Method for manufacturing a high-altitude vehicle formation light and a manufacturing mold therefor

Abstract

The application provides a manufacturing method of a high-altitude aircraft formation light and a manufacturing mold thereof, and belongs to the technical field of high-altitude aircraft external lamps. In view of the poor connection sealing performance and low strength of internal parts of the formation light, the application provides a manufacturing method of a high-altitude aircraft formation light, which comprises selecting a light-transmitting sheet and a cold light sheet; stacking the light-transmitting sheet and the cold light sheet, and forming an annular gap between the edge of the cold light sheet and the edge of the light-transmitting sheet; applying sealant along the annular gap and adhering to the edge of the cold light sheet; at least partially isolating the electrode arranged on the cold light sheet to form an isolation area, and separately pouring glue into the isolation area outside and in the isolation area of the sealed light-transmitting sheet and cold light sheet in a glue pouring cavity. The application combines the light-transmitting sheet, the cold light sheet and the electrode together in the form of glue pouring, thereby improving the sealing performance and strength of the formation light.

Description

Technical Field

[0001] This application relates to the field of external lighting technology for high-altitude aircraft, and in particular to a method for manufacturing high-altitude aircraft formation lights and its manufacturing mold. Background Technology

[0002] Formation lights are essential external lighting fixtures for high-altitude aircraft, such as modern fighter jets. Their function is to provide clear visual information about the attitude and position of high-altitude aircraft to the pilots of nearby high-altitude aircraft when they are flying in formation at night.

[0003] Formation lights are divided into Category I and Category II. The main difference between the two is that Category I formation lights emit a point light source, while Category II formation lights emit a surface light source. Because Category I formation lights can easily induce spontaneous motion illusions in pilots, potentially leading to misjudgments, Category II formation lights, with their advantages of a large luminous surface, uniform and thin light emission, and conformability to the small curvature surfaces of high-altitude aircraft, are currently widely used on high-altitude aircraft.

[0004] Because formation lights are installed on the outside of high-altitude aircraft, they are usually subjected to cyclical high and low temperature differences between the ground and high altitudes, and are exposed to sun and rain for a long time. Therefore, the reliability of the lights is required to be high.

[0005] Currently, conventional formation lights use a traditional adhesive bonding process, which involves gradually bonding several main components (light-transmitting sheet, cold light sheet, and electrodes) together with glue, and then placing the bonded components inside a bracket to provide a certain strength support. This manufacturing process is simple to operate, but the adhesive bonding process results in air bubbles between the components, especially in Category II formation lights, which have a larger surface area and therefore more air bubbles.

[0006] High-altitude aircraft operate in temperatures as low as -50°C, and upon descent to an airport, they are exposed to temperatures as high as +70°C under direct sunlight. This causes significant pressure buildup within the lights, gradually compromising the seal of the internal light-emitting components and drastically reducing the lifespan of the formation lights. Furthermore, the intense vibrations on high-altitude aircraft, especially those attached to the wings, also expose formation lights to deformation, necessitating stronger structural and manufacturing designs. Summary of the Invention

[0007] The purpose of this application is to address the problems of poor sealing and low strength of internal components in existing formation lights. Therefore, this application provides a manufacturing method and mold for high-altitude aircraft formation lights, which uses a potting process to bond the light-transmitting sheet, the cold-light sheet, and the electrodes together, reducing the generation of internal air bubbles, improving the sealing of the formation light, increasing its strength, and reducing the risk of deformation.

[0008] This application provides a method for manufacturing a formation light for a high-altitude aircraft. The formation light includes a light-transmitting sheet and a light-reducing sheet stacked together, and an electrode is disposed on the side of the light-reducing sheet opposite to the light-transmitting sheet. The manufacturing method includes:

[0009] The light-transmitting sheet and the cold-light sheet are selected, and the size of the light-transmitting sheet is larger than the size of the cold-light sheet;

[0010] The light-transmitting sheet and the cold-light sheet are stacked, such that the edge of the cold-light sheet and the edge of the light-transmitting sheet form an annular gap;

[0011] Apply sealant along the annular interval and along the edge of the light-emitting sheet to seal the light-emitting sheet and the light-transmitting sheet;

[0012] The electrodes disposed on the cold light sheet are at least partially isolated to form an isolation region, and the sealed light-transmitting sheet and the cold light sheet are respectively potted in the potting cavity to the outside and inside of the isolation region;

[0013] in,

[0014] During the potting process, the light-transmitting sheet is attached to the bottom surface of the potting cavity.

