Method for milling a sheet

Abstract

The present application relates to sheet processing technical field, especially to a kind of sheet milling processing method, it includes: step one, clean workpiece surface, draw out square in first side surface, form several evenly distributed nodes;Step two, stick pad in each node position;Step three, the second side surface of workpiece is pasted on workbench surface, each pad on the first side surface is milled, so that the milling surface of each pad is located in the same plane;Step four, clean workbench surface, the milling surface of each pad on the first side surface of workpiece is pasted flat workbench surface, the second side surface is milled;Step five, clean workbench surface, the second side surface of workpiece is pasted flat workbench surface, the first side surface is milled, so that workpiece reaches qualified size.The above-mentioned sheet milling processing method improves the positioning accuracy and clamping reliability of sheet workpiece, improves the milling surface quality of workpiece, ensures flatness and parallelism, saves material cost, and improves processing efficiency.

Description

Technical Field

[0001] This invention relates to the field of thin plate processing technology, and in particular to a method for milling thin plates. Background Technology

[0002] Thin-plate parts with high precision are widely used in many high-precision applications. Their wall thickness to contour dimension ratio is less than 1:20, and their flatness and parallelism tolerance grades are IT3 or higher. The main manufacturing challenges are as follows:

[0003] 1) Under the influence of residual cutting stress, warping or twisting deformation is very likely to occur;

[0004] 2) Under the action of cutting force, cutting vibration is very likely to occur, which affects machining accuracy and surface roughness;

[0005] 3) Under clamping force, the clamping deformation is very likely to occur, affecting the machining accuracy;

[0006] 4) Excessive allowance for machining leads to significant material waste and high costs;

[0007] 5) Milling operations require the workpiece to be turned around many times, necessitating repeated clamping and positioning, resulting in low efficiency.

[0008] Given the above technical challenges, improving product qualification rate and production efficiency while reducing processing difficulty and cost are urgent problems that technicians engaged in precision machinery manufacturing need to solve. Summary of the Invention

[0009] Based on the above problems, the purpose of this invention is to provide a thin plate milling method that can easily meet the requirements of thin plate processing.

[0010] To achieve the above objectives, the present invention adopts the following technical solution:

[0011] A method for milling thin plates, comprising:

[0012] Step 1: Clean the surface of the workpiece and draw squares on the first side surface to form several evenly distributed nodes;

[0013] Step 2: Adhere the pads at each node location;

[0014] Step 3: Place the second side surface of the workpiece on the worktable and mill each pad on the first side surface so that the milled surfaces of each pad are on the same plane.

[0015] Step 4: Clean the worktable, flatten the milled surfaces of each pad on the first side surface of the workpiece onto the worktable, and then mill the second side surface.

[0016] Step 5: Clean the worktable surface, flatten the second side surface of the workpiece against the worktable surface, and mill the first side surface to bring the workpiece to the required dimensions.

[0017] Optionally, in steps three, four, and five, the workpiece is fixed to the worktable by its own weight or by side clamping, or the side of the workpiece is glued to the worktable.

[0018] Optionally, in steps one and two, the oil stains at each node location and the bonding surface of the pad are wiped off with alcohol.

[0019] Optionally, in step one, the grid size is set to 200mm*200mm.

[0020] Optionally, in step two, AB glue is used for bonding. The curing time of the glue is 15 minutes in summer and 30 minutes in winter. When cleaning up the AB glue, use a glue remover to soften it before scraping it off.

[0021] Optionally, in step four, before milling, the second side surface of the workpiece is tapped to ensure that the milled surface of the pad is in contact with the worktable surface.

[0022] Optionally, in step five, before milling, the pad is removed or left on the first side surface.

[0023] Optionally, the bonding surface of the pad has a size of 20mm*20mm and the thickness of the pad is 3mm.

[0024] Optionally, the pad is made of aluminum, and a special aluminum milling insert is used when milling the pad.

[0025] In summary, the beneficial effects of the present invention are as follows: compared with the prior art, the thin plate milling method uses pads to thicken the thin plate workpiece, which improves the positioning accuracy and clamping reliability of the thin plate workpiece, avoids the phenomenon of workpiece vibration and tool bounce, improves the milling quality of the workpiece, ensures flatness and parallelism, and requires less milling of the workpiece body, saving material costs and improving processing efficiency. Detailed Implementation

[0026] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] This preferred embodiment provides a thin plate milling method for plates with large surfaces and a thickness not exceeding 60mm, requiring a flatness of less than 0.05 and a parallelism of less than 0.12. The method specifically includes the following steps:

[0028] Step 1: Clean the surface of the workpiece and draw squares on the first side surface to form several evenly distributed nodes.

[0029] Specifically, you can use chalk to draw a grid of approximately 200mm x 200mm. Make sure to draw nodes on the edges and corners. The size of the grid can be adjusted as needed.

