Method and device for controlling operating temperature of outdoor edge roadside computing unit

Abstract

This invention provides a method and apparatus for controlling the operating temperature of an outdoor edge roadside computing unit, relating to the field of operating temperature control technology for outdoor edge roadside computing units. The method involves acquiring first temperature information through a power board module and controlling the heating system based on the first temperature information to power on the server motherboard module under preset conditions; acquiring second temperature information through the server motherboard module; and controlling the air-cooling system and / or liquid-cooling system based on the second temperature information through the power board module and / or the server motherboard module to control the operating temperature of the outdoor edge roadside computing unit. This improves the efficiency of operating temperature control for the outdoor edge roadside computing unit and greatly expands its temperature adaptability range.

Description

Technical Field

[0001] This invention relates to the field of operating temperature control technology for outdoor edge roadside computing units, and in particular to an operating temperature control method for outdoor edge roadside computing units, an operating temperature control device for outdoor edge roadside computing units, an electronic device, and a computer-readable storage medium. Background Technology

[0002] With the development of technology, the demand for edge computing in the fields of intelligent connected vehicles and intelligent transportation has become increasingly strong in recent years, and accelerating the deployment of edge roadside computing units has gradually become one of the most important directions in this field. Since computing units are mostly deployed at outdoor traffic intersections, their operating temperature is easily affected by external factors. For example, excessively high outdoor temperatures can cause the operating temperature of edge roadside computing units to rise too high, and in the face of low-temperature outdoor environments, the challenge of low-temperature startup also needs to be addressed. At the same time, due to the massive increase in data volume at traffic intersections, server power consumption has increased dramatically, requiring excellent heat dissipation capabilities for the servers. This presents a severe challenge to the design of the computing unit's cooling system. Summary of the Invention

[0003] The present invention provides a method, apparatus, electronic device, and computer-readable storage medium for controlling the operating temperature of outdoor edge roadside computing units, in order to solve the problem of how to improve the operating temperature control efficiency of outdoor edge roadside computing units.

[0004] This invention discloses a method for controlling the operating temperature of an outdoor edge roadside computing unit, wherein the outdoor edge roadside computing unit includes a protective chassis and an edge server unit installed inside the protective chassis;

[0005] The edge server unit includes a server motherboard module, and the outdoor edge roadside computing unit is equipped with a power board module, an air-cooling system, a liquid-cooling system, and a heating system for the edge server unit.

[0006] The method includes:

[0007] The power board module obtains the first temperature information and controls the heating system based on the first temperature information so that the server motherboard module is powered on under preset conditions.

[0008] The second temperature information is obtained through the server motherboard module;

[0009] Based on the second temperature information, the power board module and / or the server motherboard module control the air-cooling system and / or the liquid-cooling system to control the operating temperature of the outdoor edge roadside computing unit.

[0010] Optionally, the protective enclosure is provided with an air-cooled internal circulation air inlet for the power board module;

[0011] The power board module includes sensors on the power board.

[0012] The step of obtaining the first temperature information through the power board module includes:

[0013] The first server inlet air temperature is obtained using the sensor on the power board for the air-cooled internal circulation inlet.

[0014] Optionally, the power board module includes a microcontroller, and the step of controlling the heating system based on the first temperature information to power on the server motherboard module under preset conditions includes:

[0015] When the microcontroller determines that the air intake temperature of the first server is lower than the first preset temperature value, it controls the heating system to turn on.

[0016] When the heating system is turned on for a preset duration threshold, the heating system is turned off and the server motherboard module is powered on.

[0017] Optionally, it also includes:

[0018] When the microcontroller determines that the air intake temperature of the first server is not lower than the first preset temperature value, it controls the server motherboard module to power on.

[0019] Optionally, the protective chassis is provided with a server air inlet for the server motherboard module. The server motherboard module includes sensors, a baseboard management controller, and a core chip on the motherboard. The step of obtaining the second temperature information through the server motherboard module includes:

[0020] The baseboard management controller is used to obtain the chip operating temperature for the core chip;

[0021] The second server intake air temperature is obtained using the sensor on the motherboard for the server air intake.

[0022] Optionally, the sensor on the motherboard is used to send the second server intake air temperature to the microcontroller, and the baseboard management controller is used to receive the chip operating temperature. The steps of controlling the air cooling system and / or the liquid cooling system based on the second temperature information through the power board module and / or the server motherboard module include:

[0023] The baseboard management controller controls the activation of the air-cooling system based on the chip's operating temperature;

[0024] The microcontroller determines the server inlet air temperature value from the first server inlet air temperature and the second server inlet air temperature; the server inlet air temperature value is the higher temperature value between the first server inlet air temperature and the second server inlet air temperature.

[0025] When the microcontroller determines that the server's air intake temperature is not lower than the second preset temperature threshold, it controls the air-cooling system to shut down and controls the liquid-cooling system to turn on.

[0026] Optionally, it also includes:

[0027] When the server intake air temperature is lower than the second preset temperature threshold, the step of using the substrate management controller to control the start of the air cooling system based on the chip operating temperature is executed.

[0028] Optionally, the protective chassis is provided with an air-cooled external circulation air inlet, the power board module is provided with a temperature sensor, the probe of the temperature sensor is disposed at the air-cooled external circulation air inlet, and further includes:

[0029] The temperature sensor is used to obtain the third server inlet air temperature for the air-cooled external circulation inlet via the probe, and the third server inlet air temperature is sent to the microcontroller.

[0030] When the microcontroller determines that the air intake temperature of the third server is lower than the third preset temperature threshold, it controls the air cooling system to turn on and controls the liquid cooling system to turn off.

[0031] Optionally, it also includes:

[0032] When the microcontroller determines that the air intake temperature of the third server is not lower than the third preset temperature threshold, the steps of controlling the air cooling system to shut down and controlling the liquid cooling system to turn on are executed.

[0033] Optionally, the protective enclosure is provided with a liquid-cooled internal circulation air inlet for the power board module, and the outdoor edge roadside computing unit is provided with electromagnetic baffles for the liquid-cooled internal circulation air inlet and the air-cooled internal circulation air inlet, and further includes:

[0034] When the air-cooling system is in the on state, the microcontroller controls the electromagnetic baffle to close the liquid-cooled internal circulation air inlet.

[0035] Optionally, it also includes:

[0036] When the liquid cooling system is in the on state, the microcontroller controls the electromagnetic baffle to close the air inlet of the air-cooled internal circulation system.

[0037] Optionally, the protective chassis is provided with a server air outlet, and the air-cooling system includes an internal circulation fan module for the server air outlet and an external circulation fan module for the external circulation air inlet.

[0038] Optionally, the top of the protective enclosure is provided with a waterproof sunshade.

[0039] Optionally, thermal insulation foam is provided between the edge server unit and the protective chassis.

[0040] This invention also discloses an operating temperature control device for an outdoor edge roadside computing unit, the outdoor edge roadside computing unit including a protective chassis and an edge server unit installed inside the protective chassis;

[0041] The edge server unit includes a server motherboard module, and the outdoor edge roadside computing unit is equipped with a power board module, an air-cooling system, a liquid-cooling system, and a heating system for the edge server unit.

[0042] The device includes:

[0043] The first temperature information acquisition module is used to acquire first temperature information through the power board module and control the heating system based on the first temperature information so that the server motherboard module is powered on under preset conditions.

[0044] The second temperature information acquisition module is used to acquire second temperature information through the server motherboard module;

[0045] A temperature control module is used to control the air-cooling system and / or liquid-cooling system based on the second temperature information via the power board module and / or the server motherboard module to control the operating temperature of the outdoor edge roadside computing unit.

