Display panel and display device

Abstract

The present application discloses a display panel and a display device, wherein the display panel further comprises a base substrate, a pixel definition layer, an overhang structure, a plurality of light-emitting units, an encapsulation layer, glass glue and an encapsulation cover plate, wherein the pixel definition layer is arranged on the base substrate, the overhang structure is arranged on the pixel definition layer and is arranged around the opening; the plurality of light-emitting units are arranged in the plurality of openings; the encapsulation layer covers the light-emitting units and the overhang structure; the glass glue is arranged in the non-display area and is arranged around the display area; the encapsulation cover plate is arranged on the inorganic encapsulation layer, is bonded to the base substrate via glass glue in the non-display area, and is supported by the overhang structure in the display area. The present application adopts glass glue and an encapsulation cover plate to achieve encapsulation, preventing water vapor and oxygen from entering the display area from the interface of the film layer, which is beneficial to improving the encapsulation capability of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diodes (OLEDs) are thin-film organic electroluminescent devices that have attracted significant attention due to their simple manufacturing process, low cost, low power consumption, high brightness, wide viewing angle, high contrast, and flexible display capabilities. As a next-generation display technology, OLED display technology has begun to gradually replace traditional liquid crystal display technology and will be widely used in electronic devices such as mobile phones, computers, full-color televisions, digital cameras, and personal digital assistants. OLED display technology differs from traditional liquid crystal display technology in that the OLED device in an OLED display panel includes an anode, a cathode, and a light-emitting layer positioned between the anode and cathode. When a voltage is applied between the anode and cathode, holes and electrons migrate to the light-emitting layer, where they recombine and emit light.

[0003] However, the cathode in the OLED display panel is an active metal and is very sensitive to water vapor and oxygen in the air. It easily reacts with water vapor and oxygen that penetrate from the outside, affecting the injection of charge. In addition, the infiltrated water vapor and oxygen will also chemically react with the organic light-emitting material in the light-emitting layer, damaging the organic light-emitting material and greatly reducing the luminous efficiency of the organic light-emitting material, causing the performance of the OLED display panel to decline and the life to be shortened. Therefore, the OLED display panel has very high requirements for packaging. Summary of the Invention

[0004] The purpose of this application is to provide a display panel and a display device, which use glass glue and a packaging cover plate to achieve packaging, preventing water vapor and oxygen from entering the display area from the film layer interface, which is beneficial to improving the packaging capability of the display panel.

[0005] The present application discloses a display panel, which includes a display area and a non-display area. The display panel also includes a base substrate, a pixel definition layer, an overhang structure, a plurality of light-emitting units, an encapsulation layer, glass glue and an encapsulation cover plate. The pixel definition layer is arranged on the base substrate and has a plurality of openings in the display area; the overhang structure is arranged on the pixel definition layer and surrounds the openings; a plurality of the light-emitting units are arranged in the plurality of openings; the encapsulation layer covers the light-emitting units and the overhang structure; the glass glue is arranged in the non-display area and surrounds the display area; the encapsulation cover plate is arranged on the encapsulation layer, is bonded to the base substrate by glass glue in the non-display area, and is supported by the overhang structure in the display area.

[0006] Optionally, the encapsulation layer includes an inorganic encapsulation layer, and at the opening, the inorganic encapsulation layer and the encapsulation cover plate form a cavity. At the overhang structure, an inorganic encapsulation layer is provided between the overhang structure and the encapsulation cover plate.

[0007] Optionally, the overhang structure includes a first conductive layer and a first insulating layer, the first conductive layer is arranged on the pixel definition layer, the first insulating layer is arranged on the conductive layer, and the width of the first insulating layer is greater than the width of the first conductive layer; the light-emitting unit includes a bottom electrode, a light-emitting layer and a top electrode, the top electrodes of adjacent light-emitting units are connected through the first conductive layer, and the light-emitting layers of adjacent light-emitting units are separated by the overhang structure; at each of the openings in the display area, the overhang structure and the packaging cover form a cavity.

