structures: one parallel and multiple series, and / or multiple parallel and multiple series.
[0070] In this context, the "one-parallel-multiple-string" structure can be understood as all the light-emitting elements G within a single light-emitting unit 12 being connected in series. Correspondingly, the "multiple-string-multiple-parallel" structure can be understood as a single light-emitting unit 12 comprising at least two strings of light-emitting elements, with at least one string comprising at least two light-emitting elements G connected in series, wherein all the light-emitting element strings within a single light-emitting unit 12 are connected in parallel.
[0071] For example, the multiple light-emitting elements G in a light-emitting unit 12 can be arranged in a rectangle, rhombus, etc., which is not limited here. In addition, the number of light-emitting elements G in a light-emitting unit 12 can be 4, 6, 8, 16, etc., which is not limited here.
[0072] For example, the light-emitting elements G in a light-emitting unit 12 emit light synchronously under the control of the same light-emitting control signal, so the light-emitting brightness of all the light-emitting elements G in a light-emitting unit 12 is the same or approximately the same.
[0073] For example, the light-emitting element G can be a sub-millimeter light-emitting diode; for example, the light-emitting diode G can also be a micro light-emitting diode (Micro LED).
[0074] By setting up signal line group 11, i.e. using an active driving method, the aforementioned defects of the display device in the passive driving method can be effectively solved.
[0075] For example, the active driving method can achieve individual control of each light-emitting unit 12, thus increasing the refresh rate of the display device and avoiding the frequency band that the human ear can hear, thereby solving the problem of display device howling; the active driving method has low power consumption and generates less heat, which can solve the problems of film bulging and clearing points in the display device, effectively improving the service life of the display device; in the active driving display device, the wiring on the light-emitting substrate 1 is simple, and the number of pins that need to be assembled with the circuit board is small, reducing the assembly difficulty and improving the product yield.
[0076] Based on this, such as Figure 1 As shown, the flip-chip film 2 is disposed on the non-light-emitting side of the light-emitting substrate 1, i.e., the backlight side 1b.
[0077] The flip-chip film 2 is electrically connected to the aforementioned signal line group 11.
[0078] The flip-chip thin film 2 is configured to provide a light emission control signal to the light emission unit 12 through the signal line group 11, thereby enabling the light emission control of the light emission unit 12.
[0079] For example, the flip-chip film 2 includes multiple output channels, each of which is electrically connected to a light-emitting unit 12 in a one-to-one correspondence via a signal line group 11. During the refresh time of one frame of the display device, the output channels in the flip-chip film 2 continuously output light-emitting control signals to their corresponding light-emitting units 12.
[0080] For example, the flip-chip film 2 is electrically connected to the signal line D in the signal line group 11, thereby transmitting the light emission control signal to the light emission unit 12 through the signal line D, so as to realize the light emission control of the light emission element G in the light emission unit 12.
[0081] For example, one end of the signal line D in the signal line group 11 is electrically connected to the light-emitting element G in the light-emitting unit 12, and the other end is disposed as a pin on the backlight side 1b of the light-emitting substrate 1 and located on the bonding side S of the light-emitting substrate 1. The output channel in the flip-chip film 2 is bonded to the pin of the signal line D in the signal line group 11.
[0082] like Figure 1 As shown, the aforementioned backplate 3 is disposed on the non-light-emitting side of the light-emitting substrate 1, i.e., the backlight side 1b, and the flip-chip film 2 is disposed between the light-emitting substrate 1 and the backplate 3.
[0083] The backplate 3 is configured to serve as a protective shell to protect components such as the light-emitting substrate 1 from impacts and damage from external structures; at the same time, it serves as a support structure to prevent deformation of the backlight module 10 from causing display defects in the display device and to improve the strength of the display device.
[0084] like Figure 1 As shown, the back plate 3 has a groove J, the opening of which faces the light-emitting substrate 1. At least a portion of the aforementioned flip-chip film 2 is disposed within the groove J.
[0085] It should be noted that flip-chip film 2 is a structure that uses a flexible film with signal traces as a carrier for packaging the driver chip, combining the driver chip with a flexible circuit board. Therefore, please refer to... Figure 2 The thickness of the flip-chip film 2 varies at different locations (i.e., the dimension along the thickness direction Z of the light-emitting substrate 1). For example, the portion of the flip-chip film 2 that encapsulates the driver chip has a larger thickness.
[0086] For example, the portion of the flip-chip film 2 that encapsulates the driver chip is located within the groove J, which can effectively protect the driver chip from external bumps and damage during the assembly of the display device.
