Printed circuit board assembly module and electronic equipment

Abstract

The invention relates to a printed circuit board assembly module and electronic equipment, the printed circuit board assembly module comprises a first circuit board and a second circuit board, the first circuit board is provided with a clearance groove and a first printed circuit arranged to avoid the clearance groove, and the first printed circuit is electrically connected with a plurality of first bonding pads; the second circuit board is provided with a second printed circuit and a plurality of second bonding pads electrically connected to the second printed circuit, the plurality of second bonding pads are connected with the plurality of first bonding pads to enable the second printed circuit to be electrically connected to the first printed circuit, the second circuit board is provided with a covering part, and the covering part covers at least part of the clearance groove; the covering part is used for arranging a first electronic component at a position corresponding to the clearance groove, and the first electronic component is electrically connected to the first printed circuit through the second printed circuit. According to the printed circuit board assembly module and the electronic equipment, the setting number of electronic components is increased while the clearance requirement of the clearance groove for other structures is maintained, and the space utilization rate is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a printed circuit board assembly module and electronic equipment. Background Art

[0002] With the development of communication technology and the needs of people's daily life, electronic devices are integrating more and more functions. In order to achieve more functions, more and more electronic components are included in electronic devices. This also requires the available area of ​​PCB (Printed Circuit Board) carrying electronic components to continue to increase.

[0003] In the related art, since the number of structural elements inside electronic devices is large and the types are different, it is usually necessary to optimize the location of each structural element in the electronic device to improve its lightness and thinness.

[0004] However, this structural optimization will also face various problems. For example, the functional modules inside the electronic device will interfere with the circuit board. In order to avoid such interference, the functional modules are usually avoided. This structural setting will make it difficult to fully utilize the space near the functional modules in the electronic device, which will lead to low space utilization of the electronic device. Summary of the invention

[0005] The present application provides a printed circuit board assembly module and an electronic device to solve the technical problem of how to reduce the probability of interference between the printed circuit board assembly module and other structural elements when the printed circuit board assembly module is installed in the electronic device and improve space utilization.

[0006] In one aspect, the present application provides a printed circuit board assembly module, comprising:

[0007] A first circuit board has a first surface and a second surface disposed opposite to each other, the first circuit board is provided with a space-avoiding groove and a first printed circuit disposed to avoid the space-avoiding groove, the space-avoiding groove runs through the first surface and the second surface, and the second surface is formed with a plurality of first pads electrically connected to the first printed circuit;

[0008] The second circuit board is provided with a second printed circuit and a plurality of second solder pads electrically connected to the second printed circuit. The second circuit board is stacked on the second surface. The plurality of second solder pads are connected to the plurality of first solder pads so that the second printed circuit is electrically connected to the first printed circuit. The second circuit board has a covering portion, which covers at least a portion of the air avoidance groove on the side where the second surface is located. The covering portion is used to set a first electronic component at a position corresponding to the air avoidance groove. The first electronic component is electrically connected to the first printed circuit through the second printed circuit.

[0009] In one embodiment, at least one of the first electronic components is accommodated in the air-avoiding groove, and the volume of the air-avoiding groove is greater than the total volume of all the first electronic components located therein.

[0010] In one embodiment, the orthographic projection area of ​​the groove wall of the air avoidance groove on the second surface includes a first area and a second area arranged side by side, and a plurality of the first electronic components arranged at intervals in the air avoidance groove are provided on the side of the covering portion facing the first circuit board, and the orthographic projection areas of all the first electronic components located in the air avoidance groove on the second surface are located in the first area.

[0011] In one embodiment, the first electronic component has an end face opposite to the covering portion, the distance from the end face to the covering portion defines a height d of the first electronic component, and the distance between the first surface and the second surface defines a depth H of the air avoidance groove, wherein d is less than or equal to H.

[0012] In one embodiment, the first surface and / or the second surface is provided with a second electronic component, and the second electronic component is electrically connected to the first printed circuit.

[0013] In one of the embodiments, at least one through slot is provided on the second circuit board, and the through slot penetrates the second circuit board along the thickness direction of the second circuit board, second electronic components are provided on the second surface, and at least one of the second electronic components is located in the through slot, and a third circuit board is stacked on the side of the second circuit board facing away from the first circuit board, and third electronic components are provided on at least one side of the third circuit board, and the third circuit board covers the through slot, and the third electronic components located on the side of the third circuit board facing the first circuit board are located in the through slot.

[0014] In one embodiment, two or more through slots are provided on the second circuit board, each of the through slots is covered by the third circuit board, and the thickness of the third circuit boards covering different through slots is different; or, two or more through slots are provided on the second circuit board, and the same third circuit board covers all the through slots.

