Backlight module and display device

Abstract

This application discloses a backlight module and a display device. The backlight module includes a backplate, a frame-mounted light-emitting device, a light guide plate, and a heat-absorbing device. Both the light-emitting device and the light guide plate are located within a receiving groove. A first sealing connector assembly connects and fixes the frame and the light guide plate, simultaneously forming a sealed cavity within the receiving groove to enclose the light-emitting device. Coolant is disposed within the sealed cavity. The backlight module forms a sealed cavity to enclose the light-emitting device. The coolant injected into the sealed cavity allows it to directly contact the light-emitting device. This direct contact allows the coolant to immediately absorb the heat generated by the light-emitting device and disperse the heat through diffusion, thereby improving heat dissipation and significantly increasing heat dissipation efficiency, effectively extending the service life of the backlight module.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a backlight module and display device. Background Technology

[0002] With the development of display technology, users have increasingly higher requirements for display quality. To improve display quality, the power of the light source in display devices is constantly increasing. This increase in power also leads to a continuous increase in heat generation. If this heat cannot be dissipated in time, it will significantly reduce the lifespan of the display device.

[0003] Improving the heat dissipation efficiency of display devices is a major challenge for their further development. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a backlight module and display device to improve the heat dissipation efficiency of display devices.

[0005] To address the aforementioned issues, this application provides a backlight module comprising: a backplate; a frame surrounding the backplate to form a receiving groove on one side of the backplate; a light-emitting device disposed within the receiving groove; and a light guide plate disposed on the backplate, corresponding to the light-emitting device, wherein light emitted by the light-emitting device enters the light guide plate from one end; and further comprising: a first sealing connector assembly connecting and fixing the frame and the light guide plate, thereby forming a sealed cavity within the receiving groove to enclose the light-emitting device, wherein a coolant is disposed within the sealed cavity.

[0006] In one possible implementation, the frame includes a sidewall and a top wall. The sidewall surrounds the back plate, and the back plate has a partition wall that divides the receiving groove into adjacent first blind grooves and second blind grooves. The light-emitting device and the light guide plate are both located in the second blind groove. The light-emitting device is disposed on the side of the partition wall facing the second blind groove. The top wall covers the first blind groove and partially covers the second blind groove. A sealing cavity is formed in the second blind groove near the partition wall by the first sealing connector assembly to close the light-emitting device.

[0007] In one possible implementation, it further includes: a heat-absorbing device embedded in the back plate in the region corresponding to the sealing cavity; the heat-absorbing device includes a thermally conductive metal layer and a graphene layer covering the thermally conductive metal layer; a plurality of the heat-absorbing devices are spliced ​​and embedded in the back plate, wherein, between two adjacent heat-absorbing devices, the thermally conductive metal layer of one heat-absorbing device is disposed close to the sealing cavity, and the graphene layer of the other heat-absorbing device is disposed close to the sealing cavity.

[0008] In one possible implementation, the first sealing connector assembly includes: a first sealant disposed on the light guide plate, wherein a first groove is formed on the side of the first sealant away from the light guide plate; a first inverted wall extending toward the back plate is formed on the edge of the top wall away from the partition wall, wherein a first protrusion is provided on the top wall corresponding to the first groove, the first protrusion being interference-fitted into the first groove to form the sealing cavity; and a corresponding groove and a second protrusion are formed on the opposite side of the first sealant and the first inverted wall, wherein the second protrusion is embedded in the groove to fasten the sealant frame and the light guide plate.

[0009] In one possible implementation, it further includes: a second sealing connector assembly, the second sealing connector assembly comprising: a second sealant disposed on the back plate, located in the first blind groove, the side of the second sealant away from the back plate forming a second groove; a third protrusion disposed on the top wall corresponding to the second groove, the third protrusion being interference-fitted into the second groove; a fourth protrusion formed on the side of the second sealant away from the partition wall, a second inverted wall formed on the side wall of the adhesive frame, the second inverted wall abutting against the fourth protrusion to securely fasten the back plate and the adhesive frame.

[0010] In one possible implementation, the light guide plate is a rigid material light guide plate.