[0008] Optionally, the light-emitting layer and the top electrode are formed by whole-surface evaporation, and a light-emitting redundant portion is formed synchronously with the light-emitting layer at the position of the glass glue, and a top electrode redundant portion is formed synchronously with the top electrode. The glass glue is used to remove the light-emitting redundant portion and the top electrode redundant portion below the glass glue position during the laser sintering process.

[0009] Optionally, the pixel definition layer is formed of an inorganic material, and the pixel definition layer extends from the display area to the non-display area, forming an inorganic extension portion in the non-display area, one side of the glass glue contacts the packaging cover plate, and the other side of the glass glue contacts the inorganic extension portion.

[0010] Optionally, the display panel further includes an overhang extension portion, which also includes a second conductive layer and a second insulating layer. The overhang extension portion is arranged in the non-display area and is located on the side of the glass glue close to the display area. On the side of the glass glue close to the display area, the second insulating layer protrudes from the second conductive layer. The overhang extension portion is used to separate the light-emitting redundant portion and the top electrode redundant portion.

[0011] Optionally, the display panel further includes a cathode connecting portion, the inorganic extension portion is further provided with a through hole, the cathode connecting portion is connected to the second conductive layer through the through hole, and the second conductive layer is connected to the first conductive layer.

[0012] Optionally, a gap is provided between the overhang extension portion and the glass glue; the overhang extension portion is provided around the display area and is formed in the same process as the overhang structure of the display area, and the first conductive layer is connected to the second conductive layer.

[0013] Optionally, the display panel also includes a pixel driving layer, which is arranged between the base substrate and the pixel definition layer. The pixel driving layer also includes a reflective metal layer, which is arranged under the glass glue and is used to reflect laser light onto the glass glue when the glass glue is laser sintered.

[0014] The present application also discloses a display device, comprising a driving circuit and the above-mentioned display panel, wherein the driving circuit is used to drive the display panel to display.

[0015] The display panel of the present application is encapsulated mainly by glass glue and an encapsulation cover plate. In particular, by setting glass glue around the display area, the non-display area of ​​the display panel is encapsulated with glass glue, and the encapsulation cover plate located in the display area is supported by a suspension structure. Compared with the thin film encapsulation technology in the exemplary technology, the glass glue encapsulation technology adopted in the present application has better encapsulation reliability and does not have the water vapor intrusion problem existing in the thin film encapsulation technology. In particular, when the glass glue is sintered at high temperature, the organic material and cathode evaporated on the entire surface can be melted, cutting off the path of water and oxygen intrusion, preventing water vapor and oxygen from entering the display area from the film layer interface, which is beneficial to improving the encapsulation capability of the display panel and improving the display effect and service life of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without inventive work. In the drawings:

[0017] Figure 1 is a schematic top view of the display panel of the present application;

[0018] Figure 2 yes Figure 1 Schematic diagram of the cross section along the cutting line AA;

[0019] Figure 3 yes Figure 1 Schematic cross-section along cutting line BB;

[0020] Figure 4 is a schematic diagram of another cathode connection portion of the present application;

[0021] Figure 5 is a schematic diagram of a display device of the present application.

[0022] Among them, 100, display panel; 101, display area; 102, non-display area; 110, base substrate; 120, pixel definition layer; 121, opening; 122, inorganic extension; 123, through hole; 130, overhang structure; 131, first conductive layer; 132, first insulating layer; 133, overhang extension; 134, second conductive layer; 135, second insulating layer; 140, light-emitting unit; 141, bottom electrode; 142, light-emitting layer; 143, top electrode; 144, light-emitting redundant part; 145, top electrode redundant part; 150, inorganic encapsulation layer; 151, cavity; 160, glass glue; 170, encapsulation cover; 180, pixel driving layer; 181, cathode connecting part; 182, bottom electrode extension; 183, reflective metal layer; 200, display device; 210, driving circuit. DETAILED DESCRIPTION

[0023] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative. However, the present application can be implemented in many alternative forms and should not be construed as being limited to the embodiments described herein.

