Photosensitive component, mounting method of photosensitive chip, camera module and electronic equipment

Abstract

The present application provides a photosensitive component, a mounting method of a photosensitive chip, a camera module and an electronic device, which are used to solve the problem of inconsistency between the field curvature of the lens and the field curvature of the photosensitive chip in the camera module. The photosensitive component includes a substrate, a first bonding portion and a photosensitive chip, and the substrate includes a first surface. The first bonding portion is stacked on the first surface, and the first bonding portion includes a third surface and a fourth surface that are arranged opposite to each other. The third surface faces the substrate, and the first bonding portion is provided with a plurality of hollow portions that penetrate from the third surface to the fourth surface, and the plurality of hollow portions are arranged at intervals. The photosensitive chip is stacked on the fourth surface, and the photosensitive chip is connected to the substrate through the first bonding portion.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a photosensitive component, a mounting method of a photosensitive chip, a camera module and an electronic device. Background Art

[0002] At present, electronic devices such as mobile phones, tablet computers, cameras, camcorders, smart glasses, etc. all have camera modules for taking photos or videos. However, the field curvature of the lens in the camera module and the field curvature of the photosensitive chip often do not match, resulting in the resolution of the camera module not meeting the specification requirements or causing blurry photos. Summary of the invention

[0003] The embodiments of the present application provide a photosensitive component, a method for mounting a photosensitive chip, a camera module and an electronic device, which are used to solve the problem of inconsistency between the field curvature of the lens in the camera module and the field curvature of the photosensitive chip.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, the present application provides a photosensitive component, which includes a substrate, a first adhesive portion and a photosensitive chip, wherein the substrate includes a first surface. The first adhesive portion is stacked on the first surface, and the first adhesive portion includes a third surface and a fourth surface that are arranged opposite to each other, and the third surface faces the substrate, and the first adhesive portion is provided with a plurality of hollow portions that penetrate from the third surface to the fourth surface, and the plurality of hollow portions are arranged at intervals. The photosensitive chip is stacked on the fourth surface, and the photosensitive chip is connected to the substrate through the first adhesive portion.

[0006] The first bonding part has a plurality of hollow parts, which can provide space for the expansion and contraction of the first bonding part. That is to say, after the photosensitive component is baked and cooled, the deformation of the first bonding part with the hollow parts is smaller, and the deformation of the first bonding part involves less deformation of the photosensitive chip. Because the volume of the first bonding part is smaller than that of the part without the hollow parts, after being heated and cooled with the same temperature rise, the cohesion and internal stress of the first hollow part are smaller, and the released internal stress and cohesion are not enough to cause the photosensitive chip to bend and deform. In other words, the first bonding part has a smaller volume after removing the hollow parts, and the deformation produced under unit temperature rise heating and cooling is also smaller. Therefore, the deformation of the first bonding part involves less deformation of the photosensitive chip, so as to ensure that the photosensitive chip does not deform after baking.

[0007] Furthermore, after the photosensitive component is heated and cooled during baking, the deformation of the first bonding portion can expand toward the hollow portion, that is, the hollow portion provides a reserved space for the expansion of the solid portion, so that the internal stress and cohesion of the first bonding portion after being heated can be released at the hollow portion, which will not cause deformation of the photosensitive chip and the substrate, or the deformation of the photosensitive chip and the substrate caused by the cohesion and internal stress of this part is not enough to affect the working performance of the photosensitive component. When the first bonding portion shrinks after cooling, due to the small volume of the first bonding portion, the shrinkage of the first bonding portion is also small, and the shrinkage of the first bonding portion also causes less deformation of the photosensitive chip.

[0008] Therefore, in summary, the first bonding portion reduces its own volume by providing a hollow portion so as to reduce the deformation under heating and cooling with the same temperature rise, and the hollow portion reserves space for the deformation of the first bonding portion. In this way, after the baking of the photosensitive component, the photosensitive chip will not undergo a large deformation, and the slight deformation on the photosensitive chip will not affect the imaging effect of the photosensitive component, thereby improving the shooting performance of the camera module with the photosensitive component to enhance the user experience.

[0009] In a possible implementation, the first bonding portion has a plurality of solid portions, and the solid portions and the hollow portions are arranged alternately. The first bonding portion is regionally divided into a plurality of solid portions to reduce the amount of deformation under heating and cooling with the same temperature rise, and a space (i.e., a hollow portion) is reserved between the plurality of solid portions for deformation of the solid portions. In this way, after the photosensitive component is baked, the photosensitive chip will not be greatly deformed, and the slight deformation on the photosensitive chip will not affect the effect of the photosensitive component during imaging, thereby improving the shooting performance of the camera module having the photosensitive component to enhance the user experience.

[0010] In a possible implementation, the substrate further includes a second surface disposed opposite to the first surface, and the substrate has a receiving space recessed from the first surface to the second surface. The photosensitive component further includes a second adhesive portion, which is disposed in the receiving space and connected to the solid portion.

[0011] In this way, in order to reduce the impact of the large deformation of the solid part after baking on the photosensitive chip, the solid part is divided into regions to reduce the bonding area between the first bonding part and the photosensitive chip and the substrate. On the basis of the first bonding part, the second bonding part further increases the bonding area between the substrate and the photosensitive chip, thereby ensuring the bonding strength between the substrate and the photosensitive chip.

[0012] Furthermore, if the volumes of the first adhesive portion and the second adhesive portion are constant, by accommodating the second adhesive portion in the accommodating space, the overall thickness of the first adhesive portion and the second adhesive portion can be reduced. In this way, the overall thickness of the photosensitive component can also be reduced, which is beneficial to the thinning of the photosensitive component and further to the thinning of the camera module.

[0013] In a possible implementation, the accommodating space is formed by penetrating from the first surface to the second surface to form a through hole. In this way, the depth of the accommodating space is larger, and a larger volume of the second bonding part can be accommodated in the accommodating space, thereby increasing the bonding area between the second bonding part and the substrate, and further increasing the bonding strength of the second bonding part to the substrate and the photosensitive chip, so as to improve the reliability and stability of the photosensitive component.

[0014] In one possible implementation, the accommodating space is a groove that is recessed from the first surface to the second surface. In this way, the groove can accommodate the second bonding portion to increase the bonding area between the second bonding portion and the substrate and the photosensitive chip. In addition, the groove does not completely penetrate the substrate. In this way, the setting of the accommodating space does not have a significant impact on the structural strength of the substrate. The groove not only meets the function of expanding the bonding area between the second bonding portion and the substrate and the photosensitive chip, but also ensures that the structural strength of the substrate will not be greatly affected. In other words, the setting of the groove can not only meet the bonding strength between the second bonding portion and the substrate and the photosensitive chip, but also meet the reliability and stability requirements of the photosensitive component.

[0015] In a possible implementation, the accommodating space includes a plurality of accommodating spaces distributed at intervals. In this way, the second bonding portion is regionally divided and distributed in each accommodating space to reduce the deformation under the same temperature rise when heated and cooled. After the photosensitive component is baked, the photosensitive chip will not be greatly deformed, and the slight deformation on the photosensitive chip will not affect the effect of the photosensitive component during imaging, thereby improving the shooting performance of the camera module with the photosensitive component to enhance the user experience.

[0016] In a possible implementation, the number of the accommodating spaces is the same as the number of the entity parts, and in the stacking direction of the substrate and the photosensitive chip, the orthographic projection of the accommodating space on the first adhesive part overlaps with the area where the entity part is located. The second adhesive part is spaced apart in each accommodating space, and after the photosensitive component is baked and cooled, the volume of the second adhesive part in each accommodating space is small, and after being heated and cooled at the same temperature rise, the cohesion and internal stress of the second adhesive part in each accommodating space are small, and the released internal stress and cohesion are not enough to cause the photosensitive chip to bend and deform. That is to say, under the premise that the volume of the second adhesive part is constant, the second adhesive part is accommodated by multiple accommodating spaces. Compared with setting the second adhesive part by a large accommodating space, the volume of the second adhesive part in each of the multiple accommodating spaces is smaller, and the deformation generated under unit temperature rise heating and cooling is also smaller. Therefore, the deformation of the first adhesive part and the second adhesive part also has a smaller pulling deformation on the photosensitive chip, so as to ensure that the photosensitive chip does not deform after baking.

[0017] Therefore, the second adhesive portion is regionalized and distributed in each accommodating space to reduce the amount of deformation under heating and cooling with the same temperature rise. After the photosensitive component is baked, the photosensitive chip will not undergo a large deformation, and the slight deformation on the photosensitive chip will not affect the imaging effect of the photosensitive component, thereby improving the shooting performance of the camera module with the photosensitive component to enhance the user experience.

[0018] In one possible implementation, a plurality of accommodating spaces are distributed in an array on the substrate. In this way, the accommodating spaces are more evenly distributed on the substrate, and the second bonding portions located in the accommodating spaces are also more evenly distributed, that is, the second bonding portions are evenly distributed between the substrate and the photosensitive chip, and the bonding strength of the second bonding portions to each area on the chip is similar, and there will not be a situation where the bonding strength on a certain area on the chip is too high, and the bonding strength on a certain area on the chip is low, or even zero. If the second bonding portion is concentrated on a certain area between the chip and the substrate, it will cause excessive stress in this area, which will lead to the problem that the photosensitive chip is prone to cracks. The accommodating spaces are arranged on the substrate in an array, which can better avoid the above problems, and the bonding surface between the substrate and the photosensitive chip can be more evenly distributed to ensure the reliability and stability of the photosensitive component.

[0019] In one possible implementation, the openings of the multiple accommodating spaces on the first surface are in the shape of long strips, and the openings of the multiple accommodating spaces intersect with each other. After the photosensitive component is baked and cooled, there is also a spacing space between the second adhesive parts overflowing from the accommodating space, reserving expansion and contraction space for the second adhesive parts in the adjacent accommodating spaces, thereby avoiding the second adhesive parts from generating large internal stress and cohesive force, thereby avoiding the deformation of the second adhesive parts from causing smaller deformation of the photosensitive chip, and the photosensitive chip will not be greatly deformed. The slight deformation on the photosensitive chip will not affect the effect of the photosensitive component during imaging, thereby improving the shooting performance of the camera module with the photosensitive component to enhance the user experience.

