Silicone-modified anhydride, curing agent, epoxy electronic adhesive and preparation method thereof

Abstract

The application discloses a kind of organic silicon modified anhydride, curing agent, epoxy electronic glue and preparation method thereof.The structural formula of the organic silicon modified anhydride is as follows.The curing agent is the curing agent containing the organic silicon modified anhydride, which is prepared from 3-methyl hexahydrophthalic anhydride, poly (dimethylsiloxane), glycidyl ether end-capped and accelerator.The epoxy electronic glue is prepared from the curing agent, epoxy resin, epoxy diluent and silicon powder.It has good cold and hot impact resistance, and also has defoaming ability, and the surface has no appearance defects such as oil floating after curing.

Description

Technical Field

[0001] This invention relates to the field of adhesive technology, and in particular to an organosilicon-modified acid anhydride, a curing agent, an epoxy electronic adhesive, and a method for preparing the same. Background Technology

[0002] With the development of electronics and electrical appliances, the usage of electronic adhesives is constantly increasing. Among epoxy electronic adhesives, anhydride-based epoxy electronic adhesives possess excellent electrical insulation properties, heat resistance, and chemical stability. However, due to varying application conditions and construction processes, epoxy electronic adhesives generally need to withstand thermal shock, possess defoaming capabilities during application, and have a smooth and even cured appearance free from defects such as floating oil. In the formulation design of epoxy electronic adhesives, defoamers and other silicone additives are typically added to enhance the defoaming ability and adjust surface tension, but this can easily lead to floating oil phenomena. Summary of the Invention

[0003] Based on this, the purpose of the present invention is to provide an epoxy electronic adhesive that is resistant to thermal shock, which also has defoaming ability and no appearance defects such as floating oil on the surface after curing.

[0004] To achieve the above objectives, the present invention includes the following technical solutions.

[0005] On the one hand, the present invention provides an organosilicon-modified acid anhydride, the structural formula of which is as follows:

[0006]

[0007] Where n = 10 - 50.

[0008] Secondly, the present invention also provides the application of the organosilicon-modified acid anhydride as a curing agent in the preparation of epoxy electronic adhesives.

[0009] Thirdly, the present invention also provides an organosilicon-modified anhydride curing agent, which is prepared from the following raw materials in parts by weight:

[0010] 100 parts of 3-methylhexahydrophthalic anhydride

[0011] 60-220 parts of poly(dimethylsiloxane), monoglycidyl ether-terminated

[0012] Accelerator 0-3 parts.

[0013] In some embodiments, the organosilicon-modified anhydride curing agent is prepared from the following raw materials in parts by weight:

[0014] 100 parts of 3-methylhexahydrophthalic anhydride

[0015] 70-200 parts of poly(dimethylsiloxane), monoglycidyl ether end-capped

[0016] Accelerator 0.2 to 3 parts.

[0017] In some embodiments, the organosilicon-modified anhydride curing agent is prepared from the following raw materials in parts by weight:

[0018] 100 parts of 3-methylhexahydrophthalic anhydride

[0019] 70-150 parts of poly(dimethylsiloxane), monoglycidyl ether end-capped

[0020] Accelerator 0.5 to 1 part.

[0021] In some embodiments, the organosilicon-modified anhydride curing agent is prepared from the following raw materials in parts by weight:

[0022] 100 parts of 3-methylhexahydrophthalic anhydride

[0023] 90-120 parts of poly(dimethylsiloxane), monoglycidyl ether end-capped

[0024] Accelerator 0.5 to 1 part.

[0025] In some embodiments, the organosilicon-modified anhydride curing agent is prepared from the following raw materials in parts by weight:

[0026] 100 parts of 3-methylhexahydrophthalic anhydride

[0027] 95-105 parts of poly(dimethylsiloxane), monoglycidyl ether end-capped

[0028] Accelerator 0.5 to 1 part.

[0029] In some embodiments, the poly(dimethylsiloxane), monoglycidyl ether-terminated structure is as follows:

[0030]

[0031] Where n = 10 - 50.