[0087] For example, such as Figure 1 As shown, the depth d1 of the groove J (i.e., the dimension along the thickness direction Z of the light-emitting substrate 1) is greater than or equal to the maximum thickness d2 of the portion of the flip-chip film 2 that encapsulates the driving chip (i.e., the dimension along the thickness direction Z of the light-emitting substrate 1).
[0088] By providing a groove J on the backplate 3 and placing at least a portion of the flip-chip film 2 within the groove J, such as placing the portion of the flip-chip film 2 containing the driver chip within the groove J, space can be provided for the flip-chip film 2, especially the portion of the flip-chip film 2 containing the driver chip. This can protect important components (such as the driver chip) in the flip-chip film 2 from damage during subsequent assembly of the display device.
[0089] In an exemplary embodiment, such as Figure 1 As shown, the flip-chip film 2 includes a flexible film 22 and a driver chip 21.
[0090] It should be noted that the flip-chip film 2 is a structure in which a flexible film 22 with signal traces is used as a carrier for packaging the driver chip 21, and the driver chip 21 is combined with the flexible film 22. The structure of the flip-chip film 2 in the accompanying drawings of this disclosure is only schematic and does not limit the actual structure of the flip-chip film 2.
[0091] The flexible film 22 is electrically connected to the signal line group 11.
[0092] For example, the flexible film 22 includes multiple output channels.
[0093] For example, the flexible film 22 can be electrically connected to the signal line D in the signal line group. For instance, one end of the output channel in the flexible film 22 protrudes and is bonded to the pin of the signal line D.
[0094] The driver chip 21 is electrically connected to the flexible film 22. For example, the other end of the output channel in the flexible film 22 is electrically connected to the driver chip 21. The light emission control signal in the driver chip 21 is transmitted to the signal line group 11 through the flexible film 22, and finally to the light emission unit 12, thereby realizing the light emission control of the light emission element G.
[0095] For example, the driver chip 21 can be a light-emitting control chip. The driver chip 21 can be configured to transmit light-emitting control signals to the signal line group 11 and finally to the light-emitting unit 12, thereby realizing the light-emitting control of the light-emitting element G in the light-emitting unit 12.
[0096] Among them, such as Figure 1 As shown, the driver chip 21 is located in the groove J.
[0097] For example, such as Figure 1 As shown, the volume of the groove J can be greater than or equal to the volume of the driver chip 21.
[0098] It should be noted that "the driver chip 21 is disposed in the groove J" can be understood as the portion of the flip-chip film 2 containing the driver chip 21 being disposed in the groove J. That is, in addition to the driver chip 21 being disposed in the groove J, the portion of the flexible film 22 used to encapsulate the driver chip 21 is also disposed in the groove J.
[0099] By placing the driver chip 21 inside the groove J, damage to the driver chip 21 from external sources can be avoided during the subsequent assembly of the display device.
[0100] Figure 3 A rear view of the backlight module 10 is shown. In some embodiments, such as Figure 3 As shown, groove J is strip-shaped, and the length direction of groove J is perpendicular to the bonding side S of the light-emitting substrate 1 (e.g., Figure 1 and Figure 2 The sides of the (as shown) extend in the same direction (see...) Figure 5 The first direction X in the middle).
[0101] Among them, the bonding side S of the light-emitting substrate 1 is the side on which the light-emitting substrate 1 and the flip-chip film 2 are bonded and electrically connected.
[0102] For example, such as Figure 3 As shown, the groove J is located on the side of the back plate 3 corresponding to the bonding side S of the light-emitting substrate 1.
[0103] Figure 4This diagram shows the structure of the backlight side 1b of the light-emitting substrate 1 after a flip-chip thin film 2 has been deposited. In some embodiments, such as... Figure 4 As shown, the backlight module 10 includes multiple flip-chip films 2, which are arranged sequentially along the first direction X.
[0104] Exemplarily, each flip-chip film 2 includes at least one driver chip 21. Exemplarily, as... Figure 4 As shown, each flip-chip film 2 includes two driver chips 21.
[0105] For example, such as Figure 4 As shown, each flip-chip film 2 is bonded to the light-emitting substrate 1 on the bonding side S of the light-emitting substrate 1.
[0106] For example, the multiple flip-chip films 2 can be an integral structure. For instance, there is a flexible film material between two adjacent flip-chip films 2, but no wiring is provided in the flexible film material between the two adjacent flip-chip films 2.