[0046] This invention also discloses an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus;

[0047] The memory is used to store computer programs;

[0048] When the processor executes a program stored in the memory, it implements the method described in the embodiments of the present invention.

[0049] This invention also discloses a computer-readable storage medium storing instructions that, when executed by one or more processors, cause the processors to perform the methods described in this invention.

[0050] The embodiments of the present invention have the following advantages:

[0051] In this embodiment of the invention, a first temperature information is obtained through the power board module, and the heating system is controlled based on the first temperature information to power on the server motherboard module under preset conditions; a second temperature information is obtained through the server motherboard module; based on the second temperature information, the power board module and / or the server motherboard module control the air cooling system and / or the liquid cooling system to control the operating temperature of the outdoor edge roadside computing unit, thereby improving the operating temperature control efficiency of the outdoor edge roadside computing unit and greatly expanding the temperature adaptation range of the edge roadside computing unit. Attached Figure Description

[0052] Figure 1 This is a flowchart of the steps of a method for controlling the operating temperature of an outdoor edge roadside computing unit provided in an embodiment of the present invention;

[0053] Figure 2 This is a schematic diagram of the structure of an outdoor edge roadside calculation unit provided in an embodiment of the present invention;

[0054] Figure 3 This is a schematic diagram of another structure for an outdoor edge roadside computing unit provided in an embodiment of the present invention;

[0055] Figure 4 This is a structural diagram of a power board module and a server motherboard module provided in an embodiment of the present invention;

[0056] Figure 5 This is a flowchart illustrating a method for controlling the operating temperature of an outdoor edge roadside computing unit, as provided in an embodiment of the present invention.

[0057] Figure 6 This is a structural block diagram of an operating temperature control device for an outdoor edge roadside computing unit provided in an embodiment of the present invention;

[0058] Figure 7 This is a hardware structure block diagram of an electronic device provided in an embodiment of the present invention;

[0059] Figure 8 This is a schematic diagram of a computer-readable medium provided in an embodiment of the present invention.

[0060] The attached reference numerals include: 1. Edge server unit; 2. Internal circulation fan module; 3. Server air inlet; 4. Server air outlet; 5. Thermal insulation foam; 6. Air-cooled heat exchanger; 7. External circulation fan module; 8. Air-cooled external circulation air inlet; 9. Air-cooled external circulation air outlet; 10. Air-cooled internal circulation air outlet; 11. Air-cooled internal circulation air inlet; 12. Electromagnetic baffle; 13. Liquid-air heat exchanger; 14. Liquid-cooled external circulation liquid inlet; 15. Liquid-cooled external circulation liquid outlet; 16. Liquid-cooled internal circulation air outlet; 17. Liquid-cooled internal circulation air inlet; 18. Waterproof sunshade; 19. Protective chassis; 20. Heating element module; 21. Liquid-cooled distribution unit (CDU). Detailed Implementation

[0061] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0062] To enable those skilled in the art to better understand the embodiments of the present invention, some technical terms in the embodiments of the present invention will be explained below.

[0063] BMC: Baseboard Management Controller

[0064] MCU: Microcontroller Unit, Single-chip microcomputer

[0065] CDU: Cooling Distribution Unit

[0066] PID: Proportional, Integral, and Derivative.

[0067] I2C: Inter-Integrated Circuit, Integrated Circuit Bus

[0068] In recent years, the demand for edge computing in the fields of intelligent connected vehicles and intelligent transportation has become increasingly strong, and accelerating the deployment of edge roadside computing units has gradually become one of the most important directions in this field. Since computing units are mostly deployed at outdoor traffic intersections, road conditions contain a large amount of dust, particles, fibers, and other particulate matter, which can easily clog heat sinks and fans, reducing server heat dissipation efficiency and increasing the risk of hardware failure, requiring a high dustproof rating. Furthermore, in some areas with abundant rainfall, moisture entering the server can lead to problems such as short circuits, corrosion, and circuit board aging, necessitating a high waterproof rating. Simultaneously, due to the massive increase in data volume at traffic intersections, server power consumption has increased dramatically, requiring excellent heat dissipation capabilities. In addition, since some chips in edge servers cannot be industrial-grade chips, the challenge of low-temperature startup in outdoor low-temperature environments must be addressed. Therefore, the requirements for waterproofing, dustproofing, and temperature adaptability of edge roadside computing units are more stringent than those of traditional servers, and the commonly used air-cooling or liquid-cooling methods for the latter are no longer suitable. Effective isolation between the server unit and the external environment is essential, posing a severe challenge to the design of the computing unit's heat dissipation system.

[0069] To address this challenge, this invention employs a heat dissipation and control system that coordinates air cooling and liquid cooling based on heat exchange technology. Air (AA) and liquid-air (LA) heat exchangers are introduced into the protective chassis of the outdoor edge computing unit, along with related air-cooling and liquid-cooling components, forming two internal and external circulation systems. This circulation system operates under the control of the server unit's Baseboard Management Controller (BMC) and Microcontroller Unit (MCU) within the chassis, ensuring the server unit operates within a suitable temperature range at all times. Furthermore, to address the challenge of low-temperature server startup, this invention also includes a heating element module installed on the chassis below the server motherboard. When the server is in a low-temperature environment, the MCU controls the heating module to activate, ensuring the server unit operates within its normal operating temperature range. Based on this design, the temperature adaptability of the edge computing unit is significantly improved, meeting the requirements for high waterproof and dustproof ratings for outdoor use.

