Display panel and display device

Abstract

The present application discloses a display panel and a display device, the display panel comprising: a substrate, the substrate comprising a display area and a non-display area; the display area comprising an aperture area, the aperture area comprising a first composite structure layer, the sidewalls of the first composite structure layer exposing a second metal layer located in the middle; a plurality of second composite structure layers provided in the non-display area, at least one of the second composite structure layers comprising at least one bump structure, the bump structure being formed by the second composite structure layer extending in a direction parallel to the substrate, the sidewalls of each bump structure exposing a fifth metal layer; the area of ​​the second metal layer exposed by the plurality of first composite structure layers being equal to the area of ​​the fifth metal layer exposed by the plurality of second composite structure layers. The display panel of the present application, by adding bump structures to the second composite structure layer in the non-display area, prevents the second composite structure layer from forming an I-shaped structure, reduces the risk of fracture of the sixth metal layer located at the top layer, and improves packaging quality and product quality.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] The display panel is a key structure for the display device to realize the display function. In order to facilitate the integration of functional devices such as cameras, earpieces and infrared sensors, openings are usually set on the display panel to integrate these functional devices. In related technologies, a barrier portion of a titanium-aluminum-titanium (Ti-Al-Ti) composite layer structure is usually used in the display panel to improve the packaging effect and reduce the intrusion of water and oxygen. Controlling the etching amount of the side-engraved aluminum layer is crucial to the packaging effect. Under the same developer concentration and time, the side etching depth of the area with a small exposed area is greater, while the side wall etching depth of the area with a large area is relatively small, eventually forming an I-shaped structure. The greater the side etching depth, the higher the risk of fracture of the top metal layer. If the side etching depth is too small, during the organic packaging process, CVD (Chemical Vapor Deposition) cannot effectively block water and oxygen, resulting in the risk of organic materials being corroded by water and oxygen, reducing the packaging effect. Summary of the Invention

[0003] The present application discloses a display panel and a display device to solve the problem of packaging effect of the display panel.

[0004] In a first aspect, the present application discloses a display panel, comprising:

[0005] a substrate, the substrate comprising a display area and a non-display area at least located on one side of the display area;

[0006] The display area includes an opening area, the opening area includes at least one first composite structure layer, each of the first composite structure layers includes a first metal layer, a second metal layer, and a third metal layer stacked sequentially from the substrate, and a sidewall of each first composite structure layer exposes the second metal layer;

[0007] The non-display area is provided with a plurality of second composite structural layers, each of the second composite structural layers having a fourth metal layer, a fifth metal layer, and a sixth metal layer stacked in sequence from the substrate; at least one of the second composite structural layers includes at least one bump structure, the bump structure being formed by extending the second composite structural layer in a direction parallel to the substrate, with a sidewall of each bump structure exposing the fifth metal layer;

[0008] The total area of ​​the second metal layer exposed by the plurality of first composite structural layers is equal to the total area of ​​the fifth metal layer exposed by the plurality of second composite structural layers.

[0009] In an exemplary embodiment, the sidewall of at least one of the second composite structural layers has at least one of the bump structures, and the total area of ​​the fifth metal layer exposed by each of the second composite structural layers is the sum of the area of ​​the fifth metal layer exposed by the sidewall of each of the bump structures and the area of ​​the fifth metal layer exposed by the sidewall of the second composite structural layer.

[0010] In an exemplary embodiment, a sidewall of at least one of the second composite structural layers includes a plurality of bump structures arranged at intervals.

[0011] In an exemplary embodiment, the non-display area is provided with a plurality of the second composite structure layers, and at least two of the second composite structure layers have different areas of the fifth metal layer exposed;

[0012] Optionally, at least two of the second composite structure layers have different numbers of the bump structures.

[0013] In an exemplary embodiment, the structure and size of each of the bump structures of at least one of the second composite structural layers are identical;

[0014] Optionally, the structure of each of the bump structures in at least one of the second composite structural layers includes a rectangular structure.

[0015] In an exemplary embodiment, when at least one of the second composite structural layers has a plurality of bump structures, the spacing between any two adjacent bump structures is the same.

[0016] In an exemplary embodiment, the display panel further includes an organic glue layer, wherein the organic glue layer covers a portion of a sidewall of each second composite structure layer, and the second composite structure layer exposes a sidewall having at least one of the bump structures.