[0015] In one embodiment, a via is provided on the second circuit board, the hole wall of the via is plated with conductive material or the via is filled with conductive material, the third circuit board is provided with a third printed circuit and a plurality of third soldering pads electrically connected to the third printed circuit, a plurality of fourth soldering pads are formed on the second surface of the first circuit board, the plurality of fourth soldering pads correspond to the plurality of third soldering pads, and the conductive material is used to electrically connect the third soldering pads to the fourth soldering pads, so that the third circuit board is electrically connected to the first circuit board.

[0016] In one embodiment, the conductive material at at least one of the vias is electrically connected to the second printed circuit, and the second printed circuit is electrically connected to the first printed circuit and the third printed circuit.

[0017] On the other hand, the present application provides an electronic device, comprising a housing and a printed circuit board assembly module as described above, wherein the printed circuit board assembly module is disposed in a space enclosed by the housing.

[0018] In one embodiment, a functional module is disposed in the space enclosed by the shell, and at least a portion of the structure of the functional module is accommodated in the air-avoiding groove.

[0019] In one embodiment, the shell includes a frame, the cross-sectional shape of the inner wall of the frame is arc-shaped, and among the circuit boards in the printed circuit board assembly module, at least one circuit board is chamfered at a position corresponding to the inner wall of the frame to maintain a distance from the inner wall of the frame.

[0020] The printed circuit board assembly module and electronic device of the present application, since the first circuit board is provided with an air avoidance groove, when the printed circuit board assembly module is assembled into the electronic device, the air avoidance groove can be used to accommodate other structural elements in the electronic device, thereby reducing the probability of interference between the printed circuit board and other structural elements. Since the covering portion of the second circuit board can be provided with the first electronic component at the position corresponding to the air avoidance groove, the deficiency that the electronic components cannot be provided at the air avoidance groove due to the provision of the air avoidance groove on the first circuit board is compensated, and the number of electronic components provided is increased while maintaining the air avoidance groove for other structures. In this way, there is no need to expand the area of ​​the first circuit board to provide more electronic components, thereby reducing the design area of ​​the electronic device occupied by the printed circuit board assembly module. Therefore, the printed circuit board assembly module of the present application takes into account the reduction of the probability of interference with other structural elements, and is also conducive to optimizing the setting position of each structural element in the electronic device, thereby improving the space utilization rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment.

[0023] FIG. 2 is a schematic cross-sectional view of a partial structure of an electronic device according to an embodiment of the present invention, taken along line II in FIG. 1 .

[0024] FIG. 3 is a schematic cross-sectional view of a partial structure of an electronic device according to another embodiment along line II in FIG. 1 .

[0025] FIG. 4 is a schematic cross-sectional view of a printed circuit board assembly module according to an embodiment of the present application.

[0026] FIG. 5 is a schematic top view of the structure of a printed circuit board assembly module according to an embodiment of the present application.

[0027] FIG. 6 is a schematic top view of the structure of a printed circuit board assembly module according to another embodiment of the present application.

[0028] FIG. 7 is a schematic top view of the structure of a printed circuit board assembly module according to another embodiment of the present application.

[0029] FIG. 8 is a schematic top view of the structure of a printed circuit board assembly module according to another embodiment of the present application.

[0030] FIG. 9 is a schematic cross-sectional structural diagram of the printed circuit board assembly module shown in FIG. 8 .

[0031] FIG. 10 is a schematic cross-sectional view of a printed circuit board assembly module according to another embodiment of the present application.

[0032] FIG. 11 is a schematic cross-sectional view of a printed circuit board assembly module according to another embodiment of the present application.

[0033] FIG. 12 is a schematic cross-sectional view of a printed circuit board assembly module according to another embodiment of the present application.

[0034] FIG. 13 is a schematic cross-sectional view of a partial structure of an electronic device according to an embodiment of the present application.

[0035] FIG. 14 is a schematic cross-sectional view of a partial structure of an electronic device according to another embodiment of the present application.

[0036] FIG15 is a schematic diagram of the structure of the electronic device of the present application.

[0037] Description of Figure Numbers:

[0038] 100. electronic device; 101. main board; 102. electronic component; 103. camera module; 104. protruding component; 10. shell; 11. front shell; 12. frame; 13. back cover; 131. through hole; 20. printed circuit board assembly module; 21. first circuit board; 211. first surface; 212. second surface; 213. air avoidance groove; 2131. first area; 2132. second area; 214. first solder pad; 215. second electronic component; 216. fourth solder pad; 22. second circuit board; 221. second solder pad; 222. covering portion; 223. first electronic component; 2231. end face; 224. through groove; 225. via; 23. third circuit board; 231. third electronic component; 232. third solder pad; A1. first exposed area; A2. second exposed area; D. chamfer. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0040] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0041] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0042] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0043] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0044] (1) Satellite phone or cellular phone;

[0045] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0046] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0047] (4) conventional laptop and / or handheld receivers;

[0048] (5) Conventional laptop and / or palmtop radiotelephone transceivers, etc.