[0070] Specifically, this invention provides a heat dissipation control system for an outdoor edge roadside computing unit, which mainly consists of eleven parts, including an edge server unit, an internal circulation fan module, a fixed guide rail assembly, thermal insulation foam, an air-type heat exchanger, an external circulation fan module, a liquid-air heat exchanger, a liquid-cooled distribution unit (CDU), a heating element module, an electromagnetic baffle, and an external protective chassis. The edge server unit is fixed to the center of the chassis using mounting rails and bolts. It employs a front-to-back airflow cooling system, with the server's fans located at the exhaust vents, also functioning as internal circulation fans to power the high-temperature exhaust air as it circulates within the heat exchanger. The server motherboard houses a Baseboard Management Controller (BMC) chip, which serves as the server's basic control unit, managing power-on, firmware updates, logging, temperature monitoring, and fan control. Additionally, the server's power board contains a Microcontroller (MCU) chip, which controls the heating element's activation / deactivation, power supply to the motherboard, and the direction of the electromagnetic baffle based on the server's inlet air temperature. This chip also communicates with the control system of the external Computer Duty Unit (CDU), transmitting the server's exhaust air temperature information to the latter, thus indirectly controlling the CDU's operation. Thermal insulation foam is installed on the front and rear sides of the edge server. Its primary function is to reduce secondary heat exchange between the server chassis and the heat exchangers on both sides, prevent the exhaust air from flowing back to the inlet, and also provide some vibration damping. The air-cooled heat exchanger consists of two heat exchange channels: an internal circulating hot air side and an external circulating cold air side. Its heat exchange walls are made of aluminum. Through a clever structural design, the server's exhaust air and the outside cold air exchange heat in a cross-flow manner without direct contact, thus achieving the purpose of heat dissipation isolation. In this design, the air-cooled heat exchanger is mainly installed on the right side of the server unit and is fixed to the protective chassis door side by a fixed guide rail assembly. At the same time, an external circulating fan module is installed at the air inlet at the bottom of the heat exchanger to ensure normal circulation of outside cold air at all times. The liquid-air heat exchanger consists of a series of heat exchange plates and liquid tube bundle modules, which are respectively the external circulating cooling liquid side and the internal circulating hot air side. The external circulating coolant mainly flows through the tube bundle, and the internal circulating hot air mainly flows through the heat exchange plates. The coolant used in this design is a refrigerant, and the specific model is not limited. In this design, the liquid-air heat exchanger is mainly installed on the left side of the server unit and is fixed to the bottom of the protective chassis by a fixed guide rail assembly. Liquid cooling connectors are installed at the bottom and top of the heat exchanger to connect to the external liquid cooling pipeline.The Cooling Unit (CDU) is primarily used to distribute and regulate the flow and temperature of the external circulating coolant to ensure sufficient heat exchange with the internal circulating hot air. It typically includes components such as a coolant pump, regulating valve, flow meter, temperature sensor, piping, and control system. In this design, the CDU is connected to the liquid-cooled connector of the liquid-air heat exchanger via external piping. Its control system communicates with the server's microcontroller (MCU) chip. The CDU starts operating after determining that the server's air outlet temperature exceeds a certain value. The heating element module is mainly attached to the inside of the server's casing below the motherboard. It is primarily controlled by the MCU chip on the server's power board. When the server's air inlet temperature is lower than a first preset temperature value, the heating element module starts operating. Simultaneously, the MCU continuously monitors changes in the air inlet temperature. When the server's air inlet temperature exceeds the first preset temperature value or the heating time exceeds a fixed heating time value, the heating element module stops operating, and the server is powered on. Even if the server's air inlet temperature is detected to be lower than the first preset temperature value again after powering on, the heating element will not operate to prevent repeated start-stop heating. The electromagnetic baffle is mainly installed near the server's air outlet. Its operating current direction is primarily controlled by the MCU chip and H-bridge circuit (DC motor control circuit) on the server's power board. The direction of the operating current determines the closing direction of the electromagnetic baffle. When the server's air outlet temperature is lower than a second preset temperature value, the electromagnetic baffle closes towards the internal circulation inlet of the liquid-air heat exchanger, and the cooling system operates in air-cooled isolation mode. When the server's air outlet temperature is higher than the second preset temperature value, the electromagnetic baffle closes towards the internal circulation inlet of the air-cooled heat exchanger, and the external circulation fan module stops working, and the cooling system operates in liquid-cooled isolation mode. The outer protective chassis primarily provides a high-level protective environment for the internal servers and provides structural support for the installation of internal components. A waterproof cap is installed on the top of the chassis to meet the requirements for waterproofing and sunshade. This technical solution controls the operating mode of the cooling system based on the actual inlet and outlet temperatures using the on-board MCU and BMC chip, improving the operating temperature control efficiency of the outdoor edge-side computing unit and greatly expanding its temperature adaptability range.

[0071] Reference Figure 1 The diagram illustrates a flowchart of a method for controlling the operating temperature of an outdoor edge roadside computing unit according to an embodiment of the present invention, which may specifically include the following steps:

[0072] Step 101: Obtain first temperature information through the power board module, and control the heating system based on the first temperature information so that the server motherboard module is powered on under preset conditions;

[0073] Step 102: Obtain the second temperature information through the server motherboard module;

[0074] Step 103: Based on the second temperature information, the power board module and / or the server motherboard module control the air cooling system and / or the liquid cooling system to control the operating temperature of the outdoor edge roadside computing unit.

[0075] In a specific implementation, the edge roadside computing unit may include a protective enclosure and an edge server unit installed inside the protective enclosure. For example, the edge server unit may be fixed in the middle position inside the enclosure by a fixing rail assembly and bolts.

[0076] The CPU, or Central Processing Unit, is the core of a computer system for computation and control; it is the final execution unit for information processing and program execution. Since its inception, the CPU has made tremendous progress in logical structure, operating efficiency, and functional scope.

[0077] GPU, short for Graphics Processing Unit, first appeared as the core chip of a computer graphics card, specifically designed for processing complex image data. As the demand for this functionality evolved, the GPU gradually became an indispensable component in computer graphics rendering and processing.

[0078] An edge server unit may include a server motherboard module, which may be the motherboard of the edge server unit, as well as core chips such as CPU and GPU mounted on the motherboard.

[0079] The outdoor edge roadside computing unit can also be configured with a power board module, air cooling system, liquid cooling system and heating system for the edge server unit.

[0080] Optionally, the air-cooling system and liquid-cooling system can be configured on both sides of the edge server unit, and the heating system can be fixed to the bottom of the protective chassis via a mounting rail assembly.

[0081] For example, the air-cooled system can be an air-type heat exchanger, the liquid-cooled system can be a liquid-air heat exchanger, and the heating system can be a heating element module.

[0082] In practical applications, to prevent edge server units from failing to start normally due to excessively low outdoor temperatures, embodiments of the present invention can prioritize powering on the power board module before powering on the server motherboard module. The power board module obtains first temperature information and controls the heating system based on this information to power on the server motherboard module under preset conditions. For example, the temperature inside the protective chassis can be raised to a temperature range that satisfies the normal power-on operation of the server motherboard module. Of course, if the temperature expressed by the first temperature information is already within the temperature range that satisfies the normal power-on operation of the server motherboard module, the server motherboard module can be directly powered on.

[0083] After the server motherboard module is powered on, the embodiments of the present invention can obtain the second temperature information through the server motherboard module. The difference between the second temperature information and the first temperature information is that they are obtained from different locations. For example, the second temperature information and the first temperature information can be obtained from different air inlets.

[0084] After obtaining the second temperature information and the first temperature information, embodiments of the present invention can control the air cooling system and / or liquid cooling system through the power board module and / or the server motherboard module based on the second temperature information to control the operating temperature of the outdoor edge roadside computing unit, thereby ensuring that the operating temperature of the edge server unit is within a suitable temperature range.

[0085] In this embodiment of the invention, a first temperature information is obtained through the power board module, and the heating system is controlled based on the first temperature information to power on the server motherboard module under preset conditions; a second temperature information is obtained through the server motherboard module; based on the second temperature information, the power board module and / or the server motherboard module control the air cooling system and / or the liquid cooling system to control the operating temperature of the outdoor edge roadside computing unit, thereby improving the operating temperature control efficiency of the outdoor edge roadside computing unit and greatly expanding the temperature adaptation range of the edge roadside computing unit.

[0086] Based on the above embodiments, modified embodiments of the above embodiments are proposed. It should be noted that, in order to keep the description brief, only the differences from the above embodiments are described in the modified embodiments.

[0087] In an optional embodiment of the present invention, the protective chassis is provided with an air-cooled internal circulation air inlet for the power board module;

[0088] The power board module includes sensors on the power board.

[0089] The step of obtaining the first temperature information through the power board module includes:

[0090] The first server inlet air temperature is obtained using the sensor on the power board for the air-cooled internal circulation inlet.

[0091] In a specific implementation, the protective chassis of this embodiment of the invention can be provided with an air-cooled internal circulation air inlet for the power board module. That is, the air-cooled internal circulation air inlet can be an air inlet near the power board module, and the power board module can integrate a sensor on the power board. The sensor on the power board can be used to obtain the temperature information (first server air intake temperature) of the air inlet (air-cooled internal circulation air inlet) near the power board module, thereby improving the temperature acquisition efficiency and making the acquired temperature information more targeted, so as to further improve the control accuracy of the operating temperature of the outdoor edge roadside computing unit.

