A multidimensional force sensor and its measurement method

Abstract

This invention discloses a multidimensional force sensor and its measurement method, comprising an elastic body, a strain gauge module, a circuit board structure, a rigid beam module, and a flexible insulating gasket. The rigid beam module is connected between the elastic bodies, and the strain gauge module is attached to the surface of the elastic body using a strain gauge adhesive. The circuit board structure is mounted on the inner bottom end of the rigid beam module and electrically connected to the strain gauge module. The flexible insulating gasket is located between the elastic bodies. By using this invention, a differential voltage output can be generated based on the deformation and resistance change of the elastic body, improving the stability of the sensor output. This invention, as a multidimensional force sensor and its measurement method, can be widely applied in the field of sensor technology.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a multidimensional force sensor and its measurement method. Background Technology

[0002] Multidimensional force sensors, commonly used in the engineering industry, are devices that convert force signals into electrical signals according to certain rules. Their working principle is based on the change in resistance of a strain gauge caused by the deformation of an elastic body structure; the magnitude of the force is reflected by measuring the change in resistance. They are widely used in robotics, medical fields, and other areas. With the rapid development of technology, multidimensional force sensors have seen explosive growth, meeting the needs of many industries. However, current multidimensional force sensors suffer from problems such as simple structure, large size, high manufacturing difficulty, and poor stability. Summary of the Invention

[0003] To address the aforementioned technical problems, the present invention aims to provide a multidimensional force sensor and its measurement method. Utilizing polarization imaging technology, the sensor can output voltage differentially based on the deformation and resistance changes of an elastic body, thereby improving the stability of the sensor output.

[0004] The first technical solution adopted in this invention is: a multi-dimensional force sensor, comprising an elastic body, a strain gauge module, a circuit board structure, a rigid beam module, and a flexible insulating gasket. The rigid beam module is connected between the elastic bodies. The strain gauge module is attached to the surface of the elastic body using a strain adhesive. The circuit board structure is mounted on the inner bottom end of the rigid beam module and electrically connected to the strain gauge module. The flexible insulating gasket is located between the elastic bodies.

[0005] The elastic body is used to receive the external force to be measured and undergo corresponding deformation;

[0006] The strain gauge module is used to generate corresponding resistance value changes based on the deformation of the elastic body;

[0007] The circuit board structure is used to convert the deformation of the elastomer when it is subjected to force into an electrical signal;

[0008] The rigid beam module is used to support the elastic body;

[0009] The flexible insulating pad is used to improve the stability of the multidimensional force sensor.

[0010] Furthermore, the elastomer includes an upper composite rhomboid structure and a lower composite rhomboid structure, which are connected by the rigid beam. The outer surface of the upper composite rhomboid structure is provided with four rhomboid surfaces, and the outer surface of the lower composite rhomboid structure is provided with four rhomboid surfaces. Each rhomboid surface is fitted with a strain gauge.

[0011] Furthermore, the strain gauge module includes at least one resistance strain gauge with strain effect.

[0012] Furthermore, the circuit board structure includes a left-end circuit module and a right-end circuit module. The left-end circuit module is attached to the strain gauge of the lower composite rhombus structure, and the right-end circuit module is attached to the strain gauge of the upper composite rhombus structure. The left-end circuit module is used to convert the deformation of the lower composite rhombus structure under stress into an electrical signal, and the right-end circuit module is used to convert the deformation of the upper composite rhombus structure under stress into an electrical signal.

[0013] Furthermore, in the circuit board structure, the first end of strain gauge R1, the second end of strain gauge R4, the first end of strain gauge R5, and the first end of strain gauge R8 are connected to the output voltage U2, and the second ends of strain gauge R1, R2, R5, and R6 are connected to V... CC The first end of strain gauge R2 is connected to the second end of strain gauge R3. The first ends of strain gauge R3, R4, R13, and R16 are connected and connected to U1. The first end of strain gauge R16 is connected to the first end of strain gauge R15. The second ends of strain gauge R15, R14, R12, and R11 are connected and grounded. The second ends of strain gauge R13, R14, R12, and R9 are connected and connected to U4. The second end of strain gauge R11 is connected to the first end of strain gauge R10. The second ends of strain gauge R10, R9, R8, and R7 are connected and connected to U3. The second end of strain gauge R7 is connected to the second end of strain gauge R6.