[0015] By adopting the above technical solution, the edges of the cold light sheet and the light-transmitting sheet are sealed, allowing the softer cold light sheet to bond with the harder light-transmitting sheet first through the sealant. This prevents the sealant from impacting the softer cold light sheet during subsequent glue filling, which could cause deformation of the cold light sheet. At the same time, sealing between the two prevents the sealant from flowing between them and affecting the light emission effect. Furthermore, the glue filling process combines the light-transmitting sheet, the cold light sheet, and the electrode together, improving the sealing and strength of the formation lights.

[0016] In some embodiments, the electrodes disposed on the electroluminescent sheet are at least partially isolated to form an isolation region, and the sealed light-transmitting sheet and the electroluminescent sheet are respectively potted within the potting cavity, both outside and inside the isolation region, including:

[0017] The electrodes disposed on the cold light sheet are completely isolated using a first isolation fixture to form a first isolation region;

[0018] After sealing, the light-transmitting sheet and the cold light sheet are first filled with glue in the glue-filling cavity to the outside of the first isolation area, and the glue is filled to a preset thickness. The preset thickness is the main body thickness of the formed formation light. The preset thickness is set according to the required strength of the formation light.

[0019] After the first potting, the first isolation fixture is removed from the light-transmitting sheet and the cold light sheet, and the electrode is isolated using a second isolation fixture to form a second isolation area;

[0020] A second gluing process is performed within the second isolation area.

[0021] In some embodiments, the electrodes disposed on the electroluminescent sheet are at least partially isolated to form an isolation region, and the sealed light-transmitting sheet and the electroluminescent sheet are respectively potted within the potting cavity, both outside and inside the isolation region, including:

[0022] The electrodes are partially isolated by a second isolation fixture to form a second isolation area. The distance between the bottom surface of the second isolation fixture and the light-transmitting sheet is the same as the preset thickness. The preset thickness is the main body thickness of the formed formation light. The preset thickness is set according to the required strength of the formation light.

[0023] After sealing, the light-transmitting sheet and the cold light sheet are first filled with glue in the glue-filling cavity to the outside of the second isolation area, and the initial filling thickness is reached, which is less than the preset thickness.

[0024] A second gluing process is performed simultaneously within and outside the second isolation area, with the gluing outside the second isolation area reaching the preset thickness.

[0025] In some embodiments, both the sealant and the adhesive used for potting are epoxy resin adhesives.

[0026] In some embodiments, an electrode pad is provided on the side of the cold light sheet facing away from the light-transmitting sheet, and the electrode is riveted to the pad lead of the electrode pad.

[0027] In some embodiments, the second isolation fixture is connected to the electrode via a detachable connector.

[0028] Another embodiment of this application provides a manufacturing mold for a high-altitude aircraft formation light. The formation light includes a light-transmitting sheet and a cold-light sheet stacked together, and an electrode is disposed on the side of the cold-light sheet opposite to the light-transmitting sheet. The manufacturing mold is used for potting the formation light. The manufacturing mold includes:

[0029] The lower mold has a glue-filling cavity for horizontally accommodating the light-transmitting sheet and the cold-light sheet that are stacked together.

[0030] The second isolation fixture includes a flexible cover and a rigid cover that is detachably disposed outside the flexible cover. The flexible cover is used to at least partially cover the electrode and form a second isolation area for potting glue inside or outside the second isolation area. The top surface of the flexible cover has a covering area that corresponds to the electrode end face. The top surface shape of the rigid cover corresponds to the top surface shape of the flexible cover. The rigid cover is detachably connected to the lower mold.

[0031] In some embodiments, a limiting member is further included, which is detachably connected to the lower mold and abuts against the edge of the light-transmitting sheet to limit the position of the light-transmitting sheet within the potting cavity.

[0032] In some embodiments, the limiting member includes a plurality of spaced-apart abutments, the sides of which abut against the edge of the light-transmitting sheet.

