Semiconductor temperature control system and semiconductor temperature control method

Abstract

This invention relates to the field of semiconductor technology, providing a semiconductor temperature control system and method. The semiconductor temperature control system includes a main pipeline, a heat exchanger, and a filter branch. The semiconductor temperature control method includes: acquiring the outlet temperature value of the main pipeline; determining that the outlet temperature value is greater than or equal to a first preset temperature value, and controlling the semiconductor temperature control system to switch to a first temperature control mode. In the first temperature control mode, the outlet end of the heat exchanger and the inlet end of the filter branch are connected to cool the filter branch; or, determining that the outlet temperature value is less than the first preset temperature value, and controlling the semiconductor temperature control system to switch to a second temperature control mode. In the second temperature control mode, the connection between the outlet end of the heat exchanger and the inlet end of the filter branch is disconnected. This invention provides a semiconductor temperature control system and method that, by introducing cooled liquid into the filter branch, ensures the resin's operating temperature, increases the resin's service life, reduces replacement frequency, and lowers costs.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a semiconductor temperature control system and a semiconductor temperature control method. Background Technology

[0002] In the etching process of semiconductor manufacturing, auxiliary equipment is required to provide a precise working temperature for the etching temperature control chamber. The process has strict requirements for cleanliness and electrical insulation, which inevitably requires the coolant used in the temperature control equipment to have extremely high purity.

[0003] In existing technologies, when deionized water or ethylene glycol is used as a refrigerant, it is prone to chemical reactions with the metal materials in the pipeline, thereby generating anions and cations that can affect the etching process. Existing technologies typically employ a parallel filter branch on the main pipeline of the equipment, using a filter cartridge with a built-in mixed-bed ion exchange resin to continuously adsorb the anions and cations in the refrigerant, thus maintaining a high water resistance value.

[0004] However, in the existing technology, the upper limit of the operating temperature of the basic ion exchange resin (OH-) in the mixed bed ion exchange resin is 60°C. When the operating temperature of the system exceeds 60°C, the basic ion exchange resin will quickly lose its activity, which will require frequent replacement of the mixed bed ion exchange resin, increasing the cost of using the mixed bed ion exchange resin and wasting a lot of labor. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical defects mentioned above. To this end, the present invention provides a semiconductor temperature control system and a semiconductor temperature control method, which directly introduces the cooled refrigerant from the heat exchanger into the filtration branch to ensure the resin's operating temperature, increase the resin's service life, reduce replacement frequency, and lower costs.

[0006] The first aspect of the present invention provides a semiconductor temperature control system.

[0007] A second aspect of the present invention provides a semiconductor temperature control method.

[0008] The first aspect of the present invention provides a semiconductor temperature control system, comprising:

[0009] The main pipeline includes a water pump, a first temperature sensor, a heater, and a second temperature sensor connected in sequence. The water pump is used to control the flow direction of the refrigerant in the main pipeline. The first temperature sensor is used to monitor the temperature of the refrigerant at the inlet of the heater. The heater is used to regulate the temperature of the refrigerant. The second temperature sensor is used to monitor the temperature of the refrigerant at the outlet of the main pipeline.

[0010] A heat exchanger, wherein the inlet end of the heat exchanger is connected to the outlet end of the water pump, and the outlet end of the heat exchanger is connected to the inlet end of the heater, and the heat exchanger is used to regulate the temperature of the refrigerant;

[0011] A filtration branch is provided, the inlet end of which is connected to the outlet end of the heat exchanger and the outlet end of the heater, the outlet end of which is connected to the inlet end of the main pipeline, and the filtration branch is provided with a filter container for holding mixed bed anion and cation exchange resins.

[0012] According to a semiconductor temperature control system provided by the present invention, the main pipeline further includes a first electric three-way valve, the inlet end of the first electric three-way valve being connected to the outlet end of the water pump, the first outlet end of the first electric three-way valve being connected to the inlet end of the heat exchanger, and the second outlet end of the first electric three-way valve being connected to the inlet end of the heater. The first electric three-way valve can be used to regulate the flow rate of the refrigerant entering the heat exchanger and the heater from the outlet end of the water pump.

[0013] According to a semiconductor temperature control system provided by the present invention, the main pipeline further includes a second electric three-way valve, the inlet end of the second electric three-way valve being connected to the outlet end of the heat exchanger, the first outlet end of the second electric three-way valve being connected to the inlet end of the filter branch, and the second outlet end of the second electric three-way valve being connected to the inlet end of the heater; the second electric three-way valve is used to regulate the flow rate of the refrigerant entering the filter branch and the heater from the heat exchanger.

[0014] According to a semiconductor temperature control system provided by the present invention, the filtration branch further includes an electrically operated two-way valve, the inlet end of which is connected to the outlet end of the heater, and the outlet end of which is connected to the inlet end of the filtration branch. The electrically operated two-way valve is used to regulate the flow rate of the refrigerant entering the filtration branch from the outlet end of the heater.

[0015] According to a semiconductor temperature control system provided by the present invention, the filtration branch further includes a third electric three-way valve, the first inlet end of the third electric three-way valve being connected to the outlet end of the electric two-way valve, the second inlet end of the third electric three-way valve being connected to the outlet end of the main pipeline, and the outlet end of the third electric three-way valve being connected to the inlet end of the filter container. The third electric three-way valve is used to control the flow rate of the refrigerant entering the filter container.

