Micro light emitting diode device packaging structure, packaging method and display device

Abstract

This application provides a micro-LED device packaging structure, packaging method, and display device. The packaging structure includes a micro-LED device and a transparent cover plate. The micro-LED device includes an electrically connected micro-LED chip and a driver chip. The transparent cover plate includes a color conversion layer. The transparent cover plate is disposed on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a portion of the light-emitting area of ​​the micro-LED chip. As a result, the packaging structure of this application has excellent packaging reliability and color display performance.

Description

Technical Field

[0001] The present application relates to the field of semiconductor light emitting technology, and in particular to a micro light emitting diode device packaging structure, a packaging method and a display device. Background Art

[0002] Micro-LED (Micro-Light Emitting Diode) display technology is a display technology that miniaturizes and arrays the traditional LED (Light Emitting Diode) structure and uses CMOS (Complementary Metal Oxide Semiconductor) or TFT (Thin Film Transistor) to make driving circuits to achieve addressing control and individual drive of each pixel.

[0003] Micro-LEDs need to be packaged after fabrication, and the packaging methods of Micro-LEDs in related technologies need to be improved. Summary of the Invention

[0004] The purpose of this application is to provide a micro light emitting diode device packaging structure, packaging method and display device.

[0005] In a first aspect, the present application provides a packaging structure, comprising:

[0006] A micro light emitting diode device comprising an electrically connected micro light emitting diode chip and a driver chip; and

[0007] The light-transmitting cover plate includes a color conversion layer. The light-transmitting cover plate is arranged on the light-emitting side of the micro-LED chip. The color conversion layer covers at least a part of the light-emitting area of ​​the micro-LED chip.

[0008] Optionally, the light-transmitting cover plate includes a first surface and a second surface that are arranged opposite to each other, the second surface is located between the first surface and the micro-LED chip, and the color conversion layer is arranged on the second surface.

[0009] Optionally, the micro-LED chip further includes a non-luminous area, and the transparent cover further includes a light-shielding layer, and the light-shielding layer covers the non-luminous area.

[0010] Optionally, the light-shielding layer is provided on the first surface.

[0011] Optionally, the packaging structure further includes:

[0012] A plastic frame structure is provided on the driving chip, and the plastic frame structure connects the micro light emitting diode device and the light-transmitting cover plate, and supports the light-transmitting cover plate.

[0013] Optionally, the plastic frame structure is provided with a notch; and the packaging structure further comprises:

[0014] A sealing colloid is used to fill and seal the gap.

[0015] Optionally, the notch is provided on an edge of the plastic frame structure, and the ratio of the opening size of the notch to the length size of the edge is between 2% and 10%.

[0016] Optionally, the packaging structure further includes:

[0017] A packaging substrate, comprising a carrier board and a circuit board connected to each other, wherein the micro light emitting diode device is arranged on the carrier board, and the circuit board is electrically connected to the driver chip via an electrical connector; and

[0018] The packaging colloid wraps the electrical connector and is connected to the colloid frame structure.

[0019] Optionally, the packaging structure further includes:

[0020] The reinforcing colloid is arranged on a side of the circuit board away from the micro-light emitting diode device and in an area adjacent to a connection area between the circuit board and the carrier board.

[0021] Optionally, the packaging substrate further includes a reinforcing sheet and a terminal structure provided on two opposite sides of the circuit board, and the projection of the reinforcing sheet on the circuit board covers the projection of the terminal structure on the circuit board.

[0022] In a second aspect, the present application further provides a packaging method for a micro-light emitting diode device packaging structure, comprising:

[0023] A micro light emitting diode device is provided, wherein the micro light emitting diode device includes a micro light emitting diode chip and a driver chip that are electrically connected;

[0024] Providing a light-transmitting cover plate, wherein the light-transmitting cover plate includes a color conversion layer;

[0025] The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a portion of the light-emitting area of ​​the micro-LED chip to form a packaging structure.

[0026] Optionally, the light-transmitting cover plate includes a first surface and a second surface that are arranged opposite to each other;

[0027] The light-transmitting cover plate is provided, and the light-transmitting cover plate includes a color conversion layer, including:

[0028] Providing a light-transmitting cover plate, and forming a color conversion layer on a second surface of the light-transmitting cover plate;

[0029] The step of arranging the light-transmitting cover plate on the light-emitting side of the micro-LED chip includes:

[0030] The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the second surface is located between the first surface and the micro-LED chip.

[0031] Optionally, the micro-LED chip further includes a non-luminous area, and the light-transmitting cover further includes a light-shielding layer;

[0032] The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a portion of the light-emitting area of ​​the micro-LED chip to form a packaging structure, including:

[0033] The transparent cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers the light-emitting area, and the light-shielding layer covers the non-light-emitting area.

[0034] Optionally, disposing the light-transmitting cover plate on the light-emitting side of the micro-LED chip includes:

[0035] forming a glue frame structure on the surface of the driver chip;

[0036] The light-transmitting cover plate is arranged on the light-emitting side of the micro-LED chip, and the light-transmitting cover plate is connected to the micro-LED device through the glue frame structure.

[0037] Optionally, the plastic frame structure is provided with a notch, and the packaging method further comprises:

[0038] Fill the gap with a sealing colloid, and allow the sealing colloid to seal the gap.

[0039] Optionally, the notch is provided on an edge of the plastic frame structure, and the ratio of the opening size of the notch to the length size of the edge is between 2% and 10%.

[0040] Optionally, the packaging structure further includes a packaging substrate, and the packaging substrate includes a carrier plate and a circuit board connected to each other;

[0041] After the step of providing the micro light emitting diode device, the method further includes:

[0042] Placing the micro light emitting diode device on the carrier board, and electrically connecting the circuit board to the driver chip via an electrical connector;

[0043] The electrical connector is filled with colloid to form a packaging colloid that wraps the electrical connector.

[0044] In a third aspect, the present application further provides a display device, which includes the packaging structure as described above; or, the display device includes the packaging structure prepared by the packaging method as described above.

[0045] Based on the above technical solution, the transparent cover plate of the packaging structure of the present application is arranged on the side of the micro-LED chip of the micro-LED device away from the driver chip. The transparent cover plate can encapsulate and protect the micro-LED device, reduce the adverse effects of water vapor and other objects on the micro-LED device, and improve the reliability of the packaging structure. At the same time, the transparent cover plate has a high light transmittance effect, which can ensure that the micro-LED device has a better luminous brightness. Moreover, the transparent cover plate also includes a color conversion layer. The color conversion layer of the transparent cover plate can convert the color of the light emitted by the micro-LED device and realize the color display of the micro-LED device, so that the micro-LED device does not need to set up a color display process, simplifies the process flow of the entire packaging structure, and reduces the preparation cost of the entire packaging structure. Based on this, the present application realizes the packaging of the micro-LED device through a transparent cover plate with a color conversion layer, and the packaging structure has better packaging reliability and color display performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] To more clearly illustrate the technical solutions of this application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of this application, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0047] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0048] Figure 1 A schematic diagram of a packaging structure provided in an embodiment of the present application;

[0049] Figure 2 for Figure 1 A schematic structural diagram of the package structure shown in another direction;

[0050] Figure 3 A schematic structural diagram of a micro light-emitting diode chip provided in an embodiment of the present application;

