Optical element and method for manufacturing the same, optical device and method for manufacturing the same

Abstract

The present disclosure provides an optical element and a manufacturing method thereof, an optical device and a manufacturing method thereof. The optical element includes a substrate, a first anti-reflection film layer, a functional film layer, and a second anti-reflection film layer. The first anti-reflection film layer is located on one side of the substrate. The functional film layer is located on the side of the first anti-reflection film layer away from the substrate, and is used to generate heat. The second anti-reflection film layer is located on the side of the functional film layer away from the first anti-reflection film layer. The first anti-reflection film layer and the second anti-reflection film layer both include multilayer film layers with different refractive indices, and the transmittance of the optical element to light is greater than or equal to a preset value.

Description

Technical Field

[0001] The present disclosure relates to the field of optical elements, and more particularly, to an optical element, an optical device, a method for manufacturing an optical element, and a method for manufacturing an optical device. Background Art

[0002] With the rapid development of the field of intelligent driving, technologies such as LiDAR and head-up display (HUD) are being used more and more widely in automobiles. Usually, light-transmitting elements such as optical windows are needed to block direct contact between devices such as LiDAR and HUD and the external environment to prevent LiDAR and HUD from being contaminated by the external environment, thereby affecting normal operation. However, when the temperature difference between the inside and outside of the optical window is large and the humidity is high, fog or frost will form on the inside and outside of the window. Fog or frost attached to the window surface will cause refraction and reflection of light, which can easily affect the transmission of optical signals such as LiDAR through the window.

[0003] At present, in order to remove fog or frost on the window surface, a transparent conductive film is often attached to the window surface and energized to convert electrical energy into thermal energy, heating the window surface to achieve the effect of defogging and deicing. However, devices such as laser radar and HUD have high requirements for the transmittance and reflectivity of external visible light and / or near-infrared light, such as high transmittance and low reflectivity, so the structure and / or processing technology of the transparent conductive film attached to the window surface are relatively high.

[0004] However, most transparent conductive films on the market today cannot have both high conductivity and low reflectivity (reflectivity refers to the reflectivity of light incident at a large angle, such as 50°). For example, when light in the wavelength range of 200nm~2000nm±100nm is incident on a common transparent conductive film, its reflectivity is about 3%. Summary of the invention

[0005] In one aspect, the present disclosure provides an optical element. The optical element includes a substrate, a first anti-reflection film layer, a functional film layer, and a second anti-reflection film layer. The first anti-reflection film layer is located on one side of the substrate. The functional film layer is located on the side of the first anti-reflection film layer away from the substrate, and is used to generate heat. The second anti-reflection film layer is located on the side of the functional film layer away from the first anti-reflection film layer. The first anti-reflection film layer and the second anti-reflection film layer each include a multilayer film layer with different refractive indices, so that the transmittance of the optical element to light is greater than or equal to a preset value.

[0006] In one embodiment, the preset value is greater than or equal to 92%. The reflectivity of the optical element to light is less than or equal to 1%.

[0007] In one embodiment, the thickness of the first anti-reflection film layer is in the range of 50 nm to 2000 nm. The first anti-reflection film layer includes a first film layer and a second film layer stacked alternately. The side of the first anti-reflection film layer close to the substrate is the first film layer. The side of the first anti-reflection film layer away from the substrate is the first film layer or the second film layer. The refractive index of the first film layer is in the range of 1.3 to 1.7. The refractive index of the second film layer is in the range of 1.8 to 4.0.

[0008] In one embodiment, the first film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride. The second film layer includes one or more of titanium, tantalum, niobium, zirconium, hafnium, silicon oxide, nitride or hydride. The number of the first film layer and the second film layer is in the range of 1 to 7.

[0009] In one embodiment, the thickness of the second anti-reflection film layer is in the range of 30 nm to 400 nm. The second anti-reflection film layer includes a third film layer and a fourth film layer stacked alternately. The side of the second anti-reflection film layer close to the functional film layer is the third film layer. The side of the second anti-reflection film layer away from the functional film layer is the third film layer or the fourth film layer. The refractive index of the third film layer is in the range of 1.3 to 1.7, and the refractive index of the fourth film layer is in the range of 1.8 to 4.0.

[0010] In one embodiment, the third film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride. The fourth film layer includes one or more of titanium, tantalum, niobium, zirconium, hafnium, silicon oxide, nitride or hydride. The number of the third film layer and the fourth film layer are both in the range of 1 to 7.

[0011] In one embodiment, the thickness of the functional film layer is in the range of 20 nm to 600 nm, the sheet resistance of the functional film layer is in the range of 2Ω / sq to 200Ω / sq, and the refractive index of the functional film layer to light is in the range of 2.0 to 2.3.

[0012] In one embodiment, the functional film layer includes one or more of a metal material, a semiconductor material and an alloy material. The metal material includes one or more of gold, silver, copper and aluminum. The semiconductor material includes one or more of indium tin oxide and aluminum zinc oxide.

[0013] In one embodiment, the functional film layer includes oxygen element, wherein the proportion of oxygen element in all elements included in the functional film layer is in the range of 40% to 75%.

[0014] In one embodiment, the light absorption rate of the functional film layer is less than or equal to 2.5%.

[0015] In one embodiment, at least one of the first anti-reflection film layer, the functional film layer and the second anti-reflection film layer is formed by an evaporation coating process, a sputtering coating process or a vapor deposition coating process.

[0016] In one embodiment, the optical element further comprises a bonding layer between the substrate and the first anti-reflection film layer. The thickness of the bonding layer is in the range of 5 nm to 100 nm. The bonding layer comprises a semiconductor material, wherein the semiconductor material comprises one or more of titanium, tantalum, niobium, zirconium, hafnium, silicon and oxides thereof.

[0017] In one embodiment, the optical element further comprises a protective layer located on a side of the substrate away from the first anti-reflection film layer, wherein the protective layer comprises at least one of a waterproof film layer and a hard film layer.

[0018] In one embodiment, the optical element further includes a third anti-reflection film layer. The third anti-reflection film layer is located between the substrate and the protective layer. The thickness of the third anti-reflection film layer is in the range of 100 nm to 500 nm. The third anti-reflection film layer includes a fifth film layer and a sixth film layer alternately stacked. The number of the fifth film layer and the sixth film layer is in the range of 1 to 7. The refractive index of the fifth film layer is in the range of 1.3 to 1.7. The refractive index of the sixth film layer is in the range of 1.8 to 4.0. The fifth film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride. The sixth film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon.

[0019] In one embodiment, the thickness of the protective layer is in the range of 5 nm to 50 nm. The protective layer includes a fluorine-containing organic compound.

[0020] In one embodiment, the equivalent optical path of the first anti-reflection film layer, the functional film layer and the second anti-reflection film layer is an odd multiple of 1 / 4λ, where λ is the wavelength of the light. An odd multiple of 1 / 4λ=n1×d1+n2×d2+n3×d3, where n1 is the refractive index of the first anti-reflection film layer, d1 is the thickness of the first anti-reflection film layer, n2 is the refractive index of the second anti-reflection film layer, d2 is the thickness of the second anti-reflection film layer, n3 is the refractive index of the functional film layer, and d3 is the thickness of the functional film layer.

[0021] In one embodiment, the substrate includes one or more of a glass material, a plastic material, and a ceramic material.

[0022] In one embodiment, the light absorption rate A of the functional film layer and the oxygen element ratio Q satisfy: 10≤Q / A≤28.

[0023] Another aspect of the present disclosure provides an optical device, which includes a light source and the optical element described above. The light emitted by the light source enters the second anti-reflection film layer of the optical element.

[0024] Another aspect of the present disclosure provides a method for manufacturing an optical element. The method includes: providing a first anti-reflection film layer on one side of a substrate; providing a functional film layer on a side of the first anti-reflection film layer away from the substrate, the functional film layer being used to generate heat; and providing a second anti-reflection film layer on a side of the functional film layer away from the first anti-reflection film layer. The first anti-reflection film layer and the second anti-reflection film layer both include multilayer film layers with different refractive indices, so that the transmittance of the optical element to light is greater than or equal to a preset value.

[0025] In one embodiment, at least one of the first anti-reflection film layer, the functional film layer and the second anti-reflection film layer is formed by an evaporation coating process, a sputtering coating process or a vapor deposition coating process.

[0026] In one embodiment, the functional film layer includes one or more of gold, silver, copper, aluminum, indium tin oxide, and aluminum zinc oxide. The functional film layer is arranged on the side of the first anti-reflection film layer away from the substrate, including: setting the temperature T in the coating chamber to be in the range of 50°C to 250°C, the vacuum degree P to be in the range of 0.0001 Pa to 0.1 Pa, and the oxygen filling amount F to be in the range of 1 sccm to 500 sccm, so that the proportion of oxygen elements in the functional film layer to all elements in the functional film layer is in the range of 40% to 75%.

[0027] In one embodiment, the temperature T, vacuum degree P and oxygen filling amount F in the coating chamber satisfy: 0.1≤-log(P)×T / F≤750.

[0028] In one embodiment, the oxygen partial pressure X, vacuum degree P and oxygen filling amount F in the coating chamber satisfy: X=kF / P, wherein k is in the range of 0.005-0.02.

[0029] In one embodiment, the sheet resistance R of the functional film layer, the oxygen partial pressure X in the coating chamber, and the temperature T in the coating chamber satisfy: R = -0.0005X 3 +0.15084X 2 -11.405X+275.61+0.031T.

[0030] In one embodiment, providing a first anti-reflection film layer on one side of the substrate comprises: alternately stacking a first film layer and a second film layer on one side of the substrate to form the first anti-reflection film layer. The thickness of the first anti-reflection film layer is in the range of 50 nm to 2000 nm; the number of the first film layer and the second film layer is in the range of 1 to 7; the first film layer comprises one or more of silicon oxide, aluminum oxide and magnesium fluoride, and the refractive index of the first film layer is in the range of 1.3 to 1.7; and the second film layer comprises one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon, and the refractive index of the second film layer is in the range of 1.8 to 4.0.

[0031] In one embodiment, the second anti-reflection film layer is provided on the side of the functional film layer away from the first anti-reflection film layer, including: alternately stacking a third film layer and a fourth film layer on the side of the functional film layer away from the first anti-reflection film layer to form the second anti-reflection film layer. The thickness of the second anti-reflection film layer is in the range of 30 nm to 400 nm; the number of the third film layer and the fourth film layer is in the range of 1 to 7; the third film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride, and the refractive index of the third film layer is in the range of 1.3 to 1.7; and the fourth film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon, and the refractive index of the fourth film layer is in the range of 1.8 to 4.0.

[0032] In one embodiment, the method further comprises: disposing a bonding layer on one side of the substrate, wherein the bonding layer comprises a semiconductor material. Disposing a first anti-reflection film layer on one side of the substrate comprises: disposing the first anti-reflection film layer on one side of the bonding layer.

[0033] In one embodiment, the method further comprises: providing a protective layer on a side of the substrate away from the first anti-reflection film layer, wherein the protective layer comprises at least one of a waterproof film layer and a hard film layer.

[0034] In one embodiment, the method further includes: disposing a third anti-reflection film layer on a side of the substrate away from the first anti-reflection film layer; disposing a protective layer on a side of the substrate away from the first anti-reflection film layer, including: disposing a protective layer on a side of the third anti-reflection film layer away from the substrate.

[0035] In one embodiment, the third anti-reflection film layer is provided on the side of the substrate away from the first anti-reflection film layer, including: alternately stacking a fifth film layer and a sixth film layer on the side of the substrate away from the first anti-reflection film layer to form the third anti-reflection film layer. The number of the fifth film layer and the sixth film layer are both in the range of 1 to 7; the refractive index of the fifth film layer is in the range of 1.3 to 1.7, and the refractive index of the sixth film layer is in the range of 1.8 to 4.0; and the fifth film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride, and the sixth film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon.

