A micromechanical nested ring gyroscope
By designing a support structure and optimizing the resonant frequency of a micromechanical nested ring gyroscope, the problem of performance degradation of micromechanical gyroscopes in harsh environments was solved, and the stability and sensitivity were improved in temperature-changing and vibration-prone environments.
Patent Information
- Application Number
- CN202411303073.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2044-09-18
AI Technical Summary
Micromechanical gyroscopes experience performance degradation in harsh environments, especially when there are changes in ambient temperature or strong vibrations, and fail to meet application requirements.
A micromechanical nested ring gyroscope with a support structure including anchor points and flexible support components is used. The nested ring resonator is supported by a flexible support beam through SOI wafer fabrication. The structural parameters are optimized to adjust the resonant frequency and reduce vibration sensitivity.
The performance stability of the gyroscope was improved in harsh environments, its sensitivity to temperature changes and vibrations was reduced, mechanical sensitivity was increased, and mechanical noise was reduced.
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Figure CN119164379B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of aerospace technology, and more specifically, to a micromechanical nested ring gyroscope. Background Technology
[0002] A micromechanical gyroscope (MEMS gyroscope) is a miniature angular velocity sensor fabricated using Micro Electro-Mechanical Systems (MEMS) technology. MEMS technology is a cutting-edge technology integrating microelectronics, micro-engineering mechanics, precision mechanics, and other disciplines. It achieves the miniaturization and integration of traditional macroscopic mechanical devices by fabricating micro-mechanical structures on silicon substrates. Micromechanical gyroscopes detect angular velocity using the Coriolis force. Specifically, the gyroscope contains a continuously oscillating mass. When rotation occurs, the mass undergoes lateral displacement due to the Coriolis force. This displacement is detected by a capacitive sensing device and converted into an electrical signal output.
[0003] Micromechanical gyroscopes (MEMS) are inertial sensors that measure the angular velocity or attitude angle of an object moving in space. They offer advantages such as small size, light weight, low power consumption, low cost, and easy integration, leading to their widespread application in inertial navigation systems, automobiles, consumer electronics, and mining. These demands provide enormous opportunities for the further development of MEMS gyroscopes, while also placing higher demands on their performance. In particular, when MEMS gyroscopes operate in relatively harsh environments, such as those with drastic temperature changes or strong vibrations, their performance degrades, making them unable to meet the requirements of the application scenarios. Summary of the Invention
[0004] In view of this, this application provides a micromechanical ring nested gyroscope to solve the problem of performance degradation of micromechanical gyroscopes when operating in harsh environments.
[0005] To achieve the above objectives, the following solution is proposed:
[0006] A micromechanical nested ring gyroscope includes a substrate and a support structure disposed on the substrate, a nested ring resonator, and a plurality of electrodes, wherein:
[0007] The support structure includes an anchor point and a flexible support component. The anchor point is connected to the substrate, and the flexible support component is connected to the anchor point and is used to support the nested ring resonator.
[0008] Optionally, the support structure, nested ring resonator, and multiple electrodes are all fabricated using SOI wafers with (100) crystal planes.
[0009] Optionally, the flexible support component is a flexible support beam that is bent and folded.
[0010] Optionally, the nested ring resonator includes multiple concentrically arranged ring resonant structures.
[0011] Optionally, each of the ring resonant structures has the same wall thickness, and the distance between any two ring resonant structures is the same.
[0012] Optionally, a plurality of spoke structures are provided between any two of the ring resonant structures.
[0013] Optionally, any two spoke structures have the same wall thickness.
[0014] Optionally, the two third-order goblet-shaped degenerate modes in which the micromechanical nested ring gyroscope operates include a first mode and a second mode, wherein:
[0015] The electrode includes a plurality of first driving electrodes and a first detection electrode for supporting the first mode, a second driving electrode and a second detection electrode for supporting the second mode, and an anchor electrode disposed on the anchor point for providing a bias voltage.