[0107] In some embodiments, such as Figure 5 and Figure 7 As shown, the sidewall Jb of the groove J has a stepped structure along the thickness direction Z of the light-emitting substrate 1 and points from the groove opening of the groove J to the bottom surface Ja. The sidewall Jb of the groove J includes a first sub-wall J11, a stepped surface J12 and a second sub-wall J21 connected in sequence.
[0108] It should be noted that the "bottom surface Ja" mentioned above refers to the surface in the groove J that is approximately parallel to the light-emitting substrate 1 and is furthest from the light-emitting substrate 1.
[0109] It should be noted that the aforementioned "sidewall Jb" includes all the sides of the groove J that are substantially perpendicular to the light-emitting substrate 1, as well as the portion connecting the two sides, i.e., see [reference]. Figure 7 The side wall Jb includes a first sub-wall J11, a step surface J12, and a second sub-wall J21 connected in sequence.
[0110] like Figure 5 and Figure 7 As shown, both the first sub-wall J11 and the second sub-wall J21 intersect the step surface J12. Exemplarily, both the first sub-wall J11 and the second sub-wall J21 are perpendicular to the step surface J12.
[0111] like Figure 5 and Figure 7 As shown, the groove J includes a first sub-groove J1 and a second sub-groove J2. The first sub-groove J1 includes a first sub-wall J11 and a step surface J12. The second sub-groove J2 includes a second sub-wall J21 and the bottom surface Ja of the groove J.
[0112] For example, the first sub-groove J1 and the second sub-groove J2 are integrally formed.
[0113] The driving chip 21 is disposed in the second sub-groove J2, and at least a portion of the flexible film 22 is disposed in the first sub-groove J1.
[0114] By setting the groove J to include a first sub-groove J1 and a second sub-groove J2, and placing the driver chip 21 in the second sub-groove J2, and placing at least a portion of the flexible film 22 in the first sub-groove J1, that is, by designing the shape of the groove J to match the shape of the flip-chip film 2, the portion of the flip-chip film 2 with the driver chip 21 and the area around the driver chip 21 can be laid flat in the groove J, reducing the number of folds or wrinkles that occur when the flip-chip film 2 is placed in the groove J, thereby reducing the risk of damage to the flip-chip film 2 and improving the service life of the backlight module 10.
[0115] For example, such as Figure 5 and Figure 7 As shown, the maximum depth d1 of the groove J (the dimension along the thickness direction Z of the light-emitting substrate 1) can be 0.8mm to 1.2mm, for example, 1mm. For example, the depth d3 of the first groove J1 is approximately 0.4mm to 0.6mm, for example, 0.5mm, and the depth d4 of the second groove J1 is approximately 0.4mm to 0.6mm, for example, 0.5mm.
[0116] In an exemplary embodiment, such as Figure 5 and Figure 6 As shown, the groove J includes a plurality of second sub-grooves J2, which are arranged along the first direction X.
[0117] Wherein, the first direction X is parallel to the extension direction of the bonding side S of the light-emitting substrate 1.
[0118] like Figure 6 As shown, the backlight module 10 includes multiple flip-chip films 2, which are arranged sequentially along the first direction X.
[0119] Each flip-chip film 2 includes at least one driver chip 21. For example, as shown... Figure 6 As shown, each flip-chip film 2 includes a driver chip 21.
[0120] like Figure 6 As shown, all the driving chips 21 belonging to the same flip-chip thin film 2 are located in the same second sub-groove J2.
[0121] For example, each flip-chip film 2 includes two driving chips 21, which are spaced apart within the same second sub-groove J2.
[0122] Optionally, the multiple flip-chip films 2 can be an integral structure.
[0123] By setting multiple second sub-grooves J2 arranged along the first direction X and placing the driving chip 21 in the second sub-grooves J2, when the backlight module 10 includes multiple flip-chip films 2, the shapes of the multiple flip-chip films 2 can be matched with those of the grooves J, so that the multiple driving chips 21 can be placed in the grooves J, and the flip-chip films 2 can be laid flat in the grooves J, reducing the number of folds or wrinkles that occur when the flip-chip films 2 are placed in the grooves J, thereby reducing the risk of damage to the flip-chip films 2 and improving the service life of the backlight module 10.
[0124] In an exemplary embodiment, such as Figure 7 As shown, the groove J also includes a plurality of first sub-grooves J1, and the first sub-grooves J1 and the second sub-grooves J2 are alternately arranged along the first direction X.
[0125] For example, at least one first sub-groove J1 is provided between two adjacent second sub-groove J2 along the first direction X.