[0036] Another aspect of the present disclosure provides a method for manufacturing an optical device. The method includes: providing a light source; and providing an optical element on one side of the light source according to the method described above. The light emitted by the light source is incident on the second anti-reflection film layer of the optical element. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Other features, objectives and advantages of the present disclosure will become more apparent through the following detailed description of non-limiting embodiments in conjunction with the accompanying drawings. In the accompanying drawings:

[0038] Figure 1is a schematic structural diagram of an optical element provided according to an exemplary embodiment of the present disclosure;

[0039] Figure 2 is a schematic structural diagram of a first antireflection film layer provided according to an exemplary embodiment of the present disclosure;

[0040] Figure 3 is a schematic structural diagram of a second antireflection film layer provided according to an exemplary embodiment of the present disclosure;

[0041] Figure 4 is a schematic structural diagram of an optical element provided according to another exemplary embodiment of the present disclosure;

[0042] Figure 5 is a schematic structural diagram of an optical element provided according to another exemplary embodiment of the present disclosure;

[0043] Figure 6 is a schematic structural diagram of an optical element provided according to another exemplary embodiment of the present disclosure;

[0044] Figure 7 and Figure 8 The reflectivity and transmittance curves of the optical element in Example 1 to light are shown respectively;

[0045] Fig. 9 It shows the change of the sheet resistance of the functional film layer and the content of oxygen in the functional film layer when the thickness of the functional film layer in Example 2 is constant;

[0046] Fig.10 and Fig.11 The reflectivity curves of the optical element in Example 5 to light at different incident angles are shown respectively;

[0047] Fig.12 shows the light transmittance curve of the optical element in Example 5;

[0048] Fig.13 is a flowchart of a method for manufacturing an optical element according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0049] In order to better understand the present disclosure, various aspects of the present disclosure will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present disclosure, and are not intended to limit the scope of the present disclosure in any way.

[0050] It should be noted that in this specification, the expressions first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the features, especially do not represent any order of precedence. Therefore, without departing from the teaching of the present disclosure, the first anti-reflection film layer discussed in the present disclosure may also be referred to as the second anti-reflection film layer, and vice versa.

[0051] In the drawings, the thickness, size and shape of the components have been slightly adjusted for ease of illustration. The drawings are for illustration only and are not drawn strictly to scale. As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not as terms of degree, and are intended to account for the inherent deviations in measurements or calculations that would be recognized by one of ordinary skill in the art.

[0052] In addition, in this document, when describing that one part is located "on" another part, for example, the meaning of "on", "above" and "over" should be interpreted in the broadest manner, so that "on" not only means "directly on something", but also includes the meaning of "on something" with intervening features or layers in between, and "above" or "over" does not absolutely mean being above based on the direction of gravity, nor does it only mean the meaning of "on something" or "above something", but also includes the meaning of "on something" or "over something" with no intervening features or layers in between (i.e., directly on something).

[0053] It should also be understood that expressions such as "include", "including", "have", "contain" and / or "comprising" are open rather than closed expressions in this specification, which indicate the presence of the stated features, elements and / or components, but do not exclude the presence of one or more other features, elements, components and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire list of features rather than just the individual elements in the list. In addition, when describing embodiments of the present disclosure, "may" is used to mean "one or more embodiments of the present disclosure". And, the term "exemplarily" is intended to refer to an example or illustration.

[0054] This document is described with reference to schematic diagrams of exemplary embodiments. The exemplary embodiments disclosed herein should not be construed as limited to the specific shapes and sizes shown, but include various equivalent structures that can achieve the same functions and shape and size deviations caused by, for example, manufacturing. The positions shown in the drawings are schematic in nature and are not intended to limit the positions of the components.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0056] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other. In addition, unless explicitly limited or contradictory to the context, the specific steps included in the method described in the present disclosure are not necessarily limited to the order described, but can be performed in any order or in parallel. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0057] The optical element, the optical device, the method for manufacturing the optical element, and the method for manufacturing the optical device according to the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0058] Figure 1 is a schematic structural diagram of an optical element 1000 provided according to an exemplary embodiment of the present disclosure.

[0059] The optical element 1000 may include a substrate 1100, a first anti-reflection film layer 1200, a functional film layer 1300, and a second anti-reflection film layer 1400. The first anti-reflection film layer 1200 may be located on one side of the substrate 1100. The functional film layer 1300 may be located on the side of the first anti-reflection film layer 1200 away from the substrate 1100, for generating heat. The second anti-reflection film layer 1400 may be located on the side of the functional film layer 1300 away from the first anti-reflection film layer 1200. In other words, the substrate 1100, the first anti-reflection film layer 1200, the functional film layer 1300, and the second anti-reflection film layer 1400 may be arranged in sequence. Exemplarily, the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400 may each include a multilayer film layer with different refractive indices, so that the transmittance of the optical element 1000 to light may be greater than or equal to a preset value. Exemplarily, the preset value may be greater than or equal to 92%. In other words, the light transmittance of the optical element 1000 provided by the present disclosure may be greater than or equal to 92%.

[0060] The optical element 1000 provided by the present disclosure can be mounted on any optical device that can contact the external environment, such as an optical lens, a laser radar, or a HUD. For example, the optical element 1000 can be a window of a laser radar, the outermost lens in an optical lens, the outermost protective element of an optical lens, a reflector of a HUD projection system, or a protective cover on the light-emitting side of a HUD projection system. The optical element 1000 can have a high light transmittance and can also isolate the optical device from direct contact with the external environment, thereby preventing the optical device from being affected by impurities such as dust in the external environment.

[0061] It should be noted that the above description of the application scenarios of optical elements is only an example and not a specific limitation. The optical element can be any element with a light-transmitting function. In actual processes, the application scenarios of optical elements can be reasonably set according to specific circumstances. The following mainly takes the optical element 1000 as the window of the laser radar as an example for detailed description.

[0062] In the present disclosure, by providing the functional film layer 1300, it is beneficial to heat the functional film layer 1300 to remove fog or frost generated on the substrate 1100. In addition, by providing the second anti-reflection film layer 1400 on one side of the functional film layer 1300 (such as providing the second anti-reflection film layer 1400 between the functional film layer 1300 and the inside of the optical device), the light can be smoothly injected into the functional film layer 1300 after passing through the second anti-reflection film layer 1400, so as to reduce the refractive index of the functional film layer 1300 to the light and increase the transmittance of the functional film layer 1300 to the light. By providing the first anti-reflection film layer 1200 between the substrate 1100 and the functional film layer 1300, the light emitted from the functional film layer 1300 can be smoothly injected into the substrate 1100 after passing through the first anti-reflection film layer 1200, so as to reduce the refractive index of the substrate 1100 to the light and increase the transmittance of the substrate 1100 to the light. It can be seen that the present disclosure can realize a smooth transition of light in the optical element 1000 without affecting the conductive performance of the optical element 1000 by respectively disposing the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400 on both sides of the functional film layer 1300, so as to improve the transmittance of the optical element 1000 to light and reduce the reflectivity of the optical element 1000 to light. In other words, the optical element 1000 provided by the present disclosure can have at least one of the beneficial effects of high conductivity, high transmittance (i.e., anti-reflection and anti-reflection) and good stability.

[0063] Exemplarily, the light may include one or more of visible light and near-infrared light. For example, the light may include light in the λ±100nm band, where λ is in the range of 400~2000nm. For example, the light may include one or more lights in the 880±50nm, 905±50nm, 940±50nm, 1064±50nm, 1330±50nm, and 1550±50nm bands. Since the human eye cannot see near-infrared light, the use of near-infrared light can improve safety, detect farther distances, and stabilize the band. The reflectivity of the optical element 1000 to the light may be less than or equal to 1%. Specifically, when the light emitted from the optical device passes through the second anti-reflection film layer 1400, the functional film layer 1300, the first anti-reflection film layer 1200, and the substrate 1100 in sequence, the reflectivity of the light may be less than or equal to 1%. For example, when light at a large angle, such as 50°, enters the optical element 1000 , the reflectivity of the optical element 1000 to the light may be less than or equal to 1%.

[0064] Exemplarily, the substrate 1100 may include at least one of a glass material, a plastic material, and a ceramic material. Exemplarily, the substrate 1100 may include a plastic material, for example, including but not limited to PC, COC and other materials, to reduce production costs and improve the plasticity and processability of the optical element. Exemplarily, in an embodiment where the light is visible light, the substrate 1100 may be a plastic substrate. For example, the substrate 1100 may be a plastic black opaque substrate to improve the overall aesthetics of the optical element. It should be understood that the substrate 1100 may be a thin plate-like structure or a curved structure, and the present disclosure does not specifically limit this. The present disclosure may reasonably set the structures of the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 based on substrates of different materials so that the optical element has characteristics such as high conductivity and low reflectivity.

[0065] Figure 2 1 is a schematic diagram of the structure of the first anti-reflection film layer 1200 provided according to an exemplary embodiment of the present disclosure. Exemplarily, the first anti-reflection film layer 1200 may include first film layers 1210 and second film layers 1220 that are alternately stacked. The side of the first anti-reflection film layer 1200 close to the substrate 1100 may be the first film layer 1210. The side of the first anti-reflection film layer 1200 away from the substrate 1100 may be the first film layer 1210 or the second film layer 1220. It should be understood that the number and thickness of the first film layer 1210 and the second film layer 1220 are not limited to Figure 2 The quantity and thickness shown in , without departing from the concept of the present disclosure, those skilled in the art can set any quantity and thickness of the first film layer 1210 and the second film layer 1220 as needed.

[0066] Exemplarily, the first film layer 1210 may be a low refractive index film layer, for example, the refractive index of the first film layer 1210 may be in the range of 1.3 to 1.7. For example, when the substrate 1100 is a glass substrate or a plastic substrate, the refractive index of the first film layer 1210 may be in the range of 1.4 to 1.8. Exemplarily, the first film layer 1210 may include at least two materials, such as a material having a refractive index greater than that of the substrate, and a material having a refractive index less than that of the substrate, to achieve an anti-reflection effect. Exemplarily, the first film layer 1210 may include silicon oxide such as SiO 2 , aluminum oxide such as Al 2 O 3 and magnesium fluoride such as MgF 2 For example, the first film layer 1210 may include but is not limited to SiO 2 、Al 2 O 3 MgF 2 For example, the first film layer 1210 may include SiO 2.SiO 2 The refractive index may be about 1.45, which is relatively close to the refractive index of air, and has excellent mechanical properties, which can greatly improve the anti-reflection effect and product stability of the first film layer 1210. Exemplarily, the second film layer 1220 may be a high refractive index film layer, for example, the refractive index of the second film layer 1220 may be in the range of 1.8 to 4.0. Exemplarily, the second film layer 1220 may include one or more of the oxides, nitrides or hydrides of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, and silicon Si. For example, the second film layer 1220 may include but is not limited to one or more of the oxides, nitrides or hydrides of Ti, Ta, Nb, Zr, Hf, Si, etc., or a mixed material thereof. For example, the second film layer 1220 may include TiO 2 .TiO 2 The hole electrons inside can improve the bonding strength and firmness of the first film layer 1210. The present disclosure sets the first anti-reflection film layer 1200 as a combination of high and low refractive index film layers, which is conducive to forming an optical interference effect and achieving the required optical performance (such as achieving anti-reflection requirements).

[0067] In one embodiment of the present disclosure, the substrate 1100 may include plastic such as a resin material, and the first film layer 1210 may include TiO 2 The fastness of the substrate 1100 and the first film layer 1210 can be improved by pre-treating the substrate 1100 (for example, plasma gas bombardment, silane coupling, etc.). In another embodiment of the present disclosure, the substrate 1100 may include a glass material, and the first film layer 1210 may include Nb 2 O 5 The bonding force between the substrate 1100 and the first film layer 1210 can be increased by increasing the coating temperature (eg, forming the first film layer 1210 ) and the vacuum degree.

[0068] For example, the number of the first film layer 1210 and the number of the second film layer 1220 may both be in the range of 1 to 7. For example, (L1H1) n or (L1H1L1) nThe first anti-reflection film layer 1200 is formed in a stacked form, wherein L1 is the first film layer 1210, H1 is the second film layer 1220, and n is in the range of 1 to 7. Exemplarily, the thickness of the first anti-reflection film layer 1200 may be in the range of 50 nm to 2000 nm. The present disclosure is conducive to achieving the effect of reducing the reflectivity by matching the high and low refractive index film layers to meet the waveguide function by arranging the first film layer 1210 and the second film layer 1220 to be stacked alternately. In addition, by setting the thickness of the first anti-reflection film layer 1200 within a reasonable range, it is conducive to making the first anti-reflection film layer 1200 have a qualified film layer reliability on the basis of achieving the function of reducing the reflectivity. For example, if the thickness of the first anti-reflection film layer 1200 is less than 50 nm, the film refractive index matching cannot be achieved. If the thickness of the first anti-reflection film layer 1200 is greater than 2000 nm, the first anti-reflection film layer 1200 may be broken due to the stress accumulation of the first film layer 1210 and the second film layer 1220.

