Endoscope

By using a combination of heat dissipation components with different coefficients of linear expansion in the endoscope, the problem of complex structure in existing endoscopes has been solved, achieving efficient heat dissipation and improved safety.

CN116981389BActive Publication Date: 2026-06-16HOYA CORPORATION

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HOYA CORPORATION
Filing Date
2022-07-07
Publication Date
2026-06-16

AI Technical Summary

Technical Problem

Existing endoscopes require complex structures and additional components for heat dissipation, leading to structural complexity.

Method used

The device employs a combination of heat dissipation components with different coefficients of linear expansion, including a first heat dissipation component covering the heating element and an embedded cylindrical second heat dissipation component. Through the design of the interventional and external components, it achieves rapid heat transfer and prevents burns to the patient's skin.

🎯Benefits of technology

It achieves effective heat dissipation with a simple structure, prevents burns to the patient's skin, and improves heat dissipation efficiency and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided is an endoscope that can appropriately dissipate heat generated by a heat generating portion with a simple structure. In an endoscope that has an imaging element (44) that generates heat during operation, a shield tube (41) that is integrated with the imaging element (44) and that functions to dissipate heat transferred from the imaging element (44) in the case where the imaging element (44) generates heat, and a molded resin portion (48), the molded resin portion (48) has a greater linear expansion coefficient than the imaging element (44) and the shield tube (41).
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Description

Technical Field

[0001] This invention relates to an endoscope.

[0002] This application claims priority based on Japanese Application No. 2021-126742, filed on August 2, 2021, and incorporates all disclosures set forth in that Japanese application. Background Technology

[0003] In recent years, with the increasing demand for high-quality endoscopes, the pixel count of camera elements has been continuously increasing. However, with the increase in the pixel count of camera elements, power consumption has increased, and the heat generated from the camera elements has also increased. Therefore, it is necessary to study methods for dissipating the heat generated by camera elements.

[0004] Patent document 1 discloses an endoscope that has a cooling device between the camera element and the wiring board, which can effectively dissipate the heat generated from the camera element.

[0005] Patent document 2 discloses an endoscope that uses two different resins to solidify the imaging element and the circuit board, thereby effectively dissipating heat from the circuit board.

[0006] Patent document 3 discloses an endoscope comprising: a heat dissipation component mounted at a front end and having a plurality of fins for dissipating heat from the front end.

[0007] Existing technical documents

[0008] Patent documents

[0009] Patent Document 1: Japanese Patent Application Publication No. 2015-217162

[0010] Patent Document 2: Japanese Patent Application Publication No. 2011-200398

[0011] Patent Document 3: Japanese Patent Application Publication No. 2007-156079 Summary of the Invention

[0012] The problem that the invention aims to solve

[0013] However, the endoscope in Patent Document 1 is equipped with a cooling device; the endoscope in Patent Document 2 uses two different resins; the endoscope in Patent Document 3 has a heat dissipation component at the front end; and in any of the endoscopes in Patent Documents 1 to 3, other components are required for heat dissipation, and they have complex structures.

[0014] The present invention was made in view of the following circumstances, and its object is to provide an endoscope that can properly dissipate the heat generated by the heating element with a simple structure without the need for additional components for heat dissipation.

[0015] Technical solutions for solving the problem

[0016] The endoscope of the present invention is characterized in that: in an endoscope having a heating part that generates heat during operation and a heat dissipation component for dissipating heat transferred from the heating part, the heat dissipation component includes a first heat dissipation component for covering the heating part and a cylindrical second heat dissipation component in which the first heat dissipation component is embedded, the first heat dissipation component having a larger coefficient of linear expansion than the heating part and the second heat dissipation component.

[0017] In this invention, compared to the heating element, the first heat dissipation component covering the heating element has a larger coefficient of linear expansion, and compared to the cylindrical second heat dissipation component in which the first heat dissipation component is embedded, the first heat dissipation component has a larger coefficient of linear expansion. Therefore, the thermal expansion of the first heat dissipation component is greater than that of the heating element and the second heat dissipation component. Thus, when the heating element is heating up, the first heat dissipation component can make close contact with both the heating element and the second heat dissipation component, and the heat from the heating element is rapidly transferred to the outer second heat dissipation component via the first heat dissipation component.