[0033] In some embodiments, a first isolation fixture detachably connected to the lower mold is further included. The first isolation fixture has a first isolation cavity for completely isolating the electrode and forming a first isolation region for potting adhesive between the potting cavity and the first isolation region.

[0034] Other features and corresponding beneficial effects of the present invention will be described in the latter part of the specification, and it should be understood that at least some of the beneficial effects will become obvious from the description in the specification. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of the mold used to manufacture the present invention.

[0036] Figure 2 This is an exploded view of the mold used to manufacture the present invention;

[0037] Figure 3 This is a schematic diagram of the flexible cover used in the manufacturing mold.

[0038] Figure 4 This is a schematic diagram of the rigid cover of the mold used in this manufacturing process;

[0039] Figure 5 A schematic diagram of the positioning component for manufacturing the mold of this invention;

[0040] Figure 6 This is a schematic diagram of the structure in which the light-transmitting sheet and the cold light sheet are placed in the potting cavity in this invention;

[0041] Figure 7 This is a schematic diagram showing the edge of the electroluminescent sheet after applying sealant.

[0042] Figure 8 This is a schematic diagram of the product placed inside the glue-filling cavity after the second glue-filling is completed according to the present invention.

[0043] Explanation of reference numerals in the attached diagram: 1. Transmitting sheet; 2. Cold light sheet; 21. Sealing ring; 3. Solder pad lead; 4. Electrode; 5. First potting layer; 6. Second potting layer;

[0044] 100. Lower mold; 101. Glue filling cavity; 102. Locating pin; 103. Locating hole; 104. Fastener; 110. Level;

[0045] 200. Flexible cover; 201. Coverage area; 202. Opening area;

[0046] 300. Rigid cover; 301. Limiting surface; 310. Connecting wing;

[0047] 400. Limiting component; 410. Abutment part. Detailed Implementation

[0048] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a deep understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0049] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0050] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0052] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0053] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0054] Formation lights are lights installed on the outside of high-altitude aircraft and conform to its curved surface. A formation light includes a light-transmitting sheet and a cold-light sheet stacked together. The cold-light sheet has a pad area on the side facing away from the light-transmitting sheet. Electrode pads are located within the pad area, and electrodes are mounted on the electrode pads. When a specific signal is input through the electrodes, the cold-light sheet begins to emit light.

[0055] Example 1:

[0056] like Figure 1-2 As shown, this embodiment provides a manufacturing mold for high-altitude aircraft formation lights, applied to the glue-filling manufacturing of formation lights. More preferably, the size of the light-transmitting sheet 1 of the formation light manufactured by this mold is larger than the size of the cold-light sheet 2. It should be noted that the size of the light-transmitting sheet 1 being larger than the size of the cold-light sheet 2 means that when the two are stacked, the cold-light sheet 2 can be completely located within the orthographic projection of the light-transmitting sheet 1. Typically, both the light-transmitting sheet 1 and the cold-light sheet 2 are rectangular sheets. In this case, the size of the light-transmitting sheet 1 being larger than the size of the cold-light sheet 2 means that the length and width of the light-transmitting sheet 1 are both larger than the length and width of the cold-light sheet 2.

[0057] The manufacturing mold includes a lower mold 100 and a second isolation fixture detachably connected to the lower mold 100.

[0058] In one embodiment, the lower mold 100 has a potting cavity 101 for horizontally accommodating the stacked light-transmitting sheet 1 and the cold-light sheet 2. It is understood that the surface area of ​​the potting cavity 101 is greater than the larger surface area of ​​the light-transmitting sheet 1 and the cold-light sheet 2; that is, in this embodiment, the surface area of ​​the potting cavity 101 is greater than the surface area of ​​the light-transmitting sheet 1, and the depth of the potting cavity 101 is greater than the total thickness of the stacked light-transmitting sheet 1 and the cold-light sheet 2, so that during potting, the adhesive can cover the light-transmitting sheet 1 and the cold-light sheet 2, and bond them together as a whole.

[0059] In one embodiment, the edge of the potting cavity 101 is spaced from the edge of the light-transmitting sheet 1 by no less than 3 mm to ensure good bonding strength. The depth of the potting cavity 101 is greater than the total thickness of the light-transmitting sheet 1 and the cold light sheet 2 after being stacked, and the difference between the two is no less than 3 mm to ensure the strength of the light-transmitting sheet 1 and the cold light sheet 2 after bonding, that is, to improve the intensity of the formation lights.

