Air conditioning system

Abstract

The application discloses an air conditioning system. The air conditioning system comprises an indoor heat exchanger, an outdoor heat exchanger, an economizer and an electric control box, wherein the economizer is arranged between the indoor heat exchanger and the outdoor heat exchanger, the economizer comprises a heat exchange main body, the heat exchange main body comprises two first plate bodies and a second plate body clamped between the two first plate bodies, the first plate body is formed with a first microchannel for flowing a first refrigerant flow, and the second plate body is formed with a second microchannel for flowing a second refrigerant flow; the second refrigerant flow absorbs heat from the first refrigerant flow, so that the first refrigerant flow is supercooled; and the economizer is further arranged to dissipate heat for electronic elements in the electric control box, and the electronic elements are arranged in heat conduction connection with the first plate body. The economizer of the air conditioning system in the application can not only improve the supercooling degree, but also dissipate heat for the electric control box.

Description

[0001] This application is a divisional application of the applicant's patent application filed on February 8, 2021, entitled "Air Conditioning System" with application number 2021101830531. Technical Field

[0002] This application relates to the field of air conditioning technology, and in particular to an air conditioning system. Background Technology

[0003] The control box of an air conditioning unit typically contains electronic components. The heat generated by these components causes the temperature inside the control box to be high. If the control box is not cooled down in time, the electronic components inside will be damaged. Summary of the Invention

[0004] This application provides an air conditioning system to solve the problem of high temperature of electronic components in the control box in the prior art.

[0005] This application provides an air conditioning system including an indoor heat exchanger, an outdoor heat exchanger, an economizer, and an electrical control box. The economizer is disposed between the indoor and outdoor heat exchangers and includes a heat exchange body. The heat exchange body includes two first plates and a second plate sandwiched between the two first plates. The first plates form first microchannels for the flow of a first refrigerant, and the second plate forms second microchannels for the flow of a second refrigerant. The second refrigerant absorbs heat from the first refrigerant flow, thereby subcooling the first refrigerant flow. The economizer is further configured to dissipate heat from electronic components inside the electrical control box, and the electronic components are configured to be thermally connected to the first plates.

[0006] The beneficial effects of this application are as follows: In this application, the economizer is placed between the indoor and outdoor heat exchangers. The economizer adopts a microchannel structure, which can improve subcooling and thus improve the heat exchange efficiency of the air conditioning system. Furthermore, because the economizer adopts a microchannel structure, its volume can be effectively reduced, allowing it to be attached to the electrical control box. The second plate is sandwiched between the two first plates, allowing the second refrigerant flow on the second plate to simultaneously absorb heat from the first refrigerant flow on the two first plates, increasing the subcooling area. The plate-shaped arrangement makes the heat exchange body easy to install and ensures sufficient heat dissipation contact area. Simultaneously, the first plate is used for thermally conductive connection with the electronic components inside the electrical control box, further ensuring better heat dissipation.

[0007] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this application. Attached Figure Description

[0008] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with this application and, together with the specification, serve to explain the technical solutions of this application.

[0009] Figure 1 This is a schematic block diagram of an embodiment of the air conditioning system of this application;

[0010] Figure 2 This is a schematic block diagram of another embodiment of the air conditioning system of this application;

[0011] Figure 3 This is a schematic block diagram of another embodiment of the air conditioning system of this application;

[0012] Figure 4 This is a schematic block diagram of another embodiment of the air conditioning system of this application;

[0013] Figure 5 This is a schematic diagram of the structure of one embodiment of the heat exchanger body of the heat exchanger in this application;

[0014] Figure 6 This is a schematic diagram of another embodiment of the heat exchanger body of the heat exchanger in this application;

[0015] Figure 7 This is a schematic diagram of the structure of another embodiment of the heat exchanger body of the heat exchanger of this application;

[0016] Figure 8 This is a schematic diagram of the structure of an embodiment of the heat exchanger body and manifold assembly of the heat exchanger of this application;

[0017] Figure 9 This is a schematic diagram of another embodiment of the heat exchanger body and manifold assembly of the heat exchanger of this application;

[0018] Figure 10 This is a schematic diagram of another embodiment of the heat exchanger body and manifold assembly of the heat exchanger of this application;

[0019] Figure 11 This is a schematic diagram of another embodiment of the heat exchanger body and manifold assembly of the heat exchanger of this application;

[0020] Figure 12 This is a schematic diagram of another embodiment of the heat exchanger body of the heat exchanger in this application;

[0021] Figure 13 This is a schematic diagram of another embodiment of the heat exchanger body and manifold assembly of the heat exchanger of this application;

[0022] Figure 14 This is a schematic diagram of another embodiment of the heat exchanger body and manifold assembly of the heat exchanger of this application;

[0023] Figure 15 This is a schematic diagram of another embodiment of the heat exchanger body of the heat exchanger in this application;

[0024] Figure 16 yes Figure 15 A three-dimensional structural diagram of the first tube body with a planar surface;

[0025] Figure 17 This is a schematic diagram of another embodiment of the heat exchanger body of the heat exchanger in this application;

[0026] Figure 18 This is a schematic diagram of another embodiment of the heat exchanger body and manifold assembly of the heat exchanger of this application;

[0027] Figure 19 This is a schematic diagram of another embodiment of the heat exchanger body of the heat exchanger in this application;

[0028] Figure 20 yes Figure 19 A schematic flow diagram of an embodiment of a method for manufacturing a heat exchanger;

[0029] Figure 21 This is a schematic diagram of another embodiment of the heat exchanger body and manifold assembly of the heat exchanger of this application;

[0030] Figure 22 yes Figure 21 A schematic diagram of the structure of one embodiment of the manifold;

[0031] Figure 23 This is a schematic diagram of another embodiment of the heat exchanger of this application;

[0032] Figure 24 yes Figure 23 Enlarged cross-section diagram at point B in circle B;

[0033] Figure 25 yes Figure 23 A schematic diagram of the structure of a heat dissipation fin in one embodiment;

[0034] Figure 26 yes Figure 23 A schematic diagram of another embodiment of the heat dissipation fins;

[0035] Figure 27 This is a three-dimensional structural diagram of an embodiment of the electrical control box of this application with some components hidden;

[0036] Figure 28 yes Figure 27 A three-dimensional structural diagram of an embodiment of the heat sink;

[0037] Figure 29 yes Figure 27A three-dimensional structural diagram of another embodiment of the heat sink;

[0038] Figure 30 This is a three-dimensional structural diagram of an embodiment of the heat dissipation fixing plate and heat sink of this application;

[0039] Figure 31 yes Figure 30 A schematic diagram of the planar structure of one embodiment of the heat dissipation fixing plate;

[0040] Figure 32 This is a cross-sectional view of another embodiment of the heat sink and electrical control box of this application;

[0041] Figure 33 This is a cross-sectional view of another embodiment of the heat sink and electrical control box of this application;

[0042] Figure 34 This is a schematic diagram of the planar structure of the heat sink and the electrical control box in another embodiment of this application;

[0043] Figure 35 This is a cross-sectional view of another embodiment of the heat sink and electrical control box in this application;

[0044] Figure 36 yes Figure 35 A schematic diagram of the structure of one embodiment of the guide vane;

[0045] Figure 37 yes Figure 35 A schematic diagram of another embodiment of the guide vane in the diagram;

[0046] Figure 38 yes Figure 35 A schematic diagram of another embodiment of the guide vane in the diagram;

[0047] Figure 39 This is a schematic diagram of the planar structure of the heat sink and the electrical control box in another embodiment of this application;

[0048] Figure 40 yes Figure 39 A cross-sectional view of the heat sink and the electrical control box in the middle;

[0049] Figure 41 This is a cross-sectional view of the heat sink and the electrical control box in another embodiment of this application;

[0050] Figure 42 This is a three-dimensional structural diagram of the electrical control box with some components hidden in another embodiment of this application;

[0051] Figure 43 This is a three-dimensional structural diagram of the electrical control box with some components hidden in another embodiment of this application;

[0052] Figure 44 This is a schematic diagram of the planar structure of the electrical control box with some components hidden in another embodiment of this application;

[0053] Figure 45 yes Figure 44 Cross-sectional view of the electrical control box in the middle

[0054] Figure 46 This is a schematic diagram of another embodiment of the air conditioning system of this application;

[0055] Figure 47 yes Figure 46 A schematic diagram of the internal structure of the air conditioning system after the casing has been removed.

[0056] Figure 48 yes Figure 46 A schematic diagram of the structure of a drainage sleeve in one embodiment;

[0057] Figure 49 yes Figure 46 A schematic diagram of another embodiment of the drainage sleeve;

[0058] Figure 50 yes Figure 46 A cross-sectional view of the air conditioning system along the AA direction. Detailed Implementation

[0059] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0060] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0061] Please see Figure 1 , Figure 1 This is a schematic block diagram of an air conditioning system according to an embodiment of this application. Figure 1As shown, the air conditioning system 1 mainly includes a compressor 2, a four-way valve 3, an outdoor heat exchanger 4, an indoor heat exchanger 5, a heat exchanger 6, an expansion valve 12, and an expansion valve 13. The expansion valve 13 and the heat exchanger 6 are located between the outdoor heat exchanger 4 and the indoor heat exchanger 5. The compressor 2 provides a circulating refrigerant flow between the outdoor heat exchanger 4 and the indoor heat exchanger 5 through the four-way valve 3.

[0062] The heat exchanger 6 includes a first heat exchange channel 610 and a second heat exchange channel 611. The first end of the first heat exchange channel 610 is connected to the outdoor heat exchanger 4 via an expansion valve 13, and the second end of the first heat exchange channel 610 is connected to the indoor heat exchanger 5. The first end of the second heat exchange channel 611 is connected to the second end of the first heat exchange channel 610 via an expansion valve 12, and the second end of the second heat exchange channel 611 is connected to the suction port 22 of the compressor 2.

[0063] When air conditioning system 1 is in cooling mode, the refrigerant flow path is as follows:

[0064] The compressor 2's exhaust port 21 - the connection port 31 of the four-way valve 3 - the connection port 32 of the four-way valve 3 - the outdoor heat exchanger 4 - the heat exchanger 6 - the indoor heat exchanger 5 - the connection port 33 of the four-way valve 3 - the connection port 34 of the four-way valve 3 - the compressor 2's suction port 22.

[0065] The refrigerant flow path (main path) of the first heat exchange channel 610 is: first end of the first heat exchange channel 610 - second end of the first heat exchange channel 610 - indoor heat exchanger 5. The refrigerant flow path (auxiliary path) of the second heat exchange channel 611 is: second end of the first heat exchange channel 610 - expansion valve 12 - first end of the second heat exchange channel 611 - second end of the second heat exchange channel 611 - suction port 22 of compressor 2.

[0066] For example, the working principle of the air conditioning system at this time is as follows: the outdoor heat exchanger 4 acts as a condenser, and it outputs a medium-pressure, medium-temperature refrigerant flow (temperature can be 40°C, liquid phase refrigerant flow) through the expansion valve 13. The refrigerant flow in the first heat exchange channel 610 is a medium-pressure, medium-temperature refrigerant flow. The expansion valve 12 converts the medium-pressure, medium-temperature refrigerant flow into a low-pressure, low-temperature refrigerant flow (temperature can be 10°C, gas-liquid two-phase refrigerant flow). The refrigerant flow in the second heat exchange channel 611 is a low-pressure, low-temperature refrigerant flow. The low-pressure, low-temperature refrigerant flow in the second heat exchange channel 611 absorbs heat from the medium-pressure, medium-temperature refrigerant flow in the first heat exchange channel 610, thereby vaporizing the refrigerant flow in the second heat exchange channel 611, further subcooling the refrigerant flow in the first heat exchange channel 610. The vaporized refrigerant flow in the second heat exchange channel 611 injects vapor to increase the enthalpy of the compressor 2, improving the cooling capacity of the air conditioning system 1.

[0067] The expansion valve 12 acts as a throttling component in the second heat exchange channel 611, regulating the flow rate of the refrigerant in the second heat exchange channel 611. The refrigerant flow in the first heat exchange channel 610 and the refrigerant flow in the second heat exchange channel 611 exchange heat, achieving subcooling of the refrigerant flow in the first heat exchange channel 610. Therefore, the heat exchanger 6 can act as an economizer in the air conditioning system 1, increasing the subcooling degree and thus improving the heat exchange efficiency of the air conditioning system 1.

[0068] Furthermore, as those skilled in the art will understand, in heating mode, connection port 31 of the four-way valve 3 is connected to connection port 33, and connection port 32 of the four-way valve 3 is connected to connection port 34. The refrigerant flow output by the compressor 2 through the discharge port 21 flows from the indoor heat exchanger 5 to the outdoor heat exchanger 4, with the indoor heat exchanger 5 serving as the condenser. At this time, the refrigerant flow output by the indoor heat exchanger 5 is divided into two paths: one flows into the first heat exchange channel 610 (main path), and the other flows into the second heat exchange channel 611 (auxiliary path) through the expansion valve 12. The refrigerant flow in the second heat exchange channel 611 can also subcool the refrigerant flow in the first heat exchange channel 610, thereby improving the heating capacity of the air conditioner.

[0069] It is understood that in some other embodiments, please refer to Figure 2 and Figure 3 As shown, the first end of the second heat exchange channel 611 may not be connected to the second end of the first heat exchange channel 610. The first end of the second heat exchange channel 611 may be directly connected to the first end or the second end of the expansion valve 13. In this way, the refrigerant flow of the second heat exchange channel 611 can subcool the refrigerant flow of the first heat exchange channel 610, thereby improving the cooling or heating capacity of the air conditioning system 1.

[0070] Please see Figure 4 , Figure 4 This is a schematic block diagram of an air conditioning system according to another embodiment of this application. Figure 4 The air conditioning system 1 shown is Figure 1 The main difference in the air conditioning system 1 shown is the addition of a gas-liquid separator 8.

[0071] and Figure 1 Similar to the illustrated embodiment, the heat exchanger 6 includes a first heat exchange channel 610 for a first refrigerant flow and a second heat exchange channel 611 for a second refrigerant flow. The second refrigerant flow absorbs heat from the first refrigerant flow during its flow along the second heat exchange channel 611, thereby subcooling the first refrigerant flow. In other embodiments, the first refrigerant flow may also absorb heat from the second refrigerant flow during its flow along the first heat exchange channel 610, thereby subcooling the second refrigerant flow. Therefore, the heat exchanger 6 can serve as an economizer in the air conditioning system 1, increasing the subcooling level and thus improving the heat exchange efficiency of the air conditioning system 1.

[0072] In this embodiment, the suction port of the compressor 2 includes an enthalpy-increasing inlet 221 and a return port 222. Further, the second refrigerant flow passing through the second heat exchange channel 611 is further delivered to the enthalpy-increasing inlet 221 of the compressor 2 or the inlet 81 of the gas-liquid separator 8, wherein the outlet 82 of the gas-liquid separator 8 is further connected to the return port 222 of the compressor 2 to provide a low-pressure gaseous refrigerant flow to the compressor 2.

[0073] Furthermore, the air conditioning system 1 also includes a four-way valve 3, an expansion valve 12, and an expansion valve 13. The expansion valve 13 and the heat exchanger 6 are disposed between the outdoor heat exchanger 4 and the indoor heat exchanger 5, and the compressor 2 provides a circulating refrigerant flow between the outdoor heat exchanger 4 and the indoor heat exchanger 5 through the four-way valve 3.