[0018] The endoscope involved in this invention is characterized in that: a sheet-like interventional component is disposed between the first heat dissipation component and the second heat dissipation component, wherein the linear expansion coefficient of the interventional component is greater than that of the heating part and the heat dissipation component.

[0019] In this invention, since the coefficient of linear expansion of the interventional component is greater than that of the heating element and the heat dissipation component, the thermal expansion of the interventional component is greater than that of the heat dissipation component. Therefore, when the heating element heats up, the first heat dissipation component and the second heat dissipation component can come into close contact via the interventional component, and the heat from the heating element is rapidly transferred from the first heat dissipation component to the outer second heat dissipation component.

[0020] The present invention relates to an endoscope, characterized in that: it has an outer component in which the second heat dissipation component is embedded, and the coefficient of linear expansion of the outer component is greater than that of the second heat dissipation component.

[0021] In this invention, because the coefficient of linear expansion of the outer component is greater than that of the second heat dissipation component, the thermal expansion of the outer component is greater than that of the second heat dissipation component. Therefore, when the heating element heats up, the outer component and the second heat dissipation component are no longer in close contact, and the heat from the heating element is difficult to transfer to the outer component via the second heat dissipation component. Thus, burns to the patient's skin due to contact with the outer component can be prevented.

[0022] The endoscope involved in this invention is characterized in that: the outer component includes a first outer component exposed to the outside and a second outer component not exposed, wherein the thermal conductivity of the first outer component is lower than that of the second outer component.

[0023] In this invention, since the thermal conductivity of the first outer component, which is exposed to the outside and can come into contact with the patient's skin, is lower than that of the second outer component, even if the heat from the heating element is transferred to the first outer component via the second heat dissipation component, it is possible to prevent the patient's skin from being burned due to contact with the first outer component.

[0024] The endoscope of the present invention is characterized in that: the second outer part is cylindrical, and has a cylindrical outer part in which the second outer part is embedded, the thermal conductivity of the outer part being less than 0.1 W / (m·K).

[0025] In this invention, since the thermal conductivity of the outer component that comes into contact with the patient's skin is as low as 0.1 W / (m·K), even if the heat from the heating element is transferred to the second outer component via the second heat dissipation component, it is possible to prevent the patient's skin from being burned due to contact with the outer component.

[0026] This invention relates to an endoscope, characterized in that the thermal conductivity of the external component is below 0.05 W / (m·K).

[0027] In this invention, the thermal conductivity of the outer component that comes into contact with the patient's skin is as low as 0.05 W / (m·K), thus more reliably preventing burns to the patient's skin from contact with the outer component.

[0028] The present invention relates to an endoscope, characterized in that: the first heat dissipation component is made of epoxy resin, and the second heat dissipation component is made of nickel.

[0029] In this invention, the first heat dissipation component is made of epoxy resin, and the second heat dissipation component is made of nickel.

[0030] The endoscope involved in this invention is characterized in that the compression ratio of the second heat dissipation component is 20% or more.

[0031] In this invention, when the heating element is heating up, the compression ratio of the second heat dissipation component is 20% or more, compared to the case where the heating element is not heating up.

[0032] The endoscope involved in this invention is characterized in that the compression rate of the interventional component is 20% or more.

[0033] In this invention, when the heating element is heated, the compression rate of the intervention component is 20% or more, compared to the case where the heating element is not heated.

[0034] Invention Effects

[0035] According to the present invention, the heat of the heating element can be dissipated appropriately with a simpler structure. Attached Figure Description

[0036] Figure 1 This is an external view of the endoscope involved in the embodiments of the present invention.

[0037] Figure 2 This is a cross-sectional view of the insertion portion of the endoscope according to this embodiment.

[0038] Figure 3 It is an enlarged representation Figure 2 The image shows an enlarged cross-sectional view of the camera component.

