Processing device and processing method for dot matrix structure parts

Abstract

The application relates to the technical field of laser additive manufacturing, in particular to a processing device and a processing method for dot matrix structure parts, which comprise a gantry, first guide rails arranged along a Y direction are arranged on two inner side walls of the gantry, a base plate is arranged at the bottom of the gantry, the base plate is connected to the gantry through fourth guide rails arranged along a Z direction and can move along the Z direction between a first height and a second height relative to the gantry. The processing device is designed to process dot matrix structure parts in a laser selective melting mode, different kinds of powder are laid in specific areas of each powder layer through two powder feeding lasers, and after sintering, a dot matrix structure with two different properties can be formed in the same thickness section, especially the structural strength of the high stress area in the dot matrix structure is improved, the dot matrix structure part has the advantages of light weight, and the strength of the dot matrix structure is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser additive manufacturing, in particular to a processing device and a processing method for lattice structure parts. BACKGROUND

[0002] A lattice structure is formed by nodes and connecting rods between the nodes according to a certain spatial periodic rule. The metal lattice structure has excellent mechanical properties such as ultra-lightness, high porosity, high specific strength, high specific stiffness, high strength toughness, high energy absorption, and special properties such as sound absorption, shock absorption, heat dissipation, electromagnetic shielding, and permeability, making it a dual-purpose structure and function material with excellent performance, and has very optimistic application prospects in aerospace, national defense, transportation, and energy industries.

[0003] Lattice structure parts have the advantage of lightweight, but also face strength problems. To solve this problem, a high-strength material can be placed in the dangerous cross-section of the lattice structure, for example, as shown in patent document 1, the lattice structure is printed by two kinds of powder materials, and the high-strength metal powder is laid at the node position of the lattice structure, and the low-strength metal powder is used to sinter layer by layer at the height layer where the node is not located, forming a lattice structure part with high strength at the node, but this processing method uses a large amount of high-strength powder, and cannot process lattice structure parts with connecting rods and connecting nodes at the same level, therefore, how to process a high-strength lattice structure is a problem that needs to be solved.

[0004] PRIOR ART DOCUMENT

[0005] Patent document 1 CN112676577A Lattice structure of nickel-based alloy composite material and preparation method thereof SUMMARY

[0006] In view of the technical problems existing in the prior art lattice structure processing device, the first aspect of the present application proposes a technical solution, a lattice structure part processing device, comprising:

[0007] The gantry has two inner side walls, each provided with a first guide rail arranged along the Y direction, and the bottom of the gantry is provided with a base plate connected to the gantry by a fourth guide rail arranged along the Z direction, which can move between a first height and a second height along the Z direction relative to the gantry;

[0008] The cross frame is connected to the first guide rail and can be driven by the first guide rail to move along the Y direction;

[0009] a powder delivery laser, including a first powder delivery laser and a second powder delivery laser, the first powder delivery laser and the second powder delivery laser are connected to the cross frame through a double-axis driving component, the double-axis driving component is used to drive the first powder delivery laser or the second powder delivery laser to move along the X direction and the Z direction;

[0010] a powder scraping component, connected to the cross frame;

[0011] a laser galvanometer, connected to the gantry frame;

[0012] wherein, when the substrate is at a first height, a plane where the upper end surface of the substrate is located is defined as a reference plane, the substrate can be driven by the fourth guide rail to move downward layer by layer at a predetermined interval, the first powder delivery laser and the second powder delivery laser are used to lay the first powder and the second powder respectively on different areas of the substrate surface, and the powder is scraped flat by the powder scraping component, so that the upper end surface of the powder is flush with the reference plane;

[0013] the laser galvanometer is used to sinter the laid powder into a predetermined path, alone or in cooperation with the first powder delivery laser and / or the second powder delivery laser.

[0014] Preferably, the laser galvanometer is arranged on the top surface of the gantry frame, the laser galvanometer includes a first laser galvanometer and a second laser galvanometer, and the first laser galvanometer and the second laser galvanometer are arranged diagonally on the top surface of the gantry frame.