[0126] like Figure 8 As shown, along the first direction X, the two sides of the flexible film 22 of each flip-chip film 2 extend beyond the two sides of the driving chip 21 of the flip-chip film 2, and the two sides of the flexible film 22 are located in the two first sub-grooves J1 on both sides of the second sub-grooves J2 where the driving chip 21 is located.
[0127] By setting a first sub-groove J1 and a second sub-groove J2 alternately arranged along the first direction X, and placing the driver chip 21 in the second sub-groove J2, when the backlight module 10 includes multiple flip-chip films 2, the shapes of the multiple flip-chip films 2 can be matched with those of the grooves J. This allows multiple driver chips 21 to be placed in the grooves J, and the flip-chip films 2 can be laid flat in the grooves J. This reduces the number of folds or wrinkles that occur when the flip-chip films 2 are placed in the grooves J, thereby reducing the risk of damage to the flip-chip films 2 and improving the service life of the backlight module 10.
[0128] In some embodiments, such as Figure 5 and Figure 7 As shown, the back plate 3 also includes a back plate body 31, which is arranged around the groove J (e.g., Figure 5 As shown, the top Jb1 of the sidewall Jb of the groove J is connected to the back plate body 31. Along the thickness direction Z of the light-emitting substrate 1, the bottom surface Ja of the groove J is further away from the light-emitting substrate 1 relative to the back plate body 31.
[0129] That is, the groove J protrudes relative to the back plate body 31 in a direction away from the light-emitting substrate 1.
[0130] For example, the groove J and the back plate body 31 are integrally formed.
[0131] By providing a groove J on the back plate 3, and the bottom surface Ja of the groove J being further away from the light-emitting substrate 1 relative to the back plate body 31, a space can be provided for the driver chip 21 to be placed, protecting the driver chip 21 from damage. At the same time, the groove J can also serve as a reinforcing rib extending along the first direction X of the back plate 3, which can enhance the strength of the back plate 3 and prevent the backlight module 10 from deforming. In particular, it can prevent the backlight module 10 from bending along the direction Y perpendicular to the first direction X, thereby improving the product yield of the display device and extending the service life of the display device.
[0132] In some embodiments, such as Figure 9 As shown, the backlight module 10 also includes a heat dissipation layer 4, which is disposed between the bottom surface Ja of the groove J and the driver chip 21, and the heat dissipation layer 4 is connected to the bottom surface Ja of the groove J.
[0133] For example, the heat dissipation layer 4 is bonded to the bottom surface Ja of the groove J by adhesive. That is, adhesive is provided on the side of the heat dissipation layer 4 near the bottom surface Ja. This not only fixes the heat dissipation layer 4, but also prevents the driver chip 21 from contacting the adhesive, thereby avoiding poor thermal conductivity between the heat dissipation layer 4 and the driver chip 21 and affecting the heat dissipation effect.
[0134] By setting up the heat dissipation layer 4, the driver chip 21 can be cooled, preventing the large amount of heat generated by the driver chip 21 during operation from damaging the driver chip 21 and other structures, thereby improving the service life of the backlight module 10.
[0135] In some embodiments, such as Figure 4 and Figure 11 As shown, the backlight module 10 also includes a second flexible circuit board 5, one end of which is electrically connected to the light-emitting substrate 1.
[0136] In an exemplary embodiment, the second flexible circuit board 5 can be configured to transmit a power signal (e.g., a positive voltage) to the light-emitting element G in the light-emitting unit 12.
[0137] For example, the second flexible circuit board 5 can be electrically connected to the light-emitting unit 12 in the light-emitting substrate 1.
[0138] For example, the signal line group 11 also includes power lines, and the second flexible circuit board 5 is electrically connected to the light-emitting unit 12 through the power lines.
[0139] Specifically, one end of the power supply line is electrically connected to the positive electrode of the light-emitting element G in the light-emitting unit 12, and the other end of the power supply line is set as a pin on the backlight side 1b of the light-emitting substrate 1 and is bonded to the line in the second flexible circuit board 5, so that the power signal can be transmitted to the light-emitting element G in the light-emitting unit 12 to realize the light emission of the light-emitting element G.
[0140] In an exemplary embodiment, the second flexible circuit board 5 may also be configured to transmit control signals to the flip-chip film 2.
[0141] For example, the second flexible circuit board 5 and the flip-chip film 2 can be electrically connected through a control signal line located in the light-emitting substrate 1. The second flexible circuit board 5 transmits control signals to the flip-chip film 2 through the control signal line, thereby realizing the control of the driving chip 21 in the flip-chip film 2.