[0039] Figure 4 This is a graph showing the relationship between the temperature of the imaging element in the endoscope according to this embodiment and the compression rate of the interventional component.

[0040] Figure 5 It is a graph showing the relationship between the thermal conductivity of the casing and the temperature difference between the inside and outside of the casing. Detailed Implementation

[0041] The endoscope according to the embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0042] Figure 1 This is an external view of the endoscope involved in the embodiments of the present invention.

[0043] Endoscope 1 is a flexible endoscope specifically designed for the upper or lower digestive tract. Endoscope 1 includes an operating section 11, a connector section 12, and an insertion section 2. A bend-resistant section 13 is provided between the insertion section 2 and the operating section 11.

[0044] The operating part 11 is cylindrical, with an operating knob 111 at one end and a channel inlet 113 at the other end. In addition, a pliers bolt 112 is provided at the channel inlet 113.

[0045] The connector section 12 is connected to the operation section 11 via a universal flexible cord 121. The connector section 12 is connected to a power supply device and a display device (not shown). Power lines and signal lines (not shown) are routed from the connector section 12 to the insertion section 2 via the universal flexible cord 121, the operation section 11, the bend prevention section 13, and the interior of the insertion section 2.

[0046] The anti-bending part 13 is connected to the other end of the operating part 11 and is in the shape of a cylindrical shape that narrows towards the insertion part 2.

[0047] The insertion part 2 is a long, thin tube, and from the front end side, it has a front end 201, a curved part 202, and a flexible part 203 in sequence. The front end 201 is the shortest and is rigid. The curved part 202 is flexible. The flexible part 203 is the longest and is soft.

[0048] Figure 2 This is a cross-sectional view of the insertion part 2 of the endoscope 1 according to this embodiment. Figure 2 The front end portion 201 of the insertion portion 2 is indicated. In the front end portion 201, a camera assembly 4 is provided along the axial length direction of the front end portion, and the camera assembly 4 is surrounded by the outer component 3.

[0049] Figure 3 It is an enlarged representation Figure 2 The magnified cross-section of the camera component 4 shown in the figure.

[0050] The camera assembly 4 includes: an image sensor 44 (heat-generating part); a cylindrical shielding tube 41 (second heat dissipation component) for housing the image sensor 44 and having a rectangular cross-section; and a molded resin part 48 (first heat dissipation component) formed inside the shielding tube 41 and integrating the image sensor 44 with the shielding tube 41. Heat emitted by the image sensor 44 is absorbed and dissipated through the shielding tube 41 or the molded resin part 48. That is, the shielding tube 41 and the molded resin part 48 are heat dissipation components.

[0051] For example, the shielding tube 41 is made of nickel. An objective lens unit 42 is provided at one end of the shielding tube 41, and a cable 47 is inserted into the shielding tube 41 from the other end.

[0052] The image sensor 44 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor 44 is plate-shaped. The image sensor 44 is embedded in the shielding tube 41, and its side abuts against the inner surface of the shielding tube 41.

[0053] Inside the shielding tube 41, a cover lens 46 is provided on the light-receiving surface side of the imaging element 44. The cover lens 46 includes a cover glass, a color filter, microlenses, etc. That is, the cover lens 46 covers the light-receiving surface of the imaging element 44.

[0054] The imaging element 44 converts the optical image image projected onto the light-receiving surface into an electrical signal and outputs it to the display device. Inside the shielding tube 41, on the surface opposite the light-receiving surface of the imaging element 44, a plurality of electrodes 441 for inputting and outputting electrical signals are protruding. Furthermore, the mounting substrate 43 is disposed adjacent to the electrodes 441. That is, the imaging element 44 is connected to the mounting substrate 43 via the electrodes 441.

[0055] Furthermore, a driver IC (not shown) and other components are mounted on a mounting substrate 43 inside the shielding tube 41. The mounting substrate 43 and the cable 47 are connected via wires. The driver IC drives the camera element 44.