[0049] 1 , an electronic device 100 is provided in one embodiment of the present application. The electronic device 100 may be a mobile phone or a tablet computer. The type of the electronic device 100 is not limited here.

[0050] The electronic device 100 includes a housing 10 and a printed circuit board assembly (PCBA) module 20 . The printed circuit board assembly module 20 is disposed in a space enclosed by the housing 10 .

[0051] The housing 10 includes a front housing 11, a frame 12, and a back cover 13, wherein the front housing 11 and the back cover 13 are connected to opposite sides of the frame 12. As shown in FIG. 2 , the housing 10 encloses a space for installing structural elements such as functional modules and printed circuit board assembly modules 20. The housing 10 is used to protect the functional modules and printed circuit board assembly modules 20 in the electronic device 100. In some embodiments, the frame 12 and the back cover 13 are integrally formed, that is, the frame 12 and the back cover 13 constitute an integral structural member. The front housing 11 and the frame 12 can be connected by snap-fit ​​connection or by hot melt adhesive. The connection method of the various components of the housing 10 is not limited here.

[0052] The functional module is electrically connected to the printed circuit board assembly module 20, and the printed circuit board assembly module 20 is used to perform signal processing and signal control operations on the functional module. It should be noted that the printed circuit board assembly module 20 can be a control circuit board of the electronic device 100, or a circuit board assembly of other functions in the electronic device 100.

[0053] As shown in combination with FIG. 2 and FIG. 4 , the printed circuit board assembly module 20 includes a first circuit board 21 and a second circuit board 22. The first circuit board 21 has a first surface 211 and a second surface 212 that are arranged opposite to each other. The first circuit board 21 is provided with an air avoidance groove 213 and a first printed circuit (not shown) that is arranged to avoid the air avoidance groove 213. The air avoidance groove 213 runs through the first surface 211 and the second surface 212, and the second surface 212 is formed with a plurality of first pads 214 that are electrically connected to the first printed circuit. It should be noted here that the first printed circuit can be a connected circuit or a plurality of circuits that are disconnected due to the air avoidance groove 213.

[0054] The second circuit board 22 is provided with a second printed circuit (not shown) and a plurality of second pads 221 electrically connected to the second printed circuit. The second circuit board 22 is stacked on the second surface 212, and the plurality of second pads 221 are connected to the plurality of first pads 214, so that the second printed circuit is electrically connected to the first printed circuit. The second circuit board 22 has a covering portion 222, and the covering portion 222 covers at least part of the air avoidance groove 213 on the side where the second surface 212 is located, that is, the covering portion 222 structurally covers and shields the area where the air avoidance groove 213 is located. The covering portion 222 is used to set a first electronic component 223 at a position corresponding to the air avoidance groove 213, and the first electronic component 223 is electrically connected to the first printed circuit through the second printed circuit.

[0055] In this embodiment, the plurality of second pads 221 of the second circuit board 22 are connected to the plurality of first pads 214 so that the second printed circuit is electrically connected to the first printed circuit, thereby realizing the electrical connection between the second circuit board 22 and the first circuit board 21. Since the first printed circuit can be a connected circuit or a plurality of circuits disconnected by the air-avoiding groove 213, the second circuit board 22 can play different roles in the embodiment of the present application. For example, when the first printed circuit is a connected circuit, the second circuit board 22 is electrically connected to the first circuit board 21, which is equivalent to superimposing the second circuit board 22 on the first circuit board 21. For another example, when the first printed circuit is a plurality of circuits disconnected by the air-avoiding groove 213, the second circuit board 22 is electrically connected to the first circuit board 21 to realize the electrical connection of the plurality of circuits in the first circuit board 21. For example, the first printed circuit of the first circuit board 21 includes a first circuit and a second circuit that are disconnected from each other. After the plurality of second pads 221 of the second circuit board 22 are connected to the plurality of first pads 214, the second circuit board 22 electrically connects the first circuit with the second circuit, that is, the second circuit board 22 acts as a bridge for current or signal, and conducts current or signal between the first circuit and the second circuit. It should be noted that the first pads 214 and the second pads 221 may be welded together in a one-to-one correspondence, or may be welded together in a one-to-many correspondence (i.e., one first pad 214 corresponds to a plurality of second pads 221) or a many-to-one correspondence (i.e., a plurality of first pads 214 corresponds to a second pad 221).

[0056] Since the first circuit board 21 is provided with a void groove 213, when the printed circuit board assembly module 20 is assembled into the electronic device 100, the void groove 213 can be used to accommodate other structural elements in the electronic device 100, thereby reducing the probability of interference between the printed circuit board and other structural elements. Since the covering portion 222 of the second circuit board 22 can be provided with the first electronic component 223 at the position corresponding to the void groove 213, the deficiency that the first circuit board 21 cannot be provided with electronic components at the void groove 213 due to the provision of the void groove 213 is compensated, and the number of electronic components provided is increased while maintaining the need for the void groove 213 to provide void avoidance for other structures, so that there is no need to expand the area of ​​the first circuit board 21 to provide more electronic components, thereby helping to reduce the design area of ​​the electronic device 100 occupied by the printed circuit board assembly module 20. It can be seen that the printed circuit board assembly module 20 of the present application takes into account the reduction of the probability of interference with other structural elements, and is also conducive to optimizing the setting position of each structural element in the electronic device 100, thereby improving the space utilization rate.