[0074] The four-way valve 3 includes connection port 31, connection port 32, connection port 33 and connection port 34. Connection port 32 of the four-way valve 3 is connected to the outdoor heat exchanger 4; connection port 34 of the four-way valve 3 is connected to the gas-liquid separator 8; connection port 31 of the four-way valve 3 is connected to the compressor 2, specifically to the exhaust port 21 of the compressor 2; connection port 33 of the four-way valve 3 is connected to the indoor heat exchanger 5.

[0075] In the above embodiment, the function of the four-way valve 3 in the air conditioning system 1 is to realize the mutual conversion between cooling and heating by changing the flow direction of the refrigerant in the system pipeline, so that the air conditioning system 1 can switch between cooling mode and heating mode. When the air conditioning system 1 has both cooling and heating functions, the above-mentioned four-way valve 3 can be used for reversal.

[0076] It is understood that, in another embodiment, the air conditioning system 1 may also omit the four-way valve 3. When the air conditioning system 1 does not include the four-way valve 3, the compressor 2 can be directly connected to the outdoor heat exchanger 4 via a connecting pipe. Specifically, the compressor 2 provides a circulating refrigerant flow between the outdoor heat exchanger 4 and the indoor heat exchanger 5 via the connecting pipe. The heat exchanger 6 is located between the outdoor heat exchanger 4 and the indoor heat exchanger 5 and is connected to the connecting pipe. For example, if the air conditioning system 1 only has cooling capacity or only has heating capacity, the air conditioning system 1 may not use the aforementioned four-way valve 3. This method simplifies the structure of the air conditioning system 1 and saves on the production cost of the air conditioning system 1. Furthermore, when the heat exchanger 6 is not used as an economizer, the heat exchanger 6 can also be connected to connecting pipes in other locations.

[0077] The first end of the first heat exchange channel 610 is connected to the outdoor heat exchanger 4 via the expansion valve 13, and the second end of the first heat exchange channel 610 is connected to the indoor heat exchanger 5. The first end of the second heat exchange channel 611 is connected to the second end of the first heat exchange channel 610 via the expansion valve 12, and the second end of the second heat exchange channel 611 is connected to the enthalpy-increasing inlet 221 of the compressor 2 or to the inlet 81 of the gas-liquid separator 8.

[0078] When the second end of the second heat exchange channel 611 is connected to the enthalpy-increasing inlet 221 of the compressor 2, it can provide gaseous refrigerant at intermediate pressure for the vapor injection enthalpy increase of the compressor 2, thereby improving the cooling and / or heating capacity of the air conditioning system 1. The principle and function of vapor injection enthalpy increase are within the understanding of those skilled in the art and will not be elaborated upon here. When the second end of the second heat exchange channel 611 is connected to the inlet 81 of the gas-liquid separator 8, compared to the intermediate pressure position, the evaporation temperature of the refrigerant flow is lower and the temperature difference is larger, further improving the heat exchange efficiency of the air conditioning system 1.

[0079] The air conditioning system 1 may also include a switching assembly for selectively connecting the second end of the second heat exchange passage 611 to the enthalpy-increasing inlet 221 of the compressor 2 and the inlet 81 of the gas-liquid separator 8. That is, the switching assembly can be used to selectively deliver the second refrigerant flow flowing through the second heat exchange passage 611 to the enthalpy-increasing inlet 221 of the compressor 2 and the inlet 81 of the gas-liquid separator 8.

[0080] In one embodiment, the switching component may include a solenoid valve 15. The solenoid valve 15 is connected between the enthalpy-increasing inlet 221 of the compressor 2 and the second end of the second heat exchange channel 611 to open the solenoid valve 15 when the compressor 2 needs to inject enthalpy, so as to provide gaseous refrigerant at intermediate pressure for the injection enthalpy of the compressor 2.

[0081] The switching assembly may also include a solenoid valve 14. The solenoid valve 14 is connected between the second end of the second heat exchange channel 611 and the inlet 81 of the gas-liquid separator 8. The solenoid valve 14 is used to open when the compressor 2 does not require vapor injection enthalpy increase or is not suitable for vapor injection enthalpy increase, so as to guide the second refrigerant flow output from the second end of the second heat exchange channel 611 into the gas-liquid separator 8.

[0082] Solenoid valve 15 and solenoid valve 14 are respectively connected to the second end of the second heat exchange channel 611. Expansion valve 12 acts as a throttling component of the second heat exchange channel 611, regulating the flow rate of the second refrigerant in the second heat exchange channel 611.

[0083] Figure 4 The air conditioning system 1 shown is Figure 1 The cooling and heating principles of the air conditioning system 1 shown are basically the same, and will not be described in detail here.

[0084] like Figure 4 As shown, the air conditioning system 1 also includes an electrical control box 7. A heat exchanger 6 is connected to the electrical control box 7, and the heat exchanger 6 is configured to dissipate heat from the electronic components inside the electrical control box 7, as described below. That is, the heat exchanger 6 serves both as an economizer for the air conditioning system 1, increasing the subcooling level, and as a radiator, dissipating heat from the electrical control box 7, specifically from the electronic components inside the electrical control box 7.

[0085] This application further optimizes the overall structure of the air conditioning system 1 described above in the following aspects:

[0086] 1. Microchannel heat exchanger

[0087] like Figure 5 , Figure 6 and Figure 7 As shown, the heat exchanger 6 includes a heat exchange body 61, which is provided with a plurality of microchannels 612, including a first microchannel and a second microchannel, and... Figure 1-4 In the air conditioning system shown, the first microchannel serves as the first heat exchange channel 610 of the heat exchanger 6, and the second microchannel serves as the second heat exchange channel 611 of the heat exchanger 6. Therefore, the first microchannel 610 and the first heat exchange channel 611 use the same designation, and the second microchannel 611 and the second heat exchange channel 611 use the same designation. The heat exchange body 61 may include one or more plates 613.

[0088] The cross-sectional shape of each microchannel 612 perpendicular to its extension direction can be rectangular, with a side length of 0.5mm-3mm. The thickness between each microchannel 612 and the surface of the plate 613, as well as between the microchannels 612, is 0.2mm-0.5mm to ensure that the microchannels 612 meet the requirements for pressure resistance and heat transfer performance. In other embodiments, the cross-sectional shape of the microchannel 612 can be other shapes, such as circular, triangular, trapezoidal, elliptical, or irregular shapes.

[0089] Multiple microchannels 612 can be configured as single-layer or multi-layer microchannels. When the refrigerant flow velocity is low and the refrigerant flow is laminar, the larger the cross-sectional area and the shorter the length of the multiple microchannels 612, the smaller the flow resistance loss of the refrigerant flow.

[0090] The multiple microchannels 612 of the plate 613 may include alternately arranged first microchannels 610 and second microchannels 611, wherein the extending direction D1 of the first microchannel 610 and the extending direction D2 of the second microchannel 611 are parallel to each other. Specifically, as shown... Figure 5As shown, a first preset number of microchannels 612 are designated as first microchannels 610, and a second preset number of microchannels 612 are designated as second microchannels 611. Multiple sets of first microchannels 610 and multiple sets of second microchannels 611 are alternately arranged, meaning that a second microchannel 611 is positioned between two sets of first microchannels 610, and a first microchannel 610 is positioned between two sets of second microchannels 611. This arrangement of at least two sets of first microchannels 610 and second microchannels 611 creates a heat exchanger 6 with alternating arrangements of first microchannels 610 and second microchannels 611. The first preset number and the second preset number can be equal or unequal.

[0091] Furthermore, in Figures 1-4 In the intended use case, the first microchannel 610 and the second microchannel 611 can be independent of each other to allow different refrigerant flows to flow, thus enabling one refrigerant flow to subcool the other. In other embodiments, the first microchannel 610 and the second microchannel 611 can be interconnected and serve as a single microchannel for the same refrigerant flow. Furthermore, when the first microchannel 610 and / or the second microchannel 611 are arranged in two or more layers, they can be interconnected through a reverse manifold, or by bending the plate 613 180 degrees to form two or more layers of the first microchannel 610 and / or the second microchannel 611.

[0092] Optionally, in one embodiment, such as Figure 5 As shown, the heat exchange body 61 may include at least one set of first microchannels 610 and at least one set of second microchannels 611, which are spaced apart from each other along the width direction of the plate 613, which is perpendicular to the extension direction of the plate 613.

[0093] In another embodiment, such as Figure 6 As shown, the at least one set of first microchannels 610 and the at least one set of second microchannels 611 may also be spaced apart from each other along the thickness direction of the plate 613, which is perpendicular to the extension direction of the plate 613.

[0094] In another embodiment, such as Figure 7As shown, the first microchannel 610 and the second microchannel 611 are independent of each other and are respectively disposed in different plates 613, so that the extension direction D1 of the first microchannel 610 and the extension direction D2 of the second microchannel 611 are arranged perpendicular to each other. This allows the first and second manifolds, described below, to be disposed on different sides of the heat exchanger 6, thereby facilitating the arrangement of the manifolds of the heat exchanger 6. In this embodiment, the first microchannel 610 and the second microchannel 611 are supplied with different refrigerant flows, and thus one refrigerant flow can be used to subcool the other refrigerant flow.

[0095] Furthermore, the plate 613 can be a flat tube, allowing heat dissipation elements or electronic components to be mounted on it. In other embodiments, the plate 613 can also be a carrier with other cross-sectional shapes, such as a cylinder, cuboid, cube, etc. In other embodiments, as described below, the heat exchange body 61 can also include at least two plates 613 stacked on top of each other or two tubes nested within each other.

[0096] For example in Figure 1-4 In the cooling mode of the air conditioning system shown, the first refrigerant flow (i.e., the medium-pressure, medium-temperature refrigerant flow) flows through the first microchannel 610, and the second refrigerant flow (i.e., the low-pressure, low-temperature refrigerant flow) flows through the second microchannel 611. The first refrigerant flow can be a liquid refrigerant flow, and the second refrigerant flow can be a gas-liquid two-phase refrigerant flow. During its flow along the second microchannel 611, the second refrigerant flow absorbs heat from the first refrigerant flow in the first microchannel 610 and further vaporizes, thereby further subcooling the first refrigerant flow.

[0097] It is worth noting that the heat exchanger 6 based on the microchannel structure described above and below is not limited to Figure 1-4 As illustrated in the application scenario, the terms "first" and "second" in the first microchannel 610, the second microchannel 611, the first refrigerant flow, and the second refrigerant flow are merely used to distinguish different microchannels and refrigerant flows, and should not be considered as limitations on the specific application of microchannel 612 and the refrigerant flow. For example, in other embodiments or operating modes, the first refrigerant flow flowing through the first microchannel 610 may absorb heat from the second refrigerant flow in the second microchannel 611, and the states of the first and second refrigerant flows are not limited to liquid phase or gas-liquid two-phase as defined above.

[0098] like Figure 1-4 As shown, the flow direction A1 of the first refrigerant flow is opposite to the flow direction A2 of the second refrigerant flow. This ensures that there is always a large temperature difference between the first and second refrigerant flows in the heat exchange zone, thereby improving the heat exchange efficiency of the first and second refrigerant flows.

[0099] Optionally, the flow direction A1 of the first refrigerant flow can be the same as or perpendicular to the flow direction A2 of the second refrigerant flow. When the refrigerant flow directions are the same, the temperature of the heat exchanger 6 near the inlet side can be lower, thereby improving the heat exchange effect in that area. For example, this area can be connected to an area with greater electrical heat generation to improve the heat dissipation effect. When the refrigerant flow directions are perpendicular to each other, the first and second manifolds can be set on different sides of the heat exchanger 6, which can facilitate the arrangement of the refrigerant manifolds of the heat exchanger.

[0100] 1.1 Manifold Assembly

[0101] Please continue reading. Figure 8 As shown, the heat exchanger 6 also includes a manifold assembly 62. The extension direction of the manifold assembly 62 is perpendicular to the extension direction of the heat exchange body 61. For example, when the heat exchange body 61 is arranged along a horizontal plane, the manifold assembly 62 is arranged vertically along the direction of gravity. In this way, when the manifold assembly 62 is connected to the compressor located below the heat exchanger 6, the piping arrangement of the manifold assembly 62 can be facilitated.

[0102] When the heat exchanger body 61 is set vertically along the direction of gravity, the manifold assembly 62 is set horizontally. This can improve the uniformity of the refrigerant distribution in the manifold assembly 62, thereby making the refrigerant distribution in the heat exchanger body 61 more uniform.

[0103] like Figure 8 As shown, the manifold assembly 62 includes a first manifold 621 and a second manifold 622. The first manifold 621 is provided with a first manifold channel, and the second manifold 622 is provided with a second manifold channel. The heat exchanger 6 has an I-shaped cross-section along the flow direction of the refrigerant flow (first or second refrigerant flow) in the heat exchange body 61. In other embodiments, the cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow in the heat exchange body 61 can be L-shaped, U-shaped, G-shaped, or circular, etc.

[0104] The first manifold channel is connected to the first microchannel 610 to provide a first refrigerant flow to the first microchannel 610 and / or collect the first refrigerant flow flowing through the first microchannel 610.

[0105] For example, in Figure 1-4In the air conditioning system shown, the first end of the first microchannel 610 is connected to the outdoor heat exchanger 4 via one of the two first manifolds 621 through an expansion valve 13, so as to provide a first refrigerant flow to the first microchannel 610 in cooling mode; the second end of the first microchannel 610 is connected to the indoor heat exchanger 5 via the other of the two first manifolds 621, so as to collect the first refrigerant flow flowing through the first microchannel 610. In heating mode, since the flow direction of the first refrigerant flow in the first microchannel 610 is opposite, the functions of the two first manifolds 621 are interchanged compared to the cooling mode.

[0106] The second manifold channel is connected to the second microchannel 611 to provide a second refrigerant flow to the second microchannel 611 and / or collect the second refrigerant flow flowing through the second microchannel 611. For example, in Figure 1-4 In the air conditioning system shown, the first end of the second microchannel 611 is connected to the second expansion valve 12 through one of the two second manifolds 622 to provide a second refrigerant flow to the second microchannel 611; the second end of the second microchannel 611 is connected to the enthalpy-increasing inlet 221 of the compressor 2 or the inlet 81 of the gas-liquid separator 8 through the other of the two second manifolds 622 to collect the second refrigerant flow flowing through the second microchannel 611.

[0107] When the first microchannel 610 and / or the second microchannel 611 are connected by a 180° bend or a reverse manifold to form two layers of first microchannel 610 or second microchannel 611, the inlet and outlet of the first microchannel 610 and / or the second microchannel 611 can be located on the same side of the heat exchange body 61. At this time, the aforementioned first and second manifolds can be divided into a refrigerant supply area and a refrigerant collection area, and the inlet and outlet of the first and / or second microchannels are respectively connected to the refrigerant supply area and the refrigerant collection area provided by the manifold assembly 62.

[0108] In one embodiment, the heat exchange body 61 includes at least two sets of first microchannels 610 and at least two sets of second microchannels 611. The same end of each of the at least two sets of first microchannels 610 is connected to the same first manifold 621, and the same end of each of the at least two sets of second microchannels 611 is connected to the same second manifold 622. That is, one manifold can correspond to multiple sets of microchannels, avoiding the need for a separate manifold for each microchannel and reducing costs.

