A method for improving the adhesion of an integrated circuit to a glass substrate

Abstract

The application discloses a method for improving the adhesion of an integrated circuit and a glass substrate, comprising the following steps: S1, surface cleaning, S2, surface treatment, S3, introducing an adhesive layer, S4, temperature control, S5, alignment and compression, and S6, solidification. The application improves the roughness and chemical activity of the surface of the glass substrate through special treatment of the glass substrate, improves the adhesion of the surface of the glass substrate, controls the compression pressure and compression rate of the integrated circuit and the glass substrate, makes the contact surface between the two uniform and free of bubbles, and further improves the connection reliability between the integrated circuit and the glass substrate. Excellent adhesion performance can realize better contact thermal resistance, improve the heat conduction performance, high adhesion can realize smaller gap and more compact packaging structure, make the overall size smaller, and can also increase the contact area and bonding strength between the integrated circuit chip and the glass substrate, and improve the anti-vibration and anti-impact capability.

Description

Technical Field

[0001] This invention relates to the field of liquid crystal display technology, and more particularly to the bonding of a glass substrate of a liquid crystal display with an integrated circuit, specifically a method for improving the bonding performance between the integrated circuit and the glass substrate. Background Technology

[0002] Bonding integrated circuits to glass substrates is a common packaging technique used to tightly connect integrated circuit chips to glass substrates to achieve electrical connection and protect the chips.

[0003] The bonding of the glass substrate and integrated circuits in a liquid crystal display (LCD) typically employs COG (Chip-On-Glass) technology. This involves directly bonding the integrated circuit chip to the driving circuit area of ​​the glass substrate, thus integrating the driving circuitry and the LCD display. The advantages of using COG packaging technology are:

[0004] COG packaging directly connects the chip to the glass substrate, reducing the use of external leads, reducing package size, and improving space utilization efficiency. COG packaging also directly connects the driver chip to the glass, transmitting signals and drive current through the glass substrate to achieve the function of liquid crystal display. It also reduces the possibility of electromagnetic interference and improves the circuit's anti-interference capability.

[0005] A search revealed that patent application number 201610927892.9 discloses a flexible organic light-emitting display screen and its fabrication method. The flexible organic light-emitting display screen includes a display body and a glass reinforcing substrate. The display body includes a polyimide layer, an integrated circuit chip, and a protective adhesive layer. The protective adhesive layer includes a first surface and a second surface. The integrated circuit chip is attached to the first surface, and the polyimide layer covers both the first surface and the integrated circuit chip. The glass reinforcing substrate is attached to the second surface. The fabrication method includes: forming the display body on a glass substrate, wherein the glass substrate is attached to the second surface; cutting off the portion of the glass substrate corresponding to the integrated circuit chip from other parts of the glass substrate to form the glass reinforcing substrate; and peeling off all the glass substrate except for the glass reinforcing substrate to form the flexible organic light-emitting display screen. The flexible organic light-emitting display screen and its fabrication method provided in this application can effectively prevent the integrated circuit chip from being bent and damaged.

[0006] In current bonding technologies for integrated circuits and glass substrates, the bonding between the two is not tight enough, which reduces the reliability of the connection between the integrated circuit and the glass substrate. Furthermore, the loose connection leads to a decrease in the thermal conductivity of the product, insufficient packaging, and reduced vibration and impact resistance. Therefore, we need to propose a method to improve the bonding between integrated circuits and glass substrates. Summary of the Invention

[0007] The purpose of this invention is to provide a method for improving the adhesion between integrated circuits and glass substrates. By performing special treatment on the glass substrate, the surface roughness and chemical activity of the glass substrate are improved, thereby enhancing the adhesion ability of the glass substrate surface. Furthermore, by controlling the pressing pressure and pressing rate of the integrated circuit and the glass substrate, the contact surfaces between the two are uniformly bonded without generating air bubbles, thus improving the connection reliability between the integrated circuit and the glass substrate. Excellent adhesion performance can achieve better contact thermal resistance and improve thermal conductivity. High adhesion can achieve smaller gaps and more compact packaging structures, resulting in a smaller overall size. It can also increase the contact area and bonding strength between the integrated circuit chip and the glass substrate, improving vibration and impact resistance, thereby solving the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a method for improving the adhesion between an integrated circuit and a glass substrate, comprising the following steps:

[0009] S1. Surface cleaning: Clean the surfaces of integrated circuits and glass substrates to remove dust, grease and contaminants, ensuring the cleanliness of the integrated circuit board and glass substrate surfaces;

[0010] S2. Surface treatment: The surface of the glass substrate is specially treated to improve the roughness and chemical activity of the glass substrate surface and improve the adhesion of the glass substrate surface.