[0142] In an exemplary embodiment, the other end of the second flexible circuit board 5 can be electrically connected to an external structure (e.g., a circuit board or a timing controller) so that the power signal and / or control signal transmitted by the external structure can be transmitted to the light-emitting substrate 1 through the second flexible circuit board 5, thereby realizing the light emission of the light-emitting element G in the light-emitting unit 12 in the light-emitting substrate 1.
[0143] Among them, such as Figure 3 and Figure 10 As shown, the back plate 3 has a first opening K1.
[0144] For example, such as Figure 10 and Figure 11 As shown, one side of the backplate 3 is bent toward the light-emitting substrate 1. On the one hand, the various film layers of the backlight module 10 can be fixed within the frame of the backplate 3, and on the other hand, the side strength of the backplate 3 can be enhanced to avoid defects such as dents or cracks on the side of the backlight module 10.
[0145] like Figure 11 As shown, the other end of the second flexible circuit board 5 passes through the first opening K1 and extends to the side of the back plate 3 away from the light-emitting substrate 1.
[0146] For example, after the second flexible circuit board 5 extends to the side of the back plate 3 away from the light-emitting substrate 1, it is electrically connected to an external structure, such as a circuit board, so that the electrical signals in the external structure are transmitted to the light-emitting substrate 1 through the second flexible circuit board 5.
[0147] For example, the second flexible circuit board 5 may include 39 pins.
[0148] In related technologies, backlight modules using passive driving methods require a large number of pins for electrical connection with external structures such as circuit boards, for example, 300 pins. At least three second flexible circuit boards are needed to realize the electrical connection between the light-emitting substrate and the circuit board. Correspondingly, the backplate in related technologies needs to be provided with at least three first openings, which reduces the structural strength of the backplate.
[0149] In the embodiments provided in this disclosure, the number of pins required for the signal line group 11 in the light-emitting substrate 1 to be electrically connected to an external structure such as a circuit board is small. Therefore, a second flexible circuit board 5 can realize the electrical connection between the light-emitting substrate 1 and the external structure such as a circuit board. Therefore, the back plate 3 only needs to be designed with a first opening K1, which effectively improves the structural strength of the back plate 3, thereby improving the structural strength of the backlight module 10.
[0150] In an exemplary embodiment, such as Figure 11 As shown, the first opening K1 is located on the side of the groove J near the bonding side S of the light-emitting substrate 1. That is, the second flexible circuit board 5 is bonded to the light-emitting substrate 1 on the bonding side S of the light-emitting substrate 1. All bonding processes in the backlight module 10 (such as the bonding of the flip-chip film 2 to the light-emitting substrate 1 and the bonding of the second flexible circuit board 5 to the light-emitting substrate 1) are completed on the bonding side S, which can reduce the process difficulty and improve the fabrication efficiency of the backlight module 10.
[0151] In some embodiments, such as Figure 12 As shown, the backlight module 10 also includes a first fixing adhesive layer 6, which is disposed between the light-emitting substrate 1 and the back plate 3.
[0152] The first fixing adhesive layer 6 is positioned to avoid the groove J and the flip-chip film 2.
[0153] For example, such as Figure 12 As shown, a second opening K2 is formed on the first fixing adhesive layer 6, so that the material of the first fixing adhesive layer 6 can avoid the groove J and the flip film 2, and avoid the material of the first fixing adhesive layer 6 from damaging the flip film 2 or affecting the heat dissipation between the driving chip 21 and the flexible film 22 in the flip film 2.
[0154] For example, the first fixing adhesive layer 6 is also disposed away from the second flexible circuit board 5 (see...). Figure 17 ).
[0155] By setting the first fixing adhesive layer 6, the light-emitting substrate 1 and the back plate 3 can be fixed, thereby preventing the various components in the backlight module 10 from becoming loose and completing the assembly of the backlight module 10.
[0156] In some embodiments, such as Figure 13 As shown, the backlight module 10 also includes an optical adjustment film 7 and a frame 8.
[0157] An optical adjustment film 7 is disposed on the light-emitting side 1a of the light-emitting substrate 1. The optical adjustment film 7 is configured to adjust the light emitted by the light-emitting substrate 1.
[0158] For example, the optical adjustment film 7 may include one or more of the following: a light-diffusing film, a composite prism, a color conversion film, and a brightness enhancement film. The light-diffusing film is configured to disperse the light emitted from the light-emitting substrate 1, thereby making the emitted light more uniform and improving the display effect; the composite prism is used to focus the light and prevent light scattering; the color conversion film can adjust the color of the light emitted from the light-emitting substrate 1, for example, converting blue light into white light; and the brightness enhancement film can increase the brightness of the light, thereby improving the display effect.
