LED light source packaging structure
By combining temperature control drive components and reset components, the heat dissipation area of the LED light source packaging structure is dynamically adjusted, solving the thermal resistance problem of traditional LED light source packaging structures in high-power scenarios. This enables compact and portable applications, reducing material waste and costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN XINGGUANGBAO SEMICONDUCTOR CO LTD
- Filing Date
- 2025-07-21
- Publication Date
- 2026-05-08
AI Technical Summary
Traditional LED light source packaging structures have high thermal resistance in high-power scenarios, cannot be dynamically adjusted, and occupy a large space, which limits their application in portable and compact scenarios. Furthermore, fixed heat dissipation structures lead to material waste and increased costs when used in low-power applications.
The system employs a temperature-controlled drive component and a reset component. The thermal deformation of the bimetallic strip drives the extension and retraction of the heat dissipation fins. Combined with a locking component and a limiting component, it achieves dynamic adjustment of the heat dissipation area and stable connection of the structure.
It achieves a compact heat dissipation structure in high-power scenarios, adapts to the needs of portable devices, reduces material waste and costs, and enhances the application capabilities of LED devices in portable and compact scenarios.
Smart Images
Figure CN224215286U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of lighting technology, specifically to an LED light source packaging structure. Background Technology
[0002] The development of LED light source packaging structure stems from the multiple requirements of semiconductor lighting technology for luminous efficiency, heat dissipation and reliability. Early pin-type packaging was only suitable for low-power scenarios due to heat dissipation limitations. However, with the popularization of solid-state lighting, the application of high-power LEDs in lighting, display and other fields has driven the iteration of packaging technology.
[0003] In existing LED light source packaging technologies, traditional passive heat dissipation methods such as heat sinks and heat pipes are limited by the thermal conductivity and surface area of materials. In high-power scenarios, they have high thermal resistance, and existing heat dissipation structures cannot be folded and are space-consuming, which seriously limits the application of LED devices in portable and compact scenarios. In low-power scenarios, fixed heat dissipation structures cannot be dynamically adjusted, resulting in material waste and increased costs. Therefore, we propose an LED light source packaging structure. Utility Model Content
[0004] The purpose of this invention is to provide an LED light source packaging structure to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: an LED light source packaging structure, including a substrate, a lamp core disposed on the top of the substrate, and further comprising:
[0006] The encapsulation assembly includes a support frame connected to the top of a substrate, an encapsulation plate disposed on the top of the support frame, and a sealant disposed at the connection between the encapsulation plate and the support frame.
[0007] A heat dissipation assembly, comprising a housing disposed on the top of a packaging plate, wherein heat dissipation fins are slidably connected inside the housing;
[0008] A temperature control drive assembly includes a bimetallic strip disposed within a housing, a push rod connected to the bimetallic strip, and the push rod being connected to heat dissipation fins.
[0009] Furthermore, a limiting groove is formed inside the casing on the side near the bimetallic sheet, and a limiting block is slidably connected in the limiting groove. Two limiting blocks are provided, and the two limiting blocks are respectively connected to the bottom of the two sides of the bimetallic sheet.
[0010] The above technical solution is adopted: by setting a limiting groove and a limiting block, the bimetallic strip is limited during the deformation process caused by heat.
[0011] Furthermore, a reset assembly is provided on the top side of the encapsulation plate near the heat dissipation fins. The reset assembly includes a closing plate connected to the heat dissipation fins. A fixing plate is connected to the top of the encapsulation plate, and a first spring is connected between the fixing plate and the closing plate.
[0012] The above technical solution is adopted: by setting a reset component, when the bimetallic strip cools down and expands, the closing plate drives the heat dissipation fins to spring back into the casing for storage through the elastic force of the first spring.
[0013] Furthermore, the encapsulation plate is provided with a locking component, which includes a connecting plate connected to the encapsulation plate, a locking block connected to the bottom of the connecting plate, a limit plate connected to the bracket frame, and limit balls provided on both sides of the limit plate.
[0014] The above technical solution involves setting a locking component to reinforce the connection between the encapsulation board and the support frame, preventing damage to the sealant and encapsulation failure when the height is too high.
[0015] Furthermore, a limiting component is provided on the side of the limiting plate near the limiting ball. The limiting component includes a limiting shell connected to the limiting plate, and a second spring is provided inside the limiting shell. The second spring is connected to the limiting ball.
[0016] The above technical solution is adopted: by setting a limiting component, the movement trajectory of the limiting ball during the squeezing process is limited.
[0017] Furthermore, there are two locking components, which are located on opposite sides of the support frame and the encapsulation plate, respectively.
[0018] The above technical solution enhances connection stability through these settings.
[0019] Furthermore, a sealing assembly is provided on the side of the box body near the experimental chamber. The sealing assembly includes a sliding door, and a rotating shaft is rotatably connected between the sliding door and the box body. A buckle is provided on the sliding door, and a mounting seat is provided on the box body. The buckle is engaged with the mounting seat.
