Miniaturized coupler with integrated structure

Abstract

The invention belongs to the field of passive device wireless communication indoor distribution systems, and particularly discloses a miniaturized coupler with an integrated structure, which comprises a cavity, a coupler, a power supply, a power supply module, a power supply module, a power supply module, a power supply module and a power supply module, and is characterized in that the upper end surface of the cavity is provided with a cover plate; the cavity comprises a first side face, a second side face, a third side face and a fourth side face, the first side face and the second side face are oppositely arranged, and the third side face and the fourth side face are oppositely arranged. According to the invention, effective isolation of signals in different frequency ranges can be realized, the third-order intermodulation stability can be significantly improved, the standing-wave ratio is reduced, and the coupling degree debugging difficulty is improved.

Description

Technical Field

[0001] The present application belongs to the field of passive device wireless communication indoor distribution system, and specifically relates to a miniaturized integrated structure coupler. Background Art

[0002] The key performance indicators of the coupler include third-order intermodulation, coupling, standing wave ratio and insertion loss, which directly affect the transmission efficiency and quality of the RF signal. In traditional designs, the coupler cavity and connector adopt a separate structure, in which the connector is fixed to one side of the cavity. This design requires that the position of the connector fixing hole after the cavity and the cover are assembled must be accurately controlled during the manufacturing process, which places high demands on the machining accuracy of the fixing holes on the cavity and the cover, as well as the matching accuracy between the two. Such high-precision requirements not only increase production costs, but also lead to problems such as unstable third-order intermodulation performance, difficulty in optimizing the standing wave ratio, and difficulty in adjusting the coupling degree. Summary of the invention

[0003] The main purpose of the present application is to provide a miniaturized integrated structural coupler, which aims to improve the third-order intermodulation stability of the existing coupler and improve the difficulty of debugging the standing wave ratio and coupling degree.

[0004] To achieve the above objectives, this application provides the following technical solutions: A miniaturized integrated structural coupler, the coupler comprising: a cavity, the upper end surface of the cavity is provided with a cover plate; the cavity comprises a first side surface, a second side surface, a third side surface and a fourth side surface, wherein the first side surface and the second side surface are arranged opposite to each other, and the third side surface and the fourth side surface are arranged opposite to each other.

[0005] Optionally, the outer wall of the first side is provided with a signal input port, the outer wall of the second side is provided with a signal output port, and the outer wall of the third side is provided with a signal coupling port, and the signal input port, signal output port and signal coupling port are respectively die-cast integrally with the cavity.

[0006] Optionally, a high-power resistor and a resistor fixing member are provided on the inner wall of the third side surface, and the high-power resistor is fixed on the third side surface based on the resistor fixing member, wherein the resistance value of the high-power resistor is 47Ω - 56Ω.

[0007] Optionally, a coupling transmission line is provided in the cavity, one end of the coupling transmission line is connected to the signal coupling port, and the other end of the coupling transmission line is connected to the high-power resistor.

[0008] Optionally, a through transmission line is further provided in the cavity, one end of the through transmission line is connected to the signal input port, and the other end of the through transmission line is connected to the signal output port.

[0009] Optionally, the inner wall of the third side surface is provided with a first boss, and the inner wall of the fourth side surface is provided with a second boss, and the first boss and the second boss are provided correspondingly; the inner wall of the third side surface is also provided with a first fixing groove, and the inner wall of the fourth side surface is also provided with a second fixing groove, and the second fixing groove and the first fixing groove are provided correspondingly.

[0010] Optionally, a first low-frequency support block, a second low-frequency support block, a first high-frequency support block and a second high-frequency support block are also provided in the cavity, and one end of the first low-frequency support block, the second low-frequency support block, the first high-frequency support block and the second high-frequency support block are all inserted into the first fixing groove, and the other ends of the first low-frequency support block, the second low-frequency support block, the first high-frequency support block and the second high-frequency support block are all inserted into the second fixing groove.