[0159] By setting the optical adjustment film 7, the quality of the light emitted by the backlight module 10 can be improved, thereby enhancing the display effect of the display device.
[0160] The frame 8 surrounds the optical adjustment film 7. Exemplarily, all four sides of the optical adjustment film 7 abut against the frame 8. Exemplarily, the frame has a ring-shaped design.
[0161] The frame 8 is configured to support and protect the optical adjustment films 7 inside the backlight module 10. The frame 8 mainly serves a load-bearing function (supporting the optical adjustment films 7), and also fixes the optical adjustment films 7 together to prevent them from loosening; on the other hand, it can assemble the external structure (such as the display panel) and the backlight module 10 to obtain the display module.
[0162] like Figure 13 As shown, the frame 8 is disposed on the light-emitting side 1a of the light-emitting substrate 1. For example, as... Figure 13 As shown, the side where the bonding side S of the light-emitting substrate 1 is located is flush with the side of the frame 8 that is away from the optical adjustment film 7.
[0163] In related technologies, the frame is located on the side where the light-emitting substrate is bonded, thereby simultaneously surrounding the light-emitting substrate and the optical adjustment film.
[0164] However, in the backlight module 10 provided in this embodiment, after adopting the active driving method, the bonding side S of the light-emitting substrate 1 needs to be bonded (including the bonding of the flip-chip film 2 to the light-emitting substrate 1 and the bonding of the second flexible circuit board 2 to the light-emitting substrate 1). The backlight module 10 provided in this embodiment extends the width (dimension along the Y direction) of the light-emitting substrate 1 by placing the frame 8 on the light-emitting side 1a of the light-emitting substrate 1 and controlling the side where the bonding side S of the light-emitting substrate 1 is located to be flush with the side of the frame 8 away from the optical adjustment film 7, thereby increasing the design space of the backlight side 1b surface of the light-emitting substrate 1, and reserving design space for bonding the light-emitting substrate 1 to the flexible film 11 and the second flexible circuit board 5.
[0165] In some embodiments, such as Figure 13 As shown, the backlight module 10 also includes a second fixing adhesive layer 9, which is disposed between the light-emitting substrate 1 and the frame 8.
[0166] The second fixing adhesive layer 9 is configured to fix the adhesive frame 8 on the light-emitting substrate 1, thereby fixing the optical adjustment film 7 on the light-emitting side 1a of the light-emitting substrate 1. In addition, the light-emitting substrate 1 is fixed to an external structure, such as a display panel, so as to realize the mating of the backlight module 10 with the external structure (such as the display panel) to obtain the display module.
[0167] For example, such as Figure 13 As shown, part of the second fixing adhesive layer 9 is disposed between the optical adjustment film 7 and the light-emitting substrate 1, so that the optical adjustment film 7 is more firmly disposed on the light-emitting side 1a of the light-emitting substrate 1.
[0168] For example, such as Figure 13 As shown, the back plate 3 bends towards the light-emitting substrate 1 on one side and passes through the side of the light-emitting substrate 1 and the second fixing adhesive layer 9 in sequence, and finally extends to the adhesive frame 8, which can further enhance the strength of the side of the back plate 3, thereby improving the strength of the side of the backlight module 10.
[0169] like Figure 14 As shown, some embodiments of this disclosure also provide a display module 100.
[0170] like Figure 15 As shown, the display module 100 includes a display panel 20 and a backlight module 10 in the above embodiments.
[0171] The display panel 20 is disposed on the light-emitting side 1a of the backlight module 10. For example, as shown... Figure 15 As shown, the display module 100 also includes foam adhesive 20', which is configured to fix the frame 8 to the display panel 20, thereby achieving the alignment of the display panel 20 and the backlight module 10 to obtain the display module 100.
[0172] For example, the display panel 20 can be a liquid crystal display (LCD) panel.
[0173] For example, the display panel 20 may include an array substrate, a cell substrate, and a liquid crystal layer disposed between the array substrate and the cell substrate. The cell substrate is located away from the backlight module 10 relative to the array substrate.
[0174] For example, the display panel 20 may include a color filter layer in the substrate of the display panel 20. The color filter layer includes at least a red photoresist unit, a green photoresist unit, and a blue photoresist unit, which are configured to control the color of the light emitted from the display panel 20.