[0020] The above technical solution facilitates the placement and removal of lithium batteries by setting up a sealing component.
[0021] Compared with the prior art, the advantages and positive effects of this utility model are as follows:
[0022] In this invention, by setting a temperature control drive component, the heat dissipation area can be dynamically adjusted, solving the space contradiction of traditional fixed heat dissipation structures. When not unfolded, the size is compact and suitable for portable devices. This solves the problem that in existing LED light source packaging technology, traditional passive heat dissipation methods such as heat sinks and heat pipes are limited by the thermal conductivity and surface area of materials, resulting in high thermal resistance in high-power scenarios. Furthermore, existing heat dissipation structures cannot be folded and occupy a large space, which seriously limits the application of LED devices in portable and compact scenarios. In low-power scenarios, fixed heat dissipation structures cannot be dynamically adjusted, leading to material waste and increased costs. Attached Figure Description
[0023] Figure 1 This is a front view of an LED light source packaging structure.
[0024] Figure 2 This is a side view of an LED light source packaging structure.
[0025] Figure 3 for Figure 2 Enlarged view of point A in the middle.
[0026] Figure 4 This is a structural diagram of a heat dissipation component in an LED light source packaging structure.
[0027] Figure 5 This is a split view of an LED light source packaging structure.
[0028] Numbering on the map:
[0029] 1. Substrate; 2. Lamp wick;
[0030] 3. Encapsulation components; 31. Support frame; 32. Sealant; 33. Encapsulation board;
[0031] 4. Heat dissipation components; 41. Housing; 42. Heat dissipation fins;
[0032] 5. Temperature control drive assembly; 51. Bimetallic strip; 52. Push rod; 53. Limit groove; 54. Limit block;
[0033] 6. Reset assembly; 61. Closing plate; 62. Fixing plate; 63. First spring;
[0034] 7. Locking assembly; 71. Connecting plate; 72. Locking block; 73. Limiting plate; 74. Limiting ball;
[0035] 8. Limiting component; 81. Limiting shell; 82. Second spring. Detailed Implementation
[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0037] like Figures 1-5 As shown, this utility model provides a technical solution: an LED light source packaging structure, including a substrate 1, a lamp core 2 disposed on the top of the substrate 1, and further comprising:
[0038] The encapsulation component 3 includes a support frame 31 connected to the top of the substrate 1, an encapsulation plate 33 is disposed on the top of the support frame 31, and a sealant 32 is disposed at the connection between the encapsulation plate 33 and the support frame 31.
[0039] Heat dissipation component 4 includes a housing 41 disposed on the top of the encapsulation plate 33, and heat dissipation fins 42 are slidably connected inside the housing 41.
[0040] Temperature control drive assembly 5 includes a bimetallic strip 51 disposed inside a housing 41, a push rod 52 connected to the bimetallic strip 51, the push rod 52 being connected to the heat dissipation fins 42, a limiting groove 53 being provided on one side of the housing 41 near the bimetallic strip 51, a limiting block 54 being slidably connected in the limiting groove 53, two limiting blocks 54 being provided, and the two limiting blocks 54 being respectively connected to the bottom of both sides of the bimetallic strip 51;
[0041] Specifically, when the temperature inside the package is too high, the bimetallic strip 51 will bend after being heated, thereby causing the push rod 52 to extend outward. The push rod 52 will cause the heat dissipation fins 42 to move outward from inside the housing 41, thereby dissipating heat inside the package. During the deformation process of the bimetallic strip 51 under heat, it will cause the bottom limiting block 54 to move synchronously in the limiting groove 53, thereby limiting the movement trajectory of the bimetallic strip 51.
[0042] Furthermore, such as Figure 1 As shown: A reset component 6 is provided on the top side of the encapsulation plate 33 near the heat dissipation fin 42. The reset component 6 includes a closing plate 61 connected to the heat dissipation fin 42. A fixing plate 62 is connected to the top of the encapsulation plate 33. A first spring 63 is connected between the fixing plate 62 and the closing plate 61. When the internal temperature drops, the bimetallic strip 51 returns to its original shape, thereby driving the push rod 52 to separate from the heat dissipation fin 42. As a result, the heat dissipation fin 42 will automatically spring back into the housing 41 for storage by the elastic force of the first spring 63, and the closing plate 61 will seal the housing 41.