[0016] According to a semiconductor temperature control system provided by the present invention, a third temperature sensor and a flow meter are connected between the outlet end of the third electric three-way valve and the filter container. The third temperature sensor is used to monitor the temperature of the refrigerant at the inlet end of the filter container, and the flow meter is used to monitor the flow rate of the refrigerant at the inlet end of the filter container.

[0017] A second aspect of the present invention provides a semiconductor temperature control method, applied to the semiconductor temperature control system described in any of the foregoing embodiments, comprising the following steps:

[0018] Obtain the outlet temperature value of the main pipeline;

[0019] If the outlet temperature value is determined to be greater than or equal to a first preset temperature value, the semiconductor temperature control system is controlled to switch to a first temperature control mode. In the first temperature control mode, the heat exchanger outlet end and the filter branch inlet end are connected to cool the filter branch. The heater outlet end is connected to the filter branch inlet end.

[0020] or,

[0021] If the outlet temperature value is determined to be less than the first preset temperature value, the semiconductor temperature control system is controlled to switch to the second temperature control mode. In the second temperature control mode, the connection between the heat exchanger outlet and the filter branch inlet is disconnected, and the heater outlet is connected to the filter branch inlet.

[0022] According to a semiconductor temperature control method provided by the present invention, the first temperature control mode further includes: disconnecting the connection between the inlet end of the filter branch and the outlet end of the heater.

[0023] According to a semiconductor temperature control method provided by the present invention, when a second electric three-way valve is provided in the semiconductor temperature control system, the first temperature control mode further includes:

[0024] The real-time flow rate value at the inlet of the filter container is subtracted from the first preset flow rate value to obtain the first real-time flow rate deviation. The opening degree of the second electric three-way valve is controlled in real time according to the first real-time flow rate deviation to cool down the filter branch.

[0025] According to a semiconductor temperature control method provided by the present invention, when a first electric three-way valve is provided in the semiconductor temperature control system, the first temperature control mode further includes:

[0026] The real-time temperature value at the heater inlet is subtracted from the second preset temperature value to obtain the first real-time temperature deviation. The opening degree of the first electric three-way valve is controlled in real time according to the first real-time temperature deviation to control the flow rate of the refrigerant entering the heat exchanger and the heater.

[0027] According to a semiconductor temperature control method provided by the present invention, when a third electric three-way valve is provided in the semiconductor temperature control system, the first temperature control mode further includes:

[0028] The real-time temperature value at the inlet of the filter container is subtracted from the third preset temperature value to obtain the second real-time temperature deviation. The opening degree of the third electric three-way valve is controlled in real time according to the second real-time temperature deviation to control the flow rate of the refrigerant entering the filter container.

[0029] According to a semiconductor temperature control method provided by the present invention, when the semiconductor temperature control system is equipped with an electrically operated two-way valve, a second electrically operated three-way valve, and a third electrically operated three-way valve, the second temperature control mode includes:

[0030] Disconnect the connection between the first outlet end of the second electric three-way valve and the inlet end of the filter branch;

[0031] Disconnect the connection between the second inlet end of the third electric three-way valve and the outlet end of the main pipeline;

[0032] The real-time flow rate at the inlet of the filter container is subtracted from the second preset flow rate to obtain the second real-time flow rate deviation. The opening degree of the electric two-way valve is controlled in real time according to the second real-time flow rate deviation to control the flow rate of the refrigerant entering the filter container.

[0033] In a semiconductor temperature control system provided in this embodiment of the invention, by partially connecting the filter branch in parallel with the main pipeline, the refrigerant in the main pipeline can be introduced into a filter container containing a mixed-bed anion and cation exchange resin. The mixed-bed anion and cation exchange resin can continuously adsorb the anions and cations in the refrigerant, maintaining the high water resistance value of the refrigerant. In the first temperature control mode, the refrigerant cooled by the heat exchanger is introduced into the filter branch, which can cool the filter branch and ensure that the mixed-bed anion and cation exchange resin in the filter container in the filter branch is at a suitable temperature, thereby extending the life of the mixed-bed anion and cation exchange resin, reducing the replacement frequency of the mixed-bed anion and cation exchange resin, reducing its usage cost, and improving economic efficiency.

[0034] Meanwhile, since the refrigerant is directly introduced into the filtration branch from the heat exchanger outlet, the temperature control methods for the main pipeline and the filtration branch can be distinguished by regulating the flow rate of the refrigerant entering the filtration branch from the heater or heat exchanger. This avoids conflicts between the temperature requirements of the main pipeline and the filtration branch. In the second temperature control mode, where only the refrigerant passing through the heater enters the filtration branch, the power of the heat exchanger and heater can be adjusted solely based on the temperature requirements of the main pipeline, saving energy and costs associated with the semiconductor temperature control system.

[0035] Compared to existing technologies, the semiconductor temperature control system provided in this invention connects the inlet of the filter branch to the outlet of the heater and the outlet of the heat exchanger, enabling precise control of the refrigerant temperature in the filter branch. This provides a suitable operating temperature for the mixed-bed ion exchange resin, reduces the cost of using the mixed-bed ion exchange resin, and saves labor. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the semiconductor temperature control system provided by the present invention;

[0038] Figure 2 This is a schematic flowchart of the semiconductor temperature control method provided by the present invention.