[0032] In some embodiments, the silicone-modified anhydride curing agent comprises a silicone-modified anhydride with the following structure:

[0033]

[0034] Where n = 10 - 50.

[0035] In some embodiments, the accelerator is selected from tertiary amine accelerators.

[0036] Fourthly, the present invention also provides a method for preparing the organosilicon-modified anhydride curing agent, comprising the following steps:

[0037] The 3-methylhexahydrophthalic anhydride is added to the reactor, the temperature is raised to 90℃~110℃, the accelerator and poly(dimethylsiloxane) are added dropwise, and the end caps are sealed with glycidyl ether. After the addition is complete, the reaction is carried out at 90℃~110℃ for 1-3 hours to obtain the organosilicon modified anhydride curing agent.

[0038] In some embodiments, the accelerator and poly(dimethylsiloxane) monoglycidyl ether end-capped are added dropwise over a period of 1-3 hours.

[0039] Fifthly, the present invention also provides an epoxy electronic adhesive, comprising component A and component B; wherein component B is the organosilicon-modified anhydride curing agent of the present invention; and, by weight, component A comprises the following raw material components:

[0040] 100 parts epoxy resin

[0041] 5-25 parts epoxy diluent

[0042] 100-250 parts of silica powder.

[0043] In some embodiments, component A comprises, by weight, the following raw material components:

[0044] 100 parts epoxy resin

[0045] 10-20 parts epoxy diluent

[0046] 120-200 parts of silica powder.

[0047] In some embodiments, component A comprises, by weight, the following raw material components:

[0048] 100 parts epoxy resin

[0049] 12-18 parts epoxy diluent

[0050] 120-180 parts of silica powder.

[0051] In some embodiments, component A comprises, by weight, the following raw material components:

[0052] 100 parts epoxy resin

[0053] 14-16 parts epoxy diluent

[0054] 140-160 parts of silica powder.

[0055] In some embodiments, when used, component A and component B are mixed at a mass ratio of 1:0.5 to 2.

[0056] In some embodiments, when used, component A and component B are mixed at a mass ratio of 1:0.8 to 1.2.

[0057] In some embodiments, when used, component A and component B are mixed in a mass ratio of 1:1.

[0058] In some embodiments, the epoxy resin is epoxy resin E-51.

[0059] In some embodiments, the epoxy diluent is the epoxy reactive diluent AGE.

[0060] In a sixth aspect, the present invention also provides a method for preparing the epoxy electronic adhesive, comprising the following steps:

[0061] Add the 3-methylhexahydrophthalic anhydride to the reactor, heat to 90℃~110℃, add the accelerator and poly(dimethylsiloxane) dropwise, and cap with glycidyl ether monocapsule. After the dropwise addition is complete, react at 90℃~110℃ for 1-3 hours to obtain component B.

[0062] The epoxy resin, epoxy diluent, and silica powder are mixed evenly to obtain component A.

[0063] This invention prepares an organosilicon-modified anhydride by reacting poly(dimethylsiloxane), monoglycidyl ether-terminated with 3-methylhexahydrophthalic anhydride, which can be used as a curing agent for epoxy electronic adhesives. Using it as a curing agent in the preparation of epoxy electronic adhesives can improve the thermal shock resistance of the adhesives; simultaneously, the organosilicon segments can reduce surface tension, giving the resulting epoxy electronic adhesives good defoaming ability, meeting the defoaming requirements of the process; furthermore, the organosilicon segments participate in the main chain reaction, preventing surface oil and other appearance defects from appearing in the cured epoxy electronic adhesives. Attached Figure Description

[0064] Figure 1 The infrared spectrum of the organosilicon-modified anhydride curing agent. Detailed Implementation

[0065] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments are merely illustrative of the present invention and should not be considered as specific limitations thereof.

[0066] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention.

[0067] The terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product, or device that includes a series of steps is not limited to the steps or modules listed, but may optionally include steps not listed, or may optionally include other steps inherent to such process, method, product, or device.

