Deep ocean slender towed array pattern measurement system

Abstract

The application relates to a deep-sea slender towed array shape measurement system, which comprises multiple array shape measurement devices, and the array shape measurement device comprises a sensor module, which is used for collecting array shape information and uploading the array shape information to an upper computer; a mounting part, which is used for mounting the sensor module; a shell, which is used for mounting the mounting part; part of the structure of the mounting part forms a first end cover of the array shape measurement device; and part of the structure of the sensor module forms a second end cover of the array shape measurement device. By configuring part of the structure of the mounting part and part of the structure of the sensor module as the first end cover and the second end cover of the array shape measurement device, a high-strength sealed cabin body is formed with the shell of the array shape measurement device, the array shape measurement device is miniaturized on the basis of high-precision measurement performance, the array shape measurement device is arranged in each subarray and a damping section of a towed array, and multi-point measurement is realized on each subarray and the damping section of the deep-sea slender towed array, so that the measurement effect of the array shape of the towed array is improved.

Description

Technical Field

[0001] This application relates to the field of marine information technology, and in particular to a deep-sea slender towed array measurement system. Background Technology

[0002] As my country places increasing emphasis on deep-sea security, underwater unmanned vehicles (UAVs) are operating at increasingly deeper depths. Sonar, serving as the "eyes and ears" of these UAVs, is gaining importance in both military and civilian sectors. Towed array sonar, towed by the stern of the vehicle, benefits from its large acoustic aperture leading to high gain and low background noise due to its distance from the vehicle, resulting in excellent acoustic detection and communication performance.

[0003] A towed array consists of several array elements arranged in fixed positions. Both acoustic detection and communication algorithms are based on estimating the time difference of signals received by each array element at a fixed position. Since a towed array is a flexible cylindrical object, it is usually subject to zero buoyancy or microgravity and is easily affected by deep-sea currents and other dynamic forces, resulting in changes in array shape. This leads to inaccurate array element positions, which in turn affects the time difference estimation and reduces acoustic performance such as detection and communication range and detection accuracy. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this application provides a deep-sea slender towed array formation measurement system, including a host computer and multiple formation measurement devices installed in the vibration damping section and multiple subarrays and interconnected by a specific bus. The host computer is electrically connected to the formation measurement devices, and the formation measurement devices include:

[0005] The sensor module is used to collect the array information of the vibration damping section and / or the subarray, and upload the array information to the host computer;

[0006] Mounting section, used to mount the sensor module;

[0007] A housing for mounting the mounting part;

[0008] A portion of the mounting section is located at the first end of the housing, and this portion of the mounting section forms the first end cap of the array measuring device.

[0009] A portion of the sensor module is located at the second end of the housing, and this portion of the sensor module forms the second end cap of the array measuring device.

[0010] The mounting part includes a mounting frame and a fixing structure fixedly connected to the mounting frame;

[0011] The fixing structure is connected to the housing, and the fixing structure is used to connect the mounting bracket and the housing;

[0012] The mounting bracket is connected to the sensor module, and the mounting bracket is used to mount the sensor module.

[0013] The fixing structure is located at the first end of the housing, and the fixing structure forms the first end cap of the array measuring device.

[0014] Optionally, the fixing structure includes a first part and a second part connected to the first part;

[0015] A sealing ring is fitted onto the outer wall of the first part, and the first part forms a sealed connection with the inner wall of the housing;

[0016] The second portion protrudes from the housing and is used to mount the fixing structure to the first end of the housing.

[0017] Optionally, the mounting part is provided with a through hole for connecting the internal and external spaces of the housing, and an external interconnection cable is connected to the interior of the housing through the through hole;

[0018] The outer wall of the housing and / or the mounting portion is provided with a plurality of notches extending along the length direction of the housing, the plurality of notches being used to avoid the interconnecting cable; and / or,

[0019] Multiple of the aforementioned gaps are used to avoid cables required for the damping section and / or other components within the subarray.

[0020] Optionally, the sensor module includes:

[0021] An array sensor is used to collect the array information;

[0022] The data transmission module is electrically connected to the array sensor and is used to transmit the array information to the host computer.

