A construction method for photosensitive resin building waterproofing layer

By using V-shaped injection of photosensitive resin and ultraviolet curing technology, combined with a specific ratio of polymers and fillers, the problems of easy cracking and complex construction of waterproof layers have been solved, achieving high weather resistance and hydrophobicity, and extending service life.

CN117822752BActive Publication Date: 2026-06-30CSCEC STRAIT CONSTR & DEV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CSCEC STRAIT CONSTR & DEV
Filing Date
2024-01-04
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing building waterproofing materials are prone to cracking after aging in sunlight, leading to leakage risks, and the construction process is complex and of poor quality.

Method used

Photosensitive resin material is used, and the coating thickness and light exposure time are controlled by V-shaped opening injection and ultraviolet curing. Combined with the ratio of polymer monomers, photosensitizers, diluents and fillers, a tightly bonded waterproof layer is formed.

Benefits of technology

It achieves high weather resistance, hydrophobicity and high temperature resistance of the waterproof layer, reduces the risk of cracking, extends service life and simplifies construction process.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a construction method for a photosensitive resin building waterproof layer, comprising the following steps: cleaning the substrate thoroughly to ensure it is free of water, dust, and debris; treating cracks in the substrate into V-shaped openings, injecting photosensitive resin into the V-shaped openings, and irradiating with ultraviolet light for 10-60 minutes; applying the photosensitive resin multiple times to the surface of the building layer using a scraper, and if encountering corners or requiring a certain height, using a brush to brush the photosensitive resin upwards to a height of 5cm, and applying it to corners to form a rounded corner, ensuring no air bubbles are present; if a slope is required, scraping the photosensitive resin onto the building surface using a scraper; irradiating with ultraviolet light for 10-60 minutes; repeating the above steps until the waterproof layer thickness is 0.5-3.0cm. This invention utilizes the dense texture, good formability, and strong adhesion of photosensitive resin to the substrate, curing the photosensitive resin into the substrate. The cured waterproof layer exhibits strong hydrophobicity, strong intermolecular forces, and minimal temperature influence, making it less prone to cracking and effectively preventing water seepage.
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Description

Technical Field

[0001] This invention belongs to the field of building waterproofing construction technology, and specifically relates to a construction method for a photosensitive resin building waterproofing layer. Background Technology

[0002] A building waterproofing layer is a layer of waterproof material used to protect the building structure from water damage. It is mainly used on building parts such as roofs, floors, walls, basements, and bathrooms. Its function is to prevent rainwater, domestic water leakage, and groundwater erosion within the design lifespan of the building, ensuring that the building structure and interior space are not damaged, and providing people with a comfortable and safe living environment.

[0003] In the prior art, such as Chinese patent CN108086684B, a construction waterproofing method using non-curing rubber asphalt and its application are disclosed. This relates to the technical field of waterproofing layer construction methods. The aforementioned construction waterproofing method utilizes the advantage that non-curing rubber asphalt does not harden for a long time after construction, which can maintain the original performance of the waterproofing material for a long time. This alleviates the problem that existing cured waterproofing coatings have poor crack resistance and lose their waterproofing function once the coated substrate deforms and cracks. However, the construction process of this invention is complex, and the waterproofing material has poor weather resistance. After aging under sunlight, it will crack and there is a risk of leakage. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a construction method for a photosensitive resin building waterproof layer. The resulting waterproof layer exhibits excellent weather resistance, hydrophobicity, and high-temperature resistance, effectively preventing water seepage in building waterproof layers.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A method for constructing a photosensitive resin waterproofing layer includes the following steps:

[0007] S1: Clean the base layer thoroughly and ensure that there is no standing water, dust, or debris residue on the base layer;

[0008] S2: Treat the cracks in the substrate into V-shaped openings, inject photosensitive resin into the V-shaped openings, and use a radiation intensity greater than 90uW / cm². 2 Irradiate with ultraviolet light for 10-60 minutes;

[0009] S3: Use a scraper to apply the photosensitive resin to the building surface multiple times. If there is a corner or a certain height is required, use a brush to brush the photosensitive resin upward to a height of 5cm at the corner and apply it to form an arc corner, ensuring that there are no air bubbles inside. If a slope is required, use a scraper to apply the photosensitive resin to the building surface.