[0020] Furthermore, there is an intersection between adjacent accommodating spaces, and the second adhesive portions in each accommodating space can flow through the intersection. In this way, when the volumes of the second adhesive portions in each accommodating space are uneven, the fluidity of the second adhesive portions themselves can be utilized to achieve flow at the intersection, so as to achieve a small difference in the volumes of the second adhesive portions in each accommodating space. This can ensure that the bonding strengths between the adhesive portions corresponding to each accommodating space and the substrate and the photosensitive chip are not much different, thereby improving the stability and reliability of the photosensitive component.

[0021] In a possible implementation, the opening of the accommodation space on the first surface extends along a curve. The accommodation space can be in a Z-shape, an N-shape, a W-shape, etc., so that the flexibility of setting the accommodation space can be improved.

[0022] In a possible implementation, in the stacking direction of the substrate and the photosensitive chip, the thickness of the first adhesive portion is greater than that of the second adhesive portion. This prevents the entity portion from generating large internal stress and cohesive force. Since the entity portion is the part that the adhesive portion directly contacts with the photosensitive chip, the deformation of the entity portion is avoided, and the deformation of the photosensitive chip is also smaller. The photosensitive chip will not be greatly deformed, and the slight deformation on the photosensitive chip will not affect the effect of the photosensitive component during imaging, thereby improving the shooting performance of the camera module with the photosensitive component to enhance the user experience.

[0023] In a possible implementation, in the stacking direction of the substrate and the photosensitive chip, the ratio of the depth of the accommodation space to the thickness of the substrate is greater than or equal to 1 / 6 and less than or equal to 1 / 2. In this way, when the ratio of the depth of the accommodation space to the thickness of the substrate is within the above range, the substrate can provide an accommodation space to accommodate the second bonding portion while ensuring its own structural strength, thereby improving the bonding strength between the second bonding portion and the substrate and the photosensitive chip.

[0024] In a possible implementation, the thickness of the substrate is greater than or equal to 100 microns and less than or equal to 200 microns, and the depth of the groove is greater than or equal to 40 microns and less than or equal to 60 microns. In this way, when the ratio between the depth of the accommodation space and the thickness of the substrate is within the above range, the substrate can provide an accommodation space to accommodate the second bonding portion while ensuring its own structural strength, thereby improving the bonding strength between the second bonding portion and the substrate and the photosensitive chip.

[0025] In a possible implementation, in the stacking direction of the substrate and the photosensitive chip, the thickness of the solid part is greater than or equal to 5 microns and less than or equal to 35 microns. When the thickness of the solid part is within the above range, it can not only ensure that the solid part will not be greatly deformed after baking, but also ensure that the solid part provides sufficient bonding strength to the substrate and the photosensitive chip.

[0026] In a possible implementation, the surface of the photosensitive chip facing the substrate is the fifth surface, and the ratio of the area of ​​the fifth surface to the sum of the areas of the multiple solid parts is greater than or equal to 4 and less than or equal to 8. When the area of ​​the solid part to the fifth surface is within the above range, it can be ensured that the solid part will not be greatly deformed after baking, and can also ensure that the solid part provides sufficient bonding strength to the substrate and the photosensitive chip.

[0027] In a second aspect, the present application further provides a method for mounting a photosensitive chip, the method comprising:

[0028] Inject glue on the surface of the substrate to form a first bonding portion;

[0029] Removing at least a portion of the first bonding portion to form a hollow portion extending from the third surface to the fourth surface, wherein the third surface and the fourth surface are surfaces disposed opposite to each other on the first bonding portion, and the third surface faces the substrate;

[0030] The photosensitive chip is bonded to the fourth surface.

[0031] In this way, there is a spacing space between the multiple parts of the first adhesive part, and the expansion and contraction of the first adhesive part can be released into the spacing space. In addition, the volume of each part of the first adhesive part is relatively small. After being heated and cooled with the same temperature rise, the cohesion and internal stress of each part of the first adhesive part are relatively small, and the released internal stress and cohesion are not enough to cause the photosensitive chip to bend and deform. Under unit temperature rise heating and cooling, the deformation amount generated is smaller. Therefore, the deformation of the first adhesive part will also cause less deformation of the photosensitive chip, so as to ensure that the photosensitive chip will not deform after baking.

[0032] On the other hand, after the photosensitive component is baked and heated and cooled, the deformation of each part of the first bonding part can expand toward the spacing space, that is, the spacing space provides a reserved space for the expansion of each part of the first bonding part. In this way, the internal stress and cohesion of the first bonding part after being heated can be released at the spacing space, and only a small part of the cohesion and internal stress of each part of the first bonding part that have not been released are released to the photosensitive chip and the substrate on both sides, which is not enough to cause the deformation of the photosensitive chip and the substrate, or the deformation caused by the cohesion and internal stress of this part on the photosensitive chip and the substrate is not enough to affect the working performance of the photosensitive component. When the parts of the first bonding part shrink after cooling, since the volume of each part of the first bonding part is small, the shrinkage of each part of the first bonding part is also small, and the shrinkage of each part of the first bonding part also causes less deformation of the photosensitive chip.

[0033] Therefore, in summary, in the present embodiment, the first bonding portion is regionally divided into multiple parts to reduce the deformation under heating and cooling with the same temperature rise, and space for the deformation of the first bonding portion is reserved between the parts. In this way, after the baking of the photosensitive component is completed, the photosensitive chip will not undergo a large deformation, and the slight deformation on the photosensitive chip will not affect the imaging effect of the photosensitive component, thereby improving the shooting performance of the camera module with the photosensitive component to enhance the user experience.

[0034] In a possible implementation, after forming the first bonding portion on the surface of the substrate and bonding the photosensitive chip to the fourth surface, the method for mounting the photosensitive chip further includes:

[0035] At least a portion of the first adhesive portion is removed to form a plurality of solid portions that are spaced apart from each other, wherein the solid portions and the hollow portions are alternately arranged.

[0036] In a third aspect, the present application further provides a method for mounting a photosensitive chip, the method comprising:

[0037] A receiving space is formed on the substrate, which is recessed from the first surface to the second surface, wherein the first surface and the second surface are surfaces of the substrate that are disposed opposite to each other along the thickness direction of the substrate, and the receiving space includes a plurality of receiving spaces;

[0038] Injecting glue into the accommodating space, wherein the thickness of the glue is greater than the depth of the accommodating space;

[0039] Bonding the photosensitive chip to the first surface, wherein a portion of the glue overflows the accommodation space to form a first bonding portion, and another portion of the glue is located in the accommodation space to form a second bonding portion;

[0040] The substrate, the first bonding part, the second bonding part and the photosensitive chip bonded together are baked, wherein the baking temperature is greater than or equal to 100 degrees Celsius and less than or equal to 120 degrees Celsius, and the baking time is greater than or equal to 80 seconds and less than or equal to 100 seconds.

[0041] The difference between the mounting method of the photosensitive chip of this embodiment and the mounting method of the photosensitive chip mentioned above is that in the mounting method of the photosensitive chip in this embodiment, the bonding part includes a first bonding part and a second bonding part, the part of the bonding part that overflows the accommodating space is the first bonding part, and the part of the bonding part that is located in the accommodating space is the second bonding part. In this way, the accommodating space can support and fix a part of the bonding part to avoid the collapse of the bonding part. In addition, the second bonding part of the bonding part further increases the bonding area between the bonding part and the substrate and the photosensitive chip, thereby ensuring the bonding strength of the bonding part to the substrate and the photosensitive chip.

[0042] Furthermore, the overall thickness of the adhesive portion provided in the accommodating space can be reduced. Thus, the overall thickness of the photosensitive component can also be reduced, which is beneficial to the thinning of the photosensitive component and further to the thinning of the camera module.

[0043] The bonding part is divided into multiple parts to reduce the deformation under heating and cooling with the same temperature rise, and space for deformation of the bonding part is reserved between the parts. In this way, after the baking of the photosensitive component, the photosensitive chip will not undergo a large deformation, and the slight deformation on the photosensitive chip will not affect the imaging effect of the photosensitive component, thereby improving the shooting performance of the camera module with the photosensitive component to enhance the user experience.

[0044] In a possible implementation, a receiving space recessed from the first surface to the second surface is opened on the substrate, and the receiving space is a through hole penetrating from the first surface to the second surface;

[0045] After a receiving space recessed from the first surface to the second surface is opened on the substrate, and before the adhesive portion is injected into the receiving space, the method for mounting the photosensitive chip further includes bonding an adhesive tape on the second surface;

[0046] After baking the substrate, the bonding part and the photosensitive chip bonded together, the photosensitive chip mounting method further includes tearing off the adhesive tape from the second surface.

[0047] In this way, when the adhesive portion is injected into the accommodating space, the tape supports the tape in the accommodating space, preventing the adhesive portion from flowing out from the lower opening of the accommodating space, thereby improving the mounting efficiency of the photosensitive chip.

[0048] In a fourth aspect, a camera module is provided, comprising a lens and the above-mentioned photosensitive component, wherein the photosensitive component is located on the light-emitting side of the lens.

[0049] Since the camera module provided in the embodiment of the present application includes a photosensitive component according to any of the above technical solutions, the two can solve the same technical problems and achieve the same effects.

[0050] According to a fifth aspect, an electronic device is provided, comprising a controller and a camera module, wherein at least one camera module is electrically connected to the controller.