[0109] exist Figure 8In the illustrated embodiment, since the extension direction D1 of the first microchannel 610 is parallel to the extension direction D2 of the second microchannel 611, the extension directions of the first manifold 621 and the second manifold 622 are also parallel to each other. However, in other embodiments, the extension directions of the first manifold 621 and the second manifold 622 can be adjusted according to the extension directions of the first microchannel 610 and the second microchannel 611, for example, they can be arranged perpendicular to each other.

[0110] 1.2 The first and second manifolds are spaced apart.

[0111] like Figure 8 As shown, the first manifold 621 and the second manifold 622 are arranged at intervals, and the second manifold 622 is arranged further away from the heat exchange body 61 than the first manifold 621. The first manifold 621 is arranged between the second manifold 622 and the heat exchange body 61.

[0112] In one embodiment, such as Figure 9 As shown, the second microchannel 611 penetrates the first manifold 621, is inserted into the second manifold 622, and is welded in place. The first microchannel 610 is inserted into the first manifold 621 and welded in place. In another embodiment, as... Figure 10 As shown, the first manifold 621 is positioned further away from the heat exchange body 61 than the second manifold 622, and the second manifold 622 is positioned between the first manifold 621 and the heat exchange body 61. The first microchannel 610 passes through the second manifold 622, is inserted into the first manifold 621, and is fixed by welding.

[0113] It is important to note that the description of a microchannel penetrating a manifold here and in the context means that the microchannel passes through the manifold but is not connected to it. The description of a microchannel being inserted into a manifold means that the microchannel is connected to the manifold. For example, the description of a second microchannel 611 penetrating a first manifold 621 means that the second microchannel 611 passes through the first manifold 621 but is not connected to it. The description of a second microchannel 611 being inserted into a second manifold 622 means that the second microchannel 611 is connected to the second manifold 622.

[0114] The first microchannel 610 and the second microchannel 611 can be configured in one or more groups, for example, Figure 9As shown, two sets of first microchannels 610 can be provided, and one set of second microchannels 611 can be provided, with the second microchannels 611 located between the two sets of first microchannels 610. In other embodiments, both the first microchannels 610 and the second microchannels 611 can be provided in two or more sets, and the first microchannels 610 and the second microchannels are alternately stacked, such as forming an arrangement of first microchannel 610-second microchannel 611-first microchannel 610-second microchannel 611 or first microchannel 610-second microchannel 611-second microchannel 611-first microchannel 610, etc.

[0115] In another embodiment, such as Figure 9 As shown, one of the first microchannel 610 and the second microchannel 611 can serve as the main channel, and the other as the auxiliary channel. The refrigerant flow in the auxiliary channel is used to subcool the refrigerant flow in the main channel. Since the refrigerant flow rate in the main channel is larger than that in the auxiliary channel, the main channel can be positioned outside the heat exchange body 61 for easy connection to the electrical control box 7, providing heat dissipation for the electrical control box 7. Furthermore, in this embodiment, by having the main channel with a larger refrigerant flow rate pass through the corresponding manifold of the auxiliary channel and be inserted into the corresponding manifold of the main channel, this method, compared to the auxiliary channel passing through the corresponding manifold of the main channel, does not occupy the space of the corresponding manifold of the main channel, reducing the flow path pressure loss of the corresponding manifold of the main channel and making the flow distribution more uniform.

[0116] For example, such as Figure 10 As shown, when the first microchannel 610 is the main channel with a large refrigerant flow and the second microchannel 611 is the auxiliary channel with a small refrigerant flow, the first microchannel 610 passes through the second manifold 622 and is inserted into the first manifold 621. In this way, the second microchannel 611 does not occupy the space of the first manifold 621. Compared with the method of having the second microchannel 610 pass through the first manifold 621, the flow path pressure loss of the first manifold 621 can be reduced, and the flow distribution can be more uniform.

[0117] In another embodiment, the first manifold 621 and the second manifold 622 may be welded together to reduce the distance between them. In other embodiments, the first manifold 621 and the second manifold 622 may be glued or snapped together.

[0118] Furthermore, the first microchannel 610 can bypass the second manifold 622 and connect to the first manifold 621. For example, the first microchannel 610 can be located outside the second manifold 622 to bypass the second manifold 622 and connect to the first manifold 621. Alternatively, the second microchannel 611 can bypass the first manifold 621 and connect to the second manifold 622.

[0119] In other embodiments, the microchannels on the heat exchanger body 61 can also be configured in other ways. At least a portion of the microchannels penetrates one of the at least two manifolds and is inserted into the other manifold. This method can reduce the volume of the heat exchanger 6. In a specific configuration, a microchannel with a large refrigerant flow rate can penetrate one of the at least two manifolds and be inserted into the other manifold. This method can reduce the pressure loss in the manifold and make the flow distribution in the microchannels more uniform.

[0120] It is understood that the heat exchange body 61 can be a single plate 613 or composed of multiple plates 613. Correspondingly, the first microchannel 610 and the second microchannel 611 can be disposed in the same plate 613 or in different plates 613. For example, when the first microchannel 610 and the second microchannel 611 are disposed in the same plate 613, one end of a portion of the microchannel passes through one of the at least two manifolds and is inserted into the other manifold, while the other end of the at least portion of the microchannel is inserted into the manifold through which it passes. This arrangement can improve the integration of the heat exchange body 61, eliminate welding and other processes, and improve the heat exchange effect.

[0121] The at least two manifolds are not limited to the spacing between them as described above, but can be at least two manifolds formed by the main manifold and the baffle plate as described below.

[0122] 1.3 The main manifold is divided into two manifolds.

[0123] like Figure 11 As shown, the manifold assembly 62 includes a main manifold 623 and a baffle plate 624. The baffle plate 624 is disposed within the main manifold 623 to form a first manifold 621 and a second manifold 622 separated by the baffle plate 624. In other embodiments, the number of baffle plates 624 and the formed manifolds can be set as needed.

[0124] At this time, as Figure 11As shown, the first microchannel 610 penetrates the wall of the main manifold 623 and is inserted into the first manifold 621, while the second microchannel 611 penetrates the wall of the main manifold 623 and the baffle plate 624 (i.e., penetrates the first manifold 621) and is inserted into the second manifold 622. In other embodiments, the second microchannel 611 may penetrate the wall of the main manifold 623 and be inserted into the second manifold 622, while the first microchannel 610 may penetrate the wall of the main manifold 623 and the baffle plate 624 and be inserted into the first manifold 621.

[0125] and Figure 9 Compared with the manifold assembly 62 shown in 10, this embodiment achieves the functions of the first manifold 621 and the second manifold 622 simultaneously through a single main manifold 623, which can reduce the cost and volume of the manifold assembly 62.

[0126] In other embodiments, the baffle plate 624 can be used to divide the main manifold 623 into two first manifolds 621 or two second manifolds 622. For example, when the first microchannel 610 or the second microchannel 611 forms two layers of first microchannels 610 or second microchannels 611 after being bent 180° or reversed through the manifold, one end of the first microchannel 610 penetrates the wall of the main manifold 623 and is inserted into one of the first manifolds 621, while the other end of the first microchannel 610 penetrates the wall of the main manifold 623 and the baffle plate 624 and is inserted into the other first manifold 621. Alternatively, one end of the second microchannel 611 penetrates the wall of the main manifold 623 and is inserted into one of the second manifolds 622, while the other end of the second microchannel 611 penetrates the wall of the main manifold 623 and the baffle plate 624 and is inserted into the other second manifold 622.

[0127] In another embodiment, such as Figure 12 and Figure 13 As shown, a slot 601 can be provided on the end face of the heat exchanger body 61. The slot 601 is located between the first microchannel 610 and the second microchannel 611. The baffle plate 624 is embedded in the slot 601, so that the first microchannel 610 passes through the wall of the main manifold 623 and is inserted into the first manifold 621, and the second microchannel 611 passes through the wall of the main manifold 623 and is inserted into the second manifold 622. By setting the slot 601 in this way, the overall length of the heat exchanger 6 can be shortened, the material cost of the heat exchanger 6 can be reduced, and the welding process between the manifold assembly 62 and the heat exchanger body 61 can be simplified.

[0128] In one embodiment, when the first microchannel 610 or the second microchannel 611 forms two layers of first microchannel 610 or second microchannel 611 after being bent 180° or reversed through a manifold, the inlet end and outlet end of the heat exchange body 61 are located on the same side. At this time, one end of the first microchannel 610 penetrates the wall of the main manifold 623 and is inserted into one of the first manifolds 621, while the other end of the first microchannel 610 penetrates the wall of the main manifold 623 and is inserted into the other first manifold 621.

[0129] Alternatively, one end of the second microchannel 611 penetrates the wall of the main manifold 623 and is inserted into one of the second manifolds 622, while the other end of the second microchannel 611 penetrates the wall of the main manifold 623 and is inserted into another of the second manifolds 622.

[0130] Furthermore, the heat exchange body 61 can be a single plate 613 or multiple plates 613. Figure 12 In the illustrated embodiment, the heat exchange body 61 can be a single plate 613, with the first microchannel 610 and the second microchannel 611 disposed within the single plate 613. Further, on the end face of the single plate 613, a gap region is provided between the first microchannel 610 and the second microchannel 611, and a slot 601 is disposed within this gap region. In this manner, the heat exchange body 61 is integrally formed, resulting in a simple structure, high reliability, and improved heat transfer efficiency. In another embodiment, as described below, the heat exchange body 61 can also include at least two plates 613, stacked together, with slots 601 disposed on the end faces of the at least two plates 613, and the slots 601 are located between adjacent plates 613, with a baffle plate 624 embedded within the slot 601.

[0131] It is worth noting that the above-described method of combining the baffle plate 624 and the slot 601 can be applied to other microchannel grouping methods, as long as at least two sets of microchannels are provided on the heat exchange body 61. These at least two sets of microchannels can be connected to each other to allow the same refrigerant flow, or they can be independent of each other to allow different refrigerant flows.

[0132] 1.4 Nested configuration of the first and second manifolds

[0133] like Figure 14As shown, the diameter of the second manifold 622 is smaller than the diameter of the first manifold 621. The first manifold 621 is sleeved on the outside of the second manifold 622. The first microchannel 610 penetrates the wall of the first manifold 621 and is inserted into it. The second microchannel 611 penetrates the walls of both the first and second manifolds 621 and is inserted into the second manifold 622. In other embodiments, the second manifold 622 may be sleeved on the outside of the first manifold 621. In this case, the second microchannel 611 penetrates the wall of the second manifold 622 and is inserted into it. The first microchannel 610 penetrates the walls of both the second manifold 622 and the first manifold 621 and is inserted into the first manifold 621.

[0134] and Figure 9 Compared to the manifold assembly 62 shown in Figure 10, the volume of the manifold assembly 62 can be reduced by nesting.

[0135] In other embodiments, two first manifolds 621 may be nested together, or two second manifolds 622 may be nested together. In this case, one end of the first microchannel 610 penetrates the wall of the outer first manifold 621 and is inserted into the outer first manifold 621. The other end of the first microchannel 610 penetrates the wall of the two first manifolds 621 and is inserted into the inner first manifold 621.

[0136] Alternatively, one end of the second microchannel 611 penetrates the wall of the outer second manifold 622 and is inserted into the outer second manifold 622. The other end of the second microchannel 611 penetrates the wall of both second manifolds 622 and is inserted into the inner first manifold 621.

[0137] 2. Shell-and-tube heat exchanger

[0138] like Figure 15 As shown, the heat exchanger 6 includes a heat exchange body 61, which comprises a first tube 614 and a second tube 615 nested together, i.e., the heat exchanger 6 is a shell-and-tube type heat exchanger. The first tube 614 contains a plurality of first microchannels 610, and the second tube 615 contains a plurality of second microchannels 611. All the first microchannels 610 and the second microchannels 611 are connected to... Figure 5 The microchannel 612 shown is the same, so the length of the heat exchange body 61 is shortened, thereby reducing the volume of the heat exchanger 6.

[0139] The extension direction of the first microchannel 610 is parallel to the extension direction of the second microchannel 611, for example, the extension direction of the first microchannel 610 is the same as the extension direction of the second microchannel 611.

[0140] In this embodiment, as Figure 16As shown, a first tube 614 is fitted over the outside of a second tube 615. The outer surface of the first tube 614 has at least one flat surface 616 to form a heat exchange contact surface. Heat dissipation elements or electronic components can be mounted on the flat surface 616 for easy installation. In other embodiments, the second tube 615 can be fitted over the outside of the first tube 614 and form a similar flat surface.

[0141] exist Figure 1-4 In the air conditioning system 1 shown, a first refrigerant flow passes through multiple first microchannels 610, and a second refrigerant flow passes through multiple second microchannels 611. The first refrigerant flow can be a liquid refrigerant flow, and the second refrigerant flow can be a gas-liquid two-phase refrigerant flow. During its flow along the multiple second microchannels 611, the second refrigerant flow absorbs heat from the first refrigerant flow in the multiple first microchannels 610 and further vaporizes, thereby further subcooling the first refrigerant flow. In other embodiments or operating modes, the first refrigerant flow flowing through the first microchannels 610 can absorb heat from the second refrigerant flow in the second microchannels 611, and the states of the first and second refrigerant flows are not limited to liquid or gas-liquid two-phase as defined above.

[0142] and Figure 5 Compared to the heat exchanger 6 shown, the heat exchange body 61 has a larger cross-sectional area, which reduces the pressure loss of the refrigerant flow. In addition, the first tube 614 and the second tube 615 are arranged in a sleeve, which can increase the heat exchange area between the multiple first microchannels 610 and the multiple second microchannels 611, and improve the heat exchange efficiency between the first microchannels 610 and the second microchannels 611.

[0143] and Figure 8 Similarly, the heat exchanger 6 also includes a manifold assembly 62, which includes a first manifold 621 and a second manifold 622. The first manifold 621 is provided with a first manifold channel, which is used to provide a first refrigerant flow to the first microchannel 610 and / or collect the first refrigerant flow flowing through the first microchannel 610. The second manifold 622 is provided with a second manifold channel, which provides a second refrigerant flow to the second microchannel 611 and / or collects the second refrigerant flow flowing through the second microchannel 611. The cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow in the heat exchange body 61 is I-shaped. In other embodiments, the cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow in the heat exchange body 61 can be L-shaped, U-shaped, G-shaped, or circular, etc.

[0144] The manifold assembly 62 can adopt various manifold configurations described above, such as the configuration where the first manifold 621 and the second manifold 622 are spaced apart, the configuration where the main manifold 623 and the baffle plate 624 are arranged, or the configuration where the first manifold 621 and the second manifold 622 are nested together. In this case, the first tube body 614 together with the first microchannel 610 thereon and the second tube body 615 together with the second microchannel 611 thereon can all cooperate with the aforementioned manifolds in the manner described above, and will not be repeated here.

[0145] 3. The heat exchanger has multiple plates stacked on top of each other.

[0146] like Figure 17 As shown, the heat exchanger 6 includes a heat exchange body 61, which includes a first plate 631 and a second plate 632, which are stacked on top of each other.

[0147] The first plate 631 has a plurality of first microchannels 610, and the second plate 632 has a plurality of second microchannels 611. The plurality of first microchannels 610 and the plurality of second microchannels 611 are all connected to… Figures 5-7 The microchannel 612 shown is the same and will not be described again here. The multi-layer structure shortens the length of the heat exchange body 61, thus reducing the volume of the heat exchanger 6.

