A method for batch stamping of a granular puzzle

Abstract

The present application relates to a kind of mould batch stamping manufacturing methods of particle jigsaw puzzle, comprising the following steps: first, the raw material plate is made, and the raw material plate is provided with pattern layer, second, the raw material plate is fixed on the first set of stamping die, and first stamping is carried out, and first stamping area is formed on the raw material plate, and the first stamping area has first stamping boundary, third, the raw material plate is fixed on the second set of stamping die, and second stamping is carried out, and second stamping area is formed on the raw material plate, and the second stamping area has second stamping boundary, and the second stamping area is staggered with the first stamping area, and a plurality of component areas are formed around by the first stamping boundary and the second stamping boundary, fourth, third stamping is carried out, and a plurality of the component areas on the raw material plate are simultaneously separated from the raw material plate.

Description

Technical Field

[0001] This invention relates to a method for manufacturing particle puzzles, and more particularly to a method for mass-producing particle puzzles using a stamping die. Background Technology

[0002] As an educational toy, piecework puzzles have become widely accepted. Also known as jigsaw puzzles, they involve cutting a flat surface into numerous small, irregularly shaped pieces that can be combined to form various shapes, models, and scenes. As an educational toy, they can help develop children's problem-solving skills, improve their observation and fine motor skills, and, when played by multiple people, foster teamwork.

[0003] Particle puzzle toys consist of numerous parts, but these parts generally have uniform or similar dimensions. Currently, particle puzzle toys are typically manufactured using two methods. The first is cutting, which involves using lasers or other cutting equipment to cut individual parts from a raw material sheet. Its main disadvantages are high production costs and low production efficiency. The second is die-stamping, which uses multiple sets of die-stamping dies to process the parts individually. For example, when a particle puzzle toy includes three parts, three sets of dies are used for production. However, these dies require "bleed areas," which have significant raw material waste and limited production output in mass production. ("Bleed areas" refer to the portion of raw material reserved during stamping to allow for cutting and physical extension of the raw material). These are the main drawbacks of the existing technologies. Summary of the Invention

[0004] The technical solution adopted in this invention is as follows: a method for mass production of particle puzzle molds by stamping, comprising the following steps: First, making a raw material plate with a pattern layer; Second, fixing the raw material plate on a first set of stamping dies and performing a first stamping to form a first stamping area on the raw material plate, the first stamping area having a first stamping boundary; Third, fixing the raw material plate on a second set of stamping dies and performing a second stamping to form a second stamping area on the raw material plate, the second stamping area having a second stamping boundary, the second stamping area intersecting with the first stamping area, and forming several component areas around the first and second stamping boundaries; Fourth, fixing the raw material plate on a third set of stamping dies and performing a third stamping to simultaneously separate the several component areas from the raw material plate, and breaking the several component areas apart to form several finished particle puzzle components.

[0005] The first set of stamping dies includes a first top die and a first bottom die. A first transverse stamping block is protruding on the bottom surface of the first top die, and a first transverse stamping groove is recessed on the top surface of the first bottom die. The first transverse stamping block and the first transverse stamping groove correspond to each other. The first stamping area is transversely arranged on the raw material plate. The second set of stamping dies includes a second top die and a second bottom die. A second longitudinal stamping block is protruding on the bottom surface of the second top die, and a second longitudinal stamping groove is recessed on the top surface of the second bottom die. The second longitudinal stamping block and the second longitudinal stamping groove correspond to each other. The second stamping area is longitudinally arranged on the raw material plate.

[0006] The third set of stamping dies includes a third top die and a third bottom die. A third separating punch is protruding on the bottom surface of the third top die, and a third separating groove is recessed on the top surface of the third bottom die. The third separating punch corresponds to the third separating groove.

[0007] The raw material plate has several positioning holes around its perimeter. A first positioning pin is provided on the first set of stamping dies, with each positioning hole corresponding to one of the first positioning pins. The first positioning pin passes through the positioning hole to fix the raw material plate onto the first set of stamping dies. A second positioning pin is provided on the second set of stamping dies, with each positioning hole corresponding to one of the second positioning pins. The second positioning pin passes through the positioning hole to fix the raw material plate onto the second set of stamping dies. A third positioning pin is provided on the third set of stamping dies, with each positioning hole corresponding to one of the third positioning pins. The third positioning pin passes through the positioning hole to fix the raw material plate onto the third set of stamping dies.

