LED structure and LED display screen

Abstract

The application provides an LED structure, comprising: a pad assembly; a light emitting chip assembly, which is arranged on the pad assembly; an encapsulation assembly, which comprises an encapsulation part and a cover, wherein the pad assembly and the light emitting chip assembly are arranged in the encapsulation part, and the cover is arranged on the top of the encapsulation part, wherein the encapsulation part comprises a side wall, and the outer surface of the side wall is arranged to be inwardly inclined at an angle of 15-20 degrees with the height direction of the encapsulation part. The LED structure and the LED display screen improve the contrast of the light emitting chip assembly through the mutually matched encapsulation part and cover in the encapsulation assembly, so that the product can present a more bright and delicate picture. Meanwhile, compared with the conventional LED structure, the application can always keep the firmness and stability of the cover installation, so that the LED structure has the advantages of high contrast, stable structure, long service life and the like, and greatly improves the product competitiveness.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of LED packaging, and particularly relates to an LED structure and an LED display screen. BACKGROUND

[0002] At present, various large-scale opening ceremonies, signing ceremonies, product recommendation meetings and stage performances all need to use LED products. Accordingly, the market scale of LED gradually expands, and the future development is immeasurable. Intense competition will be a long-term trend.

[0003] At present, the customers who need to use the LED screen mainly rent, and the rental screen is not a display screen purchase, but an investment way. The renter recovers the cost and makes a profit by collecting display screen rent. Therefore, in order to save cost and create greater value for customers, 'one screen with multiple uses' will become an important development direction of future rental screen products, and higher requirements for the quality of LED lamp beads will follow.

[0004] At present, the indoor rental screen mainly uses array-arranged LED lamp bead products, such as 2020 products. Some customers will choose lamp bead installation denser products to improve the LED display effect due to cost and use demand, and a dark cover is usually arranged on the surface to improve the contrast ratio during use. However, since the size and the gap between the lamp beads are very small, how to stably arrange the cover between the gaps of multiple lamp beads has been one of the pain points to be solved in the industry. SUMMARY

[0005] Therefore, the technical problem to be solved by the application is to overcome the problems of poor contrast ratio and difficulty in installing the cover in the prior art, and to provide an LED structure and an LED display screen.

[0006] To solve the above technical problems, the application provides an LED structure, which comprises a pad assembly, a light emitting chip assembly arranged on the pad assembly, and an encapsulation assembly comprising an encapsulation part and a cover, wherein the pad assembly and the light emitting chip assembly are arranged in the encapsulation part, and the cover is arranged at the top end of the encapsulation part, wherein the encapsulation part comprises a side wall, and the outer surface of the side wall is arranged to be inclined inward at an angle of 15-20 degrees with the height direction of the encapsulation part.

[0007] In an embodiment of the application, the outer surface of the side wall gradually extends inward along the height direction of the encapsulation part from the periphery of the pad assembly, and the inner surface of the side wall extends outward along the height direction of the encapsulation part.

[0008] In an embodiment of the present application, the inner surface of the side wall is inclined to the height direction of the packaging portion at an angle of 15-20 degrees.

[0009] In an embodiment of the present application, the packaging portion comprises a bottom plate, and the side wall is arranged on the bottom plate, and the bottom plate and the side wall enclose a packaging space for accommodating the light emitting chip assembly and the pad assembly.

[0010] In an embodiment of the present application, the thickness of the side wall is 0.18-0.38 mm, the diameter of the space cross section enclosed by the top end of the side wall is 0.8-1.68 mm, the diameter of the space cross section enclosed by the bottom end of the side wall is 0.7-1.31 mm, and the height of the side wall is 0.4-0.5 mm.

[0011] In an embodiment of the present application, the side wall comprises a first connecting portion and a second connecting portion arranged on the bottom plate in sequence, wherein the first connecting portion extends gradually inward from the periphery of the bottom plate along the height direction of the packaging portion and is inclined to the height direction of the packaging portion at an angle of 5-35 degrees, and the second connecting portion extends gradually inward from the first connecting portion along the height direction of the packaging portion and is inclined to the height direction of the packaging portion at an angle of 0-10 degrees.

[0012] In an embodiment of the present application, the extension height of the first connecting portion along the height direction of the packaging portion is 0.1-0.2 mm, and the extension height of the second connecting portion along the height direction of the packaging portion is 0.2-0.45 mm.

[0013] In an embodiment of the present application, the top end cross section of the packaging portion is circular, elliptical or rectangular.

