A PCB assembly welding system and method

Abstract

The application relates to the technical field of battery module production, and particularly discloses a PCB assembly welding system and method, which comprises a pre-fixing mechanism and a welding mechanism. The pre-fixing mechanism comprises a carrier assembly and a pre-connection assembly. The carrier assembly is used for carrying a module. The pre-connection assembly is used for pre-fixing a PCB assembly on the module. The welding mechanism comprises a pressing assembly and a welding assembly. The pressing assembly is used for pressing pins of the PCB assembly. The welding assembly is used for welding the pins. The PCB assembly is pre-fixed on the module through the pre-connection assembly, so that displacement of the PCB assembly relative to the module during the process of welding the pins by the welding assembly is avoided, welding alignment errors are avoided, and the risk of displacement of the PCB assembly during the process of welding and pressing is avoided.

Description

Technical Field

[0001] This application relates to the field of battery module manufacturing technology, and in particular to a PCB assembly welding system and method. Background Technology

[0002] PCB components are one of the components of a battery pack, and they can be either flexible or rigid. During the battery pack manufacturing process, PCB components need to be soldered onto the busbars on the end face of the battery module.

[0003] Because PCB components are thin and lightweight, there is a risk of PCB component displacement during the pre-soldering clamping process, which could lead to incorrect soldering alignment. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a PCB assembly welding system and method to solve the problem of displacement risk during the welding and clamping process of PCB assemblies.

[0005] To achieve the above-mentioned technical objectives, the first aspect of this application provides a PCB assembly welding system, including: a pre-fixing mechanism and a welding mechanism;

[0006] The pre-fixing mechanism includes: a carrier assembly and a pre-connection assembly;

[0007] The vehicle assembly is used to carry the module;

[0008] The pre-attached component is used to pre-fix the PCB component onto the module;

[0009] The welding mechanism includes: a clamping assembly and a welding assembly;

[0010] The clamping assembly is used to clamp the pins of the PCB assembly;

[0011] The welding assembly is used to weld the pins.

[0012] Furthermore, it also includes: conveyor lines;

[0013] The conveyor line is used to convey the vehicle assembly along a first direction;

[0014] The pre-connection component is disposed on one or both sides of the conveyor line along the second direction, and is used to pre-fix the PCB assembly.

[0015] The first direction is perpendicular to the second direction.

[0016] Furthermore, the pre-connected assembly includes: a riveting part and a moving part;

[0017] The riveting part is used to rivet the PCB assembly and the module;

[0018] The moving part is connected to the riveting part and is used to drive the riveting part to move along the second direction.

[0019] Furthermore, the welding mechanism comprises several components;

[0020] Several of the aforementioned welding mechanisms are arranged sequentially along the first direction;

[0021] The welding assembly is disposed on the conveyor line;

[0022] The clamping assembly is disposed on one or both sides of the welding assembly along the second direction.

[0023] Furthermore, the clamping assembly includes: a first driver, a second driver, a platform, and a clamping element;

[0024] The platform is connected to the conveyor line;

[0025] The first driver is mounted on the platform and is used to drive the vehicle assembly to move along the second direction on the platform;

[0026] The clamping element is slidably mounted on the platform;

[0027] The second driver is used to drive the clamping member to slide and press against or move away from the pins of the PCB assembly.

[0028] Furthermore, a rotator is provided on the vehicle assembly;

[0029] The rotator is used to drive the module to rotate horizontally so that the module rotates to a position where the PCB assembly is located in a first direction of the module;

[0030] The clamping element is located on one or both sides of the platform along the first direction;

[0031] The second driver is used to drive the clamping member to slide along the first direction.

[0032] Furthermore, the clamping assembly also includes: a connecting surface;

[0033] The platform is equipped with guide components;

[0034] The connecting surface is slidably disposed on the guide member and is fixedly connected to the clamping member;

[0035] The output of the second driver is connected to the connection surface.