[0023] Optionally, the array sensor includes an attitude sensor and / or a depth sensor;

[0024] The attitude sensor is electrically connected to the data transmission module, and the attitude sensor is used to collect attitude information of the vibration damping section and / or the subarray;

[0025] The depth sensor is electrically connected to the data transmission module, and the depth sensor is used to collect depth information of the vibration damping section and / or the subarray;

[0026] The depth sensor includes a precision compensation circuit and a pressure transmitter.

[0027] Optionally, the attitude sensor is disposed on the mounting portion;

[0028] The accuracy compensation circuit is disposed in the mounting part;

[0029] The pressure transmitter is located at the second end of the housing, and the pressure transmitter forms the second end cap of the array measuring device.

[0030] Optionally, the data transmission module includes a microprocessor and a CAN interface chip;

[0031] The microprocessor is electrically connected to the array sensor. The microprocessor is used to receive the array information and transmit the array information to the host computer through the CAN interface chip using the CAN bus communication protocol.

[0032] Optionally, the data transmission module further includes:

[0033] A switching power supply is used to convert the power supply voltage into the operating voltage of the array sensor and the data transmission module;

[0034] A voltage regulator chip is connected to the microprocessor and the switching power supply, and is used to stabilize the circuit voltage.

[0035] A matching resistor is provided, which is matched to the impedance characteristics of the interconnect cable, and the matching resistor is used to enhance the reliability of long-distance CAN bus communication; optionally, the array measurement device is also provided with a monitoring circuit.

[0036] The technical solutions provided by the embodiments of this application may include the following beneficial effects: By configuring part of the structure of the mounting part and part of the structure of the sensor module into the first end cover and the second end cover of the array measuring device, and then cooperating with the housing of the array measuring device to form a sealed chamber, the array measuring device is miniaturized while possessing high-precision measurement performance. This allows the array measuring device to be configured in each subarray and vibration damping section, thereby enabling multi-point measurement of each vibration damping section and subarray of the slender towed array and improving the measurement effect of the towed array.

[0037] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0039] Figure 1 This is a schematic diagram illustrating the structure of a deep-sea slender towed array measurement system according to an exemplary embodiment.

[0040] Figure 2This is a schematic diagram illustrating the structure of a deep-sea slender towed array measurement device according to an exemplary embodiment.

[0041] Figure 3 This is a schematic diagram illustrating the structure of a deep-sea slender towed array measurement device according to an exemplary embodiment.

[0042] Figure 4 This is a schematic diagram illustrating the structure of a deep-sea slender towed array measurement device according to an exemplary embodiment.

[0043] Figure 5 This is a schematic diagram illustrating the structure of a deep-sea slender towed array measurement device according to an exemplary embodiment.

[0044] Figure 6 This is a schematic diagram illustrating the structure of a deep-sea slender towed array measurement device according to an exemplary embodiment.

[0045] Figure 7 This is a circuit diagram of a deep-sea slender towed array measurement device according to an exemplary embodiment. Detailed Implementation

[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0047] As my country places increasing emphasis on deep-sea security, underwater unmanned vehicles (UAVs) are operating at increasingly deeper depths. Sonar, serving as the "eyes and ears" of these UAVs, is gaining importance in both military and civilian sectors. Towed array sonar, towed by the stern of the vehicle, benefits from its large acoustic aperture leading to high gain and low background noise due to its distance from the vehicle, resulting in excellent acoustic detection and communication performance.

[0048] A towed array consists of array elements arranged in fixed positions. Both acoustic detection and communication algorithms are based on estimating the time difference of signals received by each array element at a fixed position. Since a towed array is a flexible cylindrical object, it is usually subject to zero buoyancy or microgravity and is highly susceptible to changes in its array shape caused by deep-sea currents and other dynamic forces. This results in inaccurate array element positions, which in turn affects the time difference estimation and reduces acoustic performance such as detection and communication range and detection accuracy.

[0049] In related technologies, array measurement devices are large in size, have short transmission distances, and measure multiple array elements independently without forming a network transmission function, resulting in too many transmission cables and making them difficult to use for slender towed arrays.