[0051] Figure 4 A schematic diagram of the structure of a driver chip provided in an embodiment of the present application;

[0052] Figure 5 A schematic diagram of the bonding connection between the driver chip and the micro light-emitting diode chip provided in an embodiment of the present application;

[0053] Figure 6 A schematic structural diagram of a micro light emitting diode device provided in an embodiment of the present application;

[0054] Figure 7 A schematic structural diagram of a packaging substrate provided in an embodiment of the present application;

[0055] Figure 8 A schematic diagram of a connection between a packaging substrate and a micro light-emitting diode device provided in an embodiment of the present application;

[0056] Figure 9 A schematic diagram of the structure of the package substrate provided in an embodiment of the present application connected to the micro light-emitting diode device with the first substrate removed;

[0057] Figure 10 A schematic diagram of an electrical connection between a circuit board and a driver chip according to an embodiment of the present application;

[0058] Figure 11 for Figure 10 A schematic diagram of another orientation of the structure shown;

[0059] Figure 12 for Figure 10 The structure shown is a schematic diagram of a structure after being filled with encapsulating colloid;

[0060] Figure 13 for Figure 12 A schematic structural diagram of another direction of the structure shown;

[0061] Figure 14 A schematic structural diagram of a light-transmitting cover provided in an embodiment of the present application;

[0062] Figure 15 A schematic diagram of a structure of a plastic frame structure provided in an embodiment of the present application;

[0063] Figure 16 A schematic diagram of a connection of the plastic frame structure provided in an embodiment of the present application;

[0064] Figure 17 for Figure 16 A schematic diagram of another orientation of the structure shown;

[0065] Figure 18 A schematic diagram of a connection between the plastic frame structure and the light-transmitting cover provided in an embodiment of the present application;

[0066] Figure 19 for Figure 18A schematic diagram of another orientation of the structure shown;

[0067] Figure 20 A schematic diagram of a structure of a packaging structure including a sealing colloid provided in an embodiment of the present application;

[0068] Figure 21 A schematic diagram of a structure of a packaging structure including a reinforcing colloid provided in an embodiment of the present application;

[0069] Figure 22 A schematic diagram of a first process flow of the packaging method provided in an embodiment of the present application;

[0070] Figure 23 A second flow chart of the packaging method provided in an embodiment of the present application;

[0071] Figure 24 A schematic structural diagram of a display device provided in an embodiment of the present application.

[0072] The reference numerals indicate:

[0073] 10. Packaging structure; 20. Display device; 100. Packaging substrate; 200. Micro-LED device; 300. Transparent cover; 400. Packaging colloid; 500. Glue frame structure; 600. Sealing colloid; 700. Reinforcement colloid; 800. Reinforcement sheet; 900. Electrical connector; 110. Carrier board; 120. Circuit board; 210. Micro-LED chip; 220. Driver chip; 230. Filling structure; 240. Solid crystal structure; 310. Shading layer; 320. Color conversion layer; 510. Notch; 121. First terminal structure; 122. Two-terminal structure; 123, welding wire area; 201, light-emitting area; 202, non-light-emitting area; 211, first substrate; 212, first semiconductor layer; 213, light-emitting layer; 214, second semiconductor layer; 215, first electrode layer; 216, second electrode layer; 217, solder joint structure; 221, second substrate; 222, driving circuit; 223, driving pad; 224, bonding area; 321, black barrier glue; 322, no quantum dot structure; 323, red quantum dot structure; 324, green quantum dot structure; 331, first side; 332, second side. DETAILED DESCRIPTION

[0074] The following will be combined with the appendix of this application Figure 1 To the attached Figure 24 The present invention clearly and completely describes the technical solutions in this application through the following examples. Obviously, the examples described are only some of the examples in this application, not all of them. All other examples obtained by those skilled in the art based on the examples in this application without creative effort are within the scope of protection of this application.

[0075] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0076] The following is a detailed description with reference to specific embodiments. It should be noted that the embodiments of the present application can be presented in various forms, some of which will be described below.

[0077] Please refer to Figure 1 and Figure 2 , Figure 1 A schematic structural diagram of a micro-LED device packaging structure 10 (hereinafter referred to as packaging structure 10) provided in an embodiment of the present application is shown. Figure 2 for Figure 1 The package structure 10 is shown in another direction. The package structure 10 includes a micro light emitting diode device 200 and a transparent cover 300.

[0078] The micro-LED device 200 includes an electrically connected micro-LED chip 210 and a driver chip 220. A transparent cover 300 includes a color conversion layer 320. The transparent cover 300 is disposed on the light-emitting side of the micro-LED chip 210. The color conversion layer 320 covers at least a portion of the light-emitting region 201 of the micro-LED chip 210, such that the orthographic projection of the color conversion layer 320 on the micro-LED chip 210 covers at least a portion of the light-emitting region 201. The light-emitting side of the micro-LED chip 210 is the side of the micro-LED chip 210 facing away from the packaging substrate 100, which will be described later. The electrically connected micro-LED chip 210 and the driver chip 220 can be homogenously integrated.

[0079] It is understood that in some examples, the micro-LED chip 210 further includes a non-luminescent region 202, which is disposed around the outer periphery of the luminescent region 201, with the luminescent region 201 located inside the non-luminescent region 202. In some examples, the non-luminescent region 202 serves as the electrode and trace region of the micro-LED chip 210, while the luminescent region 201 serves as the pixel region of the micro-LED chip 210. The luminescent region 201 includes the luminescent surface of the micro-LED chip 210 and the layered structure below the luminescent surface, while the non-luminescent region 202 includes the non-luminescent surface of the micro-LED chip 210 and the layered structure below the luminescent surface.

[0080] It is understandable that if Figure 3 As shown, Figure 3 A schematic structural diagram of a micro-LED chip 210 provided in an embodiment of the present application is shown in FIG. Figure 3 in Figure 3 (a) and Figure 3 (b) Schematic diagrams of the structure of a micro-LED chip 210 from different directions are shown. The micro-LED chip 210 includes a first substrate 211, and a first semiconductor layer 212, a light-emitting layer 213, a second semiconductor layer 214, a first electrode layer 215, a second electrode layer 216, and multiple solder joint structures 217 formed on the first substrate 211. The first substrate 211 is used to support the film structure thereon and can be a sapphire substrate, a silicon substrate, or a silicon carbide substrate. The light-emitting layer 213 is a quantum well layer, for example, an indium gallium nitride quantum well layer or an indium gallium nitride / gallium nitride multi-quantum well layer. The first semiconductor layer 212 is either an N-type semiconductor layer or a P-type semiconductor layer, and the second semiconductor layer 214 is either an N-type semiconductor layer or a P-type semiconductor layer. The N-type semiconductor layer is either an N-type gallium nitride layer or an N-type gallium arsenide layer, and the P-type semiconductor layer is either a P-type gallium nitride layer or a P-type aluminum gallium nitride layer. The first electrode layer 215 is disposed on a side of the second semiconductor layer 214 facing away from the light-emitting layer 213 and is electrically connected to the second semiconductor layer 214. The second electrode layer 216 is disposed in an exposed area of ​​the first semiconductor layer 212 and is electrically connected to the first semiconductor layer 212. A solder joint structure 217 is connected to the first electrode layer 215 and the second electrode layer 216. The solder joint structure 217 can be made of, but is not limited to, metals such as indium (In), aluminum (Al), tin (Sn), silver (Ag), gold (Au), gold-tin alloy, and nickel-gold alloy. The solder joint structure 217 is used to electrically connect to the driver chip 220, such as by bonding. It should be noted that the above is only an example of the micro-LED chip 210. For example, the micro-LED chip 210 may also include structures such as a current diffusion layer and a buffer layer.