[0011] S3. Introduce an adhesive layer: Apply an adhesive layer to the contact surface between the integrated circuit and the glass substrate to increase the adhesion between the integrated circuit and the glass substrate;

[0012] S4. Temperature control: By controlling the temperature change, the thermal expansion and contraction properties of the integrated circuit and the glass substrate are changed, thereby increasing the adhesion between the integrated circuit and the glass substrate;

[0013] S5. Alignment and Pressing: Align the integrated circuit and the glass substrate, ensuring that the contact surfaces between the two are fully bonded, and apply appropriate pressure to make the integrated circuit and the glass substrate bond tightly.

[0014] S6. Curing: The adhesive layer is cured by heat curing, ultraviolet curing or chemical curing to ensure that the adhesive layer is fully cured and provides durable adhesion.

[0015] Preferably, in step S1, surface cleaners, solvents, or ultrasonic cleaning can be used to remove dust, grease, and contaminants from the surface of the integrated circuit and the glass substrate. After cleaning, the surface of the integrated circuit and the glass substrate is inspected for obvious damage, scratches, or defects caused by oil stains to ensure that the surface of the integrated circuit and the glass substrate is in good condition. Finally, a gas spray gun or oven is used to remove residual moisture from the surface of the integrated circuit and the glass substrate to achieve surface drying.

[0016] Preferably, in step S2, the special treatment of the glass substrate surface includes:

[0017] Pickling: Immersing the glass substrate in an acidic solution removes oxides and impurities from the surface of the glass substrate, improving the surface roughness and chemical activity of the glass substrate.

[0018] Plasma treatment: Plasma is used to treat the surface of the glass substrate, generating active groups on the surface of the glass substrate and improving the adhesion between the glass substrate and the adhesive.

[0019] Preferably, in step S3, the adhesive layer can be introduced using any one of the following four methods:

[0020] Adhesive coating: A layer of adhesive is coated on the surface of the integrated circuit or glass substrate to achieve bonding between the two. The adhesive can be uniformly coated on the surface by means of roller brush, spray or roller coating.

[0021] Thermo-press bonding: A thermo-press pad is placed between the integrated circuit and the glass substrate. The thermo-press pad is heated and pressure is applied to promote the bonding between the integrated circuit and the glass substrate.

[0022] UV bonding: A layer of adhesive is coated on the surface of an integrated circuit or glass substrate, and the curing reaction of the adhesive is initiated by irradiation with ultraviolet light to achieve rapid bonding.

[0023] Adhesive film: An adhesive film is used to bond integrated circuits to a glass substrate. The adhesive film is a double-sided adhesive or adhesive film with adhesive properties that is laminated between the integrated circuit and the glass substrate.

[0024] Preferably, in step S4, temperature control during the bonding process includes:

[0025] Temperature control of adhesives: The temperature of the adhesive affects its viscosity, flowability and reaction rate. The appropriate bonding temperature should be selected according to the characteristics of the adhesive.

[0026] Hot pressing temperature control: High hot pressing temperature will cause the adhesive to decompose, volatilize or degrade, while low hot pressing temperature will cause the adhesive to not cure completely, affecting the bonding strength;

[0027] Temperature uniformity control: During hot pressing, ensure that the temperature is evenly transferred to the entire bonding interface.

[0028] Preferably, in step S5, the control point for the lamination process between the integrated circuit and the glass substrate is:

[0029] Pressure control: High pressure can cause damage and deformation to the integrated circuit and the glass substrate, while low pressure can cause the integrated circuit and the glass substrate to not adhere firmly.

[0030] Pressing time control: Select an appropriate pressing time according to the characteristics of the adhesive to ensure that the adhesive flows and cures fully and obtains a strong bond;

[0031] Pressing rate control: A fast pressing rate will lead to uneven bonding or the formation of air bubbles, while a slow pressing rate will result in a long bonding time.

[0032] Pressing uniformity control: Ensure that the pressure during the pressing process is evenly distributed on the bonding interface, guaranteeing the consistency and reliability of the bonding interface.