[0024] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, features defined as "first" and "second" may explicitly or implicitly include one or more of such features; "multiple" means two or more. In addition, terms indicating orientation or positional relationships such as "upper", "lower", "left", "right", "vertical", and "horizontal" are based on the orientation or relative positional relationships shown in the accompanying drawings and are only for the convenience of describing a simplified description of this application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0025] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0026] Figure 1 is a schematic top view of the display panel of the present application, Figure 2 yes Figure 1 Schematic diagram of the cross section along the cutting line AA, Figure 3 yes Figure 1 Schematic diagram of the cross section along the cutting line BB, see Figure 1-3As shown, the present application discloses a display panel 100, which includes a display area 101 and a non-display area 102. The display panel 100 also includes a base substrate 110, a pixel definition layer 120, an overhang structure 130, a plurality of light-emitting units 140, an encapsulation layer, a glass glue 160 and an encapsulation cover 170. The pixel definition layer 120 is provided on the base substrate 110 and has a plurality of openings 121 in the display area 101; the overhang structure 130 is provided on the pixel definition layer 110. 20, and is arranged around the opening 121; the plurality of light-emitting units 140 are arranged in the plurality of openings 121; the encapsulation layer covers the light-emitting units 140 and the overhang structure 130; the glass glue 160 is arranged in the non-display area 102 and is arranged around the display area 101; the encapsulation cover plate 170 is arranged on the encapsulation layer, and is adhered to the base substrate 110 through the glass glue 160 in the non-display area 102, and is supported by the overhang structure 130 in the display area 101.

[0027] The display panel 100 of the present application is encapsulated primarily using glass glue 160 and an encapsulation cover plate 170. The glass glue 160 is disposed around the display area 101, and the non-display area 102 of the display panel 100 is encapsulated using the glass glue 160. The encapsulation cover plate 170 located in the display area 101 is supported by the overhang structure 130. Compared to the thin-film encapsulation technology in the exemplary technology, the glass glue 160 encapsulation technology used in the present application has better encapsulation reliability and does not present the water vapor intrusion problem that exists in the thin-film encapsulation technology. In particular, when the glass glue 160 is sintered at high temperature, the organic material and cathode deposited on the entire surface can be melted, blocking the path of water and oxygen intrusion, and preventing water vapor and oxygen from entering the display area 101 from the film layer interface. This is beneficial for improving the encapsulation capability of the display panel 100, and enhancing the display effect and service life of the display panel 100.

[0028] The overhang structure 130 is a key structure in maskless evaporation technology. This means that during the formation of multiple light-emitting units 140, a metal mask is not required to complete the evaporation. During the full-surface evaporation of the organic light-emitting material, the overhang structure 130 is used to isolate the organic light-emitting material in each light-emitting unit 140 within each opening 121, allowing the organic light-emitting materials in the multiple light-emitting units 140 to be individually arranged without crosstalk. The light-emitting unit 140 includes a bottom electrode 141, a light-emitting layer 142, and a top electrode 143. The light-emitting layer 142 is generally formed of an organic light-emitting material and is also referred to as the organic light-emitting layer 142. The electron transport layer, light-emitting layer 142, and hole transport layer are all formed of different organic materials. The overhang structure 130 is primarily used to isolate the organic light-emitting layer 142 from the top electrode 143.

[0029] Generally speaking, for display panels 100 using maskless evaporation technology, the organic light-emitting material and top electrode 143 in the light-emitting unit 140 are disposed entirely on the surface. In particular, no additional process is performed to remove excess organic material and top electrode 143 material in the non-display area 102. Therefore, during subsequent thin-film encapsulation, moisture and oxygen can easily enter the interior of the display panel 100 through this portion of the film layer, potentially damaging the top electrode 143, bottom electrode 141, and organic light-emitting layer 142 of the display panel 100 and causing abnormal light emission from the light-emitting unit 140.