[0060] It should be noted that the total thickness of the light-transmitting sheet 1 and the cold light sheet 2 after being stacked is the preset thickness, which is the main body thickness of the formed formation light, that is, the total thickness of the adhesive layer, the light-transmitting sheet 1 and the cold light sheet 2 (excluding the thickness of the electrode part). The preset thickness is set according to the required intensity of the formation light.

[0061] In one embodiment, the manufacturing mold is used to manufacture formation lights using self-leveling adhesive. Self-leveling adhesive refers to the application of an adhesive with automatic or slightly assisted leveling functions to the layered light-transmitting sheet 1 and the cold-light sheet 2 within the adhesive cavity 101 of the lower mold 100 in this embodiment, after stirring and spreading. The self-leveling adhesive utilizes the free flow of the adhesive under gravity to evenly and smoothly wrap the layered light-transmitting sheet 1 and the cold-light sheet 2, making them a unified whole with high strength. Furthermore, the self-leveling adhesive contains virtually no air bubbles, resulting in strong sealing between the light-transmitting sheet 1 and the cold-light sheet 2. Simultaneously, the adhesive, under gravity, compresses the layered light-transmitting sheet 1 and the cold-light sheet 2, causing them to adhere to the bottom surface of the mold, i.e., the bottom surface of the adhesive cavity 101 in this embodiment, reducing the adhesion of the adhesive to the side of the light-transmitting sheet 1 away from the cold-light sheet 2, thus minimizing its impact on the light-emitting effect.

[0062] At this time, the lower mold 100 may be equipped with a level 110 to facilitate the measurement of the levelness of the glue-filling cavity 101; furthermore, the glue-filling cavity 101 is a rectangular cavity, and a level 110 is provided on both the length and width sides of the glue-filling cavity 101 to improve the accuracy of the measurement of the levelness of the glue-filling cavity 101.

[0063] like Figure 3As shown, in one embodiment, the second isolation fixture includes a flexible cover 200. The flexible cover 200 is used to at least partially cover the electrode 4 and form a second isolation region for potting glue inside or outside the second isolation region. Potting glue inside the second isolation region is equivalent to potting glue onto the electrode 4, which improves the connection stability and strength between the electrode 4 and the cold light sheet 2. Potting glue outside the second isolation region makes the light-transmitting sheet 1 and the cold light sheet 2 integrated, improving the connection stability and strength between the two. Furthermore, the flexible cover 200 is easily deformable, facilitating demolding. It can be understood that the flexible cover 200 has a first cover cavity, and the electrode 4 is located in the first cover cavity, thereby realizing that the flexible cover 200 at least partially covers the electrode 4 and forms the second isolation region.

[0064] like Figure 4 As shown, in one embodiment, the second isolation fixture further includes a rigid cover 300. The rigid cover 300 is detachably mounted on the outside of the flexible cover 200 to limit the relative position of the flexible cover 200 and the pad area, preventing displacement of the flexible cover 200 during adhesive application, which could lead to improper electrode adhesive formation. It also limits the deformation of the flexible cover 200, preventing excessive adhesive application that could cause deformation and result in a significant difference between the solidified shape of the adhesive in the electrode 4 area and the desired shape. It is understood that the rigid cover 300 precisely covers the flexible cover 200, with their contact surfaces tightly fitted, thereby limiting the deformation of the flexible cover 200. It should be noted that the rigid cover 300 is less prone to deformation relative to the flexible cover 200.

[0065] In one embodiment, the rigid cover 300 is detachably connected to the lower mold 100. For example, the rigid cover 300 has a connecting wing 310 extending outward, and the connecting wing 310 is detachably connected to the positioning hole 103 of the lower mold 100 via a fastener 104.

[0066] In one embodiment, the rigid cover 300 has a limiting surface 301 facing the potting cavity 101 of the lower mold 100, which can limit the potting thickness.

[0067] In one embodiment, the top surface of the flexible cover 200 has a covering area 201, which corresponds to the end face of the electrode 4 in the pad area, thereby covering the end face of the electrode 4 and preventing the end face of the electrode 4 from being covered by the adhesive during potting, which would prevent it from being able to conduct to the outside and emit light.

