Backlight module and display device

Abstract

The application provides a backlight module and a display device. The backlight module comprises a back plate, an optical assembly, a light-emitting assembly and a sealing layer. The back plate comprises a bottom plate and a side plate surrounding the bottom plate. The optical assembly is fixed on the side plate. The light-emitting assembly is arranged on the bottom plate and between the optical assembly and the bottom plate. The sealing layer is arranged on the light-emitting assembly and between the optical assembly and the light-emitting assembly. When the backlight module is in a first mode, the sealing layer is spaced apart from the optical assembly to form a light mixing gap. Light emitted by the light-emitting assembly enters the optical assembly through the sealing layer and the light mixing gap in sequence. In the thickness direction of the backlight module, the sum of the thickness of the sealing layer and the size of the light mixing gap is less than a preset distance. The sealing layer and the light mixing gap can be used to homogenize the light emitted by the light-emitting assembly. Compared with the related art which uses multiple light homogenizing films to realize 0 light mixing distance technology, the application only needs to arrange the sealing layer and the light mixing gap on the light-emitting assembly, so that the manufacturing cost of the backlight module can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a backlight module and a display device. BACKGROUND

[0002] With the maturity of Mini-LED display technology, various Mini-LED display devices emerge in an endless stream, and the application scenarios are also more and more widely, gradually entering people's daily life. Mini-LED display devices have advantages such as high color gamut, high brightness, high contrast, etc. in terms of picture quality, which can bring users better visual experience. In the Mini-LED display device, a large gap needs to be reserved between the light emitting assembly and the optical film layer of the backlight module as a uniform light distance.

[0003] In recent years, a 0 light mixing distance Mini-LED (Optical Distance Zero Mini LED) display device has appeared. The 0 light mixing distance Mini-LED technology refers to a Mini-LED display technology with a very small distance between the backlight module and the display panel. In addition to inheriting all the advantages of traditional Mini-LED displays, the 0 light mixing distance Mini-LED technology can also achieve thinner design and higher display performance. However, in the related technology, the 0 light mixing distance Mini-LED usually uses 2-3 light mixing films for uniform light, and the price of the light mixing film is expensive, which makes the cost of the backlight module of the 0 light mixing distance Mini-LED higher. SUMMARY

[0004] The purpose of the present application is to provide a backlight module and a display device to solve the technical problem of high cost of the backlight module of the 0 light mixing distance Mini-LED in the related technology.

[0005] In a first aspect, the present application provides a backlight module, comprising:

[0006] a back plate comprising a bottom plate and a side plate surrounding the bottom plate;

[0007] an optical assembly fixed on the side plate;

[0008] a light emitting assembly arranged on the bottom plate and between the optical assembly and the bottom plate; and

[0009] a sealing layer arranged on the light emitting assembly and between the optical assembly and the light emitting assembly, wherein when the backlight module is in a first mode, the sealing layer and the optical assembly are spaced apart to form a light mixing gap, the light emitted by the light emitting assembly enters the optical assembly in sequence through the sealing layer and the light mixing gap, and the sum of the thickness of the sealing layer and the size of the light mixing gap is less than a preset distance in the thickness direction of the backlight module.

[0010] The backlight module provided in the application includes a bottom plate, a side plate surrounding the bottom plate, an optical assembly fixed on the side plate, a light-emitting assembly arranged on the bottom plate and between the optical assembly and the bottom plate, and a sealing layer arranged on the light-emitting assembly and between the optical assembly and the light-emitting assembly. When the backlight module is in a first mode, the sealing layer is spaced apart from the optical assembly to form a light mixing gap, light emitted by the light-emitting assembly enters the optical assembly in sequence through the sealing layer and the light mixing gap, and the sum of the thickness of the sealing layer and the size of the light mixing gap is less than a preset distance in the thickness direction of the backlight module. The light emitted by the light-emitting assembly enters the optical assembly in sequence through the sealing layer and the light mixing gap, the sealing layer and the light mixing gap can be used to homogenize the light emitted by the light-emitting assembly, which is conducive to further improving the uniformity of the light before entering the optical assembly and further improving the overall light-emitting brightness uniformity of the backlight module. Compared with the related art in which 2-3 diffusion films are used to realize 0 light mixing distance Mini-LED technology, the application only needs to arrange the sealing layer and the light mixing gap on the light-emitting assembly, which can reduce the manufacturing cost of the backlight module, so that the backlight module can be applied to 0 light mixing distance Mini-LED technology at a lower cost.

[0011] The backlight module further includes a telescopic layer arranged between the light-emitting assembly and the bottom plate, one end of the telescopic layer being connected to the light-emitting assembly and the other end being connected to the bottom plate. When the backlight module is in a second mode, the telescopic layer is in an initial state, and the sealing layer abuts against the optical assembly. When the backlight module is in the first mode, the telescopic layer is in a contracted state, and the sealing layer is spaced apart from the optical assembly to form the light mixing gap.

