Display module and display device

Abstract

A display module includes a first adhesive layer and an electromagnetic shielding layer, the electromagnetic shielding layer is arranged on a side of a chip away from an array substrate, and the first adhesive layer extends from between a display layer group and a cover plate to a side of the electromagnetic shielding layer away from the array substrate, so that the width of the first adhesive layer beyond the visual area is large enough to avoid bubbles from the first adhesive layer, thereby ensuring the display effect and appearance of the display module. A display device including the above display module is also provided.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] To increase screen-to-body ratio and provide a better user experience, a narrow bezel effect is typically achieved by reducing the width of the bottom bezel of the display device.

[0003] To avoid interference between the first adhesive layer and the electromagnetic shielding layer on the chip, the width of the first adhesive layer extending beyond the visible area needs to be reduced. This can easily lead to air bubbles forming in the first adhesive layer, affecting the display effect and appearance of the display module.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to overcome the problem that reducing the width of the first adhesive layer beyond the visible area can easily lead to air bubbles in the first adhesive layer, and to provide a display module and display device.

[0006] According to one aspect of this disclosure, a display module is provided, including an array substrate, a display layer group, a cover plate, a chip, an electromagnetic shielding layer, and a first adhesive layer. The display layer group is disposed on one side of the array substrate; the cover plate is disposed on the side of the display layer group away from the array substrate; the chip is disposed on one side of the array substrate and is spaced apart from the display layer group along a first direction; the electromagnetic shielding layer is disposed on the side of the chip away from the array substrate; the first adhesive layer is disposed between the display layer group and the cover plate, and the first adhesive layer extends to overlap the side of the electromagnetic shielding layer away from the array substrate.

[0007] In one embodiment of this disclosure, the display layer assembly includes a color filter substrate and a first polarizer. The color filter substrate is located on one side of the array substrate, and the first polarizer is disposed on the side of the color filter substrate away from the array substrate. A first adhesive layer is disposed on the side of the first polarizer away from the array substrate, and the first adhesive layer is in direct contact with the cover plate. The side of the first polarizer away from the array substrate is lower than the side of the electromagnetic shielding layer away from the array substrate, and the height difference between the side of the first polarizer away from the array substrate and the side of the electromagnetic shielding layer away from the array substrate is less than 23.6 μm.

[0008] In one embodiment of this disclosure, the display module has a display area, and the distance between the edge of the display area and the edge of the array substrate along a first direction is greater than 2 mm and less than 2.6 mm.

[0009] In one embodiment of this disclosure, the distance between the first polarizer and the edge of the display area along the first direction is 0.3-0.6 mm, and the distance between the first polarizer and the edge of the color filter substrate along the first direction is 0.035-0.335 mm.

[0010] In one embodiment of this disclosure, the display module further includes a second polarizer, which is disposed on the side of the array substrate away from the color filter substrate. The distance between the second polarizer and the edge of the display area along the first direction is 0.31-0.61 mm, and the distance between the second polarizer and the edge of the color filter substrate along the first direction is 0.0245-0.3245 mm.

[0011] In one embodiment of this disclosure, the distance between the second polarizer and the chip along the first direction is greater than or equal to 0.3 mm.

[0012] In one embodiment of this disclosure, the display module further includes a first conductive adhesive layer disposed between the chip and the array substrate. The display module also includes a second conductive adhesive layer and a flexible circuit board. The second conductive adhesive layer is disposed between the flexible circuit board and the array substrate. The second conductive adhesive layer and the first conductive adhesive layer overlap each other along a first direction, and the overlap width between the second conductive adhesive layer and the first conductive adhesive layer is 0.03-0.1 mm.

[0013] In one embodiment of this disclosure, the orthographic projection of the chip on the array substrate is located within the orthographic projection of the first conductive adhesive layer on the array substrate. The distance between the edge of the first conductive adhesive layer and the edge of the chip is 1-1.2 mm. The edge of the second conductive adhesive layer is closer to the chip than the edge of the flexible circuit board. The distance between the edge of the second conductive adhesive layer and the edge of the flexible circuit board is 0.4-0.6 mm.

[0014] In one embodiment of this disclosure, the display module further includes an insulating layer and a protective layer, wherein the protective layer is disposed between the chip and the electromagnetic shielding layer, and the insulating layer is disposed between the protective layer and the electromagnetic shielding layer.

