Integrated storage device and server

Abstract

The embodiment of the application provides an integrated storage device and a server, and belongs to the technical field of computer storage. The PCB of the integrated storage device is provided with memory related devices and hard disk related devices; and an external device reads and writes data in the memory devices of the memory and the memory devices of the hard disk through the gold fingers of the integrated storage device. The integrated storage device can save space, reduce flow resistance, and provide design space for performance improvement of a computer or a server.

Description

Technical Field

[0001] This invention relates to the field of computer storage technology, and more specifically to an integrated storage device and server. Background Technology

[0002] In existing technologies, memory and hard drives are two important components of servers; however, the design of these two components poses significant obstacles to the space and heat dissipation design of servers.

[0003] Due to the size and layout of memory modules, a dedicated air shroud is usually required to force airflow into the gaps between the memory modules for heat dissipation. Hard drive installation, on the other hand, requires a matching hard drive module, which not only occupies overall design space but also accounts for more than half of the system's resistance, severely hindering overall heat dissipation. Summary of the Invention

[0004] The purpose of this invention is to provide an integrated storage device that saves space, reduces flow resistance, and provides design flexibility for improving server performance.

[0005] To achieve the above objectives, embodiments of the present invention provide an integrated storage device, on which memory-related devices and hard disk-related devices are mounted on the PCB (Printed Circuit Board). External devices can read and write data in the memory storage devices and the hard disk storage devices through the gold fingers of the integrated storage device.

[0006] Preferably, the related devices of the memory include: memory cache chip, power control chip and memory chip, wherein the memory chip is connected to the memory cache chip and the power control chip through a high-density connector.

[0007] Preferably, the storage-related devices of the hard disk include: a main control chip, hard disk flash memory chips, and hard disk cache units, wherein the main control chip is connected to the flash memory chips and the hard disk cache units via a high-density connector.

[0008] On the other hand, the present invention provides a server, including: a processor; and the integrated storage device described in this application, wherein the processor reads and writes data in the memory of the integrated storage device to complete calculations; when data in the hard disk needs to be processed by the processor, the corresponding data is first cached in the memory for the processor to read and write.

[0009] Preferably, the server further includes external devices and peripheral expansion card slots, wherein the peripheral expansion card slots are used to fix the external devices and enable the external devices to access data in the integrated storage device.

[0010] Preferably, the server further includes a cooling fan for dissipating heat from the processor and the integrated storage device.

[0011] Optionally, the integrated storage device is located at the processor location and between the external device and peripheral expansion card slot and the cooling fan.

[0012] Optionally, the integrated storage device is located at the processor location; and the cooling fan is located between the integrated storage device and the external device and peripheral expansion card slot.

[0013] Optionally, the upper chassis cover of the server is designed with an upward-opening mechanism, through which the integrated storage device and / or the cooling fan are quickly inserted.

[0014] Optionally, the upper chassis cover of the server is designed with an upward-opening mechanism, which allows the integrated storage device and / or the cooling fan to be opened upwards during maintenance.

[0015] The above technical solution allows memory and hard drive components to be surface-mounted onto the same PCB board. The memory, with its high-efficiency access capabilities, serves as a cache for the CPU. When data from the hard drive needs to be processed by the CPU, it can first be cached in memory for CPU read / write operations. This saves space in the hard drive module, reduces overall system resistance, and provides design flexibility for improving computer or server performance.

[0016] Other features and advantages of the embodiments of the present invention will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1A , Figure 1B , Figure 1C These are, respectively, the side view, front view, and oblique view of memory in existing technology;

[0019] Figure 2A , Figure 2B , Figure 2C These are, respectively, the side view, front view, and oblique view of a hard disk in the prior art;

[0020] Figure 3A , Figure 3B , Figure 3C These are, respectively, a side view, a front view, and an oblique view of an embodiment of the integrated storage device of this application;

[0021] Figure 4 This is a schematic diagram of the main structure of a server in existing technology;

[0022] Figure 5 This is a schematic diagram of the structure of an embodiment of the server in this application; and

[0023] Figure 6 This is a schematic diagram of another embodiment of the server in this application.