[0015] Preferably, the double-axis driving component includes a second guide rail and a third guide rail, the side wall of the cross frame is provided with the second guide rail arranged along the X axis, the second guide rail is provided with two connecting plates, the connecting plates are provided with the third guide rail arranged along the Z direction, and the first powder delivery laser and the second powder delivery laser are respectively connected to the third guide rail on one connecting plate.

[0016] Preferably, the first powder delivery laser includes a broadband powder delivery laser, and the second powder delivery laser includes a coaxial powder delivery laser, the broadband powder delivery laser delivers the first powder, and the coaxial powder delivery laser delivers the second powder.

[0017] Preferably, when the laser focal point of the first powder delivery laser or the second powder delivery laser is at the reference plane, the lower end surface of the first powder delivery laser or the second powder delivery laser is at a focal point plane, when the convergence point of the first powder delivery laser or the second powder delivery laser is at the reference plane, the lower end surface of the first powder delivery laser or the second powder delivery laser is at a powder laying plane, and the focal point plane is higher than the powder laying plane or the focal point plane coincides with the powder laying plane.

[0018] Preferably, the powder scraping component is connected to the lower part of the cross frame through a telescopic structure, so that the powder scraping component has a retracted position and an extended position, when the powder scraping component is in the extended position, the lower end surface of the powder scraping component is flush with the reference surface, when the powder scraping component is in the retracted position, the lower end surface of the powder scraping component is higher than the focal plane.

[0019] The second aspect of the present application provides a technical solution, a processing method of a lattice structure part, defining the lattice structure to be processed as including alternating strengthening thickness layers and non-strengthening thickness layers in the height direction, wherein the strengthening thickness layer contains non-strengthening regions and strengthening regions at the intersection of at least two strengthening regions.

[0020] The lattice structure to be processed is processed layer by layer using the above-mentioned processing device of the lattice structure part until the predetermined thickness is reached.

[0021] The processing of the strengthening thickness layer includes the following steps:

[0022] Step a1, define the single-layer powder laying thickness as h, control the substrate to move downward by h, and the distance between the upper end surface of the moved substrate and the reference surface is h;

[0023] Step a2, move the first powder feeding laser and the second powder feeding laser from the first end to the second end along the Y positive direction row by row under the drive of the cross frame, in each row, according to the positions of the non-strengthening regions and the strengthening regions, lay the first powder in the non-strengthening regions by the first powder feeding laser and lay the second powder in the strengthening regions by the second powder feeding laser, the powder scraping component moves synchronously with the cross frame and scrapes the laid powder flat;

[0024] Step a3, sinter the first powder in the non-strengthening regions after being scraped flat by the laser galvanometer;

[0025] Step a4, move the first powder feeding laser and the second powder feeding laser from the second end to the first end along the Y negative direction row by row under the drive of the cross frame, in each row, sinter the second powder laid in the strengthening regions by the laser galvanometer in cooperation with the first powder feeding laser and / or the second powder feeding laser;

[0026] Step a5, repeat steps a1-a4 until the thickness of the strengthening thickness layer is reached;

[0027] The processing of the non-strengthening thickness layer includes the following steps:

[0028] Step b1, define the single-layer powder laying thickness as h, control the substrate to move downward by h, and the distance between the upper end surface of the moved substrate and the reference surface is h;

[0029] Step b2, the first powder feeding laser and the second powder feeding laser are moved by the cross frame from the first end to the second end along the Y positive direction row by row, in each row, according to the position of the non-strengthened area, the first powder is laid in the non-strengthened area by the first powder feeding laser, the doctor blade moves synchronously with the cross frame, and the laid powder is leveled;

[0030] Step b3, the first powder in the non-strengthened area after leveling is sintered by the laser galvanometer;

[0031] Step b4, the first powder feeding laser and the second powder feeding laser are moved by the cross frame from the second end to the first end along the Y negative direction;

[0032] Step b5, steps b1-b4 are repeated until the thickness of the non-strengthened thickness layer is reached.

[0033] Preferably, in the step, when laying powder in each row, the first powder feeding laser lays powder along the X axis direction before the second powder feeding laser, and the first powder feeding laser skips the strengthened area, and the second powder feeding laser lays powder in the strengthened area skipped by the first powder feeding laser.