[0148] Since the first plate 631 and the second plate 632 are stacked on top of each other, the contact area between the first plate 631 and the second plate 632 is increased, thereby increasing the heat exchange area between the first microchannel 610 and the second microchannel 611 and improving the heat exchange efficiency.

[0149] exist Figure 1-4 In the air conditioning system shown, the first refrigerant flow flows through multiple first microchannels 610, and the second refrigerant flow flows through multiple second microchannels 611. During the flow of the second refrigerant flow along the multiple second microchannels 611, the second refrigerant flow absorbs heat from the first refrigerant flow in the multiple first microchannels 610 and further vaporizes, so as to further subcool the first refrigerant flow.

[0150] In other embodiments or operating modes, the first refrigerant flow flowing through the first microchannel 610 may absorb heat from the second refrigerant flow in the second microchannel 611, and the states of the first and second refrigerant flows are not limited to liquid phase or gas-liquid two phase as defined above.

[0151] One or more first plates 631 and second plates 632 can be provided. For example, there can be two first plates 631, with the second plate 632 sandwiched between the two first plates 631, such as the first plates 631, second plates 632, and first plates 631 stacked sequentially. By sandwiching the second plate 632 between the two first plates 631, the second refrigerant flow of the second plate 632 simultaneously absorbs heat from the first refrigerant flow of the two first plates 631, achieving subcooling of the first refrigerant flow of the two first plates 631. Furthermore, heat dissipation elements or electronic components can be configured to be thermally connected to the first plates 631, for example, disposed on the surface of the first plates 631 away from the second plates 632, for ease of installation. In other embodiments, two or more first plates 631 and second plates 632 can be provided, and the first plates 631 and second plates can be stacked alternately.

[0152] In one embodiment, the two first plates 631 can be two independent plates. In other embodiments, the two first plates 631 can also be connected in a U-shape or connected in reverse manifolds, in which case the first microchannels 610 in the two first plates 631 are connected in a U-shape, so that the inlet and outlet of the first microchannels 610 are located on the same side of the heat exchange body 61.

[0153] In other embodiments, there may be two second plates 632, with a first plate 631 sandwiched between the two second plates 632. In this case, heat dissipation elements or electronic components may be configured to be thermally connected to the second plates 632.

[0154] like Figure 18 As shown, the heat exchanger 6 also includes a manifold assembly 62, which includes a first manifold 621 and a second manifold 622. The first manifold 621 is provided with a first manifold channel, which is used to provide a first refrigerant flow to the first microchannel 610 and / or collect the first refrigerant flow flowing through the first microchannel 610. The second manifold 622 is provided with a second manifold channel, which provides a second refrigerant flow to the second microchannel 611 and / or collects the second refrigerant flow flowing through the second microchannel 611.

[0155] The manifold assembly 62 can adopt various manifold configurations described above, such as the configuration of the first manifold 621 and the second manifold 622 spaced apart, with the main manifold 623 and the baffle plate 624, or the configuration of the first manifold 621 and the second manifold 622 nested together. In this case, the first plate 631 together with the first microchannel 610 thereon and the second plate 633 together with the second microchannel 611 thereon can both cooperate with the aforementioned manifolds in the manner described above.

[0156] 3.1 Welding process between stacked plates

[0157] like Figure 19 As shown, in this embodiment, the heat exchanger 6 includes a first plate 631, a second plate 632, and a connecting piece 64. The first plate 631 and the second plate 632 are stacked on top of each other, and the connecting piece 64 is sandwiched between adjacent first plates 631 and second plates 632. Solder (not shown) is provided on both sides of the connecting piece 64, and the solder is used to weld and fix the connecting piece 64 to the first plate 631 and the second plate 632 on both sides of the connecting piece 64.

[0158] In this embodiment, solder is applied to both sides of the connecting piece 64, and then the first plate 631 and the second plate 632 are welded together using the connecting piece 64. This method effectively fixes the first plate 631 and the second plate 632 together. Since welding adjacent plates 613 requires solder to be applied to the mating surfaces of the two plates 613, compared to using plates 613 with surface-coated solder, arranging the connecting piece 64 with solder between the two plates 613 can significantly reduce production costs.

[0159] Furthermore, the melting point of the connector 64 is higher than that of the solder. The connector 64 can be a metal foil to improve thermal conductivity. For example, the connector 64 can be aluminum foil or copper foil. Metal foil is less expensive, and the process of applying solder to both sides of the metal foil is relatively simple. Therefore, metal foil with solder is readily available and has a lower production cost.

[0160] The solder on the connecting piece 64 covers an area of ​​at least 80% of the overlap area of ​​the first plate 631 and the second plate 632 on both sides, thereby improving the reliability of the welding between the first plate 631 and the second plate 632. Optionally, the coverage area of ​​the solder on the connecting piece 64 on the first plate 631 and the second plate 632 can be 80% of the overlap area of ​​the first plate 631 and the second plate 632 on both sides; or, the coverage area of ​​the solder on the connecting piece 64 on the first plate 631 and the second plate 632 can be equal to the overlap area of ​​the first plate 631 and the second plate 632. This method can further improve the reliability of the heat exchanger 6.

[0161] Optionally, the connecting piece 64 between the first plate 631 and the second plate 632 can be a single-layer structure, that is, only one layer of connecting piece 64 is provided between the first plate 631 and the second plate 632. In other embodiments, the connecting piece 64 between the first plate 631 and the second plate 632 has at least two layers, for example, the connecting piece 64 can be a two-layer, three-layer, or four-layer structure. In this case, the at least two layers of connecting pieces 64 are further fixed by welding. By flexibly selecting the number of layers of connecting pieces 64, the distance between the first plate 631 and the second plate 632 can be adjusted, so that the heat exchanger 6 can adapt to different application scenarios. For example, a slot with a width equal to the stack thickness of the at least two layers of connecting pieces 64 can be formed between the first plate 631 and the second plate 632 to cooperate with the baffle plate described above.

[0162] The thickness of the connecting piece 64 ranges from 0.9mm to 1.2mm. For example, the thickness of the connecting piece 64 can be 0.9mm, 1mm, or 1.2mm, etc.

[0163] It is worth noting that the connecting piece 64 can be disposed between adjacent plates of at least two other plates having microchannels, for example, two first plates 631 or two second plates 632.

[0164] In a specific embodiment, such as Figure 20 As shown, the manufacturing method of the heat exchanger 6 may include: S11: providing at least two plates. S12: providing a connecting piece, with solder provided on both sides of the connecting piece. S13: stacking at least two plates and sandwiching the connecting piece between adjacent plates. S14: heating the at least two plates and the connecting piece, so that the solder welds the connecting piece to the plates 3 located on both sides of the connecting piece.

[0165] 3.2 Connection between the stacked plates and the manifold

[0166] like Figure 21 As shown, the heat exchanger 6 includes at least two plates 613 and at least one manifold 620. Each plate 613 includes a main body 671 and a connecting part 672. The main bodies 671 of the at least two plates 613 are stacked on top of each other. One end of the connecting part 672 is connected to the main body 671, and the other end of the connecting part 672 is connected to the manifold 620.

[0167] like Figure 22As shown, the manifold 620 has at least two insertion holes 602 on its wall. The other end of the connecting portion 672 of the plate 613 corresponds to the insertion hole 602 and is welded to the manifold 620 for fixation. That is, the connecting portion 672 is located at the end of the plate 613 and is used to fix it to the manifold 620. When the at least two plates 613 are welded to the manifold 620, if the distance between two adjacent plates 613 is small at the welding point, it will increase the welding difficulty. The solder will flow along the gap between the two adjacent plates 613, resulting in poor welding between the plate 613 and the manifold 620, causing a risk of refrigerant leakage.

[0168] In this embodiment, there is a first distance d1 between two adjacent insertion holes 602 on the manifold 620, and a second distance d2 between the main body portions 671 of two adjacent plates 613. The first distance d1 is greater than the second distance d2. In this way, the distance between the connecting portions 671 of two adjacent plates 613 at the weld can be increased, the capillary effect between the two adjacent plates 613 can be reduced, and the reliability of the weld between the plates 613 and the manifold 620 can be improved.

[0169] Furthermore, the first spacing d1 is not less than 2mm, for example, the first spacing d1 can be 2mm or 3mm, etc., to reduce the capillary effect between the connecting parts 672 of the plate 613, which is beneficial to the welding between the connecting parts 672 of the plate 613 and the manifold 620. Even further, the first spacing d1 is not greater than 6mm, so that the heat exchanger 6 has higher structural strength and improves the reliability of the heat exchanger 6.

[0170] Optionally, at least a portion of the connecting portion 672 of the plate 613 is curved, for example, at least a portion of the connecting portion 672 of the plate 613 is arc-shaped. This curved arrangement facilitates adjustment of the spacing between the connecting portions 672 of two adjacent plates 613, which is beneficial for welding and fixing the plate 613 to the manifold 620 and reduces the capillary effect between two adjacent plates 613 during welding.

[0171] Optionally, one end of the connecting portion 672 of the plate 613 is bent, and the other end is straight, to simplify the processing technology.

[0172] Furthermore, at least some of the adjacent plates 613 have a third distance d3 between their connecting portions 672. The third distance d3 gradually increases in at least a portion of the range from the main body 671 to the manifold 620, so that the distance between the adjacent connecting portions 672 gradually increases, thereby reducing the capillary effect between the two adjacent plates 613.

[0173] exist Figure 21 In the embodiment shown, the at least two plates 61 may include the first plate 631 and the second plate 632 described above.

[0174] Furthermore, in this embodiment, there are two first plates 631 and two second plates 632, which are stacked sequentially. One second plate 632 is sandwiched between two first plates 631, and the other second plate 632 is stacked on the outside of one of the first plates 631, away from the sandwiched second plate 632. The manifold 620 includes first manifolds 621 and second manifolds 622 spaced apart. The first plates 631 have multiple first microchannels for the flow of the first refrigerant, and the second plates 632 have multiple second microchannels for the flow of the second refrigerant. The second refrigerant absorbs heat from the first refrigerant during its flow along the multiple second microchannels 611, thus subcooling the first refrigerant; or the first refrigerant absorbs heat from the second refrigerant during its flow along the multiple first microchannels 610, thus subcooling the second refrigerant. The connecting part 672 of the first plate 631 is welded and fixed to the first manifold 621, and the connecting part 672 of the second plate 632 is welded and fixed to the second manifold 621.

[0175] like Figure 21 As shown, the connecting portion 672 of the clamped second plate 632 can pass through the first manifold 621 and connect to the second manifold 622. The connecting portion 672 of the outer side of the second plate 632 can bypass the first manifold 621 and be welded to the second manifold 622. In this way, the number of insertion holes 602 on the first manifold 621 can be reduced, and the distance between the insertion holes 602 can be increased, which is beneficial to the assembly of the heat exchanger 6 and makes the heat exchanger 6 have higher reliability. At the same time, it can reduce the interference with the refrigerant flow in the first manifold 621.

[0176] In another embodiment, the connecting portion 672 of the second plate 632 passes through the first manifold 621 and is connected to the second manifold 622. In other embodiments, the connecting portion 672 of the first plate 631 may pass through the second manifold 622 and be connected to the first manifold 621, which will not be described in detail here.

[0177] The number of the first plate 631 and the second plate 632 can be selected and set according to actual application needs, and no specific limit is made here.

[0178] The manifold 620 can also adopt various manifold configuration methods described above, which will not be repeated here.

[0179] Furthermore, the main body 671 of plate 613 has a linear structure, so the main body 671 of the first plate 631 and the main body 671 of the second plate 632 can be directly welded together with solder.

[0180] In other embodiments, the main body 671 of the first plate 631 and the main body 671 of the second plate 672 are connected by a solder-filled connecting piece as described above, which will not be repeated here.

[0181] 4. Heat dissipation fins

[0182] like Figure 23 and Figure 24 As shown, the heat exchanger 6 includes a heat exchange body 61 and heat dissipation fins 65. The heat dissipation fins 65 can be disposed on the heat exchange body 61 and are thermally connected to the heat exchange body 61. The heat dissipation fins 65 increase the contact area between the heat exchange body 61 and the air, which facilitates heat exchange with the air, improves the heat exchange efficiency of the heat exchanger 6, and enhances the heat dissipation effect of the heat exchanger 6.

[0183] The heat dissipation fins 65 can be connected to the surface of the heat exchange body 61 by welding, bonding or fastening.

[0184] Furthermore, in such Figure 23 In the embodiment shown, the heat exchange body 61 includes at least two plate assemblies 603 arranged side by side and spaced apart, and heat dissipation fins 65 are disposed on the at least two plate assemblies 603.

[0185] The heat exchanger 6 also includes a fixing plate 66, which covers the heat dissipation fins 65 on at least two plate assemblies 603. The fixing plate 66 is located on the side of the heat dissipation fins 65 facing away from the plate assembly 603, forming a heat dissipation duct. This method uses an integral fixing plate 66 structure to seal the heat dissipation fins 65, reducing the number of parts and simplifying the production of the heat exchanger 6, while also improving the heat dissipation effect through the formed heat dissipation duct. The airflow direction defined by the heat dissipation duct can be set along the spacing direction of the plate assemblies, i.e., perpendicular to the extension direction of the plate assembly 603, to increase the heat dissipation efficiency of the heat dissipation fins 65. In other embodiments, the airflow direction defined by the heat dissipation duct can be set with respect to the extension direction of the plate assembly 603 or at other angles to the extension direction of the plate assembly 603.

[0186] like Figure 23 As shown, the fixing plate 66 includes a top panel 661, which covers the heat dissipation fins 65 on the at least two plate assemblies 603 to facilitate sealing of the heat dissipation fins 65.

[0187] Furthermore, the fixing plate 66 also includes at least one side panel 662, which is bent and connected to the top panel 661 and extends toward the plate assembly 603 to seal the heat dissipation duct through the side panel 662, thereby reducing the number of components in the heat exchanger 6 and improving the sealing performance of the heat dissipation duct.

[0188] Specifically, in one embodiment, the fixing plate 66 may include a top panel 661 and a side panel 662. The side panel 662 is bent and connected to one end of the top panel 661, and one end of the heat dissipation fin 65 abuts against the side panel 662 to seal the heat dissipation channel. The other end of the heat dissipation fin 65 can be assembled by splicing other components or abutting against the housing of the electrical control box described below, so that the heat dissipation fin 65 forms a complete air channel. This method can simplify the packaging of the heat dissipation fin 65 and improve assembly efficiency.

[0189] In another embodiment, there are two side panels 662, which are spaced apart perpendicularly to the spacing direction of at least two plate assemblies 603. The top panel 661 is bent and connected to the two side panels 662 to form an accommodating space. The heat dissipation fins 65 are located in the accommodating space, that is, between the two side panels 662. In this way, the fixing plate 66 can completely seal the heat dissipation fins 65 to form an integral heat dissipation air duct. The number of parts is reduced, which further simplifies the packaging process of the heat dissipation fins 65, making the production of the heat exchanger 6 simple and reliable, while improving the heat exchange capacity.

[0190] Optionally, such as Figure 24 As shown, the heat dissipation fins 65 are a wave-like structure formed by extruding sheet material, and the crests and troughs of the wave-like structure are in contact with the opposing surfaces of the top panel 661 and the plate assembly 603, respectively.