[0039] Figure label:

[0040] 10. Main pipeline; 101. Water pump; 102. First electric three-way valve; 103. First temperature sensor; 104. Heater; 105. Second temperature sensor;

[0041] 20. Heat exchanger; 201. Second electric three-way valve;

[0042] 30. Filter branch; 301. Electric two-way valve; 302. Third electric three-way valve; 303. Third temperature sensor; 304. Flow meter; 305. Filter container. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0044] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0045] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0047] Figure 1 This is a schematic diagram of the semiconductor temperature control system provided by the present invention.

[0048] like Figure 1 As shown, the first aspect of the present invention provides a semiconductor temperature control system, including: a main pipeline 10, a heat exchanger 20, and a filter branch 30.

[0049] The main pipeline 10 includes a water pump 101, a first temperature sensor 103, a heater 104, and a second temperature sensor 105 connected in sequence.

[0050] The water pump 101 is used to control the flow direction of the refrigerant in the main pipeline 10. In other words, the water pump 101 provides power for the movement of the refrigerant in the main pipeline 10. By controlling the direction of the motor in the water pump 101, the flow direction of the refrigerant in the main pipeline 10 can be controlled. The water pump 101 can be a centrifugal pump, a reciprocating pump, a mixed flow pump, or an axial flow pump, etc. Specifically, the embodiments of the present invention are not specifically limited here.

[0051] The first temperature sensor 103 is used to monitor the temperature of the refrigerant at the inlet of the heater 104. In other words, the refrigerant entering the heater 104 needs to pass through the first temperature sensor 103 first. In this way, the first temperature sensor 103 can detect the temperature of the refrigerant at the inlet of the heater 104 in real time. The first temperature sensor 103 can be selected as a resistance temperature sensor or a thermocouple temperature sensor, and can be selected adaptively according to needs.

[0052] Heater 104 is used to regulate the temperature of the refrigerant. When it is necessary to increase the temperature of the refrigerant in the main pipeline 10, the power of heater 104 can be changed to achieve precise heating of the refrigerant. Heater 104 can be an electromagnetic heater, an infrared heater, or a resistance heater, etc., but the specific embodiment of the present invention is not limited thereto.

[0053] The second temperature sensor 105 is used to monitor the temperature of the refrigerant at the outlet of the main pipeline 10. In other words, the refrigerant passing through the main pipeline 10 needs to pass through the second temperature sensor 105 first, so the second temperature sensor 105 can monitor the temperature of the refrigerant at the outlet of the main pipeline 10 in real time. The second temperature sensor 105 is similar to the first temperature sensor 103, and can also be selected as a resistance temperature sensor or a thermocouple temperature sensor, which can be selected according to needs.

[0054] The heat exchanger 20 is partially connected in parallel with the main pipeline 10. Specifically, the inlet end of the heat exchanger 20 is connected to the outlet end of the water pump 101, and the outlet end of the heat exchanger 20 is connected to the inlet end of the heater 104. The heat exchanger 20 is used to regulate the temperature of the refrigerant.

[0055] In this embodiment of the invention, the heat exchanger 20 can be a partitioned heat exchanger, that is, the refrigerant in the main pipeline 10 is introduced into the heat exchanger 20, and the liquid that exchanges heat with it is also introduced into the heat exchanger 20, so that the refrigerant and the heat exchange liquid are separated by the wall of the heat exchanger 20 and flow in different spaces of the heat exchanger 20. Through the heat conduction of the wall of the heat exchanger 20 and the convection of the liquid on the wall surface, the heat exchange process between the refrigerant in the main pipeline 10 and the heat exchange liquid can be realized, thereby controlling the temperature of the refrigerant in the main pipeline 10. It should be noted that the heat exchanger 20 can cool down or heat up the refrigerant in the main pipeline 10, specifically by changing the temperature of the heat exchange liquid, which will not be elaborated in this embodiment of the invention.

[0056] In this configuration, the filter branch 30 is partially connected in parallel with the main branch 10. The inlet end of the filter branch 30 is connected to the outlet end of the heat exchanger 20 and the outlet end of the heater 104. It should be noted that the inlet end of the filter branch 30 is conductive to both the outlet end of the heat exchanger 20 and the outlet end of the heater 104. The conductivity between the inlet end of the filter branch 30 and the outlet end of the heat exchanger 20 can be adaptively disconnected as needed, as can the conductivity between the inlet end of the filter branch 30 and the outlet end of the heater 104. Specifically, the appropriate selection can be made according to actual needs.

[0057] The outlet end of the filter branch 30 is connected to the inlet end of the main pipeline 10. The filter branch 30 is equipped with a filter container 305 for holding mixed bed anion and cation exchange resin. The filter branch 30 can introduce the refrigerant in the main pipeline 10 into the filter branch 30 to achieve continuous control of the anions and cations in the refrigerant.