[0081] It is understandable that if Figure 3As shown, the first semiconductor layer 212, the light-emitting layer 213, the second semiconductor layer 214, the first electrode layer 215, and the solder joint structure 217 connected thereto can form a plurality of spaced-apart pixel units. The driver chip 220 can drive the plurality of pixel units of the micro-LED chip 210 to emit light. The first electrode layer 215 serves as the P electrode, or positive electrode, of the micro-LED chip 210, and the second electrode layer 216 serves as the N electrode, or negative electrode, of the micro-LED chip 210. In this case, the first region formed by the entire first electrode layer 215 and the layered structures above and below it can serve as the P region of the micro-LED chip 210. The second region formed by the entire second electrode layer 216 and the layered structures above and below it can serve as the N region of the micro-LED chip 210. The P region can serve as the light-emitting region 201 of the micro-LED chip 210, and the N region can serve as the non-light-emitting region 202 of the micro-LED chip 210. It should be noted that the first electrode layer 215 can also be an N-electrode and the second electrode layer 216 can be a P-electrode. In this case, the first region can be an N-region and the light-emitting region 201 , and the second region can be a P-region and the non-light-emitting region 202 .

[0082] Among them, such as Figure 4 As shown, Figure 4 A schematic diagram of the structure of the driver chip 220 provided in an embodiment of the present application is shown in FIG. Figure 4 in Figure 4 (a) and Figure 4 (b) Schematic diagrams of the driver chip 220 from different directions. Driver chip 220 includes a second substrate 221, a driver circuit 222 formed on the second substrate 221, and a plurality of driver pads 223. Driver circuit 222 may have, but is not limited to, a CMOS circuit structure or a TFT circuit structure. Driver pads 223 may be made of, but are not limited to, metals such as In, Al, Sn, Ag, Au, gold-tin alloy, and nickel-gold alloy.

[0083] It is understandable that, combined with Figure 4 Please also refer to Figure 5 , Figure 5 This is a schematic diagram of the bonding connection between the driver chip 220 and the micro-LED chip 210 provided in an embodiment of the present application. The multiple driver pads 223 of the driver chip 220 are used to form the bonding area 224 of the driver chip 220 and are used to be arranged in a one-to-one correspondence with the multiple solder joint structures 217 of the micro-LED chip 210 and electrically connected, such as by bonding, in a one-to-one correspondence. The driver chip 220 is located between the micro-LED chip 210 and the packaging substrate 100. The driver chip 220 provides electrical signals to the micro-LED chip 210 and controls the micro-LED chip 210 to emit light.

[0084] It should be noted that, in other embodiments, the driver chip 220 and the micro-LED chip 210 can also be manufactured on the same substrate and electrically connected. In this case, the thickness of the micro-LED device 200 is relatively thin. Figure 6 As shown, Figure 6 This is a structural schematic diagram of a micro-LED device 200 provided in an embodiment of the present application. The micro-LED device 200 can also include a filling structure 230. The micro-LED device 200 can fill the filling structure 230, such as glue, from the bonding gap between the micro-LED chip 210 and the driver chip 220 into the interior of the micro-LED device 200 and form the micro-LED device 200 of the embodiment of the present application. The filling structure 230 can be filled between multiple pixel units of the micro-LED chip 210.

[0085] In some examples, please refer to Figure 1 and Figure 2 As shown, the package structure 10 further includes a package substrate 100, which is used to support the micro-LED device 200 and the transparent cover 300. The package substrate 100 includes a carrier plate 110 and a circuit board 120 connected to each other. The driver chip 220 is disposed on the carrier plate 110, and the circuit board 120 is electrically connected to the driver chip 220 via an electrical connector 900.

[0086] It is understandable that if Figure 7 As shown, Figure 7 A schematic structural diagram of the packaging substrate 100 provided in an embodiment of the present application. Figure 7 middle Figure 7 (a) to Figure 7 (c) is a schematic diagram of the structure of the package substrate 100 in different directions. The circuit board 120 of the package substrate 100 is stacked and connected to the carrier board 110. The first end of the circuit board 120 is connected to the carrier board 110, and the second end of the circuit board 120 extends outside the carrier board 110 and is used to electrically connect to the external circuit to receive electrical signals and control signals provided by the external circuit. In some examples, the carrier board 110 is a heat dissipation substrate. The heat dissipation substrate is a metal or non-metal structure. The heat dissipation substrate can increase the heat dissipation of the package structure 10. In some examples, the circuit board 120 can be a flexible board, for example, the circuit board 120 has a flexible cable structure. The flexible circuit board 120 is lighter in weight, more reliable, and more convenient for transporting the package structure 10.

[0087] It is understandable that if Figure 8 As shown, Figure 8 This is a schematic diagram of a connection between the package substrate 100 and the micro-LED device 200 provided in an embodiment of the present application. The micro-LED device 200 and the circuit board 120 are disposed on the same surface of the carrier board 110 and are spaced apart from each other. Figure 6 The bonded structure filled with glue is fixed to the carrier board 110 via a die-bonding structure 240, thereby achieving connection between the driver chip 220 and the carrier board 110. The die-bonding structure 240 may be, but is not limited to, glue, a metal welding material structure, or a non-metallic welding material structure.

[0088] It is understandable that if Figure 9 As shown, Figure 9 This is a schematic diagram of the structure of the package substrate 100 provided in an embodiment of the present application, connected to the micro-LED device 200, with the first substrate 211 removed. After the micro-LED device 200 is connected to the carrier plate 110, the first substrate 211 of the micro-LED chip 210 is removed using a laser lift-off (LLO) process.

[0089] It is understandable that if Figure 10 and Figure 11 As shown, Figure 10 This is a schematic diagram of an electrical connection between the circuit board 120 and the driver chip 220 according to an embodiment of the present application. Figure 11 for Figure 10 Schematic diagram of another orientation of the structure shown. After the first substrate 211 is peeled off, the driver chip 220 is electrically connected to the circuit board 120 via the electrical connector 900. For example, the circuit board 120 is further provided with electrical connection terminals, such as the first terminal structure 121. A wire bonding process is used to connect the circuit board 120 and the driver chip 220. The electrical connector 900 achieves electrical connection between the circuit board 120 and the driver chip 220 through the first terminal structure 121. The driver chip 220 can receive electrical signals and control signals transmitted by the circuit board 120 and control the micro-LED chip 210 to emit light. The electrical connector 900 can be, but is not limited to, a conductive gold wire, a conductive copper wire, a conductive aluminum wire, or the like.