[0034] Preferably, the length of the strengthened area is less than one sixth of the length of the non-strengthened area at the adjacent position.

[0035] Preferably, the thickness of each layer of powder is less than 60um.

[0036] Compared with the prior art, the advantages of the present application are:

[0037] The processing device designed in the present application adopts the method of laser selective melting to process the dot matrix structure parts, different kinds of powder are laid in the specific area of each layer of powder structure layer by two powder feeding lasers, after sintering, a dot matrix structure containing two different properties in the same thickness section can be formed, especially the structural strength of the high stress area in the dot matrix structure is improved, while the dot matrix structure part has the advantage of lightweight, the strength of the dot matrix structure is improved;

[0038] This way of laying powder and sintering powder can be carried out at the same time, and the printing task can be efficiently completed;

[0039] Compared with the laser selective melting equipment in the prior art, the powder feeding cylinder is not needed, the horizontal space of the equipment can be reduced, and the use amount of powder can be saved by laying high-strength metal powder. BRIEF DESCRIPTION OF DRAWINGS

[0040] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures can be represented by a like numeral. For purposes of clarity, not every component can be called out in every drawing. There is now being described by way of example various embodiments of aspects of the application with reference to the accompanying drawings in which:

[0041] Figure 1 is a structural schematic diagram of a processing device for a dot-matrix structure part shown in the present application;

[0042] Figure 2 is a front view of the processing device for the dot-matrix structure part shown in the present application;

[0043] Figure 3 is a structural schematic diagram of a powder scraping component shown in the present application;

[0044] Figure 4 is a schematic diagram of a reinforced thickness layer and a non-reinforced thickness layer of the dot-matrix structure shown in the present application;

[0045] Figure 5 is a schematic diagram of positions of a non-reinforced area and a reinforced area in the reinforced thickness layer shown in the present application;

[0046] Figure 6a is a schematic diagram of a powder feeding laser and a laser galvanometer cooperating to perform laser sintering on the reinforced area shown in the present application;

[0047] Figure 6b is a schematic diagram of the laser galvanometer performing laser sintering on the non-reinforced area shown in the present application;

[0048] Figure 7 is a schematic diagram of a shape of the dot-matrix structure part processed in the present application. DETAILED DESCRIPTION

[0049] In order to better understand the technical content of the present application, specific embodiments are described below with reference to the accompanying drawings.

[0050] The crystal structure of the dot-matrix structure to be processed in the present application is a face-centered cubic structure, as shown in Figure 7 The dot-matrix structure includes nodes and connecting rods connecting the nodes, wherein the connecting points are stress concentration sites, and therefore, the connecting points are provided with stronger materials, so that the dot-matrix structure part formed has higher strength on the basis of light weight.

[0051]

Processing device for dot-matrix structure part

[0052] For the above-mentioned dot-matrix structure, a first aspect of the present application proposes a technical solution, a processing device for a dot-matrix structure part, as shown in Figure 1As shown, the processing device mainly includes a gantry frame 10, a crossbeam 20, a powder feeding laser 40, a powder scraping component 30, and a laser galvanometer 50.

[0053] like Figure 1 As shown, the gantry frame 10 is configured as an approximately n-shaped frame. The two inner side walls of the gantry frame 10 are respectively provided with first guide rails 11 arranged along the Y direction. The bottom of the gantry frame 10 is provided with a base plate 12. The base plate 12 is connected to the gantry frame 10 through a fourth guide rail 13 arranged along the Z direction, and can move relative to the gantry frame 10 between a first height and a second height in the Z direction.

[0054] The substrate 12 can serve as a substrate for component molding, and the space between the lower part of the gantry 10 and the upper part of the substrate 12 constitutes the component molding area. It should be understood that the bottom of the gantry 10 is a four-sided enclosed structure, shown in the figure as the left and right sides enclosed, and the front and rear enclosed structures are not shown. Whenever the substrate 12 moves downward, the space above the substrate 12 increases, and the lattice structure component is sintered and formed layer by layer on the surface of the substrate 12.