[0011] In one possible implementation, it further includes: a support device disposed on the top wall, the support device comprising: a threaded spring sleeve disposed on the top wall; having a threaded hole formed therein; and a spring located within the threaded hole, the length of the spring extending out of the threaded hole being adjustable by screwing.

[0012] In one possible implementation, multiple support devices are provided. The support device is provided in the area of ​​the top wall corresponding to the first blind slot, where one end of the support device is located on the top wall and the other end contacts the back plate. The support device is provided in the area of ​​the top wall corresponding to the second blind slot, where one end of the support device is located on the top wall and the other end contacts the light guide plate.

[0013] In one possible implementation, it further includes: a thermally conductive metal tape covering the sidewall of the frame and the area of ​​the back plate where the heat-absorbing device is embedded.

[0014] To address the aforementioned issues, this application also provides a display device comprising a backlight module and a display panel, wherein the backlight module is disposed corresponding to the display panel; the backlight module is the backlight module described in the above embodiments.

[0015] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a backlight module and display device. The backlight module includes a backplate, a frame, a light-emitting device, a light guide plate, and a first sealing connector assembly. The first sealing connector assembly connects and fixes the frame and the light guide plate, simultaneously forming a sealed cavity within the receiving groove to enclose the light-emitting device. Coolant is disposed within the sealed cavity. This backlight module forms a sealed cavity to enclose the light-emitting device. The coolant injected into the sealed cavity allows it to directly contact the light-emitting device. This direct contact allows the coolant to immediately absorb the heat generated by the light-emitting device and disperse the heat through diffusion, thereby improving heat dissipation and significantly increasing heat dissipation efficiency, effectively extending the service life of the backlight module. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a partial structural schematic diagram of an embodiment of the backlight module of this application;

[0018] Figure 2 for Figure 1 Schematic diagram of the connection structure of the first sealing connector group in the backlight module;

[0019] Figure 3 for Figure 1 Schematic diagram of the connection structure of the second sealing connector group in the backlight module;

[0020] Figure 4 for Figure 1 A schematic diagram of the structure in which several heat-absorbing devices are spliced ​​and embedded into the back panel in the backlight module;

[0021] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure of several heat absorption devices;

[0022] Figure 6 for Figure 4 Schematic diagram of the graphene layer structure in the heat absorption device;

[0023] Figure 7 for Figure 4 Schematic diagram of the thermally conductive metal layer structure in the heat absorption device.

[0024] Explanation of icon numbers:

[0025] 100. Backlight module; 10. Frame; 11. Frame sidewall; 12. Top wall; 20. Back plate; 21. Partition wall; 30. Receiving groove; 31. First blind groove; 32. Second blind groove; 321. Sealing cavity; 40. Heat absorption device; 51. First inverted wall; 52. Second inverted wall; 53. Groove; 60. Thermally conductive metal tape; 71. First sealing connector assembly; 711. First sealant; 712. First slot; 713. First protrusion; 714. Second protrusion; 72. Second sealing connector assembly; 721. Second sealant; 722. Second slot; 723. Third protrusion; 724. Fourth protrusion; 81. Light guide plate; 82. Light-emitting device; 83. Support device; 84. Waterproof silicone; 41. Graphene layer; 42. Thermally conductive metal layer. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless otherwise clearly indicated above. “Multiple” generally includes at least two, but does not exclude the inclusion of at least one.

[0028] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0029] It should be understood that the terms "comprising," "including," or any other variations used herein are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0030] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in every place in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] As display devices become increasingly powerful, they generate more and more heat. If heat cannot be effectively dissipated, it will seriously affect the lifespan of the display devices.

[0033] To address the aforementioned problems, this application proposes a backlight module and display device. By incorporating a contact liquid cooling system and a heat absorption device, the problems are effectively solved.

[0034] The backlight module and display device provided in this application will be described in detail below with reference to the accompanying drawings and embodiments.