[0017] In an exemplary embodiment, the display panel further includes an encapsulation layer, and the encapsulation layer covers surfaces of the first composite structure layer, the organic adhesive layer, and the plurality of second composite structure layers.

[0018] In an exemplary embodiment, at least one of the first metal layer, the third metal layer, the fourth metal layer, and the sixth metal layer is a titanium layer; and at least one of the second metal layer and the fifth metal layer is an aluminum layer.

[0019] In a second aspect, the present application discloses a display device, which includes the display panel as described in the first aspect.

[0020] In the display panel and display device provided by the present application, in the display panel, multiple first composite structure layers are arranged in the opening area of ​​the display area, and the sidewall of each first composite structure layer exposes the second metal layer located in the middle; multiple second composite structure layers are arranged in the non-display area, at least one second composite structure layer includes at least one bump structure, and the bump structure is formed by the second composite structure layer extending in a direction parallel to the substrate, and the sidewall of each bump structure exposes the fifth metal layer located in the middle; the total area of ​​the second metal layers exposed by the multiple first composite structure layers is equal to the total area of ​​the fifth metal layers exposed by the multiple second composite structure layers, so that after the multiple first composite structure layers and the multiple second composite structures are etched by the same side etching process, the etching amount of the second metal layer in the opening area is the same as the etching amount of the fifth metal layer in the non-display area, thereby avoiding the second composite structure layer in the non-display area from forming an I-shaped structure, reducing the risk of the third metal layer located on the top layer breaking and the risk of short circuit between lines caused by metal fracture, thereby improving packaging quality and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0022] Figure 1 This is a schematic diagram of the structure of the composite structure layer after etching in the related art.

[0023] Figure 2 The figure is a schematic structural diagram of a display panel exemplarily shown in an embodiment of the present application.

[0024] Figure 3 For the Figure 2 Schematic diagram of the cross-sectional structure of C-C'.

[0025] Figure 4 This is a top view of a second composite structure exemplarily shown in an embodiment of the present application.

[0026] Figure 5 This is a cross-sectional view of a second composite structure exemplarily shown in an embodiment of the present application.

[0027] Figure 6 The following is a schematic structural diagram of the second composite structure layer of another display panel according to an embodiment of the present application.

[0028] Figure 7 The following is a schematic structural diagram of the second composite structure layer of another display panel according to an embodiment of the present application.

[0029] Figure 8 The following is a schematic structural diagram of the second composite structure layer of another display panel according to an embodiment of the present application.

[0030] Figure 9 For the Figure 2 Schematic diagram of the cross-sectional structure along D-D'.

[0031] Figure 10 This is a schematic structural diagram of a non-display area of ​​another display panel exemplarily shown in an embodiment of the present application.

[0032] Figure 11 The following is a schematic structural diagram of another display panel according to an embodiment of the present application. DETAILED DESCRIPTION

[0033] The following will describe the technical solutions in the embodiments of this application in conjunction with the accompanying drawings. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0034] In the related art, a composite structure layer is usually used in the display panel, such as the barrier part of the titanium (Ti)-aluminum (Al)-titanium (Ti) composite structure layer TAT, to improve the packaging effect and reduce the intrusion of water and oxygen. When drilling the hole area in the display area, the aluminum (Al) needs to be side-etched. In the related art, a liquid chemical is used to side-etch Al, and the area of ​​the exposed Al on the TAT side wall in the non-display area is smaller than the exposed area of ​​the TAT in the hole area. Under the same developer concentration and time, the side etching depth of the area with a small exposed area is greater, and the side wall etching depth of the area with a large area is relatively smaller, so that the TAT in the non-display area is finally formed as follows. Figure 1 The I-shaped structure shown in the figure. The greater the side engraving depth, the higher the risk of the top Ti layer breaking. Metal peeling in the broken Ti layer can easily cause short circuits between circuits, affecting product packaging quality. If the side engraving depth is too small, the CVD process cannot effectively block water and oxygen during organic packaging, creating the risk of water and oxygen corrosion in the organic material, thus affecting the packaging effect.