[0050] To address the aforementioned issues, this application proposes a deep-sea slender towed array formation measurement system, comprising: a host computer, and multiple formation measurement devices interconnected by a specific bus within the vibration damping section and multiple sub-arrays connected to the vibration damping section. The formation measurement devices are electrically connected to the host computer. Each formation measurement device includes: a sensor module and a mounting portion for mounting the sensor module, and a housing for supporting the mounting portion. The sensor module is used to collect formation information of the vibration damping section and / or sub-arrays and upload the formation information to the host computer. A portion of the mounting portion is located at the first end of the housing, forming a first end cap of the formation measurement device, and a portion of the sensor module is located at the second end of the housing, forming a second end cap of the formation measurement device. This application configures a portion of the mounting section and a portion of the sensor module into the first and second end caps of the array measurement device, which then cooperate with the housing of the array measurement device to form a sealed chamber. While maintaining high-precision measurement performance, this application achieves miniaturization of the array measurement device, allowing the array measurement device to be configured in each subarray and vibration damping section. This enables multi-point measurement of each vibration damping section and subarray of the slender towed array, thereby improving the measurement effect of the towed array.

[0051] According to an exemplary embodiment, such as Figure 1 As shown, this embodiment provides a deep-sea slender towed array formation measurement system, including a host computer (not shown) and multiple formation measurement devices 1 installed on the vibration damping section 2 and the sub-array 3. (Refer to...) Figure 1 The towed array consists of a tow cable 4, a front damping section 21, multiple subarrays 3, and a rear damping section 22. A tow cable connector 5 is provided between the tow cable 4 and the front damping section 21, and an interarray connector 6 is provided between adjacent damping sections 2 and subarrays 3. In one example, there are four subarrays 3. The front damping section 21, the rear damping section 22, and each subarray 3 are all 32m long, and the tow cable 4 is 400m long. An array shape measuring device 1 is provided in each of the front damping section 21, the rear damping section 22, and each subarray 3.

[0052] like Figures 2 to 6 As shown, the array measurement device 1 includes a sensor module 11, a mounting portion 12 for mounting the sensor module 11, and a housing 13 for mounting the mounting portion 12. (Refer to...) Figure 1 and Figure 3The sensor module 11 is used to collect the array formation information of the vibration damping section 2 and the sub-array 3, and upload the array formation information to the host computer (not shown). Each array formation measuring device 1 is installed at the middle position of the vibration damping section 2 and the sub-array 3. Specifically, the middle position refers to the geometric center of the vibration damping section 2 and the sub-array 3, so as to ensure that the attitude and depth of the array formation measuring device 1 are consistent with the geometric center position of the vibration damping section 2 and the sub-array 3, thereby accurately measuring the array formation information of the vibration damping section 2 and the sub-array 3. Figure 3 and Figure 4 As shown, a portion of the mounting section 12 is located at the first end 131 of the housing 13, forming the first end cover of the array measuring device 1, and a portion of the sensor module 11 is located at the second end 132 of the array measuring device 1, forming the second end cover of the array measuring device 1. (Refer to...) Figure 2 , Figure 3 and Figure 4 The housing 13, part of the sensor module 11 and part of the mounting part 12 form a sealed chamber, which enables power supply and data transmission for the oriented measuring device 1 in the underwater environment. The sealed chamber also has a heat dissipation function. The sealed chamber has strong water pressure resistance to be suitable for deep-sea environments and can achieve a maximum working water depth of 2000m.

[0053] In one example, such as Figure 2 and Figure 6 As shown, the array measuring device 1 has a length of 105 mm. Its housing 13 has a circular cross-sectional shape with an inner diameter of 22 mm and an outer diameter of 30.4 mm. The wall thickness of the housing 13 is 1.2 mm. It is equipped with four fastening structures 12221, and is then mounted to the mounting part 12 by four fasteners (not shown). These fasteners can be, for example, bolts. It should be noted that in this embodiment, the housing 13 is cylindrical, but its shape can also be cuboid, sphere, or an irregular shape; it is not limited to these limitations.

[0054] Among them, such as Figure 3 A first positioning structure (not shown) is provided on the inner wall of the housing 13, and a second positioning structure (not shown) is provided on the sensor module 11 to cooperate with the first positioning structure. This is used to install the sensor module 11 in a fixed position and orientation within the housing 13, improving the accuracy of the sensor module 11 in measuring the towed array formation. Specifically, the second positioning structure is located on the attitude sensor 1111 of the sensor module 11 (see reference 1). Figure 1 )superior.