[0069] In the present disclosure, the first anti-reflection film layer 1200 can provide the optical element 1000 with an anti-reflection and anti-reflection effect. For example, the first anti-reflection film layer 1200 is located between the substrate 1100 and the functional film layer 1300, and can be used to adjust the refraction degree of light in the substrate 1100, so that the light emitted from the functional film layer 1300 smoothly transitions to the substrate 1100.

[0070] Figure 3 1 is a schematic diagram of the structure of the second anti-reflection film layer 1400 provided according to an exemplary embodiment of the present disclosure. Exemplarily, the second anti-reflection film layer 1400 may include a third film layer 1410 and a fourth film layer 1420 that are alternately stacked. The side of the second anti-reflection film layer 1400 close to the functional film layer 1300 is the third film layer 1410. The side of the second anti-reflection film layer 1400 away from the functional film layer 1300 may be the third film layer 1410 or the fourth film layer 1420. It should be understood that the number and thickness of the third film layer 1410 and the fourth film layer 1420 are not limited to Figure 3 With reference to the numbers and thicknesses shown in FIG, those skilled in the art may set any numbers and thicknesses of the third film layer 1410 and the fourth film layer 1420 as needed without departing from the concept of the present disclosure.

[0071] For example, the third film layer 1410 may be a low refractive index film layer, for example, the refractive index of the third film layer 1410 may be in the range of 1.3 to 1.7. For example, the third film layer 1410 may include silicon oxide such as SiO 2 , aluminum oxide such as Al 2 O 3 and magnesium fluoride such as MgF 2 For example, the third film layer 1410 may include but is not limited to SiO 2 、Al 2 O 3MgF 2 For example, the third film layer 1410 may include SiO 2 . Exemplarily, the fourth film layer 1420 may be a high refractive index film layer, for example, the refractive index of the fourth film layer 1420 may be in the range of 1.8 to 4.0. Exemplarily, the fourth film layer 1420 may include one or more of the oxides, nitrides or hydrides of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, and silicon Si. For example, the fourth film layer 1420 may include but is not limited to one or more of the oxides, nitrides or hydrides of Ti, Ta, Nb, Zr, Hf, Si, etc., or a mixed material thereof. For example, the fourth film layer 1420 may include TiO 2 The present disclosure sets the second anti-reflection film layer 1400 as a combination of high and low refractive index film layers, which is conducive to forming an optical interference effect and achieving the required optical performance (such as achieving anti-reflection requirements).

[0072] For example, the number of the third film layer 1410 and the fourth film layer 1420 may both be in the range of 1 to 7. For example, (L2H2) n or (L2H2L2) n The second anti-reflection film layer 1400 is formed in a stacked form, wherein L2 is the third film layer 1410, H2 is the fourth film layer 1420, and n is in the range of 1 to 7. Exemplarily, the thickness of the second anti-reflection film layer 1400 may be in the range of 30 nm to 400 nm. The present disclosure is advantageous in that the third film layer 1410 and the fourth film layer 1420 are alternately stacked, so as to achieve the effect of reducing the reflectivity by matching the high and low refractive index film layers to meet the waveguide function. In addition, by setting the thickness of the second anti-reflection film layer 1400 within a reasonable range, it is advantageous to make the second anti-reflection film layer 1400 have qualified film layer reliability on the basis of achieving the function of reducing the reflectivity. For example, if the thickness of the second anti-reflection film layer 1400 is less than 30 nm, the film refractive index matching cannot be achieved. If the thickness of the second anti-reflection film layer 1400 is greater than 400 nm, the second anti-reflection film layer 1400 may be broken due to the stress accumulation of the third film layer 1410 and the fourth film layer 1420.

[0073] In the present disclosure, the second anti-reflection film layer 1400 can provide the optical element 1000 with an anti-reflection and anti-reflection effect. For example, the second anti-reflection film layer 1400 is located between the functional film layer 1300 and the inside of the optical device, and can be used to adjust the refraction degree of the light emitted from the inside of the optical device in the functional film layer 1300, so that the light smoothly transitions to the functional film layer 1300.

[0074] like Figure 1As shown, the functional film layer 1300 may be located between the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400. The first anti-reflection film layer 1200 and the second anti-reflection film layer 1400 may play a physical protective role on the functional film layer 1300 to prevent the functional film layer 1300 from being damaged. In addition, the refractive index of the functional film layer 1300 to light may be relatively large, for example, it may be in the range of 2.0 to 2.3. The present disclosure can reasonably set the refractive index of light by reasonably setting the structure of the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400, avoid the phenomenon of poor anti-reflection effect caused by the large refractive index of the functional film layer 1300 to light, and is conducive to improving the transmittance of the functional film layer 1300 to light and improving the anti-reflection effect.

[0075] Exemplarily, the thickness of the functional film layer 1300 may be in the range of 20 nm to 600 nm to meet the need for optical path control of the functional film layer 1300. The functional film layer 1300 may include at least one of a metal material, a semiconductor material, and an alloy material. For example, the functional film layer 1300 may include, but is not limited to, a metal material, a semiconductor material, and a mixture and alloy thereof. Exemplarily, the functional film layer 1300 may include at least one of gold Au, silver Ag, copper Cu, aluminum Al, indium tin oxide such as ITO, and aluminum zinc oxide such as AZO. For example, the functional film layer 1300 may include a mixture of one or more of Au, Ag, Cu, Al, ITO, and AZO. The functional film layer 1300 in the present disclosure may have conductive properties, and a voltage may be applied across the functional film layer 1300 to heat the functional film layer 1300 to achieve the effect of anti-icing and defogging of the window.

[0076] Exemplarily, the functional film layer 1300 may include oxygen, wherein the proportion of oxygen in all elements contained in the functional film layer 1300 may be in the range of 40% to 75%. In other words, the proportion of oxygen in the functional film layer 1300 is 40% to 75%. The present disclosure can adjust the proportion of oxygen in the functional film layer 1300 by controlling the coating process, thereby controlling the resistance of the functional film layer 1300. For example, the square resistance of the functional film layer 1300 can be controlled in the range of 2Ω / sq to 200Ω / sq.

[0077] Specifically, the sheet resistance of the functional film layer 1300 can be controlled by controlling the temperature T, vacuum degree P, and oxygen filling amount F in the coating chamber, thereby realizing the heating function. For example, the temperature T in the coating chamber can be set in the range of 50°C to 250°C, the vacuum degree P in the range of 0.0001 Pa to 0.1 Pa, and the oxygen filling amount F in the range of 1 sccm to 500 sccm, so that the proportion of oxygen in the functional film layer 1300 is in the range of 40% to 75%. Exemplarily, the sheet resistance R of the functional film layer, the oxygen partial pressure X in the coating chamber, and the temperature T in the coating chamber can satisfy: R=-0.0005X 3+0.15084X 2 -11.405X+275.61+0.031T. When the temperature in the coating chamber is higher, the functional film layer 1300 reacts more actively with oxygen, and the sheet resistance R of the functional film layer 1300 is larger. When the vacuum degree P in the coating chamber is higher, the formed functional film layer 1300 is denser, the gap is smaller, and the sheet resistance R of the functional film layer 1300 is smaller. When the oxygen filling amount F is larger, the functional film layer 1300 is oxidized more completely, and the sheet resistance R is larger.

[0078] Exemplarily, the temperature T, vacuum degree P and oxygen filling amount F in the coating chamber can be set to satisfy: 0.1≤-log(P)×T / F≤750. When -log(P)×T / F is close to 0.1, the closer the refractive index of the functional film layer 1300 is to 2.0, the closer the sheet resistance of the functional film layer 1300 is to 200. When -log(P)×T / F is close to 750, the closer the refractive index of the functional film layer 1300 is to 2.3, the closer the sheet resistance of the functional film layer 1300 is to 200. Specifically, the higher the temperature T in the coating chamber, the more active the reaction between the functional film layer 1300 and oxygen, the higher the proportion Q of oxygen elements in the functional film layer 1300, the larger the sheet resistance R, and the smaller the refractive index n. When the vacuum degree P in the coating chamber is higher, the denser the functional film layer 1300 formed, the smaller the gap, the smaller the sheet resistance R, and the larger the refractive index n. The greater the oxygen filling amount F in the coating chamber, the more completely the functional film layer 1300 is oxidized, the greater the square resistance R, and the smaller the refractive index n.

[0079] Exemplarily, the oxygen partial pressure X, vacuum degree P and oxygen filling amount F in the coating chamber may satisfy: X=kF / P, where k is in the range of 0.005 to 0.02. For example, when F is 1 and P is 0.0001, X is 50. When F is 500 and P is 0.1, X is 100.

[0080] For example, the sheet resistance of the functional film layer 1300 may be in the range of 2Ω / sq~200Ω / sq to achieve the heating function. The light absorption rate of the functional film layer 1300 may be less than or equal to 2.5%. The conductive property of the functional film layer 1300 is controllable. In the present disclosure, oxygen such as O may be filled into the coating cavity. 2 and / or argon such as Ar, O 2 and / or Ar and other gases can react with metals and their incomplete oxides under activation, 2 The partial pressure controls the degree of oxidation to control the conductivity of the functional film layer 1300. In other words, the conductivity of the functional film layer 1300 can be controlled by controlling the content of oxygen in the functional film layer 1300. Specifically, the present disclosure can control the conductivity of the functional film layer 1300 by controlling the machine process, activation power, and O 2 / Ar ratio, etc., to adjust the proportion of oxygen in the functional film layer 1300, and then the square resistance of the functional film layer 1300 can be controlled within the range of 2Ω / sq~200Ω / sq, so that the light absorption rate of the functional film layer 1300 can be less than or equal to 2.5%. It should be understood that the square resistance of the functional film layer 1300 can be adjusted by adjusting the proportion of oxygen in the functional film layer 1300, and then the light absorption rate of the functional film layer 1300 can be adjusted. In other words, the light absorption rate of the functional film layer 1300 can be adjusted and controlled.

[0081] Exemplarily, the thickness of the functional film layer 1300 may be in the range of 20 nm to 600 nm. The functional film layer 1300 has a certain absorption effect on light, and the amount of light absorbed by the thermal film layer 1300 is positively correlated with the thickness of the functional film layer 1300, that is, the thicker the functional film layer 1300 is, the more light it absorbs. Therefore, if the thickness of the functional film layer 1300 is greater than 600 nm, the light transmittance is low due to the large amount of light absorbed by the functional film layer 1300, which is undesirable. In addition, according to the formula P=U 2 / R shows that, under the condition of constant voltage, the smaller the resistance, the greater the heating efficiency. Since the square resistance of the functional film layer 1300 is negatively correlated with the thickness of the functional film layer 1300, that is, the smaller the thickness of the functional film layer 1300, the greater the square resistance of the functional film layer 1300, which in turn leads to the poorer conductivity of the functional film layer 1300. Therefore, if the thickness of the functional film layer 1300 is less than 20 nm, the conductivity of the functional film layer 1300 will be poor. It can be seen that the present disclosure is conducive to achieving better conductivity when the absorption of light by the functional film layer 1300 meets the requirements by controlling the thickness of the functional film layer 1300 within the range of 20 nm~600nm.

[0082] Exemplarily, at least one of the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 may be formed by an evaporation coating process (such as electron gun evaporation coating), a sputtering coating process (such as magnetron sputtering coating) or a vapor deposition process (such as chemical vapor deposition and / or physical vapor deposition coating). For example, the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 may be formed in sequence on one side of the substrate 1100 by a sputtering coating process. At present, the market mostly adopts an attachment process to form the functional film layer 1300. However, conventional heating film attachment schemes have problems such as high processing difficulty, low processing pass rate, poor resistance uniformity, unstable application surface shape, and high long-term reliability risk. Based on this, the present disclosure adopts a sputtering coating process to form the functional film layer 1300, which is conducive to reducing the processing difficulty and improving the uniformity of the functional film layer 1300.