[0036] Furthermore, the vehicle assembly includes: a platform and a pressure plate;

[0037] The module is placed on the platform;

[0038] The pressure plate is slidably disposed on the platform and is used to press the PCB assembly on the module.

[0039] Furthermore, it also includes: a clamping mechanism;

[0040] The clamping mechanism is disposed on one or both sides of the conveyor line along the second direction, and the clamping mechanism is located between the pre-connection component and the welding mechanism along the first direction;

[0041] The clamping mechanism includes: a third actuator, a fourth actuator, and a clamp;

[0042] The pressure plate is slidably disposed in a direction parallel to the end face of the PCB assembly;

[0043] The third driver is connected to the clip and is used to drive the clip to slide in a direction perpendicular to the end face of the PCB assembly to abut against or move away from the pressure plate;

[0044] The fourth driver is connected to the clip and is used to drive the clip to slide in a direction parallel to the end face of the PCB assembly, thereby pushing the pressure plate to slide until the pins of the PCB assembly are exposed.

[0045] The second aspect of this application provides a PCB assembly soldering method, including the following steps:

[0046] Attach the PCB assembly to the side of the module;

[0047] The PCB assembly is pre-connected to the module using pre-connection components;

[0048] The pins of the PCB assembly are clamped by a clamping component;

[0049] The pins are soldered using a soldering assembly.

[0050] As can be seen from the above technical solutions, this application provides a PCB assembly welding system and method. The system includes: a pre-fixing mechanism and a welding mechanism; the pre-fixing mechanism includes: a carrier assembly and a pre-connection assembly; the carrier assembly is used to mount a module; the pre-connection assembly is used to pre-fix the PCB assembly onto the module; the welding mechanism includes: a clamping assembly and a welding assembly; the clamping assembly is used to clamp the pins of the PCB assembly; the welding assembly is used to weld the pins.

[0051] In existing PCB assembly soldering methods, the process of pressing the PCB assembly poses a risk of misalignment with the module. Furthermore, the numerous and varied solder points on the PCB assembly can lead to misaligned soldering or cold solder joints. In this solution, pre-attached components can pre-fix the PCB assembly onto the module, preventing misalignment of subsequent solder points. This ensures that cold solder joints do not occur during the subsequent detailed soldering process, thus avoiding the risk of the PCB assembly shifting relative to the module during the soldering process. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 This is a schematic diagram of the overall structure of a PCB assembly welding system provided in an embodiment of this application;

[0054] Figure 2 This is a schematic diagram of a pre-fixing mechanism for a PCB assembly welding system provided in an embodiment of this application;

[0055] Figure 3 A schematic diagram of a clamping component for a PCB assembly welding system provided in this application embodiment;

[0056] Figure 4 An enlarged view of one side of a clamping component in a clamping assembly of a PCB assembly welding system provided in an embodiment of this application;

[0057] Figure 5 A schematic diagram of the riveting part and the moving part of a PCB assembly welding system provided in this application embodiment;

[0058] Figure 6 This is a schematic diagram of a pre-fixed component of a PCB assembly welding system provided in another embodiment of this application;

[0059] Figure 7 An enlarged view of the clamping component on the other side of the clamping assembly in a PCB assembly welding system provided in an embodiment of this application;

[0060] Figure 8 A schematic diagram of the clamping mechanism and carrier assembly of a PCB assembly welding system provided in this application embodiment;

[0061] Figure 9 A schematic diagram of a carrier assembly for a PCB assembly welding system provided in this application embodiment;

[0062] Figure 10 A schematic diagram of the clamping mechanism of a PCB assembly welding system provided in this application embodiment;

[0063] Figure 11 Another schematic diagram of the clamping mechanism of a PCB assembly soldering system provided in this application embodiment. Detailed Implementation

[0064] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments in this application specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.

[0065] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0066] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0067] The first aspect of this application provides a PCB assembly soldering system. Please refer to... Figure 1 The system includes a pre-fixing mechanism 100 and a welding mechanism 200.