[0191] Optionally, the number of heat dissipation fins 65 can be at least two, such as Figure 25 As shown, the number of heat dissipation fins 65 can be equal to the number of plate assemblies 603, with each heat dissipation fin 65 disposed on a corresponding plate assembly 603. The width of each heat dissipation fin 65 in the vertical direction along the extension direction of the plate assembly 603 can be equal to the width of the corresponding plate assembly 603, thereby improving heat exchange capacity and saving material costs.

[0192] like Figure 25 As shown, each heat dissipation fin 65 can be attached to a plate assembly 603, and multiple heat dissipation fins 65 can be arranged at intervals along the spacing direction of the plate assembly 603. Since the temperature at the gaps between the plates 613 will be higher than that at the plate 613 during the welding process, this arrangement can prevent the heat dissipation fins 65 from melting and deforming. By setting multiple heat dissipation fins 65 at intervals, not only can the heat exchange efficiency of the heat dissipation fins 65 be guaranteed, but materials can also be saved and production costs reduced.

[0193] Optionally, such as Figure 26As shown, the number of heat dissipation fins 65 can also be one, meaning the heat dissipation fin 65 is integrally formed and simultaneously disposed on at least two plate assemblies 603. The width of the heat dissipation fin 65 in the vertical direction along the extension direction of the plate assembly 603 can be greater than or equal to the width of the heat exchange body 61. Thus, the number of integral heat dissipation fins 65 is reduced, and the surface area is increased. This facilitates the connection between the heat dissipation fins 65 and the heat exchange body 61, improving the installation efficiency; it also increases the contact area between the heat dissipation fins 65 and the air, enhancing the heat exchange effect.

[0194] Furthermore, the fixing plate 66 is open at both ends along the spacing direction of the at least two plate assemblies 603, so that the airflow direction in the heat dissipation duct is arranged along the spacing direction of the at least two plate assemblies 603. Furthermore, the flow direction of the refrigerant within the plate assembly 603 is perpendicular to the spacing direction of the at least two plate assemblies 603, so as to enhance the heat dissipation effect of the heat dissipation duct and improve the overall heat exchange efficiency of the heat exchanger 6.

[0195] Each plate assembly 603 may contain a microchannel, for example, by using the various plate-microchannel combination methods described above, which will not be repeated here.

[0196] It is worth noting that, as those skilled in the art will understand, the above-described heat dissipation fin 65 structure is applicable to various forms of heat exchangers 6 described in this application, and should not be limited to a particular embodiment.

[0197] 5. Heat exchanger as radiator

[0198] This application can also use the heat exchanger 6 described above as a radiator (hereinafter referred to as radiator 6). The radiator 6 includes a heat exchange body 61 and a manifold assembly 62, and is configured to dissipate heat from the electronic components within the electrical control box 7. It is worth noting that, as those skilled in the art will understand, the radiator 6 mentioned herein should include the various forms of heat exchangers described above, and should not be limited to a particular embodiment.

[0199] In one embodiment, the radiator 6 serves as an economizer for the air conditioning system 1 and also replaces the module radiator in the electrical control box 7 to dissipate heat from the electrical control box 7, thereby simplifying the piping components and the number of modules in the air conditioning system 1 and reducing costs.

[0200] Furthermore, such as Figure 27As shown, the electrical control box 7 includes a box body 72 and a heat sink 6. The box body 72 has a mounting cavity 721, and the electronic component 71 is disposed in the mounting cavity 721. The heat sink 6 is disposed inside the mounting cavity 721 to dissipate heat from the electronic component 71 inside the mounting cavity 721. In another embodiment, the heat sink 6 may also be disposed outside the box body 72 and used to dissipate heat from the electronic component 71 inside the mounting cavity 721.

[0201] like Figure 27 As shown, the box body 72 includes a top plate (not shown in the figure, which is arranged opposite to the bottom plate 723 and covers the opening of the mounting cavity 721), a bottom plate 723 and a circumferential side plate 724. The top plate and the bottom plate 723 are arranged at intervals relative to each other, and the circumferential side plate 724 is connected to the top plate and the bottom plate 723, thereby forming the mounting cavity 721.

[0202] Specifically, in Figure 27 In this structure, the base plate 723 and top plate are rectangular, and there are four circumferential side plates 724. These four side plates 724 are connected to the corresponding sides of the base plate 723 and top plate, thus forming a cuboid electrical control box 7. The length of the electrical control box 7 is the longer side of the base plate 723, and the width of the electrical control box 7 is the shorter side of the base plate 723. The height of the circumferential side plates 724 perpendicular to the base plate 723 is the height of the electrical control box 7. Figure 27 As shown, the length of the control box 7 in the X direction is the length of the control box 7, the length of the control box 7 in the Y direction is the height of the control box 7, and the length of the control box 7 in the Z direction is the width of the control box 7.

[0203] The following embodiments will provide a detailed description of the specific combination of the heat sink 6 and the electrical control box 7.

[0204] 5.1 Form of the heat exchanger body

[0205] In one embodiment, the heat exchange body 61 is arranged in a straight strip shape, such as... Figure 18 As shown, the heat exchange body 61 has an overall length, an overall width, and an overall height. The overall length is the length of the heat exchange body 61 along its extending direction, i.e., the length of the heat exchange body 61 along its extension direction. Figure 18 The length in the X direction shown. The overall width is the length of the heat exchange body 61 in a direction perpendicular to the extension direction of the heat exchange body 61 and perpendicular to the plane on which the heat exchange body 61 is located, that is, the length of the heat exchange body 61 along... Figure 18 The length in the Y direction is shown. The overall height is the length of the heat exchange body 61 along... Figure 18 The length in the Z direction is shown. The plane where the heat exchanger body 61 is located refers to the plane where the manifold assembly 62 is located, i.e. Figure 18 The XOZ plane is shown in the figure.

[0206] In this embodiment, as Figure 27 As shown, the heat exchange body 61 can be disposed on the base plate 723 of the electrical control box 7. Alternatively, the heat exchange body 61 can be disposed on the circumferential side plate 724 of the electrical control box 7. In other embodiments, the heat exchange body 61 can also be fixed at other positions of the electrical control box 7 according to the placement position of electronic components 71, etc., and this application embodiment does not make specific limitations.

[0207] When the heat exchanger body 61 is as follows Figure 18 When the heat exchange body 61 is in the straight strip shape shown, it can abut against the base plate 723 or be spaced apart from the base plate 723. In this way, the length of the base plate 723 can be fully utilized to provide the longest possible heat exchange body 61, thereby improving the heat exchange effect. In other embodiments, the heat exchange body 61 can also abut against the circumferential side plate 724 or be spaced apart from the circumferential side plate 724. This application does not make specific limitations.

[0208] Further, please refer to Figure 28 In order to reduce the overall length of the heat exchange body 61, the heat exchange body 61 can be divided into a first extension 617 and a second extension 618. The second extension 618 is connected to the end of the first extension 617 and bent to one side of the first extension 617 so that the heat exchange body 61 is L-shaped.

[0209] By bending the heat exchange body 61 to form a first extension 617 and a second extension 618 that are bent and connected, the overall length of the heat exchange body 61 can be reduced while ensuring that the heat exchange body 61 has a sufficiently long extension length. This, in turn, reduces the length of the electrical control box 7 that cooperates with the radiator 6 in the X direction, thereby reducing the volume of the electrical control box 7.

[0210] Specifically, the first extension 617 can be set parallel to the base plate 723 to make full use of the length dimension of the base plate 723 and to set the heat exchange body 61 as long as possible to improve the heat exchange effect. The second extension 618 can be set parallel to the circumferential side plate 724 to reduce the space occupied by the second extension 618 in the X direction.

[0211] Alternatively, the first extension 617 can be configured to be parallel to one of the circumferential side plates 724, and the second extension 618 can be configured to be parallel to the circumferential side plate 724 adjacent to the circumferential side plate 724, so that the heat sink 6 can be disposed on one side of the mounting cavity 721.

[0212] Optionally, the first extension 617 may abut against the base plate 723 or be spaced apart from the base plate 723, and the second extension 618 may abut against the circumferential side plate 724 or be spaced apart from the circumferential side plate 724. This application embodiment does not make specific limitations.

[0213] Furthermore, such as Figure 28 As shown, there can be one second extension 618, which is connected to one end of the first extension 617, so that the heat exchange body 61 is L-shaped.

[0214] like Figure 29 As shown, there can be two second extensions 618. The two second extensions 618 are respectively connected to the opposite ends of the first extension 617 and are bent toward the same side of the first extension 617.

[0215] Specifically, the two second extensions 618 can be arranged parallel to each other at opposite ends of the first extension 617, so as to further reduce the overall length of the heat exchange body 61 and the volume of the radiator 6 while ensuring the heat exchange effect of the heat exchange body 61. In addition, bending the two second extensions 618 on the same side of the first extension 617, with the two second extensions 618 located on opposite sides of the first extension 617, can also facilitate shortening the overall width of the radiator 6.

[0216] Furthermore, the two second extensions 618 can be arranged perpendicularly to the first extension 617 to form a U-shaped heat exchange body 61. In this way, not only can the overall length of the heat exchange body 61 be reduced, but also the space occupied by the second extensions 618 in the X direction can be reduced, avoiding interference between the two second extensions 618 and the electronic components 71 provided in the mounting cavity 721.

[0217] Alternatively, the two second extensions 618 may be inclined relative to the first extension 617, and the inclination angles of the two second extensions 618 relative to the first extension 617 may be the same or different, so as to shorten the overall width of the electrical control box 7.

[0218] Furthermore, the extension length of the first extension 617 is set to be greater than the extension length of the second extension 618, so that the first extension 617 is arranged along the length direction of the electrical control box 7, while the second extension 618 is arranged along the width or height direction of the electrical control box 7.

[0219] Furthermore, such as Figure 27 As shown, the number of heat sinks 6 disposed in the mounting cavity 721 can be one, and the heat sink 6 can extend along the length direction of the housing 72 and be disposed in the mounting cavity 721. Alternatively, the heat sink 6 can extend along the height direction of the housing 72 and be disposed in the mounting cavity 721.

[0220] Alternatively, the number of heat sinks 6 located in the mounting cavity 721 can be at least two, for example, two, three, four, or five. By setting a larger number of heat sinks 6, the heat dissipation effect of the electrical control box 7 can be improved.

[0221] 5.2 The radiator is installed inside the electrical control box.

[0222] As understood by those skilled in the art, the various forms of heat sinks 6 disclosed in this application can also be disposed in the mounting cavity 721 of the electrical control box 7 or used for heat dissipation of the electrical control box 7, and can be thermally connected to the electronic component 71 in a direct or indirect manner.

[0223] Furthermore, such as Figure 27 As shown, the heat sink 6 is disposed within the mounting cavity 721 of the electrical control box 7. Specifically, the heat sink 6 can be thermally connected to the electronic component 71 disposed within the mounting cavity 721 to dissipate heat from the electronic component 71.

[0224] Specifically, the electronic component 71 can be thermally connected to the heat exchange body 61, and the electronic component 71 can be thermally connected to any position of the heat exchange body 61.

[0225] When the heat exchange body 61 in the radiator 6 is straight (i.e., when the radiator 6 is I-shaped), the electronic component 71 can be placed at any position on the heat exchange body 61. This method facilitates the assembly of the electronic component 71. For example, the electronic component 71 can be placed in the middle of the heat exchange body 61, or it can be placed at both ends of the heat exchange body 61. Optionally, the electronic component 71 can be placed on one side of the heat exchange body 61, or, depending on the actual application scenario, it can be placed on opposite sides of the heat exchange body 61.

[0226] In such Figure 28 and Figure 29 In the embodiments shown, when the heat sink 6 is L-shaped or U-shaped, the electronic component 71 can be thermally connected to the first extension 617, and the electronic component 71 can be disposed on the same side of the first extension 617 as the second extension 618, so as to shorten the height of the electronic control box 7, i.e. the dimension along the Y direction.

[0227] Alternatively, the electronic component 71 can be thermally connected to the second extension 618, and specifically, the electronic component 71 can be disposed on the side of the second extension 618 facing the first extension 617 to shorten the length of the control box 7, i.e., the dimension along the X direction.

[0228] Alternatively, the electronic components 71 can be partially disposed on the first extension 617 and partially disposed on the second extension 618, so that the electronic components 71 are evenly distributed.

[0229] like Figure 27 and Figure 30As shown, a heat dissipation fixing plate 74 can also be set in the electrical control box 7, and the electronic component 71 can be set on the heat dissipation fixing plate 74. Then, the heat dissipation fixing plate 74 is connected to the heat exchange body 61 so that the electronic component 71 and the heat exchange body 61 are thermally connected through the heat dissipation fixing plate 74. In this way, the installation efficiency of the electronic component 71 can be greatly improved.

[0230] The heat dissipation fixing plate 74 can be made of a metal plate or alloy plate with good thermal conductivity. For example, the heat dissipation fixing plate 74 can be made of aluminum plate, copper plate, aluminum alloy plate, etc., to improve the heat conduction efficiency.

[0231] Or, such as Figure 31 As shown, a heat pipe 741 can also be embedded in the heat dissipation fixing plate 74. The heat pipe 741 is used to quickly conduct heat from the relatively concentrated high-density heat source and then diffuse it to the entire surface of the heat dissipation fixing plate 74, so that the heat distribution on the heat dissipation fixing plate 74 is uniform and the heat exchange effect between the heat dissipation fixing plate 74 and the heat exchange body 61 is enhanced.

[0232] Among them, such as Figure 31 As shown in the attached diagram on the upper middle side, the heat pipe 741 can be arranged in a long strip shape, and the number of heat pipes 741 can be multiple, which can be arranged in parallel at intervals. Or, as... Figure 31 As shown in the lower middle figure, multiple heat pipes 741 can also be connected sequentially in a ring or frame shape, and this application embodiment does not make specific limitations.

[0233] 5.3 The radiator is located outside the electrical control box.

[0234] like Figure 32 As shown, the heat sink 6 is located outside the electrical control box 7. An assembly port 726 can be opened on the box body 72 of the electrical control box 7, and the electronic component 71 can be thermally connected to the heat sink 6 through the assembly port 726.

[0235] Specifically, such as Figure 32 As shown, electronic component 71 is disposed on the surface of heat dissipation mounting plate 74 on the side away from heat sink 6.

[0236] Or, such as Figure 33 As shown, a heat pipe 741 can be configured to thermally connect the electronic component 71 to the heat sink 6. For example, the heat pipe 741 may include a heat-absorbing end 741a and a heat-releasing end 741b. The heat-absorbing end 741a of the heat pipe 741 can be inserted into the interior of the mounting cavity 721 and thermally connected to the electronic component 71 to absorb the heat of the electronic component 71. The heat-releasing end 741b of the heat pipe 741 can be disposed outside the control box 7 and thermally connected to the heat sink 6 so that the heat sink 6 can dissipate heat from the heat-releasing end 741b of the heat pipe 741.

[0237] 5.4 Arrangement of heat sink fins and electronic components

[0238] exist Figure 23-26 In the embodiment shown, the heat sink 6 includes heat dissipation fins 65. When the heat sink 6 with heat dissipation fins 65 is applied in the electrical control box 7, the heat dissipation fins 65 can increase the contact area between the heat exchange body 61 and the air in the electrical control box 7, which facilitates heat exchange with the air, reduces the temperature in the mounting cavity 721, and protects the electronic components 71.