[0083] In addition, in the embodiment where the substrate 1100 includes a resin material, due to the low temperature resistance and large expansion coefficient of the resin material, it is necessary to form the functional film layer 1300 in a low temperature environment. However, based on the characteristics of the conductive material, it can be seen that the lower the temperature, the higher the resistivity of the functional film layer 1300, which in turn leads to a lower heating efficiency and a poorer conductivity of the functional film layer 1300. Based on this, the present disclosure reasonably sets the structure of the functional film layer 1300 so that the square resistance of the functional film layer 1300 can be within a certain range, thereby achieving adjustable and controllable conductive properties of the functional film layer 1300.

[0084] Exemplarily, the equivalent optical path of the first anti-reflection film layer 1200, the functional film layer 1300, and the second anti-reflection film layer 1400 may be an odd multiple of 1 / 4λ, where λ is the wavelength of the light. An odd multiple of 1 / 4λ=n1×d1+n2×d2+n3×d3, where n1 is the refractive index of the first anti-reflection film layer 1200, d1 is the thickness of the first anti-reflection film layer 1200, n2 is the refractive index of the second anti-reflection film layer 1400, d2 is the thickness of the second anti-reflection film layer 1400, n3 is the refractive index of the functional film layer 1300, and d3 is the thickness of the functional film layer 1300. The present disclosure sets the equivalent optical path of the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 to satisfy n1×d1+n2×d2+n3×d3, so that the reflectivity of the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 to the light in the λ±100nm band (λ is 400 nm ~2000nm) is less than or equal to 1%. Exemplarily, the incident angle of the light can be in the range of 0±50°.

[0085] In addition, the present disclosure can achieve a square resistance of the functional film layer 1300 within the range of 20Ω / sq~200Ω / sq by selecting the material of the functional film layer 1300, setting the process technology, etc. By setting a multi-layer film layer such as setting a first anti-reflection film layer 1200, a functional film layer 1300 and a second anti-reflection film layer 1400, the anti-reflection performance of the optical element can be greatly improved, especially the reflectivity of the incident light at a large angle can be reduced, and the imaging clarity of the optical element can be improved. The present disclosure can achieve the power-on heating function of the functional film layer 1300 by controlling the square resistance of the functional film layer 1300 within the range of 20Ω / sq~200Ω / sq. For example, the functional film layer 1300 can be heated to 100°C at a voltage of 24V, which can quickly remove ice and dissipate water mist.

[0086] Exemplarily, the light absorption rate A of the functional film layer 1300 and the proportion Q of the oxygen element may satisfy: 10≤Q / A≤28. The light absorption rate A of the functional film layer 1300 decreases as the proportion Q of the oxygen element increases. For example, when the proportion Q of the oxygen element is 40%, the absorption rate A of the functional film layer 1300 to the light in the 400 nm ~ 2000 nm band is approximately 4%. When the proportion Q of the oxygen element is 70%, the absorption rate A of the functional film layer 1300 to the light in the 400 nm ~ 2000 nm band is approximately 2.5%.

[0087] Figure 4 1 is a schematic diagram of the structure of an optical element 1000 provided according to another exemplary embodiment of the present disclosure. For the purpose of concise description, Figure 4 The embodiment shown is Figures 1 to 3 The same contents as those in the illustrated embodiments will not be repeated in this disclosure.

[0088] The optical element 1000 may include a substrate 1100, a first anti-reflection film layer 1200, a functional film layer 1300, a second anti-reflection film layer 1400, and a bonding layer 1500. The bonding layer 1500 may be located between the substrate 1100 and the first anti-reflection film layer 1200. For example, the bonding layer 1500 may contact the substrate 1100 and the first anti-reflection film layer 1200.

[0089] Exemplarily, the substrate 1100 may include a resin material. The bonding layer 1500 may include a semiconductor material, wherein the semiconductor material includes at least one of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, silicon Si, and oxides thereof. For example, the bonding layer 1500 may include one or a mixture of Ti, Ta, Nb, Zr, Hf, Si, and oxides thereof.

[0090] In the actual process, after the substrate 1100 of the resin material is subjected to surface activation treatment, the surface chemical chain is broken and free radicals are generated. The bonding layer 1500 can be used as a gap semiconductor material. After receiving energy input, the semiconductor material can transition to an excited state, and active sites are released on the surface. It should be understood that the lower band gap width of the semiconductor material (such as about 3.2eV) is conducive to the generation of active sites. The strength of the bonding layer 1500 and the substrate 1100 combined together through chemical bonds is much greater than the bonding force of conventional coating processes relying on intermolecular adsorption. Therefore, the present disclosure is conducive to improving the bonding force between the substrate 1100 and the first anti-reflection film layer 1200 by setting the bonding layer 1500, thereby improving the overall firmness of the optical element.

[0091] For example, the thickness of the bonding layer 1500 may be in the range of 5 nm to 100 nm, which is beneficial to improving the bonding strength between the substrate 1100 and the first anti-reflection film layer 1200. If the thickness of the bonding layer 1500 is too large, such as greater than 100 nm, the thickness of the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400 may increase synchronously.

[0092] Figure 5 1 is a schematic diagram of the structure of an optical element 1000 provided according to another exemplary embodiment of the present disclosure. For the purpose of concise description, Figure 5 The embodiment shown is Figures 1 to 3 The same contents as those in the illustrated embodiments will not be repeated in this disclosure.

[0093] The optical element 1000 may include a substrate 1100, a first anti-reflection film layer 1200, a functional film layer 1300, a second anti-reflection film layer 1400, a third anti-reflection film layer 1600, and a protective layer 1700. The third anti-reflection film layer 1600 may be located on a side of the substrate 1100 away from the first anti-reflection film layer 1200. The protective layer 1700 may be located on a side of the third anti-reflection film layer 1600 away from the substrate 1100.

[0094] The first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 may be located on one side of the substrate 1100, such as inside the optical device, and the third anti-reflection film layer 1600 and the protective layer 1700 may be located on the other side of the substrate 1100, such as outside the optical device. Under normal circumstances, the light directly enters the external air of the optical device after passing through the substrate 1100, which may cause a large degree of light deflection, thereby increasing the reflectivity of the optical element as a whole to the light and reducing the transmittance, such as by about 3%. Based on this, the present disclosure is conducive to reducing the reflection of the optical element as a whole to the light, increasing the light transmission of the optical element as a whole, so as to optimize the function of the optical element by setting the third anti-reflection film layer 1600 and the protective layer 1700.

[0095] Exemplarily, the third anti-reflection film layer 1600 may include a fifth film layer (not shown) and a sixth film layer (not shown) that are alternately stacked. It should be understood that, without departing from the concept of the present disclosure, those skilled in the art may set any number and thickness of the fifth film layer and the sixth film layer as needed. The side of the third anti-reflection film layer 1600 close to the substrate 1100 is the fifth film layer. For example, the fifth film layer may be in contact with the substrate 1100.

[0096] For example, the fifth film layer may be a low refractive index film layer, for example, the refractive index of the fifth film layer may be in the range of 1.3 to 1.7. For example, the fifth film layer may include silicon oxide such as SiO 2 , aluminum oxide such as Al 2 O 3 and magnesium fluoride such as MgF2 For example, the fifth film layer may include but is not limited to SiO 2 、Al 2 O 3 MgF 2 Etc. and mixtures thereof. Exemplarily, the sixth film layer may be a high refractive index film layer, for example, the refractive index of the sixth film layer may be in the range of 1.8 to 4.0. Exemplarily, the sixth film layer may include one or more of the oxides, nitrides or hydrides of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, and silicon Si. For example, the sixth film layer may include but is not limited to one or more of the oxides, nitrides or hydrides of Ti, Ta, Nb, Zr, Hf, Si, etc., or a mixed material thereof. Exemplarily, the number of the fifth film layer and the sixth film layer may both be in the range of 1 to 7. For example, (L3H3)^ n The third anti-reflection film layer 1600 is formed in a stacked form, wherein L3 is the fifth film layer, H3 is the sixth film layer, and n is in the range of 1 to 7. The third anti-reflection film layer 1600 is provided in the present disclosure to form an optical interference effect, thereby improving the transmittance of light from the substrate 1100 to the external air of the optical device, for example, the transmittance can be increased by about 3%.

[0097] Exemplarily, the protective layer 1700 may include a waterproof film layer and / or a hard film layer. The waterproof film layer and / or the hard film layer may reduce the surface tension of the film layer, and play a role in anti-fouling, self-cleaning, etc. In addition, the waterproof film layer and / or the hard film layer may also improve the mechanical properties of the film layer, and meet the requirements of anti-fouling, self-cleaning, and mechanical performance improvement of the optical element. Exemplarily, the protective layer 1700 may include a fluorine-containing organic substance. For example, the protective layer 1700 may be a fluorine-containing organic substance coating. The fluorine-containing organic substance coating may have a surface hydrophobic and oleophobic effect, thereby achieving a hydrophobic and oleophobic effect on the exposed surface of the optical element.

[0098] Figure 6 is a schematic diagram of the structure of an optical element provided according to another exemplary embodiment of the present disclosure. For the purpose of concise description, Figure 6 The embodiment shown is Figures 1 to 5 The same contents as those in the illustrated embodiments will not be repeated in this disclosure.

[0099] like Figure 6 As shown, the optical element may include a second anti-reflection film layer 1400 , a functional film layer 1300 , a first anti-reflection film layer 1200 , a bonding layer 1500 , a substrate 1100 , a third anti-reflection film layer 1600 and a protective layer 1700 .

[0100] Specific examples of optical elements applicable to the above-mentioned embodiments are further described below with reference to the accompanying drawings. Example 1

[0101] In this embodiment, reference may be made to Figure 1 , the optical element may include a substrate 1100 , a first anti-reflection film layer 1200 , a functional film layer 1300 and a second anti-reflection film layer 1400 .

[0102] In this embodiment, the thickness of the first anti-reflection film layer 1200 may be in the range of 50 nm to 2000 nm. The thickness of the second anti-reflection film layer 1400 may be in the range of 30 nm to 400 nm. Tables 1 to 5 below show the thicknesses of the first anti-reflection film layer 1200, the functional film layer 1300, and the second anti-reflection film layer 1400 in five solutions.

[0103] Table 1

[0104]

[0105] Table 2

[0106]

[0107] Table 3

[0108]

[0109] Table 4

[0110]

[0111] Table 5

[0112]

[0113] In this embodiment, the first anti-reflection film layer 1200 may include a first film layer 1210 and a second film layer 1220 that are alternately stacked. The number of the first film layer 1210 and the second film layer 1220 may both be in the range of 1 to 7. The second anti-reflection film layer 1400 may include a third film layer 1410 and a fourth film layer 1420 that are alternately stacked. Tables 6 to 8 below respectively show the materials of the first film layer 1210, the second film layer 1220, the third film layer 1410, and the fourth film layer 1420 in Scheme 1, Scheme 2, and Scheme 3 and the thickness of each material.

[0114] Table 6

[0115]

[0116] Table 7

[0117]

[0118] Table 8

[0119]

[0120] Figure 7 and Figure 8 The reflectivity and transmittance curves of the optical element in Example 1 are shown respectively. Figure 7 As shown in FIG. 1 , the reflectivity of the optical element to light within the 880±50nm wavelength range can be less than 1%. Figure 8 As shown, the transmittance of the optical element to light in the wavelength range of 850nm~1050nm can be greater than 92%. It can be seen that in this embodiment, by reasonably setting the structure of the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400, the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400 can form an optical interference effect, achieve the required optical performance, and enable the optical element to have the effect of anti-reflection and anti-reflection. Example 2

[0121] In this embodiment, reference may be made to Figure 1 , the optical element may include a substrate 1100 , a first anti-reflection film layer 1200 , a functional film layer 1300 and a second anti-reflection film layer 1400 .

[0122] In this embodiment, the functional film layer 1300 may include at least one of gold Au, silver Ag, copper Cu, aluminum Al, indium tin oxide such as ITO, and aluminum zinc oxide such as AZO. The thickness of the functional film layer 1300 may be in the range of 20 nm to 600 nm. Tables 9 to 11 respectively show the materials and thicknesses of the functional film layer 1300 in Scheme 6, Scheme 7, and Scheme 8.