[0068] Please see Figure 2The pre-fixing mechanism 100 includes a carrier assembly 110 and a pre-connection assembly 120. The carrier assembly 110 is used to mount the module 10; the pre-connection assembly 120 is used to pre-fix the PCB assembly 20 to the module 10. The PCB assembly 20 can be manually attached to the end face of the module 10 by an operator or by a separately provided feeding assembly. Then, the pre-connection assembly 120 pre-connects the PCB assembly 20 to the module 10, ensuring that the PCB assembly 20 is fixedly connected to the module 10 and will not shift relative to it.

[0069] Please see Figures 1 to 4 The welding mechanism 200 includes a clamping assembly 210 and a welding assembly 220; the clamping assembly 210 is used to clamp the pins 21 of the PCB assembly 20; the welding assembly 220 is used to weld the pins 21. (See also...) Figure 4 The clamping assembly 210 can clamp the pin 21 through the copper nozzle 217; after clamping, the welding assembly 220 welds the pin 21.

[0070] Because of the pre-fixing operation of the pre-connected component 120 on the PCB component 20, the PCB component 20 will not be relatively displaced from the module 10 during the process of the clamping component 210 clamping the pin 21, thereby improving the welding accuracy and yield.

[0071] In practical applications, the pre-connection component 120 can pre-fix the PCB component 20 and the module 10 by means of adhesive bonding, pin connection, etc. For example, if the pre-connection component 120 is an adhesive application tool, the PCB component 20 and the module 10 can be fixedly connected by applying adhesive to the PCB component 20; if the pre-connection component 120 is a pin-driving tool, the PCB component 20 and the module 10 can be fixedly connected by driving pins through the through holes on the PCB component 20.

[0072] It should be noted that the pre-fixing mechanism 100 and the welding mechanism 200 can be set in the same working area and arranged sequentially. Specifically, after the pre-fixing mechanism 100 pre-fixes the PCB assembly 20 onto the module 10, the module 10 can be transferred to the welding mechanism 200 for further pressing and welding.

[0073] In one embodiment, see Figure 1 and Figure 2 It also includes: a conveyor line 300; the conveyor line 300 is used to convey the carrier assembly 110 along a first direction. The conveyor line 300 can be, for example, a conveyor belt. In this embodiment, the conveying direction of the conveyor line 300 is taken as the first direction, and the mechanism required for soldering the PCB assembly 20 can be arranged on the conveyor line 300 along the first direction to achieve continuous sequential operation. The first direction can be... Figure 1 and Figure 2 The x-direction in the middle.

[0074] PCB assembly 20 is located on one or both sides of module 10 along the second direction; pre-connection assembly 120 is disposed on one or both sides of conveyor line 300 along the second direction; the first direction is perpendicular to the second direction. The second direction can be... Figure 1 and Figure 2 y direction in .

[0075] Specifically, during the operation, the module 10 can be transferred to the conveyor line 300 by the loading component or by the operator, and then the PCB assembly 20 can be attached to the end face of the module 10 along the second direction. In this embodiment, the PCB assembly 20 can be attached to both sides of the module 10 at the same time. Correspondingly, pre-connection components 120 are provided on both sides of the module 10 along the second direction, so that the PCB assemblies on both sides of the module 10 can be pre-fixed at the same time, and then the two sides of the module 10 can be soldered at the same time, ultimately achieving the goal of improving work efficiency.

[0076] In actual operation, due to the complex and varied structure of PCB assembly 20, and in order to avoid its displacement relative to module 10 after installation, manual operation is often used to install PCB assembly 20 horizontally on module 10 in one direction. This method requires soldering one side of module 10 and then soldering the other side, which has a low degree of automation and is time-consuming.

[0077] The welding system provided in this embodiment can simultaneously pre-fix the PCB assemblies 20 on both sides of the module 10 and simultaneously weld the pins 21 on both sides of the module 10, thereby effectively reducing the operation time and improving the operation efficiency.