[0068] In this invention, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0069] The following are specific examples.

[0070] In the following examples and comparative examples, the structural formula of 3-methylhexahydrophthalic anhydride is as follows:

[0071]

[0072] In the following examples and comparative examples, the epoxy resin used is epoxy resin E-51.

[0073] In the following examples and comparative examples, the epoxy diluent used is the epoxy reactive diluent AGE.

[0074] In the following examples and comparative examples, the accelerator used was N,N-benzyldimethylamine.

[0075] Example 1:

[0076] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this embodiment is shown in Table 1:

[0077] Table 1. Component composition of silicone-modified acid anhydride curing agent and epoxy electronic adhesive

[0078]

[0079] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0080]

[0081] Where n = 10.

[0082] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this embodiment are as follows:

[0083] (1) Weigh 100 parts of 3-methylhexahydrophthalic anhydride, 70 parts of poly(dimethylsiloxane), monoglycidyl ether end-capping agent, and 0.5 parts of accelerator according to the mass fractions specified in component B in the mass fraction table. Add 3-methylhexahydrophthalic anhydride to a three-necked flask equipped with a stirrer, thermometer, reflux condenser, and dropping funnel. Heat to 100°C, and add the accelerator and poly(dimethylsiloxane), monoglycidyl ether end-capping agent dropwise, controlling the temperature at 90-110°C. The dropwise addition should be completed within 1-3 hours. Maintain the temperature at 100°C and continue the reaction for 2 hours to obtain component B, i.e., organosilicon-modified anhydride curing agent.

[0084] The infrared spectrum of the obtained organosilicon-modified acid anhydride curing agent is as follows: Figure 1 As shown in the infrared image, the product (black line) no longer has the characteristic peak of epoxy groups present in the raw material at 908 cm⁻¹. -1 This indicates that the epoxide groups were completely consumed in the reaction, and an additional 1731 cm⁻¹ was produced. -1 The ester group absorption peak is observed. Furthermore, due to the excess of acid anhydride in the reaction and its easy hydrolysis, the carboxylic acid absorption peak of the product is not significantly different from that of the raw material. The infrared data indicate the structural formula of the obtained organosilicon-modified acid anhydride curing agent as follows:

[0085]

[0086] The reaction formula is as follows:

[0087]

[0088] Where n = 10.

[0089] (2) Weigh 100 parts of epoxy resin, 15 parts of epoxy diluent, and 100 parts of silica powder according to the mass fractions of component A in the mass fraction table, mix them evenly at room temperature to obtain component A.

[0090] (3) When using, mix component B and component A at a mass ratio of 1:1 and cure at room temperature.

[0091] Example 2:

[0092] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this embodiment is shown in Table 2:

[0093] Table 2. Component composition of silicone-modified acid anhydride curing agent and epoxy electronic adhesive

[0094]

[0095] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0096]

[0097] Where n = 10.

[0098] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this embodiment are the same as those in Embodiment 1.

[0099] Example 3:

[0100] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this embodiment is shown in Table 3:

[0101] Table 3. Component composition of silicone-modified acid anhydride curing agent and epoxy electronic adhesive

[0102]

[0103]

[0104] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0105]

[0106] Where n = 10.

[0107] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this embodiment are the same as those in Embodiment 1.

[0108] Example 4:

[0109] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this embodiment is shown in Table 4:

[0110] Table 4. Component composition of silicone-modified acid anhydride curing agent and epoxy electronic adhesive

[0111]

[0112] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0113]

[0114] Where n = 10.

[0115] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this embodiment are the same as those in Embodiment 1.

[0116] Example 5:

[0117] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this embodiment is shown in Table 5:

[0118] Table 5. Component composition of silicone-modified acid anhydride curing agent and epoxy electronic adhesive

[0119]

[0120] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0121]

[0122] Where n = 10.

[0123] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this embodiment are the same as those in Embodiment 1.

[0124] Example 6:

[0125] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this embodiment is shown in Table 6:

[0126] Table 6. Component composition of silicone-modified anhydride curing agent and epoxy electronic adhesive

[0127]

[0128] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0129]

[0130] Where n = 10.