[0010] S4: Use radiation intensity greater than 90uW / cm 2 Irradiate with ultraviolet light for 10-60 minutes;

[0011] S5: Repeat steps S3-S4 until the waterproof layer thickness is 0.5-3.0cm.

[0012] Furthermore, in step S2, the V-shaped opening angle is greater than 45°.

[0013] Furthermore, in step S3, the thickness of the first application of photosensitive resin is ≤4mm, and the thickness of subsequent applications of photosensitive resin is ≤3mm.

[0014] Furthermore, the photosensitive resin is composed of the following raw materials in weight percentages: 40%-70% polymer monomer, 1%-5% photosensitizer, 10%-50% diluent, 0.1%-1% pigment, and 0.1%-1% filler.

[0015] Furthermore, the preparation process of the photosensitive resin is as follows: the polymer monomer, photosensitizer, diluent, pigment and filler are mixed in a set ratio, stirred for 30 minutes at a stirring speed of 60 r / min, and then allowed to stand for 1 hour after stirring to obtain the photosensitive resin.

[0016] Furthermore, the compressive strength of the photosensitive resin after curing is greater than 10 MPa.

[0017] Furthermore, the polymer monomer is one or more of hydroxypropyl acrylate and hydroxyethyl acrylate.

[0018] Furthermore, the photosensitizer is 1173 photoinitiator.

[0019] Furthermore, the diluent is at least one of isobornyl acrylate and hydroxypropyl acrylate.

[0020] Furthermore, the filler is at least one of ceramic powder, silica, kaolin, and talc.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The present invention provides a construction method for a photosensitive resin building waterproof layer. Utilizing the characteristics of photosensitive resin, such as its dense texture, good formability, and ability to bond tightly to the substrate, the photosensitive resin is photocured onto the substrate. The cured waterproof layer exhibits strong hydrophobicity, strong intermolecular forces, and is less affected by temperature, making it less prone to cracking and effectively preventing water seepage. Furthermore, the cured waterproof layer has strong weather resistance, slow aging rate, and long service life. The construction process is simple, changing the previous characteristics of complex waterproof layer construction processes and poor construction quality.

[0023] 2. In this invention, step S2 processes the cracks in the base layer into V-shaped openings with an angle greater than 45°, and then injects photosensitive resin into the V-shaped openings for curing. This increases the contact area between the photosensitive resin and the base layer, and also increases the area for UV curing, ensuring a tight bond between the photosensitive resin and the surface of the base layer at the crack. This facilitates complete curing of the photosensitive resin and improves the waterproofness of the waterproof layer.

[0024] 3. In this invention, the thickness of the first application of photosensitive resin in step S3 is ≤4mm, and the thickness of subsequent applications of photosensitive resin is ≤3mm. By applying the resin in multiple layers and controlling the thickness, the shrinkage during photocuring can be reduced, the internal thermal stress can be reduced, and the uniformity of the coating can be improved. By controlling the thickness of the coating, the curing speed of the photosensitive resin can also be increased, saving construction time.

[0025] 4. In this invention, the photosensitive resin is composed of the following raw materials in weight percentages: 40%-70% polymer monomer, 1%-5% photosensitizer, 10%-50% diluent, 0.1-1% pigment, and 0.1-1% filler. The preparation process of the photosensitive resin is as follows: the polymer monomer, photosensitizer, diluent, pigment, and filler are mixed in a set ratio and stirred for 30 minutes at a stirring speed of 60 r / min. After stirring, the mixture is allowed to stand for 1 hour. The resulting photosensitive resin has a compressive strength greater than 10 MPa after curing. The resulting waterproof layer can effectively prevent water penetration and damage to the building structure, and can maintain stable performance of the waterproof layer for a long time, thereby extending the service life of the building.

[0026] 5. In this invention, the polymer monomers used in the photosensitive resin are one or more of hydroxypropyl acrylate and hydroxyethyl acrylate. Hydroxypropyl acrylate and hydroxyethyl acrylate have good photosensitivity, film-forming properties and chemical resistance, and they also have certain elasticity and toughness, which can improve the compressive strength and impact resistance of the photosensitive resin, and help improve the durability and stability of the waterproof layer.