[0035] As an optional implementation of the disclosure of this application, the embodiment of this application discloses a display panel, such as Figure 2 As shown, Figure 2 This is a schematic structural diagram of a display panel disclosed in an embodiment of the present application, the display panel comprising:

[0036] Substrate 100 is used to support other film layers. Substrate 100 can be formed of materials known in the art. In some embodiments, substrate 100 can be formed of glass, rigid plastic, or flexible plastic. In this embodiment, the material of substrate 100 is not limited and can be any flexible or rigid material, such as polyimide, glass, or ceramic. Exemplarily, substrate 100 is a glass substrate 100. In other embodiments, substrate 100 can also be a flexible polyimide (PI) substrate 100. The specific implementation in actual applications can be adjusted based on actual needs.

[0037] refer to Figure 2 As shown, the substrate 100 includes a display area AA, within which an aperture area B is disposed. The display area AA also includes a light-emitting device area (not shown). The light-emitting device area is used to form an array of light-emitting devices, which may be organic light-emitting devices (OLEDs). The light-emitting devices are used to emit light to display image information. Each light-emitting unit may include an OLED and a pixel circuit module for driving the OLED to emit light, as well as other optional modules known in the art.

[0038] refer to Figure 2 As shown, the opening area B can be confined within the display area AA. If formed in the light-emitting device area, the light-emitting device can completely surround the opening area B. For example, the opening area B can be close to the edge of the display area AA. The opening area B is used to set functional modules such as cameras and speakers. The opening area B corresponds to the opening of the display panel. The substrate 100 in this area and the film layer formed in this area will be removed later to form an opening that passes through the display panel (not shown in the figure). Functional devices such as cameras, earpieces and infrared sensors can be integrated in the opening or below the bottom of the display panel corresponding to the opening.

[0039] In this embodiment, there is no particular limitation on the shape of the opening, and it can be selected according to actual needs. In some embodiments, the opening can be square, circular, quasi-circular, or a combination thereof.

[0040] refer to Figure 3 As shown, multiple first composite structural layers 200 are disposed within the opening region B. Each first composite structural layer 200 may be a structure, such as a barrier, for enhancing the encapsulation effect of the opening region B. For example, each first composite structural layer 200 may be a three-layer structure, comprising a first metal layer 210, a second metal layer 220, and a third metal layer 230 stacked sequentially from the substrate 100. The sidewalls of each first composite structural layer 200 expose the second metal layer 220 located in the middle. The total area of ​​the second metal layer 220 exposed by the multiple first composite structural layers 200 may be recorded as the area of ​​the second metal layer 220 exposed in the opening region B.

[0041] refer to Figure 2 In this embodiment, each first composite structure layer 200 may be a titanium-aluminum-titanium metal layer. That is, the metal material of the first metal layer 210 and the third metal layer 230 may be titanium, and the metal material of the second metal layer 220 may be aluminum. In this embodiment, the total area of ​​the aluminum layer exposed by the plurality of first composite structure layers 200 is recorded as the area of ​​the aluminum layer exposed by the opening area B. In other exemplary structures, composite structures of other metal material layers may also be used.

[0042] refer to Figure 1 As shown, the substrate 100 may further include a non-display area NA disposed adjacent to at least one side of the display area AA. The non-display area NA may be disposed around the display area AA and may be considered a border area. Various driving elements known in the art (not shown) may be disposed in the non-display area NA. The driving elements may include, for example, a data driver for providing data signals to the device layer of the display panel, a gate driver for providing gate signals to the device layer of the display panel, and the like.

[0043] refer to Figure 3 As shown, a plurality of second composite structural layers 300 are provided in the non-display area NA. The second composite structural layers 300 can be provided at both ends of a side of the non-display area NA adjacent to the binding area, or the second composite structural layers 300 can be provided at a position adjacent to the binding area in the non-display area NA. Each second composite structural layer 300, for example, has a three-layer structure, and each second composite structural layer 300 includes a fourth metal layer 310, a fifth metal layer 320, and a sixth metal layer 330 stacked sequentially from the substrate 100. In this embodiment, each second composite structural layer 300 can also be a titanium-aluminum-titanium metal layer, that is, the metal material of the fourth metal layer 310 and the sixth metal layer 330 can be titanium, and the metal material of the fifth metal layer 320 can be aluminum.