[0014] In an embodiment of the present application, the pad assembly comprises red light negative pad, green light negative pad, blue light negative pad and common positive pad which are arranged independently and insulated from each other, and the light emitting chip assembly comprises red light chip arranged on the red light negative pad, green light chip arranged on the green light negative pad and blue light chip arranged on the blue light negative pad, wherein the red light chip, the green light chip and the blue light chip are connected to the common positive pad, and the green light chip and the blue light chip are connected to the green light negative pad and the blue light negative pad respectively.

[0015] To solve the above technical problems, the present application further provides an LED display screen comprising a plurality of the above LED structures and a mounting plate, and the plurality of LED structures are arranged in an array on the mounting plate.

[0016] The above technical solution of the present application has the following advantages compared with the prior art:

[0017] The LED structure and the LED display screen have the following advantages: the contrast of the light-emitting chip assembly is improved by the mutually matched packaging parts and the mask in the packaging assembly, so that the product can present a more bright and delicate picture; meanwhile, compared with the conventional LED structure, the stability and the firmness of the mask installation can be maintained, so that the LED structure has the advantages of high contrast, stable structure, long service life and the like, and the product competitiveness is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to make the content of the present application more easily understood, the present application is further described in detail below according to the specific embodiments of the present application and in combination with the drawings.

[0019] Figure 1 is a perspective view of the LED structure in the preferred embodiment of the present application;

[0020] Figure 2 is a sectional view of A-A in Figure 1

[0021] Figure 3 is a top view of the LED structure in Figure 1

[0022] Figure 4 is a comparison diagram of the light-emitting contrast of the LED structure without the mask in the first comparative example of the present application and the conventional LED structure;

[0023] Figure 5 is a perspective view of the LED structure in another preferred embodiment of the present application;

[0024] Figure 6 is a sectional view of B-B in Figure 5

[0025] Figure 7 is a top view of the LED structure in Figure 5

[0026] Figure 8 is a comparison diagram of the light-emitting contrast of the LED structure without the mask in the second comparative example of the present application and the conventional LED structure;

[0027] Figure 9 is a comparison diagram of the light-emitting contrast of the LED display screen in the third embodiment of the present application and the conventional LED display screen.

[0028] ​​​​Description of the drawings:100, pad assembly; 110, red light negative pad; 120, green light negative pad; 130, blue light negative pad; 140, common positive pad; 200, light emitting chip assembly; 210, red light chip; 211, red light positive; 220, green light chip; 221, green light positive; 222, green light negative; 230, blue light chip; 231, blue light positive; 232, blue light negative; 300, packaging assembly; 310, packaging part; 311, side wall; 3111, first connecting part; 3112, second connecting part; 312, packaging space; 313, bottom plate; 320, supporting part; 330, cover. DETAILED DESCRIPTION

[0029] The present application will be further described below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present application and implement it.

[0030] Example one

[0031] The present embodiment provides an LED structure, comprising: a pad assembly 100; a light emitting chip assembly 200, the light emitting chip assembly 200 is arranged on the pad assembly 100; a packaging assembly 300, the packaging assembly 300 comprises a packaging part 310 and a cover 330, wherein the pad assembly 100 and the light emitting chip assembly 200 are arranged in the packaging part 310, and the cover 330 is arranged at the top end of the packaging part 310, wherein the packaging part 310 comprises a side wall 311, and the outer surface of the side wall 311 is arranged to be inclined inward at an angle of 15°-20° in the height direction of the packaging part 310.

[0032] The present LED structure improves the contrast of the light emitting chip assembly 200 through the mutually matched packaging part 310 and cover 330 in the packaging assembly 300, so that the product can present a more vivid and delicate picture. At the same time, compared with the conventional LED structure, the present scheme can always maintain the firmness and stability of the cover 330 installation under the premise that the side wall 311 is relatively thick, so that the present LED structure has the advantages of high contrast, stable structure, long service life and the like, and greatly improves the product competitiveness.

[0033] Referring to Figure 1 The present embodiment also comprises a supporting part 320, and in the height direction of the structure, the packaging part 310 is arranged above the supporting part 320, wherein the supporting part 320 is used to connect to external assembly elements and simultaneously plays a role of overall support for the structure, and the structure of the present application is not specifically limited.