[0015] According to another aspect of this disclosure, a display device is provided, including the display module provided in one aspect of this disclosure.

[0016] The display module disclosed herein includes a first adhesive layer and an electromagnetic shielding layer. The electromagnetic shielding layer is disposed on the side of the chip away from the array substrate. The first adhesive layer extends from between the display layer assembly and the cover plate to overlap the electromagnetic shielding layer on the side away from the array substrate, so that the width of the first adhesive layer beyond the visible area is large enough to avoid the formation of air bubbles in the first adhesive layer, thereby ensuring the display effect and appearance of the display module.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0019] Figure 1 This is a plan view of the display module involved in the embodiments of the present disclosure when the bottom bezel of the display device is relatively wide.

[0020] Figure 2 This is a cross-sectional schematic diagram of the display module involved in the embodiments of the present disclosure when the bottom bezel of the display device is relatively wide.

[0021] Figure 3 This is a planar schematic diagram of the lower border of the display module involved in the embodiments of this disclosure.

[0022] Figure 4 This is a cross-sectional schematic diagram of a display module according to an embodiment of the present disclosure when the distance between the edge of the chip and the edge of the color filter substrate is compressed.

[0023] Figure 5 A diagram showing the positional relationship between the support portion and the second polarizer in this embodiment of the present disclosure when bonding the chip.

[0024] Figure 6 This is a schematic diagram illustrating the state when a chip is pressed onto the first conductive adhesive by a pressure head, according to an embodiment of this disclosure.

[0025] Figure 7 This is a plan view of the display module according to an embodiment of the present disclosure, where the first adhesive layer extends to directly overlap the electromagnetic shielding layer on the side away from the array substrate.

[0026] Figure 8 The first adhesive layer extends to the side of the electromagnetic shielding layer away from the array substrate, and air bubbles are generated when the first adhesive layer is squeezed. This is a cross-sectional schematic diagram of the display module involved in the embodiments of the present disclosure.

[0027] Figure 9 This is a cross-sectional schematic diagram of the display module according to an embodiment of the present disclosure, where the first adhesive layer overcomes the height difference between the side of the electromagnetic shielding layer away from the array substrate and the side of the first polarizer away from the array substrate through its own flow.

[0028] In the figure: 1-array substrate, 2-color filter substrate, 3-first polarizer, 4-second polarizer, 5-first adhesive layer, 6-chip, 7-electromagnetic shielding layer, 8-insulating layer, 9-protective layer, 10-cover plate, 11-flexible circuit board, 12-first conductive adhesive layer, 13-second conductive adhesive layer, 14-support part, 15-pressure head, 16-buffer part, 17-bubble. Detailed Implementation

[0029] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0030] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0031] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0032] like Figure 1 and Figure 2 As shown, the display module may include an array substrate 1 and a display layer assembly. The display layer assembly may include a color filter substrate 2 and a first polarizer 3. The color filter substrate 2 is disposed on the driving side of the array substrate 1, and the first polarizer 3 is disposed on the side of the color filter substrate 2 away from the array substrate 1. The display module may also include a second polarizer 4 and a first adhesive layer 5. The second polarizer 4 is disposed on the side of the array substrate 1 away from the color filter substrate 2. The display module may also include a first adhesive layer 5 and a cover plate 10. The first adhesive layer 5 is disposed on the side of the first polarizer 3 away from the array substrate 1, and the cover plate 10 is disposed on the side of the first adhesive layer 5 away from the array substrate 1.

[0033] The display module has a display area AA, and the cover plate 10 has a viewable area VA. The edge of the viewable area VA is located outside the display area AA along a first direction. The edges of the first polarizer 3 and the second polarizer 4 are located along the first direction on the side of the viewable area VA away from the edge of the display area AA. The edge of the color filter is located along the first direction on the side of the first polarizer 3 away from the edge of the display area AA. To avoid air bubbles in the first adhesive layer 5, it needs to extend at least 0.45 mm beyond the edge of the viewable area VA of the cover plate 10.