[0035] Please see Figures 1 to 7 , Figure 1 This is a partial structural schematic diagram of an embodiment of the backlight module of this application; Figure 2 for Figure 1 Schematic diagram of the connection structure of the first sealing connector group in the backlight module; Figure 3 for Figure 1 Schematic diagram of the connection structure of the second sealing connector group in the backlight module; Figure 4 for Figure 1 A schematic diagram of the structure in which several heat-absorbing devices are spliced ​​and embedded into the back panel in the backlight module; Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure of several heat absorption devices. Figure 6 for Figure 4 A schematic diagram of the graphene layer structure in the heat absorption device. Figure 7 for Figure 4 A schematic diagram of the heat-conducting metal layer structure in the heat absorption device. In this embodiment, the backlight module 100 includes a back plate 20, a frame 10, a light-emitting device 82, a light guide plate 81, and a first sealing connector group 71.

[0036] A frame 10 is arranged around the back panel 20 to form a receiving groove 30 on one side of the back panel 20. A light-emitting device 82 is disposed within the receiving groove 30. A light guide plate 81 is disposed on the back panel 20, corresponding to the light-emitting device 82. Light emitted from the light-emitting device 82 enters the light guide plate 81 from one end. Specifically, in this application, the backlight module 100 is a side-lit backlight module 100. The side-lit backlight module 100 includes a light guide plate 81 and a light-emitting device 82 located on the side. The light-emitting device 82 provides a side light source. After the side light source enters the light guide plate 81, the light guide plate 81 converts the side light source into a surface light source and emits light uniformly. The frame 10 is used to limit and fix the light-emitting device 82, the back panel 20, the light guide plate 81, etc. The frame 10 is also arranged around the perimeter to protect the backlight module 100.

[0037] Both the light-emitting device 82 and the light guide plate 81 are located within the receiving groove 30. The first sealing connector group 71 connects the fixing frame 10 and the light guide plate 81, and simultaneously forms a sealed cavity 321 within the receiving groove 30 to enclose the light-emitting device 82. The sealed cavity 321 is filled with coolant. Specifically, the formation of the sealed cavity 321 allows the coolant within the sealed cavity 321 to directly contact the light-emitting device 82. The directly contacting coolant can immediately absorb the heat generated by the light-emitting device 82 and disperse the heat with the diffusion of the coolant, thereby improving the heat dissipation effect, greatly improving the heat dissipation efficiency, and effectively extending the service life of the backlight module 100.

[0038] Unlike existing technologies, this application proposes a backlight module 100, which forms a sealed cavity 321 enclosing the light-emitting device 82. Coolant is injected into the sealed cavity 321 so that the coolant in the sealed cavity 321 can directly contact the light-emitting device 82. The directly contacting coolant can immediately absorb the heat generated by the light-emitting device 82 and disperse the heat with the diffusion of the coolant, thereby improving the heat dissipation effect, greatly improving the heat dissipation efficiency, and effectively extending the service life of the backlight module 100.

[0039] Furthermore, in this embodiment, the backlight module 100 is also provided with a heat absorption device 40, which is located on the side of the sealed cavity 321. The coolant in the sealed cavity 321 absorbs and evenly heats the heat generated by the light-emitting device 82. In addition, the heat absorption device 40 can absorb the heat of the coolant, so that the heat in the sealed cavity 321 can be dissipated. The heat is evenly heated by the light-emitting device 82 by the coolant, and then the heat is dissipated by the heat absorption device 40 from the sealed cavity 321. The above greatly improves the heat dissipation efficiency and effectively extends the service life of the backlight module 100.