[0055] In one embodiment, such as Figure 3 and Figure 4As shown, the mounting part 12 includes a mounting bracket 121 and a fixing structure 122 fixedly connected to the mounting bracket 121. The mounting part 12 is used to mount the sensor module 11. Specifically, the fixing structure 122 of the mounting part 12 is connected to the housing 13, and the mounting bracket 121 of the mounting part 12 is connected to the sensor module 11, thereby mounting the sensor module 11 together with the housing 13 through the mounting part 12. The fixing structure 122 of the mounting part 12 is located at the first end 131 of the housing 13, forming the first end cap of the array measuring device 1.

[0056] Among them, such as Figure 3 , Figure 4 and Figure 5 As shown, the mounting bracket 121 includes a first mounting structure 1211 and a second mounting structure 1212 connected to the first mounting structure 1211. The first mounting structure 1211 and the second mounting structure 1212 form an L-shape with a 90° angle between them. The first mounting structure 1211 is connected to the fixed structure 122 and is used to mount the mounting bracket 121 on the fixed structure 122. The second mounting structure 1212 is fixedly connected to the sensor module 11 and is used to mount the sensor module 11.

[0057] Among them, such as Figure 5 As shown, the fixing structure 122 of the mounting part 12 includes a first part 1221 and a second part 1222 connected to the first part 1221. (Refer to...) Figure 4 and Figure 5 A sealing ring (not shown) is fitted onto the outer wall of the first part 1221, which makes the first part 1221 form a sealed connection with the inner wall of the housing 13. The second part 1222 protrudes from the housing 13 and is used to fix the fixing structure 122 to the first end 131 of the housing 13.

[0058] In one embodiment, such as Figures 2 to 6 As shown, both the fixing structure 122 and the mounting bracket 121 of the mounting part 12 are provided with through holes 123. The through holes 123 are used to connect the internal and external spaces of the housing 13, so that the external interconnection cable (not shown) can be connected to the inside of the housing 13 through the through holes 123 to enable power supply and data transmission to the sensor module 11.

[0059] The interconnecting cable enters the interior space of the housing 13 through the through hole 123 of the mounting part 12. A deep-water tight connector (not shown) is mounted on the mounting part 12 to achieve a seal between the interior and exterior spaces of the housing 13. In one example, the interconnecting cable outside the housing 13 is 20m long, extending to the front and rear of the towing array respectively. Figure 1The X direction and its reverse direction are shown in the figure. The interconnecting cables are interconnected inside the drag cable connector 5 and the inter-array connector 6 to form a data transmission network of multiple array measuring devices 1, which improves the efficiency of array information transmission and reduces the number of transmission cables.

[0060] Among them, such as Figure 2 As shown, the outer walls of the housing 13 and the mounting portion 12 are provided with a plurality of notches 14 extending along the length direction of the housing 13, and the plurality of notches 14 are evenly distributed along the circumference of the housing 13. In one example, as Figure 6 As shown, the outline of notch 14 is circular to avoid and fix interconnecting cables with circular cross-sections and cables required for other components inside the vibration damping section and subarray, such as multi-core sensing optical fibers and multi-core piezoelectric hydrophone wires. It is understood that the outline shape of notch 14 can also be square, irregular, or other structures.

[0061] In one embodiment, such as Figure 3 As shown, the sensor module 11 of the array measurement device 1 includes an array sensor 111 and a data transmission module 112. The array sensor 111 is used to collect array information, and the data transmission module 112 is electrically connected to the array sensor 111 to transmit the array information collected by the array sensor 111 and upload it to the host computer of the array measurement system. Wherein, as... Figure 1 As shown, the sensor module 11 includes an attitude sensor 1111 and a depth sensor 1112. The attitude sensor 1111 is used to collect the attitude information of the vibration damping section 2 and the subarray 3. For example, the attitude sensor 1111 is a three-axis (X, Y, Z) attitude sensor, that is, the attitude information collected by the attitude sensor 1111 includes heading angle, pitch angle, roll angle, etc. The depth sensor 1112 is used to collect the depth information of the vibration damping section and the subarray 3.