[0078] For a more specific embodiment, please refer to Figure 2 and Figure 5 The pre-connection assembly 120 includes: a riveting part 121 and a moving part 122; the riveting part 121 is used to rivet the PCB assembly 20 and the module 10; the moving part 122 is connected to the riveting part 121 for driving the riveting part 121 to move along the second direction.

[0079] In this embodiment, the PCB assembly 20 and the module 10 are pre-fixed by riveting the riveting part 121. The moving part 122 can be, for example, a cylinder; by moving the riveting part 121 along the second direction, the distance between the riveting part 121 and the PCB assembly 20 in the second direction can be adjusted, thereby ensuring that the riveting part 121 can perform an effective riveting operation on the PCB assembly 20, and avoiding the phenomenon of excessive riveting force and misalignment caused by the riveting part 121 being too close to the PCB assembly 20.

[0080] As a further improvement, the pre-connected assembly 120 may include a support plate 123; the riveting part 121 and the moving part 122 are disposed on the support plate 123. The riveting part 121 may include multiple parts and is spaced apart along a first direction to rivet different positions of the PCB assembly 20.

[0081] In embodiments with multiple riveting parts 121, the multiple riveting parts 121 can be staggered in the vertical direction. That is, some riveting parts 121 can be connected to the support plate 123 through the support block 124, so that the riveting part 121 and the adjacent riveting part 121 are staggered in the vertical direction, thereby riveting different positions of the PCB assembly 20 in the vertical direction and improving the pre-fixing effect of riveting.

[0082] In one embodiment, the pre-connection component 120 further includes a second moving part 125 and a third moving part 126.

[0083] A support plate 123 is disposed on the output end of the second moving part 125. The second moving part 125 is used to drive the support plate 123 to move along the second direction to adjust the distance between the support plate 123, the moving part 122, and the riveting part 121 as a whole and the PCB assembly 20. That is, the second moving part 125 can realize the coarse adjustment of the distance between the riveting part 121 and the PCB assembly 20 in the second direction, while the moving part 122 can realize the fine adjustment of the distance between the riveting part 121 and the PCB assembly 20 in the second direction.

[0084] The third moving part 126 can be mounted on the bracket, and its output end is connected to the second moving part 125. It is used to drive the second moving part 125 and the support plate 123 to move together in the first direction, thereby adjusting the position of the riveting part 121 along the conveying direction of the conveyor line 300. At the same time, the third moving part 126 can be mounted on the plate, and a height adjustment component can be provided below the plate, so that the height of the third moving part 126, the second moving part 125 and the support plate 123 can be adjusted by the height adjustment component.

[0085] Furthermore, the pre-attachment assembly 120 may also include a vision assembly 127; the vision assembly 127 may be fixedly connected to the second moving part 125 or the support plate 123 and face the conveyor line 300, for pre-fixing point addressing of the PCB assembly 20 and transmitting the information to the controller. The controller obtains the pre-fixing point position of the PCB assembly 20 based on the pre-fixing point addressing result information, and then controls the moving part 122, the second moving part 125 and the third moving part 126 to move the riveting part 121 to the riveting station aligned with the pre-fixing point, ensuring that the riveting part 121 can perform an effective riveting pre-fixing operation on the PCB assembly 20.

[0086] In another embodiment, please refer to Figure 1The welding mechanism 200 includes several units; the several welding mechanisms 200 are arranged sequentially along the first direction.

[0087] The welding assembly 220 is disposed on the conveyor line 300; the clamping assembly 210 is disposed on one or both sides of the welding assembly 220 along the second direction.

[0088] Taking the example of welding mechanism 200, which may include two units and are spaced apart along the first direction, and welding assembly 220 having clamping components 210 on both sides: During operation, conveyor line 300 continuously conveys carrier assembly 110; after carrier assembly 110 is pre-fixed by pre-connection component 120, it is conveyed to the first welding mechanism 200. The first welding mechanism 200 transfers carrier assembly 110 to the clamping component 210 on one side for clamping and welding. During the welding process, the second carrier assembly 110 can be conveyed to the clamping component 210 on the other side of the first welding mechanism 200 for clamping, and the third and fourth carrier assemblies 110 can be conveyed to the second welding mechanism 200 for clamping and welding, thereby achieving uninterrupted continuous operation.