[0014] Furthermore, the rigid beam module includes four rigid beams.

[0015] Meanwhile, the present invention also provides a measurement method for a multidimensional force sensor, specifically including the following steps:

[0016] The external force to be tested is applied to the elastic body to cause the elastic body to produce a corresponding deformation.

[0017] Based on the deformation of the elastic body, the strain gauge fixed on the rhomboid surface of the elastic body will change its resistance accordingly;

[0018] The circuit board structure acquires the resistance change of the strain gauge, performs differential calculation between different resistance changes, and obtains the output voltage.

[0019] The magnitude of the pressure is determined based on the value of the output voltage.

[0020] The step of performing differential calculations between different resistance changes specifically includes:

[0021] The power supply voltage of the circuit board structure is set to V, and the output voltage nodes of the circuit board structure are U1, U2, U3 and U4;

[0022] Based on the KCL equations for U1, U2, U3, and U4, obtain the relationship between the output voltages U1, U2, U3, and U4 and the resistance in the circuit board structure;

[0023] Convert the relationship between the output voltages U1, U2, U3, and U4 and the resistance in the circuit board structure into a matrix form;

[0024] The output voltage matrix is ​​obtained by relating the output voltages U1, U2, U3, and U4 in matrix form to the resistance in the circuit board structure.

[0025] Furthermore, the specific expressions for the relationship between the output voltages U1, U2, U3, and U4 and the resistance in the circuit board structure are as follows:

[0026]

[0027] In the above formula, U1, U2, U3, and U4 represent the output voltage, and R1, R2, R3, R4, R5, R6, R7, R8, R9, R 10 R 11 R 12 R 13 R 14 R 15 and R 16 V represents the resistance of the strain gauge, and V represents the power supply voltage of the circuit board structure.

[0028] Furthermore, the matrix expressions for the relationship between the output voltages U1, U2, U3, and U4 in matrix form and the resistance in the circuit board structure are as follows:

[0029]

[0030]

[0031]

[0032] In the above formula, A represents the correlation matrix, B represents the voltage column vector, and U O This represents the output voltage matrix.

[0033] The beneficial effects of the sensor and measurement method of this invention are as follows: This invention designs a multi-dimensional force sensor, including an elastic body, a strain gauge module, a circuit board structure, a rigid beam module, and a flexible insulating pad. Furthermore, strain gauges are attached to the rhomboid surfaces of the composite rhomboid structure at both ends of the elastic body. The elastic body can produce different deformations according to different forms of load, and the strain gauges will produce corresponding resistance changes. This resistance change information is further acquired through the circuit board structure. Since the sensor signal changes are weak and easily affected by environmental interference, direct measurement will cause significant errors. Therefore, a differential voltage output method is used to process the acquired resistance change signal. That is, by subtracting different voltage values, the voltage difference is obtained and amplified for output. The output voltage value is then calculated to reflect the magnitude of the applied force. Because the two input terminals of this method are out of phase, it not only amplifies the signal but also cancels out common-mode signals during differential input, resulting in a differential signal in the differential output. This provides strong suppression of common-mode interference, thus amplifying weak signals and suppressing environmental noise, thereby improving the output stability of the multi-dimensional force sensor. Attached Figure Description

[0034] Figure 1 This is a three-dimensional structural schematic diagram of a multi-dimensional force sensor according to an embodiment of the present invention;

[0035] Figure 2 This is a schematic flowchart of the measurement method of a multi-dimensional force sensor according to an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram showing the strain gauge attachment position on the rhomboid surface of the composite rhomboid structure at both ends in an embodiment of the present invention;

[0037] Figure 4 This is a circuit diagram of the circuit board structure according to an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram illustrating the principle of tensile force detection using a multi-dimensional force sensor according to an embodiment of the present invention.

[0039] Figure 6 This is a schematic diagram illustrating the pressure detection principle of the multi-dimensional force sensor according to an embodiment of the present invention;

[0040] Figure 7 This is a schematic diagram illustrating the principle of bending force detection using a multi-dimensional force sensor according to an embodiment of the present invention.