[0058] It is understood that in the semiconductor temperature control system provided in this embodiment of the invention, by partially connecting the filter branch 30 in parallel with the main pipeline 10, the refrigerant in the main pipeline 10 can be introduced into the filter container 305 containing mixed bed anion and cation exchange resin. The mixed bed anion and cation exchange resin can continuously adsorb the anions and cations in the refrigerant to maintain the high water resistance value of the refrigerant. By connecting the filter branch 30 to the heat exchanger 20 and the heater 104, the temperature and flow rate of the refrigerant in the filter branch 30 can be controlled by controlling the flow rate of the refrigerant entering the filter branch 30 from the heat exchanger 20 and the heater 104.

[0059] Compared to existing technologies, the semiconductor temperature control system provided in this embodiment of the invention can achieve precise control of the refrigerant temperature in the filter branch 30 by connecting the inlet end of the filter branch 30 with the outlet end of the heater 104 and the outlet end of the heat exchanger 20, so as to provide a suitable working temperature for the mixed bed exchange resin.

[0060] In an optional embodiment of the present invention, a first electric three-way valve 102 is connected between the outlet end of the water pump 101 and the inlet end of the heater 104. Specifically, the inlet end of the first electric three-way valve 102 is connected to the outlet end of the water pump 101, the first outlet end of the first electric three-way valve 102 is connected to the inlet end of the heat exchanger 20, and the second outlet end of the first electric three-way valve 102 is connected to the inlet end of the heater 104. The first electric three-way valve 102 can be used to regulate the flow rate of the refrigerant entering the heat exchanger 20 and the heater 104 from the outlet end of the water pump 101. In other words, the refrigerant entering the heat exchanger 20 and the heater 104 needs to pass through the first electric three-way valve 102 first. By adjusting the opening degree of the first electric three-way valve 102, the flow rate of the refrigerant flowing into the heat exchanger 20 or the heater 104 can be controlled.

[0061] In an optional embodiment of the present invention, the first electric three-way valve 102 can also be replaced by two electric two-way valves. That is, the outlet end of the water pump 101 is connected to the inlet end of the two electric two-way valves, and the outlet end of the two electric two-way valves is connected to the inlet end of the heat exchanger 20 and the inlet end of the heater 104, respectively. The flow rate of the refrigerant entering the heater 104 and the heat exchanger 20 is controlled by the two electric two-way valves, so as to achieve the same technical effect as the first electric three-way valve 102.

[0062] In an optional embodiment provided by the present invention, a second electric three-way valve 201 is connected between the outlet end of the heat exchanger 20 and the inlet end of the heater 104. Specifically, the inlet end of the second electric three-way valve 201 is connected to the outlet end of the heat exchanger 20, the first outlet end of the second electric three-way valve 201 is connected to the inlet end of the filter branch 30, and the second outlet end of the second electric three-way valve 201 is connected to the inlet end of the heater 104. The second electric three-way valve 201 is used to regulate the flow rate of the refrigerant entering the filter branch 30 and the heater 104 from the heat exchanger 20.

[0063] It should be noted that the connection between the outlet end of the heat exchanger 20 and the inlet end of the filter branch 30 can also be disconnected by the second electric three-way valve 201 to control the flow direction of the refrigerant passing through the heat exchanger 20. In other words, when it is necessary to cool down the mixed bed anion and cation exchange resin in the filter container 305 in the filter branch 30, the connection between the heat exchanger 20 and the filter branch 30 can be opened by the second electric three-way valve 201 to directly introduce the refrigerant in the heat exchanger 20 into the filter branch 30 to achieve cooling of the filter branch 30.

[0064] Similar to the first electric three-way valve 102, the second electric three-way valve 201 can also be replaced by two electric two-way valves. That is, the outlet end of the heat exchanger 20 is connected to the inlet end of the two electric two-way valves, and the outlet end of the two electric two-way valves is connected to the inlet end of the filter branch 30 and the inlet end of the heater 104, respectively, so as to control the flow rate of the refrigerant flowing out of the heat exchanger 20 into the filter branch 30 or the heater 104. It should be noted that the electric two-way valve connected to the filter branch 30 can disconnect the connection between the filter branch 30 and the heat exchanger 20 for adaptive adjustment according to actual needs.

[0065] In an optional embodiment of the present invention, an electrically operated two-way valve 301 is connected between the outlet end of the heater 104 and the inlet end of the filter branch 30. Specifically, the inlet end of the electrically operated two-way valve 301 is connected to the outlet end of the heater 104, and the outlet end of the electrically operated two-way valve 301 is connected to the inlet end of the filter branch 30. The electrically operated two-way valve 301 is used to regulate the flow rate of the refrigerant entering the filter branch 30 from the outlet end of the heater 104. When the working temperature of the mixed bed anion and cation exchange resin in the filter container 305 in the filter branch 30 needs to be increased, the heated refrigerant in the heater 104 can be introduced into the filter branch 30 through the electrically operated two-way valve 301 to achieve temperature control of the filter branch 30. When rapid cooling of the filter branch 30 is required, the connection between the outlet end of the heater 104 and the inlet end of the filter branch 30 can be disconnected through the electrically operated two-way valve 301 to prevent the refrigerant flowing out of the outlet end of the heater 104 from affecting the cooling process of the filter branch 30.

