Domain controller heat dissipation method and device, electronic equipment and storage medium

Abstract

The application relates to the technical field of domain controllers, and discloses a domain controller heat dissipation method and device, electronic equipment and a storage medium, which comprise the following steps: setting a target heat dissipation temperature of a domain controller, and collecting a current temperature of the domain controller; setting a hysteresis interval based on the target heat dissipation temperature, wherein the lowest temperature of the hysteresis interval is lower than the target heat dissipation temperature, and the highest temperature of the hysteresis interval is higher than the target heat dissipation temperature; judging whether the current temperature is located between the target heat dissipation temperature and the highest temperature of the hysteresis interval; when the current temperature is located between the target heat dissipation temperature and the highest temperature of the hysteresis interval, controlling a heat dissipation equipment of the domain controller to operate at a first heat dissipation power until the current temperature of the domain controller is lower than the lowest temperature of the hysteresis interval, and controlling the heat dissipation equipment to stop. The application meets the heat dissipation requirement, avoids long-time operation of the heat dissipation equipment, and prolongs the service life of the heat dissipation equipment. The hysteresis interval is set, the stability of the heat dissipation equipment is improved, and the performance of the domain controller is improved.

Description

Technical Field

[0001] This invention relates to the field of domain controller technology, and more specifically to domain controller heat dissipation methods, devices, electronic devices, and storage media. Background Technology

[0002] As automotive functions become increasingly diverse and complex, thermal management has become a major challenge in domain controller design. Common heat sources in entertainment domain controllers can be categorized into two types. Type I heat sources consist of modules or devices that generate significant heat and require active cooling with heatsinks. These include: System-on-Chip (SoC) chips, Power Management Integrated Circuits (PMICs) powering the SoC, external volatile memory (DDR) for the SoC, external non-volatile memory (UFS) for the SoC, power amplifier integrated circuits, and power modules. Type II heat sources are modules that generate considerable heat and may reach high temperatures under certain conditions, but generally do not require active cooling with heatsinks. These include: Microcontroller Units (MCUs), serializers, and deserializers.

[0003] In related technologies, fans are often used to cool domain controllers. However, due to improper fan control, the fans may repeatedly start and stop working under certain operating conditions, which affects the lifespan of the fans and the performance of the domain controller. Summary of the Invention

[0004] In view of this, the present invention provides a domain controller heat dissipation method, apparatus, electronic device and storage medium to solve the problem that the operation of existing fans is affected by temperature changes and has poor operational stability.

[0005] In a first aspect, the present invention provides a domain controller heat dissipation method, the method comprising:

[0006] Set the target cooling temperature for the domain controller and collect the current temperature of the domain controller;

[0007] Based on the target heat dissipation temperature, a hysteresis interval is set. The lowest temperature of the hysteresis interval is lower than the target heat dissipation temperature, and the highest temperature of the hysteresis interval is higher than the target heat dissipation temperature.

[0008] Determine whether the current temperature is between the target heat dissipation temperature and the highest temperature in the hysteresis range;

[0009] When the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, the heat dissipation device of the control domain controller operates at the first heat dissipation power until the current temperature of the domain controller is lower than the lowest temperature of the hysteresis interval, at which point the heat dissipation device is shut down.

[0010] In this invention, by establishing a correspondence between the operating temperature of the heat dissipation device and the zone temperature, heat dissipation requirements are met while preventing the heat dissipation device from operating for extended periods, thus extending its lifespan. By setting a hysteresis range based on temperature, the thermal instability of the domain controller caused by the heat dissipation device repeatedly cycling between starting and stopping is avoided, significantly improving the stability of the heat dissipation device's operation, further enhancing the performance of the domain controller, and improving the user experience.

[0011] In one alternative implementation, if the current temperature is not between the target heat dissipation temperature and the highest temperature of the hysteresis interval, it is determined whether the current temperature is higher than the highest temperature of the hysteresis interval.

[0012] When the current temperature is higher than the highest temperature in the hysteresis interval, the heat dissipation power of the heat dissipation device is adjusted based on the current temperature until the current temperature is between the target heat dissipation temperature and the highest temperature in the hysteresis interval. Then, the heat dissipation device of the control domain controller is returned to the first heat dissipation power operation step.

[0013] In this method, when the temperature is higher than the highest temperature in the hysteresis range, the heat dissipation is accelerated due to the activation of the heat dissipation equipment. After the temperature drops to the highest temperature in the hysteresis range, according to the above control method, the power of the heat dissipation equipment will be rapidly reduced according to the temperature drop, which will cause the domain controller temperature to be unstable. In order to avoid the situation where the power of the heat dissipation equipment fluctuates, the power of the heat dissipation equipment is adjusted so that when the temperature drops to within the hysteresis range, the power of the heat dissipation equipment maintains the first heat dissipation power.

[0014] In an alternative implementation, when the current temperature is higher than the highest temperature in the hysteresis range, the method further includes:

[0015] Determine whether the current temperature is higher than the first preset temperature threshold, which is the lowest temperature threshold corresponding to the highest heat dissipation power of the heat dissipation device.