[0012] The material of the telescopic layer is a heat-shrinkable material, and when the backlight module is in the first mode, the light-emitting assembly works and emits heat to the telescopic layer, so that the telescopic layer enters the contracted state. Alternatively, the material of the telescopic layer is an electrostrictive material, and when the backlight module is in the first mode, the light-emitting assembly is electrically connected to the telescopic layer and transmits an electrical signal to the telescopic layer, so that the telescopic layer enters the contracted state.

[0013] The backlight module further includes a limiting piece arranged between the light-emitting assembly and the bottom plate. The limiting piece is used to abut against the light-emitting assembly when the backlight module is in the first mode, so as to limit the light-emitting assembly from moving further toward the bottom plate.

[0014] The backlight module further comprises a plurality of elastic members and a bearing substrate, the bearing substrate is arranged on the bottom plate, the elastic members are arranged between the light-emitting assembly and the bearing substrate, one end of the elastic members is connected to the light-emitting assembly, and the other end is connected to the bearing substrate, and when the backlight module is in the second mode, the elastic members are in a stretched state.

[0015] The telescopic layer encloses to form a first accommodating cavity, and the first accommodating cavity is used for accommodating a preset liquid, and the preset liquid is used for conducting heat of the light-emitting assembly and reflecting light emitted by the light-emitting assembly.

[0016] The light-emitting assembly comprises a lamp plate and a light-emitting member, the light-emitting member is arranged on the lamp plate, a plurality of through holes are arranged on the lamp plate, the through holes are communicated with the first accommodating cavity, a plurality of second accommodating cavities are arranged in the sealing layer, the second accommodating cavities are arranged corresponding to the through holes and communicated with the through holes, when the backlight module enters the first mode from the second mode, the lamp plate moves towards the direction close to the bottom plate, the preset liquid in the first accommodating cavity enters the second accommodating cavity through the through hole, and a plurality of convex structures are formed on the side of the sealing layer close to the light-emitting assembly, and the convex structures are arranged corresponding to the second accommodating cavities.

[0017] The backlight module further comprises a sealing valve, the sealing valve is arranged in the through hole, and when the backlight module is in the second mode, the sealing valve is used for isolating the second accommodating cavity and the first accommodating cavity.

[0018] The backlight module further comprises a plurality of light-reflecting layers, the light-reflecting layers are arranged in the second accommodating cavity and arranged towards the bottom plate, and the light-reflecting layers are used for reflecting light emitted by the light-emitting assembly.

[0019] In a second aspect, the present application provides a display device, which comprises a display panel, a middle frame and a backlight module, the display panel and the backlight module are arranged in opposite directions, the middle frame surrounds the backlight module and the display panel, and is connected to the backlight module and the display panel respectively.

[0020] In the display device provided in this application, the optical component is fixed to the side plate, the light-emitting component is disposed on the base plate and between the optical component and the base plate, and the sealing layer is disposed on the light-emitting component and between the optical component and the light-emitting component. When the backlight module is in a first mode, the sealing layer and the optical component are spaced apart to form a light-mixing gap. The light emitted by the light-emitting component sequentially passes through the sealing layer and the light-mixing gap into the optical component. In the thickness direction of the backlight module, the sum of the thickness of the sealing layer and the size of the light-mixing gap is less than a preset distance. The light emitted by the light-emitting component sequentially passes through the sealing layer and the light-mixing gap into the optical component. The sealing layer and the cavity gap can be used to homogenize the light emitted by the light-emitting component, which helps to further improve the uniformity of the light before entering the optical component and further improve the uniformity of the overall luminous brightness of the display device. Compared with related technologies that use 2-3 homogenizing films to achieve zero light-mixing distance Mini-LED technology, this application only requires a sealing layer and a light-mixing gap on the light-emitting component, which can reduce the manufacturing cost of the display device and enable the display device to apply zero light-mixing distance Mini-LED technology at a lower cost. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a cross-sectional structural diagram of a backlight module in a first mode according to an embodiment of this application;

[0023] Figure 2 This is a partially enlarged cross-sectional view of a backlight module in a first mode according to an embodiment of this application;

[0024] Figure 3 This is a cross-sectional structural diagram of a backlight module in a second mode according to an embodiment of this application;

[0025] Figure 4 This is a partially enlarged cross-sectional schematic diagram of a backlight module in a second mode according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of the structure of a display device provided in an embodiment of this application.

