A chip packaging device

Abstract

The application provides a chip boxing device, comprising: a filling mechanism, which comprises a bearing frame for sequentially stacking and filling chips and a discharging unit, and a rotating shaft is vertically connected below the bearing frame and is rotationally arranged along its own axis; a bearing table, which is horizontally arranged and moves along the axis direction of the rotating shaft on one side of the filling mechanism, and is used for placing a packaging box; a transmission mechanism, which comprises: a first gear and rack assembly arranged below the bearing table and used for driving the bearing table; a second gear and rack assembly arranged at one end of the rotating shaft and used for driving the rotating shaft; and a driving mechanism installed at one end of the rotating shaft and acting on the first gear and rack assembly and the second gear and rack assembly, so that the bearing table moves a predetermined distance along the length direction of the rotating shaft when the rotating shaft drives the bearing frame to rotate from a horizontal state to a vertical state. The device can automatically fill the sequentially stacked chips into the chip packaging box, which is beneficial to improving the production efficiency.

Description

Technical Field

[0001] This application belongs to the field of chip packaging technology, and in particular relates to a chip packaging device. Background Technology

[0002] For rectifier bridge chips with four pins packaged on one side of the package, such as the GBJ rectifier bridge chip, after production, the chips need to be stacked and arranged, and then placed into the chip packaging box in order to facilitate logistics and save packaging space. Currently, this process is usually done manually, placing the stacked chips into the chip packaging box in order, which has a low degree of automation and is not conducive to improving production efficiency. Summary of the Invention

[0003] To address the shortcomings of the prior art, this application provides a chip packaging device that can automatically load stacked chips into chip packaging boxes, thereby improving production efficiency.

[0004] To achieve the above objectives, the present invention employs the following techniques: A chip packaging device, comprising: The loading mechanism includes a carrier frame for sequentially stacking and loading chips and an unloading unit integrated with the carrier frame for unloading the encapsulated devices in the carrier frame. A rotating shaft is vertically connected to the bottom of the carrier frame and is rotatable along its own axis. The support platform is horizontally positioned on one side of the filling mechanism and moves along the axis of rotation to place the packaging box. When the rotating shaft drives the support frame to rotate to the horizontal position, the support frame is located inside the support platform and parallel to the bottom surface of the support platform. The transmission mechanism includes: a first gear and rack assembly disposed below the support platform for driving the support platform; and a second gear and rack assembly disposed at one end of the rotating shaft for driving the rotating shaft. The drive mechanism is installed at one end of the rotating shaft and acts on the first gear and rack assembly and the second gear and rack assembly. When the rotating shaft drives the bearing frame to rotate from a horizontal state to a vertical state, the bearing platform moves a predetermined distance along the length of the rotating shaft.

[0005] Furthermore, the first gear and rack assembly includes a first gear disposed parallel to the underside of the support platform and cooperating with the drive mechanism, and a first rack connected to the underside of the support platform, which is parallel to the rotation axis and meshes with the first gear; the second gear and rack assembly includes a second gear coaxially disposed at one end of the rotation axis, and a second rack connected to the drive mechanism meshing on one side of the second gear.

[0006] Furthermore, the drive mechanism includes a first linear mechanism located at one end of the rotating shaft, with its movable end facing vertically and connected to a mounting frame. A second rack is vertically mounted on the mounting frame. A mating plate is connected below the mounting frame, and the mating plate is perpendicular to the rotating shaft. An oblique guide groove is formed on the surface of the mating plate, with one end of the guide groove facing the rotation direction of the first gear lower than the other end. A horizontally arranged mating frame is mounted parallel to one side of the mating plate, and a mounting frame that moves along the length of the mating plate is fitted inside the mating frame. A vertically positioned mating shaft is set inside the mounting frame, and the mating shaft is rotatably fitted to one end of a lever. The other end of the lever forms a pawl that engages with the first gear. A torsion spring is sleeved on the mating shaft to hold the pawl against the tooth surface of the first gear. A mating rod is vertically connected to one side of the mounting frame, with the distal end of the mating rod located in the guide groove.

[0007] Furthermore, there are two rotating shafts arranged parallel to each other, and two loading mechanisms connected to the corresponding rotating shafts respectively. One end of each rotating shaft is connected to a second gear. There are two support platforms located on both sides of the two loading mechanisms respectively. A first rack is connected to the bottom of each support platform. A pair of opposing second racks are installed on the mounting frame. The two second gears are located between the two second racks and mesh with the corresponding second racks.