[0055] The crossbeam 20 is connected to the first guide rail 11 and can be driven by the first guide rail 11 to move along the Y direction. A powder feeding laser 40 is mounted on the crossbeam 20. The powder feeding laser 40 serves the functions of powder feeding and sintering. By spreading powder on the surface of the substrate 12, a predetermined part structure is formed by laser sintering.

[0056] Furthermore, the powder scraping component 30 is also connected to the crossbeam 20, which can scrape the powder after the powder is spread by the powder-feeding laser 40, so that the powder layer thickness is uniform.

[0057] Furthermore, to increase processing efficiency, the laser galvanometer 50 is connected to the gantry 10, so that while the powder feeding laser 40 on the crossbeam 20 spreads powder and the powder scraping component 30 scrapes powder, the laser galvanometer 50 can perform laser sintering on the area that has been scraped.

[0058] In order to achieve different strengths of powder with different materials for different positions of the lattice structure, the powder feeding laser 40 includes a first powder feeding laser 41 and a second powder feeding laser 42. The first powder feeding laser 41 and the second powder feeding laser 42 are connected to the cross frame 20 through a dual-axis drive component. The dual-axis drive component is used to drive the first powder feeding laser 41 or the second powder feeding laser 42 to move along the X and Z directions.

[0059] The first powder-feeding laser 41 and the second powder-feeding laser 42 are used to lay first powder and second powder on different areas of the surface of the substrate 12, respectively, and are scraped flat by the powder scraping component 30 so that the upper surface of the powder is flush with the reference surface.

[0060] Optionally, the strength of the structure formed by the first powder after sintering is less than the strength of the structure formed by the second powder after sintering.

[0061] In an optional embodiment, the first powder feeding laser 41 comprises a wideband powder feeding laser, and the second powder feeding laser 42 comprises a coaxial powder feeding laser.

[0062] It should be understood that, since the amount of powder with small intensity is large, the wideband powder feeding laser is used to deliver the first powder, and the coaxial powder feeding laser is used to deliver the second powder, so that the powder laying speed can be improved.

[0063] In this way, the powder with corresponding intensity can be laid in the corresponding area according to the distribution position of the nodes and connecting rods in the lattice structure part in one powder laying plane, so that a structure layer containing high-intensity and low-intensity structures at the same time can be processed in any height plane of the lattice structure.

[0064] As shown in Figures 1-2 When the substrate 12 is at the first height, a plane in which the upper end surface of the substrate 12 is located is defined as a reference plane, and the substrate 12 can be driven by the fourth guide rail 13 to move downward layer by layer at a predetermined interval, wherein the substrate 12 is at the second height when it moves to the lowermost end, and the substrate 12 can move between the first height and the second height.

[0065] Further, the laser galvanometer 50 is used to sinter the laid powder into a predetermined path alone or in cooperation with the first powder feeding laser 41 and / or the second powder feeding laser 42.

[0066] Wherein, when the first powder with low intensity is sintered, the laser galvanometer 50 can be used alone for sintering, and when the second powder with high intensity is sintered, the laser galvanometer 50 can be used in cooperation with the first powder feeding laser 41 and / or the second powder feeding laser 42 for sintering, and by reasonably controlling the power of the laser galvanometer 50 and the powder feeding laser 40, the laser galvanometer 50 does not need to adjust the laser power during the entire processing process.

[0067] In an optional embodiment, the laser galvanometer 50 is arranged on the top surface of the gantry 10, and the laser galvanometer 50 comprises a first laser galvanometer and a second laser galvanometer, and the first laser galvanometer and the second laser galvanometer are diagonally distributed on the top surface of the gantry 10.

[0068] In this way, when the cross frame 20 is below one of the laser galvanometers and interferes with it, the other laser galvanometer can emit a laser beam to cooperate with the laser beam of the powder feeding laser to perform laser sintering on the same area, and the cross frame 20 does not interfere with the two laser galvanometers at the same time, so as to improve the continuity and processing speed of the laser sintering.

[0069] In an optional embodiment, in combination with Figures 1-2As shown, the double-shaft driving component includes the second guide rail 21 and the third guide rail 23, the side wall of the cross frame 20 is provided with the second guide rail 21 arranged along the X axis, the second guide rail 21 is provided with two connecting plates 22, the connecting plate 22 is provided with the third guide rail 23 arranged along the Z direction, and the first powder feeding laser 41 and the second powder feeding laser 42 are respectively connected to the third guide rail 23 on one connecting plate 22.