[0068] In one embodiment, the top surface of the flexible cover 200 also has an opening area 202, which is connected to the first cover cavity, thereby enabling the injection of adhesive into the second isolation area within the first cover cavity.

[0069] Understandably, at this time, the top surface shape of the rigid cover 300 corresponds to the top surface shape of the flexible cover 200, that is, it has the same covering surface and opening surface.

[0070] In one embodiment, the electrode 4 is an electrode 4 with internal threads extending through both ends. The manufacturing mold also includes a fastener 104 adapted to the internal threads of the electrode 4. When potting the electrode 4 with glue, the fastener 104 is first passed through the rigid cover 300 and the flexible cover 200 and then detachably connected to the electrode 4, so that the electrode 4 is connected to the rigid cover 300, thereby improving the stability of the electrode 4 during potting.

[0071] In one embodiment, the manufacturing mold further includes a limiting member 400, which is detachably connected to the lower mold 100 and abuts against the edge of the light-transmitting sheet 1 to limit the position of the light-transmitting sheet 1 within the potting cavity 101.

[0072] In one embodiment, two limiting members 400 are provided, corresponding to both ends of the light-transmitting sheet 1.

[0073] like Figure 5 As shown, in one embodiment, the limiting member 400 includes a plurality of abutment portions 410, the sides of which abut against the edge of the light-transmitting sheet 1. The plurality of abutment portions 410 are spaced apart, so that during dispensing, the adhesive can flow more smoothly from the gaps between adjacent abutment portions 410, improving the flowability of the adhesive and thus improving the adhesive formation effect.

[0074] In one embodiment, there are three abutment portions 410, and the three abutment portions 410 form a groove shape to abut against the end face and two sides of the light-transmitting sheet 1 respectively, so as to achieve stable positioning of the light-transmitting sheet 1 in the horizontal direction.

[0075] In one embodiment, the manufacturing mold further includes a first isolation fixture detachably connected to the lower mold 100. The first isolation fixture has a first isolation cavity for completely isolating the electrode 4, i.e., completely isolating the pads on the electroluminescent sheet 2, and forming a first isolation area for potting adhesive between the potting cavity 101 and the first isolation area, thereby making the stacked light-transmitting sheet 1 and electroluminescent sheet 2 form a whole. This is particularly suitable when the electrode 4 is not installed on the pads, to avoid the adhesive covering the pads, making it impossible to set the electrode 4. It is also particularly suitable when the first potting layer 5 is formed using a one-time potting process, as the formation of the first potting layer 5 requires a large amount of adhesive, which can cause the electrode 4 to be impacted and skewed, or even cause it to loosen its connection with the pads, affecting the light-emitting effect.

[0076] In one embodiment, the lower mold 100 is provided with a plurality of positioning pins 102 and / or positioning holes 103 around the potting cavity 101. The edges of the first isolation fixture and / or the second isolation fixture are detachably connected to the plurality of positioning pins 102 and / or positioning holes 103. The edges of the rigid cover 300 are detachably connected to the plurality of positioning pins 102 and / or positioning holes 103. The edges of the limiting member 400 are detachably connected to the plurality of positioning pins 102 and / or positioning holes 103.

[0077] Example 2:

[0078] A method for manufacturing a formation light for a high-altitude aircraft involves using an encapsulation process to bond a light-transmitting sheet 1, a cold light sheet 2, and an electrode 4 together. This reduces the generation of internal air bubbles, improves the sealing performance of the formation light, and increases its strength, thereby reducing the risk of deformation. Furthermore, since its strength already meets the requirements, no additional support frame is needed.

[0079] Specifically, the manufacturing method includes:

[0080] Select a light-transmitting sheet 1 and a cool-light sheet 2, with the size of the light-transmitting sheet 1 being larger than the size of the cool-light sheet 2. Preferably, the length and width of the light-transmitting sheet 1 are 3mm or more larger than the length and width of the cool-light sheet 2, which facilitates the subsequent application of sealant and allows the light-transmitting sheet 1 and the cool-light sheet 2 to better bond together through the sealant at the edges of the light-transmitting sheet 1 and the cool-light sheet 2 during the first application of sealant, thereby improving their sealing performance.