[0008] The raw material board is made of PP, PVC, or PS material. Its thickness ranges from 1.5mm to 3mm. The printed material and transparent material are bonded together using a shadowless lamination technique to form the raw material board.

[0009] The beneficial effects of this invention are as follows: This invention uses a two-stage stamping and resetting process followed by external stamping to shape the granular puzzle product. It eliminates the need for external "bleed" areas on each granule during stamping, allowing for the bonding of 1.5-3mm PP, PVC, PS, and other materials with printing and shadowless lamination techniques. The resulting granular puzzle, processed with a stamping die, is more durable and tightly joined than traditional paper granular puzzles. The granular puzzle material of this invention is water-resistant, moisture-proof, and can be repeatedly assembled without fading. The mold of this invention features a specially designed and improved stamping sequence and method, facilitating pattern changes and layout. The manufacturing and processing method of this invention is the fastest and most convenient among similar products, improving efficiency by nearly six times compared to existing products using acrylic UV printing followed by laser and engraving machines. The processed products are more aesthetically pleasing, the finished puzzle is more robust and less prone to falling apart, making it suitable for mass production and offering a more competitive price. Attached Figure Description

[0010] Figure 1 This is a schematic diagram illustrating the second step of the present invention.

[0011] Figure 2 This is a schematic diagram illustrating the third step of the present invention.

[0012] Figure 3 This is a schematic diagram illustrating the fourth step of the present invention.

[0013] Figure 4 This is a schematic diagram of the first stamping area and the first stamping boundary of the present invention.

[0014] Figure 5 This is a schematic diagram of the second stamping area and the second stamping boundary of the present invention.

[0015] Figure 6 This is a schematic diagram illustrating how the present invention breaks down several component areas to form several finished particle puzzle parts.

[0016] Figure 7 This is a schematic diagram of the first set of stamping dies of the present invention.

[0017] Figure 8 This is a schematic diagram of the second set of stamping dies of the present invention.

[0018] Figure 9 This is a schematic diagram of the third set of stamping dies of the present invention. Detailed Implementation

[0019] like Figures 1 to 9 As shown, a method for mass-producing a mold for a particle puzzle includes the following steps:

[0020] Step 1: Make raw material board 10.

[0021] The raw material plate 10 has a pattern layer, which can be a cat and dog pattern, a landscape painting, or other patterns.

[0022] In practice, the raw material board 10 is made of materials such as PP, PVC, and PS.

[0023] The thickness of the raw material plate 10 is between 1.5mm and 3mm.

[0024] In actual production, 1.5-3mm PP, PVC, or PS materials can be combined with other transparent materials of different thicknesses through printing processes and shadowless lamination technology to form the raw material board 10. After processing, it is more durable than traditional paper-based puzzle pieces and the splicing is tighter. The aforementioned puzzle material is water-resistant, moisture-proof, and can be repeatedly assembled without fading.

[0025] The second step is to fix the raw material plate 10 onto the first stamping die 20 and perform the first stamping to form the first stamping area 100 on the raw material plate 10.

[0026] The first stamping area 100 has a first stamping boundary 110.

[0027] In practice, the raw material plate 10 is provided with several positioning holes 12 around its perimeter. Corresponding to the positioning holes 12, a first positioning pin 21 is provided on the first set of stamping molds 20. The positioning holes 12 correspond one-to-one with the first positioning pin 21. The first positioning pin 21 passes through the positioning holes 12 to fix the raw material plate 10 on the first set of stamping molds 20.

[0028] In specific implementation, the first set of stamping dies 20 includes a first top die 22 and a first bottom die 23. A first transverse stamping block 221 is protruding on the bottom surface of the first top die 22, and a first transverse stamping groove 231 is recessed on the top surface of the first bottom die 23. The first transverse stamping block 221 corresponds to the first transverse stamping groove 231. The first stamping area 100 is transversely arranged on the raw material plate 10.

[0029] The third step is to fix the raw material plate 10 onto the second set of stamping dies 30 and perform a second stamping to form a second stamping area 200 on the raw material plate 10.

[0030] The second stamping region 200 has a second stamping boundary 210.

[0031] In practice, corresponding to several positioning holes 12, a second positioning pin 31 is provided on the second set of stamping mold 30. The positioning hole 12 and the second positioning pin 31 correspond one-to-one. The second positioning pin 31 passes through the positioning hole 12 to fix the raw material plate 10 on the second set of stamping mold 30.