[0057] It should be noted that the air-avoiding groove 213 can produce an air-avoiding effect on other structural elements in the electronic device 100 , and the types of these other structural elements are not limited herein.

[0058] For example, in some embodiments, in combination with FIG. 2 , other structural elements include but are not limited to electronic elements 102 such as capacitors, resistors, and inductors on a mainboard 101 of the electronic device 100 .

[0059] In some embodiments, other structural elements may also be the aforementioned functional modules, and the functional modules include but are not limited to camera modules, speakers, microphones or receivers. In conjunction with FIG. 3 , the air avoidance groove 213 is used to avoid air for the camera module 103 as an example. The back cover 13 is provided with a through hole 131, and the camera module 103 is arranged at the through hole 131 of the back cover 13. A part of the structure of the camera module 103 protrudes from the inner surface of the back cover 13 (i.e., the surface of the back cover 13 facing the inside of the electronic device 100) and is accommodated in the air avoidance groove 213. In this embodiment, the air avoidance groove 213 of the first circuit board 21 can produce an air avoidance effect on the part of the structure of the camera module 103 protruding from the inner surface of the back cover 13, so that when the first circuit board 21 is installed in the electronic device 100, the air avoidance groove 213 of the first circuit board 21 accommodates part of the structure of the camera module 103 to avoid interference between the first circuit board 21 and the camera module 103.

[0060] For ease of understanding, this interference will be explained below by taking the motherboard of an electronic device in the related art as an example. Specifically, if the motherboard of the electronic device is not slotted, when the motherboard is set to cover the camera module, the motherboard cannot be set close to the back cover due to the interference of the camera module. In this way, the gap between the motherboard and the back cover is difficult to be used, resulting in a waste of the internal space of the electronic device, that is, the space utilization rate of the electronic device decreases. If the motherboard is set to avoid the position of the camera module, the projection area of ​​the motherboard and the camera module on the plane in the vertical thickness direction of the electronic device will be larger than the area of ​​the motherboard. Therefore, this structural setting will cause the space for the electronic device to set up structures such as batteries, speakers or data terminals to be reduced, which is not conducive to the miniaturization of the electronic device. In addition, if the motherboard is slotted to avoid the camera module, although it can avoid interference between the motherboard and the camera module, the slotting on the motherboard will reduce the setting area of ​​the electronic components of the motherboard, so it is still necessary to increase the area of ​​the motherboard in the area outside the camera module to meet the need to set up electronic components, and then it will also face the problem of increasing the design area occupied by the electronic device.

[0061] In the embodiment of the present application, since the covering portion 222 of the second circuit board 22 covers the air-avoiding groove 213 of the first circuit board 21, and the covering portion 222 sets the first electronic component 223 at the position corresponding to the air-avoiding groove 213, when the air-avoiding groove 213 is used to set the camera module 103 to avoid air, the interference between the first circuit board 21 and the camera module 103 is avoided. At the same time, the covering portion 222 of the second circuit board 22 enables the first electronic component 223 to be set at the position of the air-avoiding groove 213, so as not to face the situation of losing one thing while gaining another in the related technical problems. In this way, it is possible to reduce the probability of interference between the printed circuit board assembly module 20 and the camera module 103 when it is installed in the electronic device 100, while improving the space utilization rate.

[0062] It should be noted that, in an embodiment in which the electronic device 100 includes a functional module, the functional module may be disposed outside the air-avoiding groove 213 , that is, the air-avoiding groove 213 does not accommodate the functional module.

[0063] In some embodiments, the functional module may also be accommodated in the air avoidance groove 213. For example, a functional module is arranged in the space enclosed by the housing 10, and at least part of the structure of the functional module is accommodated in the air avoidance groove 213. In this embodiment, the air avoidance groove 213 is used to accommodate the functional module, so that the functional module can be arranged in the electronic device 100 without interfering with the printed circuit board assembly module 20, so that the functional module can be arranged in a suitable position. Due to this structural setting, the printed circuit board assembly module 20 does not need to avoid the setting position of the functional module, and directly uses the air avoidance groove 213 to accommodate the functional module, which is beneficial to improve the space utilization rate of the electronic device 100, so as to realize the miniaturization of the electronic device 100.

[0064] As shown in Figure 4, in some embodiments, at least one first electronic component 223 is accommodated in the air avoidance groove 213, so that the first electronic component 223 is set using the air avoidance groove 213. In this way, while maintaining the number of first electronic components 223 set unchanged, fewer first electronic components 223 can be set on the side of the second circuit board 22 facing away from the first circuit board 21, which is conducive to the miniaturization of the second circuit board 22 and realizes the overall miniaturization of the printed circuit board assembly module 20.