[0030] Specifically, the overhang structure 130 includes a first conductive layer 131 and a first insulating layer 132. The first conductive layer 131 is disposed on the pixel definition layer 120, and the first insulating layer 132 is disposed on the conductive layer. The width of the first insulating layer 132 is greater than the width of the first conductive layer 131. It is worth noting that the width of the first insulating layer 132 and the width of the first conductive layer 131 stated herein refer to the widths of the first insulating layer 132 and the first conductive layer 131 between two adjacent light-emitting units 140. When the width of the first insulating layer 132 is greater than the width of the first conductive layer 131, the first insulating layer 132 protrudes from the first conductive layer 131 to form the overhang structure 130. When the organic light-emitting material is fully evaporated, the overhang structure 130 separates the continuous organic light-emitting material at the locations of the different openings 121. This separates the redundant organic light-emitting material (redundant light-emitting portion 144) evaporated on the first insulating layer 132 from the organic light-emitting material at the locations of the openings 121 through the overhang structure 130. This prevents electrical crosstalk between the organic light-emitting materials, which could lead to luminescence problems, when the multiple light-emitting units 140 independently emit light.

[0031] Specifically, the light-emitting unit 140 includes a bottom electrode 141, a light-emitting layer 142 and the top electrode 143. The top electrodes 143 of adjacent light-emitting units 140 are connected through the first conductive layer 131, and the light-emitting layers 142 of adjacent light-emitting units 140 are separated by the overhang structure 130. Taking the upright top light-emitting unit 140 as an example, the bottom electrode 141 of the light-emitting unit 140 is the anode, and the top electrode 143 is the cathode. Among them, the anode is generally formed of a metal material with high reflectivity, such as silver material. The cathode is generally formed of a transparent conductive material, and the cathodes of multiple light-emitting units 140 are connected to the same driving electrode and have the same driving voltage.

[0032] Specifically, the light-emitting layer 142 and the top electrode 143 are formed by full-surface evaporation. At the position of the glass glue 160, a light-emitting redundant portion 144 is formed synchronously with the light-emitting layer 142, and a top electrode redundant portion 145 is formed with the top electrode 143. The glass glue 160 is used to remove the light-emitting redundant portion 144 and the top electrode redundant portion 145 below the position of the glass glue 160 during the laser sintering process.

[0033] The present application combines the two by using glass glue 160 packaging technology in the display panel 100 formed by maskless evaporation technology. First, the organic material and the top electrode 143 material below the glass glue 160 in the non-display area 102 are removed during the laser high-temperature sintering process using the glass glue 160. The organic material and the top electrode 143 material below the glass glue 160 are directly melted during the laser high-temperature sintering process, while the inorganic material will not be melted. The reason is that the melting point of organic materials and inorganic materials is quite different, and the melting point of inorganic materials is higher. By controlling the temperature of laser sintering, the organic light-emitting material and the cathode material can be removed at the position below the glass glue 160.

[0034] In this embodiment, one side of the glass glue 160 directly contacts the inorganic material layer, and the other side directly contacts the encapsulation cover plate 170, forming an encapsulation method of glass glue 160 and encapsulation cover plate 170. The water vapor resistance of the outer side of the display panel 100 is better than the laminated method of inorganic material layers and organic material layers used in thin film encapsulation. Secondly, the encapsulation cover plate 170 is supported by the overhang structure 130 inside the display panel 100. Generally speaking, the method of setting up glass glue 160 and encapsulation cover plate 170 requires additional support columns inside the display panel 100 to process the encapsulation cover plate 170. In this embodiment, the overhang structure 130 provided in the display area 101 can be used to support the encapsulation cover plate 170.