[0011] Optionally, a first slot is provided on the first low-frequency support block and the second low-frequency support block, a second slot is provided on the first high-frequency support block and the second high-frequency support block, and the depth of the first slot is greater than that of the second slot, and the coupled transmission line and the through transmission line are placed in the first slot and the second slot.

[0012] Optionally, the distance between the first low-frequency support block and the second low-frequency support block is equal to the distance between the first high-frequency support block and the second high-frequency support block, and is greater than the distance between the first low-frequency support block and the first high-frequency support block.

[0013] Optionally, the signal input port, the signal output port and the signal coupling port are each provided with grooves, and connector pins are provided in the grooves.

[0014] Compared with the prior art, this application can bring the following beneficial effects: This application not only improves the consistency and accuracy of the coupler, but also enhances the overall robustness and reliability of the coupler by integrating the signal input port, signal output port, and signal coupling port with the cavity. At the same time, this application achieves effective isolation of signals in different frequency ranges, reduces intermodulation distortion, and optimizes impedance matching by setting low-frequency support blocks and high-frequency support blocks in the cavity and using slots of different depths to fix the transmission line, thereby significantly improving the third-order intermodulation stability, reducing the standing wave ratio, and improving the difficulty of coupling degree debugging. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view of the external structure of a miniaturized integrated structural coupler provided by one embodiment of the present application; Figure 2 is a schematic diagram of the internal structure of a miniaturized integrated structural coupler provided by another embodiment of the present application; Figure 3 is a schematic diagram of the internal structure of a miniaturized integrated structural coupler provided by another embodiment of the present application; Figure 4 It is a bottom view of the external structure of a miniaturized integrated structural coupler provided by another embodiment of the present application; Figure 5 This is a schematic diagram of the connection between the groove and the connector pin provided by an embodiment of the present application; Figure 6 is an enlarged schematic diagram of the connection between the groove and the connector pin provided in another embodiment of the present application; Figure 7 This is a schematic diagram of the connection between a support block and a transmission line provided in another embodiment of the present application.

[0016] The following are the descriptions of the reference numerals: 1. Cavity; 101. First side; 102. Second side; 103. Third side; 104. Fourth side; 2. Cover; 3. Groove; 4. Connector pin; 5. Resistor fixing piece; 6. High-power resistor; 7. Coupled transmission line; 8. Through transmission line; 9. Screw; 1001. First low-frequency support block; 1002. Second low-frequency support block; 1003. First slot; 1101. First high-frequency support block; 1102. Second high-frequency support block; 1103. Second slot; 12. First boss; 13. First fixing slot; 14. Second boss; 15. Second fixing slot; 16. Signal input port; 17. Signal output port; 18. Signal coupling port. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0019] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0021] Figure 1 A front view of the external structure of a miniaturized integrated structural coupler provided by an exemplary embodiment of the present application, Figure 2 and Figure 3 A schematic diagram of the internal structure of a miniaturized integrated structural coupler provided for another exemplary embodiment of the present application; Figure 4 A bottom view of the external structure of a miniaturized integrated structural coupler provided by another exemplary embodiment of the present application. Figures 1 to 4 As shown, the coupler includes: a cavity 1, the upper end surface of the cavity 1 is provided with a cover plate 2, and the lower end surface of the cavity 1 is fixed by a screw 9; the cavity 1 includes a first side surface 101, a second side surface 102, a third side surface 103 and a fourth side surface 104, wherein the first side surface 101 and the second side surface 102 are arranged opposite to each other, and the third side surface 103 and the fourth side surface 104 are arranged opposite to each other.

[0022] In another exemplary embodiment, the outer wall of the first side 101 is provided with a signal input port 16, the outer wall of the second side 102 is provided with a signal output port 17, and the outer wall of the third side 103 is provided with a signal coupling port 18, and the signal input port 16, signal output port 17 and signal coupling port 18 are respectively die-cast integrally with the cavity 1.

[0023] In the present application, the signal input port 16 is used to receive the input RF signal, and the input port is the entrance of the RF signal into the coupler. The signal output port 17 is used to transmit the RF signal processed by the coupler to other devices or systems. The signal coupling port 18 is used to extract a small part of the energy of the input signal from the main transmission path (i.e., the path from the signal input port 16 to the signal output port 17) so as to monitor the performance of the entire communication system in real time.