[0056] Furthermore, the driver IC is electrically connected to one end of the cable 47. The cable 47 has the aforementioned structure where the power lines and signal lines are covered by a sheath, and is flexible. The cable 47 is used to supply power from the aforementioned power supply device to the imaging element 44, and to output signals from the imaging element 44 to the display device, etc. The cable 47 is connected to a flexible printed circuit board.

[0057] Furthermore, within the shielding tube 41, one end from the imaging element 44 to the cable 47 is filled with molding resin, forming a molding resin portion 48. More specifically, the molding resin portion 48 is formed to cover the electrode 441 side of the imaging element 44 and the mounting substrate 43. Figure 2 and Figure 3 In the middle, the molded resin part 48 is indicated by a shaded line.

[0058] The molding resin portion 48 is, for example, a highly thermally conductive resin incorporating thermally conductive fillers and possesses high insulation properties. Furthermore, the thermal conductivity of the molding resin portion 48 is, for example, 2.4 W / (m·K). By molding the driver IC, the flexible printed circuit board, and the connection portion of the cable 47 to the flexible printed circuit board using the molding resin portion 48, electrical disconnection is prevented. Additionally, the molding resin portion 48 absorbs heat emitted from the imaging element 44, the driver IC, and the flexible printed circuit board, and transfers it to the shielding tube 41.

[0059] That is, the molded resin part 48 is approximately rectangular in shape and is embedded within the shielding tube 41. The molded resin part 48 is made of, for example, epoxy resin and has a larger coefficient of linear expansion than the shielding tube 41. The coefficient of linear expansion of the molded resin part 48 is 55.5 × 10⁻⁶. -6 / ℃, compared to shielding tube 41 (15.5×10 -6 / ℃) large.

[0060] Furthermore, the molding resin portion 48 has a larger coefficient of linear expansion than the imaging element 44 and the shielding tube 41. Since the main component of the imaging element 44 is Si single crystal, its coefficient of linear expansion is approximately 3.43 × 10⁻⁶. -6 / ℃. In contrast, the molded resin part 48, as described above, is made of resin and has a coefficient of linear expansion of 55.5 × 10⁻⁶. -6 / ℃. Furthermore, as mentioned above, the shielding tube 41 is made of nickel, with a coefficient of linear expansion of 15.5 × 10⁻⁶. -6 / ℃.

[0061] For purposes such as airtightness and insulation, a sheet-like intervention member 45 is disposed between the imaging element 44, the molding resin portion 48, and the shielding tube 41. That is, the intervention member 45 is sheet-like and surrounds the imaging element 44 and the molding resin portion 48. The intervention member 45 may, for example, be made of silicone rubber, and an adhesive may be applied to the main surface of the intervention member 45.

[0062] The linear expansion coefficient of the intervention component 45 is 2.5–4.0 × 10⁻⁶. -4 / ℃, compared to the image sensor 44 (3.43×10 -6 / ℃), Molded resin part 48 (55.5×10 -6 / ℃) and shielding tube 41 (15.5×10 -6 The coefficient of linear expansion (°C) is large.

[0063] In this way, since the coefficient of linear expansion of the intervention component 45 is greater than that of the molding resin part 48 and the shielding tube 41, the molding resin part 48 and the shielding tube 41 can make close contact through the intervention component 45 when thermal expansion occurs due to the heat generated by the camera element 44.

[0064] Furthermore, in a high-temperature environment of 70–80°C, the compression rate of the intervention component 45 due to the shielding tube 41 and the molding resin part 48 is 20% or more. Here, the compression rate is calculated by the following formula 1.

[0065] {(T1-T2) / T1}×100 (Equation 1)

[0066] T1 is the thickness of the intervention component 45 before it is sandwiched between the shielding tube 41 and the molding resin part 48, and T2 is the thickness of the intervention component 45 under the high temperature environment when it is sandwiched between the shielding tube 41 and the molding resin part 48.