[0035] Among them, at each of the openings 121 in the display area 101, a cavity 151 is formed between the overhanging structure 130 and the packaging cover plate 170. In the process of forming the cavity 151, it is necessary to attach the packaging cover plate 170 to the glass glue 160 under a vacuum environment, and then perform laser sintering on the glass glue 160, so that at the position of the overhanging structure 130, the packaging cover plate 170 is supported by the overhanging structure 130, and a cavity 151 is formed at the position of each opening 121. The overhanging structure 130 in the display area 101 of the display panel is mainly used to play a supporting role to support the upper packaging cover plate 170. The provision of the cavity 151 can reduce the box pressure between the packaging cover plate 170 and the base substrate 110, thereby reducing the possibility of cracking.

[0036] The display panel 100 of this application is suitable for automotive display panels 100 and display panels 100 with low flexibility requirements and high water resistance and oxygen resistance requirements. Relatively speaking, automotive display panels 100 have higher water resistance requirements, are exposed to higher humidity environments, and have higher reliability requirements. This embodiment uses glass glue 160 and cover plate packaging in combination with the overhang structure 130 to achieve better packaging effects.

[0037] Continue to see Figure 2 As shown, the encapsulation layer in this embodiment is mainly used to protect the cathode of the light-emitting unit 140. When the material of the cathode is indium tin oxide material or indium zinc oxide material, the cathode material and the organic light-emitting material are easily corroded by water and oxygen, resulting in failure of the light-emitting unit 140. The encapsulation layer of this embodiment is mainly used to protect the light-emitting unit 140 and can be selected from inorganic materials. The inorganic material includes one or more of silicon nitride, silicon oxide or silicon oxynitride materials to form an encapsulation layer. After the encapsulation layer is formed, after glass glue 160 is formed on the periphery, an encapsulation cover plate 170 is formed on the encapsulation layer. Among them, unlike thin film encapsulation, only one inorganic encapsulation layer 150 is formed in this embodiment, and there is no need to form a subsequent organic encapsulation layer and a multi-layer stacking method. On the one hand, the process is reduced, and on the other hand, the process structure complexity caused by the organic encapsulation layer process can be reduced.

[0038] Specifically, the encapsulation layer includes an inorganic encapsulation layer 150 . At the opening 121 , the inorganic encapsulation layer 150 and the encapsulation cover plate 170 form a cavity 151 . At the overhang structure 130 , an inorganic encapsulation layer 150 is provided between the overhang structure 130 and the encapsulation cover plate 170 .

[0039] The inorganic encapsulation layer 150 in the present application covers the light-emitting unit 140 and the overhang structure 130, and extends from the display area 101 to the non-display area 102. The inorganic encapsulation layer 150 needs to be removed in the area where the glass glue 160 is formed to avoid incomplete removal in the subsequent process of removing the organic light-emitting material and the cathode material, resulting in residual problems. Among them, the first insulating layer 132 in this embodiment is generally formed of one or more materials selected from silicon oxide, silicon nitride or silicon oxynitride, and an inorganic encapsulation layer 150 is also provided between the overhang structure 130 and the encapsulation cover plate. The inorganic encapsulation layer 150 is generally formed of silicon nitride material. The contact between the overhang structure 130 and the encapsulation cover plate is better, and it is not easy to cause problems such as cracking of the inorganic encapsulation layer 150.

[0040] It is worth mentioning that the sealing method of the glass glue 160 and the packaging cover plate 170 adopted in this application also solves the leveling problem of the organic packaging layer when thin film packaging is used in the maskless evaporation technology. Specifically, when the light-emitting unit 140 adopts the maskless evaporation technology, the pixel definition layer 120 is generally selected to be formed of an inorganic material. When the pixel definition layer 120 is formed of an inorganic material, it is relatively thin, for example, at 0.1um and below. When the subsequent organic packaging layer is leveled, due to the thin thickness of the pixel definition layer 120, even combined with the flattening layer below, it is difficult to prevent the organic packaging layer from overflowing outward, thereby causing the problem of failure of the organic packaging layer. When the organic packaging layer overflows outward, at the same time, the organic light-emitting layer 142 material also has redundant areas of organic light-emitting material due to the entire surface evaporation in the non-display area 102, resulting in an increased risk of water vapor and oxygen intrusion.