[0024] This embodiment, by integrally die-casting the signal input port 16, the signal output port 17 and the signal coupling port 18 with the cavity 1, can, on the one hand, reduce the impact of errors in the assembly process on the final product. In traditional designs, the port and the cavity are manufactured separately and then assembled, which requires very precise control of the position of the port fixing hole during assembly, while integral die-casting avoids this high-precision requirement, thereby improving the consistency and accuracy of the overall structure of the coupler. In addition, the integrated design makes the entire coupler more sturdy and durable, and without the need for additional connection points or interfaces, it can reduce areas that may cause mechanical stress concentration or fatigue damage, helping to extend the service life of the coupler and improve its reliability. On the other hand, it can improve electrical performance, specifically: 1. One-piece die-casting reduces the discontinuity caused by poor assembly, making the electromagnetic field distribution in the coupler more uniform and stable, thereby improving the consistency of nonlinear distortion parameters such as third-order intermodulation; 2. Tighter integration reduces the number of reflection points in the signal path in the coupler and their influence, which helps to optimize impedance matching and reduce the standing wave ratio (VSWR), which means that more energy is effectively transmitted rather than reflected back; 3. Due to the integration of the physical structure, for application scenarios that require adjustment of the coupling degree, debugging becomes more direct and controllable, because there is no need to consider the uncertainties caused by changes in the relative positions of different components.

[0025] In summary, the present application can effectively solve many problems existing in the traditional separate design by adopting the technical means of one-piece die-casting, thereby improving the overall performance of the miniaturized one-piece structural coupler.

[0026] In another exemplary embodiment, a high-power resistor 6 and a resistor fixing member 5 are provided on an inner wall of the third side surface 103 , and the high-power resistor 6 is fixed to the third side surface 103 based on the resistor fixing member 5 .

[0027] In this embodiment, the rated power of the high-power resistor 6 is 12W-20W, and the resistance is 47Ω - 56Ω. By setting the high-power resistor 6 on the third side 103, it is possible to consume and absorb excess energy in the input signal, which helps to control the signal level or achieve specific impedance matching and other functions.

[0028] The resistor fixing member 5 adopts a threaded spring washer, which can not only provide good mechanical stability for the high-power resistor 6, but also effectively dissipate heat for the high-power resistor 6 when necessary, while maintaining good connection between the high-power resistor 6 and other components in the cavity 1.

[0029] In another exemplary embodiment, a coupling transmission line 7 is disposed in the cavity 1 , one end of the coupling transmission line 7 is connected to the signal coupling port 18 , and the other end of the coupling transmission line 7 is connected to the high-power resistor 6 .

[0030] In this embodiment, the main function of the coupled transmission line 7 is to extract a small portion of energy from the RF signal received at the signal input port 16 and guide it to the high-power resistor 6. The high-power resistor 6 can absorb this part of the coupled signal energy to prevent it from being reflected back into the system and causing interference. Furthermore, since the coupled signal is guided to the independent high-power resistor 6 instead of directly returning to the main transmission path, it helps to reduce the impact on the original signal quality and ensure the signal integrity on the main transmission path.

[0031] In addition, since the coupled transmission line 7 can extract a certain proportion of radio frequency signals, these signals can be used for various forms of monitoring and control. For example, these signals can be used for power detection, fault diagnosis or as feedback signals in automatic control systems.

[0032] In summary, the coupled transmission line 7 is designed to achieve accurate extraction of the RF signal and effectively direct this part of the signal to a specific destination (such as the high-power resistor 6), thereby supporting system monitoring, testing and other auxiliary functions while maintaining optimal performance of the main signal path.

[0033] In another exemplary embodiment, a through transmission line 8 is further disposed in the cavity 1 , one end of the through transmission line 8 is connected to the signal input port 16 , and the other end of the through transmission line 8 is connected to the signal output port 17 .