[0034] The present embodiment is arranged for a product with a point spacing of P2.6, referring to Figures 1 to 3As shown, the packaging portion 310 includes a bottom plate 313 and a side wall 311 arranged on the bottom plate 313, the bottom plate 313 and the side wall 311 enclose a packaging space 312 accommodating the light-emitting chip assembly 200 and the pad assembly 100, further, the outer surface of the side wall 311 gradually extends inwardly along the height direction of the packaging portion 310 from the periphery of the bottom plate 313, the inner surface of the side wall 311 extends outwardly along the height direction of the packaging portion 310 from the inside, specifically, the outer surface of the side wall 311 is arranged at an angle of 15° with the height direction of the packaging portion 310, and the inner surface of the side wall 311 is arranged at an angle of 20° with the height direction of the packaging portion 310, based on this structure, the packaging space 312 in the embodiment is a rounded table structure, and the upper end opening thereof is circular or elliptical in cross section, further, in the embodiment, the thickness of the top end of the side wall 311 is 0.18 mm, the diameter of the cross section of the space enclosed by the top end of the side wall 311 is 0.8 mm, the diameter of the cross section of the space enclosed by the bottom end of the side wall 311 is 0.7 mm, and the height of the side wall 311 is 0.4 mm, this structure can guide the light emitted by the light-emitting chip assembly 200, expand the light-emitting angle, and improve the overall brightness of the LED structure, thereby improving the energy utilization rate and preliminarily improving the light-emitting contrast of the LED structure through the structure of the packaging portion 310.

[0035] In the embodiment, the side wall 311 is made of polyphthalamide (PPA) material, and the two are embedded and connected with each other, so as to improve the overall stability of the LED structure while avoiding damage caused by collision or friction between the pad assembly 100 or the light-emitting chip assembly 200 and the side wall 311, in other embodiments, the outer side of the side wall 311 can be made of other hard materials, the side of the side wall 311 can also be made of other elastic buffer materials, and the inner side and the outer side of the side wall 311 can also be made of the same material or integrally arranged according to actual use, which is not limited in the application. In the embodiment, the inner surface of the mask 330 is arranged as an inclined surface matched with the outer surface of the side wall 311, the two can be inserted and connected with each other, and the connected mask 330 can be stably supported on the side wall 311, further, the mask 330 in the embodiment is black, so as to improve the contrast of the light-emitting chip assembly 200 in the application.

[0036] Referring to Figure 3 As shown, the pad assembly 100 is arranged in the packaging space 312, and the side of the pad assembly 100 provided with the light-emitting chip assembly 200 faces the opening of the packaging portion 310, in the embodiment, the pad assembly 100 connected with the light-emitting chip assembly 200 is connected in the packaging assembly 300 by a dispensing machine, specifically, epoxy resin glue is used for connection to avoid the influence of external environment, so as to protect the excellent optical performance of the product.

[0037] Referring toFigure 3 As shown, the pad assembly 100 comprises the red light negative pad 110, the green light negative pad 120, the blue light negative pad 130 and the common positive pad 140 which are independently arranged and insulated from each other, the light emitting chip assembly 200 comprises the red light chip 210 arranged on the red light negative pad 110, the green light chip 220 arranged on the green light negative pad 120 and the blue light chip 230 arranged on the blue light negative pad 130, wherein the red light chip 210, the green light chip 220 and the blue light chip 230 are all connected to the common positive pad 140, and the green light chip 220 and the blue light chip 230 are respectively connected to the green light negative pad 120 and the blue light negative pad 130. In the embodiment, the red light chip is provided with a red light positive 211 and a red light negative (not shown in the figure), the green light chip 220 is provided with a green light positive 221 and a green light negative 222, and the blue light chip 230 is provided with a blue light positive 231 and a blue light negative 232, all of which are connected to the pad assembly 100 through the bonding wires to form the electrical conduction between the chip light emitting assembly and the pad assembly 100. Such a structure can avoid the problem of red-green light source or red-blue light source string light, thereby improving the stability of the function effect of the LED structure. Further, in the embodiment, the red light chip 210 is fixedly connected to the red light negative pad 110 in a vertical structure, one side of which in the packaging space 312 is the positive, and the opposite side is the negative. Specifically, the red light chip 210 is connected to the pad assembly 100 through the conductive silver glue. The blue light chip 230 and the green light chip 220 are both arranged in a horizontal structure, and the positive and negative electrodes thereof are both located on the upper surface of the pad assembly 100 and at the same horizontal height. The two are fixedly connected to the blue light negative pad 130 and the green light negative pad 120 respectively. Specifically, the blue light chip 230 and the green light chip 220 are both connected to the pad assembly 100 through the insulating glue. Further, in the embodiment, the pin is bent to be held in the bottom of the pad assembly 100. The above scheme makes the green light negative pad 120, the blue light negative pad 130 and the red light negative pad 110 exist independently without communication. Therefore, when the LED structure migrates, the phenomenon of negative-negative short circuit after the red light chip 210 and the green light chip 220 or the blue light chip 230 are conducted can be avoided, thereby achieving the purpose of avoiding red-green string light or red-blue string light.