[0027] Label Explanation:

[0028] Display device-1000, back light module-100, back plate-10, bottom plate-11, side plate-12, optical assembly-20, light emitting assembly-30, via-31, sealing layer-40, second receiving cavity-41, convex structure-42, stretchable layer-50, first receiving cavity-51, limiting piece-60, elastic piece-71, bearing substrate-72, sealing valve-73, light reflecting layer-74, light mixing gap-80, middle frame-200, display panel-300. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0030] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-described drawings are used to distinguish different objects, not to describe a particular order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0031] In the present specification, for the convenience of description, the words indicating the orientation or position relationship such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are used to describe the position relationship of the components with reference to the drawings, only for the convenience of description of the present specification and simplification of the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. The position relationship of the components is changed appropriately according to the direction of the described components. Therefore, it is not limited to the words described in the specification, and can be appropriately replaced according to the situation.

[0032] In the present specification, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate piece, or the communication inside two elements. For those of ordinary skill in the art, the meaning of the above terms in the present disclosure can be understood according to the situation.

[0033] With the maturity of Mini-LED display technology, various Mini-LED display devices emerge in an endless stream, and the application scenarios are more and more widely, and gradually enter people's daily life. Mini-LED display devices have advantages such as high color gamut, high brightness, high contrast and the like in picture quality, and can bring users better visual experience. In the Mini-LED display device, a large gap needs to be reserved between the light emitting assembly of the backlight module and the optical film layer as a light mixing distance.

[0034] In recent years, an optical distance zero Mini LED (Optical Distance Zero Mini LED) display device has appeared. The optical distance zero Mini LED technology refers to a Mini-LED display technology with a very small distance between the backlight module and the display panel. In addition to inheriting all the advantages of traditional Mini-LED displays, the optical distance zero Mini LED technology can also achieve thinner design and higher display performance. However, in the related art, the optical distance zero Mini-LED usually uses 2-3 light mixing films for light mixing, and the light mixing film is expensive, resulting in high cost of the backlight module of the optical distance zero Mini-LED.

[0035] Please refer to Figure 1 The present application provides a backlight module 100 to solve the technical problem of high cost of the backlight module 100 of the optical distance zero Mini-LED in the related art.

[0036] The backlight module 100 includes a back plate 10, an optical assembly 20, a light emitting assembly 30, and a sealing layer 40. The back plate 10 includes a bottom plate 11 and a side plate 12 surrounding the bottom plate 11. The optical assembly 20 is fixed on the side plate 12. The light emitting assembly 30 is arranged on the bottom plate 11 and between the optical assembly 20 and the bottom plate 11. The sealing layer 40 is arranged on the light emitting assembly 30 and between the optical assembly 20 and the light emitting assembly 30. When the backlight module 100 is in a first mode, the sealing layer 40 and the optical assembly 20 are spaced apart to form a light mixing gap 80. The light emitted by the light emitting assembly 30 enters the optical assembly 20 in sequence through the sealing layer 40 and the light mixing gap 80. In the thickness direction of the backlight module 100, the sum of the thickness of the sealing layer 40 and the size of the light mixing gap 80 is less than a preset distance.

[0037] The back plate 10 includes a bottom plate 11 and a side plate 12 surrounding the bottom plate 11, and the bottom plate 11 and the side plate 12 form an accommodation space for accommodating the optical assembly 20, the light emitting assembly 30 and other structural members. The back plate 10 can be used to accommodate the optical assembly 20, the light emitting assembly 30 and other structures to avoid the light emitting assembly 30 and other structures from being eroded by external water vapor or damaged by object collision, and the back plate 10 can be used to carry and fix the optical assembly 20, the light emitting assembly 30 and other structural members to avoid the light emitting assembly 30 and other structures from shaking in the accommodation space. Optionally, in the embodiment, the material of the back plate 10 includes but is not limited to plastic (such as ABS plastic), metal material or other composite materials.

[0038] The optical assembly 20 is fixed on the side plate 12. Specifically, in the embodiment, the side plate 12 is provided with a buckling structure, and the optical assembly 20 is buckled and fixed on the side plate 12 through the buckling structure to limit the movement of the optical assembly 20 relative to the back plate 10. In the embodiment, the optical assembly 20 includes a reflective film, a diffusion film and a brightness enhancement film. The reflective film can be used to reflect the light emitted by the light emitting assembly 30, reduce the escape of light, improve the utilization rate of light, and thus increase the light efficiency and brightness of the backlight module 100. The diffusion film is used to scatter the light emitted by the light emitting assembly 30 to make the light distribution more uniform and reduce the display spot and display shadow of the backlight module 100. The brightness enhancement film increases the exit angle of light through the micro-prism structure to improve the brightness and contrast of the backlight module 100. In other embodiments, the optical assembly 20 can also include other film layers such as polarizing sheets and other structures, which are not limited in the application.