[0123] Table 9

[0124]

[0125] Table 10

[0126]

[0127] Table 11

[0128]

[0129] As shown in Tables 9 to 11, compared to Scheme 6, in Scheme 8, the oxidation degree of the incomplete functional film layer 1300, such as the indium tin oxide (ITO) film layer, can be controlled by controlling the machine process parameters. For example, during the preparation of the functional film layer 1300, the oxygen flow rate can be changed from 5 sccm to 15 sccm, and the argon flow rate can be changed from 150 sccm to 300 sccm. Compared to Scheme 7, in Scheme 6, the material of the functional film layer 1300 is changed, but it can have the same effect as Scheme 7.

[0130] In this embodiment, the light absorption rate of the functional film layer 1300 may be less than or equal to 2.5%. Fig. 9The figure shows the change of the sheet resistance of the functional film layer 1300 and the oxygen content in the functional film layer 1300 when the thickness of the functional film layer 1300 in Example 2 is constant (such as a thickness of 100 nm). Fig. 9 As shown, when the proportion of oxygen in the functional film layer 1300 is in the range of 55% to 75%, the square resistance of the functional film layer 1300 can be in the range of 60Ω / sq to 130Ω / sq. Specifically, after the oxygen injection amount in the coating chamber is increased from 5sccm to 15sccm, the oxygen partial pressure in the coating chamber can be reduced to 1 / 3 of the original, the oxygen content in the functional film layer 1300 can be reduced from 60% to 58%, the conductivity of the functional film layer 1300 is slightly reduced, and the square resistance is increased. For example, the square resistance of the functional film layer 1300 can be increased from 32Ω / sq to 71Ω / sq. Example 3

[0131] In this embodiment, reference may be made to Figure 4 The optical element may include a substrate 1100 , a first anti-reflection film layer 1200 , a functional film layer 1300 , a second anti-reflection film layer 1400 and a bonding layer 1500 .

[0132] In this embodiment, the substrate 1100 may include a resin material. The bonding layer 1500 may include a semiconductor material, wherein the semiconductor material includes at least one of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, silicon Si and oxides thereof. The thickness of the bonding layer 1500 may be in the range of 5 nm to 100 nm.

[0133] Table 12 and Table 13 respectively show the material of the substrate 1100, the material and thickness of the bonding layer 1500 in Scheme 9 and Scheme 10. Table 14 shows the material of the substrate 1100 in the comparative example.

[0134] Table 12

[0135]

[0136] Table 13

[0137]

[0138] Table 14

[0139]

[0140] As shown in Tables 12 to 14, the substrate 1100 in the comparative example shown in Table 14 may include a glass material. The substrate 1100 in Schemes 9 and 10 shown in Tables 12 and 13 may include a resin material. In Schemes 9 and 10, a bonding layer 1500 may be provided to increase the bonding effect between the substrate 1100 and the first anti-reflection film layer 1200 and improve the bonding force. The bonding layer 1500 may include TiO 2or Nb 2 O 5 , the thickness of the bonding layer 1500 may be 500.2 nm.

[0141] Since the bonding strength between the glass substrate and the film layer is stronger than that between the resin substrate and the film layer, the present disclosure increases the bonding strength by adding a bonding layer 1500 between the resin substrate and the film layer (such as the first anti-reflection film layer 1200). The bonding layer 1500 may include TiO 2 , Nb 2 O 5 One or more of the above materials. Example 4

[0142] In this embodiment, reference may be made to Figure 6 The optical element may include a second anti-reflection film layer 1400 , a functional film layer 1300 , a first anti-reflection film layer 1200 , a bonding layer 1500 , a substrate 1100 , a third anti-reflection film layer 1600 and a protective layer 1700 .

[0143] This embodiment may be based on the embodiment 3, and further includes a third anti-reflection film layer 1600 and a protective layer 1700. The third anti-reflection film layer 1600 may be located on the side of the substrate 1100 away from the first anti-reflection film layer 1200. The protective layer 1700 may be located on the side of the third anti-reflection film layer 1600 away from the substrate 1100. For example, the first anti-reflection film layer 1200, the functional film layer 1300, and the second anti-reflection film layer 1400 may be located on one side of the substrate 1100, such as the inside of the optical device, and the third anti-reflection film layer 1600 and the protective layer 1700 may be located on the other side of the substrate 1100, such as the outside of the optical device. In this embodiment, the transmittance of the optical element to light may reach 94%.

[0144] Specifically, the laser emitted by the laser inside the optical device can achieve anti-reflection on the inner surface. When the laser is incident on the outer air of the optical device through the substrate 1100, it will cause high reflection due to the large difference in refractive index, resulting in energy waste. Based on this, this embodiment adds a third anti-reflection film layer 1600 on the outside of the optical device, and can form an optical interference effect on the outer surface of the device through the combination of high and low refractive index film layers, thereby achieving a double-surface anti-reflection effect.

[0145] For example, the protective layer 1700 may include a fluorine-containing organic coating. The fluorine-containing organic coating may have a surface hydrophobic and oleophobic effect, thereby achieving a hydrophobic and oleophobic effect on the exposed surface of the optical element.

[0146] Table 15 shows the materials and / or thicknesses of the second anti-reflection film layer 1400 , the functional film layer 1300 , the first anti-reflection film layer 1200 , the bonding layer 1500 , the substrate 1100 , the third anti-reflection film layer 1600 and the protective layer 1700 in this embodiment.

[0147] Table 15

[0148] Example 5

[0149] In this embodiment, reference may be made to Figure 1 The optical element may include a second anti-reflection film layer 1400 , a functional film layer 1300 , a first anti-reflection film layer 1200 and a substrate 1100 .

[0150] In this embodiment, the substrate 1100 may include a plastic material such as a resin material. The first film layer 1210 in the first anti-reflection film layer 1200 that contacts the substrate 1100 may include TiO 2 , to improve the firmness of the first film layer 1210 and the substrate 1100. The functional film layer 1300 is located between the second anti-reflection film layer 1400 and the first anti-reflection film layer 1200, and can achieve a reflectivity of the optical element to a large angle (such as 50°) incident light less than or equal to 1%. The first anti-reflection film layer 1200 may include (L1H1) n or (L1H1L1) n In stacked form, the second antireflection film layer 1400 may include (L2H2) n or (L2H2L2) n Stacked form to achieve the effect of reducing reflection.

[0151] Table 16 shows the materials, refractive indexes and thicknesses of the second anti-reflection film layer 1400 , the functional film layer 1300 , the first anti-reflection film layer 1200 and the substrate 1100 in this embodiment.

[0152] Table 16

[0153]

[0154] In this embodiment, by setting the materials, refractive index and thickness of the second anti-reflection film layer 1400, the functional film layer 1300, the first anti-reflection film layer 1200 and the substrate 1100, the equivalent optical path of the second anti-reflection film layer 1400, the functional film layer 1300 and the first anti-reflection film layer 1200 can be made n1×d1+n2×d2+n3×d3, so as to achieve a reflectivity of the optical element to light in the λ±100nm band (λ is 400~2000nm) less than or equal to ≤1%, wherein the incident angle of the light can be in the range of 0±50°.

[0155] Fig.10 and Fig.11 The reflectivity curves of the optical element in Example 5 for light with different incident angles are shown respectively. Fig.12 FIG. 5 shows the transmittance curve of the optical element to light in Example 5. Fig.10As shown in FIG. 1 , the reflectivity of the optical element to light within the wavelength range of 880±50nm and with an incident angle of 0° can be less than 1%. Fig.11 As shown in FIG. 1 , the reflectivity of the optical element to light within the wavelength range of 880±50nm and with an incident angle of 50° can be less than 1%. Fig.12 As shown, the transmittance of the optical element to light in the wavelength range of 850nm~1050nm can be greater than 92%. It can be seen that in this embodiment, by reasonably setting the structures of the second anti-reflection film layer 1400, the functional film layer 1300 and the first anti-reflection film layer 1200, an optical interference effect can be formed to meet the equivalent optical path requirements, achieve the required optical performance, and enable the optical element to have the effect of anti-reflection and anti-transmission. Example 6

[0156] In this embodiment, the optical element may include a second anti-reflection film layer 1400 , a functional film layer 1300 , a first anti-reflection film layer 1200 , a substrate 1100 , and a protective layer 1700 (eg, a waterproof film layer).

[0157] In this embodiment, the functional film layer 1300 may include copper (Cu) or indium tin oxide (ITO). Table 17 and Table 18 show the materials and thickness of the functional film layer 1300 in Scheme 11 and Scheme 12, respectively.

[0158] Table 17

[0159]

[0160] Table 18

[0161]

[0162] As shown in Tables 17 and 18, compared with Scheme 11, in Scheme 12, the oxidation degree of the incomplete functional film layer 1300, such as the indium tin oxide (ITO) film layer, can be controlled by controlling the machine process parameters. For example, during the preparation process of the functional film layer 1300, the oxygen flow rate can be changed from 1 sccm to 500 sccm, the vacuum degree P can be changed from 0.001 Pa to 0.1 Pa, and the coating temperature T can be changed from 40°C to 150°C, then the square resistance of the functional film layer 1300 can be changed from 21Ω / sq to 197Ω / sq. Compared with Scheme 11, the material of the functional film layer 1300 has changed in Scheme 12, but it can have the same effect as Scheme 11. It can be seen that mixtures of different metals and their oxides can achieve the desired anti-reflection effect.

[0163] Specifically, the sheet resistance of the functional film layer 1300 can be controlled by controlling the temperature T, vacuum degree P, and oxygen filling amount F in the coating chamber, thereby realizing the heating function. For example, the temperature T in the coating chamber can be set in the range of 50°C to 250°C, the vacuum degree P in the range of 0.0001 Pa to 0.1 Pa, and the oxygen filling amount F in the range of 1 sccm to 500 sccm, so that the proportion of oxygen in the functional film layer 1300 is in the range of 40% to 75%. Exemplarily, the sheet resistance R of the functional film layer, the oxygen partial pressure X in the coating chamber, and the temperature T in the coating chamber can satisfy: R=-0.0005X 3 +0.15084X 2 -11.405X+275.61+0.031T. The temperature T, vacuum degree P and oxygen filling amount F in the coating chamber can satisfy: 0.1≤-log(P)×T / F≤750. When -log(P)×T / F is close to 0.1, the closer the refractive index of the functional film layer 1300 is to 2.0, the closer the sheet resistance of the functional film layer 1300 is to 200. When -log(P)×T / F is close to 750, the closer the refractive index of the functional film layer 1300 is to 2.3, the closer the sheet resistance of the functional film layer 1300 is to 200. Example 7

[0164] In this embodiment, the optical element may include a second anti-reflection film layer 1400 , a functional film layer 1300 , a first anti-reflection film layer 1200 , a substrate 1100 , and a protective layer 1700 (eg, a hard film layer).

[0165] In this embodiment, the substrate 1100 may include a ceramic material. Table 19 shows the materials, refractive indexes and thicknesses of the second anti-reflection film layer 1400, the functional film layer 1300, the first anti-reflection film layer 1200, the substrate 1100 and the protective layer 1700 in this embodiment.

[0166] Table 19

[0167]

[0168] As shown in Table 19, when the substrate 1100 is made of ceramic material, the first film layer 1210 in the first anti-reflection film layer 1200 in contact with the substrate 1100 may include Ta 2 O 5 , so as to improve the bonding force between the first anti-reflection film layer and the substrate 1100. In addition, the functional film layer 1300 may include aluminum Al and its oxide, and may be plated with metal or metal oxide as the main body to achieve conductivity. By controlling the thickness of the functional film layer 1300 within the range of 20nm to 600nm, the need for optical path control of the functional film layer 1300 may be achieved.

[0169] Another aspect of the present disclosure provides an optical device. The optical device may include a light source and the above optical element. The light emitted by the light source may enter the second anti-reflection film layer 1400 in the optical element, and then sequentially pass through the functional film layer 1300, the first anti-reflection film layer 1200 and the substrate 1100 before being emitted.

[0170] Exemplarily, the optical device may be any optical device that can contact the external environment, such as an optical lens, a laser radar, or a HUD. For example, the optical device may be a laser radar.

[0171] Fig.13 is a flow chart of a method 2000 for manufacturing an optical element according to an exemplary embodiment of the present disclosure.

[0172] like Fig.13 As shown, the manufacturing method 2000 of the optical element may include: S2100, disposing a first anti-reflection film layer on one side of the substrate; S2200, disposing a functional film layer on the side of the first anti-reflection film layer away from the substrate; and S2300, disposing a second anti-reflection film layer on the side of the functional film layer away from the first anti-reflection film layer. Steps S2100 to S2300 will be described in detail below.