[0065] It should be noted that, as shown in FIG. 5, the covering portion 222 may completely cover the clearance groove 213 on the side where the second surface 212 is located. In some embodiments, as shown in FIG. 6, the covering portion 222 may cover a part of the clearance groove 213 on the side where the second surface 212 is located. At this time, at least part of the groove wall of the clearance groove 213 can be exposed from the side of the covering portion 222 facing away from the first circuit board 21 (that is, can be observed). Regarding the positions of the first pad 214 and the second pad 221, no limitation is made here. It only needs that the first pad 214 and the second pad 221 are located in the overlapping part of the first circuit board 21 and the second circuit board 22 to electrically connect the first circuit board 21 and the second circuit board 22.

[0066] Based on the corresponding settings of the first pad 214 and the second pad 221, the setting position of the first pad 214 relative to the rectangular clearance groove 213 will be taken as an example for illustration. For example, as shown in FIG. 5, the first pad 214 is arranged around the four sides of the clearance groove 213. Another example is that, as shown in FIG. 6, the covering portion 222 covers a part of the clearance groove 213, and the clearance groove 213 has an exposed area on the side where the covering portion 222 is located. At this time, the first pad 214 can be arranged on the opposite sides of the clearance groove 213, or can be arranged in a "匚" shape along the edge of the clearance groove 213. Another example is that, as shown in FIG. 7, when the covering portion 222 covers a part of the clearance groove 213 and makes the clearance groove 213 have two exposed areas on the side where the covering portion 222 is located. These two exposed areas are the first exposed area A1 and the second exposed area A2 respectively, and the first exposed area A1 and the second exposed area A2 are separated by the covering portion 222. At this time, the first pad 214 is distributed at the edge positions on both sides of the clearance groove 213 covered by the covering portion 222.

[0067] The volume of the clearance groove 213 is greater than the total volume of all the first electronic components 223 located therein. That is to say, in addition to accommodating the first electronic components 223, the clearance groove 213 also reserves other clearance spaces, so as to be able to meet the need for accommodating other functional devices of the electronic device 100. When the printed circuit board assembly module 20 is installed in the electronic device 100, the structures that will cause interference in the electronic device 100 can be accommodated in the clearance groove 213 to improve the space utilization rate in the electronic device 100.

[0068] For example, as shown in combination with FIG8 and FIG9, the orthographic projection area of ​​the groove wall of the air-avoiding groove 213 on the second surface 212 includes a first area 2131 and a second area 2132 arranged side by side, and a plurality of first electronic components 223 arranged at intervals in the air-avoiding groove 213 are provided on the side of the covering portion 222 facing the first circuit board 21, and the orthographic projection areas of all the first electronic components 223 in the air-avoiding groove 213 on the second surface 212 are located in the first area 2131. In this embodiment, since the orthographic projection areas of all the first electronic components 223 on the second surface 212 are located in the first area 2131, the space corresponding to the second area 2132 of the air-avoiding groove 213 will not be occupied, and then the space corresponding to the second area 2132 of the air-avoiding groove 213 is used to accommodate other structural parts (such as the protruding element 104 in FIG8 and FIG9), so as to improve the space utilization rate of the electronic device 100 and realize the miniaturization of the electronic device 100.

[0069] For another example, in combination with FIG. 10 , in some embodiments, the first electronic component 223 has an end surface 2231 opposite to the covering portion 222, the distance from the end surface 2231 to the covering portion 222 defines the height d of the first electronic component 223, and the distance between the first surface 211 and the second surface 212 defines the depth H of the air-avoiding groove 213, wherein d is less than or equal to H. In this embodiment, since the height d of the first electronic component 223 is less than or equal to the depth H of the air-avoiding groove 213, the first electronic component 223 will not extend from the air-avoiding groove 213 to the first surface 211 of the first circuit board 21, and then the first surface 211 of the first circuit board 21 can be set corresponding to a flat position in the electronic device 100. Compared with the first electronic component 223 extending from the first surface 211 and easily interfering with the flat position in the electronic device 100, this structural setting of this embodiment can reduce the occupation of the electronic device 100 in the thickness direction, so as to facilitate the thinning of the electronic device 100.

[0070] Referring again to FIG. 9 , in some embodiments, the first surface 211 and / or the second surface 212 are provided with a second electronic component 215. The second electronic component 215 is electrically connected to the first printed circuit. In this embodiment, for a first circuit board 21 with a certain area, the second electronic component 215 is provided on the first surface 211 and the second surface 212, so that the number of electronic components can be increased without increasing the area of ​​the first circuit board 21, so that more electronic components can be provided while maintaining the design area of ​​the printed circuit board assembly module 20. In other words, more electronic components can be provided with the same design area. Therefore, this structural setting improves the surface utilization rate of the printed circuit board assembly module 20 for designing electronic components, which is conducive to miniaturization of the printed circuit board assembly module 20.