[0066] In an optional embodiment of the present invention, a third electric three-way valve 302 is connected between the inlet end of the filter branch 30 and the inlet end of the filter container 305. Specifically, the first inlet end of the third electric three-way valve 302 is connected to the outlet end of the electric two-way valve 301, the second inlet end of the third electric three-way valve 302 is connected to the outlet end of the main pipeline 10, and the outlet end of the third electric three-way valve 302 is connected to the inlet end of the filter container 305. The third electric three-way valve 302 is used to control the flow rate of the refrigerant entering the filter container 305.

[0067] The third electric three-way valve 302 can control the flow rate of refrigerant entering the filter branch 30 from the heat exchanger 20 or heater 104. In other words, when the filter branch 30 needs to be cooled, the flow rate of refrigerant entering the filter branch 30 from the heat exchanger 20 can be increased, and the flow rate of refrigerant entering the filter branch 30 from the heater 104 can be decreased. When the filter branch 30 needs to be heated, the flow rate of refrigerant entering the filter branch 30 from the heat exchanger 20 can be decreased, and the flow rate of refrigerant entering the filter branch 30 from the heater 104 can be increased. In this way, the third electric three-way valve 302 can further precisely control the flow rate and temperature of the refrigerant entering the filter branch 30 based on the second electric three-way valve 201 and the electric two-way valve 301.

[0068] The third electric three-way valve 302 is similar to the first electric three-way valve 102 and the second electric three-way valve 201. It can also be replaced by two electric two-way valves. Specifically, refer to the first electric three-way valve 102 and the second electric three-way valve 201 mentioned above. This embodiment will not be described again here.

[0069] In an optional embodiment of the present invention, a third temperature sensor 303 and a flow meter 304 are connected between the outlet end of the third electric three-way valve 302 and the filter container 305. The third temperature sensor 303 is used to monitor the temperature of the refrigerant at the inlet end of the filter container 305, and the flow meter 304 is used to monitor the flow rate of the refrigerant at the inlet end of the filter container 305.

[0070] Figure 2 This is a schematic flowchart of the semiconductor temperature control method provided by the present invention.

[0071] Reference Figure 2 The second aspect of the present invention provides a semiconductor temperature control method, applied to the semiconductor temperature control system of any of the foregoing embodiments, comprising the following steps:

[0072] The first step is to obtain the outlet temperature value of the main pipeline 10;

[0073] Specifically, the temperature of the refrigerant at the outlet of the main pipeline 10 can be monitored in real time by a second temperature sensor 105 located at the outlet of the main pipeline 10.

[0074] Step Two:

[0075] If the outlet temperature value is determined to be greater than or equal to the first preset temperature value, the semiconductor temperature control system is controlled to switch to the first temperature control mode. In the first temperature control mode, the outlet end of the heat exchanger 20 and the inlet end of the filter branch 30 are connected to cool the filter branch 30. The outlet end of the heater 104 is connected to the inlet end of the filter branch 30.

[0076] or,

[0077] If the outlet temperature is determined to be less than the first preset temperature value, the semiconductor temperature control system is switched to the second temperature control mode. In the second temperature control mode, the connection between the outlet end of the heat exchanger 20 and the inlet end of the filter branch 30 is disconnected, and the outlet end of the heater 104 is connected to the inlet end of the filter branch 30.

[0078] It should be noted that the selectable range of the first preset temperature value is 50-70 degrees Celsius. For example, 50℃, 60℃ or 70℃ can be selected as the first preset temperature value. The magnitude of the first preset temperature value is affected by environmental factors and needs to be adapted according to the actual situation. In this embodiment of the invention, 60℃ is used as a specific example of the first preset temperature value.

[0079] When the temperature value monitored by the second temperature sensor 105 is not less than 60°C, the outlet end of the heat exchanger 20 and the inlet end of the filter branch 30 are connected by the second electric three-way valve 201. The refrigerant cooled by the heat exchanger 20 is introduced into the filter branch 30, which can cool the filter branch 30. This ensures that the mixed bed anion and cation exchange resin in the filter container 305 in the filter branch 30 is at a suitable temperature, thereby extending the life of the mixed bed anion and cation exchange resin, reducing the replacement frequency of the mixed bed anion and cation exchange resin, reducing the cost of use, and improving economic efficiency.

[0080] Meanwhile, since the refrigerant is directly introduced into the filter branch 30 from the outlet end of the heat exchanger 20, the temperature control of the main pipeline 10 and the temperature control of the filter branch 30 can be distinguished by controlling the flow rate of the refrigerant from the heater 104 or the heat exchanger 20 into the filter branch 30, thereby avoiding the contradiction between the temperature requirements of the main pipeline 10 and the temperature requirements of the filter branch 30.

[0081] When the temperature detected by the second temperature sensor 105 is less than 60°C, the connection between the heat exchanger 20 and the filter branch 30 can be disconnected by the second electric three-way valve 201, that is, only the refrigerant passing through the heater 104 enters the filter branch 30. In this case, the power of the heat exchanger 20 and the heater 104 can be adjusted only according to the temperature requirements of the main pipeline 10, so as to save energy consumption of the semiconductor temperature control system and save costs.

[0082] Based on the above embodiments, the first temperature control mode further includes disconnecting the connection between the inlet end of the filter branch 30 and the outlet end of the heater 104. Specifically, the connection between the filter branch 30 and the heater 104 can be disconnected by the electric two-way valve 301, that is, the opening of the electric two-way valve 301 is closed, so that the refrigerant cannot enter the filter branch 30 through the electric two-way valve 301.