[0008] Furthermore, the discharge unit includes a mounting block that passes through the rotating shaft, guide rods that are vertically arranged on both sides of the mounting block, and the bearing frame that passes through the corresponding guide rods and moves along the guide rods on both sides; a second linear mechanism is mounted on the mounting block, the movable end of which faces the length direction of the guide rod and is connected to the bottom of the bearing frame; a push rod is also vertically arranged on the mounting block, the push rod passes through the bottom of the bearing frame, and the stroke length of the movable end of the second linear mechanism is greater than the length of the bearing frame.

[0009] Furthermore, the filling mechanism and the support platform are both mounted on a base. The base is provided with a pair of portal frames perpendicular to the rotation axis. Support seats for mounting the rotation axis are provided at both ends of the middle of the portal frames, and guide rails for mounting the support platform are provided on both sides of the portal frames. The first gear is rotatably engaged on the base. The drive mechanism is located on the base.

[0010] The beneficial effects of this invention are as follows: 1. By setting the first gear and rack assembly and the second rack and gear assembly in the transmission mechanism, and cooperating with the drive mechanism, the carrier frame can rotate around the rotation axis, and at the same time, the carrier platform moves along the axis of rotation. The rotation of the carrier frame and the movement of the carrier platform are coordinated to put the stacked chips in the carrier frame into the packaging box placed on the carrier platform in a row until the packaging box is full. This realizes the function of automatically loading the stacked chips into the packaging box in a row, which changes the traditional manual loading method and improves production efficiency. 2. The first linear mechanism drives the mounting frame to move vertically, thereby engaging the second rack and the second gear, which in turn drives the bearing frame to rotate. Simultaneously, the first linear mechanism drives the mating plate to move, causing the guide groove on the mating plate to act on the mating rod connected to the mounting frame. This causes the mounting frame to move the lever, and the lever's pawl pushes the second gear to engage the second rack. This achieves the goal of rotating and intermittently moving the bearing frame using only a single first linear mechanism as the power source, combined with a reasonable transmission structure design. This not only improves the chip loading effect and saves costs, but also enhances the integration of the device and optimizes its structure. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of the device support frame in the embodiment of this application when it is in a vertical state.

[0012] Figure 2 This is a schematic diagram of the structure of the first gear in the device of this application embodiment.

[0013] Figure 3 This is a state diagram of the drive mechanism when the support frame is in a vertical state in the device of this application embodiment.

[0014] Figure 4 This is a schematic diagram of the drive mechanism in the device of this application embodiment.

[0015] Figure 5 This is a schematic diagram of the structure of the mating frame in the device of the embodiment of this application.

[0016] Figure 6 This is a schematic diagram of the loading mechanism in the device of this application embodiment.

[0017] Figure 7 This is a schematic diagram of the discharge state of the discharge unit in the device of this application embodiment.

[0018] Figure 8 This is a schematic diagram of the structure of the device support frame in a horizontal state according to an embodiment of this application.

[0019] Figure 9 This is a state diagram of the drive mechanism when the support frame is in a horizontal state in the device of this application embodiment.

[0020] Reference numerals: 1-Filling mechanism, 11-Bearing frame, 12-Discharge unit, 13-Rotating shaft, 14-Mounting block, 15-Guide rod, 16-Second linear mechanism, 17-Push rod, 18-Support seat, 19-Guide rail, 2-Bearing platform, 21-Storage slot, 3-Transmission mechanism, 31-First gear and rack assembly, 32-Second gear and rack assembly, 311-First gear, 312-First rack, 32-Second gear and rack assembly, 321-Second gear, 322-Second rack, 4-Drive mechanism, 41-First linear mechanism, 42-Mounting bracket, 421-Guide column, 43-Mating plate, 431-Guide groove, 44-Mating frame, 441-Bracket, 45-Mounting frame, 46-Mating shaft, 47-Pulley, 471-Claw, 48-Torsion spring, 49-Mating rod, 5-Base, 51-Gantry frame. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments.