[0040] In this embodiment, the receiving groove 30 includes adjacent first blind grooves 31 and second blind grooves 32. The frame 10 includes a frame sidewall 11 and a top wall 12. The frame sidewall 11 is arranged around the back plate 20. The back plate 20 has a partition wall 21, which divides the receiving groove 30 into adjacent first blind grooves 31 and second blind grooves 32. The light-emitting device 82 is disposed on the side of the partition wall 21 facing the second blind groove 32. The top wall 12 covers the first blind groove 31 and partially covers the second blind groove 32. A sealed cavity 321 for sealing the light-emitting device 82 is formed on the side of the second blind groove 32 near the partition wall 21 by the first sealing connector assembly 71. Specifically, the receiving groove 30 is divided into the first blind groove 31 and the second blind groove 32 by the partition wall 21. The flexible circuit board, the driving chip, etc. are located in the first blind groove 31, and the light-emitting device 82 is driven to emit light by the flexible circuit board and the driving chip in the first blind groove 31. Therefore, the light-emitting device 82 is positioned on the side of the partition wall 21 facing the second blind slot 32 to reduce wiring distance. The light-emitting device 82 includes a circuit board (not shown) fixed to the partition wall 21 and a light-emitting chip (not shown) mounted on the circuit board. Wiring holes (not shown) are provided in the area of ​​the partition wall 21 covered by the circuit board, through which the wiring passes, allowing the driving chip in the first blind slot to drive the light-emitting chip in the second blind slot. In some embodiments, the wiring hole area is also covered with sealant to prevent coolant leakage from the sealed cavity 321. The top wall 12 covers the first blind slot 31, sealing it and protecting the components inside. The first sealing connector assembly 71 provides a seal, forming a sealed cavity 321 enclosing the light-emitting device 82. The sealed cavity 321 is located within the second blind slot 32, and coolant is injected into it, directly contacting the light-emitting device 82 for heat dissipation. The first sealing connector group 71 is used to connect the fixed frame 10 and the light guide plate 81. The first sealing connector group 71 is also used to assist in forming the sealing cavity 321. When the fixed frame 10 and the light guide plate 81 are connected by the first sealing connector group 71, the sealing cavity 321 is automatically formed.

[0041] As described above, the heat-absorbing device 40 is located on one side of the sealed cavity 321. The first blind slot 31 corresponds to the frame area of ​​the backlight module 100, i.e., the non-display area. The first blind slot 31 can be used to accommodate flexible circuit boards, driver chips, etc. The light-emitting device 82 and the light guide plate 81 are both located in the second blind slot 32. The light-emitting device 82 is a side light source and is located on the side wall of the second blind slot 32 near the first blind slot 31. In order to improve the heat dissipation efficiency of the backlight module 100, this application simultaneously provides a coolant and a heat-absorbing device 40. First, the first sealing connector group 71 is used to connect the frame 10 and the light guide plate 81. The first sealing connector group 71 is also a sealing device. The first sealing connector group 71 also forms a sealed cavity 321 that closes the light-emitting device 82. By setting the coolant in the sealed cavity 321, the coolant directly contacts the light-emitting device 82. The coolant can quickly cool the light-emitting device 82 and disperse the heat. As the coolant diffuses, the heat is carried away. On the other hand, this application also absorbs the heat of the coolant through the heat absorption device 40. The light-emitting device 82 and the light guide plate 81 are both disposed above the back plate 20. The heat absorption device 40 is embedded in the area corresponding to the sealing cavity 321 inside the back plate 20. The heat absorption device 40 can quickly dissipate the heat in the sealing cavity 321, so that the heat of the light-emitting device 82 is absorbed and diffused by the coolant, and the heat of the coolant is then absorbed by the heat absorption device 40 and discharged. The above improves the heat dissipation efficiency of the backlight module 100.

[0042] Furthermore, the coolant can specifically be alcohol, glycerin, ethylene glycol, etc. In this embodiment, ultrapure water is preferred as the coolant. Ultrapure water has the characteristics of insulation, high specific heat capacity, and colorless transparency. Using ultrapure water as the coolant can prevent short circuits in the backlight module 100, improve heat dissipation, and not affect the propagation of light emitted by the light-emitting device 82.

[0043] Further, in this embodiment, the first sealing connector assembly 71 includes: a first sealant 711 disposed on the light guide plate 81, with a first groove 712 formed on the side of the first sealant 711 away from the light guide plate 81. A first inverted wall 51 extending towards the back plate 20 is formed on the edge of the top wall 12 away from the partition wall 21. A first protrusion 713 is provided on the top wall 12 corresponding to the first groove 712, and the first protrusion 713 is interference-fitted into the first groove 712 to form a sealing cavity 321. Corresponding grooves 53 and second protrusions 714 are formed on the opposite surfaces of the first sealant 711 and the first inverted wall 51. The second protrusion 714 is embedded in the groove 53 to secure the adhesive frame 10 and the light guide plate 81. Specifically, when installing the backlight module 100, the second protrusion 714 is inserted into the groove 53, fixing the frame 10 and the light guide plate 81 together. When the second protrusion 714 is inserted into the groove 53, the first protrusion 713 will be interference-fitted into the first slot 712, thereby forming a sealed cavity 321 that does not leak liquid. In order to ensure that the coolant does not leak, the materials of the first sealant 711 and the first protrusion 713 have a certain toughness, preferably thermoplastic polyurethane elastomer. The sealant and the first protrusion 713 have a certain toughness, ensuring that when the first protrusion 713 is inserted into the first slot 712, it will be interference-fitted and squeezed together with the first slot 712, thus ensuring the sealing effect.