[0092] In an optional embodiment of the present invention, the power board module includes a microcontroller, and the step of controlling the heating system based on the first temperature information to power on the server motherboard module under preset conditions includes:

[0093] When the microcontroller determines that the air intake temperature of the first server is lower than the first preset temperature value, it controls the heating system to turn on.

[0094] When the heating system is turned on for a preset duration threshold, the heating system is turned off and the server motherboard module is powered on.

[0095] Optionally, when the microcontroller determines that the air intake temperature of the first server is not lower than the first preset temperature value, it controls the server motherboard module to power on.

[0096] In practical applications, a microcontroller unit (MCU), also known as a single-chip microcomputer or microcontroller, is a chip-level computer that integrates a central processing unit (CPU) with a reduced frequency and specifications. It combines memory, timers, USB, A / D converters, UART, PLC, DMA, and even LCD driver circuitry onto a single chip, creating a chip-level computer for different applications requiring various control combinations. MCUs are found in everything from mobile phones and PC peripherals to remote controls, automotive electronics, and industrial applications such as stepper motor and robotic arm control.

[0097] The power board module of this invention can integrate a microcontroller (MCU). The sensor on the power board obtains the temperature information (first server air intake temperature) of the air intake (air-cooled internal circulation air intake) near the power board module and transmits the signal to the microcontroller (MCU) chip. The microcontroller (MCU) can determine whether the first server air intake temperature is lower than a first preset temperature value.

[0098] For example, the first preset temperature value is generally a temperature value below zero degrees. Of course, the above example is only an example. Those skilled in the art can also determine the first preset temperature value based on the lower limit of the operating temperature of the core chip. In this regard, the embodiments of the present invention do not limit it.

[0099] If the MCU determines that the intake air temperature of the first server is lower than the first preset temperature value, it means that the ambient temperature of the outdoor edge roadside computing unit is too low. In this case, the MCU can trigger the heating element module to start heating and monitor the change of the intake air temperature of the first server at all times, while recording the heating time. When the monitored intake air temperature of the first server is higher than the first preset temperature value or the heating time exceeds the preset time threshold, the MCU controls the heating element module to stop working and the server motherboard module is powered on. If the intake air temperature of the first server is not lower than the first preset temperature value, it means that the core chip is already in the appropriate temperature range for power-on. The MCU will not trigger the heating element module to work and the server motherboard module will be powered on directly.

[0100] In this embodiment of the invention, when the microcontroller determines that the intake air temperature of the first server is lower than a first preset temperature value, it controls the heating system to turn on; when the heating system is turned on for a preset duration threshold, it controls the heating system to turn off and controls the server motherboard module to power on; when the microcontroller determines that the intake air temperature of the first server is not lower than the first preset temperature value, it controls the server motherboard module to power on, ensuring that the core chip powers on within a suitable temperature range, further improving the operating temperature control efficiency of the outdoor edge roadside computing unit.

[0101] In an optional embodiment of the present invention, the protective chassis is provided with a server air inlet for the server motherboard module, the server motherboard module including sensors, a baseboard management controller and a core chip on the motherboard, and the step of obtaining the second temperature information through the server motherboard module includes:

[0102] The baseboard management controller is used to obtain the chip operating temperature for the core chip;

[0103] The second server intake air temperature is obtained using the sensor on the motherboard for the server air intake.

[0104] In practice, the protective chassis can be equipped with a server air intake for the server motherboard module; that is, the server air intake can be an air intake near the server motherboard module.

[0105] In practical applications, BMC (Baseboard Management Controller) is a dedicated controller used for monitoring and managing servers. Its four main functions are as follows:

[0106] ① Equipment Information Management: Record server information (model, manufacturer, date, production and technical information of each component, chassis information, motherboard information, etc.) and BMC information (server hostname, IP, BMC firmware version, etc.);

[0107] ② Server status monitoring and management: Monitor the health status of various server components (CPU, memory, hard drive, fan, chassis, etc.) such as temperature and voltage, and adjust the fan speed in real time according to the temperature data collection points to ensure that the server does not overheat, while controlling the overall power consumption to prevent it from being too high; if any abnormality occurs in a single board component, the information will be reported to the upper-level network management in a timely manner through various industry-standard protocols such as SNMP, SMTP, and Redfish.

[0108] ③ Remote control and management of the server: server power on / off, restart, maintenance, firmware updates, system installation, etc.;

[0109] ④ Maintenance and management: Log management, user management, BIOS management, alarm management, etc.

[0110] The Baseboard Management Controller (BMC) can perform operations such as firmware upgrades and device monitoring when the machine is not powered on. For example, the BMC manages devices through the high-speed serial computer expansion bus standard PCIe or the built-in integrated circuit channel I2C bus. It can also support MCTP to obtain information such as the manufacturer, temperature, voltage, and health status of the managed devices. It is an important component in computers.

[0111] A BMC (Browser Control Center) is a dedicated service processor that uses sensors to monitor the status of a computer, network server, or other hardware device and communicates with the system administrator via a separate connection. The BMC is part of the Intelligent Platform Management Interface (IPMI) and is typically contained within the motherboard or the main circuit board of the monitored device. The BMC's sensors measure internal physical variables such as temperature, humidity, power supply voltage, fan speed, communication parameters, and operating system (OS) functions. If any of these variables exceeds specified limits, it notifies the administrator. Relevant technicians can then take appropriate action remotely. The monitoring device can be cycled or restarted when necessary. This allows a single administrator to remotely control numerous servers and other devices simultaneously. This reduces overall network costs and ensures reliability.

[0112] The server motherboard module of this invention can integrate a sensor and a core chip on the motherboard. For example, the core chip can include at least a CPU or a GPU.

[0113] After the server motherboard module of this embodiment of the invention is powered on, the baseboard management controller (BMC) can be used to obtain the chip operating temperature of the core chip; and the sensor on the motherboard can be used to obtain the second server air intake temperature of the server air intake.

[0114] In this embodiment of the invention, the chip operating temperature of the core chip is obtained by using the baseboard management controller; and the second server intake temperature of the server air inlet is obtained by using the sensor on the motherboard. This improves the temperature acquisition efficiency and makes the acquired temperature information more targeted, thereby further improving the control accuracy of the operating temperature of the outdoor edge roadside computing unit.

[0115] In an optional embodiment of the present invention, the sensor on the motherboard is used to send the second server intake air temperature to the microcontroller, the substrate management controller is used to receive the chip operating temperature, and the step of controlling the air cooling system and / or the liquid cooling system based on the second temperature information through the power board module and / or the server motherboard module includes:

[0116] The baseboard management controller controls the activation of the air-cooling system based on the chip's operating temperature;

[0117] The microcontroller determines the server inlet air temperature value from the first server inlet air temperature and the second server inlet air temperature; the server inlet air temperature value is the higher temperature value between the first server inlet air temperature and the second server inlet air temperature.

[0118] When the microcontroller determines that the server's air intake temperature is not lower than the second preset temperature threshold, it controls the air-cooling system to shut down and controls the liquid-cooling system to turn on.

[0119] In practical applications, after the server motherboard module is powered on, since the core chips such as the CPU and GPU on the server motherboard module have just started working, the internal air intake temperature is low. Therefore, the heat dissipation system does not need to use a liquid cooling system. It can use only the air-cooled isolation heat dissipation mode to dissipate heat. Specifically, the temperature of the core chips such as the CPU and GPU and the second server intake temperature obtained by the sensor on the motherboard can be uniformly monitored by the baseboard management controller (BMC). The baseboard management controller (BMC) can perform PID (Proportional Integral Derivative) intelligent control of the air cooling system based on the obtained chip operating temperature.