[0090] It is understandable that, combined with Figure 10 and Figure 11 And refer to Figure 12 and Figure 13 , Figure 12 for Figure 10 The structure shown is a schematic diagram of a structure after the encapsulation colloid 400 is filled. Figure 13 for Figure 12A schematic structural diagram of another direction of the structure shown. A wire bonding area 123 is preset on the circuit board 120, and the wire bonding area 123 extends from the first end of the circuit board 120 toward the second end and covers the area where the electrical connector 900 is located. That is to say, the first side edge of the wire bonding area 123 is aligned with the first end, and the second side edge of the wire bonding area 123, which is arranged opposite to the first side edge, is located between the second end and the first terminal structure 121. Of course, the wire bonding area 123 may also exceed the first end of the circuit board 120. For example, one side edge of the wire bonding area 123 extends toward the direction where the micro-light-emitting diode device 200 is located, and extends to the surface of the driver chip 220; even, one side edge of the wire bonding area 123 also extends to the side wall edge of the micro-light-emitting diode chip 210. At this time, the wire bonding area 123 covers a wider area, and the encapsulation colloid 400 filled therein can seal more areas. As shown Figure 12 and Figure 13 As shown, during the production process, a glue dispensing process is performed on the bonding wire area 123 to form an encapsulation gel 400 that wraps around the electrical connector 900. Specifically, glue is first dispensed around the electrical connector 900 to form a dam wall, and then the dam wall area is filled with glue to form the encapsulation gel 400. The encapsulation gel 400 wraps around the electrical connector 900, minimizing corrosion from moisture and other liquids at the electrical connection between the circuit board 120 and the driver chip 220, thereby improving the airtightness and reliability of the package structure 10.

[0091] In some examples, the transparent cover 300 further includes a light-shielding layer 310 , which can cover the non-luminous area 202 of the micro-LED chip 210 , and the projection of the light-shielding layer 310 on the micro-LED chip 210 covers the non-luminous area 202 .

[0092] It is understandable that if Figure 14 As shown, Figure 14 A structural schematic diagram of the light-transmitting cover plate 300 provided in an embodiment of the present application. Figure 14 in Figure 14 (a) and Figure 14(b) Schematic diagrams of the structure of the transparent cover plate 300 in different directions. The transparent cover plate 300 is attached to the top of the micro-LED device 200. The transparent cover plate 300 can be, but is not limited to, an inorganic glass sheet, an organic glass sheet, a transparent resin substrate, a glass fiber reinforced plastic substrate, etc. The transparent cover plate 300 carries a light-shielding layer 310 and a color conversion layer 320. The light-shielding layer 310 and the color conversion layer 320 can be arranged on the same layer or in layers. The arrangement relationship between the light-shielding layer 310 and the color conversion layer 320 corresponds to the arrangement relationship between the light-emitting area 201 and the non-light-emitting area 202 of the micro-LED chip 210. The light-shielding layer 310 is arranged around the outer periphery of the color conversion layer 320. The light-shielding layer 310 is a black glue layer or other structure that can block light. The color conversion layer 320 includes black barrier glue 321 and quantum dot structures. The black barrier glue 321 is arranged in a crisscross pattern to form individual filling cells. The quantum dot structures are arranged in a cyclic pattern, with a non-quantum dot structure 322, a red quantum dot structure 323, and a green quantum dot structure 324, filling the corresponding filling cells to form individual quantum dot blocks. When the transparent cover 300 is placed over and connected to the micro-LED chip 210, each quantum dot block in the color conversion layer 320 corresponds to a pixel unit in the micro-LED chip 210, thereby achieving color conversion for each pixel unit.

[0093] It can be understood that the size of the transparent cover 300 is the same as the size of the micro-LED chip 210, or the size of the transparent cover 300 is larger than the size of the micro-LED chip 210, so that the color conversion layer 320 can completely cover the positive projection of the light-emitting area 201 on the transparent cover 300, and the color conversion layer 320 is arranged opposite to the light-emitting area 201; the shading layer 310 can completely cover the positive projection of the non-luminous area 202 on the transparent cover 300, and the shading layer 310 is arranged opposite to the non-luminous area 202.

[0094] The transparent cover plate 300 of the package structure 10 of the embodiment of the present application is disposed on the side of the micro-LED chip 210 of the micro-LED device 200 that faces away from the driver chip 220. The transparent cover plate 300 can encapsulate and protect the micro-LED device 200, reducing the adverse effects of moisture and other objects on the micro-LED device 200. This can improve the reliability of the package structure 10. Furthermore, the transparent cover plate 300 has a high light transmittance, ensuring that the micro-LED device 200 emits excellent brightness. Furthermore, the transparent cover plate 300 also includes a color conversion layer 320 that converts the color of light emitted by the micro-LED device 200, thereby enabling color display of the micro-LED device 200. Consequently, the micro-LED device 200 does not require a color display production process, simplifying the process flow of the entire package structure 10 and reducing the manufacturing cost of the entire package structure 10. Based on this, the present application realizes the packaging of the micro light-emitting diode device 200 through the transparent cover plate 300 with the color conversion layer 320, and the packaging structure 10 has better packaging reliability and color display performance.

[0095] Furthermore, when the carrier plate 110 of the present application is a heat dissipation substrate, the transparent cover plate 300 of the present application has a high light transmittance and good airtight protection. The carrier plate 110 has good thermal conductivity and heat dissipation. The packaging structure 10 of the present application can meet the requirements for light, electricity, and heat to the greatest extent possible, and has excellent packaging performance. Moreover, when the micro-LED chip 210 is provided with a non-luminous area 202 and the transparent cover plate 300 includes a light-shielding layer 310, the light-shielding layer 310 can prevent the user from seeing the structure of the non-luminous area 202 on the light-emitting side of the micro-LED chip 210. The light-shielding layer 310 can hide the layered structure below the non-luminous area 202. At the same time, the light-shielding layer 310 can also block and absorb the light emitted from the light-emitting area 201 of the micro-LED chip 210 and prevent light leakage from the micro-LED device 200, thereby further improving the optical performance of the packaging structure 10.

[0096] In some embodiments, please refer to Figure 14The transparent cover plate 300 includes a first surface 331 and a second surface 332 that are arranged opposite each other. When the transparent cover plate 300 is positioned on the light-emitting side of the micro-LED chip 210, the second surface 332 of the transparent cover plate 300 is positioned between the first surface 331 and the micro-LED chip 210. In this case, the color conversion layer 320 is positioned between the transparent cover plate 300 and the micro-LED chip 210. On the one hand, the color conversion layer 320 is not exposed to the outer surface of the package structure 10, and the probability of the color conversion layer 320 being hit or struck by foreign objects is low, thus extending the service life of the color conversion layer 320. On the other hand, the distance between the color conversion layer 320 and the pixel units of the micro-LED chip 210 is closer, and the color conversion layer 320 has a better color conversion effect on the light emitted by the micro-LED chip 210, thereby improving the color display effect of the micro-LED chip 210.

[0097] It will be appreciated that in some examples, the light-shielding layer 310 is disposed on the first surface 331 of the transparent cover plate 300. In this case, the light-shielding layer 310 and the color-conversion layer 320 are disposed on opposite sides of the transparent cover plate 300, respectively, and are layered with the color-conversion layer 320. Because the quantum dot structure exhibits a certain degree of fluidity when uncured, the present application arranges the light-shielding layer 310 and the color-conversion layer 320 in layers and with intervals therebetween. This prevents the light-shielding layer 310 from interfering with the production process of the color-conversion layer 320, thereby ensuring the color display effect of the micro-LED chip 210.