[0034] The display module may further include a first conductive adhesive layer 12, a chip 6, a protective layer 9, an insulating layer 8, and an electromagnetic shielding layer 7. The first conductive adhesive layer 12 is disposed on one side of the array substrate 1 and is spaced apart from the color filter substrate 2 along a first direction. The chip 6 is disposed on the side of the first conductive adhesive layer 12 away from the array substrate 1, and the orthographic projection of the chip 6 on the array substrate 1 lies within the orthographic projection of the first conductive adhesive layer 12 on the array substrate 1. The protective layer 9 is disposed on the side of the chip 6 away from the array substrate 1. It should be noted that the protective layer 9 is made of a fluorinated agent and is usually coated on the bonding area of ​​the array substrate 1, but may also be coated on the chip 6. The protective layer 9 can prevent the lines on the bonding area of ​​the array substrate 1 from being corroded, that is, prevent the lines of the array substrate 1 exposed outside the color filter substrate 2 from being corroded. The insulating layer 8 is disposed on the side of the protective layer 9 away from the array substrate 1, and the electromagnetic shielding layer 7 is disposed on the side of the insulating layer 8 away from the array substrate 1. The display module further includes a second conductive adhesive layer 13 and a flexible circuit board 11. The second conductive adhesive layer 13 is disposed in the bonding area of ​​the array substrate 1, and the flexible circuit board 11 is bonded to the side of the second conductive adhesive layer 13 away from the array substrate 1.

[0035] To ensure that the electromagnetic shielding layer 7 covers the chip 6, the edge of the electromagnetic shielding layer 7 needs to extend at least 0.1 mm beyond the edge of the chip 6. Figure 1 and Figure 2 The bezel of the display module is large enough to prevent the first adhesive layer 5 from overlapping with the electromagnetic shielding layer 7.

[0036] To increase screen-to-body ratio and provide a better user experience, narrow bezel displays are typically achieved by reducing the width of the bottom bezel. To achieve this, the distance between the edge of the color filter substrate 2 and the edge of the display area AA, as well as the distance between the edge of the color filter substrate 2 and the edge of the chip 6, is usually reduced. However, this smaller distance between the edges of the color filter substrate 2 and the chip 6 can cause interference between the first adhesive layer 5 and the electromagnetic shielding layer 7. To avoid this interference, the width of the first adhesive layer 5 extending beyond the visible area VA needs to be reduced to less than 0.45mm. However, this can easily lead to air bubbles forming in the first adhesive layer 5.

[0037] Based on this, the present disclosure provides a display module. For example... Figures 3 to 9 As shown, the display module includes an array substrate 1, a display layer group, a cover plate 10, a chip 6, an electromagnetic shielding layer 7, and a first adhesive layer 5. The display layer group is disposed on one side of the array substrate 1; the cover plate 10 is disposed on the side of the display layer group away from the array substrate 1; the chip 6 is disposed on one side of the array substrate 1 and is spaced apart from the display layer group along a first direction; the electromagnetic shielding layer 7 is disposed on the side of the chip 6 away from the array substrate 1; the first adhesive layer 5 is disposed between the display layer group and the cover plate 10, and the first adhesive layer 5 extends to overlap the side of the electromagnetic shielding layer 7 away from the array substrate 1.

[0038] The electromagnetic shielding layer 7 is located on the side of the chip 6 away from the array substrate 1. The first adhesive layer 5 extends from between the display layer group and the cover plate 10 to overlap the electromagnetic shielding layer 7 on the side away from the array substrate 1, so that the width of the first adhesive layer 5 beyond the visible area VA is large enough to avoid the formation of air bubbles in the first adhesive layer 5, thereby ensuring the display effect and appearance of the display module.

[0039] The display module involved in the embodiments of this disclosure will be described in detail below with reference to specific examples.