[0016] When the current temperature is higher than the first preset temperature threshold, the heat dissipation device is controlled to operate at the highest heat dissipation power until the current temperature reaches the highest temperature of the hysteresis range.

[0017] In this method, once the temperature reaches the preset temperature threshold, the cooling device is controlled to operate at its maximum cooling power to cool the domain controller, ensuring that the domain controller is always in a good thermal operating environment. When the temperature drops to the highest temperature in the hysteresis range, the power of the cooling device is slowly adjusted to avoid the cooling device from working for a long time and further extend the service life of the cooling device.

[0018] In one alternative implementation, the heat dissipation device is a fan;

[0019] The cooling system of the control domain controller operates at a first cooling power, including:

[0020] Adjust the duty cycle of the fan speed to control the fan to run at the first speed, which is the speed corresponding to the first heat dissipation power;

[0021] Based on the current temperature, adjust the heat dissipation power of the heat dissipation device, including:

[0022] Based on the current temperature, determine the target duty cycle of the fan speed corresponding to the current temperature, and control the fan to run at the speed corresponding to the target duty cycle.

[0023] In this method, cooling is achieved by using a fan, which is low-cost, simple to control, and easy to cool down the domain controller.

[0024] In one alternative implementation, the method further includes:

[0025] The speed error is calculated based on the speed feedback signal returned by the fan.

[0026] Set the speed error threshold;

[0027] The current state of the fan is determined based on the speed error and the speed error threshold.

[0028] In this approach, by diagnosing the fan and determining its current operating status, it is possible to promptly identify any fan malfunctions, thereby extending the fan's lifespan and improving the reliability of thermal management for the domain controller.

[0029] In one optional implementation, determining the current state of the fan based on the speed error and a speed error threshold includes:

[0030] When the speed error is less than the speed error threshold, the fan is considered to be operating normally.

[0031] When the speed error exceeds the speed error threshold, determine the fan harness positioning;

[0032] When the speed feedback signal is 0, it indicates that the fan is either stalled or open-circuited.

[0033] In this method, by comparing the fan speed with the error threshold, it is easier to identify fan faults, ensure that the fan is repaired in a timely manner, and further extend the fan's service life.

[0034] In one alternative implementation, the method further includes:

[0035] When an increase in heat source workload is detected in the domain controller, determine whether the cooling device should be activated;

[0036] Increase the heat dissipation power of the heat dissipation equipment when it is started;

[0037] Turn on the cooling system when it is not running.

[0038] In this approach, by preemptively cooling the domain controller when the workload of the heat source increases, a good thermal operating environment is ensured, further improving the performance of the domain controller and enhancing the user experience.

[0039] In a second aspect, the present invention provides a domain controller heat dissipation device, the device comprising:

[0040] The temperature acquisition module is used to set the target heat dissipation temperature of the domain controller and acquire the current temperature of the domain controller;

[0041] The hysteresis interval setting module is used to set the hysteresis interval based on the target heat dissipation temperature. The minimum temperature of the hysteresis interval is lower than the target heat dissipation temperature, and the maximum temperature of the hysteresis interval is higher than the target heat dissipation temperature.

[0042] The temperature judgment module is used to determine whether the current temperature is between the target heat dissipation temperature and the highest temperature in the hysteresis range;

[0043] The heat dissipation power adjustment module is used to control the heat dissipation equipment of the domain controller to operate at the first heat dissipation power when the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, until the current temperature of the domain controller is lower than the lowest temperature of the hysteresis interval, and then control the heat dissipation equipment to stop.

[0044] Thirdly, the present invention provides an electronic device, comprising: a memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the computer instructions to perform the domain controller heat dissipation method of the first aspect or any corresponding embodiment described above.

[0045] Fourthly, the present invention provides a computer-readable storage medium storing computer instructions for causing a computer to execute the domain controller heat dissipation method of the first aspect or any corresponding embodiment thereof. Attached Figure Description

[0046] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0047] Figure 1 This is a schematic flowchart of a domain controller heat dissipation method according to an embodiment of the present invention.

[0048] Figure 2 This is a schematic diagram showing the distribution of the main heat sources of the domain controller host according to an embodiment of the present invention.

[0049] Figure 3 This is a schematic flowchart of another domain controller heat dissipation method according to an embodiment of the present invention.

[0050] Figure 4 This is a schematic flowchart of another domain controller heat dissipation method according to an embodiment of the present invention.

[0051] Figure 5 This is a schematic diagram of the connection relationship of a diagnostic circuit according to an embodiment of the present invention.

[0052] Figure 6 This is a structural block diagram of a domain controller heat dissipation device according to an embodiment of the present invention.

[0053] Figure 7 This is a schematic diagram of the hardware structure of an electronic device according to an embodiment of the present invention. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0055] In related technologies, due to unreasonable fan control, the fan may repeatedly start and stop working under certain operating conditions, which affects the lifespan of the fan and the performance of the domain controller.