[0051] Since the electronic device provided in the embodiment of the present application includes a camera module according to any of the above technical solutions, the two can solve the same technical problems and achieve the same effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 A perspective view of an electronic device provided for some embodiments of the present application;

[0053] Figure 2 for Figure 1 an exploded view of the electronic device shown;

[0054] Figure 3 A partial structural schematic diagram of a camera module provided in some embodiments of the present application;

[0055] Figure 4 A schematic diagram of the structure of a camera module provided in some embodiments of the present application;

[0056] Figure 5 A process flow chart of bonding a photosensitive chip to a substrate provided in some embodiments of the present application;

[0057] Figure 6 for Figure 5 A schematic diagram of the structure of a sandwich structure produced by the process shown;

[0058] Figure 7 for Figure 6 The simulation diagram of the deformation of the sandwich structure before and after baking is shown;

[0059] Figure 8 for Figure 5 Structural schematic diagrams of some other sandwich structures produced by the process shown;

[0060] Fig. 9 A schematic diagram of a structure in which the field curvature of a lens matches the deformation of a photosensitive chip provided in some embodiments of the present application;

[0061] Fig.10 for Fig. 9 Schematic diagram of the effect of the lens and the photosensitive chip when focusing and imaging;

[0062] Fig.11 for Fig. 9 a side view of the lens shown;

[0063] Fig.12 for Fig. 9 a top view of the lens shown;

[0064] Fig.13 A schematic diagram of a structure in which the field curvature of a lens matches the deformation of a photosensitive chip provided in some other embodiments of the present application;

[0065] Fig.14 for Fig.13 Schematic diagram of the effect of the lens and the photosensitive chip when focusing and imaging;

[0066] Fig.15 A schematic diagram of a structure in which the field curvature of a lens matches the deformation of a photosensitive chip provided in some further embodiments of the present application;

[0067] Fig.16 for Fig.15 Schematic diagram of the effect of the lens and the photosensitive chip when focusing and imaging;

[0068] Fig.17 A schematic diagram of a structure in which the field curvature of a lens matches the deformation of a photosensitive chip provided in some further embodiments of the present application;

[0069] Fig.18 for Fig.17 Schematic diagram of the effect of the lens and the photosensitive chip when focusing and imaging;

[0070] Fig.19 A graph of focal shifts of various fields of view in a focus curve of a lens provided in some embodiments of the present application;

[0071] Fig. 20 for Fig.19 The imaging effect diagram of the lens shown;

[0072] Fig.21 A schematic diagram of the structure of a photosensitive component provided in some other embodiments of the present application;

[0073] Fig. 22 for Fig.21 A top view of the first bonding portion shown;

[0074] Fig.23 for Fig.21 Another top view of the first bonding portion shown;

[0075] Fig.24 A schematic diagram of the structure of a photosensitive component provided in some further embodiments of the present application;

[0076] Fig.25A schematic diagram of the structure of a photosensitive component provided in some further embodiments of the present application;

[0077] Fig.26 For the substrate in some embodiments of the present application Fig.25 Schematic diagram of the structure observed from the F1 direction;

[0078] Fig. 27 For the substrate in some other embodiments of the present application Fig.25 Schematic diagram of the structure observed from the F1 direction;

[0079] Fig.28 For the substrate in some other embodiments of the present application Fig.25 Schematic diagram of the structure observed from the F1 direction;

[0080] Fig.29 For the substrate in some other embodiments of the present application Fig.25 Schematic diagram of the structure observed from the F1 direction;

[0081] Fig.30 For the substrate in some other embodiments of the present application Fig.25 Schematic diagram of the structure observed from the F1 direction;

[0082] Fig.31 For the substrate in some other embodiments of the present application Fig.25 Schematic diagram of the structure observed from the F1 direction;

[0083] Fig.32 For the substrate in some other embodiments of the present application Fig.25 Schematic diagram of the structure observed from the F1 direction;

[0084] Fig.33 A process flow chart of mounting a photosensitive chip provided in some embodiments of the present application;

[0085] Fig.34 A process flow chart of mounting a photosensitive chip provided for some embodiments of the present application.

[0086] Reference numerals

[0087] 100. electronic device; 10. screen; 11. light-transmitting cover plate; 12. display screen; 20. back shell; 21. back cover; 22. frame; 23. middle plate;

[0088] 30. Camera module; 31. Lens; 311. Lens; A. Center area; B. First upper left area; C. First upper right area; D. First lower left area; E. First lower right area; F. Second upper left area; G. Second upper right area; H. Second lower left area; I. Second lower right area; 312. First area; 313. Second area;

[0089] 32, photosensitive component; 321, circuit board; 325, substrate; 3251, first surface; 3252, second surface; 3253, accommodation space; 3253a, accommodation space;

[0090] 322, photosensitive chip; 3221, fifth surface; 3222, sixth surface;

[0091] 323, reinforcement plate;

[0092] 324, bonding part; 3241, first bonding part; 3241a, solid part; 3241b, hollow part; 3242, second bonding part;

[0093] 35, frame; 351, side panel;

[0094] 40. Camera decorative cover; 41. Light-transmitting area; 50. Installation port; DETAILED DESCRIPTION

[0095] In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the features.

[0096] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0097] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0098] The present application provides an electronic device, which is a type of electronic device with a shooting function. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc.

[0099] See also Figure 1 and Figure 2 , Figure 1 A perspective view of an electronic device 100 provided in some embodiments of the present application, Figure 2 for Figure 1 The exploded view of the electronic device 100 is shown. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 includes a screen 10, a back shell 20, a camera module 30 and a camera decorative cover 40.

[0100] Understandably, Figure 1 and Figure 2 Only some components of the electronic device 100 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 and Figure 2 In some other examples, the electronic device 100 may also not include the screen 10 and the camera decorative cover 40.

[0101] The screen 10 is used to display images, videos, etc. The screen 10 includes a transparent cover plate 11 and a display screen 12 (English name: panel, also called a display panel). The transparent cover plate 11 and the display screen 12 are stacked. The transparent cover plate 11 is mainly used to protect the display screen 12 and prevent dust. The material of the transparent cover plate 11 includes but is not limited to glass. The display screen 12 can be a flexible display screen or a rigid display screen.

[0102] The back shell 20 is used to protect the internal electronic components of the electronic device 100. The back shell 20 includes a back cover 21 and a frame 22. The back cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11, and is stacked with the light-transmitting cover plate 11 and the display screen 12. The frame 22 is located between the back cover 21 and the light-transmitting cover plate 11. And the frame 22 is fixed on the back cover 21. The light-transmitting cover plate 11 is fixed on the frame 22 by gluing. The light-transmitting cover plate 11, the back cover 21 and the frame 22 enclose the internal storage space of the electronic device 100. The internal storage space accommodates the display screen 12.

[0103] For the convenience of the following description, an XYZ coordinate system is established, and the stacking direction of the light-transmitting cover plate 11, the display screen 12, and the back cover 21 in the electronic device 100 (that is, the thickness direction of the electronic device 100) is defined as the Z-axis direction. The plane where the light-transmitting cover plate 11, the display screen 12 or the back cover 21 is located is the XY plane. Specifically, the width direction of the electronic device 100 is the X-axis direction, and the length direction of the electronic device 100 is the Y-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs.

[0104] The camera module 30 is used to take photos / videos, and the camera module 30 is fixed in the internal receiving cavity of the electronic device 100. In some embodiments, see Figure 2 The electronic device 100 further includes a middle plate 23. The middle plate 23 is fixed to the inner surface of the frame 22. For example, the middle plate 23 can be fixed to the frame 22 by welding. The middle plate 23 can also be an integrally formed structure with the frame 22.

[0105] The camera module 30 can be fixed and supported on the middle plate 23 by means of threaded connection, clamping, welding, etc. On this basis, optionally, the materials of the middle plate 23 and the frame 22 are both high thermal conductivity materials. For example, the materials of the middle plate 23 and the frame 22 include but are not limited to metals such as stainless steel, aluminum alloy, and magnesium aluminum alloy. The middle plate 23 is in thermal contact with the frame 22. The heat of the camera module 30 can be conducted to the middle plate 23, and further conducted from the middle plate 23 to the frame 22.

[0106] In some embodiments, please refer to Figure 2 When the camera module 30 is used as a rear camera film, the camera module 30 is fixed to the surface of the middle plate 23 close to the back cover 21. The light incident surface of the camera module 30 faces the back cover 21. The back cover 21 is provided with a mounting opening 50. The camera decorative cover 40 covers and is fixed to the mounting opening 50. The camera decorative cover 40 is used to protect the camera module 30.

[0107] A light-transmitting area 41 is provided on the camera decorative cover 40. The light-transmitting area 41 allows the scene light L1 to pass through and enter the light-incident surface of the camera module 30. In this embodiment, the camera module 30 is used as a rear camera module of the electronic device 100. Specifically, the camera module 30 can be used as a rear main camera module, a wide-angle camera module or a telephoto camera module.

[0108] In some other embodiments, when the camera module 30 is used as a front camera module, the camera module 30 can also be fixed to the surface of the middle plate 23 close to the light-transmitting cover plate 11. The light-entering surface of the camera module 30 faces the light-transmitting cover plate 11. The display screen 12 is provided with a light path avoidance hole. The light path avoidance hole allows the scene light to pass through the light-transmitting cover plate 11 and then enter the light-entering surface of the camera module 30. In this way, the camera module 30 is used as a front camera module of the electronic device 100.

[0109] The electronic device 100 further includes a controller. At least one camera module 30 is electrically connected to the controller. The controller is used to control the working state of the camera module 30.

[0110] See also Figure 3 , Figure 3 The camera module 30 is a partial structural diagram of some embodiments of the present application. The camera module 30 includes a lens 31, a photosensitive component 32, and a frame 35.

[0111] The frame 35 is used as a supporting structure of the camera module 30 and is used to install other components in the camera module 30. The frame 35 includes a side plate 351 and a bottom plate, the side plate 351 is arranged around the periphery of the bottom plate, and the side plate 351 and the bottom plate enclose a receiving space, and the lens 31 and the photosensitive component 32 are received in the receiving space.

[0112] The lens 31 is used to image the scene light L1. Figure 1 and Figure 2 When the electronic device 100 is shown, the optical axis O of the lens 31 can extend along the Z axis direction or in a direction parallel to the XY plane. When the optical axis O of the lens 31 extends along the Z axis direction, the camera module 30 is a vertical camera module. When the optical axis O of the lens 31 extends in a direction parallel to the XY plane, the camera module 30 is a periscope camera module. Figure 3 The illustrated embodiment and the embodiments below are all described on the basis that the camera module 30 is an upright camera module, which cannot be considered as a special limitation to the present application.

[0113] The photosensitive component 32 is located on the light-emitting side of the lens 31. After the scene light L1 is imaged by the lens 31, an imaging light beam L2 is generated. The imaging light beam L2 is injected into the photosensitive component 32, and the photosensitive component 32 converts the image signal into an electrical signal for output. The photosensitive component 32 includes a circuit board 321 and a photosensitive chip 322. The photosensitive chip 322 is disposed on the surface of the circuit board 321 close to the lens 31. In some embodiments, the circuit board 321 can be used as a bottom plate, that is, the circuit board 321 and the side plate 351 enclose a receiving space.

[0114] In some other embodiments, the camera module 30 further includes a reinforcing plate 323, which is stacked on the surface of the circuit board 321 away from the photosensitive chip 322, and is used to increase the structural strength of the photosensitive component 32. The reinforcing plate 323 can also be used as a bottom plate, that is, the reinforcing plate 323 and the side plate 351 enclose an accommodating space.