[0024] Explanation of reference numerals in the attached figures

[0025] 1—Memory chip; 2—Power control chip;

[0026] 3—Memory contacts; 4—PCB board;

[0027] 5—Hard drive gold fingers; 6—Hard drive module;

[0028] 7—Memory chip; 8—PCB board of MSD;

[0029] 9—MSD cheat codes; 10—Storage area;

[0030] 11—Fan area; 12—Calculation area;

[0031] 13—Expansion card slot area; and 14—Compute storage area. Detailed Implementation

[0032] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of the present invention.

[0033] A schematic diagram of the memory structure of the prior art is shown below. Figure 1A As shown, it includes at least a memory chip 1, a power control chip 2, memory gold fingers 3, and a PCB board 4. The memory chip 1, power control chip 2, and memory gold fingers 3 are all mounted on the PCB board 4. Data is stored on the memory chip 1, and data in the memory chip 2 is read and written via the memory gold fingers 3. A schematic diagram of the external structure of a prior art hard drive is shown below. Figure 1B As shown, it includes at least a main control chip, hard disk flash memory chips, hard disk cache units (none of which are shown), hard disk gold fingers 5, and hard disk module 6. Data stored in the hard disk is read and written through the hard disk gold fingers 5, and the hard disk module 6 is used to fix and protect the main control chip, hard disk flash memory chips, and hard disk cache units housed within the hard disk module 6.

[0034] In existing technologies, RAM is made of semiconductor materials and serves as a temporary storage location for data, used to store cached data during CPU processing. Hard disks access data that requires memory capacity, such as system programs, applications, videos, photos, etc. If hard disk data needs to be processed by the CPU, it will first be cached in RAM before the CPU can directly access it.

[0035] This application relates to an integrated storage device combining memory and hard disk components from existing technologies. For the time being, this application refers to it as a memory-hard disk integrated hard disk (MSD). One embodiment has the following structure: Figures 3A-3C As shown, it includes at least: a PCB board 8, hard disk flash memory chips 7, high-density gold fingers 9, (not shown below) hard disk cache units, memory cache chips, a power control chip, a memory chip, and a main control chip. The memory chip is connected to the memory cache chips and the power control chip via a high-density connector; the main control chip is connected to the flash memory chips and the hard disk cache units via a high-density connector. The CPU processor reads and writes data in the memory chips and memory cache chips of the integrated storage device through the high-density gold fingers to complete calculations. When data in the hard disk needs to be processed by the processor, the corresponding data in the hard disk flash memory chips and hard disk cache units is first cached in memory for the CPU processor to read and write.

[0036] Compared with the prior art, the technical advantages of this embodiment are as follows:

[0037] (1) Saves space and facilitates overall system miniaturization. In the prior art, memory and hard disk are two different devices that require separate interfaces for installation. Memory also requires a duct, and hard disk also requires a hard disk enclosure, mounting cage, and other components, all of which occupy considerable space. This application places memory and hard disk related components on the same PCB board and uses high-density gold fingers as the external interface, which is conducive to system miniaturization design and high-density deployment.

[0038] (2) It is beneficial to the overall heat dissipation of the system. In the prior art, memory and hard disk are arranged separately. The air guide shroud for memory and the hard disk enclosure, mounting cage, hard disk backplate and other components are all sources of fluid resistance in the system. After adopting the integrated storage device of the present invention, these modules are no longer needed, and the additional flow resistance generated by these modules does not exist, which can greatly improve the heat dissipation capacity of the system.

[0039] (3) It helps save on manufacturing, installation, and maintenance costs. Components such as the memory's cooling shroud, and the hard drive's enclosure, mounting cage, and backplate, which are already in use in the current technology, no longer need to be manufactured. Integrated installation and maintenance of the memory and hard drive can save significant labor costs.

[0040] The integrated storage device of this application can be applied to the design of personal computers such as PCs and laptops, enabling smaller personal computers. However, its significance for the main structure design of servers is even more pronounced. Figure 4 The existing server structure shown includes four areas: a storage area 10, a fan area 11, a computing area 12, and an expansion card slot area 13. The computing area 12 includes a CPU processor and memory, and the expansion card slot area 13 includes external devices and peripheral expansion card slots. These peripheral expansion card slots are used to mount external devices and enable them to access data in the storage device. This application, however, only includes three areas: a fan area 11, a computing storage area 14, and an expansion card slot area 13. The computing storage area 14 includes a CPU processor and the integrated storage device of this application. The CPU processor reads and writes data in the memory of the integrated storage device to complete calculations. When data on the hard drive needs to be processed by the CPU processor, the corresponding data is first cached in memory for the CPU processor to read and write.