[0016] As can be seen from the above technical solution, this application discloses a micromechanical nested ring gyroscope, including a substrate and a support structure disposed on the substrate, a nested ring resonator, and multiple electrodes. The support structure includes anchor points and flexible support components. The anchor points are connected to the substrate, and the flexible support components are connected to the anchor points and used to support the nested ring resonator. Due to the use of a support structure with flexible support components, the transmission of stress caused by temperature changes can be reduced. By adjusting the structural parameters, the resonant frequency of the gyroscope's operating mode is optimized, reducing the gyroscope's vibration sensitivity. This solves the problem of performance degradation of micromechanical gyroscopes when operating in harsh environments. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a partial schematic diagram of a micromechanical ring-nested gyroscope according to an embodiment of this application;
[0019] Figure 2 This is a schematic diagram of the support structure according to an embodiment of this application;
[0020] Figure 3 This is the third-order wine glass mode of the micromechanical ring nested gyroscope in the embodiments of this application;
[0021] Figure 4 This refers to the in-plane translational mode of the micromechanical ring nested gyroscope in the embodiments of this application;
[0022] Figure 5 This is the out-of-plane cylindrical mode of the micromechanical ring nested gyroscope in the embodiments of this application. Detailed Implementation
[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0024] Figure 1 This is a partial schematic diagram of a micromechanical ring-nested gyroscope according to an embodiment of this application.
[0025] like Figure 1 As shown, this embodiment provides a micromechanical nested ring gyroscope. The gyroscope includes a substrate and a support structure, a nested ring resonator, and multiple electrodes disposed on the substrate. The driving circuit is used to connect to the multiple electrodes, output driving signals to the corresponding electrodes, acquire detection signals, and obtain the angular velocity by processing the detection signals. The support structure, the nested ring resonator, and the multiple electrodes are all fabricated using SOI wafers with (100) crystal planes.
[0026] like Figure 2 As shown, the support structure includes an anchor point 1 and a flexible support component 2. The anchor point is connected to the substrate, and the flexible support component is connected to the anchor point and is used to support the nested ring resonators. The flexible support component is a bent and folded flexible support beam. The nested ring resonators include multiple concentrically arranged ring resonant structures 3. Each ring resonant structure has the same wall thickness, and the distance between any two ring resonant structures is the same. Multiple spoke structures 4 are arranged between any two ring resonant structures.
[0027] The micromechanical nested ring gyroscope operates in two third-order goblet-shaped degenerate modes, including a first mode and a second mode. The electrodes include multiple first driving electrodes and a first detection electrode for supporting the first mode, as well as a second driving electrode and a second detection electrode for supporting the second mode, and an anchor electrode disposed on the anchor point for providing a bias voltage.
[0028] In one specific embodiment of this application, there are 10 ring resonant structures, 8 anchor points and flexible support beams, and 16 sets of spoke structures evenly distributed around the circumference with the same wall thickness as the ring structures, used to connect adjacent ring resonant structures. There are 48 electrodes, with 24 electrodes evenly distributed inside the nested ring resonators, 16 electrodes distributed outside the nested ring resonators, and 8 electrodes distributed at the anchor points.
[0029] This micromechanical ring-nested gyroscope includes three degenerate modes in a goblet shape, one of which can be simply referred to as the first mode, and the other for detecting the second mode. Of the 48 electrodes mentioned above, the first driving electrodes 81, 82, and 83 support the first mode, and the first detection electrodes 71, 72, and 73 support the second mode. The second driving electrodes 61, 62, and 63 support the second mode, and the second detection electrodes 51, 52, and 53 support the second mode. Electrodes 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 201, 202, 203, 204, 205, 206, 207, 208, 209, and 210 serve to achieve stiffness decoupling between the first and second modes. Electrodes 301, 302, 303, and 304 are used to adjust the resonant frequency of the first mode, while electrodes 401, 402, 403, and 404 are used to adjust the resonant frequency of the second mode. The electrodes located on the anchor point structure are used to provide bias voltage.