[0022] This application provides a chip packaging device for sequentially loading stacked chips into a packaging box in columns, such as... Figures 1-3As shown, it includes: a loading mechanism 1, which includes a carrier frame 11 for sequentially stacking and loading chips and an unloading unit 12 integrated with the carrier frame 11 for unloading the encapsulated devices in the carrier frame 11. The size of the carrier frame 11 matches the size of the storage slot 21 in the packaging box. A rotating shaft 13 is vertically connected to the bottom of the carrier frame 11. The rotating shaft 13 is rotatably set along its own axis. When the rotating shaft 13 drives the carrier frame 11 to a vertical state, the opening of the carrier frame 11 corresponds to the exit of the track used for transporting chips in the prior art. Due to the weight of the chips themselves and the guiding effect of the structure of the carrier frame 11 itself on the chips, the chips can be sequentially stacked vertically into the carrier frame 11, and the pins of each chip face the same side. The support platform 2 is horizontally positioned on one side of the filling mechanism 1 and is movable along the axis of the rotating shaft 13. The platform of the support platform 2 is used to place the packaging box. To ensure that the position of the chip inside the packaging box does not change during the logistics process, and to avoid damage to the encapsulation or pins caused by collisions between chips, multiple storage slots 21 are usually arranged in columns inside the packaging box. In this embodiment, the packaging box has five storage slots 21. The height of the support frame 11 is the same as the length of the storage slot 21, and the width of the storage slot 21 must be greater than the width of the support frame 11 to ensure that when the rotating shaft 13 drives the support frame 11 to rotate to the horizontal position, the support frame 11 can be completely located in the storage slot 21 of the packaging box and just fill the storage slot 21. Accordingly, the size of the support frame 11 can be set to be adjustable to accommodate chips of different specifications and storage slots 21 of different sizes. The transmission mechanism 3 includes: a first gear and rack assembly 31, located below the support platform 2, for driving the support platform 2 to move along the axis of the rotating shaft 13; and a second rack and pinion assembly 32, located at one end of the rotating shaft 13, for driving the rotating shaft 13 to rotate around its own axis. The drive mechanism 4 is mounted at one end of the rotating shaft 13 and acts on the first gear and rack assembly 31 and the second rack and pinion assembly 32. When the rotating shaft 13 drives the support frame 11 from a horizontal state to a vertical state, the support platform 2 moves a distance equal to the width of a storage slot 21 along the length of the rotating shaft 13.

[0023] When applying, such as Figure 1 , Figure 2 , Figure 8 , Figure 9As shown, the carrier frame 11 is in a vertical position, and the delivered chips are stacked vertically into the carrier frame 11 one by one. At this time, a packaging box is placed on the carrier platform 2, and the first storage slot 21 in the packaging box is on the same vertical plane as the carrier frame 11. The first slot is defined according to the moving direction of the carrier platform 2. When the carrier frame 11 is full of chips, the drive mechanism 4 will act on the second rack and pinion assembly 32, but not on the first rack and pinion assembly 31. That is, the carrier frame 11 rotates, while the carrier platform 2 and the packaging box on the carrier platform 2 do not move. The carrier frame 11 stops stacking chips and rotates around the rotation axis 13 to the first storage slot 21 in the packaging box. When the carrier frame 11 rotates to the horizontal position... When the carrier frame 11 is fully inserted into the first storage slot 21, the discharging unit 12 transfers all the chips in the carrier frame 11 into the first storage slot 21, thus completing the filling of the first storage slot 21 with chips. The driving mechanism 4 continues to act on the second rack and pinion assembly 32 and simultaneously on the first rack and pinion assembly 31, that is, the carrier frame 11 returns to the vertical state to continue receiving the delivered chips, while the carrier platform 2 and the packaging box on the carrier platform 2 move along the axis of the rotating shaft 13 by the width of one storage slot 21, so that the second storage slot 21 and the carrier frame 11 are in the same vertical plane, and the filling steps of the first storage slot 21 are repeated until the packaging box is full. Through the ingenious arrangement of the transmission mechanism 3 and the drive mechanism 4, the drive mechanism 4 achieves intermittent control of the first gear and rack assembly 31. That is, when the drive mechanism 4 acts on the second gear and rack assembly 32 to rotate the support frame 11 from vertical to horizontal, the first gear and rack assembly 31 does not move the support platform 2. When the second gear and rack assembly 32 rotates the support frame 11 from horizontal to vertical, the drive mechanism 4 simultaneously acts on the first gear and rack assembly 31, causing the support platform 2 to move a distance equal to the width of a storage slot 21. This not only ensures the chip loading effect and improves the automation level of the device, but also changes the manual chip loading method and improves production efficiency.