[0083] In this way, all the refrigerant entering the filter branch 30 is drawn from the outlet end of the heat exchanger 20, which can achieve the effect of rapid cooling of the filter branch 30, improve the cooling efficiency, and prevent the filter container 305 in the filter branch 30 from being in an unsuitable temperature environment for a long time.

[0084] In an optional embodiment of the present invention, when the semiconductor temperature control system is equipped with the second electric three-way valve 201, the first temperature control mode further includes:

[0085] The real-time flow rate at the inlet of the filter container 305 is subtracted from the first preset flow rate to obtain the first real-time flow rate deviation. The opening of the second electric three-way valve 201 is controlled in real time according to the first real-time flow rate deviation to cool down the filter branch 30.

[0086] Specifically, the flow rate of the refrigerant entering the filter container 305 can be monitored in real time by a flow meter 304 located at the inlet end of the filter container 305. The opening of the second electric three-way valve 201 can be adjusted in real time by the control module based on the first real-time flow deviation. When the first real-time flow deviation is negative, that is, when the flow rate of the refrigerant entering the filter container 305 is less than the first preset flow value, the opening of the second electric three-way valve 201 can be increased to increase the flow rate of the refrigerant entering the filter branch 30 to meet the refrigerant flow requirements of the filter branch 30. When the first real-time flow deviation is positive, the opening of the second electric three-way valve 201 can be decreased to decrease the flow rate of the refrigerant entering the filter branch 30 to meet the refrigerant flow requirements of the filter branch 30.

[0087] It should be noted that the size of the first preset flow rate can be adaptively selected according to the actual working conditions, and the embodiments of the present invention do not impose specific limitations here.

[0088] In an optional embodiment of the present invention, when the semiconductor temperature control system is equipped with the first electric three-way valve 102, the first temperature control mode further includes:

[0089] The real-time temperature value at the inlet of heater 104 is subtracted from the second preset temperature value to obtain the first real-time temperature deviation. The opening degree of the first electric three-way valve 102 is controlled in real time according to the first real-time temperature deviation to control the flow rate of refrigerant entering the heat exchanger 20 and heater 104.

[0090] Specifically, the control module can precisely adjust the opening of the first electric three-way valve 102 based on the real-time temperature value monitored by the first temperature sensor 103, i.e., the temperature value at the inlet of the heater 104. When the first real-time temperature deviation is negative, i.e., the refrigerant temperature at the inlet of the heater 104 is less than the second preset temperature value, the flow rate of the refrigerant entering the heat exchanger 20 can be reduced by the first electric three-way valve 102, and the flow rate of the refrigerant directly entering the heater 104 can be increased, thereby increasing the real-time temperature of the refrigerant entering the heater 104. When the first real-time temperature deviation is positive, i.e., the refrigerant temperature at the inlet of the heater 104 is higher than the first preset temperature value, the flow rate of the refrigerant entering the heat exchanger 20 can be increased by the first electric three-way valve 102, and the flow rate of the refrigerant directly entering the heater 104 can be reduced, thereby decreasing the flow rate of the refrigerant entering the heater 104.

[0091] It should be noted that the value of the second temperature preset value is adaptively selected according to the actual working conditions, and the embodiments of the present invention do not impose specific limitations here.

[0092] In an optional embodiment of the present invention, when the semiconductor temperature control system is equipped with a third electric three-way valve 302, the first temperature control mode further includes:

[0093] The real-time temperature value at the inlet of the filter container 305 is subtracted from the third preset temperature value to obtain the second real-time temperature deviation. The opening degree of the third electric three-way valve 302 is controlled in real time according to the second real-time temperature deviation to control the flow rate of the refrigerant entering the filter container 305.

[0094] Specifically, the temperature of the refrigerant at the inlet of the filter container 305 can be monitored in real time by a third temperature sensor 303 located at the inlet of the filter container 305. The control module controls the opening of the third electric three-way valve 302 based on the second real-time temperature deviation. When the second real-time temperature deviation is negative, that is, when the temperature of the refrigerant at the inlet of the filter container 305 is less than the third preset temperature value, the flow rate of the refrigerant entering the filter container 305 from the heater 104 can be increased and the flow rate of the refrigerant entering the filter container 305 from the heat exchanger 20 can be decreased through the third electric three-way valve 302, so as to raise the temperature of the refrigerant entering the filter container 305. When the second real-time temperature deviation is positive, that is, when the temperature of the refrigerant at the inlet of the filter container 305 is greater than the third preset temperature value, the flow rate of the refrigerant entering the filter container 305 from the heater 104 can be decreased and the flow rate of the refrigerant entering the filter container 305 from the heat exchanger 20 can be increased through the third electric three-way valve 302, so as to raise the temperature of the refrigerant entering the filter container 305.

[0095] It should be noted that the selectable range of the third preset temperature value is 50-70 degrees Celsius. For example, 50℃, 60℃ or 70℃ can be selected as the third preset temperature value. The magnitude of the third preset temperature value is affected by environmental factors and needs to be adapted according to the actual situation. In this embodiment of the invention, 60℃ is used as a specific example of the third preset temperature value.

