Component welding device for circuit board processing

Abstract

The invention belongs to the technical field of circuit board processing, and relates to a component welding device for circuit board processing, which comprises a wire feeding assembly and an agent coating assembly, the coating agent assembly comprises a supporting plate connected to the bottom frame, a rotating disc is rotationally arranged on the supporting plate, a torsion spring is connected between the rotating disc and the supporting plate, a spraying pipe is connected to the eccentric position of the rotating disc, and a first abutting rod located below the first lifting beam is connected to one side of the rotating disc. The wire feeding assembly comprises a telescopic rod connected to the first lifting beam, and the movable end of the telescopic rod is connected with a wire conduit located between the first electric soldering iron and the spraying pipe. Before the first electric soldering iron moves downwards to prepare for welding, the spraying pipe is in place in advance and sprays soldering flux to the position between a bonding pad of a circuit board and a pin of a component, the wire conduit sends a tin wire to the position between the first electric soldering iron and the spraying pipe, then when the first electric soldering iron moves downwards to conduct welding, the spraying pipe can be automatically and synchronously retracted, and the wire conduit drives the tin wire to be in place.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a component welding device for circuit board processing. Background Art

[0002] In the electronics manufacturing industry, circuit boards are an important part of electronic equipment, used to carry and connect various electronic components. As electronic products develop towards high integration, higher requirements are placed on the welding technology of components on circuit boards. Traditional manual welding methods can no longer meet the needs of modern large-scale production, so automated component welding devices have become an inevitable choice for the development of the industry.

[0003] There are currently two common ways to install components on circuit boards and the corresponding welding processes: one is through-hole mounting, in which the pins of the components directly pass through the circuit board and are exposed on the back, so that the movable circuit board can be easily soldered by dip soldering or wave soldering without affecting the front of the circuit board and the component body; the other is surface mounting, in which the pins of the components are on the front of the circuit board and the dip soldering method cannot be used, so it often relies on manual labor and the operation is cumbersome.

[0004] In view of the shortcomings of the above-mentioned prior art, a component welding device for surface mount circuit board processing is designed to overcome the shortcomings of the prior art and does not require manual tedious flux coating, tin wire pulling and heating tin feeding processes, thereby reducing the difficulty of operation and being easy to use. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a component welding device for surface mount circuit board processing that does not require manual tedious flux coating, tin wire pulling and heating tin feeding processes, reduces the difficulty of operation, and is easy to use.

[0006] In order to solve the above technical problems, the present invention provides a component welding device for processing circuit boards, comprising a base frame, a placement slot for placing the circuit board is opened on the upper side of the base frame, two electric guide rails opposite to each other are installed on the upper side of the base frame, and the sliders of the two electric guide rails are connected to a lifting beam, and a bar-shaped electric soldering iron is installed on the two lifting beams. The circuit board is first moved back and positioned in the placement slot, and then the pins on the components are placed on the pads on the upper side of the circuit board to start welding. At this time, the electric soldering iron The iron is located directly above the soldering pad of the circuit board and the pin of the component. A wire feeding assembly is provided on one side of the chassis. The wire feeding assembly is used to feed tin wire between the soldering pad of the circuit board and the pin of the component. A coating assembly is provided on one side of the chassis. The coating assembly is used to spray solder flux between the soldering pad of the circuit board and the pin of the component. When welding, the solder flux is first applied between the soldering pad of the circuit board and the pin of the component, and then the tin wire is fed between the soldering pad of the circuit board and the pin of the component, and then the electric guide rail is controlled to drive the lifting beam to drive The electric soldering iron moves down, and the electric soldering iron compresses and heat-melts the tin wire for a while; the coating component includes a support plate connected to the upper side of the base frame, a turntable is rotatably arranged on the upper part of the support plate, a torsion spring is connected between the turntable and the support plate, and the torsion spring is used for resetting the turntable after rotation; a nozzle located below the electric soldering iron is connected to the eccentric part of the turntable, and the nozzle part at the left end of the nozzle extends to the left to the top of the placement slot of the base frame, and the right end of the nozzle is used for externally connecting a hose to convey soldering flux, and the circuit board is moved back and positioned in the placement slot, and the components are placed in the bottom of the circuit board. After the pins are placed on the pads on the upper side of the circuit board, the nozzle of the nozzle is located just above the pads on the circuit board and the pins of the components. One side of the turntable is connected to a resistance rod located below the lifting beam. When the lifting beam drives the soldering iron to move down to prepare for welding, the lifting beam squeezes the resistance rod and moves it down to drive the nozzle to rotate forward through the turntable. The wire feeding assembly includes a telescopic rod connected to a lower side of the lifting beam, and the movable end of the telescopic rod is connected to a wire tube located between the soldering iron and the nozzle.