[0115] See also Figure 4 , Figure 4 The schematic diagram of the structure of the camera module 30 provided in some other embodiments of the present application. The difference between this embodiment and the above-mentioned embodiment is that the circuit board 321 in this embodiment is annular, the circuit board 321 surrounds a hollow area, the photosensitive chip 322 is placed in the hollow area surrounded by the circuit board 321, and the photosensitive chip 322 is directly connected to the surface of the reinforcing plate 323. In this way, the total thickness of the photosensitive chip 322, the circuit board 321 and the reinforcing plate 323 can be reduced, which is conducive to the miniaturization of the camera module 30 and the thinning of the electronic device 100.

[0116] The photosensitive chip 322 is connected to the circuit board 321 or the reinforcing plate 323 by bonding. The mounting process of the photosensitive chip 322, namely the DA (Die attach) process, is described in detail below. For the convenience of the following description, the circuit board 321 and the reinforcing plate 323 are collectively referred to as the substrate 325. That is, when the photosensitive chip 322 is bonded to the circuit board 321, that is, according to the above Figure 3 In the mounting position of the embodiment shown, the substrate 325 is a circuit board 321. When the photosensitive chip 322 is bonded to the reinforcing plate 323, that is, according to Figure 4 In the mounting position of the illustrated embodiment, the substrate 325 is a reinforcing plate 323 .

[0117] There are four ways to paste chips, including eutectic pasting, conductive adhesive pasting, glass adhesive pasting, and welding pasting. The common feature of these four methods is that they are inevitably carried out in a high temperature environment during the pasting process. The following is a detailed introduction using the conductive adhesive pasting method as an example.

[0118] See also Figure 5 , Figure 5The process flow chart of bonding the photosensitive chip 322 to the substrate 325 provided in some embodiments of the present application. First, Figure 5 In (a), a glue layer is stacked between the photosensitive chip 322 and the substrate 325. Specifically, the adhesive portion 324 is evenly applied to the surface of the substrate 325 facing the photosensitive chip 322 to form a glue layer, and then the photosensitive chip 322 is placed on the glue layer. Alternatively, the adhesive portion 324 is evenly applied to the surface of the photosensitive chip 322 facing the substrate 325 to form a glue layer, and then the substrate 325 is placed on the glue layer. The material of the glue layer is a polymer material. Specifically, the material of the glue layer can be selected from epoxy, polyimide, phenolic, polyamine resin and silicone resin as an adhesive matrix, silver powder is added to the adhesive matrix as a conductive material, and then an aluminum oxide powder filler is added as a thermal conductive material.

[0119] like Figure 5 In (b), the photosensitive chip 322, the glue layer and the substrate 325 in the above steps form a "sandwich structure". The "sandwich structure" formed in the above steps is heated, that is, the photosensitive chip 322, the glue layer and the substrate 325 are heated. The "sandwich structure" in this embodiment is heated to 110 degrees Celsius for 90 seconds. In some other embodiments, other heating temperatures and heating times may also be used.

[0120] like Figure 5 In (c), the above-mentioned "sandwich structure" is cooled after being heated. After the "sandwich structure" is cooled to room temperature, the adhesive layer bonds the photosensitive chip 322 and the substrate 325 into an integrated structure.

[0121] See also Figure 6 , Figure 6 for Figure 5 The schematic diagram of the structure of the sandwich structure produced by the process shown in the figure. Since the thermal expansion coefficients of each component of the sandwich structure are different, that is, the thermal expansion coefficients of the photosensitive chip 322, the thermal expansion coefficients of the glue layer, and the thermal expansion coefficients of the substrate 325 are different, the sandwich structure will bend and deform after heating and cooling.

[0122] The specific reasons are as follows: the thermal expansion coefficient refers to the expansion and contraction phenomenon of an object due to temperature changes, and its change ability is the volume change caused by a unit temperature change under constant pressure (p). In other words, the larger the thermal expansion coefficient, the greater the expansion and contraction of the object under a unit temperature change; the smaller the thermal expansion coefficient, the smaller the expansion and contraction of the object under a unit temperature change. In the sandwich structure of this embodiment, the thermal expansion coefficient of the photosensitive chip 322 is 3 ppm / °C, and the thermal expansion coefficient of the glue layer is 54ppm / °C. When the substrate 325 is a reinforcing plate 323, the thermal expansion coefficient of the substrate 325 is 15-17 ppm / °C. When the substrate 325 is a circuit board 321, the thermal expansion coefficient of the substrate 325 is 12-15 ppm / °C.

[0123] It can be seen from the above data that the thermal expansion coefficient of the glue layer is much higher than the thermal expansion coefficient of the photosensitive chip 322 and the thermal expansion coefficient of the substrate 325. In some other embodiments, the photosensitive chip 322, the glue layer and the substrate 325 made of different materials have thermal expansion coefficients different from the above data, but the thermal expansion coefficient of the glue layer is always much higher than the thermal expansion coefficient of the photosensitive chip 322 and the thermal expansion coefficient of the substrate 325.

[0124] In this case, please refer to Figure 7 , Figure 7 for Figure 6 The simulation diagram of the deformation of the sandwich structure before and after baking is shown. After the sandwich structure is heated and cooled, due to the different thermal expansion coefficients, the deformation of the photosensitive chip 322, the deformation of the glue layer and the deformation of the substrate 325 are all different. Since the thermal expansion coefficient of the glue layer is the largest, the deformation of the glue layer is also the largest. The deformation of the photosensitive chip 322 and the deformation of the substrate 325 are both smaller than the deformation of the glue layer. After the sandwich structure is heated, the deformation of the photosensitive chip 322, the deformation of the glue layer and the deformation of the substrate 325 cannot be synchronized. In this way, the part where the deformation of the glue layer is greater than the deformation of the photosensitive chip 322 and the part where the deformation of the glue layer is greater than the deformation of the substrate 325 need to be released by deformation, which will cause the deformation of the sandwich structure.

[0125] The deformation of the sandwich structure can specifically include two forms. First, Figure 6 As shown, the deformation of the adhesive layer is released by arching toward the photosensitive chip 322, which will drive the photosensitive chip 322 and the substrate 325 to arch toward the bonding portion 324 close to the photosensitive chip 322, and finally form Figure 6 The upward arching deformation shown. Second, see Figure 8 , Figure 8 for Figure 5The deformation of the adhesive layer is released by arching toward the substrate 325, which will drive the photosensitive chip 322 and the substrate 325 to arch toward the bonding part 324 close to the substrate 325, and finally form Figure 8 The downward arching deformation is shown.

[0126] The deformation (Sensor warpage) of the above-mentioned photosensitive chip 322 has a great influence on the imaging of the camera module 30. It is worth noting that although the deformation caused by the difference in thermal expansion coefficient is small, the dimensional accuracy of each component is extremely high in the field of optics. Slight changes in the size of the components will cause large differences in imaging. Therefore, it is necessary to avoid the deformation of the above-mentioned photosensitive chip 322 caused by the thermal expansion coefficient.

[0127] The specific reasons why the deformation of the photosensitive chip 322 affects the imaging are as follows: the camera module 30 does not meet the specification requirements for module resolution or has a blurry picture due to the mismatch between the field curvature of the lens 311 and the field curvature of the photosensitive chip 322. This problem is more prominent in the camera module 30 with a large target surface. Field curvature refers to the phenomenon that the image plane is sometimes bent when the lens 311 or the photosensitive chip 322 forms an image of a planar object. This aberration is called field curvature. Field curvature will result in the inability to obtain clear images at the center and the periphery of the image plane at the same time.

[0128] The design of lens 311 will minimize the field curvature, but the field curvature of the actual finished lens 311 is biased to one side or scattered in distribution. At the same time, it is difficult to ensure that the photosensitive chip 322 has a relatively flat surface. Lenses 311 with different field curvatures are randomly matched to photosensitive chips 322 with different degrees of deformation. The field curvature of lens 311 and the deformation of photosensitive chip 322 are in different directions or in the same direction but with different numerical differences, which will cause the following different imaging structures:

[0129] First, see Fig. 9 , Fig. 9 A schematic diagram of a structure in which the field curvature of the lens 311 provided in some embodiments of the present application matches the deformation of the photosensitive chip 322. The field curvature of the lens 311 and the deformation of the photosensitive chip 322 have the same direction and similar values, that is, when the field curvature of the lens 311 is negative, the photosensitive chip 322 is deformed concavely away from the lens 311, and the field curvature of the lens 311 and the deformation of the photosensitive chip 322 are more matched.

[0130] See also Fig.10 , Fig.10 for Fig. 9 The schematic diagram shows the effect of the lens 311 and the photosensitive chip 322 when focusing and imaging. Fig.10The horizontal axis in refers to the moving distance of the lens 311 during the focusing process of the camera module 30. Fig.10 The vertical axis in refers to the index of the imaging clarity of the camera module 30 . The higher the index, the higher the imaging clarity of the camera module 30 , and the smaller the index, the worse the imaging clarity of the camera module 30 . Fig.10 The nine curves in the figure represent the imaging of different areas on the lens 311, and the nine curves are in the form of parabolas. The vertex of the curve means that the area represented by the curve is at the focus where the imaging is clearest. If the vertices of the nine curves correspond to the same focus, the imaging clarity of the camera module 30 is better. In other words, if Fig.10 When the horizontal coordinates of the nine curves are around 300, they correspond to the vertices of the nine curves. At this time, the imaging of the corresponding areas represented by the nine curves reaches the clearest picture. The final imaging effect of the entire picture of the camera module 30 is better, and there will not be too many blurred areas on the picture. It can also be understood that the center and the periphery on the image plane are clearly imaged at the same time.

[0131] For a detailed description of which areas of the lens 311 the above nine curves correspond to, please refer to Fig.11 and Fig.12 , Fig.11 for Fig. 9 A side view of the lens 311 is shown; Fig.12 for Fig. 9 The top view of the lens 311 is shown. The lens 311 is divided into three areas according to the diameter. The three areas here refer to three virtual areas on the lens 311, and the lens 311 is not separated. Assuming that the radius of the lens 311 is 10 mm, the radius range of 1-2 mm from the center of the lens 311 to the periphery is the central area A, the area of ​​5 mm from the center of the lens 311 to the outside and excluding the central area A is the first area 312, and the area of ​​8 mm from the center of the lens 311 to the outside and excluding the central area A and the first area 312 is the second area 313. Four evenly distributed areas are selected from the first area 312, namely the first upper left area B, the first upper right area C, the first lower left area D and the first lower right area E. Four evenly distributed areas are selected from the second area 313, namely the second upper left area F, the second upper right area G, the second lower left area H and the second lower right area I.

