A de-vacuum fluid control device for wafer grinding equipment
By centrally positioning the drainage tubes and simplifying the configuration of the fluid control device, the problem of inconvenient maintenance of the fluid control device in the existing wafer grinding equipment is solved, and more efficient fluid control and production efficiency are achieved.
CN116967927BActive Publication Date: 2025-09-05JOEN LIH MASCH CO LTD
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Patent Information
- Application Number
- CN202311247253.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-26
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2043-09-26
AI Technical Summary
Technical Problem
During the de-vacuum operation of existing wafer grinding equipment, the components of the fluid control device are complex, making maintenance and replacement inconvenient, which affects production efficiency.
Method used
A fluid control device with a centrally positioned drainage tube is used. The positioning seat and elastic cover are driven by a linear actuator to simplify the configuration of the drainage tube. The delivery tube is connected with an adapter and a diverter to achieve centralized control and uniform distribution of the fluid.
Benefits of technology
The convenience of repairing and replacing fluid control devices is improved, the operation complexity is reduced, and the production efficiency is improved.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention discloses a de-vacuum fluid control device for wafer grinding equipment, comprising a linear driver driving a positioning seat to move up and down, a plurality of drainage tubes respectively arranged on the positioning seat, a plurality of elastic covers respectively sleeved on the drainage tubes, an adapter seat arranged on a support frame, a plurality of diverters spaced apart on the support frame, a plurality of relay channels formed inside the adapter seat, each elastic cover respectively corresponding to each relay channel one by one in the upper and lower directions, the other end of each relay channel respectively connected to a plurality of relay tubes, each relay tube respectively connected to a plurality of diverters, and each diverter respectively connected to a plurality of delivery pipes, thereby controlling the fluid to enter between the upper grinding disk of the wafer grinding equipment and the wafer being ground thereby.
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