[0098] In some embodiments, please refer to Figures 15 to 17 , Figure 15 A structural diagram of a plastic frame structure 500 provided in an embodiment of the present application is shown. Figure 16 A connection diagram of the plastic frame structure 500 provided in an embodiment of the present application is shown. Figure 17 for Figure 16 The package structure 10 of the present application further includes a plastic frame structure 500. The plastic frame structure 500 connects the micro-LED device 200 and the transparent cover plate 300.

[0099] It will be appreciated that, in some embodiments, the frame structure 500 is disposed between the non-luminescent region 202 of the micro-LED chip 210 and the transparent cover plate 300. In other embodiments, a portion of the frame structure 500 is disposed between the edge region of the driver chip 220 not covered by the micro-LED chip 210 and the transparent cover plate 300, while another portion of the frame structure 500 is disposed between the non-luminescent region 202 of the micro-LED chip 210 and the transparent cover plate 300. This frame structure 500 allows the transparent cover plate 300 to be bonded to the micro-LED chip 210, providing a more secure connection between the transparent cover plate 300 and the micro-LED chip 210.

[0100] It is understood that, in some embodiments, the plastic frame structure 500 is provided with a notch 510. The notch 510 makes the plastic frame structure 500 an annular structure with an opening.

[0101] It is understandable that if Figure 18 and Figure 19 As shown, Figure 18 A schematic diagram of a connection between the plastic frame structure 500 and the light-transmitting cover plate 300 provided in an embodiment of the present application is shown in FIG. Figure 19 for Figure 18 A schematic diagram of the structure shown in another direction. In actual production, the glue frame structure 500 can be placed in the edge area of ​​the driver chip 220 through a dispensing process. At the same time, the glue frame structure 500 is cut into a gap 510 to serve as an exhaust vent during bonding. Subsequently, a bonding process is used to bond the transparent cover plate 300 to the micro-LED device 200, with the light shielding layer 310 of the transparent cover plate 300 and the glue frame structure 500 facing each other and bonded together.

[0102] It is understood that the frame structure 500 is an annular structure with a notch 510. The frame structure 500 is a rectangular ring, a circular ring or other annular structures. The notch 510 can be formed at any edge or any corner of the frame structure 500. For example, Figure 17 As shown, a notch 510 is provided at an edge (eg, a middle area of ​​the edge) of the plastic frame structure 500 close to the circuit board 120 (or close to the electrical connector 900 ).

[0103] The glue frame structure 500 of the embodiment of the present application is provided with a notch 510, and the notch 510 can discharge the gas generated during the bonding process of the transparent cover plate 300 and the glue frame structure 500 (due to high temperature), thereby avoiding the non-fitting of the transparent cover plate 300 and the glue frame structure 500 during the bonding process. The glue frame structure 500 provided with the notch 510 in the present application can greatly improve the bonding quality between the transparent cover plate 300 and the glue frame structure 500.

[0104] Please refer again to Figure 15 When the notch 510 is disposed on an edge of the frame structure 500, in some embodiments, the ratio of the opening dimension D1 of the notch 510 to the length dimension D2 of the edge is between 2% and 10% (inclusive). For example, the opening dimension D1 of the notch 510 is 4% to 8% (inclusive) of the length dimension D2 of the edge. For another example, the opening dimension D1 of the notch 510 is 2%, 4%, 6%, 8%, or 10% of the length dimension D2 of the edge.

[0105] The opening dimension D1 of the notch 510 of the present application is 2%-10% of the length dimension D2 of the edge. This prevents the opening dimension D1 from being too small, which could cause deformation of the frame structure 500 during the bonding process between the light-transmitting cover plate 300 and the frame structure 500, thereby blocking the notch 510 and hindering air exhaust. It also prevents the opening dimension D1 from being too large, which could reduce the bonding strength between the light-transmitting cover plate 300 and the frame structure 500 and reduce the sealing performance of the package between the light-transmitting cover plate 300 and the frame structure 500. The above opening dimension of the notch 510 of the present application can ensure both the bonding strength and quality of the bonding between the light-transmitting cover plate 300 and the frame structure 500, as well as the sealing performance of the package.

[0106] Among them, please refer to Figure 20 , Figure 20 The package structure 10 provided in the embodiment of the present application includes a schematic structural diagram of a sealing colloid 600. The package structure 10 of the present application also includes a sealing colloid 600. The sealing colloid 600 can fill and seal the gap 510 of the package structure 10.

[0107] It will be appreciated that in some embodiments, the encapsulant 400 wraps around the electrical connector 900 and is connected to the frame structure 500. For example, there may be a gap between the first side edge of the wire bonding area 123 of the package structure 10 and the edge of the frame where the notch 510 is located. In this case, the sealing colloid 600 can simultaneously fill and seal the gap and the notch 510, thereby integrally connecting the encapsulant 400 and the frame structure 500.

[0108] The packaging structure 10 of the embodiment of the present application is provided with a sealing colloid 600 that seals the gap 510 of the sealing frame structure 500, which can improve the sealing and airtightness performance of the packaging structure 10; moreover, the packaging colloid 400, the sealing colloid 600 and the frame structure 500 are connected as an integrated structure, and there is almost no gap between the micro light-emitting diode device 200 and the packaging substrate 100, which greatly improves the packaging airtightness performance of the packaging structure 10 of the present application.

[0109] Among them, please refer to Figure 21 , Figure 21 A schematic diagram of the structure of the packaging structure 10 provided in an embodiment of the present application includes a reinforcing colloid 700. The packaging structure 10 in the embodiment of the present application also includes a reinforcing colloid 700. The reinforcing colloid 700 is disposed on the side of the circuit board 120 facing away from the micro-LED device 200, and the reinforcing colloid 700 is disposed in an area adjacent to the connection area between the carrier board 110 and the circuit board 120 (the area where the first end of the circuit board 120 is located). The reinforcing colloid 700 can both seal the connection gap between the carrier board 110 and the circuit board 120 and increase the connection strength between the carrier board 110 and the circuit board 120.

[0110] Please refer again to Figures 1 to 21The packaging substrate 100 also includes a terminal structure, such as a second terminal structure 122, which is electrically connected to the aforementioned first terminal structure 121. At the same time, the second terminal structure 122 is also electrically connected to an external circuit, and the external circuit is electrically connected to the driver chip 220 through the first terminal structure 121, the second terminal structure 122 and the electrical connector 900.

[0111] It is understood that the second terminal structure 122 can be disposed near the second end of the circuit board 120, with the distance between the second terminal structure 122 and the second end of the circuit board 120 being much smaller than the distance between the second terminal structure 122 and the first end. The second terminal structure 122 can extend outside the carrier board 110 to facilitate electrical connection to an external circuit.

[0112] It is understandable that if Figures 1 to 21 As shown, the package substrate 100 of the present application further includes a reinforcing sheet 800. The reinforcing sheet 800 and the second terminal structure 122 are disposed on opposite sides of the package substrate 100. For example, the second terminal structure 122 can be disposed on the side of the circuit board 120 facing away from the micro-LED device 200, while the reinforcing sheet 800 can be disposed on the side of the circuit board 120 closer to the micro-LED device 200. For another example, the reinforcing sheet 800 can be disposed on the side of the circuit board 120 facing away from the micro-LED device 200, while the second terminal structure 122 can be disposed on the side of the circuit board 120 closer to the micro-LED device 200. The reinforcing sheet 800 is disposed directly opposite the second terminal structure 122, and the orthographic projection of the reinforcing sheet 800 on the circuit board 120 overlaps the orthographic projection of the second terminal structure 122 on the circuit board 120. The package substrate 100 of this embodiment of the present application is provided with the reinforcing sheet 800, which increases the structural strength of the circuit board 120 at the second terminal structure 122.