[0044] Furthermore, in some embodiments, the first slot 712 is preferably a V-shaped slot, with the bottom dimension of the first slot 712 being smaller than the opening dimension. The first protrusion 713 contacts the middle section of the V-shaped slot and is press-fitted together with it. This structural design provides a better interference fit, improves the sealing effect, and ensures that the coolant does not leak.

[0045] In this embodiment, the backlight module 100 further includes a second sealing connector assembly 72, which includes a second sealant 721 disposed on the back plate 20, located in the first blind groove 31. A second slot 722 is formed on the side of the second sealant 721 away from the back plate 20. A third protrusion 723 is provided on the top wall 12 corresponding to the second slot 722, and the third protrusion 723 is interference-fitted into the second slot 722. A fourth protrusion 724 is formed on the side of the second sealant 721 away from the partition wall 21. A second inverted wall 52 is formed on the side wall 11 of the frame, and the second inverted wall 52 abuts against the fourth protrusion 724 to securely fix the back plate 20 and the frame 10. Specifically, the second sealing connector assembly 72 and the first sealing connector assembly 71 cooperate to connect and fix the backlight module 100. The second inverted wall 52 and the fourth protrusion 724 abut against each other to securely fix the back plate 20 and the frame 10. When the second inverted wall 52 and the fourth protrusion 724 abut against each other, the fourth protrusion 724 moves away from the back plate 20 relative to the second inverted wall 52. The fourth protrusion 724 provides a force to the second inverted wall 52 in the direction of the back plate 20, and the second inverted wall 52 provides a force to the fourth protrusion 724 in the direction of the top wall 12, thereby making the back plate 20 and the frame 10 tightly fastened together. Further, it is also preferable that the second slot 722 is a V-shaped slot, and the second slot 722 and the third protrusion 723 are preferably thermoplastic polyurethane elastomers.

[0046] In this design, the first sealing connector assembly 71 forms a sealed cavity 321 on the side of the second blind groove 32 closest to the partition wall 21, where the coolant is located. The second sealing connector assembly 72 also forms a sealed chamber on the side of the first blind groove 31 closest to the partition wall 21. The sealed chamber and the sealed cavity 321 are adjacent. The advantage of this design is that even if there is partial leakage of coolant within the sealed cavity 321, the coolant will flow into the sealed chamber and be sealed, preventing coolant leakage to other areas. This multi-layered sealing effectively prevents coolant leakage to other areas.

[0047] Further, in this embodiment, the heat-absorbing device 40 includes a thermally conductive metal layer 42 and a graphene layer 41 covering the thermally conductive metal layer 42. Several heat-absorbing devices 40 are spliced ​​and embedded in the back plate 20. Among two adjacent heat-absorbing devices 40, the thermally conductive metal layer 42 of one heat-absorbing device 40 is disposed near the sealing cavity 321, and the graphene layer 41 of the other heat-absorbing device 40 is disposed near the sealing cavity 321. Specifically, several heat-absorbing devices 40 are alternately embedded in the back plate 20 on both sides. Among two adjacent heat-absorbing devices 40, one thermally conductive metal layer 42 is disposed near the sealing cavity 321, and the other graphene layer 41 is disposed near the sealing cavity 321. It can be understood that graphene has a multi-layered structure and possesses the characteristics of high horizontal thermal conductivity and low vertical thermal conductivity, while the thermally conductive metal possesses the characteristics of low horizontal thermal conductivity and high vertical thermal conductivity. The above design allows the graphene layer 41 to absorb heat and then transfer it laterally, while the thermally conductive metal layer 42 absorbs heat and then transfers it longitudinally. This design enables the coolant in the sealed cavity 321 to absorb heat and then quickly transfer the heat out.