[0027] 6. In this invention, the photoinitiator used in the photosensitive resin is 1173 photoinitiator. 1173 photoinitiator has high sensitivity, fast photocuring speed, low bubble formation rate and good stability, which can improve the efficiency of photocuring and increase the service life of the photosensitive resin.

[0028] 7. In this invention, the diluent used in the photosensitive resin is at least one of isobornyl acrylate and hydroxypropyl acrylate. Isobornyl acrylate and hydroxypropyl acrylate have good compatibility with polymer monomers and can be fully miscible with other components in the photosensitive resin without causing phase separation or precipitation.

[0029] 8. In this invention, the filler used in the photosensitive resin is at least one of ceramic powder, silica, kaolin and talc. Ceramic powder and silica have good thermal conductivity, which can quickly conduct and disperse heat, thereby improving the thermal conductivity of the waterproof layer. By adding ceramic powder, kaolin and talc, the rigidity and compressive strength of the photosensitive resin can be increased, thereby improving the impact resistance and tensile strength of the waterproof layer. Attached Figure Description

[0030] Figure 1 A flowchart of a construction method for a photosensitive resin building waterproof layer;

[0031] Figure 2 This is a schematic diagram illustrating the application of a photosensitive resin building waterproofing layer construction method on a substrate.

[0032] Figure 3 This is a schematic diagram illustrating the application of a photosensitive resin building waterproofing layer construction method on a substrate with corners.

[0033] Among them, 1. base layer; 2. crack; 3. V-shaped opening; 4. first coating layer; 5. second coating layer; 6. V-shaped opening; 7. V-shaped opening. Detailed Implementation

[0034] The following describes a preferred embodiment, with reference to the appendix. Figure 1-3 To further illustrate the present invention, the endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values; for numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, and these numerical ranges should be considered as specifically disclosed herein; the materials, reagents, etc. used in the following embodiments are commercially available unless otherwise specified; the experimental methods in the following embodiments are conventional methods unless otherwise specified.

[0035] Example 1

[0036] This embodiment provides a construction method for a photosensitive resin building waterproof layer, such as... Figure 1-3 As shown, it includes the following steps:

[0037] S1: Clean the base layer 1 thoroughly, ensuring that there is no standing water, dust, or debris residue on the base layer 1;

[0038] S2: Using manual excavation, the crack 2 in the base layer 1 is treated into a V-shaped opening 3 with an angle of 50° to increase the contact area between the photosensitive resin and the base layer 1, ensuring a tight bond between the photosensitive resin and the crack 2. The photosensitive resin is injected into the V-shaped opening 3 using a syringe, and then subjected to a radiation intensity greater than 90uW / cm². 2 Irradiate with ultraviolet light for 30 minutes;

[0039] S3: Apply the photosensitive resin to the building layer surface multiple times using a scraper;

[0040] S4: Use radiation intensity greater than 90uW / cm 2 Irradiate with ultraviolet light for 30 minutes;

[0041] S5: Repeat steps S3-S4 until the waterproof layer thickness is 0.5cm.

[0042] In step S3, to ensure the bonding strength between the photosensitive resin and the substrate, the thickness of the first coat of photosensitive resin is 4mm, and the thickness of subsequent coats is 3mm. In this embodiment, by adopting the method of multiple coats and controlling the coating thickness, the shrinkage during photocuring can be reduced, the internal thermal stress can be reduced, and the uniformity of the coating can be improved. By controlling the coating thickness to be smaller, the curing speed of the photosensitive resin can also be increased, saving construction time.

[0043] The photosensitive resin is composed of the following raw materials by weight percentage:

[0044] Table 1. Components of photosensitive resin

[0045]

[0046]

[0047] The preparation process of the photosensitive resin is as follows: hydroxypropyl acrylate, 1173 photoinitiator, isobornyl acrylate, pigment, and ceramic powder are mixed in a set ratio and stirred for 30 minutes at a stirring speed of 60 r / min. After stirring, the mixture is allowed to stand for 1 hour to obtain the photosensitive resin. The photosensitive resin prepared in this embodiment has a compressive strength greater than 10 MPa after curing, which can effectively prevent water penetration and damage to the building structure, and can maintain the stable performance of the waterproof layer for a long time, thereby extending the service life of the building.