[0056] To address the aforementioned problems, this invention provides a domain controller heat dissipation method for use in electronic devices. It should be noted that the executing entity can be a domain controller heat dissipation device, which can be implemented as part or all of the electronic device through software, hardware, or a combination of both. The electronic device can be a terminal, client, or server. The server can be a single server or a server cluster composed of multiple servers. In this embodiment, the terminal can be a smartphone, personal computer, tablet computer, or other smart hardware device. The following method embodiments all use an electronic device as the executing entity for illustration.

[0057] The electronic device in this embodiment is suitable for vehicle domain controllers employing active cooling methods, utilizing fans for heat dissipation. The domain controller cooling method provided by this invention establishes a correspondence between the operating temperature of the cooling device and the zone temperature, meeting cooling requirements while avoiding prolonged operation of the cooling device and extending its lifespan. By setting a hysteresis range based on temperature, it prevents the cooling device from repeatedly cycling between starting and stopping, thus avoiding thermal instability in the domain controller. This significantly improves the stability of the cooling device's operation, further enhancing the domain controller's performance and improving the user experience.

[0058] According to an embodiment of the present invention, a method for cooling a domain controller is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0059] This embodiment provides a domain controller heat dissipation method, which can be used in the aforementioned electronic devices. Figure 1 This is a flowchart of a domain controller heat dissipation method according to an embodiment of the present invention, such as... Figure 1 As shown, the process includes the following steps:

[0060] Step S101: Set the target heat dissipation temperature of the domain controller and collect the current temperature of the domain controller.

[0061] In one example, Figure 2 This is a schematic diagram showing the distribution of the main heat sources of the domain controller host according to an embodiment of the present invention. Figure 2As shown, the active heat dissipation method of the domain controller uses a fan for heat dissipation. Most of a type of heat dissipation device is covered by the air duct and is in close contact with the metal housing through thermal conductive glue, and the fan is located above the air duct. In the domain controller host, a type of heat source includes: SOC module (including PMIC / DDR), UFS, power amplifier IC, and power module. A second type of heat source includes MCU, serializer, and deserializer. The dots indicate the arrangement positions of the temperature sensors to accurately collect the temperatures of each heat zone. The temperatures are uniformly summarized to the MCU, and the MCU controls the fan speed.

[0062] Step S102, set a hysteresis interval based on the target heat dissipation temperature.

[0063] In the embodiment of the present invention, the lowest temperature of the hysteresis interval is lower than the target heat dissipation temperature, and the highest temperature of the hysteresis interval is higher than the target heat dissipation temperature.

[0064] In an example, when the target heat dissipation temperature is A degrees Celsius, set the hysteresis interval as T0 - B degrees Celsius, where T0 is the lowest temperature of the hysteresis interval, B is the highest temperature of the hysteresis interval, and T0 < A < B.

[0065] Step S103, determine whether the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval.

[0066] In an example, the MCU detects the temperatures of each temperature zone to determine the range where the current domain controller temperature is located.

[0067] Step S104, when the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, control the heat dissipation device of the domain controller to operate at the first heat dissipation power until the current temperature of the domain controller is lower than the lowest temperature of the hysteresis interval, and then control the heat dissipation device to stop.

[0068] In an example, when the MCU detects that the temperatures of each heat zone reach A - B degrees Celsius, control the fan speed to be A1%, and until the domain controller temperature is lower than T0 degrees Celsius, control the fan to stop.

[0069] In an implementation scenario, when the MCU detects that the temperatures of each heat zone reach A - B degrees Celsius, control the fan speed to be A1%; when the MCU detects that the temperatures of each temperature zone reach B - C degrees Celsius, control the fan speed to be B1%; when the MCU detects that the temperatures of each temperature zone reach above C degrees Celsius, control the fan speed to be C1%; where A < B < C. When A = 85°C, B = 90°C, and C = 95°C, when the controller temperature gradually rises and is lower than 85 degrees Celsius, the fan is not turned on; when it is between 85 - 95 degrees Celsius, the fan speed is 1800 revolutions / MIN (the full speed is 3600, and at this time it is 50% speed), and when the temperature is above 95 degrees Celsius, the fan rotates at full speed of 3600 revolutions.

[0070] A hysteresis interval T0 is set: when the temperature rises to B, the corresponding fan speed is B1%; when the temperature drops back to B-T0, the fan speed is controlled to return to A1. At T0 = 80℃, when the controller rises to 85℃, the fan will turn on according to the strategy. Because the fan is on, heat dissipation is accelerated, which may cause the temperature to drop below 85℃, at which point the fan will stop. Without a hysteresis interval, the fan will repeatedly cycle between turning on and off, resulting in thermal instability of the product. Similarly, when the temperature rises to 95℃, the fan speed will also fluctuate. To solve these problems, the strategy is optimized: the temperature rise process is controlled according to the above steps; when the temperature drops, it is handled at 1800 RPM for 80-90℃ and 3600 RPM for above 90℃. The 5℃ difference between the temperature rise and fall control constitutes the hysteresis interval.