[0120] In practical applications, the I2C bus is a simple, bidirectional, two-wire synchronous serial bus. It requires only two wires to transmit information between devices connected to the bus. The master device initiates data transmission on the bus and generates a clock to enable transmission; any addressed device is considered a slave device. The master-slave and send-receive relationships on the bus are not constant but depend on the direction of data transmission. If the master wants to send data to a slave device, it first addresses the slave device, then actively sends data to the slave device, and finally terminates the data transmission. If the master wants to receive data from a slave device, it first addresses the slave device, then receives the data sent by the slave device, and finally terminates the receiving process. In this case, the master is responsible for generating the timing clock and terminating the data transmission.

[0121] The sensor on the motherboard acquires the temperature information (second server intake temperature) of the air inlet (server intake) near the server motherboard, and transmits the second server intake temperature to the microcontroller MCU on the power board module via I2C (Inter-Integrated Circuit, abbreviated as I2C). The microcontroller MCU takes the maximum value of the first server intake temperature and the second server intake temperature and determines it as the server intake temperature value. It then compares the server intake temperature value with a second preset temperature value. For example, the second preset temperature value can be set to 55°C. Of course, the above example is only an example. Those skilled in the art can set other temperature values ​​as the second preset temperature value according to actual needs. In this regard, the embodiments of the present invention do not limit it.

[0122] If the server's intake air temperature is not lower than the second preset temperature value, the MCU will communicate with the control system of the liquid cooling distribution unit (CDU) via serial port, inform the CDU of the high temperature warning information, and trigger the CDU to start the liquid cooling circulation. The baseboard management controller (BMC) can control the external circulation fan module to stop, and all the server's exhaust air enters the liquid-air heat exchanger, thus activating the liquid cooling mode.

[0123] Optionally, when the server intake air temperature is lower than the second preset temperature threshold, the step of using the substrate management controller to control the start of the air cooling system based on the chip operating temperature is executed.

[0124] If the server intake air temperature is lower than the second preset temperature, the air-cooling system will maintain PID control mode, and the heat dissipation system will remain in air-cooled isolation heat dissipation mode.

[0125] In this embodiment of the invention, the baseboard management controller controls the activation of the air-cooling system based on the chip's operating temperature; the microcontroller determines the server intake temperature value from the first server intake temperature and the second server intake temperature; the server intake temperature value is the higher of the first server intake temperature and the second server intake temperature; when the microcontroller determines that the server intake temperature value is not lower than a second preset temperature threshold, it controls the air-cooling system to shut down and controls the liquid cooling system to activate. When the server intake temperature value is lower than the second preset temperature threshold, the step of controlling the activation of the air-cooling system based on the chip's operating temperature using the baseboard management controller is executed. This achieves efficient switching from air-cooling system heat dissipation to liquid-cooling system heat dissipation, further improving the control efficiency of the operating temperature of the outdoor edge roadside computing unit.

[0126] In an optional embodiment of the present invention, the protective chassis is provided with an external air-cooled air inlet, the power board module is provided with a temperature sensor, the probe of the temperature sensor is disposed at the external air-cooled air inlet, and further includes:

[0127] The temperature sensor is used to obtain the third server inlet air temperature for the air-cooled external circulation inlet via the probe, and the third server inlet air temperature is sent to the microcontroller.

[0128] When the microcontroller determines that the air intake temperature of the third server is lower than the third preset temperature threshold, it controls the air cooling system to turn on and controls the liquid cooling system to turn off.

[0129] In practical applications, after the liquid cooling mode is turned on, the server intake air temperature drops rapidly, and may even fall below the second preset temperature value. If the original judgment logic is maintained at this time, the liquid cooling mode will be turned off and the air cooling mode will be turned on again. A situation of repeated start and stop of liquid cooling and air cooling modes will occur, which is extremely detrimental to the operation of the heat dissipation control system and may even damage related components.

[0130] To avoid the repeated start-stop of air cooling and liquid cooling modes in the above heat dissipation system, this embodiment of the invention can connect a temperature sensor to the power board module and install the probe of the temperature sensor at the air cooling external circulation inlet. The temperature signal obtained by the temperature sensor is acquired by the power board module's microcontroller (MCU) and compared with a third preset temperature value (generally a high temperature value above 35°C, lower than the second preset temperature value, and this value will not cause the liquid cooling mode to shut down quickly after being turned on) as the third server inlet temperature.

[0131] If the temperature value of the air-cooled external circulation inlet 8 (the third server air intake temperature) is lower than the third preset temperature value, it means that the ambient temperature has dropped significantly. At this time, the microcontroller MCU will control the liquid cooling mode to stop working, the baseboard management controller BMC will control the air cooling system to start, and perform PID control to restart the air cooling mode.

[0132] Optionally, when the microcontroller determines that the air intake temperature of the third server is not lower than a third preset temperature threshold, the steps of controlling the air cooling system to shut down and controlling the liquid cooling system to start are executed.

[0133] In practice, if the temperature of the external air intake is not lower than the third preset temperature value, the liquid cooling mode will continue to be maintained.

[0134] In an optional embodiment of the present invention, the protective enclosure is provided with a liquid-cooled internal circulation air inlet for the power board module, and the outdoor edge roadside computing unit is provided with electromagnetic baffles for the liquid-cooled internal circulation air inlet and the air-cooled internal circulation air inlet, and further includes:

[0135] When the air-cooling system is in the on state, the microcontroller controls the electromagnetic baffle to close the liquid-cooled internal circulation air inlet.

[0136] Optionally, it also includes:

[0137] When the liquid cooling system is in the on state, the microcontroller controls the electromagnetic baffle to close the air inlet of the air-cooled internal circulation system.

[0138] In practical implementation, the H-bridge is a typical DC motor control circuit. It is named "H-bridge" because its circuit shape resembles the letter H.

[0139] For example, the protective enclosure may be provided with a liquid-cooled internal circulation air inlet and a wind-cooled internal circulation air inlet for the power board module. An electromagnetic baffle may be provided between the two. The power board module may be provided with an H-bridge circuit. The initial default state of the heat dissipation system may be wind-cooled isolation heat dissipation mode. That is, when the wind-cooling system is on, the power board module controls the electromagnetic baffle to close to the liquid-cooled internal circulation air inlet by default through the microcontroller MCU and the H-bridge circuit.

[0140] If the microcontroller (MCU) communicates with the control system of the liquid cooling distribution unit (CDU) via serial port, it can inform the CDU of high temperature warning information and trigger the CDU to start the liquid cooling cycle. That is, when the liquid cooling system is in the on state, the MCU can control the H-bridge circuit of the power board module to reverse, and the electromagnetic baffle will close to the air inlet of the air-cooled inner circulation.

[0141] If the temperature value of the air inlet of the external air-cooled system (the air inlet temperature of the third server) is lower than the third preset temperature value, it means that the ambient temperature has dropped significantly. At this time, the H-bridge circuit on the MCU control board reverses again, and the electromagnetic baffle closes at the air inlet of the internal air-cooled system.

[0142] By controlling the electromagnetic baffle to close the liquid-cooled internal circulation air inlet when the air-cooling system is on and the electromagnetic baffle to close the air-cooled internal circulation air inlet when the liquid-cooling system is on, the switching between air / cooling isolation heat dissipation modes can be realized, further improving the heat dissipation efficiency for outdoor edge roadside computing units.

[0143] In an optional embodiment of the present invention, the protective chassis is provided with a server air outlet, and the air-cooling system includes an internal circulation fan module for the server air outlet and an external circulation fan module for the external circulation air inlet, thereby realizing that the air-cooling system of the protective chassis includes two sets of air circulation, internal and external, further improving the heat dissipation efficiency for outdoor edge roadside computing units.