[0039] The light emitting assembly 30 is arranged on the bottom plate 11, and the light emitting assembly 30 is used to emit visible light. The light emitting assembly 30 is arranged on the side of the optical assembly 20 facing the bottom plate 11, and the visible light emitted by the light emitting assembly 30 is emitted through the optical assembly 20. Optionally, in the embodiment, the light emitting assembly 30 is a Mini-LED light emitting structure. In other embodiments, the light emitting assembly 30 can also be a LED light emitting structure, or a Micro-LED light emitting structure, or other types of light emitting structures, which are not limited in the application.

[0040] The sealing layer 40 is arranged on the light emitting component 30, and the sealing layer 40 covers the light emitting component 30. In one aspect, the sealing layer 40 can be used to seal the light emitting component 30, to prevent the water vapor in the external environment from corroding the electronic components in the light emitting component 30, so as to improve the service life of the light emitting component 30. In addition, the sealing layer 40 can also be used to protect the light emitting component 30, to prevent the light emitting component 30 from being damaged due to collision during the preparation and transportation process. In another aspect, the sealing layer 40 is arranged on the light emitting surface of the light emitting component 30, and the visible light emitted by the light emitting component 30 first passes through the sealing layer 40 and then enters the optical component 20. The sealing layer 40 can be used to homogenize the visible light emitted by the optical component 20, which is conducive to the more uniform diffusion of light before entering the optical component 20, improves the uniformity of the overall luminous brightness of the backlight module 100, and reduces the light interference, such as glare or ghosting, caused by the direct irradiation of the light emitting component 30 on the optical component 20, thereby improving the light emitting quality of the backlight module 100. It should be noted that in the embodiment, the sealing layer 40 is made of transparent material, and the material of the sealing layer 40 is silica gel. In other embodiments, the material of the sealing layer 40 can also be other types of transparent materials, which are not limited in the present application.

[0041] In the embodiment, when the backlight module 100 is in the first mode, the sealing layer 40 and the optical component 20 are arranged to form a light mixing gap 80. The light mixing gap 80 can be used to homogenize the light emitted by the light emitting component 30, which is conducive to the more uniform diffusion of light before entering the optical component 20, improves the uniformity of the overall luminous brightness of the backlight module 100. In addition, the light mixing gap 80 can also dissipate heat, to prevent the heat generated by the light emitting component 30 from accumulating and damaging the optical component 20. The light mixing gap 80 can also reduce the light interference, such as glare or ghosting, caused by the direct irradiation of the light emitting component 30 on the optical component 20, thereby improving the light emitting quality of the backlight module 100. It should be noted that the light emitted by the light emitting component 30 enters the optical component 20 through the sealing layer 40 and the light mixing gap 80 in sequence. The sealing layer 40 and the light mixing gap can be used to homogenize the light emitted by the light emitting component 30, which is conducive to further improving the uniformity of the light before entering the optical component 20, and further improving the uniformity of the overall luminous brightness of the backlight module 100.

[0042] And, in the thickness direction of the backlight module 100, the sum of the thickness of the sealing layer 40 and the size of the light mixing gap 80 is less than a preset distance, it should be noted that the preset distance refers to the distance that needs to be reserved between the light emitting assembly 30 and the optical film layer of the backlight module 100 in the related art. Wherein, the preset distance is usually greater than 3mm, and optionally, the preset distance can be 3mm, or 4mm, or 5mm, or 6mm, or other sizes.

[0043] In the thickness direction of the backlight module 100, the sum of the thickness of the sealing layer 40 and the size of the light mixing gap 80 is less than a preset distance, specifically, in the embodiment, the thickness of the sealing layer 40 is 0.3mm-0.7mm. If the thickness of the sealing layer 40 is less than 0.3mm, it may cause poor sealing effect of the sealing layer 40 or poor light uniformity effect of the light emitting assembly 30, and if the thickness of the sealing layer 40 is greater than 0.7mm, it may block the normal emission of the light emitted by the light emitting assembly 30, therefore, the thickness of the sealing layer 40 is 0.3mm-0.7mm, which can effectively seal the light emitting assembly 30 and uniform the light emitted by the light emitting assembly 30, and also avoid blocking the normal emission of the light emitted by the light emitting assembly 30. Optionally, the thickness of the sealing layer 40 can be 0.3mm, or 0.4mm, or 0.5mm, or 0.6mm, or 0.7mm, or other sizes within 0.3mm-0.7mm, which is not limited in the present application.