[0024] Specifically, such as Figures 1-4 As shown, the first gear and rack assembly 31 includes a first gear 311 parallel to the support platform 2 and cooperating with the drive unit 4, and a first rack 312 parallel to the rotation shaft 13 and meshing with the first gear 311 connected below the support platform 2; the second gear and rack assembly 32 includes a second gear 321 coaxially disposed at one end of the rotation shaft 13, and a second rack 322 connected to the drive unit 4 meshing on one side of the second gear 321. In this embodiment, a gear and rack is used as the preferred transmission method. Gear and rack transmission has the characteristics of long service life, smooth operation and constant transmission ratio, which makes the support frame 11 and the support platform 2 more stable during rotation and movement, and the chips have better stability in the support frame 11 and the storage slot 21, further ensuring the chip loading effect and extending the service life of the device.

[0025] To better achieve intermittent control of the first gear and rack assembly 31 by the drive mechanism 4, that is, each time the support frame 11 rotates from a horizontal to a vertical position, the first gear and rack assembly 31 drives the support platform 2 to move a distance equal to the width of a storage slot 21, this embodiment proposes a preferred solution: Figure 4 , Figure 5 , Figure 8 As shown, the drive mechanism 4 includes a first linear mechanism 41 located at one end of the rotating shaft 13. In this embodiment, the first linear mechanism 41 is a linear lead screw, but other linear mechanisms such as linear cylinders and linear motors can also be used. The movable end of the first linear mechanism 41 faces the vertical direction and is connected to a mounting bracket 42. A second rack 322 is vertically mounted on the mounting bracket 42. A mating plate 43 is connected to the lower part of the mounting bracket 42. The mating plate 43 is set perpendicular to the rotating shaft 13. An oblique guide groove 431 is opened on the surface of the mating plate 43. The end of the guide groove 431 facing the rotation direction of the first gear 311 is lower than the rotation direction of the first gear 311. At the other end, a horizontally arranged mating frame 44 is mounted parallel to one side of the mating plate 43. A mounting frame 45 is mounted inside the mating frame 44 and is movable along the length of the mating plate 43. A vertically arranged mating shaft 46 is arranged inside the mounting frame 45. The mating shaft 46 is rotatably engaged with one end of a lever 47. The other end of the lever 47 forms a pawl 471 that engages with the first gear 311. A torsion spring 48 is sleeved on the mating shaft 46 to hold the pawl 471 against the tooth surface of the first gear 311. A mating rod 49 is vertically connected to one side of the mounting frame 45. The distal end of the mating rod 49 is located in the guide groove 431.

[0026] In application, the support frame 11 is in a vertical state, the first storage slot 21 in the packaging box on the support platform 2 is on the same plane as the support frame 11, the mounting frame 45 is located at one end of the mating frame 44, and the mating rod 49 is located at the lower end of the guide groove 431; the first linear mechanism 41 drives the mounting bracket 42 and the mating plate 43 to move downward in the vertical direction, thereby driving the second rack 322 to mesh with the second gear 321, and the support frame 11 rotates from a vertical state to a horizontal state. At the same time, under the action of the guide groove 431 and the mating rod 49, the mounting frame 45 moves along the length direction of the mating plate 43 to the other end of the mating frame 44, and the mating rod 49 also moves to the upper end of the guide groove 431. With the lever 47 in motion, under the action of the torsion spring 48, the lever 47 moves along the tooth surface of the first gear 311 in the direction it points. After loading is completed, the first linear mechanism 41 drives the mounting frame 42 and the mating plate 43 to move vertically upward. The second rack 322 meshes with the second gear 321, causing the bearing frame 11 to rotate from horizontal to vertical. At the same time, under the action of the guide groove 431 and the mating rod 49, the mounting frame 45 returns to its initial position. The pawl 471 at one end of the lever 47 engages between the two teeth of the first gear 311. As the mounting frame 45 moves, the first gear 311 rotates and meshes with the first rack 312, thereby moving the bearing platform 2. Correspondingly, the rotation of the support frame 11 is determined by the transmission ratio and meshing time of the second gear 321 and the second rack 322, while the meshing time is determined by the length of the second rack 322 and the stroke length of the first linear mechanism 41; the moving distance of the support platform 2 is determined by the transmission ratio and meshing time of the first gear 311 and the first rack 312, while the meshing time is determined by the stroke length of the first linear mechanism 41 and the straight distance between the two ends of the guide groove 431; therefore, it is necessary to reasonably set the gear and rack transmission ratio, rack length, stroke length of the first linear mechanism 41 and the straight distance between the two ends of the guide groove 431 to achieve the purpose of precise chip loading, which not only further improves the chip loading effect, but also improves the integration of the device and optimizes the structure of the device.