[0030] Step 2: Adhere the pads at each node location.

[0031] It is important to note that all joint locations and the bonding surfaces of the spacers should be wiped with alcohol to remove oil stains and ensure reliable adhesion. The preferred spacer is an aluminum block with a bonding surface size of 20mm x 20mm and a thickness of 3mm. AB glue is used to bond the aluminum block to the workpiece. The curing time is approximately 15 minutes in summer and 30 minutes in winter. A heat gun can be used to further accelerate the curing process.

[0032] Step 3: Place the second side surface of the workpiece on the worktable and mill each pad on the first side surface. Specifically, use a special aluminum milling insert to mill the pads so that the milled surfaces of each pad are on the same plane.

[0033] To ensure milling accuracy, heavy workpieces do not need to be clamped, while light workpieces can be fixed to the worktable by side clamping, or the workpiece can be cleaned of oil stains on the side and then glued to the worktable with AB glue.

[0034] Step 4: Clean the worktable, flatten the milled surfaces of each pad on the first side surface of the workpiece onto the worktable, and then mill the second side surface.

[0035] Furthermore, before milling, the second side surface of the workpiece is tapped to ensure that the milled surface of the pad is in contact with the worktable surface; there should be no serious vibration during the milling process, and the flatness can be ensured to be 0.05. After this surface is milled, the workpiece can be placed on the inspection platform and checked with a feeler gauge.

[0036] Step 5: Clean the worktable surface, flatten the second side surface of the workpiece against the worktable surface, and mill the first side surface to bring the workpiece to the required dimensions.

[0037] The main steps for cleaning the workbench are to remove iron filings, high spots, etc., and to smooth it with an oilstone. Then, mill the aluminum block and place it flat on the workbench. For any adhesive residue on the workbench, use an adhesive remover to wet the adhesive area. After about 5 minutes, the adhesive will soften. Use a scraper to remove the adhesive, tap (you can use a metal plate to avoid damaging the workpiece) or push the workpiece from the side to move it. After moving the workpiece, any remaining adhesive residue on the workbench should still be cleaned with an adhesive remover and a scraper. For minor issues, use sandpaper or an oilstone to smooth it.

[0038] In addition, before the final milling of the first side surface of the workpiece, the aluminum block can be removed by striking it with a hammer and an iron plate, or the aluminum block can be left unremoved, since the thickness of the aluminum block is only 3mm, which will not affect the milling process.

[0039] In summary, the above-mentioned thin plate milling method uses pads to thicken the thin plate workpiece, which improves the positioning accuracy and clamping reliability of the thin plate workpiece, avoids the phenomenon of workpiece vibration and tool bounce, improves the milling surface quality of the workpiece, ensures flatness and parallelism, and reduces the amount of milling on the workpiece body, saving material costs and improving processing efficiency.

[0040] The above embodiments merely illustrate the basic principles and characteristics of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for milling thin plates, characterized in that, include: Step 1: Clean the surface of the workpiece and draw squares on the first side surface to form several evenly distributed nodes; Step 2: Adhesive pads are applied to each node location to thicken the workpiece; Step 3: Place the second side surface of the workpiece on the worktable and mill each pad on the first side surface so that the milled surfaces of each pad are on the same plane. Step 4: Clean the worktable, flatten the milled surfaces of each pad on the first side surface of the workpiece onto the worktable, and then mill the second side surface. Step 5: Clean the worktable surface, flatten the second side surface of the workpiece against the worktable surface, and mill the first side surface to bring the workpiece to the required dimensions.

2. The thin plate milling method according to claim 1, characterized in that, In steps three, four, and five, the workpiece is fixed to the worktable by its own weight or by side clamping, or by gluing the side of the workpiece to the worktable.

3. The thin plate milling method according to claim 1, characterized in that, In steps one and two, the oil stains on each node location and the bonding surface of the pad are wiped with alcohol to remove them.

4. The thin plate milling method according to claim 1, characterized in that, In step one, the grid size is set to 200mm*200mm.

5. The thin plate milling method according to claim 1, characterized in that, In step two, AB glue is used for bonding. The curing time of the glue is 15 minutes in summer and 30 minutes in winter. When cleaning up the AB glue, use a glue remover to soften it before scraping it off.

6. The thin plate milling method according to claim 1, characterized in that, In step four, before milling, the second side surface of the workpiece is tapped to ensure that the milled surface of the pad is in contact with the worktable surface.

7. The thin plate milling method according to claim 1, characterized in that, In step five, before milling, the pad is removed or left on the first side surface.

8. The thin plate milling method according to claim 1, characterized in that, The bonding surface of the pad has a size of 20mm*20mm, and the thickness of the pad is 3mm.

9. The thin plate milling method according to claim 1, characterized in that, The pad is an aluminum block, and a special aluminum milling insert is used when milling the pad.