[0067] Figure 4 This is a graph showing the relationship between the temperature of the imaging element 44 in the endoscope 1 according to this embodiment and the compression ratio of the interventional component 45. Figure 4 In the figure, the horizontal axis represents the compression rate (%) of the intervention component 45, and the vertical axis represents the temperature of the imaging element 44.

[0068] from Figure 4 As can be seen, the greater the compression ratio of the intervention component 45, the lower the temperature of the imaging element 44. In other words, the higher the compression ratio of the intervention component 45, the more heat the imaging element 44 dissipates. Furthermore, when the compression ratio of the intervention component 45 exceeds 20% (refer to...), the temperature of the imaging element 44 decreases. Figure 4 In the case of the arrow, the amount of temperature reduction of the imaging element 44 remains almost unchanged.

[0069] As described above, since the coefficient of linear expansion of the intervention component 45 is greater than that of the molding resin part 48 and the shielding tube 41, and the compression ratio of the intervention component 45 is more than 20%, the heat emitted from the imaging element 44 is rapidly transferred to the shielding tube 41 through the intervention component 45 and is effectively dissipated.

[0070] In addition, the intervention component 45 is not limited to silicone rubber, but can also be made of polyimide, polyester, silicone, polyurethane, acrylic, hot melt adhesive, etc.

[0071] The objective lens unit 42 has multiple imaging lenses 421, 421, ... and a lens holding tube 422.

[0072] The lens holding tube 422 is cylindrical in shape and has an inner circumferential surface with a circular cross-section. Along its axial length, the thickness of the half of the lens holding tube 422 closest to the shielding tube 41 is greater than the thickness of the other half. Furthermore, the lens holding tube 422 has a reduced-diameter portion on the outer circumferential surface of one end on the shielding tube 41 side. This reduced-diameter portion has a stepped outer diameter along the circumferential direction. The outer diameter of this reduced-diameter portion is slightly smaller than the inner diameter of the shielding tube 41 at that end, and the shielding tube 41 is externally fitted into the end of the lens holding tube 422.

[0073] Multiple camera lenses 421, 421, ... are embedded within a lens retaining sleeve 422. The multiple camera lenses 421, 421, ... are arranged on the axis of the lens retaining sleeve 422.

[0074] like Figure 2 As shown, the camera component 4 is embedded in the outer component 3.

[0075] The outer component 3 includes a front cylindrical portion 31 (first outer component) and a cylindrical body 32 (second outer component). The front cylindrical portion 31 is a bottomed cylindrical shape, and the cylindrical body 32 is cylindrical. The front end of the lens holding tube 422 is exposed to the outside through a through hole formed at the bottom of the front cylindrical portion 31.

[0076] One end of the front cylindrical portion 31 is fitted onto the same axis as one end of the cylindrical body 32. Specifically, the cylindrical body 32 has an enlarged diameter portion on the inner circumferential surface of the one end, which has a stepped shape along the circumference and an expanded inner diameter. The inner diameter of this enlarged diameter portion is slightly larger than the outer diameter of the one end of the front cylindrical portion 31, and the one end of the front cylindrical portion 31 is fitted into the one end of the cylindrical body 32.

[0077] The front cylindrical portion 31 is made of resins such as m-PPE (Noryl, Iupiace), PPSU (Radel), POM, PPE, PC, PP, ABS, PMMA, etc. One end of the front cylindrical portion 31 is embedded in the sleeve 26 (external component) described later, while the other end on the front side is exposed to the outside.

[0078] Furthermore, a plurality of through holes extending from the inside to the outside are formed at the bottom of the front cylindrical portion 31, and as described above, one end of the camera assembly 4 is exposed to the outside through one of the through holes. In addition, one end of the channel tube (not shown) is opened through another through hole. The channel tube extends the entire length of the insertion portion 2, and the other end is connected to the channel inlet 113 of the operation portion 11.

[0079] The cylindrical body 32 is made of metals such as SUS, Cu, brass, Al, Ti, and Fe. The cylindrical body 32 is embedded inside the sleeve 26 and is not exposed to the outside.