[0071] The domain controller heat dissipation method provided in this embodiment establishes a correspondence between the operating temperature of the heat dissipation device and the zone temperature. This satisfies heat dissipation requirements while preventing the heat dissipation device from operating for extended periods, thus extending its lifespan. By setting a hysteresis range based on temperature, the thermal instability of the domain controller caused by the heat dissipation device repeatedly cycling between starting and stopping is avoided. This significantly improves the stability of the heat dissipation device, further enhancing the performance of the domain controller and improving the user experience.

[0072] This embodiment provides a domain controller heat dissipation method, which can be used in the aforementioned electronic devices. Figure 3 This is a flowchart of another domain controller heat dissipation method according to an embodiment of the present invention, such as... Figure 3 As shown, the process includes the following steps:

[0073] Step S301: Set the target heat dissipation temperature for the domain controller and acquire the current temperature of the domain controller. For details, please refer to [link to relevant documentation]. Figure 1 Step S101 of the illustrated embodiment will not be described again here.

[0074] Step S302: Based on the target heat dissipation temperature, a hysteresis interval is set, where the lowest temperature of the hysteresis interval is lower than the target heat dissipation temperature and the highest temperature of the hysteresis interval is higher than the target heat dissipation temperature.

[0075] Step S303: Determine whether the current temperature is between the target heat dissipation temperature and the highest temperature in the hysteresis range. For details, please refer to [link to relevant documentation]. Figure 1 Step S103 of the illustrated embodiment will not be described again here.

[0076] Step S304: When the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, the cooling device of the control domain controller operates at the first heat dissipation power until the current temperature of the domain controller is lower than the lowest temperature of the hysteresis interval, at which point the cooling device is shut down. For details, please refer to [link to relevant documentation]. Figure 1 Step S104 of the illustrated embodiment will not be described again here.

[0077] Specifically, the heat dissipation device is a fan.

[0078] The cooling system of the control domain controller operates at a first cooling power, including:

[0079] Step S3041: Adjust the duty cycle of the fan speed to control the fan to run at a first speed. Here, the first speed is the speed corresponding to the first cooling power.

[0080] In one example, the fan speed is set to full speed N = 3600 (full speed) * the duty cycle of the PWM control signal. Taking a target cooling temperature of 85 degrees Celsius as an example, the hysteresis range is set to have a 5-degree Celsius difference between the temperature rise and fall based on the target cooling temperature, i.e., the hysteresis range is 80-90 degrees Celsius. When the current temperature is between 85 and 90 degrees Celsius, the fan is controlled to run at the first speed, which is 1800 rpm (full speed is 3600 rpm, at 50% speed), corresponding to a duty cycle of 50%.

[0081] In this method, when the temperature exceeds the maximum temperature of the hysteresis range, the cooling device is activated, accelerating heat dissipation. Once the temperature drops to the maximum temperature of the hysteresis range, the cooling device power is rapidly reduced according to the control method described above, leading to domain controller temperature instability. To avoid such fluctuations in cooling device power, the power is adjusted to maintain the initial cooling capacity once the temperature falls within the hysteresis range. After reaching a preset temperature threshold, the cooling device operates at its maximum cooling capacity to cool the domain controller, ensuring it operates in a favorable thermal environment. As the temperature drops to the maximum temperature of the hysteresis range, the cooling device power is adjusted slowly to prevent prolonged operation and extend its lifespan. Using a fan for cooling is cost-effective, simple to control, and facilitates cooling of the domain controller.

[0082] Specifically, after step S304 above, the domain controller heat dissipation method further includes:

[0083] Step S305: When the current temperature is not between the target heat dissipation temperature and the highest temperature of the hysteresis interval, determine whether the current temperature is higher than the highest temperature of the hysteresis interval.

[0084] Step S306: When the current temperature is higher than the highest temperature in the hysteresis interval, adjust the heat dissipation power of the heat dissipation device based on the current temperature until the current temperature is between the target heat dissipation temperature and the highest temperature in the hysteresis interval, and return the heat dissipation device of the control domain controller to run at the first heat dissipation power.

[0085] In this method, when the temperature is higher than the highest temperature in the hysteresis range, the heat dissipation is accelerated due to the activation of the heat dissipation equipment. After the temperature drops to the highest temperature in the hysteresis range, according to the above control method, the power of the heat dissipation equipment will be rapidly reduced according to the temperature drop, which will cause the domain controller temperature to be unstable. In order to avoid the situation where the power of the heat dissipation equipment fluctuates, the power of the heat dissipation equipment is adjusted so that when the temperature drops to within the hysteresis range, the power of the heat dissipation equipment maintains the first heat dissipation power.

[0086] Specifically, step S306 includes:

[0087] Step S3061: Determine whether the current temperature is higher than the first preset temperature threshold, where the first preset temperature threshold is the lowest temperature threshold corresponding to the highest heat dissipation power of the heat dissipation device.