[0038] In summary, the LED structure improves the contrast of the light emitting chip assembly 200 through the packaging part 310 and the mask 330 which are matched in shape in the packaging assembly 300, so that the product can present a more vivid and delicate picture. At the same time, compared with the conventional LED structure, the scheme can always maintain the firmness and stability of the mask 330 installation, so that the LED structure has the advantages of high contrast, stable structure, long service life and the like, greatly improving the product competitiveness.

[0039] Comparative Example One

[0040] Figure 4 The LED structure in Example One without the mask 330 is shown in the comparative diagram of the light-emitting contrast with the conventional LED structure, where the left side is the conventional LED structure and the right side is the LED structure in Example One without the mask 330, as shown in Figure 4 It can be seen that the light source in the LED structure in Example One is more concentrated, and there is a significant difference in the light-emitting effect from the conventional LED structure, which can prove that the LED structure without the mask 330 to improve the contrast can achieve the effect of improving the light-emitting contrast according to the structure of the packaging part 310 itself.

[0041] Example Two

[0042] Another LED structure is provided in this embodiment, which is the same as Example One except for the structure of the packaging part 310. This will not be described in detail here. See Figures 5 to 7 The structure of the packaging part 310 in this embodiment is shown as follows:

[0043] In this embodiment, the side wall 311 includes a first connecting part 3111 and a second connecting part 3112 arranged in sequence on the bottom plate 313, where the first connecting part 3111 extends gradually inward from the periphery of the bottom plate 313 along the height direction of the packaging part 310 and is inclined at 35° to the height direction of the packaging part 310, and the second connecting part 3112 extends gradually inward from the first connecting part 3111 along the height direction of the packaging part 310 and is inclined at 10° to the height direction of the packaging part 310. See Figure 6 The structure of the packaging part 310 in this embodiment can further improve the stability when the mask 330 is connected and buckled, as shown. Specifically, when the mask 330 is connected to the packaging part 310, its inner surface is embedded with the outer surface of the second packaging part 310, and it can be stably supported on the first connecting part 3111. Further, this structure can also improve the distance between the mask 330 and the light-emitting chip assembly 200, so that the light can be guided by the inner surface of the packaging part 310 to improve the light-emitting angle, thereby achieving a better light-emitting effect of the LED structure.

[0044] Further, in this embodiment, the first connecting part 3111 extends along the height direction of the packaging part 310 with a height of 0.2 mm, and the second connecting part 3112 extends along the height direction of the packaging part 310 with a height of 0.35 mm.

[0045] Comparative Example Two

[0046] Figure 8The diagram shows a comparison of the light emission contrast between the LED structure in Example 2 without the mask 330 and a conventional LED structure. The left side represents the conventional LED structure, and the right side represents the LED structure in Example 2 without the mask 330. Figure 8 It is evident that the light source in the LED structure of Embodiment 2 is more concentrated, and the light emission effect is significantly different from that of the conventional LED structure. This proves that the present LED structure can significantly improve the light emission contrast even without the mask 330 used to improve contrast, based on the structure of the encapsulation part 310 itself.

[0047] Example 3

[0048] This embodiment provides an LED display screen, which includes multiple LED structures as described in Embodiment 2 and a mounting plate. Multiple LED structures are arrayed on the mounting plate, resulting in an LED display screen composed of multiple LED structures. This embodiment uses a constant current drive circuit for illumination. Each LED structure has identical parameters, and before connection and installation, they undergo beam splitting and tape-making processes to facilitate mounting multiple LED structures in the same direction, thereby improving mounting efficiency. Furthermore, any LED structure in this LED display screen can be independently mounted with a mask 330 to maximize the contrast and luminous effect of the product.

[0049] See Figure 9 As shown, the left side represents a conventional LED display structure, while the right side represents the LED display in this embodiment without the mask 330. Both displays have the same number of LEDs and current ratings. This demonstrates that the LED display in this embodiment significantly improves the contrast ratio when the LEDs are emitting light. Further testing showed that this LED display can increase the contrast ratio by approximately 30%. Furthermore, compared to conventional products, this LED display can significantly increase the pin thrust, effectively solving the problem of LED dropouts. The pin thrust parameters for this LED display and conventional displays are shown in Table 1.

[0050] Table 1. Comparison of pin thrust parameters between LED display screen and conventional display screen in this embodiment.

[0051]

[0052] As can be seen from the data in the table above, the LED display screen in this embodiment also has a significant advantage in improving pin push force, thereby solving the problem of easy lamp drop in existing products.