[0081] like Figure 6 As shown, a light-transmitting sheet 1 and a cold-light sheet 2 are stacked, with the edge of the cold-light sheet 2 forming a ring-shaped gap with the edge of the light-transmitting sheet 1. That is, the light-transmitting sheet 1 covers the cold-light sheet 2, and the edges of the light-transmitting sheet 1 and the cold-light sheet 2 have an uninterrupted gap. Preferably, the cold-light sheet 2 is located at the center of the light-transmitting sheet 1, which facilitates subsequent trimming and shaping.

[0082] Apply sealant along the annular interval and along the edge of the cold light sheet 2, i.e. Figure 7 As shown, a sealing ring 21 is formed at the edge of the cold light sheet 2 to seal the cold light sheet 2 and the light-transmitting sheet 1. Preferably, the sealant is epoxy resin, which has good adhesion and stability. Moreover, the light-transmitting sheet used in the formation light is itself an epoxy resin material. After being combined, they have very similar shrinkage rates, which can improve the surface smoothness of the formation light. At the same time, the epoxy resin also has a certain elasticity after curing, which can achieve better protection for the various components of the formation light.

[0083] The sealant can be BP-839 type adhesive, which dries slowly in 24 hours and can withstand low temperatures of -55℃ and high temperatures of 100℃.

[0084] Preferably, to ensure that the light-emitting sheet 2 and the light-transmitting sheet 1 do not shift relative to each other when the sealant is applied, a fast-drying adhesive, such as AB epoxy structural adhesive, is used to fix the four corners of both before applying the sealant.

[0085] Electrodes 4, which are at least partially isolated on the cold light sheet 2, are used to form an isolation area. Then, glue is applied to the outside and inside of the isolation area in the glue-filling cavity 101 after the light-transmitting sheet 1 and the cold light sheet 2 are sealed. This combines the light-transmitting sheet 1, the cold light sheet 2 and the electrodes 4 together, reduces the generation of internal bubbles, improves the sealing of the formation lights, and increases the strength of the formation lights, reducing their deformation risk.

[0086] In one embodiment, during the potting process, the light-transmitting sheet 1 is attached to the bottom surface of the potting cavity 101 to minimize the contact between the front surface of the light-transmitting sheet 1 and the adhesive, thereby ensuring the smoothness of the front surface of the light-transmitting sheet 1.

[0087] In one embodiment, the electrode 4 disposed on the electroluminescent sheet 2 is at least partially isolated to form an isolation region, and the sealed light-transmitting sheet 1 and electroluminescent sheet 2 are respectively potted in the potting cavity 101, both outside and inside the isolation region, including:

[0088] The second isolation fixture is used to partially isolate the electrode 4 to form a second isolation area. The distance between the bottom surface of the second isolation fixture and the light-transmitting sheet 1 is the same as the preset thickness. The preset thickness is the main body thickness of the formed formation light. The preset thickness is set according to the required strength of the formation light.

[0089] Partial isolation refers to the gap between the bottom surface of the second isolation fixture and the cold light sheet 2, which allows the adhesive to flow within and outside the second isolation area during dispensing.

[0090] After sealing, the light-transmitting sheet 1 and the cold light sheet 2 are first filled with glue in the glue-filling cavity to the outside of the second isolation area, and the initial filling thickness is less than the preset thickness, so as to form part of the first glue-filling layer 5.

[0091] For example, the lower mold 100 of the manufacturing mold in Embodiment 1 is used, and the glue-filling cavity 101 of the lower mold 100 is the glue-filling cavity 101 in this embodiment; and the second isolation fixture of the manufacturing mold in Embodiment 1 is used to partially isolate the electrode 4 to form a second isolation area. More preferably, the flexible cover 200 and the rigid cover 300 are used together to achieve isolation, which facilitates demolding.

[0092] A second gluing is performed simultaneously inside and outside the second isolation area, and the gluing outside the second isolation area is performed to a preset thickness, so that the two gluings form the first gluing layer 5 and the second gluing forms the second gluing layer 6.

[0093] Since part of the first potting layer 5 is potted and formed simultaneously with the second potting layer 6, the bonding between the two is good, which improves the connection stability and strength between the electrode 4 and the cold light sheet 2.