[0113] Based on the above description, the transparent cover plate 300 with the color conversion layer 320 of the package structure 10 of the present application is disposed on the side of the micro-LED chip 210 of the micro-LED device 200 that faces away from the driver chip 220. This improves the reliability of the package structure 10 and enables color display of the micro-LED device 200. Furthermore, the transparent cover plate 300 is bonded to the micro-LED device 200 via the adhesive frame structure 500 with the notch 510, resulting in a better bonding quality. Furthermore, the encapsulating colloid 400, the sealing colloid 600, and the adhesive frame structure 500 are connected as an integrated structure, leaving virtually no gap between the micro-LED device 200 and the package substrate 100, significantly improving the airtightness of the package structure 10.

[0114] Based on the description of the above packaging structure 10, the embodiment of the present application also provides a packaging method. Figure 22 , Figure 22A first flow chart of the packaging method provided in an embodiment of the present application.

[0115] In S101 , a micro light emitting diode device 200 is provided. The micro light emitting diode device 200 includes a micro light emitting diode chip 210 and a driving chip 220 that are electrically connected.

[0116] like Figures 3 to 6 As shown, micro-LED chip 210 and driver chip 220 are bonded together. Micro-LED chip 210 includes a light-emitting region 201 and a non-light-emitting region 202. Non-light-emitting region 202 surrounds the outer periphery of light-emitting region 201 and serves as the electrode and wiring area for micro-LED chip 210. Light-emitting region 201 serves as the pixel area for micro-LED chip 210.

[0117] In S102 , a light-transmitting cover plate 300 is provided, and the light-transmitting cover plate 300 includes a color conversion layer 320 .

[0118] like Figure 14 As shown, the transparent cover plate 300 can be, but is not limited to, an inorganic glass sheet, an organic glass sheet, a transparent resin substrate, a glass fiber reinforced plastic substrate, etc. In some examples, the transparent cover plate 300 also includes a light-shielding layer 310, which supports the light-shielding layer 310 and the color conversion layer 320. The light-shielding layer 310 is disposed around the outer periphery of the color conversion layer 320. The light-shielding layer 310 can be a black adhesive layer or other structure capable of blocking light. The color conversion layer 320 includes a quantum dot structure that enables color conversion.

[0119] In S103 , the transparent cover plate 300 is disposed on the light-emitting side of the micro-LED chip 210 , and the color conversion layer 320 covers at least a portion of the light-emitting region 201 of the micro-LED chip 210 , thereby forming a package structure 10 .

[0120] like Figures 14 to 17 as well as Figure 1 and Figure 2 As shown, the transparent cover plate 300 can be bonded to the micro-LED device 200 via, but not limited to, a plastic frame structure 500. The shape and area of ​​the color conversion layer 320 can be equal to or larger than the shape and area of ​​the light-emitting region 201 of the micro-LED chip 210. The projection of the color conversion layer 320 on the micro-LED chip 210 can completely cover the light-emitting region 201.

[0121] In the packaging method of the embodiment of the present application, a transparent cover plate 300 is set on the light-emitting side of the micro-LED chip 210. The transparent cover plate 300 can encapsulate and protect the micro-LED device 200, reduce the adverse effects of water vapor and other objects on the micro-LED device 200, and improve the reliability of the packaging structure 10; at the same time, the transparent cover plate 300 has a high light transmittance effect and is not likely to affect the luminous performance of the micro-LED device 200; moreover, the transparent cover plate 300 also includes a color conversion layer 320, which can convert the color of the light emitted by the micro-LED device 200 and realize the color display of the micro-LED device 200, so that the micro-LED device 200 does not need to set up a color display production process, thereby simplifying the process flow of the entire packaging structure 10 and reducing the preparation cost of the entire packaging structure 10. Based on this, the packaging method of the present application achieves the packaging of the micro-LED device 200 through the transparent cover plate 300 having the color conversion layer 320. The packaging structure 10 prepared by the packaging method of the present application has excellent packaging reliability and color display performance. In addition, when the carrier plate 110 of the present application is a heat dissipation substrate, the transparent cover plate 300 of the present application has a high light transmittance and good airtight protection. The carrier plate 110 has good thermal conductivity and heat dissipation. The packaging structure 10 prepared by the packaging method of the present application can meet the requirements of light, electricity, and heat to the greatest extent.

[0122] In some embodiments, step S102: providing a transparent cover plate 300, wherein the transparent cover plate 300 includes a color conversion layer 320, includes providing the transparent cover plate 300 and forming the color conversion layer 320 on the second surface 332 of the transparent cover plate 300. At this time, step S103: disposing the transparent cover plate 300 on the light-emitting side of the micro-LED chip 210 includes placing the transparent cover plate 300 on the light-emitting side of the micro-LED chip 210, with the second surface 332 located between the first surface 331 and the micro-LED chip 210.

[0123] In the embodiment of the present application, the color conversion layer 320 is located between the transparent cover plate 300 and the micro-LED chip 210, and the service life of the color conversion layer 320 is longer; at the same time, the distance between the color conversion layer 320 and the pixel unit of the micro-LED chip 210 is closer, and the color conversion layer 320 has a better color conversion effect on the light emitted by the micro-LED chip 210, and the color display effect of the micro-LED chip 210 is better.

[0124] In some examples, the micro-LED chip 210 also includes a non-luminous area 202, and the transparent cover 300 also includes a shading layer 310. Step S103: the transparent cover 300 is set on the light-emitting side of the micro-LED chip 210, and the color conversion layer 320 covers at least part of the light-emitting area 201 of the micro-LED chip 210, and forms a packaging structure 10, including: the transparent cover 300 is set on the light-emitting side of the micro-LED chip 210, and the color conversion layer 320 covers the light-emitting area 201, and the shading layer 310 covers the non-luminous area 202.

[0125] In the embodiment of the present application, the light-shielding layer 310 can prevent the user from seeing the structure of the non-luminous area 202 on the luminous side of the micro-LED chip 210, and the light-shielding layer 310 can hide the layered structure below the non-luminous area 202; at the same time, the light-shielding layer 310 can also block and absorb the light from the luminous area 201 of the micro-LED chip 210, and prevent light leakage from the micro-LED device 200.

[0126] In some examples, step S102: providing a transparent cover plate 300, the transparent cover plate 300 includes a color conversion layer 320, including: providing a transparent cover plate 300, forming a light-shielding layer 310 on a first surface 331 of the transparent cover plate 300, and forming a color conversion layer 320 on a second surface 332 of the transparent cover plate 300.

[0127] In the embodiment of the present application, the light-shielding layer 310 and the color-conversion layer 320 are respectively arranged on two opposite surfaces of the transparent cover 300. The light-shielding layer 310 and the color-conversion layer 320 are arranged in layers and at intervals. The light-shielding layer 310 is not likely to affect the production process of the color-conversion layer 320, which can further improve the color display effect of the micro-LED chip 210.