[0048] This embodiment provides a construction method for a photosensitive resin building waterproof layer. Utilizing the dense texture, good formability, and strong adhesion to the substrate of photosensitive resin, the resin is photocured onto the substrate. The cured waterproof layer exhibits strong hydrophobicity, strong intermolecular forces, and minimal temperature influence, making it less prone to cracking and effectively preventing water seepage. Furthermore, the cured waterproof layer demonstrates strong weather resistance, slow aging, and a long service life. The construction process is simple, overcoming the previous challenges of complex construction processes and poor construction quality.

[0049] Example 2

[0050] This embodiment provides a construction method for a photosensitive resin building waterproof layer, such as... Figure 3 As shown, it includes the following steps:

[0051] S1: Clean the base layer 1 thoroughly, ensuring that there is no standing water, dust, or debris residue on the base layer 1;

[0052] S2: Using an electric drill, the crack 2 in the base layer 1 is processed into a V-shaped opening 3 with an angle of 60° to increase the contact area between the photosensitive resin and the base layer 1, ensuring a tight bond between the photosensitive resin and the crack 2. The photosensitive resin is then injected into the V-shaped opening 3 using a syringe, and a radiation intensity greater than 90uW / cm² is applied. 2 Irradiate with ultraviolet light for 60 minutes;

[0053] S3: Apply the photosensitive resin multiple times to the surface of the building layer using a scraper, such as... Figure 3 As shown, when encountering a corner, use a brush to brush the photosensitive resin upwards to a height of 5cm at the corner, and apply it to the corner to form an arc-shaped corner, ensuring that there are no air bubbles inside;

[0054] S4: Use radiation intensity greater than 90uW / cm 2 Irradiate with ultraviolet light for 60 minutes;

[0055] S5: Repeat steps S3-S4 until the waterproof layer thickness is 2.9cm.

[0056] In step S3, to ensure the bonding strength between the photosensitive resin and the substrate, the thickness of the first coat of photosensitive resin is 3mm, and the thickness of subsequent coats is 2mm.

[0057] The photosensitive resin is composed of the following raw materials by weight percentage:

[0058] Table 2. Components of photosensitive resin

[0059] Hydroxyethyl acrylate 47.5% 1173 photoinitiator 1% Hydroxypropyl acrylate 50% pigment 1% silicon dioxide 0.5%

[0060] The preparation process of the photosensitive resin is as follows: hydroxyethyl acrylate, 1173 photoinitiator, hydroxypropyl acrylate, pigment, and silica are mixed in a set ratio, stirred for 30 minutes at a stirring speed of 60 r / min, and then allowed to stand for 1 hour after stirring to obtain the photosensitive resin.

[0061] Example 3

[0062] This embodiment provides a construction method for a photosensitive resin building waterproof layer, such as... Figure 3 As shown, it includes the following steps:

[0063] S1: Clean the base layer 1 thoroughly, ensuring that there is no standing water, dust, or debris residue on the base layer 1;

[0064] S2: Using an electric drill, the crack 2 in the base layer 1 is processed into a V-shaped opening 3 with an angle of 70° to increase the contact area between the photosensitive resin and the base layer 1, ensuring a tight bond between the photosensitive resin and the crack 2. The photosensitive resin is then injected into the V-shaped opening 3 using a syringe, and a radiation intensity greater than 90uW / cm² is applied. 2 Irradiate with ultraviolet light for 10 minutes;

[0065] S3: Use a scraper to apply the photosensitive resin to the building surface multiple times. When a slope is required, use a scraper to apply the photosensitive resin to the building surface and ensure that there are no air bubbles inside.

[0066] S4: Use radiation intensity greater than 90uW / cm 2 Irradiate with ultraviolet light for 10 minutes;

[0067] S5: Repeat steps S3-S4 until the waterproof layer thickness is 2.1cm.

[0068] In step S3, to ensure the bonding strength between the photosensitive resin and the substrate, the thickness of the first coat of photosensitive resin is 3.5 mm, and the thickness of subsequent coats is 2.5 mm.