[0041] Figure 8 This is a schematic diagram illustrating the principle of shear force and torsion detection using a multi-dimensional force sensor according to an embodiment of the present invention.

[0042] Figure 9 This is a schematic diagram illustrating the principle of the differential measurement method using a single composite rhomboid structure as an example in an embodiment of the present invention;

[0043] Reference numerals in the attached figures: 1. Strain gauge; 2. Lower composite rhomboid structure; 3. Upper composite rhomboid structure; 4. First rigid beam; 5. Second rigid beam; 6. Third rigid beam; 7. Fourth rigid beam; 8. Circuit board structure; 9. First stress point; 10. Second stress point; 11. Flexible insulating gasket; 12. Elastomer. Detailed Implementation

[0044] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The step numbers in the following embodiments are only for ease of explanation and do not limit the order of the steps. The execution order of each step in the embodiments can be adapted according to the understanding of those skilled in the art.

[0045] Reference Figure 1 This invention provides a multidimensional force sensor, including an elastic body 12, a strain gauge module, a circuit board structure 8, a rigid beam module, and a flexible insulating gasket 11. The rigid beam module is connected between the elastic bodies 12. The strain gauge module is attached to the surface of the elastic body 12 by a strain adhesive. The circuit board structure 8 is mounted on the inner bottom end of the rigid beam module and electrically connected to the strain gauge module. The flexible insulating gasket 11 is located between the elastic bodies 12.

[0046] The elastic body 12 is used to receive the external force to be measured and undergo corresponding deformation;

[0047] Specifically, refer to Figure 3 The elastic body 12 includes an upper composite rhomboid structure 3 and a lower composite rhomboid structure 2. The upper composite rhomboid structure 3 and the lower composite rhomboid structure 2 are connected by a rigid beam. The outer surface of the upper composite rhomboid structure 3 is provided with four rhomboid surfaces, and the outer surface of the lower composite rhomboid structure 2 is provided with four rhomboid surfaces. Each rhomboid surface is fitted with a strain gauge 1.

[0048] The strain gauge module is used to generate corresponding resistance value changes based on the deformation of the elastic body 12;

[0049] Specifically, the strain gauge module includes at least one resistive strain gauge with strain effect;

[0050] The strain gauge with strain effect is preferably strain gauge 1. Strain gauge 1 is attached to the rhomboid surfaces of two composite rhomboid structures. After strain gauge 1 is attached to elastomer 12 with strain adhesive, it is then cured to achieve the best detection effect of strain gauge 1.

[0051] The circuit board structure 8 is used to convert the deformation of the elastic body 12 under force into an electrical signal;

[0052] Specifically, refer to Figure 4The circuit board structure 8 includes a left-end circuit module and a right-end circuit module. The left-end circuit module includes resistance strain gauges R1-R16, and the right-end circuit module includes resistance strain gauges R17-R32. The left-end circuit module is attached to the strain gauge 1 of the lower composite rhombus structure 2, and the right-end circuit module is attached to the strain gauge 1 of the upper composite rhombus structure 3. The left-end circuit module is used to convert the deformation of the lower composite rhombus structure 2 under stress into an electrical signal, and the right-end circuit module is used to convert the deformation of the upper composite rhombus structure 3 under stress into an electrical signal.

[0053] Circuit board structure 8 is mainly responsible for collecting and processing the resistance changes of the output strain gauge, processing the collected signals, converting the resistance changes into voltage and processing the output, thus realizing the conversion of force signal to electrical signal;

[0054] In circuit board structure 8, the first end of strain gauge R1, the second end of strain gauge R4, the first end of strain gauge R5, and the first end of strain gauge R8 are connected to the output voltage U2. The second ends of strain gauge R1, R2, R5, and R6 are connected to V. CC The first end of strain gauge R2 is connected to the second end of strain gauge R3. The first ends of strain gauge R3, R4, R13, and R16 are connected and connected to U1. The first end of strain gauge R16 is connected to the first end of strain gauge R15. The second ends of strain gauge R15, R14, R12, and R11 are connected and grounded. The second ends of strain gauge R13, R14, R12, and R9 are connected and connected to U4. The second end of strain gauge R11 is connected to the first end of strain gauge R10. The second ends of strain gauge R10, R9, R8, and R7 are connected and connected to U3. The second end of strain gauge R7 is connected to the second end of strain gauge R6.