[0044] like Figure 4 As shown, the at least one second composite structure layer 300 includes a body structure of the second composite structure layer and at least one bump structure 360 ​​. The bump structure 360 ​​is formed by extending the second composite structure layer 300 along a direction parallel to the substrate 100 .

[0045] Combine Figure 4 and Figure 5 As shown, because the bump structure 360 ​​protrudes from the main structure of the second composite structure layer 300, three side surfaces of the bump structure 360 ​​are exposed, and each side surface can expose a portion of the fifth metal layer 320. Compared to a composite structure without a bump structure, the second composite structure layer 300 in the embodiment of the present application exposes a larger area of ​​the sidewall of the second composite structure layer 300. Therefore, the design of the bump structure 360 ​​can increase the area of ​​the fifth metal layer 320 exposed by the second composite structure layer 300.

[0046] refer to Figure 4 As shown, for example, at least one bump structure 360 ​​is provided on one sidewall of the second composite structure layer 300, and the display panel further includes an organic glue layer 400. The organic glue layer 400 covers a portion of the sidewall of the second composite structure layer 300, and the sidewall of the second composite structure layer 300 having the at least one bump structure 360 ​​is exposed. Therefore, by adjusting the area of ​​the sidewall covered by the organic glue layer 400, the area of ​​the other portion of the sidewall exposed of the second composite structure layer 300 can be controlled to increase the exposed area of ​​the fifth metal layer 320 of the second composite structure layer 300. In addition, the organic glue layer 400 can also cover the top surface of the second composite structure layer 300, which can reduce the amount of reactants in the etching process, such as Ag+, that participate in the replacement reaction and are adsorbed on the surface, thereby preventing impurities from being adsorbed on the surface of the second composite structure layer 300.

[0047] refer to Figure 4 and Figure 5 For example, the area outside the bump structure 360 ​​in the sidewall is the other sidewall surface of the exposed second composite structure layer 300. Then, the total area of ​​the fifth metal layer 320 exposed by the second composite structure layer 300 is the sum of the area of ​​the fifth metal layer 320 exposed by the sidewall of each bump structure 360 ​​and the area of ​​the fifth metal layer 320 exposed by the sidewall of the second composite structure layer 300.

[0048] Specifically, for example, refer to Figure 4 and Figure 5 , the length of the second composite structure layer 300 is denoted as K, the thickness of the fifth metal layer 320 of the second composite structure layer 300 is denoted as p, the bump structure 360 ​​is, for example, a rectangular structure, the length protruding from the sidewall of the second composite structure layer 300 is denoted as d, and the width of the bump structure 360 ​​is denoted as b. Then, the area S1 of the fifth metal layer 320 exposed by the second composite structure layer 300, that is, the side engraved area of ​​the fifth metal layer 320, can be calculated as follows: S1=K*p+2d*p, where K=a+b+c. Compared to a composite structure layer without a bump structure, the product of twice the length d of the bump structure 360 ​​and the thickness p of the fifth metal layer 320 is the additional exposed area of ​​the fifth metal layer 320. That is, for a composite structure layer, the second composite structure layer 300 provided in the present application has a larger area of ​​the fifth metal layer 320 exposed than a composite structure layer without a bump structure.

[0049] The area of ​​the fifth metal layer 320 exposed by each second composite structure layer 300 can be calculated using the above method. In this embodiment, the area of ​​the fifth metal layer 320 exposed by each second composite structure layer 300 is added together to obtain the total area of ​​the fifth metal layer 320 exposed by the multiple second composite structure layers 300. The total area of ​​the second metal layer 220 exposed by the multiple first composite structure layers 200 can be made equal to the total area of ​​the fifth metal layer 320 exposed by the multiple second composite structure layers 300, so that after the multiple first composite structure layers 200 and the multiple second composite structures are etched through the same side etching process, the etching amount of the second metal layer 220 in the opening area B is the same as the etching amount of the fifth metal layer 320 in the non-display area NA.