[0088] Step S3062: When the current temperature is higher than the first preset temperature threshold, control the heat dissipation device to operate at the highest heat dissipation power until the current temperature reaches the highest temperature of the hysteresis range.

[0089] In some alternative implementations, the heat dissipation power of the heat dissipation device is adjusted based on the current temperature, including:

[0090] Step a1: Based on the current temperature, determine the target duty cycle of the fan speed corresponding to the current temperature, and control the fan to run at the speed corresponding to the target duty cycle.

[0091] In one example, when the controller temperature gradually rises below 85 degrees Celsius, the fan does not turn on; when the temperature is between 85 and 95 degrees Celsius, the fan speed is 1800 rpm (full speed is 3600 rpm, at 50% speed); when the temperature is above 95 degrees Celsius, the fan runs at full speed of 3600 rpm.

[0092] When the controller temperature rises to 85 degrees Celsius, the strategy will activate the fan. The increased cooling from the fan may cause the temperature to drop below 85 degrees Celsius, at which point the fan will stop. Without a hysteresis interval, the fan will cycle between running and not running, resulting in thermal instability. Similarly, when the temperature rises to 95 degrees Celsius, the fan speed will fluctuate. To address these issues, the strategy is optimized: the temperature rise process is controlled as described in 1); during temperature drops, the speed is 1800 RPM for 80-90 degrees Celsius and 3600 RPM for temperatures above 90 degrees Celsius. The 5-degree Celsius difference between the temperature rise and fall is the hysteresis interval.

[0093] In this method, when the temperature exceeds the maximum temperature of the hysteresis range, the cooling device activates, accelerating heat dissipation. Once the temperature drops to the maximum temperature of the hysteresis range, the cooling device power is rapidly reduced according to the control method described above, leading to unstable domain controller temperature. To avoid such fluctuations in cooling device power, the power is adjusted to ensure that the cooling device maintains its initial cooling capacity once the temperature falls within the hysteresis range. Using a fan for cooling is cost-effective, simple to control, and facilitates effective cooling of the domain controller.

[0094] Step S307: When an increase in the workload of the heat source in the domain controller is detected, determine whether the heat dissipation device should be started.

[0095] Step S308: When the heat dissipation device is started, increase the heat dissipation power of the heat dissipation device.

[0096] Step S309: Turn on the cooling device when it is not running.

[0097] In one example, the fan speed is proactively adjusted based on the workload of the heat source. For instance, when the car volume is adjusted to X%, since it's foreseeable that the increased amplifier volume will significantly increase heat, the MCU still controls the fan speed to increase by X1%, even if the temperature hasn't reached a specific point. The SOC's load rate is monitored in real-time and can be periodically reported to the MCU. When playing audio, the percentage of the adjusted volume bar or value can be understood as the amplifier's load rate; this information can be periodically transmitted from the SOC to the MCU. Upon receiving this information, the MCU controls the fan speed to increase by adjusting the duty cycle of the fan control PWM signal. The relationship between speed and workload needs to be calibrated through thermal testing: for example, for every 10% increase in the SOC or amplifier load rate, the fan speed increases by 100 RPM.

[0098] Specifically, taking a temperature of 87℃ and a fan speed of 1800 RPM as an example, when the driver plays USB audio, the power amplifier needs to work to play the audio file, resulting in a significant increase in heat generation. This heat generation is directly proportional to the volume. The MCU recognizes that the audio playback volume is 50%, and even if the temperature hasn't reached 95℃, it can increase the fan speed by 500 RPM to 2300 RPM to cope with the impending increase in heat, thus ensuring a good thermal operating environment for the power amplifier.

[0099] In this approach, by preemptively cooling the domain controller when the workload of the heat source increases, a good thermal operating environment is ensured, further improving the performance of the domain controller and enhancing the user experience.

[0100] The domain controller cooling method provided in this embodiment accelerates heat dissipation when the temperature exceeds the maximum temperature of the hysteresis range by activating the cooling device. As the temperature drops below the maximum hysteresis range, the cooling device power is rapidly reduced according to the aforementioned control method. This can lead to temperature instability in the domain controller. To prevent such fluctuations, the cooling device power is adjusted to maintain its initial cooling capacity once the temperature falls within the hysteresis range. Once the temperature reaches a preset threshold, the cooling device operates at its maximum cooling capacity to cool the domain controller, ensuring it remains in a favorable thermal environment. Slowly adjusting the cooling device power as the temperature drops below the maximum hysteresis range prevents prolonged operation and extends its lifespan. Using a fan for cooling is cost-effective, simple to control, and facilitates domain controller cooling. By proactively cooling the domain controller when the heat source workload increases, a favorable thermal environment is ensured, further improving its performance and user experience.

[0101] This embodiment provides a domain controller heat dissipation method, which can be used in the aforementioned electronic devices. Figure 4 This is a flowchart of another domain controller heat dissipation method according to an embodiment of the present invention, such as... Figure 4 As shown, the process includes the following steps:

[0102] Step S401: Set the target heat dissipation temperature for the domain controller and acquire the current temperature of the domain controller. For details, please refer to [link to relevant documentation]. Figure 3 Step S301 of the illustrated embodiment will not be described again here.