[0128] Among them, in some embodiments, step S103: the transparent cover plate 300 is set on the light-emitting side of the micro-LED chip 210, and the color conversion layer 320 covers at least part of the light-emitting area 201 of the micro-LED chip 210, and forms a packaging structure 10, including: forming a glue frame structure 500 on the surface of the driving chip 220; the transparent cover plate 300 is set on the light-emitting side of the micro-LED chip 210, and the transparent cover plate 300 is connected to the micro-LED device 200 through the glue frame structure 500, and the color conversion layer 320 covers at least part of the light-emitting area 201, and forms a packaging structure 10.

[0129] In the embodiment of the present application, the transparent cover plate 300 can be bonded to the micro-LED chip 210 through the glue frame structure 500, and the connection between the transparent cover plate 300 and the micro-LED chip 210 is more secure.

[0130] In some embodiments, the plastic frame structure 500 is provided with a gap 510 . The packaging method further includes: filling the gap 510 with a sealing plastic 600 and sealing the gap 510 with the sealing plastic 600 .

[0131] In the embodiment of the present application, the plastic frame structure 500 is provided with a notch 510. This notch 510 can discharge the gas generated during the bonding process between the transparent cover plate 300 and the plastic frame structure 500, greatly improving the bonding quality between the transparent cover plate 300 and the plastic frame structure 500. In addition, the sealing glue 600 can further improve the sealing and airtight performance of the packaging structure 10.

[0132] In some embodiments, the package structure 10 further includes a package substrate 100, which includes a carrier board 110 and a circuit board 120 connected thereto. After step S101, and after providing the micro-LED device 200, the process further includes: placing the micro-LED device 200 on the carrier board 110, electrically connecting the circuit board 120 to the driver chip 220 via the electrical connector 900; and filling the electrical connector 900 with a colloid to form a packaging colloid 400 that encapsulates the electrical connector 900.

[0133] The embodiment of the present application wraps the electrical connector 900 with the encapsulation colloid 400 to improve the sealing performance of the electrical connector 900, prevent liquids such as water vapor from affecting the electrical connection between the driver chip 220 and the circuit board 120, and improve the reliability of the packaging structure 10.

[0134] Based on the above description, please refer to Figure 23 , Figure 23 A second flow chart of the packaging method provided in an embodiment of the present application.

[0135] In S201 , a micro-LED device 200 is provided. The micro-LED device 200 includes a micro-LED chip 210 and a driving chip 220 that are bonded together. The micro-LED chip 210 includes a light-emitting region 201 and a non-light-emitting region 202 .

[0136] like Figures 3 to 6 As shown, the micro LED chip 210 and the driver chip 220 are bonded together, and the driver chip 220 controls the micro LED chip 210 to emit light. The non-light emitting area 202 of the micro LED chip 210 is arranged around the outer periphery of the light emitting area 201.

[0137] In S202 , a packaging substrate 100 is provided. The packaging substrate 100 includes a carrier plate 110 and a circuit board 120 that are connected to each other.

[0138] like Figure 4As shown, the carrier board 110 is a heat dissipation substrate, and the circuit board 120 is a flexible board, for example, the circuit board 120 is a flexible flat cable structure.

[0139] In S203 , the carrier board 110 is disposed and connected to a side of the driver chip 220 facing away from the micro LED chip 210 .

[0140] like Figure 8 and Figure 9 As shown, the carrier board 110 is connected to the driver chip 220 via a die-bonding structure 240. The micro-LED device 200 and the circuit board 120 are disposed on the same surface of the carrier board 110 and spaced apart from each other. The driver chip 220 is located between the micro-LED chip 210 and the carrier board 110.

[0141] In S204 , the first substrate 211 of the micro LED chip 210 is removed.

[0142] like Figure 9 As shown, this step may be, but is not limited to, peeling off the first substrate 211 of the micro light emitting diode chip 210 through an LLO production process.

[0143] In S205 , the circuit board 120 is electrically connected to the driving chip 220 via the electrical connector 900 .

[0144] like Figure 10 and Figure 11 As shown, after the first substrate 211 is peeled off, the circuit board 120 and the driver chip 220 are connected by a wire bonding process in this step. The driver chip 220 is electrically connected to the circuit board 120 through the electrical connector 900. The driver chip 220 can receive the electrical signals and control signals transmitted by the circuit board 120, thereby controlling the micro light-emitting diode chip 210 to emit light.

[0145] In S206 , an encapsulant 400 is formed in the predetermined wire bonding area 123 , and the encapsulant 400 wraps the electrical connection.

[0146] like Figures 11 to 13 As shown, a welding wire area 123 is preset on the circuit board 120. In this step, glue is first applied around the electrical connector 900 to form a dam wall, and then colloid is filled in the dam wall area to form a packaging colloid 400. The packaging colloid 400 wraps the electrical connector 900, which can minimize the corrosion of the electrical connection between the circuit board 120 and the driver chip 220 by liquids such as moisture, thereby improving the airtight layer and reliability of the packaging structure 10 of the micro light emitting diode device 200.

[0147] In S207 , a plastic frame structure 500 having a notch 510 is formed on the surface of the driving chip 220 .

[0148] like Figures 15 to 17 As shown, in this step, a glue frame structure 500 is formed at the edge area of ​​the driver chip 220 through a glue dispensing process, and a gap 510 is cut in the glue frame as an exhaust port during bonding.

[0149] In S208, the transparent cover 300 is connected to the side of the micro-LED chip 210 facing away from the driver chip 220 through the frame structure 500, and the light-shielding layer 310 covers the projection of the non-luminous area 202 on the transparent cover 300, and the color conversion layer 320 covers the projection of the luminous area 201 on the transparent cover 300.

[0150] like Figure 18 and Figure 19 As shown, the transparent cover plate 300 is laminated to the micro-LED device 200 by using a laminating process, and the light shielding layer 310 of the transparent cover plate 300 is arranged opposite to the plastic frame and bonded together.

[0151] In S209 , the sealing adhesive 600 is filled into the gap 510 , and the sealing adhesive 600 seals the gap 510 .

[0152] like Figure 20 As shown, a sealing compound 600 is filled into the gap 510 through a dispensing process, and the sealing compound 600 seals the gap 510. In some embodiments, there is a gap between the first side edge of the wire bonding area 123 of the package structure 10 and the edge of the frame where the gap 510 is located. In this case, the sealing compound 600 can simultaneously fill and seal the gap and the gap 510, and the sealing compound 600 can connect the package 400 and the frame structure 500 into a whole.

[0153] In S210 , a reinforcing adhesive 700 is disposed on a connection area between the circuit board 120 and the carrier board 110 on a side of the circuit board 120 facing away from the micro LED device 200 , thereby forming a package structure 10 .

[0154] like Figure 21 As shown, a reinforcing colloid 700 is provided at the connection area between the circuit board 120 and the carrier board 110 on the side of the circuit board 120 facing away from the micro-LED device 200 by a dispensing process, and as shown in FIG. Figure 1 and Figure 2 As shown, a packaging structure 10 is formed.