[0096] In an optional embodiment of the present invention, in the first temperature control mode, the connection between the outlet end of the heater 104 and the inlet end of the filter branch 30 can be opened or closed by the electric two-way valve 301, and the connection between the filter branch 30 and the outlet end of the main pipeline 10 can be closed or opened by the third electric three-way valve 302. Specifically, the selection can be made according to actual needs. The specific control of the electric two-way valve 301 and the third electric three-way valve 302 can be referred to the above description, and the embodiments of the present invention will not be repeated here.

[0097] In an optional embodiment of the present invention, when the semiconductor temperature control system is equipped with an electrically operated two-way valve 301, a second electrically operated three-way valve 201, and a third electrically operated three-way valve 302, the second temperature control mode includes:

[0098] Disconnect the connection between the first outlet end of the second electric three-way valve 201 and the inlet end of the filter branch 30;

[0099] Disconnect the connection between the second inlet end of the third electric three-way valve 302 and the outlet end of the main pipeline 10;

[0100] The real-time flow rate at the inlet of the filter container 305 is subtracted from the second preset flow rate to obtain the second real-time flow rate deviation. The opening degree of the electric two-way valve 301 is controlled in real time according to the second real-time flow rate deviation to control the flow rate of the refrigerant entering the filter container 305.

[0101] It should be noted that the magnitude of the second preset flow rate value should be selected adaptively according to the actual working conditions, and the embodiments of the present invention do not impose specific limitations here.

[0102] A third aspect of the present invention provides a fault handling device for a semiconductor temperature control device, comprising:

[0103] The monitoring module can:

[0104] The temperature of the refrigerant at the inlet end of the heater 104 is monitored based on the first temperature sensor 103.

[0105] The temperature of the refrigerant at the outlet end of the main pipeline 10 is monitored based on the second temperature sensor 105.

[0106] The temperature of the refrigerant at the inlet of the filter container 305 is monitored based on the third temperature sensor 303.

[0107] The flow rate of the refrigerant at the inlet of the filter container 305 is monitored using flow meter 304.

[0108] The control module is used to control the operation of the semiconductor temperature control system based on the data provided by the monitoring module.

[0109] A fourth aspect of this invention provides an electronic device, which may include: a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other via the communication bus. The processor can invoke logical instructions from the memory to execute a semiconductor temperature control method, the method comprising:

[0110] Obtain the outlet temperature value of main pipeline 10;

[0111] If the outlet temperature value is determined to be greater than or equal to the first preset temperature value, the semiconductor temperature control system is controlled to switch to the first temperature control mode. In the first temperature control mode, the outlet end of the heat exchanger 20 and the inlet end of the filter branch 30 are connected to cool the filter branch 30. The outlet end of the heater 104 is connected to the inlet end of the filter branch 30.

[0112] or,

[0113] If the outlet temperature is determined to be less than the first preset temperature value, the semiconductor temperature control system is switched to the second temperature control mode. In the second temperature control mode, the connection between the outlet end of the heat exchanger 20 and the inlet end of the filter branch 30 is disconnected, and the outlet end of the heater 104 is connected to the inlet end of the filter branch 30.

[0114] The logical instructions in the aforementioned memory can be implemented as software functional units and sold or used as independent products, and can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0115] A fifth aspect of the present invention provides a non-transitory computer-readable storage medium, the non-transitory computer-readable storage medium including a computer program, which, when executed by a processor, implements the above-described semiconductor temperature control method, the method comprising:

[0116] Obtain the outlet temperature value of main pipeline 10;

[0117] If the outlet temperature value is determined to be greater than or equal to the first preset temperature value, the semiconductor temperature control system is controlled to switch to the first temperature control mode. In the first temperature control mode, the outlet end of the heat exchanger 20 and the inlet end of the filter branch 30 are connected to cool the filter branch 30. The outlet end of the heater 104 is connected to the inlet end of the filter branch 30.

[0118] or,

[0119] If the outlet temperature is determined to be less than the first preset temperature value, the semiconductor temperature control system is switched to the second temperature control mode. In the second temperature control mode, the connection between the outlet end of the heat exchanger 20 and the inlet end of the filter branch 30 is disconnected, and the outlet end of the heater 104 is connected to the inlet end of the filter branch 30.

[0120] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0121] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments or some parts of embodiments.

[0122] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor temperature control system, characterized in that, include: The main pipeline (10) includes a water pump (101), a first temperature sensor (103), a heater (104), and a second temperature sensor (105) connected in sequence. The water pump (101) is used to control the flow direction of the refrigerant in the main pipeline (10). The first temperature sensor (103) is used to monitor the temperature of the refrigerant at the inlet of the heater (104). The heater (104) is used to regulate the temperature of the refrigerant. The second temperature sensor (105) is used to monitor the temperature of the refrigerant at the outlet of the main pipeline (10). The heat exchanger (20) has its inlet end connected to the outlet end of the water pump (101) and its outlet end connected to the inlet end of the heater (104). The heat exchanger (20) is used to regulate the temperature of the refrigerant. The filter branch (30) has its inlet end connected to the outlet end of the heat exchanger (20) and the outlet end of the heater (104). The outlet end of the filter branch (30) is connected to the inlet end of the main pipeline (10). The filter branch (30) is provided with a filter container (305) for holding mixed bed anion and cation exchange resins. The main pipeline (10) also includes a second electric three-way valve (201); The inlet end of the second electric three-way valve (201) is connected to the outlet end of the heat exchanger (20), the first outlet end of the second electric three-way valve (201) is connected to the inlet end of the filter branch (30), and the second outlet end of the second electric three-way valve (201) is connected to the inlet end of the heater (104); the second electric three-way valve (201) is used to regulate the flow rate of the refrigerant entering the filter branch (30) and the heater (104) from the heat exchanger (20); The filter branch (30) also includes an electrically operated two-way valve (301); the inlet end of the electrically operated two-way valve (301) is connected to the outlet end of the heater (104), and the outlet end of the electrically operated two-way valve (301) is connected to the inlet end of the filter branch (30). The electrically operated two-way valve (301) is used to regulate the flow rate of the refrigerant entering the filter branch (30) from the outlet end of the heater (104).