[0040] like Figure 3 As shown, the width of the lower bezel of the display device before adjustment is 2.6mm, and the width d of the lower bezel of the display device after adjustment is greater than 2mm and less than 2.6mm, that is, the distance between the edge of the display area AA and the edge of the array substrate 1 along the first direction is greater than 2mm and less than 2.6mm. Specifically, the width d of the lower bezel of the display device after adjustment can be 2.35mm. Before and after adjustment, the distance d1 between the edge of the flexible circuit board 11 and the edge of the array substrate 1 remains unchanged at 0.07 mm. Before and after adjustment, the width d2 of the flexible circuit board 11 along the first direction remains unchanged at 0.3 mm. Before adjustment, the distance d3 between the edge of the chip 6 and the edge of the flexible circuit board 11 is 0.2 mm. After adjustment, the distance d3 between the edge of the chip 6 and the edge of the flexible circuit board 11 is 0.2095 mm. Before adjustment, the width d4 of the chip 6 along the first direction is 0.9 mm. After adjustment, the width d4 of the chip 6 along the first direction is 0.91 mm. Before adjustment, the distance d5 between the edge of the chip 6 and the edge of the color filter substrate 2 is 0.295 mm. After adjustment, the distance d5 between the edge of the chip 6 and the edge of the color filter substrate 2 is 0.2255 mm. Before adjustment, the distance d6 between the edge of the color filter substrate 2 and the edge of the display area AA is 0.835 mm. After adjustment, the distance d6 between the edge of the color filter substrate 2 and the edge of the display area AA is 0.635 mm.

[0041] It is understandable that the reduction in the bottom bezel of the display device is mainly achieved by compressing the distance between the edge of the color filter substrate 2 and the edge of the display area AA, as well as the distance between the edge of the chip 6 and the edge of the color filter substrate 2. Figure 4 As shown, the first polarizer 3 and the second polarizer 4 are located between the edge of the display area AA and the edge of the chip 6. If the edge of the first polarizer 3 and the edge of the second polarizer 4 are too close to the display area AA, moisture or other substances may seep in, causing a reaction inside the first polarizer 3 and the second polarizer 4, resulting in local discoloration of the display area AA. If they are too close to the chip 6, the heat may be conducted to the first polarizer 3 and the second polarizer 4 when the chip 6 is bonded, causing the first polarizer 3 and the second polarizer 4 to be burned.

[0042] To reduce the risk of burns to the first polarizer 3 and the second polarizer 4, the distance between the edge of the first polarizer 3 and the edge of the display area AA is 0.45 mm, therefore the distance between the edge of the first polarizer 3 and the edge of the color filter substrate 2 is 0.185 mm. Figure 5 As shown, it is also necessary to consider that when bonding chip 6, the support portion 14 and the second polarizer 4 must not interfere with each other. The distance between the edge of chip 6 and the edge of the second polarizer 4 must be greater than or equal to 0.3mm. It should be noted that when manufacturing the display module, the first polarizer 3 and the second polarizer 4 are attached first, and then chip 6 is bonded. When bonding chip 6, the support portion 14 is used to support the array substrate 1.

[0043] When bonding chip 6, a tolerance of ±0.1mm is considered. The distance between the edge of the second polarizer 4 and the edge of chip 6 is 0.4mm. The accuracy of the polarizer bonding equipment is ±0.05mm. The width tolerance of the second polarizer 4 along the first direction is ±0.06mm. The panel's shape tolerance is ±0.1mm. The cumulative tolerance of the distance between the edge of the second polarizer 4 and the edge of chip 6 is... The distance between the edge of the second polarizer 4 and the edge of the display area AA is 0.4605mm, and the distance between the edge of the second polarizer 4 and the edge of the color filter substrate 2 is 0.1745mm.

[0044] The distance between the edge of the first polarizer 3 and the edge of the display area AA is 0.45mm, the distance between the edge of the first polarizer 3 and the edge of the color filter substrate 2 is 0.185mm, the distance between the edge of the second polarizer 4 and the edge of the display area AA is 0.4605mm, the distance between the edge of the second polarizer 4 and the edge of the color filter substrate 2 is 0.1745mm, and the attachment tolerance of the first polarizer 3 and the second polarizer 4 is ±0.15mm. Under the conditions that the actual temperature of the first conductive adhesive layer 12 is 145℃ and there may be a temperature fluctuation of ±5℃, and the actual temperature of the second conductive adhesive layer 13 is 175℃ and there may be a temperature fluctuation of ±5℃, the problem of burns on the first polarizer 3 and the second polarizer 4 is verified.

[0045] When the distance between the edge of the first polarizer 3 and the edge of the color filter substrate 2 is 0.035mm, there is no burn problem when the actual temperature of the first conductive adhesive layer 12 is 140℃, 145℃, and 150℃. When the distance between the edge of the first polarizer 3 and the edge of the color filter substrate 2 is 0.185mm, there is no burn problem when the actual temperature of the first conductive adhesive layer 12 is 140℃, 145℃, and 150℃. When the distance between the edge of the first polarizer 3 and the edge of the color filter substrate 2 is 0.335mm, there is no burn problem when the actual temperature of the first conductive adhesive layer 12 is 140℃, 145℃, and 150℃.