[0070] Specifically, the two connecting plates 22 can independently move along the X axis direction on the second guide rail 21, so that the first powder feeding laser 41 can be at a suitable position in the X axis direction for powder laying and laser sintering, and the second powder feeding laser 42 can be at a suitable position in the X axis direction for powder laying and laser sintering.

[0071] Further, the first powder feeding laser 41 and the second powder feeding laser 42 can move in the Z direction through the third guide rail 23 to adjust the corresponding height positions.

[0072] Specifically, when the laser focal point of the first powder feeding laser 41 or the second powder feeding laser 42 is at the reference plane, the lower end surface of the first powder feeding laser 41 or the second powder feeding laser 42 is at the focal point plane, and when the convergence point of the powder fed by the first powder feeding laser 41 or the second powder feeding laser 42 is at the reference plane, the lower end surface of the first powder feeding laser 41 or the second powder feeding laser 42 is at the powder laying plane.

[0073] Optionally, the focal point plane coincides with the powder laying plane.

[0074] In a preferred embodiment, the focal point plane is higher than the powder laying plane.

[0075] In this way, the first powder feeding laser 41 and the second powder feeding laser 42 can be at different heights during powder laying and laser sintering. Taking the first powder feeding laser 41 as an example, when the first powder feeding laser 41 is at a lower height during powder laying, the convergence of the powder can be increased, and the powder laying position is accurate, and when the first powder feeding laser 41 is at a higher height during laser sintering, a larger laser incidence angle can be provided for the laser galvanometer 50 working in cooperation to avoid interference of the powder feeding head with the laser light path.

[0076] Further, the powder scraping component 30 is connected to the lower side of the cross frame 20 through the telescopic structure 24, so that the powder scraping component 30 has a retracted position and an extended position, when the powder scraping component 30 is in the extended position, the lower end surface of the powder scraping component 30 is flush with the reference plane, and when the powder scraping component 30 is in the retracted position, the lower end surface of the powder scraping component 30 is higher than the focal point plane.

[0077] In this way, when the powder scraping component 30 is in the extended position, the powder laid by the powder feeding laser can be compacted and leveled, and the thickness of the laid powder layer is uniform; when the powder scraping component is in the retracted position, the powder scraping component 30 can be retracted upward as much as possible to provide a larger incident angle for the laser beam of the laser galvanometer 50, thereby avoiding optical interference.

[0078] In optional embodiments, as shown in Figure 3 The powder scraping component 30 includes a scraper holder, a scraper 31 connected to the scraper holder, and a compression roller 32, and the scraper 31 is arranged on both sides of the compression roller 32 and can scrape powder in both directions.

[0079] In the above embodiments, the telescopic structure 24 can be controlled by an electric telescopic rod or a telescopic cylinder. The first guide rail 11, the second guide rail 21, the third guide rail 23, and the fourth guide rail 13 can be ball screws.

[0080]

Method for processing dot matrix structure parts

[0081] The second aspect of the present application provides a technical solution, a method for processing dot matrix structure parts, as shown in Figure 4 and Figure 5 The definition of the dot matrix structure to be processed includes alternatingly arranged reinforced thickness layers 1C and non-reinforced thickness layers 1D in the height direction, wherein the reinforced thickness layers 1C contain non-reinforced regions 1A and reinforced regions 1B, and the reinforced regions 1B are located at the intersection of at least two reinforced regions 1A.

[0082] In a specific crystal structure, the bottom, middle, and top are all reinforced thickness layers 1C, and the connecting regions at the bottom and middle are non-reinforced thickness layers 1D, and the connecting regions at the middle and top are non-reinforced thickness layers 1D. Therefore, the reinforced thickness layers 1C and the non-reinforced thickness layers 1D are alternately distributed, and the thickness ratio of the non-reinforced thickness layers 1D and the reinforced thickness layers 1C can be determined according to the proportion of the structure at the node.