[0089] In one implementation, the welding assembly 220 can be a multi-axis robot, such as a six-axis robot, so that it can simultaneously dock with the clamping assemblies 210 on both sides in the second direction.

[0090] In one embodiment, see Figure 1 , Figure 3 and Figure 4 The clamping assembly 210 includes: a first driver 211, a second driver 212, a platform 213, and a clamping member 214.

[0091] The test stand 213 is connected to the conveyor line 300. Specifically, the test stand 213 is interconnected with the conveyor line 300, so that the carrier assembly 110 on the conveyor line 300 can be transferred to the test stand 213.

[0092] The first driver 211 is disposed on the stand 213 and is used to drive the carrier assembly 110 to move along the second direction on the stand 213. The clamping member 214 is slidably disposed on the stand 213; the second driver 212 is used to drive the clamping member 214 to slide and clamp or move away from the pin 21 of the PCB assembly 20.

[0093] In the application, the clamping assembly 210 may include a transfer plate; the transfer plate is movably disposed along the second direction; the output end of the first driver 211 is connected to the transfer plate so that it can drive the transfer plate to move along the second direction onto the conveyor line 300; after the carrier assembly 110 moves onto the transfer plate, the first driver 211 drives the transfer plate to move, which can drive the carrier assembly 110 to move along the second direction on the stand 213 to the position of the clamping assembly 210; then, the second driver 212 drives the clamping member 214 to clamp the pin 21, and then the welding assembly 220 can weld the pin 21.

[0094] It should be noted that the copper nozzles 217 on the clamping member 214 can be staggered in both horizontal and vertical directions. For example... Figure 4 and Figure 7 As shown, the misaligned copper nozzle 217 can be adapted to various PCB assemblies 20 of different sizes and shapes.

[0095] As a further improvement, the clamping assembly 210 may also include: a fifth driver; the clamping member 214 may be disposed on a movable stage; the movable stage is movably connected to the frame 213 in the second direction; the output end of the fifth driver is connected to the movable stage, thereby allowing adjustment of the position of the clamping member 214 on the movable stage in the second direction.

[0096] Furthermore, both the fifth driver and the second driver 212 can be equipped with displacement sensing components, which can sense the moving distance of the copper nozzle 217 on the clamping member 214, ensuring that the position of the copper nozzle 217 corresponds to that of the pin 21.

[0097] In one embodiment, a rotator is provided on the carrier assembly 110; the rotator is used to drive the module 10 to rotate horizontally so that the module 10 rotates to the position where the PCB assembly 20 is located in a first direction of the module 10; the clamping member 214 is located on one or both sides of the platform 213 along the first direction; the second driver 212 is used to drive the clamping member 214 to slide along the first direction.

[0098] Specifically, the rotator can be positioned below the aforementioned transfer plate, driving the carrier assembly 110 and module 10 to rotate by rotating the transfer plate. Correspondingly, the output of the first driver 211 is connected to the transfer plate via the rotator.

[0099] Without a transfer plate, the PCB assembly 20 will be located in the second direction of the module 10, so the clamping member 214 needs to be set in the second direction of the module 10. This way, the clamping member 214 can only clamp one end face of the module 10 at a time, resulting in low work efficiency.

[0100] In this embodiment, after the module 10 is rotated 90° by the rotator, the clamping members 214 on both sides of the first direction on the stand 213 can simultaneously clamp the PCB assemblies 20 on both sides of the module 10, thereby further improving the work efficiency.

[0101] In application, the clamping assembly 210 may further include: a connecting surface 215; a guide 216 disposed on the frame 213; the connecting surface 215 being slidably disposed on the guide 216 and fixedly connected to the clamping assembly 214; and the output end of the second driver 212 being connected to the connecting surface 215. The guide 216 may be a guide rail.