[0173] For example, reference may be made to Figure 1 , a first anti-reflection film layer 1200, a functional film layer 1300, and a second anti-reflection film layer 1400 may be sequentially disposed on one side of the substrate 1100. Exemplarily, the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400 may each include a multilayer film layer with different refractive indices, so that the transmittance of the optical element 1000 to light may be greater than or equal to a preset value. Exemplarily, the preset value may be greater than or equal to 92%. In other words, the transmittance of the optical element 1000 provided by the present disclosure to light may be greater than or equal to 92%.

[0174] The optical element manufactured by the present disclosure can be mounted on any optical device that can contact the external environment, such as an optical lens, a laser radar, or a HUD. For example, the optical element can be a window of a laser radar, the outermost lens in an optical lens, the outermost protective element of an optical lens, a reflector of a HUD projection system, or a protective cover on the light-emitting side of a HUD projection system. The optical element can have a high light transmittance and can also isolate the optical device from direct contact with the external environment, thereby preventing the optical device from being affected by impurities such as dust in the external environment.

[0175] It should be noted that the above description of the application scenarios of optical elements is only an example and not a specific limitation. The optical element can be any element with a light-transmitting function. In actual processes, the application scenarios of optical elements can be reasonably set according to specific circumstances. The following mainly takes the optical element as the window of the laser radar as an example for detailed description.

[0176] In the present disclosure, by providing the functional film layer 1300, it is beneficial to heat the functional film layer 1300 to remove fog or frost generated on the substrate 1100. In addition, by providing the second anti-reflection film layer 1400 on one side of the functional film layer 1300 (such as providing the second anti-reflection film layer 1400 between the functional film layer 1300 and the inside of the optical device), the light can be smoothly injected into the functional film layer 1300 after passing through the second anti-reflection film layer 1400, so as to reduce the refractive index of the functional film layer 1300 to the light and increase the transmittance of the functional film layer 1300 to the light. By providing the first anti-reflection film layer 1200 between the substrate 1100 and the functional film layer 1300, the light emitted from the functional film layer 1300 can be smoothly injected into the substrate 1100 after passing through the first anti-reflection film layer 1200, so as to reduce the refractive index of the substrate 1100 to the light and increase the transmittance of the substrate 1100 to the light. It can be seen that the present disclosure can realize a smooth transition of light in the optical element without affecting the conductive performance of the optical element by respectively arranging the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400 on both sides of the functional film layer 1300, so as to improve the transmittance of the optical element to light and reduce the reflectivity of the optical element to light. In other words, the optical element provided by the present disclosure can have at least one of the beneficial effects of high conductivity, high transmittance (i.e., anti-reflection and anti-reflection) and good stability.

[0177] Exemplarily, at least one of the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 may be formed by an evaporation coating process (such as electron gun evaporation coating), a sputtering coating process (such as magnetron sputtering coating) or a vapor deposition process (such as chemical vapor deposition and / or physical vapor deposition coating). For example, the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 may be formed in sequence on one side of the substrate 1100 by a sputtering coating process. At present, the market mostly adopts an attachment process to form the functional film layer 1300. However, conventional heating film attachment schemes have problems such as high processing difficulty, low processing pass rate, poor resistance uniformity, unstable application surface shape, and high long-term reliability risk. Based on this, the present disclosure adopts a sputtering coating process to form the functional film layer 1300, which is conducive to reducing the processing difficulty and improving the uniformity of the functional film layer 1300.

[0178] In one embodiment of the present disclosure, the substrate 1100 may include plastic such as a resin material, and the first film layer 1210 may include TiO 2 The fastness of the substrate 1100 and the first film layer 1210 can be improved by pre-treating the substrate 1100 (for example, plasma gas bombardment, silane coupling, etc.). In another embodiment of the present disclosure, the substrate 1100 may include a glass material, and the first film layer 1210 may include Nb 2 O 5The bonding force between the substrate 1100 and the first film layer 1210 can be increased by increasing the coating temperature (eg, forming the first film layer 1210 ) and the vacuum degree.

[0179] In addition, in the embodiment where the substrate 1100 includes a resin material, due to the low temperature resistance and large expansion coefficient of the resin material, it is necessary to form a functional film layer 1300 (including a conductive material) in a low temperature environment. However, based on the characteristics of the conductive material, it can be seen that the lower the temperature, the higher the resistivity of the functional film layer 1300, which in turn leads to a lower heating efficiency and a poorer conductivity of the functional film layer 1300. Based on this, the present disclosure reasonably sets the structure of the functional film layer 1300 so that the square resistance of the functional film layer 1300 can be within a certain range, thereby achieving adjustable and controllable conductive properties of the functional film layer 1300.

[0180] Exemplarily, the functional film layer 1300 may include at least one of a metal material, a semiconductor material, and an alloy material. For example, the functional film layer 1300 may include, but is not limited to, a metal material, a semiconductor material, and a mixture and alloy thereof. Exemplarily, the functional film layer 1300 may include at least one of gold Au, silver Ag, copper Cu, aluminum Al, indium tin oxide such as ITO, and aluminum zinc oxide such as AZO. For example, the functional film layer 1300 may include a mixture of one or more of Au, Ag, Cu, Al, ITO, and AZO. The functional film layer 1300 in the present disclosure may have conductive properties, and a voltage may be applied across the functional film layer 1300 to heat the functional film layer 1300 to achieve the effect of anti-icing and defogging of the window.

[0181] Exemplarily, the functional film layer 1300 may include oxygen, wherein the proportion of oxygen in all elements contained in the functional film layer 1300 may be in the range of 40% to 75%. In other words, the proportion of oxygen in the functional film layer 1300 is 40% to 75%. The present disclosure can adjust the proportion of oxygen in the functional film layer 1300 by controlling the coating process, thereby controlling the resistance of the functional film layer 1300. For example, the square resistance of the functional film layer 1300 can be controlled in the range of 2Ω / sq to 200Ω / sq.

[0182] Specifically, the sheet resistance of the functional film layer 1300 can be controlled by controlling the temperature T, vacuum degree P, and oxygen filling amount F in the coating chamber, thereby realizing the heating function. For example, the temperature T in the coating chamber can be set in the range of 50°C to 250°C, the vacuum degree P in the range of 0.0001 Pa to 0.1 Pa, and the oxygen filling amount F in the range of 1 sccm to 500 sccm, so that the proportion of oxygen in the functional film layer 1300 is in the range of 40% to 75%. Exemplarily, the sheet resistance R of the functional film layer, the oxygen partial pressure X in the coating chamber, and the temperature T in the coating chamber can satisfy: R=-0.0005X 3+0.15084X 2 -11.405X+275.61+0.031T. When the temperature in the coating chamber is higher, the functional film layer 1300 reacts more actively with oxygen, and the sheet resistance R of the functional film layer 1300 is larger. When the vacuum degree P in the coating chamber is higher, the formed functional film layer 1300 is denser, the gap is smaller, and the sheet resistance R of the functional film layer 1300 is smaller. When the oxygen filling amount F is larger, the functional film layer 1300 is oxidized more completely, and the sheet resistance R is larger.

[0183] Exemplarily, the temperature T, vacuum degree P and oxygen filling amount F in the coating chamber can be set to satisfy: 0.1≤-log(P)×T / F≤750. When -log(P)×T / F is close to 0.1, the closer the refractive index of the functional film layer 1300 is to 2.0, the closer the sheet resistance of the functional film layer 1300 is to 200. When -log(P)×T / F is close to 750, the closer the refractive index of the functional film layer 1300 is to 2.3, the closer the sheet resistance of the functional film layer 1300 is to 200. Specifically, the higher the temperature T in the coating chamber, the more active the reaction between the functional film layer 1300 and oxygen, the higher the proportion Q of oxygen elements in the functional film layer 1300, the larger the sheet resistance R, and the smaller the refractive index n. When the vacuum degree P in the coating chamber is higher, the denser the functional film layer 1300 formed, the smaller the gap, the smaller the sheet resistance R, and the larger the refractive index n. The greater the oxygen filling amount F in the coating chamber, the more completely the functional film layer 1300 is oxidized, the greater the square resistance R, and the smaller the refractive index n.

[0184] Exemplarily, the oxygen partial pressure X, vacuum degree P and oxygen filling amount F in the coating chamber may satisfy: X=kF / P, where k is in the range of 0.005 to 0.02. For example, when F is 1 and P is 0.0001, X is 50. When F is 500 and P is 0.1, X is 100.

[0185] For example, the sheet resistance of the functional film layer 1300 may be in the range of 2Ω / sq~200Ω / sq. The light absorption rate of the functional film layer 1300 may be less than or equal to 2.5%. The conductive property of the functional film layer 1300 is controllable. For example, the proportion of oxygen in the functional film layer 1300 may be controlled by controlling the oxygen content in the coating cavity. For example, oxygen such as O may be filled into the coating cavity. 2 and / or argon such as Ar, O 2 and / or Ar and other gases can react with metals and their incomplete oxides under activation, 2 The partial pressure controls the degree of oxidation to control the conductivity of the functional film layer 1300. In other words, the conductivity of the functional film layer 1300 can be controlled by controlling the content of oxygen in the functional film layer 1300. Specifically, the present disclosure can control the conductivity of the functional film layer 1300 by controlling the machine process, activation power, and O 2 / Ar ratio, etc., to adjust the proportion of oxygen in the functional film layer 1300, and then the square resistance of the functional film layer 1300 can be controlled within the range of 2Ω / sq~200Ω / sq, so that the light absorption rate of the functional film layer 1300 can be less than or equal to 2.5%. It should be understood that the square resistance of the functional film layer 1300 can be adjusted by adjusting the proportion of oxygen in the functional film layer 1300, and then the light absorption rate of the functional film layer 1300 can be adjusted. In other words, the light absorption rate of the functional film layer 1300 can be adjusted and controlled.

[0186] Exemplarily, the thickness of the functional film layer 1300 may be in the range of 20 nm to 600 nm. The functional film layer 1300 has a certain absorption effect on light, and the amount of light absorbed by the thermal film layer 1300 is positively correlated with the thickness of the functional film layer 1300, that is, the thicker the functional film layer 1300 is, the more light it absorbs. Therefore, if the thickness of the functional film layer 1300 is greater than 600 nm, the light transmittance is low due to the large amount of light absorbed by the functional film layer 1300, which is undesirable. In addition, according to the formula P=U 2 / R shows that, under the condition of constant voltage, the smaller the resistance, the greater the heating efficiency. Since the square resistance of the functional film layer 1300 is negatively correlated with the thickness of the functional film layer 1300, that is, the smaller the thickness of the functional film layer 1300, the greater the square resistance of the functional film layer 1300, which in turn leads to the poorer conductivity of the functional film layer 1300. Therefore, if the thickness of the functional film layer 1300 is less than 20 nm, the conductivity of the functional film layer 1300 will be poor. It can be seen that the present disclosure is conducive to achieving better conductivity when the absorption of light by the functional film layer 1300 meets the requirements by controlling the thickness of the functional film layer 1300 within the range of 20 nm~600nm.

[0187] For example, the first film layer 1210 and the second film layer 1220 may be alternately stacked on one side of the substrate 1100 to form the first anti-reflection film layer 1200 ( Figure 2 ). It should be understood that the number and thickness of the first film layer 1210 and the second film layer 1220 are not limited to Figure 2 The quantity and thickness shown in , without departing from the concept of the present disclosure, those skilled in the art can set any quantity and thickness of the first film layer 1210 and the second film layer 1220 as needed.

[0188] For example, the first film layer 1210 may be a low refractive index film layer, for example, the refractive index of the first film layer 1210 may be in the range of 1.3 to 1.7. For example, the first film layer 1210 may include silicon oxide such as SiO 2 , aluminum oxide such as Al 2 O 3 、Magnesium fluoride such as MgF 2and SL4. For example, the first film layer 1210 may include but is not limited to SiO 2 、Al 2 O 3 MgF 2 , SL 4 Etc. and mixtures thereof. Exemplarily, the second film layer 1220 may be a high refractive index film layer, for example, the refractive index of the second film layer 1220 may be in the range of 1.8 to 4.0. Exemplarily, the second film layer 1220 may include one or more of the oxides, nitrides or hydrides of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, and silicon Si. For example, the second film layer 1220 may include but is not limited to one or more of the oxides, nitrides or hydrides of Ti, Ta, Nb, Zr, Hf, Si, etc., or a mixed material thereof. The present disclosure facilitates the formation of an optical interference effect and achieves the desired optical performance (such as achieving anti-reflection requirements) by setting the first anti-reflection film layer 1200 as a combination of high and low refractive index film layers.