[0050] In the embodiment of the present application, taking the example that both the first composite structure layer 200 and the second composite structure layer 300 are titanium-aluminum-titanium metal layers, by adding a bump structure 360 ​​to each second composite structure layer 300 in the non-display area NA, the area of ​​the aluminum layer exposed by each second composite structure layer 300 in the non-display area NA is increased, so that the total area of ​​the aluminum layer exposed by the multiple second composite structure layers 300 in the non-display area NA is equal to the total area of ​​the aluminum layer exposed by the multiple first composite structure layers 200 in the opening area B, so that the aluminum layer in the non-display area NA and the aluminum layer in the opening area B form the same side etching amount after being etched by the same side etching process, thereby avoiding the second composite structure layer 300 in the non-display area NA from forming an I-shaped structure, reducing the risk of fracture of the titanium layer on the top layer and the risk of metal fracture causing short circuit between lines, thereby improving packaging quality and product quality.

[0051] As an optional implementation of the disclosure of this application, the embodiment of this application discloses a structural diagram of another display panel, such as Figure 6 As shown, Figure 6 This is a schematic structural diagram of the second composite structural layer in another display panel disclosed in an embodiment of the present application. The structure of the display panel in this embodiment is basically the same as the structure of the display panel provided in the above embodiment. The main difference is that one side wall of the second composite structural layer 300 in this embodiment includes a plurality of spaced-apart bump structures 360.

[0052] Specifically, refer to Figure 6 As shown, in this embodiment, a plurality of bump structures 360 are provided on a side wall of the second composite structure layer 300. The plurality of bump structures 360 can be distributed on a side wall of the second composite structure layer 300 in a uniformly spaced arrangement so that the distance between two adjacent bump structures 360 is equal, which is conducive to shortening the patterned support.

[0053] refer to Figure 6In this embodiment, five bump structures 360 are shown as an example. Each bump structure 360 ​​is a rectangular structure, and the bump structures 360 are of the same size, so that the length of each bump structure 360 ​​protruding from the side wall of the second composite structure layer 300 can be kept consistent.

[0054] refer to Figure 5 and Figure 6 For example, assuming the length of second composite structure layer 300 is K, the thickness of fifth metal layer 320 is p, and the length of bump structure 360 ​​is d, the area S2 of fifth metal layer 320 exposed by second composite structure layer 300 is: S2 = K*P + 5*2*d*p. It can be seen that, compared to a composite structure layer without a bump structure, the product of 10 times the length d of bump structure 360 ​​and the thickness p of fifth metal layer 320 is the additional area of ​​fifth metal layer 320 exposed. It can be seen that the setting of the length of the bump structure 360 ​​protruding from the side wall of the second composite structure layer 300 has an impact on the area of ​​the fifth metal layer 320 exposed by the second composite structure layer 300, because the length of the bump structure 360 ​​in each second composite structure layer 300 can be selected according to the total area of ​​the second metal layer 220 exposed by the multiple first composite structure layers 200 in the opening area and the regional space of the non-display area to increase the area of ​​the fifth metal layer 320 exposed by each second composite structure layer 300.

[0055] For example, refer to Figure 7 As shown, when a bump structure 360 ​​is provided on one sidewall of the second composite structure layer 300, the length of the bump structure 360 ​​protruding from the sidewall of the second composite structure layer 300 can be lengthened. The length of the bump structure 360 ​​of the second composite layer structure is D. Assuming Figure 7 The length of the second composite structure layer 300 is Figure 4 The length of the second composite structure layer is consistent, Figure 7 The width of the bump structure 360 ​​in Figure 4 The width of the bump structure 360 ​​is consistent, Figure 7 The length D of the bump structure 360 ​​is greater than Figure 4 The length d of the bump structure 360 ​​in FIG. 3 is d, and when the thickness of the fifth metal layer 320 is p, then Figure 7 The area ratio of the fifth metal layer 320 exposed by the bump structure 360 ​​is Figure 4 The exposed area of ​​the fifth metal layer 320 of the bump structure 360 ​​is larger than Δs, and Δs=2*(Dd)*p.

[0056] refer to Figure 8When multiple bump structures 360 are disposed on a sidewall of the second composite structure layer 300, the lengths of the multiple bump structures 360 may be the same or different. For example, the length of each bump structure 360 ​​in the second composite structure layer 300 is D, which can further increase the area of ​​the fifth metal layer 320 exposed by the second composite structure layer 300. Therefore, by adjusting the length of each bump structure 360, the area of ​​the fifth metal layer 320 exposed by each second composite structure layer 300 can be adjusted.