[0103] Step S402: Based on the target heat dissipation temperature, set a hysteresis range. The lowest temperature of the hysteresis range is lower than the target heat dissipation temperature, and the highest temperature of the hysteresis range is higher than the target heat dissipation temperature. For details, please refer to [link to relevant documentation]. Figure 3 Step S302 of the illustrated embodiment will not be described again here.

[0104] Step S403: Determine whether the current temperature is between the target heat dissipation temperature and the highest temperature in the hysteresis range. For details, please refer to [link to relevant documentation]. Figure 3 Step S303 of the illustrated embodiment will not be described again here.

[0105] In step S404, when the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, the heat dissipation device of the control domain controller is operated at the first heat dissipation power until the current temperature of the domain controller is lower than the lowest temperature of the hysteresis interval, and the heat dissipation device is shut down.

[0106] Specifically, after step S404 above, the domain controller heat dissipation method further includes:

[0107] Step S405: Calculate the speed error based on the speed feedback signal returned by the fan.

[0108] Step S406: Set the rotational speed error threshold.

[0109] Step S407: Determine the current state of the fan based on the speed error and the speed error threshold.

[0110] Specifically, step S407 above includes:

[0111] Step S4071: When the speed error is less than the speed error threshold, determine that the fan is working normally.

[0112] Step S4072: When the speed error is greater than the speed error threshold, determine the fan harness positioning.

[0113] Step S4073: When the speed feedback signal is 0, determine whether the fan is stalled or open-circuited.

[0114] In one example, the fan is powered and controlled by a domain controller. The power supply is 12V, the control signal is a PWM waveform, and the fan speed is the full speed N = 3600 (full speed) * the duty cycle of the control signal PWM. At the same time, the fan provides a feedback signal, the frequency f of which has a certain proportional relationship with the actual speed, N = 2f.

[0115] Figure 5 This is a schematic diagram of the connection relationship of a diagnostic circuit according to an embodiment of the present invention. Figure 5 As shown, a diagnostic circuit is used to convert and transmit the speed drive signal and the speed feedback signal. The diagnostic circuit is existing technology and is used only as an example in this embodiment of the invention, without limitation. MCU_FAN_PWM is the PWM interface of the MCU, outputting a fan drive waveform of approximately 25kHz; the speed is adjusted by the duty cycle. MCU_FAN_TACH is the PWM interface of the MCU, receiving the fan speed feedback signal; the frequency information includes the fan speed information. The MCU forms a diagnostic strategy based on the comparison between the drive signal and the feedback signal.

[0116] The control speed information and feedback speed information identified by MCU_FAN_PWM and MCU_FAN_TACH are as follows:

[0117] 1) The fan works normally within a certain speed error of 10%;

[0118] 2) When the feedback speed is more than 10% slower than the control speed, it is identified as a wiring harness jamming.

[0119] 3) When there is a speed control signal but the returned speed signal is 0, it is identified as a fan stall or open circuit;

[0120] Common fan malfunctions include open circuit (connector not properly connected), jamming (blocked by wiring harness or foreign object, but still able to rotate), and stalled (severe jamming, the fan does not rotate at all). When there is an open circuit or stall, the fan will not rotate, i.e., the speed will be 0, which can be used to diagnose the current status of the fan. After identifying the fault, the MCU can report the corresponding fault and shut down the fan.

[0121] The domain controller heat dissipation method provided in this embodiment diagnoses the fan to determine its current operating status, enabling timely detection of fan malfunctions and extending fan lifespan, thereby improving the reliability of heat dissipation management for the domain controller. By comparing the fan speed with an error threshold, fan faults can be identified more easily, ensuring timely fan repair and further extending fan lifespan.

[0122] This embodiment also provides a domain controller heat dissipation device, which is used to implement the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, hardware implementations, or a combination of software and hardware, are also possible and contemplated.

[0123] This embodiment provides a domain controller heat dissipation device, such as... Figure 6 As shown, it includes:

[0124] Temperature acquisition module 601 is used to set the target heat dissipation temperature of the domain controller and to acquire the current temperature of the domain controller. For details, please refer to [link to relevant documentation]. Figure 1 Step S101 of the illustrated embodiment will not be described again here.

[0125] The hysteresis interval setting module 602 is used to set a hysteresis interval based on the target heat dissipation temperature. The minimum temperature of the hysteresis interval is lower than the target heat dissipation temperature, and the maximum temperature of the hysteresis interval is higher than the target heat dissipation temperature. For details, please refer to [link to details]. Figure 1 Step S102 of the illustrated embodiment will not be described again here.

[0126] The heat dissipation power adjustment module 604 is used to control the domain controller's heat dissipation equipment to operate at a first heat dissipation power when the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, until the current temperature of the domain controller falls below the lowest temperature of the hysteresis interval, at which point the heat dissipation equipment is shut down. The temperature judgment module 603 is used to determine whether the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval. For details, please refer to [link to relevant documentation]. Figure 1 Step S103 of the illustrated embodiment will not be described again here.