[0071] As shown in combination with FIG. 11 and FIG. 12 , in some embodiments, at least one through slot 224 is provided on the second circuit board 22, and the through slot 224 penetrates the second circuit board 22 along the thickness direction of the second circuit board 22. The second surface 212 is provided with a second electronic component 215, and at least one second electronic component 215 is located in the through slot 224. A third circuit board 23 is stacked on the side of the second circuit board 22 facing away from the first circuit board 21, and a third electronic component 231 is provided on at least one side of the third circuit board 23. The third circuit board 23 covers the through slot 224, and the third electronic component 231 located on the side of the third circuit board 23 facing the first circuit board 21 is located in the through slot 224.

[0072] The through slots 224 on the second circuit board 22 are used to accommodate the second electronic component 215 and the third electronic component 231 , thereby further improving the surface utilization rate of the printed circuit board assembly module 20 for designing electronic components, which is conducive to miniaturization of the printed circuit board assembly module 20 .

[0073] For ease of understanding, a single-layer circuit board is taken as an example. If N electronic components are required to realize a certain function, the area occupied by the N electronic components when arranged on one side of the single-layer circuit board is S. Then, the printed circuit board assembly module 20 of the present application is adopted, and part of the N electronic components are arranged at the position corresponding to the through slot 224 of the second circuit board 22, and part of them are arranged at the position corresponding to the through slot 224 of the third circuit board 23, so that the number of electronic components arranged at other positions will be less than N. If the occupied area of ​​these electronic components less than N on any one of the first circuit board 21, the second circuit board 22 and the third circuit board 23 is set to s, then s is less than S. Therefore, the printed circuit board assembly module 20 of the present application only needs a smaller design area to meet the need to set up an equal number of electronic components. In other words, the printed circuit board assembly module 20 of the present application is conducive to reducing the occupied area in the electronic device 100. It should be noted here that the occupied area of ​​the printed circuit board assembly module 20 in the electronic device 100 refers to the positive projection area of ​​the printed circuit board assembly module 20 along the thickness direction of the electronic device 100.

[0074] Furthermore, two or more through slots 224 are provided on the second circuit board 22, and each through slot 224 is covered with a third circuit board 23. In this way, the through slots 224 can be used to accommodate the third electronic components 231 on the corresponding third circuit board 23, so as to reduce the occupied area of ​​the printed circuit board assembly module 20 in the electronic device 100. In this embodiment, the thickness of the third circuit board 23 covering different through slots 224 is different, so as to adapt to the layer height requirements of different positions. For example, for the electronic device 100, due to the different stacking thickness of the structural parts at different positions, the space used to set the printed circuit board assembly module 20 in the electronic device 100 is not a standard equal thickness space. Therefore, for the situation where different positions have different thickness spaces, the different thicknesses of the third circuit board 23 covering different through slots 224 in this embodiment are adopted to achieve different thicknesses at different positions, so as to adapt to the layer height requirements of different positions in the electronic device 100.

[0075] In the embodiment where two or more through slots 224 are provided on the second circuit board 22, the same third circuit board 23 may be used to cover all the through slots 224, thereby constructing another miniaturized printed circuit board assembly module 20.

[0076] The number of circuit boards in the printed circuit board assembly module 20 may be 4 or more. For example, in addition to the first circuit board 21, the second circuit board 22, and the third circuit board 23, in some embodiments, the printed circuit board assembly module 20 further includes a fourth circuit board, a fifth circuit board, or a sixth circuit board. The number of circuit boards in the printed circuit board assembly module 20 and the structural arrangement of the corresponding circuit boards are not described in detail here.

[0077] It should be noted that the circuit boards stacked adjacent to each other can be electrically connected by welding. For example, the first circuit board 21 and the second circuit board 22 are electrically connected to each other by welding the first solder pad 214 and the second solder pad 221. A solder pad for electrically connecting the second circuit board 22 and the third circuit board 23 is provided between them.

[0078] In some embodiments, the circuit boards can also be electrically connected to each other by other conductive methods. For example, as shown in FIG. 12, a via 225 is provided on the second circuit board 22, and the hole wall of the via 225 is plated with a conductive material or the via 225 is filled with a conductive material. The third circuit board 23 is provided with a third printed circuit (not shown) and a plurality of third pads 232 electrically connected to the third printed circuit. A plurality of fourth pads 216 are formed on the second surface 212 of the first circuit board 21, and the plurality of fourth pads 216 correspond to the plurality of third pads 232. It should be noted here that the fourth pad 216 and the first pad 214 are both pads on the first circuit board 21, and there is no essential difference between the two, but the electrical connection objects may be different, so they are named separately. In some embodiments, a portion of the fourth pad 216 also acts as the first pad 214 to realize electrical connection with the second pad 221, so as to realize the electrical connection between the second circuit board 22 and the first circuit board 21.