[0102] The second driver 212 is connected to the clamping member 214 via the connecting surface 215. This avoids the output end of the second driver 212 being directly connected to the clamping member 214, which would cause the vibration generated by the output end of the second driver 212 to be directly transmitted to the clamping member 214 during the clamping process, thus affecting the stability of the clamping. In other words, the connecting surface 215 can disperse the vibration of the output end of the second driver 212, avoiding the point-to-surface contact connection between the output end of the second driver 212 and the clamping member 214, which would cause instability in the clamping of the clamping member 214.

[0103] Furthermore, the connecting surface 215 and the clamping member 214 are arranged parallel to each other and can be connected by a sliding module, thereby allowing the distance between them to be adjusted. A reinforcing member can be connected between the connecting surface 215 and the clamping member 214 to increase the connection strength and ensure the clamping force.

[0104] In other embodiments, please refer to Figures 8 to 10 The carrier assembly 110 includes: a platform 111 and a pressure plate 112; the module 10 is placed on the platform 111; the pressure plate 112 is slidably disposed on the platform 111 and is used to press the PCB assembly 20 on the module 10.

[0105] The stage 111 has a cavity in the middle for mounting the module 10 into the slot; the pressure plate 112 cooperates with the stage 111 to clamp and fix the module 10. The PCB assembly 20 can be pre-attached to the module 10 placed in the slot.

[0106] Meanwhile, the pressure plate 112 may be provided with a through hole 114 so that the riveting part 121 can pass through the through hole 114 to perform a riveting pre-fixing operation on the PCB assembly 20.

[0107] For further improvements, please refer to Figures 8 to 11The PCB assembly soldering system may also include: a clamping mechanism 400; the clamping mechanism 400 includes: a third driver 410, a fourth driver 420 and a clamp 430; the pressure plate 112 is slidably disposed in a direction parallel to the end face of the PCB assembly 20; the third driver 410 is driven to connect to the clamp 430, and is used to drive the clamp 430 to slide in a direction perpendicular to the end face of the PCB assembly 20 to abut against or move away from the pressure plate 112; the fourth driver 420 is driven to connect to the clamp 430, and is used to drive the clamp 430 to slide in a direction parallel to the end face of the PCB assembly 20 to push the pressure plate 112 to slide until the pin 21 of the PCB assembly 20 is exposed.

[0108] Specifically, the clamping mechanism 400 can be fixed to one or both sides of the conveyor line 300 along the second direction, and includes a clamping platform 440; the clamping platform 440 is located beside the conveyor line 300 and between the pre-connected assembly 120 and the welding mechanism 200 in the first direction.

[0109] At the location of the clamping assembly 400, the direction parallel to the end face of the PCB assembly 20 is the first direction, and the direction perpendicular to the end face of the PCB assembly 20 is the second direction. Therefore, the third driver 410 can drive the clamp 430 to move along the second direction, and the fourth driver 420 can drive the clamp 430 to move along the first direction.

[0110] The third driver 410 is disposed on the clamping platform 440. The clamping platform 440 is provided with an opening clamping plate 450 that is movable in the second direction; the fourth driver 420 and the clamp are disposed on the opening clamping plate 450, and the clamp is movably connected to the opening clamping plate 450 in the first direction.

[0111] After the module 10 and PCB assembly 20 are pre-fixed on the carrier assembly 110, the conveyor line 300 transports the carrier assembly 110 to the corresponding position of the clamping mechanism 400. Then, the third driver 430 drives the clamping plate 450 to move along the second direction, so that the clamp 430 moves to the position of abutting the pressure plate 112. The fourth driver 420 is activated to move and push the pressure plate 112 along the first direction, so that the pin 21 of the PCB assembly 20 is exposed.