[0132] Among them, curve No. 1 corresponds to the imaging of the central area A, curve No. 2 corresponds to the imaging of the first upper left area B, curve No. 3 corresponds to the imaging of the first upper right area C, curve No. 4 corresponds to the imaging of the first lower left area D, curve No. 5 corresponds to the imaging of the first lower right area E, curve No. 6 corresponds to the imaging of the second upper left area F, curve No. 7 corresponds to the imaging of the second upper right area G, curve No. 8 corresponds to the imaging of the second lower left area H, and curve No. 9 corresponds to the imaging of the second lower right area I.

[0133] Second, see Fig.13 and Fig.14 , Fig.13 A schematic diagram of a structure in which the field curvature of the lens 311 and the deformation of the photosensitive chip 322 are matched with each other in some other embodiments of the present application; Fig.14 for Fig.13 The effect of lens 311 and photosensitive chip 322 when focusing and imaging is shown. The field curvature of lens 311 is too negative, and the deformation of photosensitive chip 322 is concave, which is in the same direction as the field curvature of lens 311, but the value is quite different. The field curvature of lens 311 and the deformation of photosensitive chip 322 are not well matched. Fig.14 As shown, when the camera module 30 is imaging, the imaging of the central area A reaches the focus with the highest clarity faster than the imaging of other areas, which will cause the problem that the imaging center is clear but the edges are not.

[0134] Fig.14 The meanings of the horizontal axis, vertical axis and curve are the same as those above and will not be repeated here. The meanings of the curve graph below are also the same as those above and will not be repeated here.

[0135] Third, see Fig.15 and Fig.16 , Fig.15 A schematic diagram of a structure in which the field curvature of the lens 311 and the deformation of the photosensitive chip 322 are matched with each other in some other embodiments of the present application; Fig.16 for Fig.15 The schematic diagram of the effect of lens 311 and photosensitive chip 322 when focusing and imaging is shown. The field curvature of lens 311 is opposite to the deformation of photosensitive chip 322. The field curvature of lens 311 is negative, and the deformation of photosensitive chip 322 is convex. Even if the field curvature of lens 311 and the deformation of photosensitive chip 322 are similar in value, the field curvature of lens 311 and the deformation of photosensitive chip 322 are poorly matched. Fig.16 As shown, when the camera module 30 is imaging, the imaging of the central area A reaches the focus with the highest clarity faster than the imaging of other areas, which will cause the problem that the imaging center is clear but the edges are not.

[0136] Fourth, please see Fig.17 and Fig.18 , Fig.17 A schematic diagram of a structure in which the field curvature of the lens 311 and the deformation of the photosensitive chip 322 are matched with each other in some other embodiments of the present application; Fig.18 for Fig.17The schematic diagram of the effect of lens 311 and photosensitive chip 322 when focusing and imaging is shown. The field curvature of lens 311 is opposite to the deformation of photosensitive chip 322. The field curvature of lens 311 is negative, and the deformation of photosensitive chip 322 is convex. The field curvature of lens 311 and the deformation of photosensitive chip 322 are greatly different in value. The field curvature of lens 311 and the deformation of photosensitive chip 322 have the lowest matching degree. Fig.18 As shown, there is a problem with the imaging of the camera module 30 and no picture is produced.

[0137] In summary, when field curvature exists, the center, inner field of view, and outer field of view of the image cannot be clear at the same time, which greatly reduces the overall image quality. In addition, the larger the focal shift value of the field of view, the worse the overall image quality. The focal shift value of the field of view refers to the difference between the position of the peak value of the field of view and the position of the peak value of the center field of view. For details, please refer to Fig.19 , Fig.19 The focus curve of each field of view in the focus curve of the lens 311 provided in some embodiments of the present application is a graph. Among them, curve 1 is a graph of the central field of view during the focusing process, curve 2 is a graph of the inner field of view during the focusing process, and curve 3 is a graph of the outer field of view during the focusing process. The focal shift value of curve 2 and curve 1 is L1, and the focal shift value of curve 3 and curve 1 is L2. The larger the focal shift value, the worse the overall imaging quality.

[0138] See also Fig. 20 , Fig. 20 for Fig.19 The imaging effect diagram of the lens 311 is shown. Fig. 20 As shown in a in the figure, when the central area A of the image is clear, the inner and outer fields of view of the image are blurry. Fig. 20 As shown in b in the figure, when the inner field of view of the image is clear, the central area A of the image and the outer field of view are relatively blurred. Fig. 20 As shown in c in the figure, when the outer field of view of the image is clear, the central area A of the image and the inner field of view are relatively blurred.

[0139] In order to solve the above problem, since the deformation of the photosensitive chip 322 is difficult to control, the field curvature of the lens 311 can be adjusted to match the deformation of the photosensitive chip 322. However, the deformation of the photosensitive chip 322 after each processing is not fixed. The deformation of the photosensitive chip 322 can be bent in a direction away from the substrate 325, or in a direction close to the substrate 325, and the curvature of each bending is difficult to control. Adjusting the field curvature of the lens 311 to match the deformation of the photosensitive chip 322 will lead to low production efficiency and difficulty in mass production.

[0140] Therefore, the present application also provides a solution to control the deformation of the photosensitive chip 322 within a certain range, thereby reducing the influence of the deformation of the photosensitive chip 322 on the imaging of the camera module 30, as follows:

[0141] See also Fig.21 , Fig.21 A schematic diagram of the structure of a photosensitive component 32 provided in some other embodiments of the present application; Fig. 22 for Fig.21 A top view of the first adhesive portion 3241 is shown. The photosensitive component 32 includes a substrate 325, an adhesive portion 324 and a photosensitive chip 322. The substrate 325 is in the shape of a plate. Specifically, the substrate 325 can be a square plate, a circular plate, an elliptical plate, etc. This embodiment and the following embodiments are described by taking the substrate 325 as a square plate as an example, but this does not represent a special limitation on the present application. The substrate 325 can be a circuit board 321 or a reinforcing plate 323. This embodiment and the following embodiments are described by taking the substrate 325 as a reinforcing plate 323 as an example. The reinforcing plate 323 can be a steel plate to provide sufficient support for the photosensitive component 32 and the camera module 30. The substrate 325 includes a first surface 3251 and a second surface 3252 that are arranged opposite to each other along its own thickness direction.

[0142] The function of the photosensitive chip 322 is consistent with that of the photosensitive chip 322 in the above content, and will not be repeated here. The photosensitive chip 322 is located on the side facing the first surface 3251 and is fixedly connected to the substrate 325. Specifically, the photosensitive chip 322 can be connected to the substrate 325 by gluing.

[0143] The first adhesive portion 3241 is stacked on the first surface 3251. The first adhesive portion 3241 includes a third surface and a fourth surface that are opposite to each other. The third surface faces the substrate 325. The first adhesive portion 3241 is provided with a plurality of hollow portions 3241b that pass through the third surface 3241c to the fourth surface, and the plurality of hollow portions 3241b are arranged at intervals. The photosensitive chip 322 is stacked on the fourth surface, and the photosensitive chip 322 is connected to the substrate 325 through the first adhesive portion 3241.

[0144] The first bonding part 3241 has a plurality of hollow parts 3241b, which can provide space for the expansion and contraction of the first bonding part 3241. That is, after the photosensitive component 32 is baked and cooled, although the thermal expansion coefficients of the substrate 325, the bonding part 324, and the photosensitive chip 322 are different, the deformation of the first bonding part 3241 with the hollow parts 3241b is smaller, and the deformation of the first bonding part 3241 involves a smaller deformation of the photosensitive chip 322. Because the volume of the first adhesive portion 3241 is smaller than that without the hollow portion 3241b, after being heated and cooled at the same temperature rise, the cohesive force and internal stress of the first hollow portion 3241b are smaller, and the released internal stress and cohesive force are not sufficient to cause the photosensitive chip 322 to bend and deform. In other words, the first adhesive portion 3241 is smaller in volume after removing the hollow portion 3241b, and the deformation produced under unit temperature rise heating and cooling is also smaller. Therefore, the deformation of the first adhesive portion 3241 also causes less pulling deformation on the photosensitive chip 322, thereby ensuring that the photosensitive chip 322 does not deform after baking.

[0145] Furthermore, after the photosensitive component 32 is heated and cooled by baking, the deformation of the first adhesive portion 3241 can expand toward the hollow portion 3241b, that is, the hollow portion 3241b provides a reserved space for the expansion of the solid portion 3241a, so that the internal stress and cohesive force of the first adhesive portion 3241 after being heated can be released at the hollow portion 3241b, which will not cause the deformation of the photosensitive chip 322 and the substrate 325, or the deformation caused by the cohesive force and internal stress of this part on the photosensitive chip 322 and the substrate 325 is not enough to affect the working performance of the photosensitive component 32. When the first adhesive portion 3241 shrinks after cooling, due to the small volume of the first adhesive portion 3241, the shrinkage of the first adhesive portion 3241 is also small, and the shrinkage of the first adhesive portion 3241 also causes less deformation of the photosensitive chip 322.

[0146] Therefore, in summary, the first bonding portion 3241 reduces its own volume by setting the hollow portion 3241b to reduce the deformation under heating and cooling with the same temperature rise, and the hollow portion 3241b reserves space for the deformation of the first bonding portion 3241. In this way, after the baking of the photosensitive component 32 is completed, the photosensitive chip 322 will not undergo a large deformation, and the slight deformation on the photosensitive chip 322 will not affect the imaging effect of the photosensitive component 32, thereby improving the shooting performance of the camera module with the photosensitive component 32 to enhance the user experience.

[0147] Please also read Fig.21 and Fig.23 , Fig.23 for Fig.21Another top view of the first bonding portion 3241 is shown. The first bonding portion 3241 also includes a plurality of solid portions 3241a, and the solid portions 3241a and the hollow portions 3241b are arranged alternately. The photosensitive chip 322 includes a fifth surface 3221 and a sixth surface 3222 arranged opposite to each other along its thickness direction, wherein the fifth surface 3221 is the surface of the photosensitive chip 322 facing the substrate 325. The first bonding portion 3241 is located between the first surface 3251 and the fifth surface 3221, and is used to bond the photosensitive chip 322 to the substrate 325.

[0148] The solid part 3241a is a part of the first adhesive part 3241 with adhesive properties, and the hollow part 3241b is a part of the first adhesive part 3241 without adhesive properties. The alternating arrangement of the solid part 3241a and the hollow part 3241b means that there is at least a certain space between two adjacent solid parts 3241a for arranging the hollow part 3241b, and the hollow part 3241b can completely separate the two adjacent solid parts 3241a, that is, there is no overlapping area between the two adjacent solid parts 3241a. The hollow part 3241b can also separate at least part of the two adjacent solid parts 3241a, that is, the two adjacent solid parts 3241a have an overlapping area and a spacing area, and the spacing area forms the hollow part 3241b.