[0041] One implementation of the server in this application is as follows: Figure 5 As shown, the fan area 11 is placed at the front, the storage and computing area 14 is placed in the middle area, and the expansion card slot area 13 is placed at the rear.

[0042] In this embodiment, the peripheral expansion card slot is used to fix an external device and enable the external device to access data in the integrated storage device.

[0043] In this embodiment, the fan area 11 includes a set of cooling fans for cooling the corresponding processor and integrated storage device respectively.

[0044] In this embodiment, the upper chassis cover of the storage computing area 14 is designed with an upward-opening mechanism, or the upper chassis cover of the front chassis including the storage computing area is designed with an upward-opening mechanism. If only the upper chassis cover of the storage computing area is designed with an upward-opening mechanism, the fan is installed via a quick-connect fitting from the front of the server, and the storage components are installed via a quick-connect fitting from the top. If the upper chassis cover of the front chassis including the storage computing area is designed with an upward-opening mechanism, both the fan and the storage components are installed via a quick-connect fitting from the top.

[0045] In this embodiment, the components of the integrated storage device are connected via high-density connectors.

[0046] In some implementations, the storage computing area 14 is placed at the very front, and the chassis cover above this area is designed with an upward-opening mechanism, allowing it to be opened for maintenance. Figure 6 As shown, other designs of this embodiment are similar to Figure 5 The scheme shown is the same.

[0047] Compared with the prior art, the technical advantages of this embodiment are as follows:

[0048] (1) Strong heat dissipation capacity. Traditional servers require hard drive enclosures, hard drive mounting cages, backplanes, and other component modules. The fluid resistance of these modules accounts for more than half of the system resistance. In order to achieve memory heat dissipation, traditional servers often design air guide shrouds to direct airflow from the upper part of the server to the lower memory module area. With the present invention, the height of the composite storage memory is higher than that of traditional memory, and the flow resistance at the top and bottom of this area of ​​the server is basically the same, eliminating the need for air guide shrouds or requiring only partial air guide shrouds. With the solution of this embodiment, these modules are no longer needed, reducing the system flow resistance by at least 1 / 2 and greatly improving the system heat dissipation capacity;

[0049] (2) Reduced costs. By simplifying a series of components, material and production costs can be saved;

[0050] (3) Improved performance. The integrated storage device saves 1 / 4 of the server space and provides more room for high-performance servers while meeting the industry's required form factor.

[0051] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0052] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A server, comprising: processor; And an integrated storage device, the PCB board of which is equipped with memory-related components and hard disk-related components; as well as External devices can read and write data in the memory storage device and the hard disk storage device through the gold fingers of the integrated storage device; The memory-related components include: memory cache chips, power control chips, and memory chips, wherein the memory chips are connected to the memory cache chips and the power control chips via high-density connectors; The storage-related components of the hard disk include: a main control chip, hard disk flash memory chips, and hard disk cache units, wherein the main control chip is connected to the flash memory chips and the hard disk cache units via a high-density connector; The processor reads and writes data in the memory of the integrated storage device to complete calculations; and When data in the hard disk needs to be processed by the processor, the corresponding data is first cached in the memory for the processor to read and write, thus saving space in the hard disk module.

2. The server according to claim 1 further includes an external device and a peripheral expansion card slot, wherein the peripheral expansion card slot is used to fix the external device and enable the external device to access data in the integrated storage device.

3. The server according to claim 2, characterized in that, It also includes a cooling fan for dissipating heat from the processor and the integrated storage device.

4. The server according to claim 3, characterized in that, The integrated storage device is located at the processor position and is situated between the external device and peripheral expansion card slot and the cooling fan.

5. The server according to claim 3, characterized in that, The integrated storage device is located at the processor position; and the cooling fan is located between the integrated storage device and the external device and peripheral expansion card slot.

6. The server according to claim 4 or 5, characterized in that, The server's upper chassis cover is designed with an upward-opening mechanism, through which the integrated storage device and / or the cooling fan can be quickly inserted.

7. The server according to claim 4 or 5, characterized in that, The server's upper chassis cover is designed with an upward-opening mechanism, which allows the integrated storage device and / or the cooling fan to be opened upwards during maintenance.

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