[0127] Please see details Figure 1Step S104 of the illustrated embodiment will not be described again here.

[0128] In some alternative implementations, the domain controller cooling system further includes:

[0129] The first temperature judgment unit is used to determine whether the current temperature is higher than the highest temperature of the hysteresis interval when the current temperature is not between the target heat dissipation temperature and the highest temperature of the hysteresis interval.

[0130] The first power adjustment unit is used to adjust the heat dissipation power of the heat dissipation device based on the current temperature when the current temperature is higher than the highest temperature of the hysteresis interval, until the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, and then return the heat dissipation device of the control domain controller to the first heat dissipation power operation step.

[0131] In some alternative implementations, the domain controller cooling system further includes:

[0132] The second temperature judgment unit is used to determine whether the current temperature is higher than the first preset temperature threshold, which is the lowest temperature threshold corresponding to the highest heat dissipation power of the heat dissipation device.

[0133] The second power adjustment unit is used to control the heat dissipation device to operate at the highest heat dissipation power when the current temperature is higher than the first preset temperature threshold, until the current temperature reaches the highest temperature of the hysteresis range.

[0134] In some alternative implementations, the heat dissipation device is a fan.

[0135] The heat dissipation power adjustment module 604 includes:

[0136] The first speed adjustment unit is used to adjust the duty cycle of the fan speed and control the fan to run at a first speed, which is the speed corresponding to the first heat dissipation power.

[0137] The first power adjustment unit includes:

[0138] The second speed adjustment unit is used to determine the target duty cycle of the fan speed corresponding to the current temperature based on the current temperature, and control the fan to run at the speed corresponding to the target duty cycle.

[0139] In some alternative implementations, the domain controller cooling system further includes:

[0140] The speed error calculation unit is used to calculate the speed error based on the speed feedback signal returned by the fan.

[0141] The speed error threshold setting unit is used to set the speed error threshold.

[0142] The fan status determination unit is used to determine the current status of the fan based on the speed error and the speed error threshold.

[0143] In some optional implementations, the fan state determination unit includes:

[0144] The normal confirmation subunit is used to determine that the fan is working normally when the speed error is less than the speed error threshold.

[0145] The positioning confirmation subunit is used to determine the fan harness positioning when the speed error is greater than the speed error threshold.

[0146] The stall / open circuit determination subunit is used to determine whether the fan is stalled or open circuit when the speed feedback signal is 0.

[0147] In some alternative implementations, the domain controller cooling system further includes:

[0148] The load increase judgment unit is used to determine whether the heat dissipation device should be started when the heat source workload in the domain controller is detected to increase.

[0149] The power boosting unit is used to increase the heat dissipation power of the heat dissipation device when it is started.

[0150] The device startup unit is used to turn on the heat dissipation device when it is not started.

[0151] Further functional descriptions of the above modules and units are the same as those in the corresponding embodiments described above, and will not be repeated here.

[0152] In this embodiment, the domain controller heat dissipation device is presented in the form of a functional unit. Here, a unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that execute one or more software or fixed programs, and / or other devices that can provide the above functions.

[0153] This invention also provides an electronic device having the above-described features. Figure 6 The domain controller heat dissipation device shown.

[0154] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of an electronic device provided in an optional embodiment of the present invention, such as... Figure 7As shown, the electronic device includes one or more processors 10, memory 20, and interfaces for connecting the components, including high-speed interfaces and low-speed interfaces. The components communicate with each other via different buses and can be mounted on a common motherboard or otherwise as required. The processors can process instructions executed within the electronic device, including instructions stored in or on memory to display graphical information of a GUI on external input / output devices (such as display devices coupled to the interfaces). In some alternative implementations, multiple processors and / or multiple buses can be used with multiple memories and multiple memory modules, if desired. Similarly, multiple electronic devices can be connected, each providing some of the necessary operations (e.g., as a server array, a group of blade servers, or a multiprocessor system). Figure 7 Take a processor 10 as an example.

[0155] Processor 10 may be a central processing unit, a network processor, or a combination thereof. Processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The programmable logic device may be a complex programmable logic device (CAMP), a field-programmable gate array (FPGA), a general-purpose array logic (GDA), or any combination thereof.

[0156] The memory 20 stores instructions executable by at least one processor 10 to cause the at least one processor 10 to perform the method shown in the above embodiments.

[0157] The memory 20 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the electronic device. Furthermore, the memory 20 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, the memory 20 may optionally include memory remotely located relative to the processor 10, and these remote memories may be connected to the electronic device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0158] The memory 20 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk or solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0159] The electronic device also includes a communication interface 30 for communicating with other devices or communication networks.