[0033] Preferably, in step S6, thermosetting: the adhesive is cured into a hard structure by heating the adhesive to trigger a chemical reaction;

[0034] UV curing: UV light irradiates the adhesive, triggering a chemical reaction in the photoinitiator and rapidly curing the adhesive into a hardened state;

[0035] Chemical curing: A mixture of epoxy resin and curing agent is used to trigger a chemical reaction and form a strong adhesive layer.

[0036] Preferably, the process further includes a surface coating treatment after the integrated circuit and the glass substrate are bonded together, the surface coating comprising:

[0037] Thin film coating: A thin film is applied to the bonded surface to provide protection, scratch resistance, and increased abrasion resistance;

[0038] Anti-oxidation coating: Used to protect the bonding interface from corrosion and oxidation;

[0039] Thermally conductive coating: used to quickly conduct heat and reduce product temperature;

[0040] Insulating coating: Used to prevent electrical interference or leakage;

[0041] Anti-reflective coating: Improves product transmittance and viewing clarity.

[0042] Preferably, it also includes inspection and quality control of the integrated circuit after bonding to the glass substrate, including:

[0043] Visual inspection: Determining whether a product meets quality standards by manually observing and evaluating its appearance, color, and shape characteristics;

[0044] Size measurement: Using tools such as calipers and gauges, measure the dimensions, diameter, and length parameters of the product to ensure that the product dimensions meet the design requirements;

[0045] Functional testing: Simulating actual usage conditions or using specific testing equipment to verify whether the product's performance and functions meet the requirements.

[0046] Compared with the prior art, the beneficial effects of the present invention are:

[0047] This invention improves the surface roughness and chemical activity of the glass substrate through special treatment, thereby enhancing its adhesion. Furthermore, by controlling the pressing pressure and rate between the integrated circuit and the glass substrate, the bonding between the two surfaces becomes uniform and bubble-free, thus improving the connection reliability between the integrated circuit and the glass substrate. Excellent bonding performance achieves better contact thermal resistance and improves thermal conductivity. High bonding strength allows for smaller gaps and a more compact packaging structure, resulting in a smaller overall size. It also increases the contact area and bonding strength between the integrated circuit chip and the glass substrate, improving vibration and impact resistance. Attached Figure Description

[0048] Figure 1 This is a flowchart of the present invention;

[0049] Figure 2 This is a schematic diagram of the structure of the integrated circuit after it is bonded to the glass substrate according to the present invention;

[0050] Figure 3 This is a schematic diagram illustrating the temperature control during the bonding process between the integrated circuit and the glass substrate according to the present invention. Detailed Implementation

[0051] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] Please see Figure 1-3 The present invention provides a technical solution: a method for improving the adhesion between integrated circuits and glass substrates, comprising the following steps:

[0053] S1. Surface cleaning: Clean the surfaces of integrated circuits and glass substrates to remove dust, grease and contaminants, ensuring the cleanliness of the integrated circuit board and glass substrate surfaces;

[0054] In step S1, surface cleaners, solvents, or ultrasonic cleaning can be used to remove dust, grease, and contaminants from the surface of the integrated circuit and the glass substrate. After cleaning, the surface of the integrated circuit and the glass substrate is inspected for obvious damage, scratches, or defects caused by oil stains to ensure that the surface of the integrated circuit and the glass substrate is in good condition. Finally, a gas spray gun or oven is used to remove residual moisture from the surface of the integrated circuit and the glass substrate to achieve surface drying. A wet surface may affect the quality of bonding.

[0055] S2. Surface treatment: The surface of the glass substrate is specially treated to improve the roughness and chemical activity of the glass substrate surface and improve the adhesion of the glass substrate surface.

[0056] In step S2, the special treatment of the glass substrate surface includes:

[0057] Pickling: Immersing a glass substrate in an acidic solution removes oxides and impurities from its surface, improving surface roughness and chemical activity. Commonly used pickling agents include nitric acid and hydrochloric acid. Strict control of parameters such as temperature, acid concentration, and immersion time is necessary during pickling.

[0058] Plasma treatment: Plasma is used to treat the surface of the glass substrate, generating active groups on the surface and improving the adhesion between the glass substrate and the adhesive. Plasma treatment can be performed using a vacuum plasma cleaner or a plasma activation device, and the surface activation effect can be achieved by adjusting the treatment parameters and gas combinations.