[0112] The platform 111 may be equipped with a slide rail 115; the pressure plate 112 is slidably mounted on the slide rail 115; the bottom of the pressure plate 112 may be connected to a card holder 113, which extends outward in a direction perpendicular to the PCB assembly 20, and the clip 430 abuts against the pressure plate 112 through the card holder 113; that is, the card holder 113 facilitates the contact between the pressure plate 112 and the clip 340. The clip 430 may be L-shaped, abutting against the bottom and side of the card holder 113 when pushing it, which can improve the stability of the pressure plate 112 after it is pushed.

[0113] As a further improvement, there can be at least two pressure plates 112; and at least two pressure plates 112 are respectively pressed onto the PCB assembly 20 at positions corresponding to those on the PCB assembly 20. Correspondingly, there can be two fourth drivers 420 and two clips 430 on the opening clamp 450. The opening clamp stage 440 is connected to a displacement component that can adjust the position of the opening clamp stage 440 along a first direction, so that the positions of the two clips 430 correspond to the positions of the two pressure plates 112. The two fourth drivers 420 are arranged facing each other. When the two drivers 420 are activated, they can respectively drive the two clips 430 to move away from each other in opposite directions along the first direction, thereby pushing the two pressure plates 112 to slide towards each other along the first direction to expose the PCB assembly 20.

[0114] The second aspect of this application provides a PCB assembly soldering method, including the following steps:

[0115] S10. Attach the PCB assembly 20 to the side of the module 10.

[0116] The PCB assembly 20 can be applied to the module 10 manually or automatically. Furthermore, depending on the specific needs, the PCB assembly 20 can be applied to one or both sides of the module 10.

[0117] S11. Transfer module 10 to carrier assembly 110 on conveyor line 300 and place PCB assembly 20 on the side end of module 10 in the second direction.

[0118] S20, Pre-connect PCB assembly 20 to module 10 via pre-connection assembly 120.

[0119] The pre-connected component 120 is located on one or both sides of the conveyor line 300 along the second direction.

[0120] Specifically, after the conveyor line 300 conveys the carrier assembly 110 to the corresponding position of the pre-connected assembly 120, the above step S20 includes the following steps:

[0121] S21, Vision component 127 acquires pre-fixed points on PCB component 20 and transmits them to the controller;

[0122] S22. The controller calculates the riveting position of the riveting part 121 and the pre-fixed point based on the pre-fixed point.

[0123] S23. The riveting part 121 is moved to the riveting station by the cooperation of the moving part 122 and / or the second moving part 125 and / or the third moving part 126.

[0124] S24, the riveting part 121 performs a riveting pre-fixing operation on the PCB assembly 20.

[0125] After the riveting pre-fixing operation, the PCB assembly 20 and the module 10 are fixedly connected by riveting; then the conveyor line 300 continues to convey the carrier assembly 110 and performs the following steps:

[0126] S31, the conveyor line 300 transports the carrier assembly 110 to the corresponding station of the clamping mechanism 400;

[0127] S32, the clamping mechanism 400 drives the clamp 430 to abut against the pressure plate 112 through the cooperation of the third driver 410 and / or the displacement component;

[0128] S33, the fourth driver 420 drives the clip 430 to push the pressure plate 112 to move, so that the pin 21 on the PCB assembly 20 is exposed;

[0129] Then, conveyor line 300 transports carrier assembly 110 to the corresponding station of welding mechanism 200 for the following steps:

[0130] S40, the pins 21 of the PCB assembly 20 are pressed by the clamping component 210.

[0131] Step S40 may include the following steps:

[0132] S41. The carrier assembly 110 is moved along the second direction by the first driver 211, so that the copper nozzle 217 on the clamping member 214 is aligned with the pin 21 of the PCB assembly 20 on the carrier assembly 110.

[0133] S42, The second driver 212 drives the clamping member 214 to clamp the pin 21.

[0134] Then, step S50 can be performed, where the welding assembly 220 welds the pins 21 and then unloads the material after welding.