[0094] In other alternative embodiments, the electrodes 4 disposed on the electroluminescent sheet 2 are at least partially isolated to form an isolation region, and the sealed light-transmitting sheet 1 and electroluminescent sheet 2 are respectively potted in the potting cavity 101, both outside and inside the isolation region, including:

[0095] The electrode 4, which is disposed on the electroluminescent sheet 2, is completely isolated using a first isolation fixture to form a first isolation area. Complete isolation means that the bottom surface of the first isolation fixture is in contact with the electroluminescent sheet 2 to prevent the adhesive from flowing into the first isolation area during potting.

[0096] For example, the first isolation fixture of the manufacturing mold in Embodiment 1 is used to completely isolate the pad area of ​​the cold light sheet 2 to form a first isolation area.

[0097] After sealing, the light-transmitting sheet 1 and the cold light sheet 2 are first filled with glue in the glue filling cavity 101 to the outside of the first isolation area, and the glue is filled to a preset thickness. The preset thickness is set according to the required intensity of the formation lights to form the first glue filling layer 5.

[0098] After the first potting, the first isolation fixture is removed from the light-transmitting sheet 1 and the cold light sheet 2, and the electrode is isolated using the second isolation fixture to form a second isolation area. Preferably, the bottom surface of the second isolation fixture is flush with the upper surface of the first potting layer 5, so that when the electrode is potted, the adhesive, i.e., part of the second potting layer 6, can contact the first potting layer 5 to achieve connection.

[0099] A second layer of adhesive is applied to the second isolation area to form a second adhesive layer 6, ultimately as follows: Figure 8 As shown.

[0100] In this method, the electrode 4 can be connected to the cold light sheet 2 after the first gluing and before the second gluing.

[0101] In one embodiment, epoxy resin is used for potting.

[0102] In one implementation, self-leveling adhesive is used for potting.

[0103] Self-leveling compounding refers to the application of a self-leveling compound, after stirring, to the layered light-transmitting sheet 1 and the cool-light sheet 2 within the compounding cavity 101 of the lower mold 100 in this embodiment. The compound has automatic or slightly assisted leveling functions. The self-leveling compound utilizes the free flow of the compound under gravity to evenly and smoothly wrap the layered light-transmitting sheet 1 and the cool-light sheet 2, making them a unified whole with high strength. Furthermore, the self-leveling compound contains virtually no air bubbles, resulting in strong sealing between the light-transmitting sheet 1 and the cool-light sheet 2. Simultaneously, the compound, under gravity, compresses the layered light-transmitting sheet 1 and the cool-light sheet 2, causing them to adhere to the bottom surface of the mold, i.e., the bottom surface of the compounding cavity 101 in this embodiment, reducing the amount of compound adhering to the side of the light-transmitting sheet 1 away from the cool-light sheet 2, thus minimizing its impact on the light-emitting effect.

[0104] In one embodiment, the second isolation fixture is connected to the electrode 4 via a detachable connector. For example, the electrode 4 is an electrode with through-ends and internal threads, and the detachable connector is a fastener 104 adapted to the internal threads of the electrode 4. When potting the electrode 4, the fastener 104 is first passed through the second isolation fixture and then detachably connected to the electrode 4, so that the electrode 4 is connected to the second isolation fixture, thereby improving the stability of the electrode 4 during potting.

[0105] In one embodiment, electrode 4 is riveted to the pad lead 3 of electrode pad, thereby improving the connection stability between electrode 4 and electrode pad.

[0106] In one embodiment, the light-transmitting sheet 1 is processed from FR sheet material, where FR is a composite material composed of fiberglass cloth and epoxy resin. The cold light sheet 2 is fabricated using ITO substrate technology.