[0059] This also includes a sealing layer deposition process: depositing a sealing layer on the surface of the glass substrate provides a better foundation for increased adhesion. The sealing layer can be prepared using chemical vapor deposition (CVD), physical vapor deposition (PVD), or other coating techniques.

[0060] S3. Introduce an adhesive layer: Apply an adhesive layer to the contact surface between the integrated circuit and the glass substrate to increase the adhesion between the integrated circuit and the glass substrate;

[0061] In step S3, the adhesive layer can be introduced using any of the following four methods:

[0062] Adhesive coating: A layer of adhesive is coated on the surface of the integrated circuit or glass substrate to achieve bonding between the two. The adhesive can be uniformly coated on the surface by means of roller brush, spray or roller coating.

[0063] Hot-press bonding: A hot-press pad is placed between the integrated circuit and the glass substrate. The hot-press pad is heated and pressure is applied to promote the bonding between the integrated circuit and the glass substrate. Hot-press bonding can be achieved using a hot press or hot-press equipment.

[0064] UV bonding: A layer of adhesive is coated on the surface of an integrated circuit or glass substrate, and the adhesive is cured by irradiating it with ultraviolet light to achieve rapid bonding. This bonding method has the advantage of rapid curing, but requires the use of curing equipment to provide sufficient ultraviolet irradiation energy.

[0065] Adhesive film: An adhesive film is used to bond integrated circuits to a glass substrate. The adhesive film is a double-sided adhesive or adhesive film with adhesive properties that is laminated between the integrated circuit and the glass substrate.

[0066] S4. Temperature control: By controlling the temperature change, the thermal expansion and contraction properties of the integrated circuit and the glass substrate are changed, thereby increasing the adhesion between the integrated circuit and the glass substrate;

[0067] In step S4, temperature control during the bonding process includes:

[0068] Temperature control of adhesives: The temperature of an adhesive affects its viscosity, flowability and reaction rate. An appropriate bonding temperature must be selected according to the characteristics of the adhesive. Some adhesives require a specific temperature range to achieve optimal performance and curing effect.

[0069] Hot pressing temperature control: High hot pressing temperature will cause the adhesive to decompose, volatilize or degrade, while low hot pressing temperature will cause the adhesive to not cure completely, affecting the bonding strength;

[0070] Hot-pressing time control: Hot-pressing time is closely related to temperature. Lower temperatures may require longer hot-pressing times to achieve full curing and bonding. Conversely, higher temperatures may require shorter hot-pressing times. Experimentation and testing should be conducted to find the optimal temperature and time parameters to ensure the adhesive reaches the desired degree of curing within a given time.

[0071] Temperature uniformity control: During hot pressing, ensure that the temperature is evenly distributed across the entire bonding interface. Uneven temperature distribution may lead to uneven curing of the adhesive or the creation of stress concentration areas, thereby reducing the bonding quality.

[0072] S5. Alignment and Pressing: Align the integrated circuit and the glass substrate, ensuring that the contact surfaces between the two are fully bonded, and apply appropriate pressure to make the integrated circuit and the glass substrate bond tightly.

[0073] In step S5, the control points for the lamination process between the integrated circuit and the glass substrate are:

[0074] Pressure control: Applying appropriate pressure during the bonding process ensures a tight contact between the integrated circuit and the glass substrate. Excessive pressure can damage and deform both the integrated circuit and the glass substrate, while insufficient pressure can result in weak adhesion between the integrated circuit and the glass substrate. Pressure adjustment is typically achieved using pressure sensors or hydraulic systems.

[0075] Pressing time control: Pressing time refers to the duration of pressure applied. Based on the adhesive's properties, selecting an appropriate pressing time ensures sufficient flow and curing of the adhesive, resulting in a strong bond. Pressing time is typically managed by controlling the duration of the press or using a timer.

[0076] Pressing rate control: A fast pressing rate can lead to uneven bonding or the formation of air bubbles, while a slow pressing rate can result in a long bonding time. The pressing rate is usually controlled by adjusting a hydraulic system or a mechanical transmission device.

[0077] Pressing uniformity control: Ensure that the pressure during the pressing process is evenly distributed on the bonding interface, guaranteeing the consistency and reliability of the bonding interface.

[0078] S6. Curing: The adhesive layer is cured by heat curing, ultraviolet curing or chemical curing to ensure that the adhesive layer is fully cured and provides durable adhesion.