[0080] The thermal conductivity of the front cylindrical portion 31 is lower than that of the cylindrical body 32. For example, the thermal conductivity of the front cylindrical portion 31 is less than 0.5 W / (m·K), while the thermal conductivity of the cylindrical body 32 is more than 20 W / (m·K).

[0081] Furthermore, in the endoscope 1 according to this embodiment, the coefficient of linear expansion of the front cylindrical portion 31 and the cylindrical body 32 is greater than that of the shielding tube 41.

[0082] That is, the front cylindrical part 31 is made of resin, and its coefficient of linear expansion is greater than that of the shielding tube 41, which is made of metal. In addition, the cylindrical body 32 is made of a material with a larger coefficient of linear expansion than that of the shielding tube 41 from the materials listed above.

[0083] Therefore, when the imaging element 44 heats up and the shielding tube 41 and the outer component 3 (front cylindrical portion 31 and cylindrical body 32) undergo thermal expansion, the thermal expansion of the outer component 3 is greater than that of the shielding tube 41, and close contact between the shielding tube 41 and the outer component 3 can be prevented. Therefore, it is possible to suppress the transfer of heat from the imaging element 44 to the outer component 3 via the shielding tube 41.

[0084] Furthermore, as described above, in the endoscope 1 according to this embodiment, the thermal conductivity of the exposed front cylindrical portion 31 is lower than that of the unexposed cylindrical body 32. Therefore, even if heat from the imaging element 44 is transferred to the outer component 3 via the shielding tube 41, it is possible to suppress the transfer of high heat to the patient's skin via the front cylindrical portion 31.

[0085] like Figure 2 As shown, the outer peripheral surface of the outer component 3 is covered by the sleeve 26. That is, the sleeve 26 is embedded in the outer component 3. As described above, the outer peripheral surface of one end of the front cylindrical portion 31 is surrounded by the sleeve 26, and the entire outer peripheral surface of the cylindrical body 32 is surrounded by the sleeve 26.

[0086] The sleeve 26 is made of a material with excellent thermal insulation properties. Specifically, the sleeve 26 is made of a material with a lower thermal conductivity than the front cylindrical portion 31. For example, the sleeve 26 is made of fluororubber.

[0087] As described above, the sleeve 26 covers the entire outer circumferential surface of the cylindrical body 32. Therefore, although the thermal conductivity of the cylindrical body 32 is higher than that of the front cylindrical portion 31, even if heat from the imaging element 44 is transferred to the outer component 3 via the shielding tube 41, it is possible to suppress the transfer of high heat to the patient's skin.

[0088] The above description uses the case where the thermal conductivity of sleeve 26 is 0.2 to 0.25 W / (m·K) as an example, but it is not limited to this case.

[0089] Figure 5 This is a graph showing the relationship between the thermal conductivity of sleeve 26 and the temperature difference between the inside and outside of sleeve 26. Figure 5 In the diagram, the horizontal axis represents the thermal conductivity of the sleeve 26, and the vertical axis represents the temperature difference between the inside and outside of the sleeve 26. That is, Figure 5 This indicates the temperature difference generated between the inner and outer sides of the sleeve 26 based on the thermal conductivity of the sleeve 26 material. However, Figure 5 The calculation results are based on the premise that the thickness of the sleeve 26 is 0.5mm, the outer diameter of the endoscope 1 is 10.75mm, and the power consumption of the camera element 44 is 0.23mW.

[0090] from Figure 5 As can be seen, the lower the thermal conductivity of the sleeve 26, the greater the temperature difference between the inside and outside of the sleeve 26, and the lower the risk of burns. In particular, when the thermal conductivity of the sleeve 26 is below 0.1 W / (m·K) (refer to...) Figure 5As indicated by the arrow, the temperature difference between the inside and outside of the sleeve 26 increases sharply. Therefore, by using a material with a thermal conductivity of less than 0.1 W / (m·K) as the material of the sleeve 26, the risk of burns can be effectively reduced.