[0041] In this embodiment, after the organic encapsulation layer is removed, there is no risk of overflow during leveling of the organic encapsulation layer, thus eliminating the need to form a barrier dam at the leveling barrier location, thus reducing the number of organic encapsulation and secondary inorganic encapsulation processes in thin-film encapsulation. It is understood that the encapsulation layer in this embodiment is an inorganic encapsulation layer 150, which can be manufactured using the first inorganic encapsulation process in thin-film encapsulation technology. This inorganic encapsulation layer 150 covers the light-emitting unit 140 and the overhang structure 130, providing a good encapsulation effect.

[0042] Specifically, the glass glue 160 is arranged in a ring, surrounding the display area 101 and also serving as a frame sealant. At the outermost edge of the non-display area 102, it generally has a "racetrack" shape or a rectangular shape with rounded corners, as projected onto the base substrate 110. One side of the glass glue 160 is bonded to the package cover plate 170, and the other side is bonded to the base substrate 110. Of course, the base substrate 110 also has a film layer, which is actually bonded to the film layer on the base substrate 110.

[0043] Specifically, the display panel 100 generally also includes a pixel driving layer 180, which is arranged on the base substrate 110. The pixel driving layer 180 is generally formed by multiple metal layers and insulating layers. By utilizing multiple metal layers and insulating layers to form thin film transistor devices, data driving circuits, etc., a driving circuit is formed to achieve individual control of each light-emitting unit 140.

[0044] Specifically, the display panel 100 also includes a pixel driving layer 180, which is arranged between the base substrate 110 and the pixel definition layer 120. The pixel driving layer 180 also includes a reflective metal layer 183, which is arranged under the glass glue 160 and is used to reflect the laser onto the glass glue 160 when the glass glue 160 is laser sintered.

[0045] In this embodiment, a reflective metal layer 183 is disposed below the glass glue 160 in the pixel driving layer 180. The reflective metal layer 183 primarily reflects the laser light during laser sintering of the glass glue 160, concentrating the heat on the glass glue 160 and allowing adhesion between the package cover plate 170 and the pixel driving layer 180 after sintering. The reflective metal layer 183 can be formed simultaneously with the metal layer within the pixel driving layer used to form thin-film transistors, scan lines, or data lines, using the same material.

[0046] It can be understood that in the process of forming the organic light-emitting layer 142 and the cathode, since the whole-surface evaporation technology is used, when the glass glue 160 is not subjected to laser high-temperature sintering, a light-emitting redundant part 144 and a top electrode redundant part 145 are provided between the glass glue 160 and the pixel driving layer 180. At this time, there is no need to remove the light-emitting redundant part 144 and the top electrode redundant part 145 under the glass glue 160 by etching. During the laser sintering process, the organic light-emitting material and cathode material of the light-emitting redundant part 144 are directly melted, so that the light-emitting redundant part 144 and the top electrode redundant part 145 are separated at the glass glue 160, and the light-emitting redundant part 144 on the outside of the glass glue 160 is no longer connected to the light-emitting redundant part 144 on the inside of the glass glue 160, and the top electrode redundant part 145 on the outside of the glass glue 160 is no longer connected to the top electrode redundant part 145 on the inside of the glass glue 160.

[0047] Specifically, the pixel definition layer 120 is formed of an inorganic material, and the pixel definition layer 120 extends from the display area 101 to the non-display area 102, forming an inorganic extension portion 122 in the non-display area 102. One side of the glass glue 160 contacts the packaging cover plate 170, and the other side of the glass glue 160 contacts the inorganic extension portion 122.