[0027] Specifically, such as Figures 1-4As shown, there are two rotating shafts 13 arranged parallel to each other, and two filling mechanisms 1 connected to the corresponding rotating shafts 13. One end of each rotating shaft 13 is connected to a second gear 321. There are two support platforms 2 located on either side of the two filling mechanisms 1, and a first rack 312 is connected to the bottom of each support platform 2. A pair of opposing second racks 322 are mounted on the mounting frame 42, and two second gears 321 are located between the two second racks 322 and mesh with the corresponding second racks 322. In application, the two support frames 11 can be simultaneously controlled to fill the packaging boxes on the two support platforms 2 with chips, and the two support platforms 2 can be simultaneously controlled to move towards each other along the axis of the rotating shafts 13. This allows the device to not only automatically fill chips but also simultaneously fill two packaging boxes with chips, greatly improving chip filling efficiency and further enhancing production efficiency.

[0028] Specifically, such as Figure 1 , Figure 6 , Figure 7 As shown, the discharge unit 12 includes a mounting block 14 passing through the rotating shaft 13. Guide rods 15 are vertically arranged on both sides of the mounting block 14. The support frame 11 is mounted on both sides of the corresponding guide rods 15 and moves along the guide rods 15. A second linear mechanism 16 is mounted on the mounting block 14. In this embodiment, the second linear mechanism 16 is a linear cylinder, with its movable end facing the length direction of the guide rod 15 and connected to the bottom of the support frame 11. A push rod 17 is also vertically arranged on the mounting block 14, passing through the bottom of the support frame 11. The stroke length of the movable end of the second linear mechanism 16 is greater than the length of the support frame 11. When the support frame 11, filled with stacked chips, rotates from a vertical to a horizontal state, the second linear mechanism 16 drives the support frame 11 to exit from the storage slot 21 along the guide rod 15. Under the action of the push rod 17, the chips are completely pressed into the storage slot 21 by the end of the push rod 17, preventing them from falling out of the storage slot 21 due to friction as the support frame 11 moves. The structure of the discharge unit 12 ensures the chip loading effect while simplifying the chip discharge method in the carrier frame 11.

[0029] Specifically, such as Figure 1 and Figure 8As shown, the filling mechanism 1 and the support platform 2 are both mounted on a base 5. The base 5 has a pair of portal frames 51 perpendicular to the rotating shaft 13. Support seats 18 for mounting the rotating shaft 13 are provided at both ends of the portal frames 51. Guide rails 19 for mounting the support platform 2 are provided on both sides of the portal frames 51. Correspondingly, limit blocks can be set on the guide rails 19. After filling is completed, simply pull the lever 47 away from the first gear 311, and then push the support platform 2 to abut against the limit blocks. At this time, the first storage slot 2 of the packaging box is re-placed on the support platform 2. The 1 and the support frame 11 are on the same vertical plane, further improving the loading efficiency of the device; the first gear 311 is rotatably fitted on the base 5, and correspondingly, a certain damping can be set for the rotation of the first gear 311 so that when the lever 47 moves along the tooth surface of the first gear 311, the first gear 311 will not be rotated due to friction; the drive mechanism 4 is mounted on the base 5; a pair of guide posts 421 are also vertically mounted on the base 5, and the mounting bracket 42 is slidably fitted on the guide posts 421; the mating frame 44 is mounted on the base 5 through a bracket 441. The above configuration makes the device highly integrated and facilitates the transfer of the device.