[0079] The conductive material is used to electrically connect the third pad 232 to the fourth pad 216, so that the third circuit board 23 is electrically connected to the first circuit board 21. In this embodiment, the conductive material in the via 225 is used to realize the electrical connection between the third circuit board 23 and the first circuit board 21, so that the third electronic component 231 arranged on the third circuit board 23 and the second electronic component 215 on the first circuit board 21 play corresponding functions in the whole printed circuit board assembly module 20, or in other words, for the second electronic component 215 and the third electronic component 231 in the related art are arranged on the same circuit board, this structural setting of the present application reduces the occupied area of ​​the printed circuit board assembly module 20 by stacking, so as to free up more area for the electronic device 100 to set other structural elements such as batteries and camera modules 103, thereby facilitating the miniaturization of the electronic device 100.

[0080] It should be noted that when the conductive material in the via 225 located on the second circuit board 22 is used to realize the electrical connection between the first circuit board 21 and the third circuit board 23, the second circuit board 22 can also be electrically connected to the first circuit board 21 and the third circuit board 23, so that the circuit boards in the printed circuit board assembly module 20 are electrically connected as a whole. For example, in some embodiments, the conductive material at at least one via 225 is electrically connected to the second printed circuit, and the second printed circuit is electrically connected to the first printed circuit and the third printed circuit. In this embodiment, it can be considered that the fourth pad 216 corresponding to the via 225 connected to the second printed circuit is also reused as the first pad 214, and the position of the via 225 connected to the fourth pad 216 reused as the first pad 214 is equivalent to the second pad 221. Through this structural setting, the electrical connection structure between the first circuit board 21, the second circuit board 22 and the third circuit board 23 can be simplified, which is conducive to the assembly of the printed circuit board assembly module 20 and reduces the production cost.

[0081] As shown in FIG. 13 , if the circuit board in the printed circuit board assembly module 20 interferes with the structure of the electronic device 100 such as the frame 12, the edge of the printed circuit board assembly module 20 can also be designed to avoid air according to the installation requirements in the electronic device 100. For example, as shown in FIG. 14 , in an embodiment in which the housing 10 includes a frame 12, the cross-sectional shape of the inner wall of the frame 12 is arc-shaped, and among the circuit boards in the printed circuit board assembly module 20, at least one circuit board (such as the third circuit board 23 in FIG. 14 ) is provided with a chamfer D at a position corresponding to the inner wall of the frame 12 to maintain a gap with the inner wall of the frame 12. In this embodiment, the chamfer D of the circuit board corresponding to the position inside the frame 12 is used to achieve that the circuit board and the inside of the frame 12 are kept at a distance without interfering with each other. This design of avoiding air for the edge shape of the circuit board is not only simple in structure, but also has little modification to the circuit board, so the cost is low. It should be noted that the chamfer D on the circuit board can be a rounded corner, or a concave arc-shaped chamfer D (that is, the cross-sectional shape of the edge of the circuit board is concave arc-shaped).

[0082] Referring to FIG15, FIG15 is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application. The electronic device 100 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. It can be understood by those skilled in the art that the structure of the electronic device 100 shown in FIG15 does not constitute a limitation on the electronic device 100, and may include more or fewer components than shown in the figure, or combine certain components, or arrange components differently.

[0083] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Generally, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0084] The memory 502 can be used to store applications and data. The applications stored in the memory 502 include executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the electronic device 100 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0085] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0086] The display unit 504 may be used to display information input by the user or provided to the user and various graphical user interfaces of the electronic device 100, which may be composed of graphics, text, icons, videos, and any combination thereof. The display unit 504 may include the above-mentioned liquid crystal panel.

[0087] Furthermore, the touch-sensitive surface may cover a liquid crystal panel. When the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event. The processor 508 then provides corresponding visual output on the liquid crystal panel according to the type of touch event.

[0088] Although in FIG15 , the touch-sensitive surface and the liquid crystal panel are implemented as two independent components to implement input and output functions, in some embodiments, the touch-sensitive surface and the liquid crystal panel can be integrated to implement input and output functions. It can be understood that the screen can include an input unit 503 and a display unit 504 .

[0089] The electronic device 100 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the liquid crystal panel according to the brightness of the ambient light, and the proximity sensor may turn off the liquid crystal panel and / or the backlight when the electronic device 100 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that can also be configured in the electronic device 100, they will not be repeated here.

[0090] The audio circuit 506 can provide an audio interface between the user and the electronic device 100 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another electronic device 100 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the electronic device 100.

[0091] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 100 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507, which provides users with wireless broadband Internet access. Although FIG15 shows the wireless fidelity module 507, it is understandable that it is not a necessary component of the electronic device 100 and can be omitted as needed without changing the essence of the invention.