[0107] In one embodiment, the glue-filling area is evacuated simultaneously with the glue-filling process, which can further reduce the generation of air bubbles.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a formation light for a high-altitude aircraft, the formation light comprising a light-transmitting sheet and a light-reducing sheet stacked together, wherein an electrode is disposed on the side of the light-reducing sheet opposite to the light-transmitting sheet, characterized in that, The manufacturing method includes: The light-transmitting sheet and the cold-light sheet are selected, and the size of the light-transmitting sheet is larger than the size of the cold-light sheet; The light-transmitting sheet and the cold-light sheet are stacked, such that the edge of the cold-light sheet and the edge of the light-transmitting sheet form an annular gap; Apply sealant along the annular interval and along the edge of the light-emitting sheet to seal the light-emitting sheet and the light-transmitting sheet; The electrodes disposed on the cold light sheet are at least partially isolated to form an isolation region, and the sealed light-transmitting sheet and the cold light sheet are respectively potted in the potting cavity to the outside and inside of the isolation region; During the potting process, the light-transmitting sheet is attached to the bottom surface of the potting cavity; The process involves at least partially isolating the electrodes on the cold light sheet to form an isolation region. Then, after sealing, the light-transmitting sheet and the cold light sheet are filled with adhesive both outside and inside the isolation region within the adhesive filling cavity. This includes: using a first isolation fixture to completely isolate the electrodes on the cold light sheet to form a first isolation region; performing a first adhesive filling on the sealed light-transmitting sheet and the cold light sheet outside the first isolation region within the adhesive filling cavity, reaching a preset thickness, which is the thickness of the main body of the formed formation light, and the preset thickness is set according to the required strength of the formation light; removing the first isolation fixture from the light-transmitting sheet and the cold light sheet after the first adhesive filling, and using a second isolation fixture to isolate the electrodes to form a second isolation region; and performing a second adhesive filling within the second isolation region. or, The electrodes, at least partially isolated on the cold light sheet, form an isolation region. The sealed light-transmitting sheet and the cold light sheet are then filled with adhesive within a potting cavity, both outside and inside the isolation region. This includes: using a second isolation fixture to partially isolate the electrodes, forming a second isolation region, where the distance between the bottom surface of the second isolation fixture and the light-transmitting sheet is the same as a preset thickness, which is the thickness of the main body of the formed formation light. The preset thickness is set according to the required strength of the formation light; a first potting process is performed on the sealed light-transmitting sheet and the cold light sheet within the potting cavity, reaching an initial potting thickness less than the preset thickness; and a second potting process is performed simultaneously inside and outside the second isolation region, with the outer part of the second isolation region potted to the preset thickness.

2. The method for manufacturing high-altitude aircraft formation lights according to claim 1, characterized in that, The sealant and the adhesive used for potting are both epoxy resin adhesives.

3. The method for manufacturing high-altitude aircraft formation lights according to claim 1, characterized in that, The cold light sheet has an electrode pad on the side opposite to the light-transmitting sheet, and the electrode is riveted to the lead wire of the electrode pad.

4. The method for manufacturing high-altitude aircraft formation lights according to claim 1, characterized in that, The second isolation fixture is connected to the electrode via a detachable connector.

5. The method for manufacturing high-altitude aircraft formation lights according to claim 1, characterized in that, The formation lights are manufactured using a mold applied to the glue-pouring process, the mold comprising: The lower mold has the glue-filling cavity, which is used to horizontally accommodate the light-transmitting sheet and the cold light sheet that are stacked together; The second isolation fixture includes a flexible cover and a rigid cover that is detachably disposed outside the flexible cover. The flexible cover is used to at least partially cover the electrode and form a second isolation area for potting glue inside or outside the second isolation area. The top surface of the flexible cover has a covering area that corresponds to the end face of the electrode. The top surface shape of the rigid cover corresponds to the top surface shape of the flexible cover. The rigid cover is detachably connected to the lower mold.

6. The method for manufacturing high-altitude aircraft formation lights according to claim 5, characterized in that, The mold also includes a limiting member, which is detachably connected to the lower mold and abuts against the edge of the light-transmitting sheet to limit the position of the light-transmitting sheet within the potting cavity.

7. The method for manufacturing high-altitude aircraft formation lights according to claim 6, characterized in that, The limiting member includes a plurality of spaced-apart abutments, the sides of which abut against the edge of the light-transmitting sheet.

8. The method for manufacturing high-altitude aircraft formation lights according to claim 5, characterized in that, The mold also includes a first isolation fixture detachably connected to the lower mold. The first isolation fixture has a first isolation cavity for completely isolating the electrode and forming a first isolation area for potting glue between the potting cavity and the first isolation area.

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