[0062] Among them, reference Figure 3 The depth sensor 1112 includes a precision compensation circuit 11121 and a pressure transmitter 11122. The precision compensation circuit 11121 is installed in the mounting part 12 of the array measuring device 1. The pressure transmitter 11122 is located at the second end 132 of the housing 13 and forms the second end cover of the array measuring device. The pressure transmitter 11122 converts pressure into an electrical signal and adjusts the precision of the electrical signal through the precision compensation circuit 11121 to achieve accurate depth detection.

[0063] The data transmission module 112 and the attitude sensor 1111 can be connected to the mounting bracket 121 by means of adhesive bonding, welding, fastener connection, etc. In one example, such as... Figure 3As shown, the data transmission module 112 and the attitude sensor 1111 are mounted on the second mounting structure 1212 of the mounting bracket 121 by fasteners, such as bolts. The accuracy compensation circuit 11121 of the depth sensor 1112 is mounted on the data transmission module 112 by fasteners.

[0064] Among them, such as Figure 3 and Figure 7 As shown, the data transmission module 112 of the sensor module 11 includes a microprocessor 1121 and a CAN interface chip (not shown). (Refer to...) Figure 3 The microprocessor 1121 is electrically connected to the array sensor 111. The microprocessor 1121 is used to receive the array information from the array sensor 111 and transmit the array information to the host computer (not shown) through the CAN interface chip. The communication protocol is the CAN bus communication protocol. The CAN bus has the advantages of multi-master control, multiple connection nodes, strong node expandability, and long communication distance, and is suitable for slender towed arrays.

[0065] In one example, the transmission rate of array information is less than 10kbps and the transmission distance is not less than 4km. For a slender towed array, using the CAN bus communication protocol to transmit array information can realize multi-point networking and long-distance data transmission, which improves the efficiency of array information transmission and thus improves the effect of towed array array measurement.

[0066] In one example, the data transmission module 112 of the sensor module 11 has a width of 17 mm and a length of no more than 40 mm to save space stacking inside the array measurement device.

[0067] Among them, reference Figure 7 The data transmission module 112 also includes a microprocessor 1121, a switching power supply 1122, a voltage regulator chip (not shown), a CAN interface chip (not shown), and a matching resistor (not shown). The input terminal of the switching power supply 1122 is connected to the interconnect cable, and the output terminal of the switching power supply 1122 is connected to the attitude sensor 1111 and the depth sensor 1112, used to convert the power supply voltage into the operating voltage of the array sensor 111 and the data transmission module 112. The voltage regulator chip is connected to the microprocessor 1121 and the switching power supply 1122, used to stabilize the circuit voltage. The CAN interface chip is connected to the microprocessor 1121 and the interconnect cable (not shown), used to convert the microprocessor logic level to the differential level of the CAN bus. Each data transmission module 112 has a space for a matching resistor, which is connected to the CAN interface chip (not shown) and the interconnect cable (not shown), used to match the characteristic impedance of the interconnect cable. Only the data transmission module 112 at the end of the array measurement device 1 has a matching resistor installed, for example, by soldering.

[0068] In one example, refer to Figure 7 The solid lines with arrows represent the power supply provided by the host computer (not shown) to the array measurement device 1. The power supply voltage provided by the host computer is 12VDC to 28VDC, ensuring that the voltage output to the array measurement device 1 at the very end of the towed array after transmission through the interconnecting cables is still higher than the lower limit of the allowable input voltage of the array measurement device 1. The power supply voltage is converted by the switching power supply 1122 of the data transmission module 112 and reduced to 5VDC to power the attitude sensor 1111 and the depth sensor 1112. The dashed lines with arrows represent the data transmission module 112 to which the array sensor 111 uploads the array information it collects. Specifically, in the working state, the attitude sensor 1111 and the depth sensor 1112 collect array information, which is collected by the microprocessor 1121 of the data transmission module 112. The array information is uploaded to the host computer through the CAN interface chip (not shown) and using the CAN bus communication protocol. The microprocessor 1121 transmits data with the attitude sensor 1111 and the depth sensor 1112 through a specified interface protocol. In one example, the microprocessor 1121 and the array sensor 111 can use a serial connection to transmit data.