[0044] Specifically, in the embodiment, in the thickness direction of the backlight module 100, the size of the light mixing gap 80 is 1mm-2mm. If the thickness of the light mixing gap 80 is less than 1mm, it may cause poor light uniformity effect of the light emitting assembly 30, and if the thickness of the light mixing gap 80 is greater than 2mm, it will increase the thickness of the backlight module 100, reducing its thinness performance, therefore, when the thickness of the cavity gap is 1mm-2mm, it can effectively and uniformly the light emitted by the light emitting assembly 30, and also avoid increasing the thickness of the backlight module 100. Optionally, the thickness of the cavity gap can be 1mm, or 1.1mm, or 1.2mm, or 1.3mm, or 1.5mm, or 1.6mm, or 1.8mm, or 1.9mm, or 2mm, or other sizes within 1mm-2mm, which is not limited in the present application.

[0045] Compared with the related art, the gap distance between the light emitting assembly 30 and the optical film layer of the backlight module 100 needs to be reserved, the sum of the thickness of the sealing layer 40 and the size of the mixed light gap 80 is less than the preset distance, which can reduce the thickness of the backlight module 100 and improve the thinness performance of the backlight module 100. Moreover, compared with the related art, the 0 mixed light distance Mini-LED technology is realized by using 2-3 uniform light films, and the sealing layer 40 is arranged on the light emitting assembly 30, which can reduce the manufacturing cost of the backlight module 100, and the backlight module 100 can be applied to the 0 mixed light distance Mini-LED technology at a lower cost.

[0046] In the backlight module 100 provided by the application, the backlight module 100 includes the bottom plate 11 and the side plate 12 surrounding the bottom plate 11, the optical assembly 20 is fixed on the side plate 12, the light emitting assembly 30 is arranged on the bottom plate 11 and between the optical assembly 20 and the bottom plate 11, and the sealing layer 40 is arranged on the light emitting assembly 30 and between the optical assembly 20 and the light emitting assembly 30. When the backlight module 100 is in the first mode, the sealing layer 40 and the optical assembly 20 are arranged to form a mixed light gap 80, the light emitted by the light emitting assembly 30 enters the optical assembly 20 through the sealing layer 40 and the mixed light gap 80 in turn, and the sum of the thickness of the sealing layer 40 and the size of the mixed light gap 80 is less than a preset distance in the thickness direction of the backlight module 100. The light emitted by the light emitting assembly 30 enters the optical assembly 20 through the sealing layer 40 and the mixed light gap 80, the sealing layer 40 and the cavity gap can be used to homogenize the light emitted by the light emitting assembly 30, which is beneficial to further improve the uniformity of the light before entering the optical assembly 20 and further improve the overall light emitting brightness uniformity of the backlight module 100. Compared with the related art, the 0 mixed light distance Mini-LED technology is realized by using 2-3 uniform light films, and the sealing layer 40 and the mixed light gap 80 are arranged on the light emitting assembly 30, which can reduce the manufacturing cost of the backlight module 100, and the backlight module 100 can be applied to the 0 mixed light distance Mini-LED technology at a lower cost.

[0047] It should be noted that the backlight module 100 includes a second mode in addition to the first mode, and when the backlight module 100 is in the second mode, the sealing layer 40 and the optical assembly 20 abut and the light mixing gap 80 does not exist. In the embodiment, the second mode is an initial mode, and the first mode is a use mode, that is, only when the backlight module 100 enters the use mode, the sealing layer 40 forms the light mixing gap 80 with the optical assembly 20. How to make the backlight module 100 enter the first mode from the second mode will be described in detail below. When the backlight module 100 is in the second mode, the backlight module 100 can be conveniently carried (explained later), and it should be noted that in the embodiment, the backlight module 100 can also enter the second mode from the first mode, which should not be understood as a limitation of the present application.

[0048] Please refer to Figures 1 to 4 In some embodiments, the backlight module 100 further includes a telescopic layer 50, which is arranged between the light emitting assembly 30 and the bottom plate 11, and one end of the telescopic layer 50 is connected to the light emitting assembly 30 and the other end is connected to the bottom plate 11. When the backlight module 100 is in the second mode, the telescopic layer 50 is in an initial state, and the sealing layer 40 abuts the optical assembly 20. When the backlight module 100 is in the first mode, the telescopic layer 50 is in a contracted state, and the sealing layer 40 is at least partially spaced apart from the optical assembly 20 to form the light mixing gap 80.

[0049] Specifically, when the backlight module 100 enters the first mode from the second mode, the telescopic layer 50 changes from the initial state to the contracted state, and the telescopic layer 50 drives the light emitting assembly 30 and the sealing layer 40 to move in the direction of approaching the bottom plate 11, thereby making the sealing layer 40 on the light emitting assembly 30 form the light mixing gap 80 with the optical assembly 20, so that the light emitted by the light emitting assembly 30 can enter the optical assembly 20 in sequence through the sealing layer 40 and the light mixing gap 80.