[0083] In this way, the dot matrix structure to be processed is processed layer by layer using the above-mentioned dot matrix structure part processing device until the predetermined thickness is reached.

[0084] In the above processing process, the processing of the non-reinforced thickness layer 1D and the reinforced thickness layer 1C is different because the structures contained in the non-reinforced thickness layer 1D and the reinforced thickness layer 1C are different.

[0085] The processing of the reinforced thickness layer 1C includes the following steps:

[0086] Step a1, define the single-layer powder laying thickness as h, control the substrate 12 to move downward by h, and the distance between the upper end surface of the moved substrate 12 and the reference surface is h;

[0087] In optional embodiments, in order to ensure the effect of laser sintering, the thickness h of each layer of powder laying is less than 60um.

[0088] Step a2, the first powder feeding laser 41 and the second powder feeding laser 42 are driven by the cross frame 20 to move along the Y positive direction row by row from the first end to the second end. In each row, according to the position of the non-strengthened area 1A and the strengthened area 1B, the first powder feeding laser 41 lays the first powder in the non-strengthened area 1A, and the second powder feeding laser 42 lays the second powder in the strengthened area 1B. The powder scraping component 30 moves synchronously with the cross frame 20 and levels the laid powder.

[0089] Step a3, the first powder in the non-strengthened area 1A after leveling is sintered by the laser galvanometer 50.

[0090] Step a4, the first powder feeding laser 41 and the second powder feeding laser 42 are driven by the cross frame 20 to move along the Y negative direction row by row from the second end to the first end. In each row, the second powder laid in the strengthened area 1B is sintered by the laser galvanometer 50 in cooperation with the first powder feeding laser 41 and / or the second powder feeding laser 42.

[0091] Step a5, repeat steps a1-a4 until the thickness of the strengthened thickness layer 1C is reached.

[0092] In optional embodiments, in step a2, when laying powder in each row, the first powder feeding laser 41 lays powder along the X axis direction before the second powder feeding laser 42, and the first powder feeding laser 41 skips the strengthened area 1B, and the second powder feeding laser 42 lays powder in the strengthened area 1B skipped by the first powder feeding laser 41.

[0093] As shown in Figure 5 When laying powder in a row shown by the dashed box, it should be understood that the width of each row is the powder laying width of the first powder feeding laser 41, and the first powder feeding laser 41 moves along the X direction, and its powder laying width is the same as the width of the wide powder laying head. When moving along the X direction, when reaching the strengthened area 1B, the powder feeding is paused, the strengthened area 1B is skipped, and the non-strengthened area 1A outside the strengthened area 1B is laid with powder. When the first powder feeding laser 41 finishes laying powder in the non-strengthened area 1A, the second powder feeding laser 42 lays powder in the strengthened area 1B. Since the second powder feeding laser 42 is a common powder feeder with a narrow powder laying width, it can move along the Y direction by the cross frame 20 to lay powder in the strengthened area 1B.

[0094] Optionally, by adjusting the powder feeding amount of the second powder feeding laser 42, the powder laying efficiency can be improved.

[0095] Further, after the powder is laid in the row, the cross frame 20 continues to move in the Y direction, and the powder scraping component 30 behind the powder feeding laser head scrapes and compacts the powder to ensure the uniform thickness of the powder laying area.

[0096] Further, as shown in FIG. 1B, the second powder of the reinforced area 1B is sintered by the laser mirror 50 and the laser, and the second powder of the non-reinforced area 1A is sintered by the laser mirror 50 and the laser. Figure 6a Further, as shown in FIG. 1B, the second powder of the reinforced area 1B is sintered by the laser mirror 50 and the laser, and the second powder of the non-reinforced area 1A is sintered by the laser mirror 50 and the laser.