[0131] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this embodiment are the same as those in Embodiment 1.

[0132] Comparative Example 1:

[0133] The composition of the epoxy electronic adhesive provided in this comparative example is shown in Table 7:

[0134] Table 7 Component Composition of Epoxy Adhesives

[0135]

[0136]

[0137] The preparation method of the epoxy electronic adhesive provided in this comparative example is as follows:

[0138] (1) Weigh 100 parts of epoxy resin, 15 parts of epoxy diluent, 0.5 parts of silicone defoamer, and 150 parts of silica powder, mix them evenly at room temperature to obtain component A, and set aside.

[0139] (2) Weigh 100 parts of 3-methylhexahydrophthalic anhydride and 0.5 parts of accelerator, mix them evenly at room temperature to obtain component B, and set aside for later use;

[0140] (3) When using, component A and component B are mixed and cured at a mass ratio of 1:1 at room temperature.

[0141] Comparative Example 2

[0142] The composition of the epoxy electronic adhesive provided in this comparative example is shown in Table 8:

[0143] Table 8 Component Composition of Epoxy Adhesives

[0144]

[0145] The toughening agent used is 102C-5 from Jiangsu Taizhou Hengchuang New Materials Co., Ltd.

[0146] The preparation method of the epoxy electronic adhesive provided in this comparative example is as follows:

[0147] (1) Weigh 100 parts of epoxy resin, 15 parts of epoxy diluent, 150 parts of silica powder, and 15 parts of toughening agent, mix them evenly at room temperature to obtain component A, and set aside.

[0148] (2) Weigh 100 parts of 3-methylhexahydrophthalic anhydride and 0.5 parts of accelerator, mix them evenly at room temperature to obtain component B, and set aside for later use;

[0149] (3) When using, component A and component B are mixed and cured at a mass ratio of 1:1 at room temperature.

[0150] Comparative Example 3

[0151] The composition of the epoxy electronic adhesive provided in this comparative example is shown in Table 9:

[0152] Table 9. Component Composition of Epoxy Electronic Adhesive

[0153]

[0154] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0155]

[0156] Where n = 10.

[0157] The preparation method of the epoxy electronic adhesive provided in this comparative example is as follows:

[0158] (1) Weigh 100 parts of epoxy resin, 15 parts of epoxy diluent, and 150 parts of silica powder, mix them evenly at room temperature to obtain component A, and set aside.

[0159] (2) Weigh 100 parts of 3-methylhexahydrophthalic anhydride, 100 parts of poly(dimethylsiloxane), 0.5 parts of glycidyl ether end-capping agent, and mix them evenly at room temperature to obtain component B for later use.

[0160] (3) When using, component A and component B are mixed and cured at a mass ratio of 1:1 at room temperature.

[0161] Comparative Example 4

[0162] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this comparative example is shown in Table 10:

[0163] Table 10 Composition of Organosilicon Modified Anhydride Curing Agent and Epoxy Electronic Adhesive

[0164]

[0165] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this comparative example are the same as those in Example 2, except that the poly(dimethylsiloxane) monoglycidyl ether end-capping agent in Example 2 is replaced with an equal amount of terminal hydroxyl polydimethylsiloxane.

[0166] Comparative Example 5

[0167] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this comparative example are shown in Table 11:

[0168] Table 11 Composition of Organosilicon Modified Anhydride Curing Agent and Epoxy Electronic Adhesive

[0169]

[0170] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0171]

[0172] Where n = 10.

[0173] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this comparative example are the same as those in Example 2, except that the 3-methylhexahydrophthalic anhydride in Example 2 is replaced with an equal amount of maleic anhydride during the preparation process.

[0174] Comparative Example 6

[0175] The composition of the silicone-modified anhydride curing agent (component B) and the epoxy electronic adhesive provided in this comparative example is shown in Table 12:

[0176] Table 12 Composition of Organosilicon Modified Anhydride Curing Agent and Epoxy Electronic Adhesive

[0177]

[0178] The structural formula of poly(dimethylsiloxane), monoglycidyl ether-terminated poly(dimethylsiloxane) is as follows:

[0179]

[0180] Where n = 10.