[0055] The left-end circuit module is attached to the strain gauge of the lower composite rhombus structure, and the right-end circuit module is attached to the strain gauge of the upper composite rhombus structure. The left-end circuit module is used to convert the deformation of the lower composite rhombus structure under stress into an electrical signal, and the right-end circuit module is used to convert the deformation of the upper composite rhombus structure under stress into an electrical signal.

[0056] The rigid beam module is used to support the elastic body 12;

[0057] Specifically, in order to ensure that the strain resistors at both ends can work properly and improve the stability of the sensor, a flexible insulating pad 11 is installed in the middle of the composite rhomboid structure at both ends.

[0058] Specifically, the rigid beam module includes four rigid beams;

[0059] There are four rigid beams, specifically the first rigid beam 4, the second rigid beam 5, the third rigid beam 6 and the fourth rigid beam 7. The rigid beams connect the upper and lower composite rhomboid structures and form an elastic multidimensional force sensor structure using the elastic body 12.

[0060] Flexible insulating pad 11 is used to improve the stability of multidimensional force sensor.

[0061] Reference Figure 2 A measurement method using a multidimensional force sensor includes the following steps:

[0062] S1. Apply the external force to be measured to the elastic body 12 to cause the elastic body 12 to produce a corresponding deformation;

[0063] S2. Based on the deformation of the elastic body 12, the strain gauge 1 fixed on the rhomboid surface of the elastic body 12 will change its resistance.

[0064] S3, Circuit board structure 8 collects the resistance change of strain gauge 1, performs differential calculation between different resistance changes, and obtains the output voltage;

[0065] Specifically, such as Figure 9 As shown, taking a single composite rhomboid structure as an example, the power supply voltage of circuit board structure 8 is set to V, connected from points A and C, and the voltage at points A and B is measured as U. AB The voltage at measurement points B and C is U. BC , measuring U AB and U BC The voltage is obtained by subtracting the two voltages to understand how they change under different loads. The voltage U changes under tension, compression, bending, shear, and torsion. AB and U BC The difference is zero;

[0066] For the lower composite rhomboid structure circuit, the corresponding one is... Figure 4 For the circuit model on the left side, assuming the power supply voltage is V, the KCL equations for nodes U1, U2, U3, and U4 are as follows:

[0067] -i1-i2+i3+i4=0

[0068] -i5-i6+i2+i7=0

[0069] -i7-i8+i9+i10 =0

[0070] -i4-i9+i 11 +i 12 =0

[0071] In the above formula, i1, i2, i3, i4, i5, i6, i7, i8, i9, i 10 i 11 and i 12 Representing resistors R2, R4, and R respectively 16 R 13 R1, R5, R8, R7, R9, R 10 R 12 and R 14 Current on;

[0072] The equation for node U1 is as follows:

[0073]

[0074] The equation for node U2 is as follows:

[0075]

[0076] The equation for node U3 is as follows:

[0077]

[0078] The equation for node U4 is as follows:

[0079]

[0080] Based on the above node formulas, the expressions for the relationship between the output voltages U1, U2, U3, and U4 and the resistance in circuit board structure 8 are as follows:

[0081]

[0082] In the above formula, U1, U2, U3, and U4 represent the output voltage, and R1, R2, R3, R4, R5, R6, R7, R8, R9, R 10 R 11 R 12 R 13 R 14 R 15 and R 16 V represents the resistance of strain gauge 1, and V represents the power supply voltage of circuit board structure 8.

[0083] The four equations can be written in matrix form, and their matrix expressions are as follows:

[0084]

[0085]

[0086]

[0087] In the above formula, A represents the correlation matrix, B represents the voltage column vector, and U O Represents the output voltage matrix;

[0088] Based on the expression for the relationship between the output voltages U1, U2, U3, and U4 in matrix form and the resistance in circuit board structure 8, we obtain A*U0 = B, U O =A -1 *B, ultimately yielding the output voltage matrix U O Similarly, the output voltage matrix U1 = [U5 U6 U7 U8] is derived from the circuit model on the right side using this method. T ;

[0089] S4. Determine the magnitude and nature of the force based on the change in output voltage to determine the magnitude of the pressure.