[0144] Optionally, the top of the protective chassis is equipped with a waterproof sunshade visor, which can shield the protective chassis from direct sunlight and rain, thereby improving the security of the server.

[0145] Optionally, thermal insulation foam is provided between the edge server unit and the protective chassis, thereby improving the heat exchange efficiency of the heat dissipation system.

[0146] To enable those skilled in the art to better understand the embodiments of the present invention, a complete example is used below to illustrate the embodiments of the present invention.

[0147] refer to Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the structure of an outdoor edge roadside calculation unit provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of another structure for an outdoor edge roadside computing unit provided in an embodiment of the present invention;

[0148] Outdoor edge roadside computing units may include: 1. Edge server unit; 2. Internal circulation fan module; 3. Server air inlet; 4. Server air outlet; 5. Thermal insulation foam; 6. Air-cooled heat exchanger; 7. External circulation fan module; 8. Air-cooled external circulation air inlet; 9. Air-cooled external circulation air outlet; 10. Air-cooled internal circulation air outlet; 11. Air-cooled internal circulation air inlet; 12. Electromagnetic baffle; 13. Liquid-air heat exchanger; 14. Liquid-cooled external circulation liquid inlet; 15. Liquid-cooled external circulation liquid outlet; 16. Liquid-cooled internal circulation air outlet; 17. Liquid-cooled internal circulation air inlet; 18. Waterproof sunshade; 19. Protective enclosure; 20. Heating element module; 21. Liquid-cooled distribution unit (CDU).

[0149] refer to Figure 4 , Figure 4 This is a structural diagram of a power board module and a server motherboard module provided in an embodiment of the present invention. The edge server unit may include a power board module and a server motherboard module.

[0150] refer to Figure 5 , Figure 5 This is a flowchart illustrating a method for controlling the operating temperature of an outdoor edge roadside computing unit, as provided in an embodiment of the present invention.

[0151] When the heat dissipation control system is working, the power board module inside the edge server unit 1 is powered on first. The sensor on the power board obtains the temperature information (first server air intake temperature) of the air intake (air-cooled internal circulation air intake 11) near the power board module and transmits the signal to the microcontroller MCU chip, which will then judge this temperature value.

[0152] If the intake air temperature of the first server is lower than the first preset temperature value (generally a temperature value below zero degrees Celsius, depending on the lower limit of the chip's operating temperature), the microcontroller MCU will trigger the heating element module 20 to start heating and constantly monitor the change in the intake air temperature of the first server, while recording the heating time. When the intake air temperature of the first server is detected to be higher than the first preset temperature value or the heating time exceeds the preset threshold, the heating element module 20 will be controlled to stop working and the server motherboard module will be powered on.

[0153] If the air intake temperature of the first server is not lower than the first preset temperature value, the microcontroller MCU will not trigger the heating element module 20 to work, and the server motherboard module will be powered on directly.

[0154] After the server motherboard module is powered on, the internal air intake temperature is low because the core chips such as CPU and GPU on the server motherboard module have just started working. At this time, the power board module controls the electromagnetic baffle 12 to close the liquid-cooled internal air intake 17 by default through the microcontroller MCU and H-bridge circuit. The heat dissipation system is in air-cooled isolation heat dissipation mode. At the same time, the temperature of the core chips such as CPU and GPU and the temperature signal obtained by the sensor on the motherboard are monitored by the baseboard management controller (BMC) on the board. The baseboard management controller (BMC) will perform PID (Proportional Integral Derivative) intelligent control on the internal air intake fan module 2 and the external air intake fan module 7 according to the acquired temperature signal.

[0155] Meanwhile, the sensor on the motherboard acquires the temperature information (hereinafter referred to as the second server air intake temperature) of the air intake near the server motherboard (server air intake 3), and transmits this temperature signal to the microcontroller MCU on the power board module through I2C (Inter-Integrated Circuit, I2C). The microcontroller MCU takes the maximum value of the two air intake temperatures as the server air intake temperature value, and compares the server air intake temperature value with the second preset temperature value (generally a high temperature value above 55℃).

[0156] If the server intake air temperature is lower than the second preset temperature, the electromagnetic baffle will remain in its original position, the internal and external circulation fan modules will maintain PID control, and the heat dissipation system will mainly be in air-cooled isolation heat dissipation mode.

[0157] If the server's intake air temperature is not lower than the second preset temperature value, the MCU will communicate with the control system of the liquid cooling distribution unit CDU21 via serial port, inform the liquid cooling distribution unit CDU21 of the high temperature warning information, and trigger the liquid cooling distribution unit CDU21 to start the liquid cooling circulation. At the same time, the H-bridge circuit on the MCU control board is reversed, and the electromagnetic baffle closes to the air-cooled inner circulation intake port 11. At this time, the BMC controls the outer circulation fan module to stop, and all the server exhaust air enters the liquid-air heat exchanger, and the liquid cooling mode is turned on.

[0158] After the liquid cooling mode is turned on, the server intake air temperature drops rapidly, even quickly falling below the second preset temperature value. If the original judgment logic is maintained at this time, the liquid cooling mode will be turned off and the air cooling mode will be turned on again. A situation of repeated start-stop of liquid cooling and air cooling modes will occur, which is extremely detrimental to the operation of the heat dissipation control system and may even damage related components.

[0159] To avoid the repeated start-stop of air cooling and liquid cooling modes in the above heat dissipation system, this invention connects a temperature sensor to the power board module and installs the sensor probe at the air cooling external circulation inlet 8. The temperature signal obtained by the temperature sensor is acquired by the power board module's microcontroller (MCU) and compared with the third server air intake temperature (generally a high temperature value above 35°C, lower than the second preset temperature value, and this value will not cause the liquid cooling mode to shut down quickly after being turned on).

[0160] If the temperature value of the air-cooled external circulation inlet 8 (the air intake temperature of the third server) is lower than the third preset temperature value, it means that the ambient temperature has dropped significantly. At this time, the H-bridge circuit on the MCU control board reverses again, the electromagnetic baffle 12 closes to the liquid-cooled internal circulation inlet 17, the liquid cooling mode stops working, the BMC controls the external circulation fan module to start and performs PID control, and the air-cooling mode is turned on again.

[0161] If the temperature at the external air intake is not lower than the third preset temperature value, the liquid cooling mode will continue to be maintained.

[0162] This technical solution can control the working mode of the heat dissipation system through the on-board microcontroller (MCU) and BMC chip, based on the actual temperature of the internal and external air inlets and outlets. When the ambient temperature is low and the server unit is under low load, the heat dissipation control system mainly uses air cooling mode. When the ambient temperature is high and the server unit is under high load, the air cooling mode cannot meet the server's heat dissipation requirements, and the heat dissipation control system will automatically switch to liquid cooling mode. This heat dissipation control system greatly expands the temperature adaptation range of the edge computing unit while ensuring the server's high protection level.

[0163] By employing the methods described above, air-cooled and liquid-air-cooled heat exchangers are applied to outdoor deployment chassis of edge servers. The server's internal microcontroller (MCU) and BMC chip monitor and regulate the server's air inlet temperature in real time, ensuring a consistently optimal operating environment for the edge servers. Compared to traditional outdoor air conditioning chassis, this invention's heat dissipation control system is compatible with both liquid and air cooling modes, offers rapid adjustment response, minimizes fan speed fluctuations, and has a wide temperature adaptability range. This entire heat dissipation control system, while maintaining a high level of server protection, facilitates the long-term safe and reliable operation of edge servers outdoors, meeting the deployment requirements of servers in harsh environments.