[0175] For example, the display panel 20 also includes a black matrix pattern in the substrate of the cell, which is used to separate the red photoresist unit, the green photoresist unit and the blue photoresist unit.
[0176] For example, the display panel 20 also includes a first polarizer disposed on the side of the cell substrate away from the backlight module 10, and a second polarizer disposed on the side of the array substrate near the backlight module 10.
[0177] The beneficial effects that the display module 100 in the above embodiments of this disclosure can achieve are the same as the beneficial effects that the backlight module 10 can achieve, and will not be repeated here.
[0178] In some embodiments, such as Figure 16 As shown, the display module 100 also includes a circuit board 30.
[0179] The circuit board 30 is located on the side of the backlight module 10 away from the display panel 20, and the circuit board 30 is located on the side of the groove J of the back plate 1 of the backlight module 10.
[0180] For example, such as Figure 16 As shown, the circuit board 30 is disposed on the side of the groove J near the bonding side S of the light-emitting substrate 1.
[0181] By setting the circuit board 30 on one side of the groove J, the edge of the groove J in the backlight module 10 can be used as a boundary line to define the setting position of the circuit board 30 during the assembly of the circuit board 30, thereby saving the laser engraving process of making reference lines and simplifying the assembly process.
[0182] For example, in the display module 100 provided in this embodiment of the present disclosure, the thickness of the groove J can be approximately equal to the thickness of the circuit board 30, and the circuit board 30 is disposed on the side of the groove J near the bonding side S of the light-emitting substrate 1.
[0183] By designing the thickness of the groove J to be approximately equal to the thickness of the circuit board 30, and placing the circuit board 30 on the side of the groove J close to the bonding side S of the light-emitting substrate 1, the design of the groove J can avoid increasing the overall thickness of the display module 100, which is beneficial to achieving a thinner and lighter design for the display device using the active driving method.
[0184] For example, the dimensions of the circuit board 30 provided in this embodiment of the present disclosure along the first direction X, i.e., the length of the circuit board 30, can be 260mm to 300mm, for example, 280mm, and the dimensions along the direction Y perpendicular to the first direction X, i.e., the width of the circuit board 30, can be 10mm to 14mm, for example, 12mm. Compared with the dimensions of the circuit board 30 in related technologies (e.g., a length of 280mm and a width of 30mm), the circuit board 30 provided in this embodiment of the present disclosure occupies less design space, which can reserve more design space for the display device.
[0185] In some embodiments, such as Figure 14 and Figure 16 As shown, the display module 100 also includes a third flexible circuit board 40, through which the display panel 20 is electrically connected to the circuit board 30.
[0186] For example, such as Figure 16 As shown, one end of the third flexible circuit board 40 extends from the display panel 20, bends past the side of the bonding side S, and finally extends to the circuit board 30 and is electrically connected to the circuit board 30.
[0187] The circuit board 30 is configured to provide the necessary electrical signals to the display panel 20. For example, it provides an electric field to the liquid crystal layer in the display panel 20 to control the liquid crystal, thereby controlling the light emitted by the display panel 20.
[0188] In some embodiments, such as Figure 14 and Figure 17 As shown, the display module 100 also includes a connector 50, which is located on the side of the circuit board 30 away from the backlight module 10.
[0189] For example, the connector 50 is provided with a number of sockets that are the same as the number of pins on the second flexible circuit board 5, for example, 39 in each case.
[0190] like Figure 17 As shown, the second flexible circuit board 5 is plugged into the connector 50.
[0191] The circuit board 30 is electrically connected to the second flexible circuit board 5 of the backlight module 10. The circuit board 30 is also configured to transmit power signals (e.g., positive voltage) and / or control signals to the second flexible circuit board 5, and transmit the power signals to the light-emitting unit 12 in the light-emitting substrate 1 and the control signals to the flip-chip film 2 through the second flexible circuit board 5, thereby realizing the light-emitting control of the light-emitting element G in the light-emitting unit 12 in the light-emitting substrate 1.
[0192] like Figure 18As shown, some embodiments of this disclosure also provide a display device 1000, which includes the display module 100 in the above embodiments.
[0193] The beneficial effects that the display device 1000 in this embodiment can achieve are the same as those that the display module 100 described above can achieve, and will not be repeated here.
[0194] Figure 18 This is a top view of a display device 1000 provided for some embodiments of the present disclosure. The display device 1000 can be any device that displays images, whether moving (e.g., video) or stationary (e.g., still images), and whether text or images. More specifically, embodiments are contemplated to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal digital assistants (PDAs), virtual reality (VR) displays, handheld or portable computers, Global Positioning System (GPS) receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.