[0079] In step S6, thermal curing: the adhesive is cured into a hard structure by heating the adhesive to trigger a chemical reaction; the reaction in the adhesive is made to occur by controlling the temperature and time, and a strong adhesive layer is formed.

[0080] UV curing: UV light irradiates the adhesive, triggering a chemical reaction in the photoinitiator and rapidly curing the adhesive into a hardened state; UV curing is fast and also has the advantages of low volatility and low VOC emissions.

[0081] Chemical curing: A mixture of epoxy resin and curing agent is used to trigger a chemical reaction and form a strong adhesive layer.

[0082] It also includes surface coating treatment after the integrated circuit is bonded to the glass substrate, the surface coating including:

[0083] Thin film coating: A thin film is applied to the bonded surface to provide protection, scratch resistance, and increased abrasion resistance; thin film coating can also be used to adjust optical properties, such as increasing transmittance or reducing reflectivity.

[0084] Anti-oxidation coating: The bonding interface between the integrated circuit and the glass substrate may be exposed to moisture, oxygen or other corrosive environments. This coating is used to protect the bonding interface from corrosion and oxidation.

[0085] Thermally conductive coating: To improve heat dissipation, a thermally conductive coating can be applied between the integrated circuit and the glass substrate to quickly conduct heat and reduce product temperature;

[0086] Insulating coating: An insulating or dielectric coating is applied to the bonding interface to prevent electrical interference or leakage;

[0087] Anti-reflective coating: Improves product transmittance and viewing clarity.

[0088] It also includes the inspection and quality control of the integrated circuits after bonding to the glass substrate, including:

[0089] Visual inspection: Determining whether a product meets quality standards by manually observing and evaluating its appearance, color, and shape characteristics;

[0090] Size measurement: Using tools such as calipers and gauges, measure the dimensions, diameter, and length parameters of the product to ensure that the product dimensions meet the design requirements;

[0091] Functional testing: Simulating actual usage conditions or using specific testing equipment to verify whether the product's performance and functions meet the requirements.

[0092] Materials testing: Testing the materials used in a product is a key quality control measure. This can include material strength testing, chemical testing, and material durability testing under environmental conditions. Strict quality control of raw materials ensures the quality and reliability of the product.

[0093] Non-destructive testing: Non-destructive testing is a method used to assess product quality that detects internal defects or problems without damaging the product. This can include techniques such as X-ray inspection, ultrasonic testing, and magnetic particle inspection.

[0094] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for improving the adhesion between integrated circuits and glass substrates, characterized in that: Includes the following steps: S1. Surface cleaning: Clean the surfaces of integrated circuits and glass substrates to remove dust, grease and contaminants, ensuring the cleanliness of the integrated circuit board and glass substrate surfaces; S2. Surface treatment: Activate the surface of the glass substrate to improve the surface roughness and chemical activity of the glass substrate and improve the adhesion of the glass substrate surface. S3. Introduce an adhesive layer: Apply an adhesive layer to the contact surface between the integrated circuit and the glass substrate to increase the adhesion between the integrated circuit and the glass substrate; S4. Temperature control: By controlling the temperature change, the thermal expansion and contraction properties of the integrated circuit and the glass substrate are changed, thereby increasing the adhesion between the integrated circuit and the glass substrate; S5. Alignment and Pressing: Align the integrated circuit and the glass substrate, ensuring that the contact surfaces between the two are fully bonded, and apply appropriate pressure to make the integrated circuit and the glass substrate bond tightly. S6. Curing: The adhesive layer is cured by heat curing, ultraviolet curing or chemical curing to ensure that the adhesive layer is fully cured and provides durable adhesion.

2. The method for improving the adhesion between integrated circuits and glass substrates according to claim 1, characterized in that: In step S1, surface cleaners, solvents, or ultrasonic cleaning can be used to remove dust, grease, and contaminants from the surface of the integrated circuit and glass substrate. After cleaning, the surface of the integrated circuit and glass substrate is inspected for obvious damage, scratches, or defects caused by oil stains to ensure that the surface of the integrated circuit and glass substrate is in good condition. Finally, a gas spray gun or oven is used to remove residual moisture from the surface of the integrated circuit and glass substrate to achieve surface drying.