[0097] And the processing of the non-reinforced thickness layer 1D includes the following steps:

[0098] Step b1, define the single-layer powder laying thickness as h, control the substrate 12 to move downward by h, and the upper end surface of the moved substrate 12 is h away from the reference surface;

[0099] Step b2, the first powder feeding laser 41 and the second powder feeding laser 42 are driven by the cross frame 20 to move row by row in the Y positive direction from the first end to the second end, and in each row, the first powder is laid in the non-reinforced area 1A by the first powder feeding laser 41, and the powder laying is scraped by the synchronous movement of the powder scraping component 30 and the cross frame 20;

[0100] Step b3, the first powder in the non-reinforced area 1A after scraping is sintered by the laser mirror 50;

[0101] Step b4, the first powder feeding laser 41 and the second powder feeding laser 42 are driven by the cross frame 20 to move from the second end to the first end in the Y negative direction;

[0102] Step b5, repeat steps a1-a4 until the thickness of the non-reinforced thickness layer 1D is reached.

[0103] In the above embodiment, optionally, on the basis of meeting the structural strength at the nodes, in order to reduce the use amount of the second powder, the length of the reinforced area 1B is less than one sixth of the length of the adjacent non-reinforced area 1A.

[0104] Although the present application has been disclosed in the above preferred embodiments, it is not intended to limit the present application. Those skilled in the art can make various modifications and improvements without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be subject to the scope defined by the claims.

Claims

1. A method of processing a dot matrix structure part, characterized by, The to-be-processed lattice structure comprises alternating reinforced thickness layers (1C) and non-reinforced thickness layers (1D) in the height direction, wherein the reinforced thickness layers (1C) comprise non-reinforced regions (1A) and reinforced regions (1B), and the reinforced regions (1B) are located at the intersections of at least two non-reinforced regions (1A); The processing method uses a processing device of the lattice structure part to process layer by layer until a predetermined thickness is reached, so as to obtain the to-be-processed lattice structure; The processing device of the lattice structure part comprises a gantry (10), a cross frame (20), a powder scraping component (30), a powder feeding laser (40), and a laser galvanometer (50); Two inner side walls of the gantry (10) are respectively provided with first guide rails (11) arranged in the Y direction, and the bottom of the gantry (10) is provided with a base plate (12) connected to the gantry (10) by fourth guide rails (13) arranged in the Z direction, and the base plate (12) can move between a first height and a second height in the Z direction relative to the gantry (10); The cross frame (20) is connected to the first guide rails (11) and can be driven by the first guide rails (11) to move in the Y direction; The powder feeding laser (40) comprises a first powder feeding laser (41) and a second powder feeding laser (42), and the first powder feeding laser (41) and the second powder feeding laser (42) are connected to the cross frame (20) by a double-shaft driving component for driving the first powder feeding laser (41) or the second powder feeding laser (42) to move in the X direction and the Z direction; The powder scraping component (30) is connected to the cross frame (20); The laser galvanometer (50) is connected to the gantry (10); When the base plate (12) is at the first height, a plane where the upper end surface of the base plate (12) is located is defined as a reference plane, the base plate (12) can be driven by the fourth guide rails (13) to move downward layer by layer at a predetermined interval, the first powder feeding laser (41) and the second powder feeding laser (42) are used to lay first powder and second powder respectively on different regions of the surface of the base plate (12), and the powder is leveled by the powder scraping component (30) so that the upper end surface of the powder is flush with the reference plane; The laser galvanometer (50) is used to sinter the laid powder into a predetermined path alone or in cooperation with the first powder feeding laser (41) and / or the second powder feeding laser (42); The processing of the reinforced thickness layer (1C) comprises the following steps: Step a1, define a single-layer powder laying thickness h, control the base plate (12) to move downward by h, and the distance between the upper end surface of the base plate (12) after moving and the reference plane is h; Step a2, the first powder feeder laser (41) and the second powder feeder laser (42) are driven by the cross beam (20) to move from the first end to the second end along the Y positive direction row by row, and in each row, the first powder is laid in the non-strengthened area (1A) by the first powder feeder laser (41) and the second powder is laid in the strengthened area (1B) by the second powder feeder laser (42) according to the position of the non-strengthened area (1A) and the strengthened area (1B), the powder scraping component (30) moves synchronously with the cross beam (20) and flattens the laid powder; Step a3, the first powder in the non-strengthened area (1A) after flattening is sintered by the laser galvanometer (50); Step a4, the first powder feeder laser (41) and the second powder feeder laser (42) are driven by the cross beam (20) to move from the second end to the first end along the Y negative direction row by row, and in each row, the second powder laid in the strengthened area (1B) is sintered by the laser galvanometer (50) in cooperation with the first powder feeder laser (41) and / or the second powder feeder laser (42); Step a5, repeat steps a1-a4 until the thickness of the strengthened thickness layer (1C) is reached; The processing of the non-strengthened thickness layer (1D) includes the following steps: Step b1, define the single-layer powder laying thickness as h, control the substrate (12) to move downward by h, and the distance between the upper end surface of the moved substrate (12) and the reference surface is h; Step b2, the first powder feeder laser (41) and the second powder feeder laser (42) are driven by the cross beam (20) to move from the first end to the second end along the Y positive direction row by row, and in each row, the first powder is laid in the non-strengthened area (1A) by the first powder feeder laser (41) according to the position of the non-strengthened area (1A), and the powder scraping component (30) moves synchronously with the cross beam (20) and flattens the laid powder; Step b3, the first powder in the non-strengthened area (1A) after flattening is sintered by the laser galvanometer (50); Step b4, the first powder feeder laser (41) and the second powder feeder laser (42) are driven by the cross beam (20) to move from the second end to the first end along the Y negative direction; Step b5, repeat steps a1-a4 until the thickness of the non-strengthened thickness layer (1D) is reached.