[0048] In this embodiment, the backlight module 100 also includes a thermally conductive metal tape 60. The thermally conductive metal tape 60 covers the area of ​​the frame sidewall 11 and the back plate 20 where the heat-absorbing device 40 is embedded. Specifically, the thermally conductive metal tape 60 allows the heat absorbed by the heat-absorbing device 40 to dissipate quickly, preventing heat accumulation.

[0049] Furthermore, in this embodiment, the backlight module 100 also includes a support device 83, which is disposed on the top wall 12. The support device 83 includes a threaded spring sleeve disposed on the top wall 12, with a threaded hole formed therein. A spring is located in the threaded hole and can be screwed to adjust the length of the spring extending out of the threaded hole. Specifically, the support device 83 supports the rubber frame 10 and the internal plate, preventing deformation of the rubber frame 10 and preventing poor sealing caused by deformation of the rubber frame 10, which could lead to leakage of coolant. The spring can be screwed into or out of the threaded spring sleeve. After the backlight module 100 is installed, one end of the spring supports the internal plate, providing support. Furthermore, in this embodiment, multiple support devices 83 are provided. A support device 83 is provided in the area of ​​the top wall 12 corresponding to the first blind groove 31. One end of the support device 83 in this area is located on the top wall 12, and the other end contacts the back plate 20. A support device 83 is provided in the area of ​​the top wall 12 corresponding to the second blind slot 32. One end of the support device 83 is located on the top wall 12, and the other end contacts the light guide plate 81. Further, in some embodiments, the spring of the support device 82 is covered with a water-resistant silicone 84. The water-resistant silicone 84 has both deformation and waterproof capabilities. When the spring is screwed into or out of the threaded spring sleeve, and the two ends of the support device 83 support the rubber frame 10 and the plate, the water-resistant silicone 84 will also deform accordingly. The water-resistant silicone 84 is used to protect the support device 82, preventing coolant from contacting the spring and entering the spring sleeve, which could cause the spring to rust and be damaged.

[0050] Understandably, the sealing cavity 321 is formed by the first sealing connector assembly 71 and the light guide plate 81 surrounding part of the groove wall of the second blind groove 32. If there is a gap between the light guide plate 81 and the groove wall of the second blind groove 32, it can easily cause leakage of coolant in the sealing cavity 321. To enhance the sealing effect of the sealing cavity 321, in some embodiments, the space between the side of the light guide plate 81 and the groove wall of the second blind groove 32 is filled with water-resistant silicone 84. The water-resistant silicone 84 can ensure the complete sealing of the sealing cavity 321 and prevent coolant leakage.

[0051] The light guide plate 81 is attached to the back plate 20 with adhesive, so that there is no gap between the light guide plate 81 and the back plate 20, thus preventing the leakage of coolant in the sealed cavity 321.

[0052] Furthermore, in this embodiment, the light guide plate 81 is a rigid material light guide plate 81. The light guide plate 81 also needs to have high light transmittance so as not to affect the propagation of light. Preferably, it is a glass light guide plate 81. The glass light guide plate 81 has a small coefficient of thermal expansion and is not easily deformed. After assembly, the gap is smaller and it can be perfectly attached to the back plate 20 to avoid gaps that could cause coolant leakage.

[0053] Unlike existing technologies, this application proposes a backlight module 100 that forms a sealed cavity 321 enclosing a light-emitting device 82. Coolant is injected into the sealed cavity 321, allowing it to directly contact the light-emitting device 82. This direct contact absorbs the heat generated by the light-emitting device 82 and disperses it through diffusion, thereby improving heat dissipation efficiency and extending the lifespan of the backlight module 100. Furthermore, this application also includes a heat-absorbing device 40, located to the side of the sealed cavity 321, which quickly dissipates heat from within the cavity. These features further enhance heat dissipation efficiency and effectively extend the lifespan of the backlight module 100.

[0054] Correspondingly, this application also proposes a display device, which includes a display panel and a backlight module 100 disposed opposite to each other. The backlight module 100 is the backlight module 100 described in the above embodiments.