[0030] The above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. A chip packaging device, characterized in that, include: The filling mechanism (1) includes a carrier frame (11) for sequentially stacking and filling chips and a discharge unit (12) integrated with the carrier frame (11) and discharging the encapsulated device in the carrier frame (11). A rotating shaft (13) is vertically connected to the lower part of the carrier frame (11), and the rotating shaft (13) is rotatably arranged along its own axis. The support platform (2) is horizontally positioned on one side of the filling mechanism (1) and moves along the axis of the rotating shaft (13) to hold the packaging box. When the rotating shaft (13) drives the support frame (11) to rotate to the horizontal position, the support frame (11) is located inside the support platform (2) and parallel to the bottom surface of the support platform (2). When the rotating shaft (13) drives the support frame (11) from the horizontal state to the vertical state, the support platform (2) moves a predetermined distance along the length of the rotating shaft (13). The transmission mechanism (3) includes a first gear and rack assembly (31) located below the support platform (2) and a second gear and rack assembly (32) located at one end of the rotating shaft (13). The first gear and rack assembly (31) includes a first gear (311) located parallel to the support platform (2) and a first rack (312) connected below the support platform (2) and meshing with the first gear (311) parallel to the rotating shaft (13). The second gear and rack assembly (32) includes a second gear (321) located coaxially at one end of the rotating shaft (13) and a second rack (322) meshing with one side of the second gear (321). The drive mechanism (4) is installed at one end of the rotating shaft (13). It includes a first linear mechanism (41), the movable end of which faces the vertical direction and is connected to a mounting bracket (42). A second rack (322) is vertically installed on the mounting bracket (42). A mating plate (43) is connected to the lower part of the mounting bracket (42). The mating plate (43) is set perpendicular to the rotating shaft (13). An oblique guide groove (431) is opened on the surface of the mating plate (43). The end of the guide groove (431) facing the rotation direction of the first gear (311) is lower than the other end. A horizontally set mating plate is mounted parallel to one side of the mating plate (43). The frame (44) is fitted with a mounting frame (45) that moves along the length of the mounting plate (43). The mounting frame (45) is fitted with a vertically positioned mounting shaft (46). The mounting shaft (46) is rotatably fitted to one end of a lever (47). The other end of the lever (47) forms a pawl (471) that engages with the first gear (311). A torsion spring (48) is fitted on the mounting shaft (46) to hold the pawl (471) against the tooth surface of the first gear (311). A mounting rod (49) is vertically connected to one side of the mounting frame (45). The far end of the mounting rod (49) is located in the guide groove (431).

2. The chip packaging device according to claim 1, characterized in that, There are two rotating shafts (13) arranged in parallel to each other. There are two loading mechanisms (1) connected to the corresponding rotating shafts (13). One end of each rotating shaft (13) is connected to a second gear (321). There are two support platforms (2) located on both sides of the two loading mechanisms (1). A first rack (312) is connected to the bottom of each support platform (2). A pair of opposing second racks (322) are installed on the mounting frame (42). The two second gears (321) are located between the two second racks (322) and mesh with the corresponding second racks (322).

3. The chip packaging device according to claim 1, characterized in that, The discharge unit (12) includes a mounting block (14) that passes through the rotating shaft (13). Guide rods (15) are vertically provided on both sides of the mounting block (14). The bearing frame (11) is provided on both sides through the corresponding guide rods (15) and is movable along the guide rods (15). A second linear mechanism (16) is installed on the mounting block (14). Its movable end faces the length direction of the guide rod (15) and is connected to the bottom of the bearing frame (11). A push rod (17) is also vertically provided on the mounting block (14). The push rod (17) passes through the bottom of the bearing frame (11). The stroke length of the movable end of the second linear mechanism (16) is greater than the length of the bearing frame (11).

4. A chip packaging device according to claim 2, characterized in that, The loading mechanism (1) and the support platform (2) are both mounted on a base (5). A pair of portal frames (51) perpendicular to the rotating shaft (13) are provided on the base (5). Support seats (18) for mounting the rotating shaft (13) are provided at both ends of the middle part of the portal frame (51). Guide rails (19) for mounting the support platform (2) are provided on both sides of the portal frame (51). The first gear (311) is rotatably engaged on the base (5). The drive mechanism (4) is located on the base (5).

5. A chip packaging device according to claim 4, characterized in that, A pair of guide posts (421) are vertically provided on the base (5), and the mounting bracket (42) is slidably fitted on the guide posts (421); the fitting frame (44) is mounted on the base (5) through a bracket (441).

Images