[0181] The preparation methods of the organosilicon-modified anhydride curing agent and epoxy electronic adhesive provided in this comparative example are the same as those in Example 2, except that the 3-methylhexahydrophthalic anhydride in Example 2 is replaced with an equal amount of dodecenylsuccinic anhydride during the preparation process.

[0182] The epoxy electronic adhesives prepared in Examples 1-6 and Comparative Examples 1-6 were subjected to the following performance tests:

[0183] Al-Al shear strength: tested according to GB / T 7124-2008.

[0184] Al-Al shear strength after 168 hours of thermal shock: Refer to GB / T 2423.22, temperature range -40~80℃, hold at high and low temperatures for 1 hour each, cycle for 168 hours; then test according to GB / T 7124-2008.

[0185] Defoaming ability: After components A and B in the epoxy electronic adhesive are mixed evenly, they are placed in a vacuum chamber with a relative vacuum of -80kPa, and the bubbles generated within 5 minutes are observed to see if they can be defoamed.

[0186] Oil floating condition on the cured surface: Observe the appearance of the cured surface after curing.

[0187] Weather resistance: After 7 days of outdoor aging, the yellowing index ΔYi was measured.

[0188] The test results are shown in Tables 13 and 14.

[0189] Table 13 Performance test results of the epoxy electronic adhesives prepared in Examples 1-6

[0190]

[0191] Table 14 Comparison of performance test results of epoxy electronic adhesives prepared in Example 2 and Comparative Examples 1-6

[0192]

[0193] As can be seen from the test results in Table 13, by adding the organosilicon-modified acid anhydride prepared in this invention as a curing agent, the epoxy electronic adhesive prepared in this invention can have good resistance to thermal shock and defoaming ability, and the surface is free of appearance defects such as floating oil after curing.

[0194] Comparative Example 1 is an epoxy adhesive with added silicone defoamer in the prior art. Although it has defoaming ability, it has poor resistance to thermal shock. After 168 hours of thermal shock, its shear strength drops significantly, and there are appearance defects such as floating oil on the surface after curing.

[0195] Comparative Example 2 is an epoxy adhesive with added toughening agent in the prior art. Although it has certain resistance to thermal shock, this epoxy adhesive does not have defoaming ability.

[0196] In Comparative Example 3, the acid anhydride and poly(dimethylsiloxane) monoglycidyl ether end-capping were simply mixed and added without prior reaction. The AL-AL bonding strength and thermal shock resistance were similar to the epoxy adhesive of the present invention, and it also had defoaming ability. However, there was an oil floating phenomenon on the cured surface after curing.

[0197] Comparative Example 4 used hydroxyl-terminated polydimethylsiloxane-modified acid anhydride as a curing agent. The epoxy adhesive prepared by it had similar defoaming ability and cured appearance to the present invention, but its bonding strength was significantly reduced.

[0198] Comparative Example 5 prepared a modified curing agent using poly(dimethylsiloxane), monoglycidyl ether end-capping and maleic anhydride as raw materials. The epoxy adhesive prepared by it had worse weather resistance compared with that of the present invention.

[0199] Comparative Example 6 prepared a modified curing agent using poly(dimethylsiloxane), monoglycidyl ether end-capping and dodecenyl succinic anhydride as raw materials. The epoxy adhesive prepared by it had worse bonding performance compared with the present invention.

[0200] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0201] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An organosilicon-modified acid anhydride, characterized in that, Its structural formula is as follows: Where n = 10 - 50.

2. The application of the organosilicon-modified acid anhydride as described in claim 1 as a curing agent in the preparation of epoxy electronic adhesive.

3. An organosilicon-modified acid anhydride curing agent, characterized in that, It is prepared from the following raw materials in parts by weight: 100 parts of 3-methylhexahydrophthalic anhydride 70-200 parts of monoglycidyl ether-terminated polydimethylsiloxane Accelerator 0.2-3 parts.