[0057] refer to Figure 3 and Figure 8 In addition, the setting of the number of bump structures 360 also affects the area of ​​the fifth metal layer 320 exposed by the second composite structure layer 300, because the number and layout of the bump structures 360 in each second composite structure layer 300 can be set according to the area of ​​the second metal layer 220 exposed by the first composite structure layer 200 in the opening area B to increase the area of ​​the fifth metal layer 320 exposed by each second composite structure layer 300, thereby increasing the total area of ​​the fifth metal layer 320 exposed in the non-display area NA.

[0058] like Figure 9 As shown, Figure 9 This is a schematic diagram of the structure of another display panel disclosed in an embodiment of the present application. The structure of the display panel in this embodiment is basically the same as that of the display panel provided in the above embodiment. The main difference is that Figure 9 and Figure 10 In this embodiment, at least one bump structure 360 ​​is provided on a sidewall of each second composite structure layer 300 in the non-display area NA, so that the areas of the fifth metal layer 320 exposed by at least two second composite structure layers 300 are different.

[0059] refer to Figure 3 and Figure 10 As shown, exemplarily, four second composite structure layers 300 are provided in the non-display area NA. Figure 9 As shown, there is a preset interval between the four second composite structure layers 300 in the non-display area NA, so that the multiple second composite structure layers 300 are distributed at different positions in the non-display area NA, and an organic glue layer is provided on the surface of the multiple second composite structure layers 300. The organic glue layer covers the top surface and part of the side walls of the multiple second composite structure layers 300, and the side wall of each second composite structure layer 300 with the bump structure 360 ​​is exposed.

[0060] like Figure 3 and Figure 10As shown, a different number of bump structures 360 are provided on the side walls of each second composite structure layer 300, so that the area of ​​the side walls of the fifth metal layer 320 exposed by each second composite structure layer 300 is different, so as to adjust the area of ​​the fifth metal layer 320 exposed in multiple regions of the non-display area NA, thereby increasing the exposed area of ​​the fifth metal layer 320 in the non-display area NA and slowing down the overall etching amount of the fifth metal layer 320 in the non-display area NA.

[0061] refer to Figure 10 As shown, the structure and size of each bump structure 360 ​​are the same, and the bump structures 360 are all rectangular structures. In other embodiments, the shape of the bump structure 360 ​​can also be semicircular, trapezoidal or other structures, which is not specifically limited here.

[0062] refer to Figure 3 and Figure 10 In this embodiment, different numbers of bump structures 360 can be provided on the plurality of second composite structural layers 300 in the non-display area NA to increase the area of ​​the fifth metal layer 320 exposed by the second composite structural layer 300 in the non-display area NA, thereby reducing the overall etching amount of the fifth metal layer 320. After the side etching process, the structure of the first composite structural layer 200 in the display area AA and the second composite structural layer 300 in the non-display area NA is as follows: Figure 11 As shown, the etching amounts of the second metal layer 220 of the first composite structure layer 200 and the fifth metal layer 320 of the second composite structure layer 300 are controlled within the same range.

[0063] like Figure 11 As shown, Figure 11This is a schematic diagram of the structure of another display panel disclosed in an embodiment of the present application. The structure of the display panel in this embodiment is substantially the same as that of the display panel provided in the above embodiment, with the primary difference being that the display panel in this embodiment further includes an encapsulation layer, which covers the surfaces of the first composite structural layer 200, the organic adhesive layer 400, and the second composite structural layer 300. In this embodiment, an encapsulation layer is formed in the display area AA and the non-display area NA to encapsulate the entire display panel. Because the side engraving areas of the second metal layer 220 of the first composite structural layer 200 in the display area AA and the fifth metal layer 320 of the second composite structural layer 300 in the non-display area NA are equal, the etching amount of the second metal layer 220 of the first composite structural layer 200 in the display area AA and the fifth metal layer 320 of the second composite structural layer 300 in the non-display area NA can be effectively controlled within a reasonable range. Therefore, during the organic encapsulation process, the CVD (Chemical Vapor Deposition) process can effectively provide a water and oxygen barrier, reducing the risk of water and oxygen corrosion of the organic material, thereby improving the encapsulation effect and product quality.