[0069] The photosensitive resin is composed of the following raw materials by weight percentage:

[0070] Table 3. Components of photosensitive resin

[0071] Hydroxyethyl acrylate 67% 1173 photoinitiator 2.8% Isoborneol acrylate 30% pigment 0.1% Kaolin 0.1%

[0072] The preparation process of the photosensitive resin is as follows: hydroxyethyl acrylate, 1173 photoinitiator, isobornyl acrylate, pigment, and kaolin are mixed in a set ratio, stirred for 30 minutes at a stirring speed of 60 r / min, and then allowed to stand for 1 hour after stirring to obtain the photosensitive resin.

[0073] Comparative Example 1

[0074] The difference from Example 1 is as follows:

[0075] In step S3, the photosensitive resin is applied to a thickness of 0.5cm in one go.

[0076] Comparative Example 2

[0077] The difference from Example 1 is as follows:

[0078] In step S2, the photosensitive resin is directly injected into the crack.

[0079] Comparative Example 3

[0080] The difference from Example 1 is as follows:

[0081] The waterproofing material used is a waterproof sealant.

[0082] Implementation effect evaluation:

[0083] The following specific experiments further illustrate the beneficial effects achieved by this invention:

[0084] The performance test results of Examples 1-3 and Comparative Examples 1-3 are shown in the table below:

[0085] Table 4 Statistical Table of Performance Test Results

[0086]

[0087] As can be seen from the table above, the construction method of the photosensitive resin building waterproof layer provided by the present invention produces a waterproof layer with strong hydrophobicity, strong adhesion to the base layer, resistance to cracking, effective prevention of water seepage, strong weather resistance, and slow aging speed.

[0088] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A construction method for a photosensitive resin building waterproof layer, characterized in that, Includes the following steps: S1: Clean the base layer thoroughly and ensure that there is no standing water, dust, or debris residue on the base layer; S2: Treat the cracks in the substrate into V-shaped openings, inject photosensitive resin into the V-shaped openings, and use a radiation intensity greater than 90μW / cm². 2 Irradiate with ultraviolet light for 10-60 minutes; S3: Use a scraper to apply the photosensitive resin to the building surface multiple times. If there is a corner or a certain height is required, use a brush to brush the photosensitive resin upward to a height of 5cm at the corner and apply it to form an arc corner, ensuring that there are no air bubbles inside. If a slope is required, use a scraper to apply the photosensitive resin to the building surface. S4: Use radiation intensity greater than 90 μW / cm² 2 Irradiate with ultraviolet light for 10-60 minutes; S5: Repeat steps S3-S4 until the waterproof layer thickness is 0.5-3.0cm; In step S3, the thickness of the first application of photosensitive resin is ≤4mm, and the thickness of subsequent applications of photosensitive resin is ≤3mm. The photosensitive resin is composed of the following raw materials by weight percentage: 40%-70% polymer monomer, 1%-5% photosensitizer, 10%-50% diluent, 0.1-1% pigment, and 0.1-1% filler, wherein the sum of the percentage content of each component in the photosensitive resin is 100%. The polymer monomer is at least one of hydroxypropyl acrylate and hydroxyethyl acrylate; The photosensitizer is 1173 photoinitiator; The diluent is at least one of isobornyl acrylate and hydroxypropyl acrylate.

2. The construction method of a photosensitive resin building waterproof layer according to claim 1, characterized in that, In step S2, the V-shaped opening angle is greater than 45°.

3. The construction method of a photosensitive resin building waterproof layer according to claim 1, characterized in that, The preparation process of the photosensitive resin is as follows: polymer monomers, photosensitizers, diluents, pigments and fillers are mixed in a set ratio, stirred for 30 minutes at a stirring speed of 60 r / min, and then allowed to stand for 1 hour after stirring to obtain the photosensitive resin.

4. The construction method of a photosensitive resin building waterproof layer according to claim 3, characterized in that, The photosensitive resin has a compressive strength greater than 10 MPa after curing.

5. The construction method of a photosensitive resin building waterproof layer according to claim 3, characterized in that, The filler is at least one of ceramic powder, silica, kaolin and talc.