[0030] The micromechanical nested ring gyroscope in this application operates in a set of degenerate third-order goblet modes with the lowest resonant frequency. In contrast, the resonant frequencies of the in-plane translational mode and the out-of-plane barrel mode, which are sensitive to external acceleration, are higher than those of the operating mode, thereby reducing the gyroscope's vibration sensitivity to external acceleration.
[0031] When a micromechanical gyroscope is working, the nested ring resonator will first be in the position of... Figure 3 The third-order wine glass mode shown enters a resonant state in the first mode and maintains a stable vibration frequency and amplitude. When the sensor frame rotates about the sensitive axis, the coupling effect generated by the Coriolis force will change the resonator as follows: Figure 3 The vibration state of the second mode of the third-order wine glass mode is shown. The current angular velocity can be obtained by measuring the vibration amplitude of the second mode.
[0032] Figure 4 This represents the in-plane translational mode of the micromechanical nested ring gyroscope. Figure 5This represents the out-of-plane barrel mode of the micromechanical nested ring gyroscope. When the number and wall thickness of the ring resonant structures are specific, their resonant frequencies can be made higher than the resonant frequency of the operating mode. The higher the resonant frequency, the less sensitive it is to external acceleration. Maintaining the resonant frequency of the gyroscope's operating mode at a relatively low level helps improve mechanical sensitivity and reduce mechanical thermal noise.
[0033] As can be seen from the above technical solution, this embodiment provides a micromechanical nested ring gyroscope, including a substrate and a support structure disposed on the substrate, a nested ring resonator, and multiple electrodes. The support structure includes anchor points and flexible support components. The anchor points are connected to the substrate, and the flexible support components are connected to the anchor points and are used to support the nested ring resonator. Due to the use of a support structure with flexible support components, the transmission of stress caused by temperature changes can be reduced. By adjusting the structural parameters, the resonant frequency of the gyroscope's operating mode is optimized, reducing the gyroscope's vibration sensitivity. This solves the problem of performance degradation of micromechanical gyroscopes when operating in harsh environments.
[0034] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0035] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.
[0036] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.
[0037] The technical solution provided by the present invention has been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.
Claims
1. A micromechanical nested ring gyroscope, characterized by The micro-mechanical nested ring gyroscope comprises a substrate and a support structure, a nested ring resonator and a plurality of electrodes disposed on the substrate, wherein: The support structure comprises an anchor point connected with the substrate and a flexible support component connected with the anchor point and used for supporting the nested ring resonator, the nested ring resonator comprises a plurality of ring resonant structures arranged concentrically, a plurality of spoke structures are disposed between any two of the ring resonant structures, the working mode of the micro-mechanical nested ring gyroscope is a set of degenerate third-order wineglass modes, the working mode has the lowest resonant frequency, and the resonant frequencies of the in-plane translational mode and the out-of-plane cylindrical mode are both higher than the resonant frequency of the working mode.
2. The micro-machined nested ring gyroscope of claim 1, wherein, The support structure, the nested ring resonator and the plurality of electrodes are all processed from an SOI wafer with a (100) crystal surface.
3. The micro-machined nested ring gyroscope of claim 1, wherein, The flexible support component is a curved and folded flexible support beam.
4. The micro-machined nested ring gyroscope of claim 1, wherein, The wall thickness of each of the ring resonant structures is the same, and the distance between any two of the ring resonant structures is the same.
5. The micro-machined nested ring gyroscope of claim 1, wherein, The wall thickness of any two of the spoke structures is the same.
6. The micro-machined nested ring gyroscope of claim 1, wherein, The two third-order wineglass degenerate modes comprise a first mode and a second mode, the electrodes comprise a plurality of first drive electrodes and a first detection electrode for supporting the first mode, and further comprise a second drive electrode and a second detection electrode for supporting the second mode.
7. A micromechanical nested ring gyroscope as claimed in claim 6, characterized in that, The electrodes further comprise an anchor point electrode disposed on the anchor point and used for providing a bias voltage.
Citation Information
Patent Citations
Geometric compensation type (100) silicon micromechanical annular resonant gyroscope
CN112444239A