[0046] When the distance between the edge of the second polarizer 4 and the edge of the color filter substrate 2 is 0.0245 mm, there is no burn problem when the actual temperature of the second conductive adhesive layer 13 is 170℃, 175℃, and 180℃. When the distance between the edge of the second polarizer 4 and the edge of the color filter substrate 2 is 0.1745 mm, there is no burn problem when the actual temperature of the second conductive adhesive layer 13 is 170℃, 175℃, and 180℃. When the distance between the edge of the second polarizer 4 and the edge of the color filter substrate 2 is 0.3245 mm, there is no burn problem when the actual temperature of the second conductive adhesive layer 13 is 170℃, 175℃, and 180℃.

[0047] The distance between the first polarizer 3 and the edge of the display area AA along the first direction is 0.3-0.6 mm, and the distance between the first polarizer 3 and the edge of the color filter substrate 2 along the first direction is 0.035-0.335 mm.

[0048] Therefore, the distance between the first polarizer 3 and the edge of the display area AA along the first direction is 0.3-0.6 mm, and the distance between the first polarizer 3 and the edge of the color filter substrate 2 along the first direction is 0.035-0.335 mm. The distance between the second polarizer 4 and the edge of the display area AA along the first direction is 0.31-0.61 mm, and the distance between the second polarizer 4 and the edge of the color filter substrate 2 along the first direction is 0.0245-0.3245 mm.

[0049] like Figure 6 As shown, during bonding, the chip 6 is pressed firmly onto the first conductive adhesive using the pressure head 15. The distance between the edge of the color filter substrate 2 and the edge of the chip 6 is 0.2255 mm, and the risk of interference between the chip 6 and the color filter substrate 2 during bonding needs to be considered. To prevent the pressure head 15 from damaging the chip 6, a buffer portion 16 is wrapped around the outside of the pressure head 15. During chip bonding, it is necessary to ensure that the buffer portion 16 does not press against the color filter substrate 2. Therefore, the distance between the side of the buffer portion 16 and the side of the pressure head 15 is reduced from 100 μm to 50 μm. To ensure uniformity of bonding, the edge of the pressure head 15 extends 100 μm beyond the edge of the bonding area of ​​the chip 6, and the distance between the side of the buffer portion 16 and the side of the chip 6 is 80 μm. Considering a bonding accuracy of ±50 μm and a cutting burr of ±50 μm on the color filter substrate 2, the distance between the edge of the pressure head 15 and the edge of the color filter substrate 2 is 45 μm in the extreme case.

[0050] To avoid interference between the first adhesive layer and the electromagnetic shielding layer on the chip, such as Figure 7 As shown, the first adhesive layer 5 extends directly onto the side of the electromagnetic shielding layer 7 away from the array substrate 1. The first adhesive layer 5 and the electromagnetic shielding layer 7 on the chip 6 will not interfere with each other, and the width of the first adhesive layer 5 extending beyond the visible area VA is large enough to avoid air bubbles caused by insufficient width of the first adhesive layer 5 extending beyond the visible area VA. In this embodiment, the distance between the edge of the first adhesive layer 5 and the edge of the display area AA can be 0.65mm. The side of the first polarizer 3 away from the array substrate 1 is lower than the side of the electromagnetic shielding layer 7 away from the array substrate 1, therefore the distance between the first polarizer 3 and the cover plate 10 is smaller than the distance between the electromagnetic shielding layer 7 and the cover plate 10. It should be noted that the first adhesive layer 5 is an optical adhesive.

[0051] The display module may further include a second conductive adhesive layer 13 and a flexible circuit board 11. The second conductive adhesive layer 13 is disposed between the flexible circuit board 11 and the array substrate 1, and the flexible circuit board 11 is bonded to the array substrate 1 via the second conductive adhesive layer 13. The distance between two adjacent first bonding pins on the array substrate 1 is 115µm, the width of the first bonding pin is 75µm, and the distance between two adjacent first bonding pins is 40µm. The distance between two adjacent second bonding pins on the flexible circuit board 11 is 115µm, the width of the second bonding pin is 75µm, and the distance between two adjacent second bonding pins is 40µm.