[0091] Furthermore, considering that burns can occur to the human body at temperatures above 70°C, and that the guaranteed upper limit temperature of the camera element 44 is 75°C, the temperature difference between the inside and outside of the sleeve 26 is preferably 6°C or more. Therefore, by using a material with a thermal conductivity of 0.05 W / (m·K) or less as the material for the sleeve 26, the risk of burns can be reduced more reliably.

[0092] In this embodiment, the case where the shielding tube 41 is made of nickel is used as an example, but it is not limited to this. The shielding tube 41 may be made of, for example, Al, SUS, Cu, brass, Ti, Fe, etc.

[0093] Furthermore, in this embodiment, the case where the molding resin part 48 is made of epoxy resin is described as an example, but it is not limited to this. The molding resin part 48 may also be made of silicone, acrylic, polyurethane, melamine, hot melt adhesive, etc.

[0094] <Variation Example>

[0095] In the above description, the case in which the intervention component 45 is sandwiched between the shielding tube 41 and the molding resin part 48 is used as an example, but it is not limited to this case, and the intervention component 45 may also be omitted.

[0096] In this variation, the shielding tube 41 only needs to be configured such that its compression rate is 20% or higher in a high-temperature environment of 70–80°C. The compression rate of the shielding tube 41 is calculated using the above formula 1.

[0097] At this point, T1 is the thickness of the shielding tube 41 at room temperature, and T2 is the thickness of the shielding tube 41 at the high temperature.

[0098] Furthermore, as described above, since the coefficient of linear expansion of the molded resin portion 48 is greater than that of the shielding tube 41, the molded resin portion 48 and the shielding tube 41 can make close contact when thermal expansion occurs due to the heat generated by the imaging element 44.

[0099] As described above, since the coefficient of linear expansion of the molded resin part 48 is greater than that of the shielding tube 41, and the compression ratio of the shielding tube 41 is more than 20%, the heat emitted from the imaging element 44 is quickly transferred to the shielding tube 41 and effectively dissipated.

[0100] Symbol Explanation

[0101] 1. Endoscope

[0102] 3. External components

[0103] 4. Camera components

[0104] 26. Sleeve (external component)

[0105] 31 Front cylindrical section (first outermost component)

[0106] 32. Cylindrical main body (second outermost component)

[0107] 41 Shielding tube (second heat dissipation component)

[0108] 44. Camera element (heat-generating part)

[0109] 45 Interventional Components

[0110] 48 Molded resin section (first heat dissipation component).

Claims

1. An endoscope comprising an imaging element that generates heat during operation and a heat dissipation component for dissipating heat transferred from said imaging element, characterized in that, The heat dissipation component includes a molded resin portion for covering the camera element and a cylindrical shielding tube embedded with the molded resin portion. The molded resin portion has a larger coefficient of linear expansion than the camera element and the shielding tube.

2. The endoscope according to claim 1, characterized in that: A sheet-like intervention component is disposed between the molded resin part and the shielding tube. The coefficient of linear expansion of the intervention component is greater than that of the imaging element and the heat dissipation component.

3. The endoscope according to claim 1 or 2, characterized in that: It has an outer component with the shielding tube embedded inside. The coefficient of linear expansion of the outer component is greater than that of the shielding tube.

4. The endoscope according to claim 3, characterized in that: The outer component includes a first outer component that is exposed to the outside and a second outer component that is not exposed. The thermal conductivity of the first outer component is lower than that of the second outer component.

5. The endoscope according to claim 4, characterized in that: The second outer component is cylindrical. It has a cylindrical outer component with the shielding tube embedded inside. The thermal conductivity of the external component is below 0.1 W / (m·K).

6. The endoscope according to claim 5, characterized in that: The thermal conductivity of the external component is below 0.05 W / (m·K).

7. The endoscope according to claim 1 or 2, characterized in that: The molded resin part is made of epoxy resin. The shielding tube is made of nickel.

8. The endoscope according to claim 1 or 2, characterized in that: The compression rate of the shielding tube is over 20%.

9. The endoscope according to claim 2, characterized in that: The compression rate of the intervention component is 20% or more.