[0055] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A backlight module, comprising: Back panel; A plastic frame is provided around the back plate to form a receiving groove on one side of the back plate; A light-emitting device is disposed within the receiving groove; A light guide plate is disposed on the back plate and is correspondingly disposed to the light-emitting device. Light emitted by the light-emitting device enters the light guide plate from one end of the light guide plate. Its characteristic is that it further includes: The first sealing connector assembly connects and fixes the rubber frame and the light guide plate, while forming a sealed cavity inside the receiving groove to enclose the light-emitting device. The sealed cavity is filled with coolant. The frame includes a side wall and a top wall. One side of the side wall is connected to the back plate, and the other side is connected to the top wall. The back plate forms a partition wall that divides the receiving groove into a first blind groove and a second blind groove. The light-emitting device and the light guide plate are disposed in the second blind groove. The light-emitting device is disposed on the side of the partition wall facing the second blind groove. The second blind groove forms the sealing cavity, and the light-emitting device is located in the sealing cavity. The first sealing connector assembly includes a first sealant that is disposed on the light guide plate. A first slot is formed on the side of the first sealant away from the light guide plate. A first inverted wall extending towards the back plate is formed on the edge of the top wall away from the partition wall. A first protrusion is provided on the top wall corresponding to the first slot. The first protrusion is interference-fitted into the first slot to form the sealing cavity. Corresponding grooves and second protrusions are formed on the opposite surfaces of the first sealant and the first inverted wall. The second protrusion is embedded in the groove to fasten the frame and the light guide plate. Multiple heat-absorbing devices are disposed inside the back plate and corresponding to the sealed cavity; each heat-absorbing device includes a thermally conductive metal layer and a graphene layer stacked on the thermally conductive metal layer, perpendicular to the stacking direction, and the heat-absorbing devices are spliced ​​together; wherein, in two adjacent heat-absorbing devices, the metal layer of one heat-absorbing device faces the sealed cavity, and the graphene layer of the other heat-absorbing device faces the sealed cavity, so that heat is absorbed by the graphene layer and then transferred laterally, and heat is absorbed by the metal layer and then transferred longitudinally to remove heat.

2. The backlight module according to claim 1, characterized in that, The sidewalls of the frame are arranged around the back panel; The top wall covers the first blind groove and partially covers the second blind groove; the first sealing connector assembly forms a sealed cavity that closes the light-emitting device on the side of the second blind groove near the partition wall.

3. The backlight module according to claim 2, characterized in that, Also includes: The second sealing connection assembly includes: A second sealant is disposed on the back plate, located in the first blind groove, and a second groove is formed on the side of the second sealant away from the back plate; The top wall is provided with a third protrusion corresponding to the second slot, and the third protrusion is interference-fitted into the second slot. The second sealant has a fourth protrusion on the side away from the partition wall, and a second inverted wall is formed on the side wall of the sealant frame. The second inverted wall abuts against the fourth protrusion to lock and fix the back plate and the sealant frame.

4. The backlight module according to claim 3, characterized in that, The light guide plate is a rigid material light guide plate.

5. The backlight module according to claim 2, characterized in that, Also includes: A support device is disposed on the top wall, and the support device includes: A threaded spring sleeve is disposed on the top wall; a threaded hole is formed therein. A spring, located inside the threaded hole, can be screwed to adjust the length of the spring extending out of the threaded hole.

6. The backlight module according to claim 5, characterized in that, Multiple support devices are provided. The support device is provided on the top wall in the area corresponding to the first blind groove. One end of the support device is located on the top wall in this area, and the other end contacts the back plate. The support device is provided on the top wall in the area corresponding to the second blind slot. One end of the support device is located on the top wall in this area, and the other end contacts the light guide plate.

7. The backlight module according to claim 2, characterized in that, Also includes: Thermally conductive metal tape covers the sidewalls of the frame and the area of ​​the back plate where the heat-absorbing device is embedded.

8. A display device, comprising a backlight module and a display panel, wherein the backlight module is disposed corresponding to the display panel; characterized in that, The backlight module is the backlight module according to any one of claims 1-7.

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