[0189] For example, the number of the first film layer 1210 and the number of the second film layer 1220 may both be in the range of 1 to 7. For example, (L1H1) n The first anti-reflection film layer 1200 is formed in a stacked form, wherein L1 is the first film layer 1210, H1 is the second film layer 1220, and n is in the range of 1 to 7. Exemplarily, the thickness of the first anti-reflection film layer 1200 may be in the range of 50 nm to 2000 nm. The present disclosure is conducive to achieving the effect of reducing the reflectivity by matching the high and low refractive index film layers to meet the waveguide function by arranging the first film layer 1210 and the second film layer 1220 to be stacked alternately. In addition, by setting the thickness of the first anti-reflection film layer 1200 within a reasonable range, it is conducive to making the first anti-reflection film layer 1200 have a qualified film layer reliability on the basis of achieving the function of reducing the reflectivity. For example, if the thickness of the first anti-reflection film layer 1200 is less than 50 nm, the film refractive index matching cannot be achieved. If the thickness of the first anti-reflection film layer 1200 is greater than 2000 nm, the first anti-reflection film layer 1200 may be broken due to the stress accumulation of the first film layer 1210 and the second film layer 1220.

[0190] In the present disclosure, the first anti-reflection film layer 1200 can provide the optical element 1000 with an anti-reflection and anti-reflection effect. For example, the first anti-reflection film layer 1200 is located between the substrate 1100 and the functional film layer 1300, and can be used to adjust the refraction degree of light in the substrate 1100, so that the light emitted from the functional film layer 1300 smoothly transitions to the substrate 1100.

[0191] For example, the third film layer 1410 and the fourth film layer 1420 may be alternately stacked on the side of the functional film layer 1300 away from the first anti-reflection film layer 1200 to form the second anti-reflection film layer 1400 ( Figure 3) It should be understood that the number and thickness of the third film layer 1410 and the fourth film layer 1420 are not limited to Figure 3 With reference to the numbers and thicknesses shown in FIG, those skilled in the art may set any numbers and thicknesses of the third film layer 1410 and the fourth film layer 1420 as needed without departing from the concept of the present disclosure.

[0192] For example, the third film layer 1410 may be a low refractive index film layer, for example, the refractive index of the third film layer 1410 may be in the range of 1.3 to 1.7. For example, the third film layer 1410 may include silicon oxide such as SiO 2 , aluminum oxide such as Al 2 O 3 and magnesium fluoride such as MgF 2 For example, the third film layer 1410 may include but is not limited to SiO 2 、Al 2 O 3 MgF 2 , SL 4 Etc. and mixtures thereof. Exemplarily, the fourth film layer 1420 may be a high refractive index film layer, for example, the refractive index of the fourth film layer 1420 may be in the range of 1.8 to 4.0. Exemplarily, the fourth film layer 1420 may include one or more of the oxides, nitrides or hydrides of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, and silicon Si. For example, the fourth film layer 1420 may include but is not limited to one or more of the oxides, nitrides or hydrides of Ti, Ta, Nb, Zr, Hf, Si, etc., or a mixed material thereof. The present disclosure provides the second anti-reflection film layer 1400 with a combination of high and low refractive index film layers, which is conducive to forming an optical interference effect and achieving the desired optical performance (such as achieving anti-reflection requirements).

[0193] For example, the number of the third film layer 1410 and the fourth film layer 1420 may both be in the range of 1 to 7. nThe second anti-reflection film layer 1400 is formed in a stacked form, wherein L2 is the third film layer 1410, H2 is the fourth film layer 1420, and n is in the range of 1 to 7. Exemplarily, the thickness of the second anti-reflection film layer 1400 may be in the range of 30 nm to 400 nm. The present disclosure is advantageous in that the third film layer 1410 and the fourth film layer 1420 are alternately stacked, so as to achieve the effect of reducing the reflectivity by matching the high and low refractive index film layers to meet the waveguide function. In addition, by setting the thickness of the second anti-reflection film layer 1400 within a reasonable range, it is advantageous to make the second anti-reflection film layer 1400 have qualified film layer reliability on the basis of achieving the function of reducing the reflectivity. For example, if the thickness of the second anti-reflection film layer 1400 is less than 30 nm, the film refractive index matching cannot be achieved. If the thickness of the second anti-reflection film layer 1400 is greater than 400 nm, the second anti-reflection film layer 1400 may be broken due to the stress accumulation of the third film layer 1410 and the fourth film layer 1420.

[0194] In the present disclosure, the second anti-reflection film layer 1400 can provide the optical element 1000 with an anti-reflection and anti-reflection effect. For example, the second anti-reflection film layer 1400 is located between the functional film layer 1300 and the inside of the optical device, and can be used to adjust the refraction degree of the light emitted from the inside of the optical device in the functional film layer 1300, so that the light smoothly transitions to the functional film layer 1300.

[0195] Exemplarily, the equivalent optical path of the first anti-reflection film layer 1200, the functional film layer 1300, and the second anti-reflection film layer 1400 may be an odd multiple of 1 / 4λ, where λ is the wavelength of the light. An odd multiple of 1 / 4λ=n1×d1+n2×d2+n3×d3, where n1 is the refractive index of the first anti-reflection film layer 1200, d1 is the thickness of the first anti-reflection film layer 1200, n2 is the refractive index of the second anti-reflection film layer 1400, d2 is the thickness of the second anti-reflection film layer 1400, n3 is the refractive index of the functional film layer 1300, and d3 is the thickness of the functional film layer 1300. The present disclosure sets the equivalent optical path of the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 to satisfy n1×d1+n2×d2+n3×d3, so that the reflectivity of the first anti-reflection film layer 1200, the functional film layer 1300 and the second anti-reflection film layer 1400 to the light in the λ±100nm band (λ is 400 nm ~2000nm) is less than or equal to 1%. Exemplarily, the incident angle of the light can be in the range of 0±50°.

[0196] In addition, the present disclosure can achieve a square resistance of the functional film layer 1300 within the range of 20Ω / sq~200Ω / sq by selecting the material of the functional film layer 1300, setting the process technology, etc. By setting a multi-layer film layer such as setting a first anti-reflection film layer 1200, a functional film layer 1300 and a second anti-reflection film layer 1400, the anti-reflection performance of the optical element can be greatly improved, especially the reflectivity of the incident light at a large angle can be reduced, and the imaging clarity of the optical element can be improved. The present disclosure can achieve the power-on heating function of the functional film layer 1300 by controlling the square resistance of the functional film layer 1300 within the range of 20Ω / sq~200Ω / sq. For example, the functional film layer 1300 can be heated to 100°C at a voltage of 24V, which can quickly remove ice and dissipate water mist.

[0197] Exemplarily, the light absorption rate A of the functional film layer 1300 and the proportion Q of the oxygen element may satisfy: 10≤Q / A≤28. The light absorption rate A of the functional film layer 1300 decreases as the proportion Q of the oxygen element increases. For example, when the proportion Q of the oxygen element is 40%, the absorption rate A of the functional film layer 1300 to the light in the 400 nm ~2000 nm band is about 4%. When the proportion Q of the oxygen element is 70%, the absorption rate A of the functional film layer 1300 to the light in the 400 nm ~2000 nm band is about 2.5%.

[0198] In another embodiment of the present disclosure, reference may be made to Figure 4 , the substrate 1100 may include a resin material. The method 2000 may further include: disposing a bonding layer 1500 on one side of the substrate 1100. Exemplarily, disposing a first anti-reflection film layer 1200 on one side of the substrate 1100 may include: disposing the first anti-reflection film layer 1200 on one side of the bonding layer 1500.

[0199] Exemplarily, the substrate 1100 may include a resin material. The bonding layer 1500 may include a semiconductor material, wherein the semiconductor material includes at least one of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, silicon Si, and oxides thereof. For example, the bonding layer 1500 may include one or a mixture of Ti, Ta, Nb, Zr, Hf, Si, and oxides thereof.

[0200] In the actual process, after the substrate 1100 of the resin material is subjected to surface activation treatment, the surface chemical chain is broken and free radicals are generated. The bonding layer 1500 can be used as a gap semiconductor material. After receiving energy input, the semiconductor material can transition to an excited state, and active sites are released on the surface. It should be understood that the lower band gap width of the semiconductor material (such as about 3.2eV) is conducive to the generation of active sites. The strength of the bonding layer 1500 and the substrate 1100 combined together through chemical bonds is much greater than the bonding force of conventional coating processes relying on intermolecular adsorption. Therefore, the present disclosure is conducive to improving the bonding force between the substrate 1100 and the first anti-reflection film layer 1200 by setting the bonding layer 1500, thereby improving the overall firmness of the optical element.

[0201] For example, the thickness of the bonding layer 1500 may be in the range of 5 nm to 100 nm, which is beneficial to improving the bonding strength between the substrate 1100 and the first anti-reflection film layer 1200. If the thickness of the bonding layer 1500 is too large, such as greater than 100 nm, the thickness of the first anti-reflection film layer 1200 and the second anti-reflection film layer 1400 may increase synchronously.

[0202] In another embodiment of the present disclosure, reference may be made to Figure 5 or Figure 6 , the above method 2000 may also include: disposing a third anti-reflection film layer 1600 on the side of the substrate 1100 away from the first anti-reflection film layer 1200; and disposing a protective layer 1700 on the side of the third anti-reflection film layer 1600 away from the substrate 1100. The third anti-reflection film layer 1600 and the protective layer 1700 may be located on the other side of the substrate 1100, such as outside the optical device. Under normal circumstances, the light directly enters the external air of the optical device after passing through the substrate 1100, which may cause a large degree of light deflection, thereby causing the overall reflectivity of the optical element to increase and the transmittance to decrease, such as by about 3%. Based on this, the present disclosure is conducive to reducing the reflection of the optical element as a whole to light, increasing the overall light transmission of the optical element, and optimizing the function of the optical element by disposing the third anti-reflection film layer 1600 and the protective layer 1700.

[0203] For example, a fifth film layer (not shown) and a sixth film layer (not shown) may be alternately stacked on the side of the substrate 1100 away from the first anti-reflection film layer 1200 to form a third anti-reflection film layer 1600. It should be understood that, without departing from the concept of the present disclosure, those skilled in the art may set any number and thickness of the fifth film layer and the sixth film layer as needed. The side of the third anti-reflection film layer 1600 close to the substrate 1100 is the fifth film layer. For example, the fifth film layer may be in contact with the substrate 1100.

[0204] For example, the fifth film layer may be a low refractive index film layer, for example, the refractive index of the fifth film layer may be in the range of 1.3 to 1.7. For example, the fifth film layer may include silicon oxide such as SiO2 , aluminum oxide such as Al 2 O 3 and magnesium fluoride such as MgF 2 For example, the fifth film layer may include but is not limited to SiO 2 、Al 2 O 3 MgF 2 Etc. and mixtures thereof. Exemplarily, the sixth film layer may be a high refractive index film layer, for example, the refractive index of the sixth film layer may be in the range of 1.8 to 4.0. Exemplarily, the sixth film layer may include one or more of oxides, nitrides or hydrides of titanium Ti, tantalum Ta, niobium Nb, zirconium Zr, hafnium Hf, and silicon Si. For example, the sixth film layer may include but is not limited to one or more of oxides, nitrides or hydrides of Ti, Ta, Nb, Zr, Hf, Si, etc., or a mixed material thereof. Exemplarily, the number of the fifth film layer and the sixth film layer may both be in the range of 1 to 7. For example, (L3H3) n The third anti-reflection film layer 1600 is formed in a stacked form, wherein L3 is the fifth film layer, H3 is the sixth film layer, and n is in the range of 1 to 7. The third anti-reflection film layer 1600 is provided in the present disclosure to form an optical interference effect, thereby improving the transmittance of light from the substrate 1100 to the external air of the optical device, for example, the transmittance can be increased by about 3%.