[0155] Based on the above description, the packaging method of the present application places a transparent cover plate 300 having a color conversion layer 320 on the side of the micro-LED chip 210 of the micro-LED device 200 facing away from the driver chip 220, thereby improving the reliability of the packaging structure 10 and enabling color display of the micro-LED device 200. Furthermore, the transparent cover plate 300 is bonded to the micro-LED device 200 via a plastic frame structure 500 having a notch 510, resulting in a better bonding quality. Furthermore, the encapsulating colloid 400, the sealing colloid 600, and the plastic frame structure 500 are connected as an integrated structure, leaving virtually no gap between the micro-LED device 200 and the packaging substrate 100, significantly improving the airtightness of the packaging structure 10.

[0156] Based on the above description, the present application embodiment further provides a display device 20, please refer to Figure 24 , Figure 24 A structural schematic diagram of a display device 20 provided in an embodiment of the present application. The display device 20 can be applied to electronic devices to realize extended reality (XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). During implementation, the display device 20 can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the display device 20 can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop computer, a tablet computer, a driving recorder, a navigation system, a head-mounted device, or any other device with a display screen; for another example, the display device 20 can also be the lighting part of an electronic device, such as a vehicle, a street lamp, or any other device with a lighting component.

[0157] It is understood that the display device 20 of the embodiment of the present application includes the packaging structure 10 of any of the aforementioned embodiments, or includes the packaging structure 10 prepared by the packaging method of any of the aforementioned embodiments. Therefore, the display device 20 of the present application has better packaging integrity, high reliability, and good aesthetics.

[0158] It should be noted that the packaging structure 10, packaging method, and display device 20 of the embodiments of the present application are different subjects under the same inventive concept. Features not described in detail in each embodiment can be found in the description of other embodiments.

[0159] It should be noted that the "multiple" mentioned in this application generally refers to two or more. Moreover, the directional terms mentioned in the embodiments of the present application, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the embodiments of the present application, rather than to limit the embodiments of the present application. In the various drawings, units with similar structures are represented by the same figure marks. For the sake of clarity, the various parts in the drawings are not drawn to scale. In addition, certain related parts may not be shown in the drawings.

[0160] It should be understood that, in the description of this application, terms such as "first" and "second" are only used to distinguish similar objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0161] It is understood that those skilled in the art can, under the guidance of the above embodiments, combine the various implementation methods in the above embodiments to obtain technical solutions of multiple implementation methods. The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

[0162] The above describes in detail the packaging structure, packaging method, and display device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is intended only to help understand the present application. At the same time, those skilled in the art will find that the specific implementation methods and scope of application may vary based on the concepts of the present application. In summary, the contents of this specification should not be construed as limiting the present application.

Claims

1. A micro light emitting diode device packaging structure, characterized in that: include: A micro light emitting diode device comprising an electrically connected micro light emitting diode chip and a driver chip; a light-transmitting cover plate, comprising a color conversion layer, wherein the light-transmitting cover plate is disposed on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a portion of the light-emitting area of ​​the micro-LED chip; A plastic frame structure is provided on the driving chip, the plastic frame structure connects the micro light emitting diode device and the light-transmitting cover plate, and supports the light-transmitting cover plate; the plastic frame structure is provided with a notch; and A sealing colloid is used to fill and seal the gap.

2. The packaging structure according to claim 1, wherein: The light-transmitting cover plate includes a first surface and a second surface that are opposite to each other, the second surface is located between the first surface and the micro-LED chip, and the color conversion layer is arranged on the second surface.

3. The packaging structure according to claim 2, wherein: The micro-LED chip further includes a non-luminous area, and the transparent cover further includes a light-shielding layer, and the light-shielding layer covers the non-luminous area.

4. The packaging structure according to claim 3, wherein: The light shielding layer is disposed on the first surface.

5. The packaging structure according to any one of claims 1 to 4, characterized in that: The notch is provided at an edge of the plastic frame structure, and the ratio of the opening size of the notch to the length size of the edge is between 2% and 10%.

6. The packaging structure according to any one of claims 1 to 4, characterized in that: The packaging structure further includes: A packaging substrate, comprising a carrier board and a circuit board connected to each other, wherein the micro light emitting diode device is arranged on the carrier board, and the circuit board is electrically connected to the driver chip via an electrical connector; and The packaging colloid wraps the electrical connector and is connected to the colloid frame structure.

7. The packaging structure according to claim 6, wherein: The packaging structure further includes: The reinforcing colloid is arranged on a side of the circuit board away from the micro-light emitting diode device and in an area adjacent to a connection area between the circuit board and the carrier board.

8. The packaging structure according to claim 6, wherein: The packaging substrate further includes a reinforcing sheet and a terminal structure disposed on two opposite sides of the circuit board, wherein a projection of the reinforcing sheet on the circuit board covers a projection of the terminal structure on the circuit board.

9. A packaging method for a micro light emitting diode device packaging structure, characterized in that: include: A micro light emitting diode device is provided, wherein the micro light emitting diode device includes a micro light emitting diode chip and a driver chip that are electrically connected; Providing a light-transmitting cover plate, wherein the light-transmitting cover plate includes a color conversion layer; A plastic frame structure is formed on the surface of the driver chip, wherein the plastic frame structure is provided with a notch; The light-transmitting cover is disposed on the light-emitting side of the micro-LED chip, and the light-transmitting cover is connected to the micro-LED device through the plastic frame structure, and the color conversion layer covers at least a portion of the light-emitting area of ​​the micro-LED chip, thereby forming a packaging structure; Fill the gap with a sealing colloid, and allow the sealing colloid to seal the gap.

10. The packaging method according to claim 9, wherein: The light-transmitting cover plate includes a first surface and a second surface that are arranged opposite to each other; The light-transmitting cover plate is provided, and the light-transmitting cover plate includes a color conversion layer, including: Providing a light-transmitting cover plate, and forming a color conversion layer on a second surface of the light-transmitting cover plate; The step of arranging the light-transmitting cover plate on the light-emitting side of the micro-LED chip includes: The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the second surface is located between the first surface and the micro-LED chip.

11. The packaging method according to claim 9, wherein: The micro-LED chip further includes a non-luminous area, and the light-transmitting cover further includes a light-shielding layer; The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the light-transmitting cover is connected to the micro-LED device through the glue frame structure, and the color conversion layer covers at least a portion of the light-emitting area of ​​the micro-LED chip to form a packaging structure, including: The transparent cover is arranged on the light-emitting side of the micro-LED chip, and the transparent cover is connected to the micro-LED device through the glue frame structure, and the color conversion layer covers the light-emitting area, and the light-shielding layer covers the non-light-emitting area.

12. The packaging method according to claim 9, wherein: The notch is provided at an edge of the plastic frame structure, and the ratio of the opening size of the notch to the length size of the edge is between 2% and 10%.

13. The packaging method according to any one of claims 9 to 12, characterized in that: The packaging structure further includes a packaging substrate, and the packaging substrate includes a carrier plate and a circuit board connected to each other; After the step of providing the micro light emitting diode device, the method further includes: Placing the micro light emitting diode device on the carrier board, and electrically connecting the circuit board to the driver chip via an electrical connector; The electrical connector is filled with colloid to form a packaging colloid that wraps the electrical connector.

14. A display device, characterized in that: The display device comprises the packaging structure according to any one of claims 1 to 8; or, the display device comprises the packaging structure prepared by the packaging method according to any one of claims 9 to 13.

Images