[0050] In some embodiments, the telescopic layer 50 is arranged to form a first accommodating cavity 51, which is used to accommodate a preset liquid for conducting heat of the light emitting component 30 and reflecting light emitted by the light emitting component 30. In the present embodiment, the preset liquid is used to conduct heat emitted by the light emitting component 30 to the back plate 10, so as to improve heat dissipation effect of the backlight module 100, avoid the light emitting component 30 working in an environment with high temperature, and improve service life of the light emitting component 30. In addition, the preset liquid is white in color, and reflective particles can be filled in the preset liquid for emitting light emitted by the light emitting component 30, so as to improve light utilization rate of the backlight module 100.

[0051] In some embodiments, the light emitting component 30 comprises a lamp plate and a light emitting piece arranged on the lamp plate. The lamp plate is provided with a plurality of through holes 31, which are communicated with the first accommodating cavity 51. The sealing layer 40 is provided with a plurality of second accommodating cavities 41, which are arranged corresponding to the through holes 31 and communicated with the through holes 31. When the backlight module 100 enters the first mode from the second mode, the lamp plate moves towards the direction close to the bottom plate 11, the preset liquid in the first accommodating cavity 51 enters the second accommodating cavity 41 through the through hole 31, and the sealing layer 40 is provided with a plurality of convex structures 42 on the side close to the light emitting component 30.

[0052] When the backlight module 100 enters the first mode, the sealing layer 40 is provided with a plurality of convex structures 42 on the side close to the light emitting component 30, and the thickness of the convex structures 42 is thin. If the backlight module 100 is transported in the first mode, the convex structures 42 may rub against the optical component 20 and cause liquid leakage and other phenomena. Therefore, the backlight module 100 is usually transported in the second mode and fixed and worked in the first mode.

[0053] It should be noted that, in the present embodiment, the through holes 31 are arranged between four light emitting pieces. In other embodiments, the through holes 31 can also be arranged between two light emitting pieces, which is not limited in the present application.

[0054] Specifically, in some embodiments, the material of the stretchable layer 50 is a thermal shrinkable material. When the backlight module 100 is in the first mode, the light emitting assembly 30 works and dissipates heat to the stretchable layer 50, so that the stretchable layer 50 enters the contracted state. The material of the stretchable layer 50 is a thermal shrinkable material, which can be a reversible material, in other words. The backlight module 100 can also enter the second mode from the first mode, that is, when the light emitting assembly 30 does not dissipate heat to the stretchable layer 50, the stretchable layer 50 is stretched and enters the initial state from the contracted state, so as to drive the light emitting assembly 30 and the sealing layer 40 to move away from the bottom plate 11. The backlight module 100 can enter the second mode from the first mode, which facilitates the user to carry the backlight module 100 without damaging the backlight module 100. The thermal shrinkable material can also be an irreversible material, that is, the stretchable layer 50 cannot be stretched after being contracted after the backlight module 100 works for the first time, which is not limited in the present application.

[0055] In some embodiments, the material of the stretchable layer 50 can also be an electrostrictive material. When the backlight module 100 is in the first mode, the light emitting assembly 30 is electrically connected to the stretchable layer 50 and transmits an electrical signal to the stretchable layer 50, so that the stretchable layer 50 enters the contracted state. When the material of the stretchable layer 50 is an electrostrictive material, the backlight module 100 can enter the second mode from the first mode, that is, when the light emitting assembly 30 does not transmit an electrical signal to the stretchable layer 50, the stretchable layer 50 is stretched and enters the initial state from the contracted state, so as to drive the light emitting assembly 30 and the sealing layer 40 to move away from the bottom plate 11. The backlight module 100 can enter the second mode from the first mode, which facilitates the user to carry the backlight module 100 without damaging the backlight module 100.

[0056] In some embodiments, the backlight module 100 further comprises a limiting piece 60, which is arranged between the light emitting assembly 30 and the bottom plate 11. The limiting piece 60 is used to abut against the light emitting assembly 30 when the backlight module 100 is in the first mode, so as to limit the light emitting assembly 30 from continuing to move towards the bottom plate 11.

[0057] Specifically, in the embodiment, the telescopic layer 50 is a hollow structure, and the limiting member 60 is arranged in the hollow inner cavity of the telescopic layer 50, that is, when the telescopic layer 50 is contracted, the limiting member 60 can be used to abut against the light-emitting assembly 30 to limit the position of the light-emitting assembly 30. Further, in the embodiment, the side of the telescopic layer 50 facing the side plate 12 is also provided with a vent hole, that is, when the telescopic layer 50 is contracted, the air in the hollow inner cavity of the telescopic layer 50 is discharged from the vent hole, so that the telescopic layer 50 can be normally contracted. In the embodiment, the limiting member 60 is a metal limiting column.