[0052] The second conductive adhesive layer 13 overlaps with the first conductive adhesive layer 12 along the first direction, and the overlap width between the second conductive adhesive layer 13 and the first conductive adhesive layer 12 is 0.03-0.1 mm. The orthographic projection of the chip 6 on the array substrate 1 lies within the orthographic projection of the first conductive adhesive layer 12 on the array substrate 1. The distance between the edge of the first conductive adhesive layer 12 and the edge of the chip 6 is 1-1.2 mm. The edge of the second conductive adhesive layer 13 is closer to the chip 6 than the edge of the flexible circuit board 11, and the distance between the edge of the second conductive adhesive layer 13 and the edge of the flexible circuit board 11 is 0.4-0.6 mm.

[0053] like Figure 8 As shown, the height difference A between the side of the first polarizer 3 away from the array substrate 1 and the side of the electromagnetic shielding layer 7 away from the array substrate 1 is defined as follows: If the height of the side of the electromagnetic shielding layer 7 away from the array substrate 1 is higher, the corresponding height difference A is larger. According to the current thickness design of the electromagnetic shielding layer 7, the size of A is between 40μm and 55μm. Since the thickness of the first adhesive layer 5 is set according to the distance between the first polarizer 3 and the cover plate 10, when the difference between the distance between the first polarizer 3 and the cover plate 10 and the distance between the electromagnetic shielding layer 7 and the cover plate 10 is large, the gap between the cover plate 10 and the electromagnetic shielding layer 7 is small, and the first adhesive layer 5 is severely squeezed to both sides when the cover plate 10 is attached. The deformation of the first adhesive layer 5 caused by the compression of the electromagnetic shielding layer 7 is large. The first adhesive layer 5 cannot be buffered by its own fluidity, and air bubbles 17 will be generated around the squeezed part, resulting in uneven attachment of the cover plate 10. Air bubbles can be seen near the edge of the visible area VA when viewed from an oblique angle.

[0054] like Figure 9As shown, to avoid air bubbles, the height difference between the side of the electromagnetic shielding layer 7 away from the array substrate 1 and the side of the first polarizer 3 away from the array substrate 1 needs to be adjusted. This allows the first adhesive layer 5 to overcome the height difference between the side of the electromagnetic shielding layer 7 away from the array substrate 1 and the side of the first polarizer 3 away from the array substrate 1 through its own flow, thus avoiding the formation of bonding air bubbles. In this embodiment, the thickness of the electromagnetic shielding layer 7 can be reduced. After the reduction, the height difference A is 20 μm. When bonding the cover plate 10, the first adhesive layer 5 is subjected to less pressure from the cover plate 10 and the electromagnetic shielding layer 7, and the amount of adhesive squeezed out to the left and right sides is also less. The first adhesive layer 5 can absorb this height difference A through its own flowability, thus avoiding the air bubble problem.

[0055] Before thinning, the thickness of the electromagnetic shielding layer 7 can be 0.03 mm, the thickness of the insulating layer 8 can be 0.02 mm, the thickness of the protective layer 9 can be 0.01 mm, the thickness of the chip 6 can be 0.15 mm, and the thickness of the first conductive adhesive layer 12 after lamination is 0.013 mm. The thickness of the electromagnetic shielding layer 7 can be reduced to 0.02 mm, and the thickness of the insulating layer 8 can be reduced to 0.012 mm. The thickness of the color filter substrate 2 is 0.15 mm, and the thickness of the first polarizing layer is typically 0.069 mm.

[0056] Define the height of the electromagnetic shielding layer 7 on the side away from the array substrate 1 as H1, then H1 = 0.013 + 0.15 + 0.01 + 0.02 + 0.012 = 0.205, and define the height of the first polarizer 3 on the side away from the array substrate 1 as H2, then H2 = 0.15 + 0.069 = 0.219.

[0057] The thickness deviation of the color filter substrate 2 is [value], the thickness deviation of the first polarizer 3 is [value], the thickness deviation of the chip 6 is [value], and the thickness deviation of the electromagnetic shielding layer 7 is [value]. Considering the cumulative thickness tolerance: the cumulative height tolerance on the side furthest from the array substrate 1 is [value]. The cumulative height tolerance of the side of the first polarizer 3 furthest from the array substrate 1 After considering the cumulative height tolerance S2, the maximum height of the electronic shielding layer on the side away from the array substrate 1 is: 0.205 + 0.014 = 0.219. After considering the cumulative height tolerance S3, the minimum height on the side away from the array substrate 1 is: 0.219 - 0.0236 = 0.1954 mm. The height difference A = 0.0236. Therefore, the maximum value of the height difference A is 23.6 μm.