[0064] As an optional implementation of the disclosure of this application, an embodiment of this application discloses a display device, which includes the display panel provided by the above embodiment, wherein the display panel is referenced Figure 11 , a plurality of first composite structure layers 200 are arranged in the opening area B of the display area AA, and the sidewall of each first composite structure layer 200 exposes the second metal layer 220 located in the middle; a plurality of second composite structure layers 300 are arranged in the non-display area NA, and each second composite structure layer 300 includes at least one bump structure 360, and the bump structure 360 ​​is formed by the second composite structure layer 300 extending in a direction parallel to the substrate 100, and the sidewall of each bump structure 360 ​​exposes the fifth metal layer 320 located in the middle; the total exposed second metal layer 220 of the plurality of first composite structure layers 200 is The area of ​​the fifth metal layer 320 exposed by the multiple second composite structure layers 300 is equal to the total area of ​​the fifth metal layer 320, so that after the multiple first composite structure layers 200 and the multiple second composite structure layers 300 are etched by the same side etching process, the etching amount of the second metal layer 220 in the opening area B is the same as the etching amount of the fifth metal layer 320 in the non-display area NA, thereby avoiding the second composite structure layer 300 in the non-display area NA from forming an I-shaped structure, reducing the risk of the sixth metal layer 330 located on the top layer being broken and the risk of short circuits between lines caused by metal fracture problems, thereby improving packaging quality and product quality.

[0065] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The above embodiments merely represent several implementation methods of this specification. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of this specification, and these modifications and improvements fall within the scope of protection of this specification. Therefore, the scope of protection of the patent in this specification shall be based on the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: a substrate, the substrate comprising a display area and a non-display area at least located on one side of the display area; The display area includes an opening area, the opening area includes at least one first composite structure layer, each of the first composite structure layers includes a first metal layer, a second metal layer, and a third metal layer stacked sequentially from the substrate, and a sidewall of each first composite structure layer exposes the second metal layer; The non-display area is provided with a plurality of second composite structural layers, each of the second composite structural layers having a fourth metal layer, a fifth metal layer, and a sixth metal layer stacked in sequence from the substrate; at least one of the second composite structural layers includes at least one bump structure, the bump structure being formed by extending the second composite structural layer in a direction parallel to the substrate, with a sidewall of each bump structure exposing the fifth metal layer; The total area of ​​the second metal layer exposed by the plurality of first composite structural layers is equal to the total area of ​​the fifth metal layer exposed by the plurality of second composite structural layers.

2. The display panel according to claim 1, wherein: The sidewall of each of the second composite structural layers has at least one of the bump structures, and the total area of ​​the fifth metal layer exposed by each of the second composite structural layers is the sum of the area of ​​the fifth metal layer exposed by the sidewall of each of the bump structures and the area of ​​the fifth metal layer exposed by the sidewall of the second composite structural layer.

3. The display panel according to claim 2, wherein: The sidewall of at least one of the second composite structure layers includes a plurality of bump structures arranged at intervals.

4. The display panel according to claim 3, wherein: The non-display area is provided with a plurality of second composite structural layers, and at least two of the second composite structural layers have different areas of the fifth metal layer exposed; Optionally, at least two of the second composite structure layers have different numbers of the bump structures.

5. The display panel according to claim 3, wherein: The structure and size of each of the bump structures of at least one of the second composite structure layers are identical; Optionally, the structure of each of the bump structures in at least one of the second composite structural layers includes a rectangular structure.

6. The display panel according to claim 5, wherein: When at least one of the second composite structural layers has a plurality of bump structures, the spacing between any two adjacent bump structures is the same.

7. The display panel according to claim 1, wherein: The display panel further includes an organic glue layer, wherein the organic glue layer covers a portion of a side wall of each second composite structure layer, and the second composite structure layer exposes a side wall having at least one of the bump structures.

8. The display panel according to claim 7, wherein: The display panel further includes an encapsulation layer, which covers surfaces of the first composite structure layer, the organic adhesive layer, and the plurality of second composite structure layers.

9. The display panel according to claim 1, wherein: At least one of the first metal layer, the third metal layer, the fourth metal layer, and the sixth metal layer is a titanium layer; and at least one of the second metal layer and the fifth metal layer is an aluminum layer.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 9.

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