[0058] In some embodiments, the backlight module 100 further comprises a plurality of elastic members 71 and a bearing substrate 72, the bearing substrate 72 is arranged on the bottom plate 11, the elastic members 71 are arranged between the light-emitting assembly 30 and the bearing substrate 72, and one end of the elastic members 71 is connected to the light-emitting assembly 30 and the other end is connected to the bearing substrate 72, when the backlight module 100 is in the second mode, the elastic members 71 are in an elastic tension state.

[0059] When the backlight module 100 enters the first mode, the telescopic layer is contracted, and the elastic members 71 can be used to provide a pulling force to the light-emitting assembly 30 to drive the light-emitting assembly 30 to move towards the direction close to the bottom plate 11, so as to improve the movement uniformity of the light-emitting assembly 30 and avoid that each area of the light-emitting assembly 30 is at different heights. Further, in the embodiment, the number and position of the elastic members 71 can be set according to the light-emitting assembly.

[0060] Optionally, in the embodiment, the elastic members 71 are springs, and in other embodiments, the elastic members 71 can also be elastic sheets or other elastic structures, which are not limited in the application.

[0061] In the embodiment, the material of the bearing substrate 72 is copper, and in other embodiments, the material of the bearing substrate 72 can also be aluminum or other metal materials, the elastic members 71 are respectively connected to the light-emitting assembly 30 and the bearing substrate 72, and the elastic members 71 can be used to conduct static electricity of the light-emitting assembly 30 to the copper substrate to realize the anti-static function of the light-emitting assembly 30. When the material of the back plate 10 is a metal material, the copper substrate can also ground the static electricity through the back plate 10, which is not limited in the application.

[0062] In some embodiments, the backlight module 100 further comprises a sealing valve 73 arranged in the through hole 31, the sealing valve 73 is used to isolate the second accommodating cavity 41 and the first accommodating cavity 51 when the backlight module 100 is in the second mode, so as to prevent the preset liquid in the first accommodating cavity 51 from entering the second accommodating cavity 41. It should be noted that in the present embodiment, the sealing valve 73 and the limiting piece 60 are both fixed on the bearing substrate 72, which should not be construed as a limitation of the present application.

[0063] In some embodiments, the backlight module 100 further comprises a plurality of light-reflecting layers 74 arranged in the second accommodating cavity 41 and facing the bottom plate 11, the light-reflecting layers 74 are used to reflect the light emitted by the light-emitting component 30.

[0064] The light-reflecting layers 74 are arranged corresponding to the protruding structure 42, and the light-reflecting layers 74 can be used to reflect the light emitted by the light-emitting component 30, so as to improve the light utilization rate of the backlight module 100.

[0065] The backlight module 100 further comprises a first adhesive arranged between the stretchable layer 50 and the light-emitting component 30, which is used to connect the stretchable layer 50 and the light-emitting component 30. The backlight module 100 further comprises a second adhesive arranged between the copper substrate and the bottom plate 11, which is used to connect the copper substrate and the bottom plate 11. Optionally, in the present embodiment, the second adhesive is conductive glue.

[0066] Please refer to Figure 5 The present application provides a display device 1000, which comprises a display panel 300, a middle frame 200 and a backlight module 100. The display panel 300 and the backlight module 100 are arranged in opposite intervals. The middle frame 200 surrounds the backlight module 100 and the display panel 300, and is connected to the backlight module 100 and the display panel 300 respectively.

[0067] The light emitted by the backlight module 100 passes through the display panel 300 and forms a display picture. The middle frame 200 is used to fix the display panel 300 and protect the display panel 300 from being bumped by external objects.

[0068] In the display device 1000 provided in the application, the optical assembly 20 is fixed on the side plate 12, the light emitting assembly 30 is arranged on the bottom plate 11 and between the optical assembly 20 and the bottom plate 11, and the sealing layer 40 is arranged on the light emitting assembly 30 and between the optical assembly 20 and the light emitting assembly 30. When the backlight module 100 is in the first mode, the sealing layer 40 is arranged to form a light mixing gap 80 with the optical assembly 20, the light emitted by the light emitting assembly 30 enters the optical assembly 20 through the sealing layer 40 and the light mixing gap 80 in sequence, and the sum of the thickness of the sealing layer 40 and the size of the light mixing gap 80 is less than a preset distance in the thickness direction of the backlight module 100. The light emitted by the light emitting assembly 30 enters the optical assembly 20 through the sealing layer 40 and the light mixing gap 80 in sequence, the sealing layer 40 and the cavity gap can be used to homogenize the light emitted by the light emitting assembly 30, which is conducive to further improving the uniformity of the light before entering the optical assembly 20 and further improving the overall uniformity of the luminous brightness of the display device 1000. Compared with the 0 light mixing distance Mini-LED technology using 2-3 light homogenizing films in the related art, the sealing layer 40 and the light mixing gap 80 are arranged only on the light emitting assembly 30 in the application, which can reduce the preparation cost of the display device 1000, so that the display device 1000 can apply the 0 light mixing distance Mini-LED technology at a lower cost.