[0048] In this embodiment, the pixel definition layer 120 also extends below the glass glue 160 and extends into the non-display area 102 as an inorganic extension 122. Considering that a passivation layer is disposed above the pixel driving layer 180, and the passivation layer is generally formed of an organic material, the planar layer on the pixel driving layer 180 is easily melted during the laser sintering of the organic light-emitting material and cathode material. Therefore, in this embodiment, an inorganic extension 122 formed of an inorganic material is provided to separate the glass glue 160 from the passivation layer. The aforementioned reflective metal layer 183 is disposed below the passivation layer and below the glass glue 160, aligned with the projection of the glass glue 160 on the base substrate 110.

[0049] Considering that only the inorganic extension portion 122 is provided on the pixel driving layer 180 at the position of the glass glue 160, and the cathode wiring cannot be transmitted to the binding connection of the display panel 100, the cathode signal can be provided by an external circuit board by connecting the cathode to the pixel driving layer 180.

[0050] Specifically, the display panel 100 further includes a cathode connecting portion 181 , and the inorganic extension portion 122 is further provided with a plurality of through holes 123 . The cathode connecting portion 181 is connected to the first conductive layer 131 through the through holes 123 , and the first conductive layer 131 is connected to the cathode.

[0051] In this embodiment, the first conductive layer 131 connected to the cathode is connected to the cathode connecting portion 181 through the through hole 123, the cathode connecting portion 181 is arranged in the pixel driving layer 180, and is formed using a metal layer or conductive layer in the pixel driving layer 180, and a through hole 123 is formed on the inorganic extension portion 122, so that the first conductive layer 131 of the overhang structure 130 can be connected to the cathode connecting portion 181 in the pixel driving layer 180 through the via hole, thereby realizing the driving of the cathode.

[0052] Of course, in order to prevent the water vapor from extending from the organic light-emitting material and the cathode material to the display area 101 , in this embodiment, the overhang structure 130 provided in the non-display area 102 may be used to block them.

[0053] Specifically, the display panel 100 further includes an overhang extension 133, which also includes a second conductive layer 134 and a second insulating layer 135. The overhang extension 133 is disposed in the non-display area 102 and is located on the side of the glass adhesive 160 that is closer to the display area 101. The second insulating layer 135 protrudes from the second conductive layer 134 on the side of the glass adhesive 160 that is closer to the display area 101. The overhang extension 133 is used to separate the redundant light-emitting portion 144 from the redundant top electrode portion 145. Specifically, a gap is provided between the overhang extension 133 and the glass adhesive 160.

[0054] In this embodiment, the overhang extension 133 surrounds the display area 101 and is formed in the same process as the overhang structure 130 of the display area 101. The first conductive layer 131 is connected to the second conductive layer 134. In addition to supporting the package cover 170, the overhang extension 133 also serves to separate the redundant light-emitting portion 144 and the redundant top electrode portion 145 in the non-display area 102. Specifically, the edges of the overhang extension 133 isolate the redundant light-emitting portion 144 and the redundant top electrode portion 145 on both sides to prevent moisture from transferring between them.

[0055] Figure 4 This is a schematic diagram of another cathode connection portion of the present application, see Figure 4 As shown, considering the limited wiring space in the non-display area 102 near the display area 101, the second conductive layer 134 can also be used for connection. Specifically, the cathode connecting portion 181 is connected to the second conductive layer 134 through the through hole 123, the second conductive layer 134 is connected to the first conductive layer 131, and the first conductive layer 131 is connected to the cathode.

[0056] The cathode in this embodiment is connected to the cathode connection portion 181 in the pixel driving layer 180 through the first conductive layer 131 and the second conductive layer 134 from the through hole 123 below the overhang extension portion 133, without relying on the layout space of the display area 101 or the non-display area 102 close to the display area 101.

[0057] In another embodiment, after the inorganic extension portion 122 is formed into the through hole 123 , the bottom electrode extension portion 182 may be formed in the same layer as the bottom electrode 141 , and the signal may be transmitted to the cathode extension portion through the bottom electrode extension portion 182 .