[0239] Optionally, the electronic component 71 and the heat dissipation fins 65 can be disposed on the same side of the heat exchange body 61, and the electronic component 71 and the heat dissipation fins 65 can be staggered to avoid interference between the electronic component 71 and the heat dissipation fins 65. In addition, the distance between the electronic component 71 and the heat dissipation fins 65 can be set to be large, so that the temperature of the refrigerant in contact with the heat dissipation fins 65 and the electronic component 71 is low, thereby improving the heat dissipation effect of the heat exchange body 61.

[0240] In other embodiments, the electronic component 71 is disposed on one side of the heat exchange body 61, and the heat dissipation fins 65 are disposed on the other side of the heat exchange body 61. Specifically, the heat dissipation fins 65 can be disposed at any position on the other side of the heat exchange body 61.

[0241] In one embodiment, the heat dissipation fins 65 can extend to the outside of the electrical control box 7. For example, an assembly port is opened on the box body 72, the heat exchange body 61 is disposed inside the box body 72 and is thermally connected to the electronic component 71, and one side of the heat dissipation fins 65 is thermally connected to the heat exchange body 61 and extends to the outside of the box body 72 through the assembly port. The heat dissipation capacity of the heat exchange body 61 can be further improved by air cooling assistance.

[0242] 6. Electronic components are placed in locations where the heat sink experiences high temperatures.

[0243] Please see Figure 34 In this embodiment, the electrical control box 7 includes a box body 72, a heat sink 6, and electronic components 71. The box body 72 has a mounting cavity 721, and the heat sink 6 is at least partially disposed within the mounting cavity 721. The electronic components 71 are also disposed within the mounting cavity 721. The structures of the box body 72 and the heat sink 6 are largely the same as those in the above embodiments; please refer to the description in the above embodiments.

[0244] Optionally, the heat exchange body 61 can be entirely disposed within the mounting cavity 721 of the electrical control box 7, or the heat exchange body 61 can be partially disposed within the mounting cavity 721 of the electrical control box 7 and partially protrude outside the electrical control box 7 for connection with the manifold assembly 62 and external pipelines.

[0245] The flow of refrigerant keeps the temperature of the heat sink 6 low. However, the heat generated by the electronic components 71 inside the control box 7 keeps the temperature inside the mounting cavity 721 of the control box 7 high. When the warmer air inside the control box 7 comes into contact with the heat sink 6, it easily condenses, forming condensate on the surface of the heat sink 6. If this condensate flows to the location of the electronic components 71, it can easily cause a short circuit or damage to the components, and in more serious cases, it can create a fire hazard.

[0246] Therefore, as Figure 34 As shown, the heat exchange body 61 can be divided into a first end 61a and a second end 61b along the flow direction of the refrigerant. When the heat exchange body 61 is working, its temperature gradually decreases from the first end 61a to the second end 61b, meaning the temperature of the first end 61a is higher than the temperature of the second end 61b. Electronic components 71 are located near the first end 61a and are thermally connected to the heat exchange body 61. It should be noted that since the heat exchange body 61 needs to exchange heat with the internal environment or internal components of the control box 7, the temperature of the heat exchange body 61 described above and below refers to its surface temperature. Specifically, the surface temperature change of the heat exchange body 61 is determined by the heat exchange channels adjacent to the surface. For example, when the heat exchange channel adjacent to the surface of the heat exchange body 61 is the main channel, the refrigerant flow in the main channel is continuously heated by the refrigerant flow in the auxiliary channel. Therefore, the surface temperature of the heat exchange body 61 gradually decreases along the refrigerant flow direction of the main channel. In this case, the first end 61a is located upstream of the second end 61b along the refrigerant flow direction of the main channel. When the heat exchange channel adjacent to the surface of the heat exchange body 61 is the auxiliary channel, the surface temperature of the heat exchange body 61 gradually increases along the refrigerant flow direction of the auxiliary channel. In this case, the first end 61a is located downstream of the second end 61b along the refrigerant flow direction of the auxiliary channel.

[0247] Therefore, by dividing the heat exchanger body 61 into a first end 61a with a higher temperature and a second end 61b with a lower temperature according to the temperature change on the heat exchanger body 61 during operation, since the temperature difference between the first end 61a with a higher temperature and the hot air is small, no condensate will be generated or the amount of condensate generated will be small. By placing the electronic component 71 close to the first end 61a, the probability of the electronic component 71 coming into contact with the condensate can be reduced, thereby protecting the electronic component 71.

[0248] It is worth noting that air conditioners generally have cooling and heating modes, and the refrigerant flow direction may be opposite in these two modes. In this case, the temperature of the heat exchanger 61 exhibits opposite trends from the first end 61a to the second end 61b; that is, in one mode, the temperature of the heat exchanger 61 gradually decreases from the first end 61a to the second end 61b, while in the other mode, the temperature of the heat exchanger 61 gradually increases from the first end 61a to the second end 61b. In this embodiment, it is prioritized to ensure that the temperature of the heat exchanger 61 gradually decreases from the first end 61a to the second end 61b in cooling mode, for the following reasons:

[0249] When the ambient temperature is low, for example, when the air conditioner is operating in heating mode during winter, the air temperature inside the control box 7 is low. At this time, the temperature difference between the air inside the control box 7 and the radiator 6 is small, and the air is less likely to condense. Conversely, when the ambient temperature is high, for example, when the air conditioner is operating in cooling mode during summer, the air temperature inside the control box 7 is high, and the temperature difference between the air inside the control box 7 and the radiator 6 is large, making it easier for the air to condense. Therefore, in this embodiment, at least in the cooling mode of the air conditioner, the temperature of the heat exchange body 61 can be set to gradually decrease from the first end 61a to the second end 61b to prevent condensation from forming on the radiator 6 in cooling mode.

[0250] Furthermore, placing the electronic component 71 at a position close to the first end 61a means that the electronic component 71 has a first distance between its thermally conductive connection position on the heat exchange body 61 and the first end 61a, and a second distance between its thermally conductive connection position and the second end 61b, wherein the first distance is less than the second distance.

[0251] Specifically, since the temperature of the heat exchanger body 61 gradually decreases from the first end 61a to the second end 61b, the temperature at the first end 61a is the highest, and the temperature at the second end 61b is the lowest. The higher the temperature of the heat exchanger body 61, the smaller the temperature difference between it and the air inside the control box 7, and the less likely condensation is to form. Conversely, the lower the temperature of the heat exchanger body 61, the greater the temperature difference between it and the hot air, and the easier condensation is to form. In other words, the probability of condensation formation gradually increases from the first end 61a to the second end 61b of the heat exchanger body 61. Therefore, by placing the electronic component 71 closer to the end of the heat exchanger body 61 with a higher temperature, i.e., in a location where condensation is less likely to accumulate, the risk of the electronic component 71 coming into contact with condensation can be reduced, thereby protecting the electronic component 71.

[0252] Furthermore, such as Figure 34As shown, the extension direction of the heat exchange body 61 can be set in the vertical direction, and the first end 61a can be set above the second end 61b. In this way, when condensate is generated near the second end 61b of the heat exchange body 61, the condensate will flow downward in the vertical direction, that is, the condensate will flow away from the electronic component 71, thus avoiding contact between the electronic component 71 and the condensate.

[0253] Alternatively, the extension direction of the heat exchange body 61 can be set horizontally as needed, so that the condensate generated near the second end 61b can be quickly separated from the heat exchange body 61 under the action of gravity, avoiding contact with the electronic component 71. Alternatively, in other embodiments, the extension direction of the heat exchange body 61 can be set at an angle relative to the horizontal direction, which is not specifically limited in this application embodiment.

[0254] Understandably, the structure of the radiator 6 in this embodiment can be the same as that in the above embodiments, i.e., using a bent heat exchange body 61. Alternatively, the structure of the radiator 6 in this embodiment can also use a straight heat exchange body 61. Or, in addition to using the radiator 6 with microchannels described above, other types of radiators can also be used. This application does not limit the specific structure of the radiator 6. Furthermore, other embodiments of this application that apply the radiator to the electrical control box can use various radiators disclosed in this application, or other radiators known in the art.

[0255] 7. Condensation protection

[0256] Please see Figure 35 As shown, the electrical control box 7 in this embodiment includes a box body 72, a mounting plate 76, electronic components 71, and a heat sink 6.

[0257] The housing 72 has a mounting cavity 721, and a mounting plate 76 is disposed in the mounting cavity 721, so that the mounting cavity 721 forms a first chamber 7212 and a second chamber 7214 located on both sides of the mounting plate 76. The electronic component 71 is disposed in the second chamber 7214. At least a portion of the heat exchange body 61 is disposed in the first chamber 7212 and is thermally connected to the electronic component 71. The mounting plate 76 is used to prevent condensate from the radiator 6 from flowing into the second chamber 7214.

[0258] By setting an mounting plate 76 that separates the mounting cavity 721 in the electrical control box 7, and placing the heat exchange body 61 and the electronic component 71 in the independent first chamber 7212 and second chamber 7214 respectively, the electronic component 71 can be completely isolated from the condensate, thereby preventing the electronic component 71 from coming into contact with the condensate and causing a short circuit or damage.

[0259] Furthermore, a heat dissipation mounting plate 74 can be used to indirectly connect the electronic component 71 to the heat exchange body 61.

[0260] Specifically, clearance holes 762 can be made at positions corresponding to the mounting plate 76 and the heat dissipation fixing plate 74. The heat dissipation fixing plate 74 is connected to the heat exchange body 61 and seals the clearance holes 762. The electronic component 71 is located on the side of the heat dissipation fixing plate 74 away from the heat exchange body 61. In this way, the heat dissipation fixing plate 74 can be used to thermally connect the electronic component 71 and the heat exchange body 61, and the heat dissipation fixing plate 74 can be used to separate the first chamber 7212 and the second chamber 7214 to prevent condensate from flowing into the second chamber 7214 where the electronic component 71 is located through the clearance holes 762, thereby preventing condensate from contacting the electronic component 71.

[0261] Furthermore, if a large amount of condensate is generated on the heat exchanger body 61, the condensate will fall under the action of gravity after accumulating. The dripping condensate is easy to splash, which may cause hidden dangers to the circuit inside the electrical control box 7. Moreover, the relatively dispersed condensate is not conducive to the discharge of the electrical control box 7.

[0262] Therefore, as Figure 35 As shown, a baffle plate 77 can be installed inside the electrical control box 7. The baffle plate 77 is located on the lower side of the radiator 6 and is used to collect the condensate dripping from the radiator 6. The baffle plate 77 not only reduces the height of the condensate dripping and prevents the condensate from splashing, but also has a certain accumulation effect on the condensate, making it easier to collect the condensate and discharge it together into the electrical control box 7.

[0263] like Figure 35 As shown, the guide plate 77 is fixed to the base plate 723 of the electrical control box 7. One end of the guide plate 77 is connected to the base plate 723, and the other end of the guide plate 77 extends into the first chamber 7212. The vertical projection of the radiator 6 falls inside the guide plate 77. In this way, it can be ensured that the condensate dripping from the radiator 6 is located on the guide plate 77, preventing the condensate from dripping to other parts of the electrical control box 7.

[0264] Understandably, the radiator 6 can also be mounted on the mounting plate 76. In this case, one end of the guide plate 77 is connected to the mounting plate 76, and the other end of the guide plate 77 extends into the first chamber 7212. The vertical projection of the radiator 6 falls inside the guide plate 77.

[0265] Furthermore, such as Figure 36 As shown, in order to facilitate the timely discharge of condensate from the baffle plate 77 to the electrical control box 7, a drain outlet 725 can be opened on the bottom wall of the box 72, and the baffle plate 77 can be inclined relative to the bottom wall of the box 72. After the condensate is guided by the baffle plate 77, it is discharged from the box 72 through the drain outlet 725.

[0266] Specifically, a drain outlet 725 can be opened on the circumferential side plate 724 of the electrical control box 7. A guide plate 77 is connected to the mounting plate 76 or the bottom plate 723 of the box body 72 and is inclined towards the drain outlet 725. After the condensate drips onto the guide plate 77, it will converge along the inclined guide plate 77 to the position of the drain outlet 725 and then be discharged from the drain outlet 725 into the electrical control box 7.

[0267] The number and size of the drain outlets 725 can be flexibly set according to the amount of condensate, and this application embodiment does not make specific limitations.

[0268] In this embodiment, the flow direction of the refrigerant in the heat exchange body 61 can be set in the horizontal direction, that is, the extension direction of the heat exchange body 61 is set in the horizontal direction. On the one hand, this can shorten the flow path of the condensate on the heat exchange body 61, so that the condensate can drip onto the guide plate 77 as soon as possible under the action of gravity, so that the condensate can be discharged from the electrical control box 7 in a timely manner and avoid contact with the electronic components 71 located in the mounting cavity 721. On the other hand, it can also avoid interference between the guide plate 77 and the heat exchange body 61, thereby allowing for a relatively long heat exchange body 61 and improving the heat exchange efficiency of the radiator 6.

[0269] In another embodiment, such as Figure 37 As shown, the height of the guide plate 77 gradually decreases in the vertical direction from the middle region to both ends, so that the condensate dripping on the guide plate 77 flows to both ends of the guide plate 77. That is, the guide plate 77 is set in an inverted V shape. This method can reduce the overall height of the guide plate 77 in the vertical direction, avoid interference between the guide plate 77 and other components in the electrical control box 7, and also quickly drain the condensate dripping from the radiator 6 onto the guide plate 77.

[0270] Furthermore, such as Figure 37 As shown, the box body 72 is provided with a first drain outlet 771 and a second drain outlet 772 corresponding to the two ends of the guide plate 77, respectively, to discharge condensate flowing to both ends of the guide plate 77. The condensate dripping on the guide plate 77 flows to both ends of the guide plate 77 and is discharged from the box body 72 through the first drain outlet 771 and the second drain outlet 772.

[0271] In yet another embodiment, such as Figure 38 As shown, the height of the guide plate 77 gradually increases vertically from the middle region to both ends, so that the condensate dripping onto the guide plate 77 flows to the middle region of the guide plate 77. That is, the guide plate 77 can be arranged in a V-shape, which allows the condensate to converge to the middle region of the guide plate and be discharged from the middle region.

[0272] Furthermore, such as Figure 38As shown, the box 72 is provided with a drain outlet 725 corresponding to the middle area of ​​the guide plate 77 to discharge the condensate flowing to the middle area of ​​the guide plate 77. This method is conducive to the collection and discharge of condensate.

[0273] The number and size of the above-mentioned drain outlet 725, first drain outlet 771 and second drain outlet 772 can be flexibly set according to the amount of condensate, and this application embodiment does not make specific limitations.

[0274] It is worth noting that the aforementioned guide plate 77 can be disposed below the heat sink 6, which is installed in the control box 7 in other ways and is used to dissipate heat from the electronic components 71 inside the control box 7, and is not limited to the embodiments described above.

[0275] 8. Electronic components are installed upstream of the heat sink, and heat dissipation fins are installed downstream.

[0276] like Figure 39 As shown, the housing 72 has a mounting cavity 721, and at least a portion of the heat exchange body 61 is disposed within the mounting cavity 721. Electronic components 71 are thermally connected to the heat exchange body 61 at a first position, and heat dissipation fins 65 are thermally connected to the heat exchange body 61 at a second position. The first and second positions are spaced apart from each other along the direction of the refrigerant flow in the heat exchange body 61. As described above, the refrigerant flow mentioned here can be... Figure 1-4 The refrigerant flow in the air conditioning system shown can be either the main refrigerant flow or the auxiliary refrigerant flow.