[0069] In the present application, the phrase "embodiment" or "embodiments" means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it independent or alternative to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present application can be combined with other embodiments. In addition, it should be understood that the features, structures or characteristics described in the embodiments of the present application can be combined with each other without contradiction, to form another embodiment without departing from the spirit and scope of the present application.

[0070] The above is part of the embodiments of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered as the protection scope of the present application.

Claims

1. A backlight module, characterized in that, The backlight module comprises: a backboard comprising a bottom plate and a side plate surrounding the bottom plate; an optical assembly fixed on the side plate; a light-emitting assembly arranged on the bottom plate and between the optical assembly and the bottom plate; a sealing layer arranged on the light-emitting assembly and between the optical assembly and the light-emitting assembly, wherein when the backlight module is in a first mode, the sealing layer is spaced apart from the optical assembly to form a light mixing gap, light emitted by the light-emitting assembly enters the optical assembly in sequence through the sealing layer and the light mixing gap, and the sum of the thickness of the sealing layer and the size of the light mixing gap is less than a preset distance in the thickness direction of the backlight module; the backlight module further comprises a stretchable layer arranged between the light-emitting assembly and the bottom plate, one end of the stretchable layer being connected to the light-emitting assembly and the other end being connected to the bottom plate; when the backlight module is in a second mode, the stretchable layer is in an initial state, and the sealing layer abuts against the optical assembly; when the backlight module is in the first mode, the stretchable layer is in a contracted state, and the sealing layer is at least partially spaced apart from the optical assembly to form the light mixing gap. The material of the stretchable layer is heat-shrinkable material, and when the backlight module is in the first mode, the light-emitting assembly generates heat and transmits the heat to the stretchable layer to make the stretchable layer enter the contracted state; or the material of the stretchable layer is electrostrictive material, and when the backlight module is in the first mode, the light-emitting assembly is electrically connected to the stretchable layer and transmits an electrical signal to the stretchable layer to make the stretchable layer enter the contracted state.

2. The backlight module of claim 1, wherein, The backlight module further comprises a limiting piece arranged between the light-emitting assembly and the bottom plate, the limiting piece being used to abut against the light-emitting assembly when the backlight module is in the first mode to limit the light-emitting assembly from moving further towards the bottom plate.

3. The backlight module of claim 1, wherein, The backlight module further comprises a plurality of elastic pieces and a bearing substrate, the bearing substrate being arranged on the bottom plate, the elastic pieces being arranged between the light-emitting assembly and the bearing substrate, one end of each elastic piece being connected to the light-emitting assembly and the other end being connected to the bearing substrate, and the elastic pieces being in a stretched state when the backlight module is in the second mode.

4. The backlight module of claim 1, wherein, The stretchable layer forms a first accommodating cavity, and the first accommodating cavity can be used to accommodate a preset liquid, the preset liquid being used to conduct heat generated by the light-emitting assembly and reflect light emitted by the light-emitting assembly.

5. The backlight module of claim 1, wherein, The light-emitting assembly comprises a lamp plate and a light-emitting piece arranged on the lamp plate, a plurality of through holes are arranged on the lamp plate and communicate with the first accommodating cavity, and a plurality of second accommodating cavities are arranged in the sealing layer and correspond to the through holes.

6. The backlight module of claim 5, wherein, When the backlight module changes from the second mode to the first mode, the lamp plate moves towards the bottom plate, the preset liquid in the first accommodating cavity enters the second accommodating cavities through the through holes, and a plurality of protruding structures are formed on the side of the sealing layer facing the light-emitting assembly, the protruding structures corresponding to the second accommodating cavities. ​ 7. The backlight module of claim 6, wherein, The backlight module further comprises a sealing valve arranged in the through hole, and the sealing valve is used for isolating the second accommodating cavity and the first accommodating cavity when the backlight module is in the second mode.

8. The backlight module of claim 6, wherein, The backlight module further comprises a plurality of light reflection layers arranged in the second accommodating cavity and facing the bottom plate, and the light reflection layers are used for reflecting light emitted by the light emitting assembly.

9. A display device, characterized by comprising: The display panel and the backlight module are arranged in a relative spaced manner, the middle frame is arranged around the backlight module and the display panel, and is connected to the backlight module and the display panel respectively.

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