[0090] Specifically, the magnitude of the external force is determined based on the change in the output voltage. By measuring the change in the output voltage to reflect the magnitude of the external force, the value and nature of the external force can be obtained.

[0091] In practical applications of multidimensional force sensors, the individual rhombuses in the composite rhombus structure undergo different deformations when subjected to different external loads. Based on this characteristic, a differential voltage output method is adopted in the circuit design, that is, the voltages at two points are subtracted to calculate the output voltage value to reflect the magnitude of the force, thereby improving the stability of the sensor output.

[0092] Compared with traditional multidimensional force sensors, this invention has an overall symmetrical structure, which is simple, easy to manufacture, and can measure different loads such as tension, pressure, bending force and torsion.

[0093] Furthermore, regarding the present invention Figure 5 , Figure 6 , Figure 7 and Figure 8 To explain:

[0094] Figure 5 This is a schematic diagram illustrating the tensile force detection principle of the multi-dimensional force sensor according to an embodiment of the present invention, taking a single composite rhomboid structure as an example. Figure 5 The diagram shows the structural changes of a composite rhombus structure under tension. The left half represents the shape of the composite rhombus structure in its normal state, while the right half represents the changes in the length of each side of the composite rhombus structure when it is subjected to a tensile force Ft from the point of application.

[0095] Figure 6 This is a schematic diagram illustrating the pressure detection principle of the multi-dimensional force sensor according to an embodiment of the present invention, taking a single composite rhomboid structure as an example. Figure 6 The diagram shows the structural changes of a composite rhombus structure under compression. The left half shows the shape of the composite rhombus structure in its normal state, while the right half represents the changes in the length of each side of the composite rhombus structure when it is subjected to a compressive force Fc from the point of application.

[0096] Figure 7 This is a schematic diagram illustrating the principle of bending force detection using a multi-dimensional force sensor according to an embodiment of the present invention, taking a single composite rhomboid structure as an example. Figure 7 The diagram shows the structural changes of a composite rhombus structure under bending force. The left half shows the shape of the composite rhombus structure in its normal state, while the right half represents the changes in the length of each side of the composite rhombus structure when subjected to a bending moment M from the point of force application.

[0097] Figure 8 This is a schematic diagram of the detection principle of the multi-dimensional force sensor for shear force and torsion in an embodiment of the present invention, wherein (1) is the shape of the composite rhombus structure in its normal state; (2) represents the change of the side lengths when a single composite rhombus structure is subjected to shear force Fs; (3) represents the state diagram of the two composite rhombus structures subjected to shear force FS respectively, and the force point is subjected to shear force F. S The state diagram, where F S1 For the composite rhomboid structure above to be subjected to shear force, F S2 (4) represents the state diagram under the action of torque T derived from the difference in shear force after the superposition of the two composite rhombuses.

[0098] In summary, when measuring external force, the force to be measured is applied to the first force point 9 and the second force point 10 of the lower composite rhombus structure 2. The external force is transmitted to the upper composite rhombus structure 3 through four rigid beams, causing deformation of the composite rhombus structures at both ends, resulting in changes in the resistance of the rhombus surface. The circuit board collects data from each strain resistor. Due to the different forms of external force, each rhombus in the composite rhombus structure at both ends undergoes different deformation effects, resulting in different changes in resistance. The circuit board processes the collected data in different ways to calculate the magnitude of the current external force.

[0099] The content of the above method embodiments is applicable to this system embodiment. The specific functions implemented in this system embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0100] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A multidimensional force sensor, characterized in that, The system includes an elastomer, a strain gauge module, a circuit board structure, a rigid beam module, and a flexible insulating gasket. The rigid beam module is connected between the elastomers. The strain gauge module is attached to the surface of the elastomers using a strain gauge adhesive. The circuit board structure is mounted on the inner bottom end of the rigid beam module and is electrically connected to the strain gauge module. The flexible insulating gasket is located between the elastomers. The elastic body is used to receive the external force to be measured and undergo corresponding deformation; The elastic body includes an upper composite rhomboid structure and a lower composite rhomboid structure, which are connected by the rigid beam. The outer surface of the upper composite rhomboid structure is provided with four rhomboid surfaces, and the outer surface of the lower composite rhomboid structure is provided with four rhomboid surfaces. Each rhomboid surface is fitted with a strain gauge. The strain gauge module is used to generate a corresponding change in resistance value based on the deformation of the elastic body; The circuit board structure is used to convert the deformation of the elastomer when it is subjected to force into an electrical signal; The rigid beam module is used to support the elastic body; The flexible insulating pad is used to improve the stability of the multidimensional force sensor.