[0135] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although this application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A PCB assembly soldering system, characterized in that, include: Pre-fixing mechanism (100), welding mechanism (200), conveyor line (300) and clamping mechanism (400); The pre-fixing mechanism (100) includes: a vehicle assembly (110) and a pre-connection assembly (120). The vehicle assembly (110) is used to carry the module (10). The pre-attached component (120) is used to pre-fix the PCB component (20) onto the module (10); The welding mechanism (200) includes: a clamping assembly (210) and a welding assembly (220); The clamping assembly (210) is used to clamp the pins (21) of the PCB assembly (20). The welding assembly (220) is used to weld the pin (21); The conveyor line (300) is used to convey the vehicle assembly (110) along a first direction; The pre-attached component (120) is disposed on one or both sides of the conveyor line (300) along the second direction, and is used to pre-fix the PCB assembly (20); The first direction is perpendicular to the second direction; The vehicle assembly (110) includes: a platform (111) and a pressure plate (112). The module (10) is placed on the platform (111); The pressure plate (112) is slidably disposed on the platform (111) for pressing the PCB assembly (20) on the module (10). The clamping mechanism (400) is disposed on one or both sides of the conveyor line (300) along the second direction, and the clamping mechanism (400) is located between the pre-connection assembly (120) and the welding mechanism (200) along the first direction; The clamping mechanism (400) includes: a third driver (410), a fourth driver (420), and a clamp (430). The pressure plate (112) is slidably disposed in a direction parallel to the end face of the PCB assembly (20); The third driver (410) is connected to the clip (430) and is used to drive the clip (430) to slide in a direction perpendicular to the end face of the PCB assembly (20) to abut against or move away from the pressure plate (112). The fourth driver (420) is connected to the clip (430) and is used to drive the clip (430) to slide in a direction parallel to the end face of the PCB assembly (20) to push the pressure plate (112) to slide to expose the pin (21) of the PCB assembly (20).

2. The PCB assembly soldering system according to claim 1, characterized in that, The pre-connected assembly (120) includes: a riveting part (121) and a moving part (122); The riveting part (121) is used to rivet the PCB assembly (20) and the module (10). The moving part (122) is connected to the riveting part (121) for driving the riveting part (121) to move along the second direction.

3. The PCB assembly soldering system according to claim 1, characterized in that, The welding mechanism (200) includes several components; Several of the welding mechanisms (200) are arranged sequentially along the first direction; The welding assembly (220) is disposed on the conveyor line (300); The clamping assembly (210) is disposed on one or both sides of the welding assembly (220) along the second direction.

4. The PCB assembly soldering system according to claim 3, characterized in that, The clamping assembly (210) includes: a first driver (211), a second driver (212), a stand (213), and a clamping member (214). The stand (213) is connected to the conveyor line (300); The first driver (211) is disposed on the platform (213) for driving the vehicle assembly (110) to move along the second direction on the platform (213); The clamping member (214) is slidably mounted on the platform (213); The second driver (212) is used to drive the clamping member (214) to slide and press against or move away from the pin (21) of the PCB assembly (20).

5. The PCB assembly soldering system according to claim 4, characterized in that, A rotator is provided on the vehicle assembly (110); The rotator is used to drive the module (10) to rotate horizontally so that the module (10) rotates to a first direction in which the PCB assembly (20) is located; The clamping member (214) is located on one or both sides of the platform (213) along the first direction; The second driver (212) is used to drive the clamping member (214) to slide along the first direction.

6. The PCB assembly soldering system according to claim 4, characterized in that, The clamping assembly (210) further includes: a connecting surface (215); The platform (213) is provided with a guide (216); The connecting surface (215) is slidably disposed on the guide (216) and fixedly connected to the clamping member (214). The output of the second driver (212) is connected to the connection surface (215).

7. A PCB assembly soldering method, characterized in that, Performed based on the PCB assembly soldering system according to any one of claims 1 to 6, and including the following steps: The PCB assembly (20) is attached to the side of the module (10); The PCB assembly (20) is pre-connected to the module (10) via the pre-connection component (120); The pins (21) of the PCB assembly (20) are pressed by the clamping assembly (210). The pin (21) is soldered using a soldering assembly (220).

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