[0195] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.
Claims
1. A backlight module, comprising: A light-emitting substrate includes a signal line group and multiple light-emitting units, wherein the multiple light-emitting units are electrically connected to the signal line group; A flip-chip film is disposed on the non-light-emitting side of the light-emitting substrate, and the flip-chip film is electrically connected to the signal line group; the flip-chip film includes a flexible film and a driving chip, the flexible film is electrically connected to the signal line group, and the driving chip is electrically connected to the flexible film; A backplate is disposed on the non-light-emitting side of the light-emitting substrate, and the flip-chip film is located between the backplate and the light-emitting substrate; the backplate is provided with a groove, the opening of the groove facing the light-emitting substrate, and at least a portion of the flip-chip film is disposed in the groove; the driving chip is disposed in the groove; The sidewall of the groove has a stepped structure along the thickness direction of the light-emitting substrate and points from the groove opening to the bottom surface. The sidewall of the groove includes a first sub-wall surface, a stepped surface, and a second sub-wall surface connected in sequence. The first sub-wall surface and the second sub-wall surface both intersect with the stepped surface. The groove includes a first sub-groove and a second sub-groove. The first sub-groove includes a first sub-wall surface and the stepped surface, and the second sub-groove includes a second sub-wall surface and the bottom surface of the groove. The driving chip is disposed in the second sub-groove, and at least a portion of the flexible film is disposed in the first sub-groove.
2. The backlight module according to claim 1, wherein, The groove includes a plurality of second sub-grooves, which are arranged along a first direction; the first direction is parallel to the extension direction of the bonding side edge of the light-emitting substrate. The backlight module includes a plurality of the flip-chip films, which are arranged sequentially along the first direction; Each of the flip-chip films includes at least one of the driving chips, and all the driving chips belonging to the same flip-chip film are disposed in the same second sub-groove.
3. The backlight module according to claim 2, wherein, The groove includes a plurality of first sub-grooves, and the first sub-grooves and the second sub-grooves are alternately arranged along the first direction; Along the first direction, the two sides of the flexible film of each flip-chip film extend beyond the two sides of the driving chip of the flip-chip film, and the two sides of the flexible film are respectively located in the two first sub-grooves on both sides of the second sub-grooves where the driving chip is located.
4. The backlight module according to claim 1, further comprising: A heat dissipation layer is disposed between the bottom surface of the groove and the driver chip, and the heat dissipation layer is connected to the bottom surface of the groove.
5. The backlight module according to claim 1, wherein, The back plate also includes a back plate body, which is disposed around the groove, and the top of the sidewall of the groove is connected to the back plate body; Along the thickness direction of the light-emitting substrate, the bottom surface of the groove is further away from the light-emitting substrate relative to the back plate body.
6. The backlight module according to any one of claims 1 to 5, wherein, Also includes: The second flexible circuit board is electrically connected at one end to the light-emitting substrate. The back panel has a first opening, and the other end of the second flexible circuit board passes through the first opening and extends to the side of the back panel away from the light-emitting substrate.
7. The backlight module according to claim 6, wherein, The first opening is located on the side of the groove near the bonding side of the light-emitting substrate.
8. The backlight module according to any one of claims 1 to 5, further comprising: A first fixing adhesive layer is disposed between the light-emitting substrate and the back plate; The first adhesive layer is positioned to avoid the groove and the flip-chip film.
9. The backlight module according to any one of claims 1 to 5, further comprising: An optical adjustment film is disposed on the light-emitting side of the light-emitting substrate; A frame is provided around the optical adjustment film, and the frame is located on the light-emitting side of the light-emitting substrate.
10. The backlight module according to claim 9, further comprising: A second fixing adhesive layer is disposed between the light-emitting substrate and the adhesive frame.
11. A display module, comprising: The backlight module as described in any one of claims 1 to 10; The display panel is located on the light-emitting side of the backlight module.
12. The display module according to claim 11, further comprising: A circuit board is disposed on the side of the backlight module away from the display panel, and on one side of the groove of the back plate of the backlight module; The circuit board is electrically connected to the second flexible circuit board of the backlight module.
13. The display module according to claim 12, further comprising: The third flexible circuit board is used to electrically connect the display panel to the circuit board.
14. The display module according to claim 12 or 13, further comprising: A connector is located on the side of the circuit board away from the backlight module; The second flexible circuit board is plugged into the connector.
15. A display device comprising the display module according to any one of claims 11 to 14.