[0164] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.

[0165] Reference Figure 6 The diagram illustrates a structural block diagram of an operating temperature control device for an outdoor edge roadside computing unit provided in an embodiment of the present invention, which may specifically include the following modules:

[0166] The first temperature information acquisition module 601 is used to acquire first temperature information through the power board module and control the heating system based on the first temperature information so that the server motherboard module is powered on under preset conditions.

[0167] The second temperature information acquisition module 602 is used to acquire second temperature information through the server motherboard module;

[0168] Temperature control module 603 is used to control the air-cooling system and / or liquid-cooling system through the power board module and / or the server motherboard module based on the second temperature information to control the operating temperature of the outdoor edge roadside computing unit.

[0169] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0170] In addition, this invention also provides an electronic device, including: a processor, a memory, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the various processes of the above-described embodiment of the method for controlling the operating temperature of an outdoor edge roadside computing unit and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0171] This invention also provides a computer-readable storage medium storing a computer program. When executed by a processor, the computer program implements the various processes described in the embodiments of the above-described method for controlling the operating temperature of an outdoor edge roadside computing unit, achieving the same technical effects. To avoid repetition, these details will not be repeated here. The computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0172] Figure 7 A schematic diagram of the hardware structure of an electronic device for implementing various embodiments of the present invention.

[0173] The electronic device 700 includes, but is not limited to, components such as: a radio frequency unit 701, a network module 702, an audio output unit 703, an input unit 704, a sensor 705, a display unit 706, a user input unit 707, an interface unit 708, a memory 709, a processor 710, and a power supply 711. Those skilled in the art will understand that... Figure 7 The electronic device structures shown are not intended to limit the electronic device. An electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements. In embodiments of the present invention, the electronic device includes, but is not limited to, mobile phones, tablet computers, laptops, PDAs, in-vehicle terminals, wearable devices, and pedometers.

[0174] It should be understood that, in this embodiment of the invention, the radio frequency unit 701 can be used for receiving and transmitting signals during information transmission or calls. Specifically, it receives downlink data from the base station and processes it with the processor 710; additionally, it transmits uplink data to the base station. Typically, the radio frequency unit 701 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low-noise amplifier, a duplexer, etc. Furthermore, the radio frequency unit 701 can also communicate with networks and other devices through a wireless communication system.

[0175] Electronic devices provide users with wireless broadband internet access through network module 702, such as helping users send and receive emails, browse web pages, and access streaming media.

[0176] The audio output unit 703 can convert audio data received by the radio frequency unit 701 or the network module 702 or stored in the memory 709 into audio signals and output them as sound. Furthermore, the audio output unit 703 can also provide audio output related to specific functions performed by the electronic device 700 (e.g., call signal reception sound, message reception sound, etc.). The audio output unit 703 includes a speaker, a buzzer, and a receiver, etc.

[0177] Input unit 704 is used to receive audio or video signals. Input unit 704 may include a graphics processing unit (GPU) 7041 and a microphone 7042. The GPU 7041 processes image data of still images or videos acquired by an image capture device (such as a camera) in video capture mode or image capture mode. The processed image frames can be displayed on display unit 706. The image frames processed by GPU 7041 can be stored in memory 709 (or other storage medium) or transmitted via radio frequency unit 701 or network module 702. Microphone 7042 can receive sound and process such sound into audio data. The processed audio data can be converted into a format that can be transmitted to a mobile communication base station via radio frequency unit 701 in telephone call mode.

[0178] The electronic device 700 also includes at least one sensor 705, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor and a proximity sensor. The ambient light sensor can adjust the brightness of the display panel 7061 according to the ambient light level, and the proximity sensor can turn off the display panel 7061 and / or backlight when the electronic device 700 is moved to the ear. As a type of motion sensor, an accelerometer sensor can detect the magnitude of acceleration in various directions (generally three axes). When stationary, it can detect the magnitude and direction of gravity and can be used to identify the posture of the electronic device (such as landscape / portrait switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc. The sensor 705 may also include a fingerprint sensor, pressure sensor, iris sensor, molecular sensor, gyroscope, barometer, hygrometer, thermometer, infrared sensor, etc., which will not be described in detail here.

[0179] The display unit 706 is used to display information input by the user or information provided to the user. The display unit 706 may include a display panel 7061, which may be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like.

[0180] User input unit 707 can be used to receive input numerical or character information, and to generate key signal inputs related to user settings and function control of electronic devices. Specifically, user input unit 707 includes a touch panel 7071 and other input devices 7072. Touch panel 7071, also known as a touch screen, can collect touch operations performed by the user on or near it (such as operations performed by the user using a finger, stylus, or any suitable object or accessory on or near touch panel 7071). Touch panel 7071 may include two parts: a touch detection device and a touch controller. The touch detection device detects the user's touch position and the signal generated by the touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into touch point coordinates, and sends it to the processor 710, which receives and executes commands from the processor 710. In addition, touch panel 7071 can be implemented using various types such as resistive, capacitive, infrared, and surface acoustic wave. Besides touch panel 7071, user input unit 707 may also include other input devices 7072. Specifically, other input devices 7072 may include, but are not limited to, physical keyboards, function keys (such as volume control buttons, power buttons, etc.), trackballs, mice, joysticks, etc., which will not be described in detail here.

[0181] Furthermore, the touch panel 7071 can cover the display panel 7061. When the touch panel 7071 detects a touch operation on or near it, it transmits the information to the processor 710 to determine the type of touch event. Subsequently, the processor 710 provides corresponding visual output on the display panel 7061 based on the type of touch event. Although in Figure 7 In this embodiment, the touch panel 7071 and the display panel 7061 are two independent components to realize the input and output functions of the electronic device. However, in some embodiments, the touch panel 7071 and the display panel 7061 can be integrated to realize the input and output functions of the electronic device. The specific implementation is not limited here.

[0182] Interface unit 708 serves as an interface for connecting external devices to electronic device 700. For example, external devices may include a wired or wireless headphone port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device with an identification module, an audio input / output (I / O) port, a video I / O port, a headphone port, and so on. Interface unit 708 can be used to receive input from external devices (e.g., data, power, etc.) and transmit the received input to one or more components within electronic device 700, or it can be used to transmit data between electronic device 700 and external devices.

[0183] The memory 709 can be used to store software programs and various data. The memory 709 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, applications required for at least one function (such as sound playback, image playback, etc.), etc.; the data storage area may store data created based on the use of the mobile phone (such as audio data, phonebook, etc.). Furthermore, the memory 709 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0184] The processor 710 is the control center of the electronic device. It connects various parts of the electronic device via various interfaces and lines. By running or executing software programs and / or modules stored in the memory 709, and by calling data stored in the memory 709, it performs various functions and processes data, thereby providing overall monitoring of the electronic device. The processor 710 may include one or more processing units; preferably, the processor 710 may integrate an application processor and a modem processor. The application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into the processor 710.

[0185] The electronic device 700 may also include a power supply 711 (such as a battery) for supplying power to various components. Preferably, the power supply 711 is logically connected to the processor 710 through a power management system, thereby enabling functions such as managing charging, discharging, and power consumption through the power management system.

[0186] In addition, the electronic device 700 includes some functional modules not shown, which will not be described in detail here.

[0187] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0188] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0189] like Figure 8 As shown, in another embodiment of the present invention, a computer-readable storage medium 801 is also provided, which stores instructions that, when executed on a computer, cause the computer to perform the operating temperature control method for the outdoor edge roadside computing unit described in the above embodiment.