2. The method of processing a dot patterned part according to claim 1, wherein The laser galvanometer (50) is arranged on the top surface of the gantry (10), and the laser galvanometer (50) includes a first laser galvanometer and a second laser galvanometer, and the first laser galvanometer and the second laser galvanometer are diagonally distributed on the top surface of the gantry (10).

3. The method of processing a dot patterned part according to claim 1, wherein The double-shaft driving component includes a second guide rail (21) and a third guide rail (23), the side wall of the cross beam (20) is provided with the second guide rail (21) arranged along the X axis, the second guide rail (21) is provided with two connecting plates (22), the connecting plate (22) is provided with the third guide rail (23) arranged along the Z direction, and the first powder feeder laser (41) and the second powder feeder laser (42) are respectively connected to the third guide rail (23) on one connecting plate (22).

4. The method of processing a dot patterned part according to claim 3, wherein The first powder feeding laser (41) comprises a wideband powder feeding laser, and the second powder feeding laser (42) comprises a coaxial powder feeding laser, the wideband powder feeding laser feeding a first powder, and the coaxial powder feeding laser feeding a second powder.

5. The method of processing a dot patterned part according to claim 3, wherein When the laser focal point of the first powder feeding laser (41) or the second powder feeding laser (42) is at the reference plane, the lower end surface of the first powder feeding laser (41) or the second powder feeding laser (42) is at the focal point plane; when the convergence point of the powder feeding of the first powder feeding laser (41) or the second powder feeding laser (42) is at the reference plane, the lower end surface of the first powder feeding laser (41) or the second powder feeding laser (42) is at the powder laying plane, the focal point plane is higher than the powder laying plane or the focal point plane coincides with the powder laying plane.

6. The method of processing a dot patterned part according to claim 5, wherein The powder scraping component (30) is connected to the lower part of the cross frame (20) through a telescopic structure (24), so that the powder scraping component (30) has a retracted position and an extended position; when the powder scraping component (30) is in the extended position, the lower end surface of the powder scraping component (30) is flush with the reference plane; when the powder scraping component (30) is in the retracted position, the lower end surface of the powder scraping component (30) is higher than the focal point plane.

7. The method of processing a dot patterned part according to claim 1, wherein In step a2, when performing powder laying of each row, the first powder feeding laser (41) performs powder laying in the X-axis direction before the second powder feeding laser (42), and the first powder feeding laser (41) skips the reinforcing area (1B), and the second powder feeding laser (42) performs powder laying in the reinforcing area (1B) skipped by the first powder feeding laser (41).

8. The method of processing a dot patterned part according to claim 7, wherein The length of the reinforcing area (1B) is less than one sixth of the length of the non-reinforcing area (1A) at the adjacent position.

9. The method of processing a dot patterned part according to claim 7, wherein The thickness of each layer of powder is less than 60 um.

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