[0092] The processor 508 is the control center of the electronic device 100. It uses various interfaces and lines to connect various parts of the entire electronic device 100. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it executes various functions of the electronic device 100 and processes data, thereby monitoring the electronic device 100 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0093] The electronic device 100 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption management. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0094] Although not shown in FIG. 15 , the electronic device 100 may further include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules may be implemented as independent entities, or may be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules may refer to the previous method embodiments, which will not be described in detail here.

[0095] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0096] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0097] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0098] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0099] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0100] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the inventive concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A printed circuit board assembly module, It is characterized in that include: A first circuit board has a first surface and a second surface disposed opposite to each other, the first circuit board is provided with a space-avoiding groove and a first printed circuit disposed to avoid the space-avoiding groove, the space-avoiding groove runs through the first surface and the second surface, and the second surface is formed with a plurality of first pads electrically connected to the first printed circuit; The second circuit board is provided with a second printed circuit and a plurality of second solder pads electrically connected to the second printed circuit. The second circuit board is stacked on the second surface. The plurality of second solder pads are connected to the plurality of first solder pads so that the second printed circuit is electrically connected to the first printed circuit. The second circuit board has a covering portion, which covers at least a portion of the air avoidance groove on the side where the second surface is located. The covering portion is used to set a first electronic component at a position corresponding to the air avoidance groove. The first electronic component is electrically connected to the first printed circuit through the second printed circuit.

2. The printed circuit board assembly module according to claim 1, It is characterized in that At least one of the first electronic components is accommodated in the air-avoiding groove, and the volume of the air-avoiding groove is greater than the total volume of all the first electronic components located therein.

3. The printed circuit board assembly module according to claim 2, It is characterized in that The orthographic projection area of ​​the groove wall of the air avoidance groove on the second surface includes a first area and a second area arranged side by side, and a plurality of the first electronic components arranged at intervals in the air avoidance groove are provided on the side of the covering portion facing the first circuit board, and the orthographic projection areas of all the first electronic components located in the air avoidance groove on the second surface are located in the first area.

4. The printed circuit board assembly module according to claim 2 or 3, It is characterized in that The first electronic component has an end face opposite to the covering portion, the distance from the end face to the covering portion defines a height d of the first electronic component, and the distance between the first surface and the second surface defines a depth H of the air avoidance groove, wherein d is less than or equal to H.

5. The printed circuit board assembly module according to claim 1, It is characterized in that The first surface and / or the second surface is provided with a second electronic component, and the second electronic component is electrically connected to the first printed circuit.

6. The printed circuit board assembly module according to claim 1, It is characterized in that At least one through slot is provided on the second circuit board, and the through slot penetrates the second circuit board along the thickness direction of the second circuit board. Second electronic components are provided on the second surface, and at least one of the second electronic components is located in the through slot. A third circuit board is stacked on the side of the second circuit board facing away from the first circuit board, and third electronic components are provided on at least one side of the third circuit board. The third circuit board covers the through slot, and the third electronic components located on the side of the third circuit board facing the first circuit board are located in the through slot.

7. The printed circuit board assembly module according to claim 6, It is characterized in that The second circuit board is provided with two or more through slots, each of the through slots is covered by the third circuit board, and the third circuit boards covering different through slots have different thicknesses; Alternatively, the second circuit board is provided with two or more through slots, and the same third circuit board covers all the through slots.

8. The printed circuit board assembly module according to claim 6 or 7, It is characterized in that The second circuit board is provided with a via, the hole wall of the via is plated with conductive material or the via is filled with conductive material, the third circuit board is provided with a third printed circuit and a plurality of third soldering pads electrically connected to the third printed circuit, a plurality of fourth soldering pads are formed on the second surface of the first circuit board, the plurality of fourth soldering pads correspond to the plurality of third soldering pads, and the conductive material is used to electrically connect the third soldering pads to the fourth soldering pads, so that the third circuit board is electrically connected to the first circuit board.

9. The printed circuit board assembly module according to claim 8, It is characterized in that The conductive material at at least one of the vias is electrically connected to the second printed circuit, and enables the second printed circuit to be electrically connected to the first printed circuit and the third printed circuit.

10. An electronic device, It is characterized in that It comprises a shell and a printed circuit board assembly module as claimed in any one of claims 1 to 9, wherein the printed circuit board assembly module is arranged in a space enclosed by the shell.

11. The electronic device according to claim 10, It is characterized in that A functional module is arranged in the space enclosed by the shell, and at least a part of the structure of the functional module is accommodated in the air-avoiding groove.

12. The electronic device according to claim 10 or 11, It is characterized in that The shell includes a frame, the inner wall of which has an arc-shaped cross-section. Among the circuit boards in the printed circuit board assembly module, at least one circuit board is chamfered at a position corresponding to the inner wall of the frame to maintain a distance from the inner wall of the frame.

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