[0277] In this embodiment, by arranging the electronic components 71 and the heat dissipation fins 65 at intervals along the flow direction of the refrigerant in the heat exchange body 61, the space on the heat exchange body 61 can be fully utilized. Not only can the heat exchange body 61 dissipate heat from the electronic components 71, but the heat dissipation fins 65 can also reduce the temperature inside the mounting cavity 721 of the electrical control box 7, thereby protecting the electronic components 71 installed in the mounting cavity 721.

[0278] Furthermore, the heat exchange body 61 includes a first end 61a and a second end 61b spaced apart from each other along the flow direction of the refrigerant, wherein the temperature of the heat exchange body 61 gradually decreases from the first end 61a to the second end 61b, that is, the temperature of the first end 61a is greater than the temperature of the second end 61b. The first position is positioned closer to the first end 61a than the second position.

[0279] Specifically, during the operation of the heat exchanger body 61, the surface temperature of the heat exchanger body 61 changes with the flow direction of the refrigerant, resulting in a higher temperature first end 61a and a lower temperature second end 61b. Since the temperature difference between the higher temperature first end 61a and the hot air in the mounting cavity 721 is small, condensation is less likely to occur. Therefore, the electronic component 71 can be positioned close to the first end 61a, i.e., the first position can be set near the first end 61a. Conversely, since the temperature difference between the lower temperature second end 61b and the hot air in the mounting cavity 721 is large, condensation is more likely to occur. Therefore, the heat dissipation fins 65 can be positioned close to the second end 61b. On one hand, the lower temperature of the heat dissipation fins 65 ensures a sufficiently large temperature difference between the heat dissipation fins 65 and the hot air, facilitating heat dissipation for the electrical control box 7. On the other hand, the condensation formed on the heat dissipation fins 65 will evaporate under the action of the hot air. The evaporation of the condensation absorbs heat, further reducing the temperature of the refrigerant flow and improving the heat exchange effect of the radiator 6.

[0280] 8.1 Accelerate the flow rate of the cooling airflow

[0281] Furthermore, such as Figure 40 As shown, a cooling fan 78 can also be installed inside the electrical control box 7. The cooling fan 78 is used to form a cooling airflow that acts on the heat dissipation fins 65 inside the electrical control box 7. In this way, the flow speed of the cooling airflow can be accelerated, thereby improving the heat exchange effect.

[0282] Optionally, the cooling fan 78 can be positioned close to the heat sink fins 65 to directly act on the heat sink fins 65.

[0283] Or, such as Figure 40 As shown, an installation plate 76 can also be provided in the electrical control box 7. The installation plate 76 is located in the installation cavity 721, so that the installation cavity 721 forms a first chamber 7212 and a second chamber 7214 located on both sides of the installation plate 76. A first vent 764 and a second vent 766 are spaced apart on the installation plate 76, so that the gas in the first chamber 7212 flows into the second chamber 7214 through the first vent 764, and the gas in the second chamber 7214 flows into the first chamber 7212 through the second vent 766. At least a part of the heat exchange body 61 is located in the first chamber 7212, and the electronic components 71 and the cooling fan 78 are located in the second chamber 7214.

[0284] By using mounting plate 76 to divide mounting cavity 721 into two independent first chamber 7212 and second chamber 7214, circulating airflow can be formed in the first chamber 7212 and second chamber 7214 to increase the air volume in contact with heat dissipation fins 65 in the first chamber 7212, and facilitate the cooling of electronic components 71 in the second chamber 7214 by the cooled airflow, avoiding gas mixing and improving the heat dissipation efficiency of heat dissipation fins 65.

[0285] The cooling fan 78 installed in the second chamber 7214 is used to accelerate the air flow speed in the second chamber 7214, thereby accelerating the air circulation speed between the first chamber 7212 and the second chamber 7214 and improving the heat dissipation efficiency of the electrical control box 7.

[0286] Furthermore, the flow direction of the heat dissipation airflow through the heat dissipation fins 65 can be set to be perpendicular to the flow direction of the refrigerant.

[0287] like Figure 39 and Figure 40 As shown, when the refrigerant flow in the heat exchanger body 61 is in the horizontal direction, the heat dissipation airflow can be set to flow in the vertical direction to avoid the heat dissipation airflow flowing to the location of the electronic component 71.

[0288] Specifically, the first vent 764 and the second vent 766 can be arranged vertically at intervals on opposite sides of the heat dissipation fins 65. The number and arrangement density of the first vent 764 and the second vent 766 can be set as needed.

[0289] Alternatively, when the refrigerant flow in the heat exchanger body 61 is vertical, the heat dissipation airflow can be configured to flow horizontally to prevent the heat dissipation airflow from flowing to the location of the electronic component 71. Alternatively, the flow direction of the heat dissipation airflow can also be configured to be along two other mutually perpendicular directions, as described in this embodiment.

[0290] Furthermore, when a first vent 764 and a second vent 766 are arranged vertically, the first vent 764 can be positioned above the second vent 766, so that the hot air entering the first chamber 7212 through the second vent 766 automatically rises to the position of the heat exchange body 61 and exchanges heat with the heat exchange body 61.

[0291] Optionally, the cooling fan 78 can be positioned near the first vent 764 so that the cold air at the top of the first chamber 7212 can enter the second chamber 7214 in a timely manner, and the cooling fan 78 can accelerate the cold air to improve the heat dissipation efficiency of the electronic component 71.

[0292] 9. Internal circulation

[0293] Normally, to cool down the electrical control box 7, ventilation holes communicating with the mounting cavity 721 are made on the box body 72 of the electrical control box 7. Heat exchange occurs through natural convection with the outside air via these ventilation holes, thus cooling the electrical control box 7. However, making ventilation holes on the box body 72 reduces the airtightness of the electrical control box 7. Moisture, dust, and other impurities from the outside can enter the mounting cavity 721 through the ventilation holes, potentially damaging the electronic components located within the mounting cavity 721.

[0294] To address the aforementioned problems, this embodiment proposes a sealed structure for the housing 72 of the electrical control box 7. For details, please refer to... Figure 41 The electrical control box 7 includes a box body 72, a mounting plate 76, a heat sink 6, electronic components 71, and a cooling fan 78.

[0295] The housing 72 has a mounting cavity 721, and a mounting plate 76 is disposed in the mounting cavity 721, so that the mounting cavity 721 forms a first chamber 7212 and a second chamber 7214 located on both sides of the mounting plate 76. The mounting plate 76 has a first vent 764 and a second vent 766 spaced apart, and the first vent 764 and the second vent 766 communicate with the first chamber 7212 and the second chamber 7214. The heat sink 6 is at least partially disposed in the first chamber 7212. The electronic component 71 is disposed in the second chamber 7214 and is thermally connected to the heat sink 6. The cooling fan 78 is used to deliver air so that the gas in the first chamber 7212 flows into the second chamber 7214 through the first vent 764.

[0296] In this embodiment, at least a portion of the heat sink 6 is disposed within the first chamber 7212, while the electronic component 71 and the cooling fan 78 are disposed within the second chamber 7214. A first ventilation port 764 and a second ventilation port 766, spaced apart and connecting the first and second chambers 7212 and 7214, are provided on the mounting plate 76. Thus, the heat generated by the electronic component 71 raises the temperature of the air within the second chamber 7214. The cooling fan 78 then delivers the hot air into the second ventilation port 766. Due to the lower density of the hot air, it naturally rises to contact the heat sink 6 located in the first chamber 7212. The heat sink 6 cools the hot air, creating cold air, which then flows out from the first ventilation port 764. 4. The air flows into the second chamber 7214, where the cooling fan 78 accelerates the air to cool the electronic components 71 located in the second chamber 7214. After exchanging heat with the electronic components 71, the temperature of the air rises. The air then continues to enter the second vent 766 under the action of the cooling fan 78, thus circulating and cooling the electronic components 71 located in the control box 7 through internal circulation. Compared with cooling by opening heat dissipation holes on the control box 7, the control box 7 in this application is a fully enclosed control box 7, which can effectively solve problems such as waterproofing, insect prevention, dust prevention, and moisture prevention, thereby improving the electrical control reliability of the control box 7.

[0297] In another embodiment, such as Figure 42 As shown, the plane where the cooling fan 78 is located is perpendicular to the plane where the mounting plate 76 is located, and the leeward side of the cooling fan 78 is positioned towards the first ventilation port 764.

[0298] Specifically, the cooling fan 78 can be positioned on the side of the mounting plate 76 facing the second chamber 7214. The rotation axis of the cooling fan 78 is parallel to the plane of the mounting plate 76, and the leeward side of the cooling fan 78 refers to the air inlet side of the cooling fan 78. In this embodiment, the cooling fan 78 can be positioned between the first vent 764 and the electronic component 71. The cold air entering the second chamber 7214 through the first vent 764 is accelerated by the cooling fan 78 and then flows out, thereby increasing the airflow speed and improving the heat dissipation efficiency of the control box 7.

[0299] In another embodiment, such as Figure 43 As shown, the cooling fan 78 can also be set as a centrifugal fan.

[0300] Centrifugal fans are machines that use input mechanical energy to increase gas pressure and discharge gas. The working principle of a centrifugal fan is to accelerate gas using a high-speed rotating impeller. Therefore, in this embodiment, by setting the cooling fan 78 as a centrifugal fan, high-speed cold air can be obtained, improving the heat dissipation efficiency of the electronic component 71. Furthermore, centrifugal fans can simplify the structure of the cooling fan 78 and improve installation efficiency.

[0301] Air guide plates (not shown in the figure) can also be spaced out on the mounting plate 76, and air guide channels can be formed between the air guide plates to guide the air blown out by the cooling fan 78.

[0302] For example, two parallel, spaced air guides can be placed between the dispersed electronic components 71, with the air guides extending along the spacing direction of the electronic components 71, thus defining an airflow channel between the two air guides along the spacing direction of the electronic components 71. The cool air blown out by the cooling fan 78 first flows to the location of some electronic components 71 to dissipate heat from them. After passing through some electronic components 71, the air further flows through the airflow channel to the location of another part of the electronic components 71 to dissipate heat from that part. In this way, the heat dissipation of the electronic components 71 can be more even, avoiding overheating of some electronic components 71 and damage.

[0303] The radiator 6 can be installed inside the electrical control box 7, that is, the heat exchange body 61 can be installed inside the first chamber 7212 to cool the air in the first chamber 7212.

[0304] Alternatively, the radiator 6 can be disposed outside the electrical control box 7, with at least a portion of the radiator 6 extending into the first chamber 7212. For example, if the radiator 6 includes a heat exchange body 61, a manifold assembly 62, and heat dissipation fins 65, an assembly port (not shown) communicating with the first chamber 7212 can be provided on the box body 72. In this case, the heat exchange body 61 is connected to the outer wall of the box body 72, the heat dissipation fins 65 are connected to the heat exchange body 61, and inserted into the first chamber 7212 through the assembly port.

[0305] In this embodiment, the way the heat sink 6 and the electrical control box 7 are connected is the same as in the above embodiments. Please refer to the description in the above embodiments, and it will not be repeated here.

[0306] like Figure 43 As shown, the electronic component 71 can be placed within the airflow range of the cooling fan 78 so that the cooling fan 78 can directly act on the electronic component 71 to cool it down.

[0307] The electronic component 71 may include, for example, a primary heat-generating component such as a common-mode inductor 711, an inductor 712, and a capacitor 713, and a secondary heat-generating component such as a fan module 714, which generates less heat. To improve the heat dissipation efficiency of the primary heat-generating component, the distance between the primary heat-generating component and the first vent 764 can be set smaller than the distance between the secondary heat-generating component and the first vent 764. That is, the primary heat-generating component, which generates more heat, can be placed closer to the first vent 764, and the secondary heat-generating component, which generates less heat, can be placed further away from the first vent 764. This allows the cooler air entering through the first vent 764 to first act on the primary heat-generating component, thereby improving its heat dissipation efficiency.

[0308] Optionally, the second vent 766 can be opened at the end of the air supply of the cooling fan 78 and close to the electronic component 71 that generates a lot of heat. On the one hand, this can expand the radiation range of the cooling fan 78 and improve the air circulation efficiency in the second chamber 7214. On the other hand, it can also allow the hot air after exchanging heat with the electronic component 71 to be discharged from the second chamber 7214 in a timely manner, so as to avoid raising the temperature of the entire second chamber 7214.

[0309] Furthermore, the second vent 766 can be positioned close to the first vent 764 to shorten the air circulation path within the second chamber 7214, reduce airflow resistance, improve air circulation efficiency, and thus improve the heat dissipation efficiency of the electrical control box 7.

[0310] Furthermore, the dimensions of the first vent 764 and the second vent 766 can also be set according to the arrangement of the electronic components 71.

[0311] Specifically, there can be multiple second vents 766, each located at a different position on the mounting plate 76. The second vents 766 located at the positions of electronic components 71 with higher heat generation can be relatively larger in size, more numerous, and have a relatively high distribution density. Conversely, the second vents 766 located at the positions of electronic components 71 with lower heat generation can be relatively smaller in size, fewer in number, and have a relatively low distribution density.

[0312] Furthermore, the size of the first vent 764 can be set to be larger than the size of the second vent 766 to increase the return air volume and improve the efficiency of the cooling fan 78.

[0313] 10. Natural convection

[0314] Please see Figure 44 and Figure 45 In this embodiment, the electrical control box 7 includes a box body 72, a mounting plate 76, a heat sink 6, and a main heating element 715.

[0315] The housing 72 has a mounting cavity 721, and a mounting plate 76 is disposed in the mounting cavity 721, so that the mounting cavity 721 forms a first chamber 7212 and a second chamber 7214 located on both sides of the mounting plate 76. The mounting plate 76 has a first vent 764 and a second vent 766 spaced vertically. The radiator 6 is at least partially disposed in the first chamber 7212. The main heating element 715 is disposed in the second chamber 7214. The first vent 764 and the second vent 766 connect the first chamber 7212 and the second chamber 7214, so as to form a circulating heat dissipation airflow between the first chamber 7212 and the second chamber 7214 by utilizing the temperature difference between the main heating element 715 and the radiator 6.

[0316] Specifically, the main heating element 715 is located in the second chamber 7214. The heat generated by the main heating element 715 causes the temperature in the second chamber 7214 to rise. Since the density of hot air is low, the hot air naturally rises and enters the first chamber 7212 through the first vent 764 at the top of the second chamber 7214. After the hot air comes into contact with the radiator 6, it exchanges heat with the radiator 6. The temperature of the hot air decreases and its density increases. Under the action of gravity, it naturally sinks to the bottom of the first chamber 7212 and enters the second chamber 7214 through the second vent 766 to cool the main heating element 715 located in the second chamber 7214. The hot air after exchanging heat with the main heating element 715 rises further to the position of the first vent 764, thereby forming an internal circulating airflow between the first chamber 7212 and the second chamber 7214.

[0317] In this embodiment, by opening a first ventilation port 764 and a second ventilation port 766 on the mounting plate 76 to connect the first chamber 7212 and the second chamber 7214, and arranging the first ventilation port 764 and the second ventilation port 766 in a vertical direction, the air can circulate between the first chamber 7212 and the second chamber 7214 using its own gravity, so as to cool down the electronic component 71 located in the second chamber 7214 and reduce the overall temperature of the control box 7. Compared with the solution of using a cooling fan 78 for air supply, the structure of the control box 7 in this embodiment is simpler, thereby improving the assembly efficiency of the control box 7 and reducing the production cost of the control box 7.