[0034] In this embodiment, the through transmission line 8 connects the signal input port 16 and the signal output port 17, and its function is to directly transmit the RF signal entering the coupler from the input end to the output end, thereby providing a low-loss, high-efficiency transmission path. Through this path, the attenuation and distortion of the RF signal during the transmission process can be minimized, thereby ensuring the signal quality.

[0035] In another exemplary embodiment, the inner wall of the third side surface 103 is provided with a first boss 12, and the inner wall of the fourth side surface 104 is provided with a second boss 14, and the first boss 12 and the second boss 14 are provided correspondingly; the inner wall of the third side surface 103 is also provided with a first fixing groove 13, and the inner wall of the fourth side surface 104 is also provided with a second fixing groove 15, and the second fixing groove 15 and the first fixing groove 13 are provided correspondingly; the cavity 1 is also provided with a first low-frequency support block 1001, a second low-frequency support block 1002, a first high-frequency support block 1101 and a second high-frequency support block 1102, and one end of the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101 and the second high-frequency support block 1102 are all inserted into the first fixing groove 13, and the other end is inserted into the second fixing groove 15.

[0036] In this embodiment, the first boss 12 and the second boss 14 provide clear positioning points to help the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101 and the second high-frequency support block 1102 to be accurately aligned and inserted into the first fixing groove 13 and the second fixing groove 15, thereby ensuring the consistency and accuracy of the installation positions of the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101 and the second high-frequency support block 1102 in the cavity 1. In addition, the first boss 12 and the second boss 14, by closely fitting with the first fixing groove 13 and the second fixing groove 15, help prevent the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101 and the second high-frequency support block 1102 from being displaced due to vibration or external force during use, thereby ensuring their stability. The first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101 and the second high-frequency support block 1102 can maintain stability, optimize the magnetic field distribution, and thus reduce mutual interference between low-frequency signals and high-frequency signals.

[0037] It should be noted that the first fixing groove 13 and the second fixing groove 15 are used to accurately insert and fix the two ends of the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101 and the second high-frequency support block 1102 to ensure that they maintain the correct position in the cavity 1. It should be noted that the main function of the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101 and the second high-frequency support block 1102 is to reduce the direct interaction between signals in different frequency ranges through physical separation. If the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101 and the second high-frequency support block 1102 cannot maintain the correct position in the cavity 1, this physical interval will be weakened or even disappear, which will cause unnecessary coupling or interference between the low-frequency signal and the high-frequency signal. In addition, if the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101, and the second high-frequency support block 1102 are not positioned properly, the uniformity and stability of the electromagnetic field inside the coupler will be affected, thereby causing the third-order intermodulation parameter index to be unstable. Furthermore, if the first low-frequency support block 1001, the second low-frequency support block 1002, the first high-frequency support block 1101, and the second high-frequency support block 1102 are not positioned properly, additional reflection points will be introduced, thereby increasing the standing wave ratio (VSWR), causing more energy to be reflected instead of effectively transmitted, thereby reducing the efficiency of the system and possibly causing other nonlinear distortion phenomena.

[0038] In summary, this embodiment enables high-frequency signals and low-frequency signals to coexist better in the coupler without interfering with each other by providing the first low-frequency support block 1001 , the second low-frequency support block 1002 , the first high-frequency support block 1101 and the second high-frequency support block 1102 .

[0039] In another exemplary embodiment, Figure 7 As shown, the first low-frequency support block 1001 and the second low-frequency support block 1002 are both provided with a first slot 1003, the first high-frequency support block 1101 and the second high-frequency support block 1102 are both provided with a second slot 1103, and the depth of the first slot 1003 is greater than that of the second slot 1103, and the coupled transmission line 7 and the through transmission line 8 are placed in the first slot 1003 and the second slot 1103.

[0040] In this embodiment, the depth of the first slot 1003 may be, for example, 5 mm, and the depth of the second slot 1103 may be, for example, 3 mm. First, by providing slots on the low-frequency support block and the high-frequency support block, respectively, it is possible to ensure that the positions of the coupled transmission line 7 and the through transmission line 8 in the cavity 1 remain fixed, and it is possible to avoid positional deviation caused by external factors (such as vibration) that affects the transmission quality of the RF signal.