[0190] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

[0191] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed in this invention can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0192] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0193] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0194] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0195] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0196] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, essentially, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0197] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for operating temperature control for an outdoor edge roadside computing unit, characterized by, The outdoor edge roadside computing unit includes a protective enclosure and an edge server unit installed inside the protective enclosure; The edge server unit includes a server motherboard module, and the outdoor edge roadside computing unit is equipped with a power board module, an air-cooling system, a liquid-cooling system, and a heating system for the edge server unit. The method includes: The power board module obtains the first temperature information and controls the heating system based on the first temperature information so that the server motherboard module is powered on under preset conditions. The second temperature information is obtained through the server motherboard module; Based on the second temperature information, the power board module and / or the server motherboard module control the air cooling system and / or the liquid cooling system to control the operating temperature for the outdoor edge roadside computing unit. The protective chassis is equipped with a server air intake for the server motherboard module. The server motherboard module includes sensors, a baseboard management controller, and a core chip. The step of obtaining the second temperature information through the server motherboard module includes: The baseboard management controller is used to obtain the chip operating temperature for the core chip; The second server intake air temperature for the server air inlet is obtained using the sensor on the motherboard. The sensor on the motherboard is used to send the second server intake air temperature to the microcontroller of the power board module. The baseboard management controller is used to receive the chip operating temperature. The steps of controlling the air cooling system and / or the liquid cooling system based on the second temperature information through the power board module and / or the server motherboard module include: The baseboard management controller controls the start of the air-cooling system based on the chip's operating temperature; the first temperature information includes the first server inlet air temperature of the air-cooling internal circulation inlet of the power board module. The microcontroller is used to determine the server inlet air temperature value from the first server inlet air temperature and the second server inlet air temperature; the server inlet air temperature value is the higher temperature value between the first server inlet air temperature and the second server inlet air temperature. When the microcontroller determines that the server's air intake temperature is not lower than the second preset temperature threshold, it controls the air-cooling system to shut down and controls the liquid-cooling system to turn on. When the server intake air temperature is lower than the second preset temperature threshold, the step of using the substrate management controller to control the air cooling system to start based on the chip operating temperature is executed. The protective chassis is equipped with an air-cooled external circulation air inlet, and the power board module is equipped with a temperature sensor, with the probe of the temperature sensor located at the air-cooled external circulation air inlet. The temperature sensor is used to obtain the third server inlet air temperature for the air-cooled external circulation inlet via the probe, and the third server inlet air temperature is sent to the microcontroller. When the microcontroller determines that the air intake temperature of the third server is lower than the third preset temperature threshold, it controls the air cooling system to turn on and controls the liquid cooling system to turn off.

2. The method according to claim 1, characterized in that, The protective enclosure is equipped with an air-cooled internal circulation air inlet for the power board module; The power board module includes sensors on the power board. The step of obtaining the first temperature information through the power board module includes: The first server inlet air temperature is obtained using the sensor on the power board for the air-cooled internal circulation inlet.

3. The method according to claim 2, characterized in that, The step of controlling the heating system based on the first temperature information to power on the server motherboard module under preset conditions includes: When the microcontroller determines that the air intake temperature of the first server is lower than the first preset temperature value, it controls the heating system to turn on. When the heating system is turned on for a preset duration threshold, the heating system is turned off and the server motherboard module is powered on.

4. The method according to claim 3, characterized in that, Also includes: When the microcontroller determines that the air intake temperature of the first server is not lower than the first preset temperature value, it controls the server motherboard module to power on.

5. The method according to claim 4, characterized in that, Also includes: When the microcontroller determines that the air intake temperature of the third server is not lower than the third preset temperature threshold, the steps of controlling the air cooling system to shut down and controlling the liquid cooling system to turn on are executed.

6. The method according to claim 5, characterized in that, The protective enclosure is equipped with a liquid-cooled internal circulation air inlet for the power board module, and the outdoor edge roadside computing unit is equipped with electromagnetic baffles for the liquid-cooled internal circulation air inlet and the air-cooled internal circulation air inlet, and also includes: When the air-cooling system is in the on state, the microcontroller controls the electromagnetic baffle to close the liquid-cooled internal circulation air inlet.

7. The method according to claim 6, characterized in that, Also includes: When the liquid cooling system is in the on state, the microcontroller controls the electromagnetic baffle to close the air inlet of the air-cooled internal circulation system.

8. The method according to claim 7, characterized in that, The protective chassis is provided with a server air outlet, and the air-cooling system includes an internal circulation fan module for the server air outlet and an external circulation fan module for the external circulation air inlet.

9. The method according to claim 7, characterized in that, The top of the protective enclosure is equipped with a waterproof sunshade.

10. The method according to claim 7, characterized in that, Thermal insulation foam is installed between the edge server unit and the protective chassis.

11. A temperature control device for operating an outdoor edge roadside computing unit, characterized in that, The outdoor edge roadside computing unit includes a protective enclosure and an edge server unit installed inside the protective enclosure; The edge server unit includes a server motherboard module, and the outdoor edge roadside computing unit is equipped with a power board module, an air-cooling system, a liquid-cooling system, and a heating system for the edge server unit. The device includes: The first temperature information acquisition module is used to acquire first temperature information through the power board module and control the heating system based on the first temperature information so that the server motherboard module is powered on under preset conditions. The second temperature information acquisition module is used to acquire second temperature information through the server motherboard module; A temperature control module is used to control the air-cooling system and / or liquid-cooling system based on the second temperature information via the power board module and / or the server motherboard module to control the operating temperature for the outdoor edge roadside computing unit. The protective chassis is provided with a server air intake for the server motherboard module. The server motherboard module includes sensors, a baseboard management controller, and a core chip on the motherboard. The second temperature information acquisition module is further used for: The baseboard management controller is used to obtain the chip operating temperature for the core chip; The second server intake air temperature for the server air inlet is obtained using the sensor on the motherboard. The sensor on the motherboard is used to send the intake air temperature of the second server to the microcontroller of the power board module; the baseboard management controller is used to receive the chip operating temperature; and the temperature control module is further used for: The baseboard management controller controls the start of the air-cooling system based on the chip's operating temperature; the first temperature information includes the first server inlet air temperature of the air-cooling internal circulation inlet of the power board module. The microcontroller is used to determine the server inlet air temperature value from the first server inlet air temperature and the second server inlet air temperature; the server inlet air temperature value is the higher temperature value between the first server inlet air temperature and the second server inlet air temperature. When the microcontroller determines that the server's air intake temperature is not lower than the second preset temperature threshold, it controls the air-cooling system to shut down and controls the liquid-cooling system to turn on. When the server intake air temperature is lower than the second preset temperature threshold, the baseboard management controller re-controls the air cooling system to start based on the chip operating temperature. The protective chassis is equipped with an air-cooled external circulation air inlet, and the power board module is equipped with a temperature sensor, with the probe of the temperature sensor located at the air-cooled external circulation air inlet. The temperature sensor is used to obtain the third server inlet air temperature for the air-cooled external circulation inlet via the probe, and the third server inlet air temperature is sent to the microcontroller. When the microcontroller determines that the air intake temperature of the third server is lower than the third preset temperature threshold, it controls the air cooling system to turn on and controls the liquid cooling system to turn off.

12. An electronic device, characterized in that, It includes a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; The memory is used to store computer programs; When the processor executes a program stored in the memory, it implements the method as described in any one of claims 1-10.

13. A computer-readable storage medium having instructions stored thereon that, when executed by one or more processors, cause the processors to perform the method as described in any one of claims 1-10.

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