[0318] Furthermore, the radiator 6 can be positioned above the main heating element 715 along the direction of gravity, that is, the radiator 6 can be positioned near the top of the first chamber 7212, and the main heating element 715 can be positioned near the bottom of the second chamber 7214. This arrangement reduces the distance between the radiator 6 and the first vent 764, allowing hot air entering the first chamber 7212 through the first vent 764 to quickly contact the radiator 6 for cooling and then naturally sink under gravity. Similarly, reducing the distance between the main heating element 715 and the second vent 766 allows hot air entering the second chamber 7214 through the second vent 766 to quickly contact the main heating element 715 for heating and then naturally rise under buoyancy. This increases the airflow circulation speed within the control box 7, improving heat dissipation efficiency.

[0319] Furthermore, such as Figure 45 As shown, a secondary heating element 716 can also be installed in the electrical control box 7. The secondary heating element 716 is located in the second chamber 7214 and is thermally connected to the heat exchange body 61. The heat output of the secondary heating element 716 is less than that of the main heating element 715.

[0320] Specifically, in this embodiment, the main heating element 715, which generates a large amount of heat, can be positioned near the second vent 766. This allows the cold air entering through the first chamber 7212 to first contact the electronic component 71, which generates a large amount of heat, thus improving the heat dissipation efficiency of the electronic component 71. Furthermore, it creates a significant temperature difference between the cold air and the electronic component 71, allowing the cold air to heat up rapidly and rise quickly under buoyancy. The secondary heating element 716, which generates a smaller amount of heat, is positioned on and in contact with the heat exchange body 61, allowing the heat exchange body 61 to directly cool the electronic component 71. Thus, by separating the main heating element 715 and the secondary heating element 716 into different areas, the distribution of the electronic components 71 is optimized, and the internal space of the control box 7 is fully utilized.

[0321] Optionally, the secondary heating element 716 is connected to the heat exchange body 61 via a heat dissipation fixing plate 74 to improve the assembly efficiency of the secondary heating element 716.

[0322] The connection method between the secondary heating element 716 and the heat exchange body 61 can be the same as that in the above embodiments, and will not be repeated here.

[0323] Alternatively, the heat sink 6 can be disposed outside the electrical control box 7, and at least a portion of the heat sink 6 can be extended into the first chamber 7212.

[0324] The way the heat sink 6 and the electrical control box 7 are connected is the same as in the above embodiments. Please refer to the description in the above embodiments.

[0325] 11. Install drainage sleeves on the pipeline.

[0326] like Figure 46 and Figure 47 As shown, the air conditioning system 1 in this embodiment includes a radiator 6, a pipe 710, and a drain sleeve 79.

[0327] Pipe 710 is used to connect to radiator 6 to supply refrigerant flow to radiator 6 or to collect refrigerant flow flowing out of radiator 6. Specifically, pipe 710 is connected to the manifold assembly of radiator 6.

[0328] The pipe 710 may include an input pipe and an output pipe. The input pipe is used to provide refrigerant flow to the radiator 6, and the output pipe is used to collect the refrigerant flow inside the radiator 6.

[0329] A drainage sleeve 79 is fitted onto the pipe 710 to drain condensate formed on or flowing through the pipe. This drainage sleeve 79 guides the condensate from the pipe 710 and protects the pipe 710, thus improving the reliability of the air conditioning system 1.

[0330] Specifically, such as Figure 48 As shown, the drainage sleeve 79 includes a sleeve body 791 and a flange 792.

[0331] The sleeve 791 is provided with insertion holes 793 and drainage grooves 708. Insertion holes 793 are used to accommodate pipes 710. The number and size of insertion holes 793 can be set according to the distribution and size of the pipes 710. For example, in... Figure 46 In the illustrated embodiment, the number of insertion holes 793 can be 2, while in other embodiments, the number of insertion holes 793 can be 1 or 3, etc.

[0332] The sleeve 791 can be made of a flexible material, such as thermoplastic polyurethane elastomer rubber, to protect the pipe 710 and prevent the pipe 710 from coming into contact with the sheet metal of the electrical control box during vibration and causing wear.

[0333] A flange 792 is disposed on the end face of the sleeve 791 and located around the insertion hole 793, thereby cooperating with the sleeve 791 to form a water collection tank 794. The water collection tank 794 is used to collect condensate from the pipe 710. A drain trough 708 is connected to the water collection tank 794 and is used to drain the condensate from the water collection tank 794. When the air conditioning system is running, the condensate flows along the pipe 710 into the water collection tank 794 of the drain sleeve 79, and is then discharged through the drain trough 708 on the sleeve 791.

[0334] like Figure 48As shown, the outer wall of the flange 792 is flush with the outer wall of the sleeve 791 to increase the volume of the water collection tank 794, which is more conducive to the collection of condensate.

[0335] The pipe 710 can be arranged along the direction of gravity. The sleeve 791 includes an upper end face and a lower end face arranged opposite to each other. A flange 792 and a water collection tank 794 are disposed on the upper end face of the sleeve 791. A drain trough 708 connects the upper end face and the lower end face of the sleeve 791. Condensate on the pipe 710 can flow into the water collection tank 794 under the action of gravity, and then be discharged through the drain trough 708 connected to the water collection tank 794. In this way, condensate on the pipe 710 can be automatically discharged. In other embodiments, the pipe 710 can also be arranged at an angle to adapt to different application scenarios.

[0336] like Figure 48 As shown, a drainage groove 708 is formed on the side wall of the sleeve 791 and further connects the insertion hole 793 and the outer surface of the sleeve 791, allowing the pipe 710 to be inserted into the insertion hole 793 through the drainage groove 708. This design, on the one hand, allows the drain sleeve 79 to be fitted onto the pipe 710 through the drainage groove 708, facilitating the assembly of the drain sleeve 79 and the pipe 710; on the other hand, it also allows the drainage groove 708 to discharge condensate from the water collection tank 794, simplifying the structure of the drain sleeve 79. The size of the drainage groove 708 can be selected according to the amount of condensate, and is not specifically limited here.

[0337] Optionally, the flange 792 has an opening on the side where the drain trough 708 is located, allowing the pipe 710 to enter the water collection trough 794 through the opening. This facilitates the assembly of the drain sleeve 79.

[0338] like Figure 46 and 50 As shown, the air conditioning system 1 further includes an electrical control box 7, which includes a box body 72 and a radiator 6 disposed within the box body 72. Optionally, a drain outlet 725 is provided on the box body 72, and a drain sleeve 79 is embedded in the drain outlet 725. Condensate in the electrical control box 7 can be collected into the water collection tank 794 of the drain sleeve 79 and discharged through the drain trough 708. In this way, not only is the discharge of condensate facilitated, but the drain sleeve 79 can also seal the electrical control box 7, thereby improving the reliability of the electrical control box 7.

[0339] The sleeve 791 and flange 792 abut against the box 72. The drainage groove 708 and the opening on the flange 792 are located on the side where the sleeve 791 and flange 792 abut against the box 72, so that the box 72 seals the drainage groove 708 and the opening from the side of the drainage sleeve 79. This method can improve the sealing performance of the electrical control box 7 and reduce the area of ​​the electrical control box 7 communicating with the outside world.

[0340] In another embodiment, such as Figure 49 As shown, this embodiment is similar to Figure 48 The difference in the illustrated embodiment is that the insertion hole 793 may also have a plurality of protruding ribs 796 inside. The plurality of protruding ribs 796 are arranged at intervals around the pipe 710 and abut against the pipe 710 to further form a drainage groove 709 between the protruding ribs 796. The water collection tank 794 is connected to the drainage groove 709, and the condensate collected in the water collection tank 794 can also be discharged through this drainage groove 709. Figure 49 In the illustrated embodiment, the drainage sleeve 79 is simultaneously provided with a drainage groove 708 and a drainage groove 709. This facilitates the drainage of condensate in the water collection tank 794 and prevents condensate from overflowing. The protruding ribs 796 can connect the upper and lower end faces of the sleeve body 791. The number of protruding ribs 796 can be 2, 3, 4, or 5, etc. The extending direction of the protruding ribs 796 is the same as the extending direction of the pipe 710 to facilitate the drainage of condensate.

[0341] The protruding rib 796 can be integrally formed with the sleeve 791 to facilitate processing and make the structure of the drainage sleeve 79 more reliable. In other embodiments, the protruding rib 796 can also be bonded to the inner surface of the insertion hole 793. The number of protruding ribs 796 can be selected according to the actual amount of condensate to be discharged, and no specific limitation is made in this application.

[0342] It is understood that in other embodiments, the drainage sleeve 79 may only have a drainage groove 709, without a drainage groove 708. This method can also achieve the discharge of condensate in the water collection tank 794, and makes the structure of the drainage sleeve 79 simpler.

[0343] like Figure 49 As shown, a fixing groove 797 can also be provided on the sleeve 791. The fixing groove 797 is used to engage with the box 72 to fix the drainage sleeve 79. Optionally, the fixing groove 797 can be provided on the side of the sleeve 791 where the drainage groove 708 is provided, so as to facilitate the installation of the drainage sleeve 79. The fixing groove 797 can fix the drainage sleeve 79, preventing the drainage sleeve 79 from sliding on the pipe 710. At the same time, the drainage sleeve 79 can fix the pipe 710, preventing the pipe 710 from tilting under the action of external force, thereby improving the reliability of the air conditioning system 1.

[0344] In the above embodiment, a drain sleeve 79 is provided on the pipe 710 of the air conditioning system 1, which can drain the condensate on the pipe 710, protect the pipe 710, and seal the electrical control box 7, thereby improving the reliability of the air conditioning system 1.

[0345] The structures in the above embodiments can be combined with each other. Furthermore, it is understood that, in addition to the heat sink 6 described above, other types of heat sink 6 can also be used in the above embodiments. This application does not impose specific limitations on these embodiments.

[0346] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An air conditioning system, characterized in that, The air conditioning system includes an indoor heat exchanger, an outdoor heat exchanger, an economizer, and an electrical control box. The economizer is disposed between the indoor and outdoor heat exchangers. The economizer includes a heat exchange body, which includes two first plates and a second plate sandwiched between the two first plates. The first plates form first microchannels for the flow of a first refrigerant, and the second plate forms second microchannels for the flow of a second refrigerant. The second refrigerant absorbs heat from the first refrigerant, thereby subcooling the first refrigerant. The economizer is further configured to dissipate heat from electronic components within the electrical control box, and the electronic components are configured to be thermally connected to the first plates.

2. The air conditioning system according to claim 1, characterized in that, The electronic components are disposed on the surface of the first plate away from the second plate.

3. The air conditioning system according to claim 1, characterized in that, The electrical control box includes a box body, the box body has a mounting cavity, the electronic components are disposed in the mounting cavity, and the economizer is disposed in the mounting cavity or at least partially disposed in the mounting cavity.

4. The air conditioning system according to claim 3, characterized in that, The heat exchange body includes a first extension and a second extension. The second extension is connected to the end of the first extension and bent to one side of the first extension. The electronic component is thermally connected to the first extension and / or the second extension.

5. The air conditioning system according to claim 4, characterized in that, There are two second extensions, which are respectively connected to the opposite ends of the first extension and bend toward the same side of the first extension.

6. The air conditioning system according to claim 4, characterized in that, The box body includes a bottom plate and a circumferential side plate. One end of the circumferential side plate is connected to the bottom plate to form the mounting cavity. The first extension is arranged parallel to the bottom plate, and the second extension is arranged parallel to the circumferential side plate.

7. The air conditioning system according to claim 1, characterized in that, The air conditioning system further includes a compressor and a gas-liquid separator. The second refrigerant flow passing through the second microchannel is further delivered to the enthalpy-increasing inlet of the compressor or the gas-liquid separator, wherein the outlet of the gas-liquid separator is further connected to the return port of the compressor.

8. The air conditioning system according to claim 7, characterized in that, The air conditioning system further includes a switching component for selectively delivering the second refrigerant flow flowing through the second microchannel to the enthalpy-increasing inlet of the compressor and the inlet of the gas-liquid separator.

9. The air conditioning system according to claim 1, characterized in that, The heat exchange body further includes a connecting piece sandwiched between the first plate and the second plate. Solder is provided on both sides of the connecting piece, and the solder is used to weld and fix the connecting piece to the first plate and the second plate on both sides of the connecting piece.

10. The air conditioning system according to claim 3, characterized in that, The electrical control box also includes: A mounting plate is disposed within the mounting cavity, such that the mounting cavity forms a first chamber and a second chamber located on both sides of the mounting plate; The electronic components are disposed in the second chamber; at least a portion of the heat exchange body is disposed in the first chamber and is thermally connected to the electronic components; the mounting plate is used to prevent condensate from the heat exchange body from flowing into the second chamber.

11. The air conditioning system according to claim 3, characterized in that, The electrical control box also includes: A mounting plate is disposed within the mounting cavity, such that the mounting cavity forms a first chamber and a second chamber located on both sides of the mounting plate. The mounting plate is provided with a first vent and a second vent spaced vertically apart. The heat exchange body is at least partially disposed in the first chamber, and the electronic components are disposed in the second chamber. The first vent and the second vent connect the first chamber and the second chamber to form a circulating cooling airflow between the first chamber and the second chamber by utilizing the temperature difference between the electronic components and the economizer.

12. The air conditioning system according to claim 3, characterized in that, The electrical control box also includes: An mounting plate is disposed within the mounting cavity, such that the mounting cavity forms a first chamber and a second chamber located on both sides of the mounting plate. The mounting plate is provided with a first vent and a second vent spaced apart, the first vent and the second vent connecting the first chamber and the second chamber. The heat exchange body is at least partially disposed within the first chamber, and the electronic components are disposed within the second chamber. A cooling fan is used to deliver air so that the gas in the first chamber flows into the second chamber through the first vent.

13. The air conditioning system according to claim 3, characterized in that, The electrical control box also includes: An mounting plate is disposed within the mounting cavity, such that the mounting cavity forms a first chamber and a second chamber located on both sides of the mounting plate. A first vent and a second vent are spaced apart on the mounting plate, such that gas in the first chamber flows into the second chamber through the first vent, and gas in the second chamber flows into the first chamber through the second vent. At least a portion of the heat exchange body is disposed within the first chamber, and the first vent and the second vent have a spacing direction, with the refrigerant flow direction in the heat exchange body arranged along the spacing direction. The heat exchanger has a first temperature near the first vent and a second temperature near the second vent, wherein the first temperature is greater than the second temperature.

14. The air conditioning system according to claim 3, characterized in that, The electrical control box further includes heat dissipation fins, wherein the electronic component is thermally connected to the first plate at a first position; the heat dissipation fins are thermally connected to the first plate at a second position, wherein the first position and the second position are spaced apart from each other along the flow direction of the refrigerant in the heat exchange body.

15. The air conditioning system according to claim 1, characterized in that, The heat exchanger body has a first end and a second end along the flow direction of the refrigerant. When the heat exchanger body is working, the temperature of the first end is higher than the temperature of the second end. The electronic component is thermally connected to the first plate near the first end.

16. The air conditioning system according to claim 1, characterized in that, The flow direction of the first refrigerant flow is opposite to that of the second refrigerant flow.

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