[0205] Exemplarily, the protective layer 1700 may include a waterproof film layer and / or a hard film layer. The waterproof film layer and / or the hard film layer may reduce the surface tension of the film layer, and play a role in anti-fouling, self-cleaning, etc. In addition, the waterproof film layer and / or the hard film layer may also improve the mechanical properties of the film layer, and meet the requirements of anti-fouling, self-cleaning, and mechanical performance improvement of the optical element. Exemplarily, the protective layer 1700 may include a fluorine-containing organic substance. For example, the protective layer 1700 may be a fluorine-containing organic substance coating. The fluorine-containing organic substance coating may have a surface hydrophobic and oleophobic effect, thereby achieving a hydrophobic and oleophobic effect on the exposed surface of the optical element.

[0206] Another aspect of the present disclosure provides a method for manufacturing an optical device. The method includes: providing a light source; and providing an optical element on one side of the light source according to the method 2000 described above. The light emitted by the light source is incident on the second anti-reflection film layer of the optical element. For example, the light emitted by the light source may be incident on the second anti-reflection film layer 1400 in the optical element, and then sequentially pass through the functional film layer 1300, the first anti-reflection film layer 1200 and the substrate 1100 before being emitted.

[0207] Exemplarily, the manufactured optical device may be any optical device that can contact the external environment, such as an optical lens, a laser radar, or a HUD. For example, the optical device may be a laser radar.

[0208] Since the contents and structures involved in describing the optical element 1000 and the optical device above are fully or partially applicable to the optical element manufacturing method 2000 and the optical device manufacturing method described herein, the related or similar contents are not repeated here.

[0209] Although the exemplary structure and manufacturing method of the optical element are described herein, it is understood that one or more features can be omitted, replaced or added from the manufacturing method of the optical element. In addition, the various structures exemplified are only exemplary.

[0210] The above description is only a preferred embodiment of the present disclosure and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present disclosure is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with the technical features with similar functions disclosed in the present disclosure (but not limited to) by each other.

Claims

1. An optical element, comprising: substrate; A first anti-reflection film layer, located on one side of the substrate; A functional film layer, located on a side of the first anti-reflection film layer away from the substrate, and used to generate heat; as well as A second anti-reflection film layer, located on a side of the functional film layer away from the first anti-reflection film layer; Wherein, the first anti-reflection film layer and the second anti-reflection film layer both include multiple film layers with different refractive indices, and the transmittance of the optical element to light is greater than or equal to a preset value, The functional film layer includes oxygen element, and the absorption rate A of the functional film layer to light and the proportion Q of the oxygen element satisfy: 10≤Q / A≤28.

2. The optical element according to claim 1, wherein The preset value is greater than or equal to 92%, and the reflectivity of the optical element to light is less than or equal to 1%.

3. The optical element according to claim 1, wherein The thickness of the first anti-reflection film layer is in the range of 50 nm to 2000 nm, and the first anti-reflection film layer includes a first film layer and a second film layer that are alternately stacked. Wherein, the side of the first anti-reflection film layer close to the substrate is the first film layer; The side of the first anti-reflection film layer away from the substrate is the first film layer or the second film layer; and The refractive index of the first film layer is in the range of 1.3-1.7, and the refractive index of the second film layer is in the range of 1.8-4.

0.

4. The optical element according to claim 3, wherein: The first film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride; the second film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon; and The number of the first film layer and the number of the second film layer are both in the range of 1 to 7.

5. The optical element according to claim 1, wherein The thickness of the second anti-reflection film layer is in the range of 30 nm to 400 nm, and the second anti-reflection film layer includes a third film layer and a fourth film layer that are alternately stacked. Wherein, the side of the second antireflection film layer close to the functional film layer is the third film layer; The side of the second anti-reflection film layer away from the functional film layer is the third film layer or the fourth film layer; and The refractive index of the third film layer is in the range of 1.3 to 1.7, and the refractive index of the fourth film layer is in the range of 1.8 to 4.

0.

6. The optical element according to claim 5, wherein: The third film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride; The fourth film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium or silicon; and The number of the third film layer and the number of the fourth film layer are both in the range of 1 to 7.

7. The optical element according to claim 1, wherein: The thickness of the functional film layer is in the range of 20 nm to 600 nm, the square resistance of the functional film layer is in the range of 2Ω / sq to 200Ω / sq, and the refractive index of the functional film layer to the light is in the range of 2.0 to 2.

3.

8. The optical element according to claim 7, wherein: The functional film layer includes one or more of metal materials, semiconductor materials and alloy materials. Wherein, the metal material includes one or more of gold, silver, copper and aluminum; and The semiconductor material includes one or more of indium tin oxide and aluminum zinc oxide.

9. The optical element according to claim 8, wherein: The oxygen element accounts for 40% to 75% of all elements contained in the functional film layer.

10. The optical element according to any one of claims 1 to 9, wherein: At least one of the first anti-reflection film layer, the functional film layer and the second anti-reflection film layer is formed by an evaporation coating process, a sputtering coating process or a vapor deposition coating process.

11. The optical element according to any one of claims 1 to 9, wherein: The optical element further comprises a bonding layer located between the substrate and the first anti-reflection film layer. Wherein, the thickness of the bonding layer is in the range of 5 nm to 100 nm, and the bonding layer includes semiconductor materials, wherein the semiconductor materials include one or more of titanium, tantalum, niobium, zirconium, hafnium, silicon and oxides thereof.

12. The optical element according to any one of claims 1 to 9, wherein: The optical element further includes a protective layer located on a side of the substrate away from the first anti-reflection film layer, wherein the protective layer includes at least one of a waterproof film layer and a hard film layer.

13. The optical element according to claim 12, wherein: The optical element further comprises: A third anti-reflection film layer is located between the substrate and the protective layer, wherein the thickness of the third anti-reflection film layer is in the range of 100 nm to 500 nm, and the third anti-reflection film layer includes a fifth film layer and a sixth film layer that are alternately stacked, Wherein, the number of the fifth film layer and the sixth film layer are both in the range of 1 to 7; The refractive index of the fifth film layer is in the range of 1.3 to 1.7, and the refractive index of the sixth film layer is in the range of 1.8 to 4.0; and The fifth film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride, and the sixth film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon.

14. The optical element according to claim 12, wherein: The thickness of the protective layer is in the range of 5 nm to 50 nm, and the protective layer includes fluorine-containing organic matter.

15. The optical element according to any one of claims 1 to 9, wherein: The equivalent optical path of the first anti-reflection film layer, the functional film layer and the second anti-reflection film layer is an odd multiple of 1 / 4λ, where λ is the wavelength of the light. Among them, the odd number multiple of 1 / 4λ=n1×d1+n2×d2+n3×d3, wherein n1 is the refractive index of the first anti-reflection film layer, d1 is the thickness of the first anti-reflection film layer, n2 is the refractive index of the second anti-reflection film layer, d2 is the thickness of the second anti-reflection film layer, n3 is the refractive index of the functional film layer, and d3 is the thickness of the functional film layer.

16. The optical element according to any one of claims 1 to 9, wherein: The substrate includes one or more of a glass material, a plastic material, and a ceramic material.

17. An optical device comprising: light source; The optical element according to any one of claims 1 to 16, wherein the light emitted by the light source is incident on the second anti-reflection film layer.

18. A method for manufacturing an optical element, comprising: Disposing a first anti-reflection film layer on one side of the substrate; Disposing a functional film layer on a side of the first anti-reflection film layer away from the substrate, the functional film layer being used to generate heat; and Disposing a second anti-reflection film layer on a side of the functional film layer away from the first anti-reflection film layer; Wherein, the first anti-reflection film layer and the second anti-reflection film layer both include multiple film layers with different refractive indices, so that the transmittance of the optical element to light is greater than or equal to a preset value, The functional film layer includes oxygen element, and the absorption rate A of the functional film layer to light and the proportion Q of the oxygen element satisfy: 10≤Q / A≤28.

19. The method according to claim 18, wherein: At least one of the first anti-reflection film layer, the functional film layer and the second anti-reflection film layer is formed by an evaporation coating process, a sputtering coating process or a vapor deposition coating process.

20. The method according to claim 18, wherein: The functional film layer includes one or more of gold, silver, copper, aluminum, indium tin oxide, and aluminum zinc oxide, and the functional film layer is arranged on a side of the first anti-reflection film layer away from the substrate, including: The temperature T in the coating chamber is set in the range of 50°C to 250°C, the vacuum degree P is set in the range of 0.0001 Pa to 0.1 Pa, and the oxygen filling amount F is set in the range of 1 sccm to 500 sccm, so that the proportion of oxygen elements in the functional film layer to all elements in the functional film layer is within the range of 40% to 75%.

21. The method according to claim 20, wherein: The temperature T, vacuum degree P and oxygen filling amount F in the coating chamber satisfy: 0.1≤-log(P)×T / F≤750.

22. The method according to claim 20, wherein: The oxygen partial pressure X, vacuum degree P and oxygen filling amount F in the coating chamber satisfy: X=kF / P, wherein k is in the range of 0.005-0.

02.

23. The method according to claim 20, wherein: The sheet resistance R of the functional film layer, the oxygen partial pressure X in the coating chamber and the temperature T in the coating chamber satisfy: R=-0.0005X 3 +0.15084X 2 -11.405X+275.61+0.031T.

24. The method according to claim 18, wherein: Providing a first anti-reflection film layer on one side of the substrate includes: The first anti-reflection film layer is formed by alternately stacking a first film layer and a second film layer on one side of the substrate, Wherein, the thickness of the first antireflection film layer is in the range of 50 nm to 2000 nm; The number of the first film layer and the number of the second film layer are both in the range of 1 to 7; The first film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride, and the refractive index of the first film layer is in the range of 1.3 to 1.7; and The second film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon, and the refractive index of the second film layer is in the range of 1.8 to 4.

0.

25. The method of claim 18, wherein: Providing a second anti-reflection film layer on a side of the functional film layer away from the first anti-reflection film layer comprises: A third film layer and a fourth film layer are alternately stacked on a side of the functional film layer away from the first anti-reflection film layer to form the second anti-reflection film layer, Wherein, the thickness of the second antireflection film layer is in the range of 30 nm to 400 nm; The number of the third film layer and the fourth film layer are both in the range of 1 to 7; The third film layer comprises one or more of silicon oxide, aluminum oxide and magnesium fluoride, and the refractive index of the third film layer is in the range of 1.3 to 1.7; and The fourth film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon, and the refractive index of the fourth film layer is in the range of 1.8 to 4.

0.

26. The method of claim 18, wherein: The method further comprises: Disposing a bonding layer on one side of the substrate, wherein the bonding layer comprises a semiconductor material; Wherein, providing a first anti-reflection film layer on one side of the substrate comprises: The first anti-reflection film layer is disposed on one side of the bonding layer.

27. The method according to any one of claims 18 to 26, wherein: The method further comprises: A protective layer is disposed on a side of the substrate away from the first anti-reflection film layer, wherein the protective layer includes at least one of a waterproof film layer and a hard film layer.

28. The method according to claim 27, wherein: The method further comprises: Disposing a third anti-reflection film layer on a side of the substrate away from the first anti-reflection film layer; Wherein, a protective layer is provided on a side of the substrate away from the first anti-reflection film layer, comprising: The protective layer is disposed on a side of the third anti-reflection film layer away from the substrate.

29. The method according to claim 28, wherein: Providing a third anti-reflection film layer on a side of the substrate away from the first anti-reflection film layer comprises: The third anti-reflection film layer is formed by alternately stacking a fifth film layer and a sixth film layer on a side of the substrate away from the first anti-reflection film layer. Wherein, the number of the fifth film layer and the sixth film layer are both in the range of 1 to 7; The refractive index of the fifth film layer is in the range of 1.3 to 1.7, and the refractive index of the sixth film layer is in the range of 1.8 to 4.0; and The fifth film layer includes one or more of silicon oxide, aluminum oxide and magnesium fluoride, and the sixth film layer includes one or more of oxides, nitrides or hydrides of titanium, tantalum, niobium, zirconium, hafnium and silicon.

30. A method for manufacturing an optical device, comprising: Set up the light source; as well as The optical element is arranged on one side of the light source according to the method of any one of claims 18 to 29, wherein the light emitted by the light source is incident on the second anti-reflection film layer of the optical element.

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