[0041] Secondly, the reason why the depth of the first slot 1003 is set to be greater than that of the second slot 1103 is mainly based on the consideration of the characteristics of signals of different frequencies. Since the wavelength of low-frequency signals is longer, a larger space is required to propagate to reduce reflection and loss; while the wavelength of high-frequency signals is shorter and can be effectively propagated in a smaller space. Therefore, by setting slots of different depths to accommodate the coupled transmission line 7 and the through transmission line 8 at the same time, propagation paths that meet the characteristics of low-frequency signals and high-frequency signals can be provided at the same time.

[0042] Furthermore, by using slots with different depths, the physical spacing effect formed by the low-frequency support block and the high-frequency support block can be further enhanced, thereby further enhancing the physical isolation between the low-frequency signal and the high-frequency signal.

[0043] In summary, this embodiment adopts slots of different depths and cooperates with the design of low-frequency support blocks and high-frequency support blocks. This is the result of a deep understanding of electromagnetic principles and radio frequency technology. This design can effectively manage the behavior of low-frequency signals and high-frequency signals in the cavity 1, ensuring that they work efficiently and stably in their respective frequency bands, while avoiding mutual interference across frequency bands, and ultimately achieving good isolation of low-frequency signals and high-frequency signals.

[0044] In another exemplary embodiment, please continue to refer to Figure 2 and Figure 3 The distance between the first low-frequency support block 1001 and the second low-frequency support block 1002 is equal to the distance between the first high-frequency support block 1101 and the second high-frequency support block 1102 , and is greater than the distance between the first low-frequency support block 1001 and the first high-frequency support block 1101 .

[0045] In this embodiment, the distance between the first low-frequency support block 1001 and the second low-frequency support block 1002 and the distance between the first high-frequency support block 1101 and the second high-frequency support block 1102 can be set to 15 mm, for example. By setting the distance between the first low-frequency support block 1001 and the second low-frequency support block 1002 and the distance between the first high-frequency support block 1101 and the second high-frequency support block 1102 to be equal, a uniform and symmetrical structural layout can be formed, which is helpful to create a stable electromagnetic environment in these specific areas. The distance between the first low-frequency support block 1001 and the first high-frequency support block 1101 can be set to 10 mm, for example. By setting the distance between the first low-frequency support block 1001 and the first high-frequency support block 1101 to be smaller, an effective barrier can be formed between the first low-frequency support block 1001 and the first high-frequency support block 1101, which can further reduce the mutual interference between the low-frequency signal and the high-frequency signal.

[0046] like Figure 5 and Figure 6 As shown, in another exemplary embodiment, the signal input port 16 , the signal output port 17 and the signal coupling port 18 are all provided with grooves 3 , and connector pins 4 are provided in the grooves 3 .

[0047] In this embodiment, the connector pin 4 adopts a high-precision design to ensure a close fit with the external connection device, thereby reducing contact resistance and improving the quality of signal transmission. In addition, the connector pin 4 also adopts a petal opening design, which increases the elasticity of the connector pin 4, so that the connector pin 4 can better adapt to multiple plugging and unplugging without being easily damaged or losing contact force, thereby ensuring its reliability in long-term use. Due to the above-mentioned design of the connector pin 4, the insertion loss (i.e., the energy lost when the signal passes through the connector) can be significantly reduced, which means that more signal energy can be effectively transmitted to the next component. At the same time, this design can also reduce the standing wave ratio (VSWR), improve impedance matching, and thus improve the performance of the entire communication system.

[0048] The groove 3 is made of polytetrafluoroethylene (PTFE) medium, which is a material with excellent dielectric properties. Its dielectric constant is low and very stable, and is almost unaffected by temperature changes, which helps to maintain stable electrical properties, especially in high-frequency applications, and can reduce phase delay and reflection. In addition, the polytetrafluoroethylene medium itself also has a good dielectric loss factor, which has little effect on signal attenuation, helping to maintain high signal integrity.