2. The semiconductor temperature control system according to claim 1, characterized in that, The main pipeline (10) also includes a first electric three-way valve (102); The inlet end of the first electric three-way valve (102) is connected to the outlet end of the water pump (101), the first outlet end of the first electric three-way valve (102) is connected to the inlet end of the heat exchanger (20), and the second outlet end of the first electric three-way valve (102) is connected to the inlet end of the heater (104). The first electric three-way valve (102) can be used to regulate the flow rate of the refrigerant entering the heat exchanger (20) and the heater (104) from the outlet end of the water pump (101).

3. The semiconductor temperature control system according to claim 2, characterized in that, The filter branch (30) also includes a third electric three-way valve (302); The first inlet of the third electric three-way valve (302) is connected to the outlet of the electric two-way valve (301), the second inlet of the third electric three-way valve (302) is connected to the outlet of the main pipeline (10), and the outlet of the third electric three-way valve (302) is connected to the inlet of the filter container (305). The third electric three-way valve (302) is used to control the flow rate of the refrigerant entering the filter container (305).

4. The semiconductor temperature control system according to claim 3, characterized in that, A third temperature sensor (303) and a flow meter (304) are connected between the outlet end of the third electric three-way valve (302) and the filter container (305). The third temperature sensor (303) is used to monitor the temperature of the refrigerant at the inlet end of the filter container (305), and the flow meter (304) is used to monitor the flow rate of the refrigerant at the inlet end of the filter container (305).

5. A semiconductor temperature control method, applied to the semiconductor temperature control system according to any one of claims 1-4, characterized in that, Includes the following steps: Obtain the outlet temperature value of the main pipeline (10); If the outlet temperature value is determined to be greater than or equal to the first preset temperature value, the semiconductor temperature control system is controlled to switch to the first temperature control mode. In the first temperature control mode, the outlet end of the heat exchanger (20) and the inlet end of the filter branch (30) are connected to cool the filter branch (30). The outlet end of the heater (104) is disconnected from the inlet end of the filter branch (30). or, If the outlet temperature value is determined to be less than the first preset temperature value, the semiconductor temperature control system is controlled to switch to the second temperature control mode. In the second temperature control mode, the connection between the outlet end of the heat exchanger (20) and the inlet end of the filter branch (30) is disconnected, and the outlet end of the heater (104) is connected to the inlet end of the filter branch (30).

6. The semiconductor temperature control method according to claim 5, characterized in that, When the semiconductor temperature control system is equipped with the second electric three-way valve (201); the first temperature control mode further includes: The real-time flow rate value at the inlet of the filter container (305) is subtracted from the first preset flow rate value to obtain the first real-time flow rate deviation. The opening degree of the second electric three-way valve (201) is controlled in real time according to the first real-time flow rate deviation to cool down the filter branch (30).

7. The semiconductor temperature control method according to claim 6, characterized in that, When the semiconductor temperature control system is equipped with the first electric three-way valve (102); the first temperature control mode further includes: The real-time temperature value at the inlet of the heater (104) is compared with the second preset temperature value to obtain the first real-time temperature deviation. The opening degree of the first electric three-way valve (102) is controlled in real time according to the first real-time temperature deviation to control the flow rate of the refrigerant entering the heat exchanger (20) and the heater (104).

8. The semiconductor temperature control method according to any one of claims 5-7, characterized in that, When the semiconductor temperature control system is equipped with a third electric three-way valve (302), the first temperature control mode further includes: The real-time temperature value at the inlet of the filter container (305) is compared with the third preset temperature value to obtain the second real-time temperature deviation. The opening degree of the third electric three-way valve (302) is controlled in real time according to the second real-time temperature deviation to control the flow rate of the refrigerant entering the filter container (305).

9. The semiconductor temperature control method according to claim 5, characterized in that, When the semiconductor temperature control system is equipped with an electrically operated two-way valve (301), a second electrically operated three-way valve (201), and a third electrically operated three-way valve (302), the second temperature control mode includes: Disconnect the connection between the first outlet end of the second electric three-way valve (201) and the inlet end of the filter branch (30); Disconnect the connection between the second inlet end of the third electric three-way valve (302) and the outlet end of the main pipeline (10); The real-time flow rate at the inlet of the filter container (305) is subtracted from the second preset flow rate to obtain the second real-time flow rate deviation. The opening degree of the electric two-way valve (301) is controlled in real time according to the second real-time flow rate deviation to control the flow rate of the refrigerant entering the filter container (305).

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