[0149] Compared with the photosensitive component 32 in the above-mentioned embodiment, that is, the bonding portion 324 is flatly laid between the substrate 325 and the photosensitive chip 322, when the photosensitive component 32 is baked and cooled as a whole, the bonding portion 324 connected as a whole is subjected to greater internal stress and cohesive force. The internal stress and cohesive force in the bonding portion 324 drive the bonding portion 324 to arch and deform to both sides to release the internal stress and cohesive force, thereby causing the deformation of the photosensitive chip 322, and further causing the field curvature of the photosensitive component 32 and the lens 31 to be inconsistent, which ultimately leads to the problem of poor imaging effect of the camera module 30.

[0150] In this embodiment, the solid part 3241a in the first adhesive part 3241 is separated by the hollow part 3241b, and the hollow part 3241b between adjacent solid parts 3241a can provide space for the expansion and contraction of the solid part 3241a. That is to say, after the photosensitive component 32 is baked and cooled, the deformation of the first adhesive part 3241 in this embodiment is smaller than that of the adhesive part 324 in the above embodiment, and the deformation of the first adhesive part 3241 involves less deformation of the photosensitive chip 322, and the specific reasons are as follows:

[0151] First, the volume of a single entity part 3241a is small. After being heated and cooled at the same temperature rise, the cohesive force and internal stress of the single entity part 3241a are small. The released internal stress and cohesive force are not enough to cause the photosensitive chip 322 to bend and deform. That is to say, the first bonding part 3241 in this embodiment is smaller in volume than the bonding part 324 in the above embodiment. Under unit temperature rise heating and cooling, the deformation amount generated is also smaller. Therefore, the deformation of the first bonding part 3241 also causes less pulling deformation on the photosensitive chip 322, so as to ensure that the photosensitive chip 322 does not deform after baking.

[0152] Second, there is a hollow portion 3241b between adjacent solid portions 3241a. After the photosensitive component 32 is baked, heated and cooled, the deformation of a single solid portion 3241a can expand toward the hollow portion 3241b. In other words, the hollow portion 3241b provides a reserved space for the expansion of the solid portion 3241a. In this way, the internal stress and cohesion of the solid portion 3241a after being heated are released at the hollow portion 3241b, and only a small part of the cohesion and internal stress in the solid portion 3241a is not released. This part is released to both sides to the photosensitive chip 322 and the substrate 325, which is not enough to cause the deformation of the photosensitive chip 322 and the substrate 325, or the deformation of the photosensitive chip 322 and the substrate 325 caused by this part of the cohesion and internal stress is not enough to affect the working performance of the photosensitive component 32. When the single entity portion 3241a shrinks after being cooled, since the volume of the single entity portion 3241a is small, the shrinkage amount of the single entity portion 3241a is also small, and the shrinkage of the entity portion 3241a also causes less deformation of the photosensitive chip 322.

[0153] Therefore, in summary, in this embodiment, the first adhesive portion 3241 is regionally divided into multiple solid portions 3241a to reduce the deformation under heating and cooling with the same temperature rise, and space for deformation of the solid portion 3241a (i.e., hollow portion 3241b) is reserved between the multiple solid portions 3241a. In this way, after the baking of the photosensitive component 32 is completed, the photosensitive chip 322 will not undergo a large deformation, and the slight deformation on the photosensitive chip 322 will not affect the imaging effect of the photosensitive component 32, thereby improving the shooting performance of the camera module 30 with the photosensitive component 32 to enhance the user experience.

[0154] In order to ensure that each solid part 3241a does not collapse and connect into one piece after being set on the substrate 325, a first bonding part 3241 with a higher thixotropic index can be selected. The first bonding part 3241 can be glue, that is, some glue with lower fluidity can be selected. For example, glue with a thixotropic index greater than or equal to 2 and less than or equal to 4 can be selected. In this way, the first bonding part 3241 is easier to stand up after being set on the substrate 325, and will not collapse and connect into one piece, so as to ensure that the first bonding part 3241 of the photosensitive component 32 will not undergo significant deformation during baking.

[0155] In order to improve the applicability of the adhesive portion 324 in the photosensitive component 32, the photosensitive component 32 is applicable to most adhesive materials, that is, the photosensitive component 32 is not limited to adhesive materials with low fluidity, but is also applicable to adhesive materials with high fluidity. Fig.24 , Fig.24 A schematic diagram of the structure of the photosensitive component 32 provided for some other embodiments of the present application. In some embodiments, the substrate 325 has a receiving space 3253 recessed from the first surface 3251 to the second surface 3252, and the receiving space 3253 is used to receive a portion of the adhesive portion 324. Specifically, the adhesive portion 324 can be divided into a first adhesive portion 3241 and a second adhesive portion 3242 according to being located inside the receiving space 3253 and being located outside the receiving space 3253, wherein the first adhesive portion 3241 is located outside the receiving space 3253, the second adhesive portion 3242 is located inside the receiving space 3253, and the first adhesive portion 3241 is connected to the entity portion 3241a.

[0156] In this way, the accommodating space 3253 can support and fix a part of the bonding portion 324, thereby preventing the bonding portion 324 from collapsing. In addition, in the above embodiment, in order to reduce the influence of the large deformation of the bonding portion 324 after baking on the photosensitive chip 322, the solid portion 3241a is divided into regions to reduce the bonding area between the first bonding portion 3241 and the photosensitive chip 322. On the basis of the first bonding portion 3241, the second bonding portion 3242 further increases the bonding area between the bonding portion 324 and the substrate 325 and the photosensitive chip 322, thereby ensuring the bonding strength between the bonding portion 324 and the substrate 325 and the photosensitive chip 322.

[0157] Furthermore, under the premise that the total volume of the bonding portion 324 remains unchanged, at least a portion of the bonding portion 324 is disposed in the accommodating space 3253, and the overall thickness of the bonding portion 324 can be reduced. In this way, the overall thickness of the photosensitive component 32 can also be reduced, which is beneficial to the thinning of the photosensitive component 32, and further beneficial to the thinning of the camera module 30.

[0158] The specific types of the accommodating space 3253 are introduced in detail below.

[0159] Please continue to refer to 24. In some embodiments, the accommodating space 3253 is formed by penetrating from the first surface 3251 to the second surface 3252 to form a through hole. In this way, the depth of the accommodating space 3253 is larger, and more second adhesive parts 3242 can be accommodated, thereby increasing the bonding area of ​​the adhesive part 324 as a whole with the substrate 325 and the photosensitive chip 322, and further increasing the bonding strength of the adhesive part 324 to the substrate 325 and the photosensitive chip 322, so as to improve the reliability and stability of the photosensitive component 32.

[0160] See also Fig.25 , Fig.25 A schematic diagram of the structure of the photosensitive component 32 provided for some other embodiments of the present application. In some embodiments, the accommodating space 3253 is a groove that is recessed from the first surface 3251 to the second surface 3252. In this way, the groove can accommodate the second bonding portion 3242 to increase the bonding area between the bonding portion 324 and the substrate 325 and the photosensitive chip 322. In addition, the groove does not completely penetrate the substrate 325. In this way, the setting of the accommodating space 3253 does not have a significant impact on the structural strength of the substrate 325. The groove not only meets the function of expanding the bonding area between the bonding portion 324 and the substrate 325 and the photosensitive chip 322, but also ensures that the structural strength of the substrate 325 will not be greatly affected. In other words, the setting of the groove can not only meet the bonding strength between the bonding portion 324 and the substrate 325 and the photosensitive chip 322, but also meet the reliability and stability requirements of the photosensitive component 32.

[0161] In order to balance the bonding strength between the second bonding part 3242 and the substrate 325 and the photosensitive chip 322, as well as the structural strength of the substrate 325 itself. In the stacking direction of the substrate 325 and the photosensitive chip 322, the ratio of the depth of the accommodating space 3253 to the thickness of the substrate 325 is greater than or equal to 1 / 6, and less than or equal to 1 / 2. In this way, when the ratio between the depth of the accommodating space 3253 and the thickness of the substrate 325 is within the above range, the substrate 325 can provide the accommodating space 3253 to accommodate the second bonding part 3242 while ensuring its own structural strength, thereby improving the bonding strength between the second bonding part 3242 and the substrate 325 and the photosensitive chip 322.

[0162] In some embodiments, the thickness d1 of the substrate 325 is greater than or equal to 100 microns and less than or equal to 200 microns, and the depth d2 of the groove is greater than or equal to 40 microns and less than or equal to 60 microns. In this way, when the ratio between the depth of the accommodating space 3253 and the thickness of the substrate 325 is within the above range, the substrate 325 can provide the accommodating space 3253 to accommodate the second bonding portion 3242 while ensuring its own structural strength, thereby improving the bonding strength between the bonding portion 324 and the substrate 325 and the photosensitive chip 322.

[0163] The specific structure and shape of the accommodating space 3253 will be described in detail below.

[0164] See also Fig.26 , Fig.26 In some embodiments of the present application, the substrate 325 passes through Fig.25 Schematic diagram of the structure observed from the F1 direction. In some embodiments, the accommodation space 3253 includes a plurality of accommodation spaces 3253a distributed at intervals, the number of the accommodation spaces 3253a is the same as the number of the entity parts 3241a and corresponds one to one, and in the stacking direction of the substrate 325 and the photosensitive chip 322, the orthographic projection of the accommodation space 3253a on the first adhesive part 3241 overlaps with the area where the entity part 3241a is located. "Overlap" includes the following situations: first, the orthographic projection of the accommodation space 3253a on the first adhesive part 3241 overlaps with the area where the entity part 3241a is located; second, the orthographic projection of the accommodation space 3253a on the first adhesive part 3241 is located in the area where the entity part 3241a is located; third, part of the orthographic projection of the accommodation space 3253a on the first adhesive part 3241 partially overlaps with the area where the entity part 3241a is located.

[0165] The plurality of accommodating spaces 3253a are disposed corresponding to the entity portion 3241a. The second bonding portion 3242 is connected to the entity portion 3241a to form an integral body, so as to improve the bonding strength between the bonding portion 324 and the substrate 325 and the photosensitive chip 322.