[0032] In specific implementation, the second set of stamping dies 30 includes a second top die 32 and a second bottom die 33. A second longitudinal stamping block 321 is protruding on the bottom surface of the second top die 32, and a second longitudinal stamping groove 331 is recessed on the top surface of the second bottom die 33. The second longitudinal stamping block 321 corresponds to the second longitudinal stamping groove 331.

[0033] The second stamping area 200 is longitudinally arranged on the raw material plate 10. The second stamping area 200 intersects with the first stamping area 100, and several component areas 300 are formed around it by means of the first stamping boundary 110 and the second stamping boundary 210.

[0034] The fourth step is to fix the raw material plate 10 onto the third set of stamping dies 40 and perform a third stamping. This will separate several component areas 300 from the raw material plate 10 at the same time and break them apart to form several finished particle puzzle parts 310.

[0035] In practice, a third positioning pin 41 is provided on the third set of stamping dies 40 in correspondence with several positioning holes 12. The positioning holes 12 and the third positioning pin 41 correspond one-to-one. The third positioning pin 41 passes through the positioning holes 12 to fix the raw material plate 10 on the third set of stamping dies 40.

[0036] In specific implementation, the third set of stamping dies 40 includes a third top die 42 and a third bottom die 43. A third separating punch block 421 is protruding on the bottom surface of the third top die 42, and a third separating punch groove 431 is recessed on the top surface of the third bottom die 43. The third separating punch block 421 corresponds to the third separating punch groove 431.

Claims

1. A method for mass-producing a mold for a particle puzzle, characterized in that, Includes the following steps: The first step is to create a raw material board, which has a pattern layer. The second step is to fix the raw material plate onto the first stamping die and perform the first stamping, forming the first stamping area on the raw material plate. This first stamping area has a first stamping boundary. The third step involves fixing the raw material plate onto the second set of stamping dies and performing a second stamping process. This creates a second stamping area on the raw material plate, which has a second stamping boundary. The second stamping area intersects with the first stamping area, and several component areas are formed around the first and second stamping boundaries. The fourth step involves fixing the raw material plate onto the third set of stamping dies and performing a third stamping process. This process simultaneously separates several parts from the raw material plate, breaking them apart to form several finished piecework components. The first set of stamping dies includes a first top die and a first bottom die. A first transverse stamping block is protruding on the bottom surface of the first top die, and a first transverse stamping groove is recessed on the top surface of the first bottom die. The first transverse stamping block corresponds to the first transverse stamping groove. The first stamping area is transversely arranged on the raw material plate. The second set of stamping dies includes a second top die and a second bottom die. A second longitudinal stamping block is protruding on the bottom surface of the second top die, and a second longitudinal stamping groove is recessed on the top surface of the second bottom die. The second longitudinal stamping block corresponds to the second longitudinal stamping groove, and the second stamping area is longitudinally arranged on the raw material plate.

2. The method for mass production of a mold for a particle puzzle as described in claim 1, characterized in that: The third set of stamping dies includes a third top die and a third bottom die. A third separating punch is protruding on the bottom surface of the third top die, and a third separating groove is recessed on the top surface of the third bottom die. The third separating punch corresponds to the third separating groove.

3. The method for mass production of a mold for a particle puzzle as described in claim 1, characterized in that: The raw material plate has several positioning holes around its perimeter. Corresponding to these positioning holes, a first positioning pin is provided on the first stamping die. The positioning holes and the first positioning pins are aligned one-to-one, and the first positioning pins pass through the positioning holes to fix the raw material plate onto the first stamping die. Corresponding to several positioning holes, a second positioning pin is provided on the second set of stamping dies. The positioning holes and the second positioning pins are respectively aligned, and the second positioning pins are inserted into the positioning holes to fix the raw material plate onto the second set of stamping dies. Corresponding to several positioning holes, a third positioning pin is provided on the third set of stamping dies. The positioning holes and the third positioning pins correspond one-to-one. The third positioning pins are inserted into the positioning holes to fix the raw material plate on the third set of stamping dies.

4. The method for mass stamping manufacturing of a mold for a particle puzzle as described in claim 1, characterized in that: The raw material board is made of PP, PVC or PS material.

5. The method for mass stamping manufacturing of a mold for a particle puzzle as described in claim 4, characterized in that: The thickness of the raw material plate is between 1.5 mm and 3 mm.

6. The method for mass stamping manufacturing of a mold for a particle puzzle as described in claim 5, characterized in that: The raw material board is formed by bonding printed materials and transparent materials together using a shadowless lamination technique.

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