[0043] The above solutions also have the problem that the sealant 32 may break when the temperature is too high. Therefore, the connection between the encapsulation plate 33 and the bracket frame 31 should be strengthened, such as... Figure 3 As shown: The encapsulation plate 33 is provided with a locking component 7. The locking component 7 includes a connecting plate 71 connected to the encapsulation plate 33. A locking block 72 is connected to the bottom of the connecting plate 71. A limit plate 73 is connected to the bracket frame 31. Limit balls 74 are provided on both sides of the limit plate 73. There are two locking components 7. The two locking components 7 are located on the sides of the bracket frame 31 and the encapsulation plate 33, respectively. When the encapsulation plate 33 drives the connecting plate 71 to descend, the connecting plate 71 drives the locking block 72 at the bottom to squeeze the limit balls 74 on the limit plate 73 to both sides. Then the limit balls 74 will be locked in the groove opened on the locking block 72 for limiting and fixing.
[0044] The above solutions also include limiting the movement trajectory of the limiting ball 74 during the compression process, such as... Figure 3 As shown: A limiting component 8 is provided on the side of the limiting plate 73 near the limiting ball 74. The limiting component 8 includes a limiting shell 81 connected to the limiting plate 73. A second spring 82 is provided inside the limiting shell 81. The second spring 82 is connected to the limiting ball 74. When the limiting ball 74 is squeezed, it will slide and retract inside the limiting shell 81 through the second spring 82. Then, it will be bounced into the groove opened on the locking block 72 by the elastic force of the second spring 82.
[0045] The working principle provided by this utility model is as follows: Figures 1-5 As shown: First, the encapsulation plate 33 drives the connecting plate 71 to descend. The connecting plate 71 drives the locking block 72 at the bottom to press the limiting ball 74 on the limiting plate 73 to both sides. When the limiting ball 74 is being pressed, it will slide and retract within the limiting shell 81 through the second spring 82. Then, the elastic force of the second spring 82 will push it into the groove opened on the locking block 72. When the temperature inside the encapsulation is too high, the bimetallic strip 51 will bend after being heated, thereby driving the push rod 52 to extend outward. The push rod 52 will drive the heat dissipation fins 42 from the sleeve. The bimetallic strip 51 moves outward from the inside of the shell 41 to dissipate heat from the encapsulation. During the deformation caused by heat, the bimetallic strip 51 drives the bottom limiting block 54 to move synchronously in the limiting groove 53, thereby limiting the movement trajectory of the bimetallic strip 51. When the internal temperature drops, the bimetallic strip 51 returns to its original shape, thereby causing the push rod 52 to separate from the heat dissipation fins 42. The heat dissipation fins 42 will then automatically spring back into the shell 41 for storage by the elastic force of the first spring 63, and the closing plate 61 will seal the shell 41.
[0046] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present utility model. The implementation schemes in the above embodiments can also be further combined or replaced. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.
Claims
1. An LED light source packaging structure, comprising a substrate (1) and a lamp core (2) disposed on the top of the substrate (1), characterized in that, Also includes: The encapsulation assembly (3) includes a support frame (31) connected to the top of the substrate (1), an encapsulation plate (33) is provided on the top of the support frame (31), and a sealant (32) is provided at the connection between the encapsulation plate (33) and the support frame (31). Heat dissipation assembly (4), the heat dissipation assembly (4) includes a housing (41) disposed on the top of the encapsulation plate (33), and heat dissipation fins (42) are slidably connected inside the housing (41); Temperature control drive assembly (5) includes a bimetallic strip (51) disposed inside a housing (41), a push rod (52) connected to the bimetallic strip (51), and the push rod (52) being connected to the heat dissipation fins (42).
2. The LED light source packaging structure according to claim 1, characterized in that: A limiting groove (53) is provided inside the casing (41) on one side near the bimetallic sheet (51). A limiting block (54) is slidably connected inside the limiting groove (53). There are two limiting blocks (54), and the two limiting blocks (54) are respectively connected to the bottom of both sides of the bimetallic sheet (51).
3. The LED light source packaging structure according to claim 1, characterized in that: A reset assembly (6) is provided on the top side of the encapsulation plate (33) near the heat dissipation fins (42). The reset assembly (6) includes a closing plate (61) connected to the heat dissipation fins (42). A fixing plate (62) is connected to the top of the encapsulation plate (33). A first spring (63) is connected between the fixing plate (62) and the closing plate (61).
4. The LED light source packaging structure according to claim 1, characterized in that: The encapsulation plate (33) is provided with a locking component (7), the locking component (7) includes a connecting plate (71) connected to the encapsulation plate (33), a locking block (72) is connected to the bottom of the connecting plate (71), a limiting plate (73) is connected to the bracket frame (31), and a limiting ball (74) is provided on both sides of the limiting plate (73).
5. The LED light source packaging structure according to claim 4, characterized in that: A limiting component (8) is provided on the side of the limiting plate (73) near the limiting ball (74). The limiting component (8) includes a limiting shell (81) connected to the limiting plate (73). A second spring (82) is provided inside the limiting shell (81), and the second spring (82) is connected to the limiting ball (74).
6. The LED light source packaging structure according to claim 4, characterized in that: Two locking components (7) are provided, and the two locking components (7) are located on both sides of the bracket frame (31) and the encapsulation plate (33), respectively.