2. The multidimensional force sensor according to claim 1, characterized in that, The strain gauge module includes at least one resistance strain gauge with strain effect.

3. The multidimensional force sensor according to claim 2, characterized in that, The circuit board structure includes a left-end circuit module and a right-end circuit module. The left-end circuit module is attached to the strain gauge of the lower composite rhombus structure, and the right-end circuit module is attached to the strain gauge of the upper composite rhombus structure. The left-end circuit module is used to convert the deformation of the lower composite rhombus structure under stress into an electrical signal, and the right-end circuit module is used to convert the deformation of the upper composite rhombus structure under stress into an electrical signal.

4. A multidimensional force sensor according to claim 3, characterized in that, In the circuit board structure, the first end of strain gauge R1, the second end of strain gauge R4, the first end of strain gauge R5, and the first end of strain gauge R8 are connected to the output voltage U2. The second ends of strain gauge R1, R2, R5, and R6 are connected to the output voltage U2. The first end of strain gauge R2 is connected to the second end of strain gauge R3. The first ends of strain gauge R3, R4, R13, and R16 are connected and connected to U1. The first end of strain gauge R16 is connected to the first end of strain gauge R15. The second ends of strain gauge R15, R14, R12, and R11 are connected and grounded. The second ends of strain gauge R13, R14, R12, and R9 are connected and connected to U4. The second end of strain gauge R11 is connected to the first end of strain gauge R10. The second ends of strain gauge R10, R9, R8, and R7 are connected and connected to U3. The second end of strain gauge R7 is connected to the second end of strain gauge R6.

5. A multidimensional force sensor according to claim 4, characterized in that, The rigid beam module comprises four rigid beams.

6. A measurement method for a multidimensional force sensor according to any one of claims 1-5, characterized in that, Includes the following steps: The external force to be tested is applied to the elastic body to cause the elastic body to produce a corresponding deformation. Based on the deformation of the elastic body, the strain gauge fixed on the rhomboid surface of the elastic body will change its resistance accordingly; The circuit board structure acquires the resistance change of the strain gauge, performs differential calculation between different resistance changes, and obtains the output voltage. The magnitude of the pressure is determined based on the value of the output voltage, and the value of the applied pressure is obtained by measuring the change in the output voltage.

7. The measurement method of a multidimensional force sensor according to claim 6, characterized in that, The step of performing differential calculations between different resistance changes specifically includes: The power supply voltage of the circuit board structure is set to V, and the output voltage nodes of the circuit board structure are U1, U2, U3 and U4; Based on the KCL equations for U1, U2, U3, and U4, obtain the relationship between the output voltages U1, U2, U3, and U4 and the resistance in the circuit board structure; Convert the relationship between the output voltages U1, U2, U3, and U4 and the resistance in the circuit board structure into a matrix form; The output voltage matrix is ​​obtained by relating the output voltages U1, U2, U3, and U4 in matrix form to the resistance in the circuit board structure.

8. The measurement method of a multidimensional force sensor according to claim 7, characterized in that, The specific expressions for the relationship between the output voltages U1, U2, U3, and U4 and the resistance in the circuit board structure are as follows: In the above formula, , , and Indicates the output voltage. , , , , , , , , , , , , , , and This indicates the resistance of the strain gauge. This indicates the power supply voltage of the circuit board structure.

9. The measurement method of a multidimensional force sensor according to claim 8, characterized in that, The matrix expressions for the relationship between the output voltages U1, U2, U3, and U4 in matrix form and the resistance in the circuit board structure are shown below: In the above formula, Represents the correlation matrix. Represents the voltage column vector. This represents the output voltage matrix.

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