[0058] It should be noted that the first direction is Figures 1 to 4 and Figures 7 to 9 The x-direction is shown in the figure.

[0059] This disclosure also provides a display device, which may include the display module mentioned above in this disclosure. The specific structure and beneficial effects of the display device can be referred to the display module, which has been described in detail above and therefore will not be repeated here.

[0060] It should be noted that, in addition to the display module, the display device also includes other necessary components and parts, such as the casing, circuit board, power cord, etc. Those skilled in the art can make corresponding additions according to the specific usage requirements of the display device, which will not be elaborated here.

[0061] Display devices can be traditional electronic devices, such as mobile phones, computers, televisions, and video recorders, or emerging wearable devices, such as virtual reality devices and augmented reality devices, which will not be listed here.

[0062] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A display module, characterized in that, include: Array substrate; The display layer group is disposed on one side of the array substrate; A cover plate is disposed on the side of the display layer group away from the array substrate; The chip is disposed on one side of the array substrate and spaced apart from the display layer group along the first direction; An electromagnetic shielding layer is disposed on the side of the chip away from the array substrate; A first adhesive layer is disposed between the display layer assembly and the cover plate, and the first adhesive layer extends to overlap the electromagnetic shielding layer on the side away from the array substrate; The display layer assembly includes a color filter substrate and a first polarizer. The color filter substrate is located on one side of the array substrate. The first polarizer is disposed on the side of the color filter substrate away from the array substrate. The first adhesive layer is disposed on the side of the first polarizer away from the array substrate. The first adhesive layer is in direct contact with the cover plate. The side of the first polarizer away from the array substrate is lower than the side of the electromagnetic shielding layer away from the array substrate. The height difference between the side of the first polarizer away from the array substrate and the side of the electromagnetic shielding layer away from the array substrate is less than 23.6 μm.

2. The display module according to claim 1, characterized in that, The display module has a display area, and the distance between the edge of the display area and the edge of the array substrate along a first direction is greater than 2 mm and less than 2.6 mm.

3. The display module according to claim 2, characterized in that, The distance between the first polarizer and the edge of the display area along the first direction is 0.3-0.6 mm, and the distance between the first polarizer and the edge of the color filter substrate along the first direction is 0.035-0.335 mm.

4. The display module according to claim 2, characterized in that, The display module further includes a second polarizer, which is disposed on the side of the array substrate away from the color filter substrate. The distance between the second polarizer and the edge of the display area along the first direction is 0.31-0.61 mm, and the distance between the second polarizer and the edge of the color filter substrate along the first direction is 0.0245-0.3245 mm.

5. The display module according to claim 4, characterized in that, The distance between the second polarizer and the chip along the first direction is greater than or equal to 0.3 mm.

6. The display module according to claim 1, characterized in that, The display module further includes a first conductive adhesive layer, which is disposed between the chip and the array substrate. The display module further includes a second conductive adhesive layer and a flexible circuit board. The second conductive adhesive layer is disposed between the flexible circuit board and the array substrate. The second conductive adhesive layer and the first conductive adhesive layer overlap each other along a first direction. The overlap width between the second conductive adhesive layer and the first conductive adhesive layer is 0.03-0.1 mm.

7. The display module according to claim 6, characterized in that, The orthographic projection of the chip on the array substrate is located within the orthographic projection of the first conductive adhesive layer on the array substrate. The distance between the edge of the first conductive adhesive layer and the edge of the chip is 1-1.2 mm. The edge of the second conductive adhesive layer is closer to the chip than the edge of the flexible circuit board. The distance between the edge of the second conductive adhesive layer and the edge of the flexible circuit board is 0.4-0.6 mm.

8. The display module according to claim 1, characterized in that, The display module further includes an insulating layer and a protective layer. The protective layer is disposed between the chip and the electromagnetic shielding layer, and the insulating layer is disposed between the protective layer and the electromagnetic shielding layer.

9. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 8.

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