[0049] Furthermore, the design of the groove 3 using the polytetrafluoroethylene medium further improves the physical stability of the connector pin 4 and can provide additional support to prevent the connector pin 4 from loosening or shifting during use.

[0050] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A miniaturized integrated structural coupler, characterized in that: The coupler comprises: A cavity (1), wherein the upper end surface of the cavity (1) is provided with a cover plate (2); The cavity (1) comprises a first side surface (101), a second side surface (102), a third side surface (103) and a fourth side surface (104), wherein the first side surface (101) and the second side surface (102) are arranged opposite to each other, and the third side surface (103) and the fourth side surface (104) are arranged opposite to each other.

2. A miniaturized integrated structural coupler according to claim 1, characterized in that: The outer wall of the first side surface (101) is provided with a signal input port (16), the outer wall of the second side surface (102) is provided with a signal output port (17), and the outer wall of the third side surface (103) is provided with a signal coupling port (18); the signal input port (16), the signal output port (17) and the signal coupling port (18) are respectively die-casted integrally with the cavity (1).

3. A miniaturized integrated structural coupler according to claim 2, characterized in that: A high-power resistor (6) and a resistor fixing member (5) are provided on the inner wall of the third side surface (103); the high-power resistor (6) is fixed to the third side surface (103) based on the resistor fixing member (5); the resistance value of the high-power resistor (6) is 47Ω-56Ω.

4. A miniaturized integrated structural coupler according to claim 3, characterized in that: A coupling transmission line (7) is arranged in the cavity (1), one end of the coupling transmission line (7) is connected to the signal coupling port (18), and the other end of the coupling transmission line (7) is connected to the high-power resistor (6).

5. The miniaturized integrated structural coupler according to claim 2, characterized in that: A through transmission line (8) is also provided in the cavity (1), one end of the through transmission line (8) is connected to the signal input port (16), and the other end of the through transmission line (8) is connected to the signal output port (17).

6. The miniaturized integrated structural coupler according to claim 1, characterized in that: The inner wall of the third side surface (103) is provided with a first boss (12), and the inner wall of the fourth side surface (104) is provided with a second boss (14), and the first boss (12) and the second boss (14) are provided correspondingly; the inner wall of the third side surface (103) is also provided with a first fixing groove (13), and the inner wall of the fourth side surface (104) is also provided with a second fixing groove (15), and the second fixing groove (15) and the first fixing groove (13) are provided correspondingly.

7. A miniaturized integrated structural coupler according to claim 6, characterized in that: A first low-frequency support block (1001), a second low-frequency support block (1002), a first high-frequency support block (1101) and a second high-frequency support block (1102) are also arranged in the cavity (1); one end of the first low-frequency support block (1001), the second low-frequency support block (1002), the first high-frequency support block (1101) and the second high-frequency support block (1102) are all inserted into the first fixing groove (13); and the other ends of the first low-frequency support block (1001), the second low-frequency support block (1002), the first high-frequency support block (1101) and the second high-frequency support block (1102) are all inserted into the second fixing groove (15).

8. The miniaturized integrated structural coupler according to claim 7, characterized in that: The first low-frequency support block (1001) and the second low-frequency support block (1002) are both provided with a first slot (1003), the first high-frequency support block (1101) and the second high-frequency support block (1102) are both provided with a second slot (1103), and the depth of the first slot (1003) is greater than that of the second slot (1103), and the coupled transmission line (7) and the through transmission line (8) are placed in the first slot (1003) and the second slot (1103).

9. The miniaturized integrated structural coupler according to claim 7, characterized in that: The distance between the first low-frequency support block (1001) and the second low-frequency support block (1002) is equal to the distance between the first high-frequency support block (1101) and the second high-frequency support block (1102), and is greater than the distance between the first low-frequency support block (1001) and the first high-frequency support block (1101).

10. The miniaturized integrated structural coupler according to claim 2, characterized in that: The signal input port (16), the signal output port (17) and the signal coupling port (18) are all provided with grooves (3), and the grooves (3) are provided with connector pins (4).

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