3. The method for improving the adhesion between integrated circuits and glass substrates according to claim 1, characterized in that: In step S2, the activation treatment of the glass substrate surface includes: Pickling: Immersing the glass substrate in an acidic solution removes oxides and impurities from the surface of the glass substrate, improving the surface roughness and chemical activity of the glass substrate. Plasma treatment: Plasma is used to treat the surface of the glass substrate, generating active groups on the surface of the glass substrate and improving the adhesion between the glass substrate and the adhesive.

4. The method for improving the adhesion between integrated circuits and glass substrates according to claim 1, characterized in that: In step S3, the adhesive layer can be introduced using any of the following four methods: Adhesive coating: A layer of adhesive is coated on the surface of the integrated circuit or glass substrate to achieve bonding between the two. The adhesive is uniformly coated on the surface by means of roller brush, spray or roller coating. Thermo-press bonding: A thermo-press pad is placed between the integrated circuit and the glass substrate. The thermo-press pad is heated and pressure is applied to promote the bonding between the integrated circuit and the glass substrate. UV bonding: A layer of adhesive is coated on the surface of an integrated circuit or glass substrate, and the curing reaction of the adhesive is initiated by irradiation with ultraviolet light to achieve rapid bonding. Adhesive film: An adhesive film is used to bond integrated circuits to a glass substrate. The adhesive film is a double-sided adhesive or adhesive film with adhesive properties that is laminated between the integrated circuit and the glass substrate.

5. The method for improving the adhesion between integrated circuits and glass substrates according to claim 1, characterized in that: In step S4, temperature control during the bonding process includes: Temperature control of adhesives: The temperature of the adhesive affects its viscosity, flowability and reaction rate. The appropriate bonding temperature should be selected according to the characteristics of the adhesive. Hot pressing temperature control: High hot pressing temperature will cause the adhesive to decompose, volatilize or degrade, while low hot pressing temperature will cause the adhesive to not cure completely, affecting the bonding strength; Temperature uniformity control: During hot pressing, ensure that the temperature is evenly transferred to the entire bonding interface.

6. The method for improving the adhesion between integrated circuits and glass substrates according to claim 1, characterized in that: In step S5, the control points for the lamination process between the integrated circuit and the glass substrate are: Pressure control: High pressure can cause damage and deformation to the integrated circuit and the glass substrate, while low pressure can cause the integrated circuit and the glass substrate to not adhere firmly. Pressing time control: Select an appropriate pressing time according to the characteristics of the adhesive to ensure that the adhesive flows and cures fully and obtains a strong bond; Pressing rate control: A fast pressing rate will lead to uneven bonding or the formation of air bubbles, while a slow pressing rate will result in a long bonding time. Pressing uniformity control: Ensure that the pressure during the pressing process is evenly distributed on the bonding interface, guaranteeing the consistency and reliability of the bonding interface.

7. The method for improving the adhesion between integrated circuits and glass substrates according to claim 1, characterized in that: In step S6, thermosetting: a chemical reaction is triggered by heating the adhesive, causing the adhesive to cure into a hard structure; UV curing: UV light irradiates the adhesive, triggering a chemical reaction in the photoinitiator and rapidly curing the adhesive into a hardened state; Chemical curing: A mixture of epoxy resin and curing agent is used to trigger a chemical reaction and form a strong adhesive layer.

8. The method for improving the adhesion between integrated circuits and glass substrates according to claim 1, characterized in that: It also includes surface coating treatment after the integrated circuit is bonded to the glass substrate, the surface coating including: Thin film coating: A thin film is applied to the bonded surface to provide protection, scratch resistance, and increased abrasion resistance; Anti-oxidation coating: Used to protect the bonding interface from corrosion and oxidation; Thermally conductive coating: used to quickly conduct heat and reduce product temperature; Insulating coating: Used to prevent electrical interference or leakage; Anti-reflective coating: Improves product transmittance and viewing clarity.

9. The method for improving the adhesion between integrated circuits and glass substrates according to claim 1, characterized in that: It also includes the inspection and quality control of the integrated circuits after bonding to the glass substrate, including: Visual inspection: Determining whether a product meets quality standards by manually observing and evaluating its appearance, color, and shape characteristics; Dimension measurement: Use calipers and gauges to measure the dimensions, diameter, and length of the product to ensure that the product dimensions meet the design requirements; Functional testing: Simulating actual usage conditions or using specific testing equipment to verify whether the product's performance and functions meet the requirements.

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