[0053] Example 4

[0054] The embodiment provides another LED structure, and the main structural arrangement is the same as that of the first embodiment. In the LED structure of the embodiment, the outer surface of the side wall 311 is arranged to be inclined to the height direction of the packaging portion 310 at an angle of 20°, and the inner surface of the side wall 311 is arranged to be inclined to the height direction of the packaging portion 310 at an angle of 15°. Based on the structural arrangement, the packaging space 312 in the embodiment is a reverse trapezoidal structure, the upper end opening of the packaging space 312 is a rectangle, further, the thickness of the side wall 311 is 0.38 mm, the diameter of the cross section of the space surrounded by the top end of the side wall 311 is 1.68 mm, the diameter of the cross section of the space surrounded by the bottom end of the side wall 311 is 1.31 mm, and the height of the side wall 311 is 0.5 mm.

[0055] Embodiment five

[0056] The embodiment provides another LED structure, and the main structural arrangement is the same as that of the second embodiment. In the LED structure of the embodiment, the first connecting portion 3111 gradually extends inward from the outer periphery of the bottom plate 313 along the height direction of the packaging portion 310 and is inclined to the height direction of the packaging portion 310 at an angle of 5°, the second connecting portion 3112 gradually extends inward from the first connecting portion 3111 along the height direction of the packaging portion 310 and is inclined to the height direction of the packaging portion 310 at an angle of 1°, the extension height of the first connecting portion 3111 along the height direction of the packaging portion 310 is 0.1 mm, and the extension height of the second connecting portion 3112 along the height direction of the packaging portion 310 is 0.2 mm.

[0057] In summary, the LED structure and the LED display screen improve the contrast of the light-emitting chip assembly 200 by the shape-matched packaging portion 310 and the mask 330 in the packaging assembly 300, so that the product can present a more vivid and delicate picture. Meanwhile, compared with the conventional LED structure, the mask 330 can always be firmly and stably installed, so that the LED structure has the advantages of high contrast, stable structure, long service life and the like, and the product competitiveness is greatly improved.

[0058] Obviously, the above embodiment is only an example for clearly illustrating the present application, and is not a limitation on the embodiments. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments cannot be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. An LED structure, characterized by: It comprises: a pad assembly; a light emitting chip assembly arranged on the pad assembly; a package assembly comprising a package and a cover, wherein the pad assembly and the light emitting chip assembly are arranged in the package, and the cover is arranged on the top of the package, wherein the package comprises a side wall, the outer surface of the side wall gradually extends inwardly from the periphery of the package along the height direction of the package at an angle of 15-20°, and the inner surface of the side wall extends outwardly along the height direction of the package; the side wall comprises a first connecting part and a second connecting part arranged on the bottom plate of the package in sequence, wherein the first connecting part gradually extends inwardly from the periphery of the bottom plate along the height direction of the package at an angle of 5-35°, and the second connecting part gradually extends inwardly from the first connecting part along the height direction of the package at an angle of 0-10°.

2. The LED structure of claim 1, wherein: The inner surface of the side wall is arranged at an angle of 15-20° with respect to the height direction of the package.

3. The LED structure of claim 1, wherein: The package comprises a bottom plate, and the side wall is arranged on the bottom plate, and the bottom plate and the side wall enclose a package space for accommodating the light emitting chip assembly and the pad assembly.

4. The LED structure of claim 3, wherein: The thickness of the side wall is 0.18-0.38 mm, the diameter of the space cross section enclosed by the top of the side wall is 0.8-1.68 mm, the diameter of the space cross section enclosed by the bottom of the side wall is 0.7-1.31 mm, and the height of the side wall is 0.4-0.5 mm.

5. The LED structure of claim 1, wherein: The extension height of the first connecting part along the height direction of the package is 0.1-0.2 mm, and the extension height of the second connecting part along the height direction of the package is 0.2-0.45 mm.

6. The LED structure of claim 1, wherein: The top cross section of the package is circular, elliptical or rectangular.

7. The LED structure of claim 1, wherein: The pad assembly comprises red, green and blue negative electrode pads and a common positive electrode pad arranged independently and insulated from each other, the light emitting chip assembly comprises a red light chip arranged on the red negative electrode pad, a green light chip arranged on the green negative electrode pad, and a blue light chip arranged on the blue negative electrode pad, wherein the red, green and blue light chips are connected to the common positive electrode pad, and the green and blue light chips are connected to the green and blue negative electrode pads, respectively.

8. An LED display screen, characterized by: It comprises a plurality of LED structures according to any one of claims 1-7 and a mounting plate, and the plurality of LED structures are arranged in an array on the mounting plate.

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