[0069] In one embodiment, such as Figure 7 As shown, the array measurement device 1 also includes a monitoring circuit (not shown). The monitoring circuit is connected to the switching power supply 1122 and the array sensor 111. When any array sensor 111 is detected to be de-energized, the monitoring circuit controls the array measurement device 1 to stop working, thus preventing errors in the array measurement system caused by the failure of some array sensors 111 during operation. Specifically, the monitoring circuit is a watchdog circuit.

[0070] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0071] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A deep-sea slender towed array measurement system, characterized in that, The system includes a host computer and multiple array measurement devices interconnected by a specific bus, installed within the vibration damping section and multiple subarrays. The host computer is electrically connected to the array measurement devices, and the array measurement devices include: The sensor module is used to collect the array information of the vibration damping section and / or the subarray, and upload the array information to the host computer; Mounting section, used to mount the sensor module; A housing for mounting the mounting part; A portion of the mounting section is located at the first end of the housing, and this portion of the mounting section forms the first end cap of the array measuring device. A portion of the sensor module is located at the second end of the housing, and this portion of the sensor module forms the second end cap of the array measuring device.

2. The deep-sea slender towed array measurement system according to claim 1, characterized in that, The mounting part includes a mounting frame and a fixing structure fixedly connected to the mounting frame; The fixing structure is connected to the housing, and the fixing structure is used to connect the mounting bracket and the housing; The mounting bracket is connected to the sensor module, and the mounting bracket is used to mount the sensor module. The fixing structure is located at the first end of the housing, and the fixing structure forms the first end cap of the array measuring device.

3. The deep-sea slender towed array measurement system according to claim 2, characterized in that, The fixing structure includes a first part and a second part connected to the first part; A sealing ring is fitted onto the outer wall of the first part, and the first part forms a sealed connection with the inner wall of the housing; The second portion protrudes from the housing and is used to mount the fixing structure to the first end of the housing.

4. The deep-sea slender towed array measurement system according to claim 2 or 3, characterized in that, The mounting part is provided with a through hole, which is used to connect the internal and external spaces of the housing, and the external interconnection cable is connected to the inside of the housing through the through hole; The outer wall of the housing and / or the mounting portion is provided with a plurality of notches extending along the length direction of the housing, the plurality of notches being used to avoid the interconnecting cable; and / or, Multiple of the aforementioned gaps are used to avoid cables required for the damping section and / or other components within the subarray.

5. The deep-sea slender towed array measurement system according to claim 1, characterized in that, The sensor module includes: An array sensor is used to collect the array information; The data transmission module is electrically connected to the array sensor and is used to transmit the array information to the host computer.

6. The deep-sea slender towed array measurement system according to claim 5, characterized in that, The array sensor includes an attitude sensor and / or a depth sensor; The attitude sensor is electrically connected to the data transmission module, and the attitude sensor is used to collect attitude information of the vibration damping section and / or the subarray; The depth sensor is electrically connected to the data transmission module, and the depth sensor is used to collect depth information of the vibration damping section and / or the subarray; The depth sensor includes a precision compensation circuit and a pressure transmitter.

7. The deep-sea slender towed array measurement system according to claim 6, characterized in that, The attitude sensor is disposed on the mounting part; The accuracy compensation circuit is disposed in the mounting part; The pressure transmitter is located at the second end of the housing, and the pressure transmitter forms the second end cap of the array measuring device.

8. The deep-sea slender towed array measurement system according to claim 5, characterized in that, The data transmission module includes a microprocessor and a CAN interface chip; The microprocessor is electrically connected to the array sensor. The microprocessor is used to receive the array information and transmit the array information to the host computer through the CAN interface chip using the CAN bus communication protocol.

9. The deep-sea slender towed array measurement system according to claim 8, characterized in that, The data transmission module further includes: A switching power supply is used to convert the power supply voltage into the operating voltage of the array sensor and the data transmission module; A voltage regulator chip is connected to the microprocessor and the switching power supply, and is used to stabilize the circuit voltage. A matching resistor, which is matched to the impedance characteristics of the interconnect cable, is used to enhance the reliability of long-distance CAN bus communication.

10. The deep-sea slender towed array measurement system according to claim 1, characterized in that, The array measuring device is also equipped with a monitoring circuit.

Images