[0166] Furthermore, a plurality of accommodating spaces 3253a are provided, and the second adhesive portions 3242 in the accommodating spaces 3253a are also divided into blocks. In this way, the second adhesive portions 3242 are spaced apart in the accommodating spaces 3253a. After the photosensitive component 32 is baked and cooled, although the thermal expansion coefficients of the substrate 325, the thermal expansion coefficients of the adhesive portions 324, and the thermal expansion coefficients of the photosensitive chip 322 are different, the deformation of the adhesive portions 324 of the same volume after heating and cooling is greater than the deformation of the chip and the substrate 325 of the same volume. However, the volume of the second adhesive portions 3242 in each accommodating space 3253a is small, and under the same temperature rise, the deformation of the adhesive portions 324 is greater than that of the chip and the substrate 325 of the same volume. After heating and cooling, the cohesive force and internal stress of the second adhesive portion 3242 in each accommodating space 3253a are relatively small, and the released internal stress and cohesive force are not sufficient to cause the photosensitive chip 322 to bend and deform. In other words, the volume of the second adhesive portion 3242 in each accommodating space 3253a is smaller, and the deformation produced under unit temperature rise heating and cooling is also smaller. Therefore, the overall deformation of the adhesive portion 324 also causes less pulling deformation on the photosensitive chip 322, so as to ensure that the photosensitive chip 322 does not deform after baking.

[0167] Therefore, the second adhesive portion 3242 is divided into regions and distributed in each accommodating space 3253a to reduce the deformation under heating and cooling with the same temperature rise. After the photosensitive component 32 is baked, the photosensitive chip 322 will not undergo a large deformation, and the slight deformation on the photosensitive chip 322 will not affect the imaging effect of the photosensitive component 32, thereby improving the shooting performance of the camera module 30 with the photosensitive component 32 to enhance the user experience.

[0168] Please continue reading Fig.26 In some embodiments, a plurality of accommodating spaces 3253a are distributed in an array on the substrate 325. Fig.26The cross-sectional shape of the accommodation space 3253a shown is circular, and the array of the accommodation spaces 3253a in the shape of circular holes is arranged on the substrate 325. In this way, the distribution of the accommodation spaces 3253a on the substrate 325 is more uniform, and the second adhesive portions 3242 located in the accommodation spaces 3253a are also more uniformly distributed, that is, the adhesive portions 324 are uniformly distributed between the substrate 325 and the photosensitive chip 322, and the adhesive strength of the adhesive portions 324 to each area on the chip is similar, and there will not be a situation where the adhesive strength on a certain area on the chip is too high, and the adhesive strength on a certain area on the chip is low, or even zero. If the second adhesive portions 3242 of the adhesive portions 324 are concentrated on a certain area between the chip and the substrate 325, it will cause the stress in this area to be too high, which will lead to the problem that the photosensitive chip 322 is prone to cracks. The accommodating space 3253a is arranged on the substrate 325 in an array, which can better avoid the above-mentioned problem. The bonding surface between the substrate 325 and the photosensitive chip 322 can be more evenly distributed to ensure the reliability and stability of the photosensitive component 32.

[0169] Fig.26 The cross section of the accommodation space 3253a shown is circular. In some other embodiments, see Fig. 27 and Fig.28 , Fig. 27 The substrate 325 in some other embodiments of the present application is Fig.25 Schematic diagram of the structure observed from the F1 direction; Fig.28 For the substrate 325 in some other embodiments of the present application, Fig.25 The cross-sectional shape of the accommodation space 3253a can also be an ellipse, a triangle, a rectangle, etc. Fig. 27 As shown, the cross-sectional shape of the accommodation space 3253a is a triangle. Fig.28 As shown, the cross-sectional shape of the accommodation space 3253a is a rectangle. The cross-sectional shape of the accommodation space 3253a is only for exemplary description and does not constitute a special limitation on the present application.

[0170] See also Fig.29 , Fig.29 For the substrate 325 in some other embodiments of the present application, Fig.25In some embodiments, the openings of the plurality of accommodating spaces 3253a on the first surface 3251 are in the shape of long strips, and the openings of the plurality of accommodating spaces 3253a intersect with each other. In other words, the accommodating spaces 3253a are in the shape of long strips. In this way, there are both spacing spaces and intersections between the multiple accommodating spaces 3253a. Therefore, after the photosensitive component 32 is baked and cooled, there is also spacing space between the second adhesive portions 3242 overflowing from the multiple accommodating spaces 3253a, reserving expansion and contraction space for the second adhesive portions 3242 in adjacent accommodating spaces 3253a, thereby avoiding the adhesive portions 324 from generating large internal stress and cohesive force, thereby avoiding the deformation of the adhesive portions 324 and causing smaller deformation of the photosensitive chip 322. The photosensitive chip 322 will not undergo large deformation, and the slight deformation on the photosensitive chip 322 will not affect the imaging effect of the photosensitive component 32, thereby improving the shooting performance of the camera module 30 with the photosensitive component 32, thereby enhancing the user experience.

[0171] Furthermore, there is an intersection between adjacent accommodating spaces 3253a, and the second adhesive portion 3242 in each accommodating space 3253a can flow through the intersection. In this way, when the volume of the second adhesive portion 3242 in each accommodating space 3253a is uneven, the fluidity of the second adhesive portion 3242 itself can be utilized to achieve flow at the intersection, so as to achieve a small difference in the volume of the second adhesive portion 3242 in each accommodating space 3253a, thereby ensuring that the bonding strength between the adhesive portion 324 corresponding to each accommodating space 3253a and the substrate 325 and the photosensitive chip 322 is small, thereby improving the stability and reliability of the photosensitive component 32.

[0172] Fig.29 The substrate 325 shown has two accommodating spaces 3253a, and the accommodating spaces 3253a are in the shape of long strips. The two accommodating spaces 3253a are arranged crosswise. In some other embodiments, please refer to Fig.30 and Fig.31 , Fig.30 For the substrate 325 in some other embodiments of the present application, Fig.25 Schematic diagram of the structure observed from the F1 direction; Fig.31 For the substrate 325 in some other embodiments of the present application, Fig.25 Schematic diagram of the structure observed from the F1 direction. Fig.30 The substrate 325 of the embodiment shown has three accommodating spaces 3253a. Fig.31 The substrate 325 of the embodiment shown has four accommodating spaces 3253a. Fig.29 , Fig.31 and Fig.31 This is merely an exemplary description and does not constitute any special limitation on the present application.

[0173] See also Fig.32 , Fig.32 For the substrate 325 in some other embodiments of the present application, Fig.25 In some embodiments, the opening of the accommodation space 3253a on the first surface 3251 extends along a curve. The accommodation space 3253a can be in a Z shape, an N shape, a W shape, etc., so that the flexibility of setting the accommodation space 3253a can be improved.

[0174] The cross-sectional shape and depth of the accommodation space 3253a in the above content can be selected according to the fluidity of the adhesive portion 324. Specifically, when the fluidity of the adhesive portion 324 is good, when the adhesive portion 324 is injected into the accommodation space 3253a, the adhesive portion 324 is more likely to cover the entire cavity of the accommodation space 3253a. In this way, the width and length of the cavity can be larger, and the depth does not need to be too large. On the contrary, when the fluidity of the adhesive portion 324 is lower, when the adhesive portion 324 is injected into the accommodation space 3253a, the adhesive portion 324 is less likely to cover the entire cavity of the accommodation space 3253a. In this way, the width and length of the cavity can be smaller, and the depth can be deeper.

[0175] In some embodiments, in the stacking direction of the substrate 325 and the photosensitive chip 322, the thickness of the solid part 3241a is greater than the thickness of the second bonding part 3242. In this way, the thickness of the portion of the bonding part 324 between the substrate 325 and the photosensitive chip 322, that is, the thickness of the solid part 3241a, is reduced. Therefore, after the photosensitive component 32 is baked, the expansion and contraction of the solid part 3241a of the bonding part 324 is also small, which avoids the solid part 3241a from generating large internal stress and cohesive force. Since the solid part 3241a is the part where the bonding part 324 is in direct contact with the photosensitive chip 322, the deformation of the solid part 3241a is avoided. The deformation of the photosensitive chip 322 is also smaller, and the photosensitive chip 322 will not be greatly deformed. The slight deformation on the photosensitive chip 322 will not affect the effect of the photosensitive component 32 during imaging, thereby improving the shooting performance of the camera module 30 with the photosensitive component 32, so as to enhance the user experience.

[0176] In some embodiments, in the stacking direction of the substrate 325 and the photosensitive chip 322, the thickness of the solid portion 3241a is greater than or equal to 5 microns and less than or equal to 35 microns. When the thickness of the solid portion 3241a is within the above range, it can not only ensure that the solid portion 3241a will not undergo significant deformation after baking, but also ensure that the solid portion 3241a provides sufficient bonding strength to the substrate 325 and the photosensitive chip 322.

[0177] In some embodiments, the ratio of the area of ​​the fifth surface 3221 to the sum of the areas of the plurality of solid parts 3241a is greater than or equal to 4 and less than or equal to 8. The same effect as in the above embodiment is achieved, that is, when the area of ​​the solid part 3241a on the fifth surface 3221 is within the above range, the solid part 3241a will not be greatly deformed after baking, and sufficient bonding strength can be provided to the substrate 325 and the photosensitive chip 322 by the solid part 3241a.

[0178] The following is a detailed description of the method for making the photosensitive component 32, that is, the method for mounting the photosensitive chip 322. Fig.33 , Fig.33 The process flow chart of mounting the photosensitive chip 322 provided in some embodiments of the present application. The mounting method of the photosensitive chip 322 includes:

[0179] like Fig.33 (a) injecting glue on the surface of the substrate 325 to form a first bonding portion 3241;

[0180] like Fig.33 (b) removing at least part of the first bonding portion 3241 to form a hollow portion 3241b extending from the third surface to the fourth surface, wherein the third surface and the fourth surface are surfaces of the first bonding portion 3241 that are disposed opposite to each other, and the third surface faces the substrate 325;

[0181] The photosensitive chip 322 is bonded to the fourth surface.