4. The organosilicon-modified anhydride curing agent according to claim 3, characterized in that, It is prepared from the following raw materials in parts by weight: 100 parts of 3-methylhexahydrophthalic anhydride 70-150 parts of monoglycidyl ether-terminated polydimethylsiloxane Accelerator 0.5~1 part.

5. The organosilicon-modified anhydride curing agent according to claim 4, characterized in that, It is prepared from the following raw materials in parts by weight: 100 parts of 3-methylhexahydrophthalic anhydride 90-120 parts of monoglycidyl ether-terminated polydimethylsiloxane Accelerator 0.5~1 part.

6. The organosilicon-modified anhydride curing agent according to claim 5, characterized in that, It is prepared from the following raw materials in parts by weight: 100 parts of 3-methylhexahydrophthalic anhydride 95-105 parts of monoglycidyl ether-terminated polydimethylsiloxane Accelerator 0.5~1 part.

7. The organosilicon-modified anhydride curing agent according to any one of claims 3-6, characterized in that, The accelerator is a tertiary amine accelerator; and / or The structural formula of the monoglycidyl ether-terminated polydimethylsiloxane is as follows: Where n = 10 - 50.

8. The organosilicon-modified anhydride curing agent according to any one of claims 3-6, characterized in that, The organosilicon-modified anhydride curing agent contains organosilicon-modified anhydrides with the following structure: Where n = 10 - 50.

9. A method for preparing the organosilicon-modified anhydride curing agent according to any one of claims 3-8, characterized in that, Includes the following steps: The 3-methylhexahydrophthalic anhydride is added to the reactor, the temperature is raised to 90℃~110℃, the accelerator and monoglycidyl ether-terminated polydimethylsiloxane are added dropwise, and after the addition is complete, the reaction is carried out at 90℃~110℃ for 1-3 hours to obtain the organosilicon-modified anhydride curing agent.

10. An epoxy electronic adhesive, characterized in that, It includes component A and component B; said component B is the organosilicon-modified acid anhydride curing agent according to any one of claims 3-8; By weight, component A comprises the following raw material components: 100 parts epoxy resin 5-25 parts epoxy diluent 100-250 parts of silicon micro powder.

11. The epoxy electronic adhesive according to claim 10, characterized in that, By weight, component A comprises the following raw material components: 100 parts epoxy resin 10-20 parts epoxy diluent 120-200 parts of silica powder.

12. The epoxy electronic adhesive according to claim 11, characterized in that, By weight, component A comprises the following raw material components: 100 parts epoxy resin 12-18 parts epoxy diluent 120-180 parts of silica powder.

13. The epoxy electronic adhesive according to claim 12, characterized in that, By weight, component A comprises the following raw material components: 100 parts epoxy resin 14-16 parts epoxy diluent 140-160 parts of silica powder.

14. The epoxy electronic adhesive according to any one of claims 10-13, characterized in that, In use, component A and component B are mixed at a mass ratio of 1:0.5~2; and / or, The epoxy resin is epoxy resin E-51; and / or, The epoxy diluent is the epoxy reactive diluent AGE.

15. The epoxy electronic adhesive according to claim 14, characterized in that, When in use, component A and component B are mixed at a mass ratio of 1:0.8~1.

2.

16. The epoxy electronic adhesive according to claim 15, characterized in that, When in use, component A and component B are mixed at a mass ratio of 1:

1.

17. A method for preparing an epoxy electronic adhesive according to any one of claims 10-16, characterized in that, Includes the following steps: Add the 3-methylhexahydrophthalic anhydride to the reactor, heat to 90℃~110℃, add the accelerator and monoglycidyl ether-terminated polydimethylsiloxane dropwise, and react at 90℃~110℃ for 1-3 hours after the dropwise addition is complete to obtain component B. The epoxy resin, epoxy diluent, and silica powder are mixed evenly to obtain component A.

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