[0058] Figure 5 is a schematic diagram of the display device of this application, see Figure 5 As shown, the present application further discloses a display device, wherein the display device 200 includes a driving circuit 210 and any one of the above-mentioned display panels 100 , wherein the driving circuit 210 is used to drive the display panel 100 to display.

[0059] It should be noted that the inventive concept of this application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the various embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the various embodiments or technical features are combined, the original technical effects will be enhanced.

[0060] The above content is a further detailed description of the present application in conjunction with specific optional implementation methods, and the specific implementation of the present application cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, they can make several simple deductions or substitutions without departing from the concept of the present application, which should be considered to fall within the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area, and further includes: substrate; a pixel definition layer, disposed on the base substrate and having a plurality of openings in the display area; an overhang structure, disposed on the pixel definition layer and surrounding the opening; a plurality of light-emitting units, disposed in the plurality of the openings; an encapsulation layer, covering the light-emitting unit and the overhanging structure; Glass glue is disposed in the non-display area and surrounds the display area; and an encapsulation cover plate, disposed on the encapsulation layer, adhered to the base substrate via the glass adhesive in the non-display area, and supported by the overhanging structure in the display area; The light-emitting unit includes a bottom electrode, a light-emitting layer and a top electrode, the overhang structure includes a first conductive layer and a first insulating layer, the top electrodes of adjacent light-emitting units are connected through the first conductive layer, and the light-emitting layers of adjacent light-emitting units are separated by the overhang structure; The light-emitting layer and the top electrode are formed by whole-surface evaporation. At the position of the glass glue, a light-emitting redundant portion is formed synchronously with the light-emitting layer, and a top electrode redundant portion is formed synchronously with the top electrode. The glass glue is used to remove the light-emitting redundant portion and the top electrode redundant portion below the glass glue position during the laser sintering process.

2. The display panel according to claim 1, wherein: The encapsulation layer includes an inorganic encapsulation layer. At the opening, the inorganic encapsulation layer and the encapsulation cover plate form a cavity. At the overhang structure, the inorganic encapsulation layer is provided between the overhang structure and the encapsulation cover plate.

3. The display panel according to claim 1, wherein: The first conductive layer is disposed on the pixel definition layer, the first insulating layer is disposed on the conductive layer, and a width of the first insulating layer is greater than a width of the first conductive layer; At each of the openings in the display area, a cavity is formed between the overhanging structure and the packaging cover.

4. The display panel according to claim 1, wherein: The pixel definition layer is formed of an inorganic material, and extends from the display area to the non-display area, forming an inorganic extension portion in the non-display area. One side of the glass glue contacts the packaging cover plate, and the other side of the glass glue contacts the inorganic extension portion.

5. The display panel according to claim 4, wherein: The display panel also includes an overhanging extension portion, which also includes a second conductive layer and a second insulating layer. The overhanging extension portion is arranged in the non-display area and is located on the side of the glass glue close to the display area. On the side of the glass glue close to the display area, the second insulating layer protrudes from the second conductive layer. The overhanging extension portion is used to separate the light-emitting redundant portion and the top electrode redundant portion.

6. The display panel according to claim 5, wherein: The display panel further includes a cathode connecting portion, and the inorganic extension portion is further provided with a through hole. The cathode connecting portion is connected to the second conductive layer through the through hole, and the second conductive layer is connected to the first conductive layer.

7. The display panel according to claim 5, wherein: A gap is provided between the overhang extension portion and the glass glue; the overhang extension portion is provided around the display area and is formed in the same process as the overhang structure of the display area; the first conductive layer is connected to the second conductive layer.

8. The display panel according to claim 1, wherein: The display panel also includes a pixel driving layer, which is arranged between the base substrate and the pixel definition layer. The pixel driving layer also includes a reflective metal layer, which is arranged under the glass glue and is used to reflect laser light onto the glass glue when the glass glue is laser sintered.

9. A display device, characterized in that: The device comprises a driving circuit and the display panel according to any one of claims 1 to 8, wherein the driving circuit is used to drive the display panel to display.

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