[0182] In this way, there is a spacing space Q between the multiple parts of the first adhesive part 3241, and the expansion and contraction of the first adhesive part 3241 can be released to the spacing space Q. In addition, the volume of each part of the first adhesive part 3241 is relatively small. After being heated and cooled with the same temperature rise, the cohesive force and internal stress of each part of the first adhesive part 3241 are relatively small, and the released internal stress and cohesive force are not sufficient to cause the photosensitive chip 322 to bend and deform. Under unit temperature rise heating and cooling, the deformation amount generated is smaller. Therefore, the deformation of the first adhesive part 3241 will also cause less deformation of the photosensitive chip 322, so as to ensure that the photosensitive chip 322 will not be deformed after baking;

[0183] On the other hand, after the photosensitive component 32 is baked, heated and cooled, the deformation of each part of the first adhesive portion 3241 can expand toward the spacing space Q, that is, the spacing space Q provides a reserved space for the expansion of each part of the first adhesive portion 3241, so that the internal stress and cohesion of the first adhesive portion 3241 after heating are released at the spacing space Q, and only a small part of the cohesion and internal stress of each part of the first adhesive portion 3241 is not released, and this part is released to both sides to the photosensitive chip 322 and the substrate 325, which is not enough to cause the deformation of the photosensitive chip 322 and the substrate 325, or the deformation caused by the cohesion and internal stress of this part to the photosensitive chip 322 and the substrate 325 is not enough to affect the working performance of the photosensitive component 32. When the parts of the first adhesive portion 3241 shrink after being cooled, since the volume of the parts of the first adhesive portion 3241 is small, the shrinkage of the parts of the first adhesive portion 3241 is also small, and the shrinkage of the parts of the first adhesive portion 3241 causes less deformation of the photosensitive chip 322.

[0184] Therefore, in summary, in the present embodiment, the first bonding portion 3241 is regionally divided into multiple parts to reduce the deformation under heating and cooling with the same temperature rise, and space for the first bonding portion 3241 to deform is reserved between the parts. In this way, after the baking of the photosensitive component 32 is completed, the photosensitive chip 322 will not undergo a large deformation, and the slight deformation on the photosensitive chip 322 will not affect the imaging effect of the photosensitive component 32, thereby improving the shooting performance of the camera module 30 with the photosensitive component 32 to enhance the user experience.

[0185] After forming the first bonding portion 3241 on the surface of the substrate 325 and bonding the photosensitive chip 322 to the fourth surface, the mounting method of the photosensitive chip 322 further includes:

[0186] At least a portion of the first adhesive portion 3241 is removed to form a plurality of solid portions 3241 a disposed at intervals, wherein the solid portions 3241 a and the hollow portions 3241 b are alternately disposed.

[0187] See also Fig.34 , Fig.34 The present application also provides a method for mounting a photosensitive chip 322, which includes:

[0188] like Fig.34In (a), a receiving space 3253 is formed on the substrate 325, which is recessed from the first surface 3251 to the second surface 3252, wherein the first surface 3251 and the second surface 3252 are surfaces of the substrate 325 that are disposed opposite to each other along the thickness direction of the substrate 325, and the number of the receiving space 3253 is multiple;

[0189] like Fig.34 In (b), glue is injected into the accommodating space 3253a, wherein the thickness of the glue is greater than the depth of the accommodating space 3253;

[0190] like Fig.34 (c) in which the photosensitive chip 322 is bonded to the surface of the bonding portion 324 that is away from the substrate 325, wherein a portion of the bonding portion 324 overflows the accommodation space 3253a to form a first bonding portion 3241 of the bonding portion 324, and another portion of the bonding portion 324 is located in the accommodation space 3253a to form a second bonding portion 3242 of the bonding portion 324;

[0191] like Fig.34 In (d), the substrate 325, the bonding portion 324 and the photosensitive chip 322 bonded together are baked, wherein the baking temperature is greater than or equal to 100 degrees Celsius and less than or equal to 120 degrees Celsius, and the baking time is greater than or equal to 80 seconds and less than or equal to 100 seconds.

[0192] like Fig.34 In (e), the substrate 325, the bonding portion 324 and the photosensitive chip 322 bonded together are cooled.

[0193] The difference between the mounting method of the photosensitive chip 322 of the above embodiment is that in the mounting method of the photosensitive chip 322 of the present embodiment, the bonding part 324 includes a first bonding part 3241 and a second bonding part 3242, the part of the bonding part 324 that overflows the accommodation space 3253a is the first bonding part 3241, and the part of the bonding part 324 that is located in the accommodation space 3253a is the second bonding part 3242. In this way, the accommodation space 3253a can support and fix a part of the bonding part 324 to avoid the collapse of the bonding part 324. In addition, the second bonding part 3242 of the bonding part 324 further increases the bonding area between the bonding part 324 and the substrate 325 and the photosensitive chip 322, thereby ensuring the bonding strength of the bonding part 324 to the substrate 325 and the photosensitive chip 322.

[0194] Furthermore, the adhesive portion 324 is provided in the accommodating space 3253a, and the overall thickness of the adhesive portion 324 can be reduced. Thus, the overall thickness of the photosensitive component 32 can also be reduced, which is beneficial to the thinning of the photosensitive component 32 and further beneficial to the thinning of the camera module 30.

[0195] The bonding portion 324 is divided into multiple parts to reduce the deformation under heating and cooling with the same temperature rise, and space for deformation of the bonding portion 324 is reserved between the parts. In this way, after the baking of the photosensitive component 32 is completed, the photosensitive chip 322 will not undergo a large deformation, and the slight deformation on the photosensitive chip 322 will not affect the imaging effect of the photosensitive component 32, thereby improving the shooting performance of the camera module 30 with the photosensitive component 32 to enhance the user experience.

[0196] A receiving space 3253 is formed on the substrate 325 and is recessed from the first surface 3251 to the second surface 3252 . The receiving space 3253 is a through hole extending from the first surface 3251 to the second surface 3252 .

[0197] Before injecting the adhesive portion 324 into the accommodating space 3253a, an adhesive tape is bonded to the second surface 3252;

[0198] After the accommodating space 3253a recessed from the first surface 3251 to the second surface 3252 is opened on the substrate 325, and after the substrate 325, the adhesive portion 324 and the photosensitive chip 322 bonded together are baked, the tape is torn off the second surface 3252.

[0199] In this way, when the glue is injected into the accommodating space 3253a, the adhesive tape supports the adhesive tape in the accommodating space 3253a, preventing the adhesive portion 324 from flowing out from the lower opening of the accommodating space 3253a, thereby improving the mounting efficiency of the photosensitive chip 322. In the description of this specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0200] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A camera module, characterized in that: include: Lens; A photosensitive component, the photosensitive component is located on the light-emitting side of the lens, and the photosensitive component includes: A substrate, the substrate comprising a first surface and a second surface disposed opposite to the first surface, the substrate having a receiving space recessed from the first surface toward the second surface, the opening of each receiving space located on the first surface being in a strip shape, and the openings of a plurality of the receiving spaces intersect with each other to form an intersection; A first adhesive portion, the first adhesive portion is stacked on the first surface, the first adhesive portion includes a third surface and a fourth surface that are arranged opposite to each other, the third surface faces the substrate, the first adhesive portion includes a plurality of hollow portions and a plurality of solid portions, the hollow portions extend from the third surface to the fourth surface, and the plurality of hollow portions are arranged at intervals; A second adhesive portion, the second adhesive portion is disposed in the accommodating space, and the second adhesive portion is connected to the solid portion; A photosensitive chip, the photosensitive chip is stacked on the fourth surface, and the photosensitive chip is connected to the substrate through the first bonding portion, so that the field curvature of the photosensitive chip is adapted to the field curvature of the lens; Wherein, the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the photosensitive chip are both smaller than the thermal expansion coefficient of the first bonding portion, and the first bonding portion is a thermosetting material.

2. The camera module according to claim 1, characterized in that: The solid parts and the hollow parts are arranged alternately.

3. The camera module according to claim 1, characterized in that: The accommodating space is a through hole extending from the first surface to the second surface.

4. The camera module according to claim 1, characterized in that: The accommodating space is a groove sunken from the first surface to the second surface.

5. The camera module according to any one of claims 1 to 4, characterized in that: The number of the accommodating spaces is the same as the number of the entity parts. In the stacking direction of the substrate and the photosensitive chip, the orthographic projection of the accommodating space on the first adhesive part overlaps with the area where the entity part is located.

6. The camera module according to any one of claims 1 to 4, characterized in that: In the stacking direction of the substrate and the photosensitive chip, the thickness of the first adhesive portion is greater than the thickness of the second adhesive portion.

7. The camera module according to claim 4, characterized in that: In the stacking direction of the substrate and the photosensitive chip, the ratio of the depth of the accommodating space to the thickness of the substrate is greater than or equal to 1 / 6 and less than or equal to 1 / 2.

8. The camera module according to claim 7, characterized in that: The thickness of the substrate is greater than or equal to 100 micrometers and less than or equal to 200 micrometers, and the depth of the groove is greater than or equal to 40 micrometers and less than or equal to 60 micrometers.

9. The camera module according to any one of claims 1 to 4, characterized in that: In the stacking direction of the substrate and the photosensitive chip, the thickness of the solid portion is greater than or equal to 5 microns and less than or equal to 35 microns.

10. The camera module according to any one of claims 1 to 4, characterized in that: The surface of the photosensitive chip facing the substrate is the fifth surface, and the ratio of the area of ​​the fifth surface to the sum of the areas of the multiple solid parts is greater than or equal to 4 and less than or equal to 8.

11. A method for mounting a photosensitive chip, characterized in that: include: A receiving space is provided on the substrate, which is recessed from the first surface to the second surface. The receiving space is a through hole extending from the first surface to the second surface, wherein the first surface and the second surface are surfaces of the substrate that are arranged opposite to each other along the thickness direction thereof. There are multiple receiving spaces, and the openings of the multiple receiving spaces on the first surface are in the shape of long strips, and the openings of the multiple receiving spaces cross each other, and / or the openings of the receiving spaces on the first surface extend along a curve; bonding an adhesive tape to the second surface; Injecting glue into the accommodating space, wherein the thickness of the glue is greater than the depth of the accommodating space; Bonding the photosensitive chip to the first surface, wherein a portion of the glue overflows the accommodation space to form a first bonding portion, and another portion of the glue is located in the accommodation space to form a second bonding portion; Baking the substrate, the first bonding portion, the second bonding portion, and the photosensitive chip that are bonded together, wherein the baking temperature is greater than or equal to 100 degrees Celsius and less than or equal to 120 degrees Celsius, and the baking time is greater than or equal to 80 seconds and less than or equal to 100 seconds; After baking the substrate, the first bonding portion, the second bonding portion and the photosensitive chip that are bonded together, the method for mounting the photosensitive chip further includes tearing off the tape from the second surface.

12. An electronic device, characterized in that: include: Controller; At least one camera module according to any one of claims 1-10, wherein the at least one camera module is electrically connected to the controller.

Images