[0160] This invention also provides a computer-readable storage medium. The methods described above according to embodiments of the invention can be implemented in hardware or firmware, or implemented as computer code that can be recorded on a storage medium, or implemented as computer code downloaded via a network and originally stored on a remote storage medium or a non-transitory machine-readable storage medium and then stored on a local storage medium. Thus, the methods described herein can be processed by software stored on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. The storage medium can be a magnetic disk, optical disk, read-only memory, random access memory, flash memory, hard disk, or solid-state drive, etc.; further, the storage medium can also include combinations of the above types of memory. It is understood that computers, processors, microprocessor controllers, or programmable hardware include storage components capable of storing or receiving software or computer code, which, when accessed and executed by the computer, processor, or hardware, implements the methods shown in the above embodiments.

[0161] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A method for heat dissipation of a domain controller, characterized in that, The method includes: Set the target cooling temperature for the domain controller and collect the current temperature of the domain controller; Based on the target heat dissipation temperature, a hysteresis interval is set, wherein the lowest temperature of the hysteresis interval is lower than the target heat dissipation temperature, and the highest temperature of the hysteresis interval is higher than the target heat dissipation temperature. Determine whether the current temperature is between the target heat dissipation temperature and the highest temperature in the hysteresis range; When the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, the heat dissipation device of the domain controller is controlled to operate at the first heat dissipation power until the current temperature of the domain controller is lower than the lowest temperature of the hysteresis interval, and then the heat dissipation device is controlled to stop. If the current temperature is not between the target heat dissipation temperature and the highest temperature of the hysteresis interval, determine whether the current temperature is higher than the highest temperature of the hysteresis interval. When the current temperature is higher than the highest temperature of the hysteresis interval, the heat dissipation power of the heat dissipation device is adjusted based on the current temperature until the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, and the process of controlling the heat dissipation device of the domain controller to operate at the first heat dissipation power is resumed.

2. The method according to claim 1, characterized in that, When the current temperature is higher than the highest temperature in the hysteresis range, the method further includes: Determine whether the current temperature is higher than a first preset temperature threshold, where the first preset temperature threshold is the lowest temperature threshold corresponding to the highest heat dissipation power of the heat dissipation device. When the current temperature is higher than the first preset temperature threshold, the heat dissipation device is controlled to operate at the maximum heat dissipation power until the current temperature reaches the highest temperature of the hysteresis interval.

3. The method according to any one of claims 1 to 2, characterized in that, The heat dissipation device is a fan; The heat dissipation device controlling the domain controller to operate at a first heat dissipation power includes: The duty cycle of the fan speed is adjusted to control the fan to run at a first speed, which is the speed corresponding to the first heat dissipation power; Adjusting the heat dissipation power of the heat dissipation device based on the current temperature includes: Based on the current temperature, determine the target duty cycle of the fan speed corresponding to the current temperature, and control the fan to run at the speed corresponding to the target duty cycle.

4. The method according to claim 3, characterized in that, The method further includes: The speed error is calculated based on the speed feedback signal returned by the fan. Set the speed error threshold; The current state of the fan is determined based on the speed error and the speed error threshold.

5. The method according to claim 4, characterized in that, Determining the current state of the fan based on the speed error and the speed error threshold includes: When the speed error is less than the speed error threshold, the fan is determined to be operating normally. When the rotational speed error is greater than the rotational speed error threshold, the fan harness positioning is determined; When the speed feedback signal is 0, it is determined that the fan is either stalled or open-circuited.

6. The method according to claim 1, characterized in that, The method further includes: When an increase in the heat source workload is detected in the domain controller, it is determined whether the heat dissipation device should be activated. When the heat dissipation device is started, the heat dissipation power of the heat dissipation device is increased; Turn on the heat dissipation device when it is not in operation.

7. A domain controller heat dissipation device, characterized in that, The device includes: The temperature acquisition module is used to set the target heat dissipation temperature of the domain controller and acquire the current temperature of the domain controller; The hysteresis interval setting module is used to set a hysteresis interval based on the target heat dissipation temperature, wherein the lowest temperature of the hysteresis interval is lower than the target heat dissipation temperature, and the highest temperature of the hysteresis interval is higher than the target heat dissipation temperature. A temperature judgment module is used to determine whether the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval; The heat dissipation power adjustment module is used to control the heat dissipation device of the domain controller to operate at a first heat dissipation power when the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, until the current temperature of the domain controller is lower than the lowest temperature of the hysteresis interval, and then control the heat dissipation device to stop. If the current temperature is not between the target heat dissipation temperature and the highest temperature of the hysteresis interval, determine whether the current temperature is higher than the highest temperature of the hysteresis interval. When the current temperature is higher than the highest temperature of the hysteresis interval, the heat dissipation power of the heat dissipation device is adjusted based on the current temperature until the current temperature is between the target heat dissipation temperature and the highest temperature of the hysteresis interval, and the process of controlling the heat dissipation device of the domain controller to operate at the first heat dissipation power is resumed.

8. An electronic device, characterized in that, include: A memory and a processor are communicatively connected, the memory stores computer instructions, and the processor executes the computer instructions to perform the domain controller heat dissipation method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing the computer to perform the domain controller heat dissipation method according to any one of claims 1 to 6.

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