[0007] Preferably, the telescopic rod includes a support rod connected to a lower side of the lifting beam, a sliding sleeve is slidably provided at the lower part of the support rod, the sliding sleeve is the movable end of the telescopic rod, a spring 1 located in the sliding sleeve is connected between the sliding sleeve and the support rod, the wire tube is connected to the sliding sleeve, and when the lifting beam moves downward, the wire tube will be driven downward through the support rod, the spring 1 and the sliding sleeve, and when the sliding sleeve moves downward to the base frame, the tin wire on the wire tube will contact between the pad of the circuit board and the pin of the component, and the lifting beam 1 continues to move downward to drive the support rod to squeeze the spring 1 and deform.

[0008] Preferably, the wire feeding assembly also includes a connecting beam connected to the movable end of the telescopic rod, and two upper and lower opposite wire wheels are rotated on the connecting beam. The two wire wheels are respectively located on the upper and lower sides of the left end of the wire tube, and the wire wheels are used to guide the tin wire into the wire tube.

[0009] The transmission gear of the present invention is a gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a first gear and a second gear selected from the group consisting of a

[0010] Preferably, the coating assembly further comprises a shifting plate connected to one side of the turntable, and the support plate is connected to a stopper rod which contacts and cooperates with the shifting plate, so that the shifting plate is limited by the stopper rod.

[0011] Preferably, it also includes a guide sleeve, two of the guide sleeves are connected to the upper side of the base frame, and sliding rods are slid on the two guide sleeves. The sides of the two sliding rods close to each other are connected to limiting blocks, and the left and right limiting blocks are rotationally symmetrical. The left and right limiting blocks are used to limit the left rear corner part and the right front corner part of the components on the circuit board respectively, so as to position the components on the circuit board so that the pins of the components correspond to the pads of the circuit board, and the upper side of the sliding rod is connected to a resistance rod 2 that slides on the guide sleeve, and a spring 3 is connected between the resistance rod 2 and the guide sleeve. The limiting block positions the component under the action of the spring 3, so that the resistance rod 2 drives the two limiting blocks away from each other through the sliding rod to release the components on the circuit board.

[0012] Preferably, it also includes a gear 2 rotatably arranged on the upper part of the base frame, and the two sliding bars are connected to a rack 2 on one side close to each other, and the two racks 2 are relatively meshed on both sides of the gear 2, and the resistance rod 1 is suitable for squeezing the resistance rod 2. In the process of the lifting beam 1 driving the electric soldering iron to move down to prepare for welding, the lifting beam 1 will not directly make the resistance rod 1 contact with the resistance rod 2 when squeezing the resistance rod 1 and rotating. When the electric soldering iron 1 is completed and moved up to reset, it is necessary to make the limit block release the component, and the operator manually drives the turntable to rotate through the dial plate, so that the turntable drives the nozzle to rotate forward and away from the component, and at the same time, the turntable will drive the resistance rod 1 to rotate backward until the resistance rod 1 squeezes the right resistance rod 2, and the right resistance rod 2 will drive the right limit block to move right through the right sliding bar to release the component, and at the same time, the right sliding bar will also drive the left limit block to move left to release the component through the meshing of gear 2 and rack 2.

[0013] Preferably, it also includes a pushing rack slidably arranged on the base frame, the pushing rack is perpendicular to the rack 2, and the pushing rack is meshed with the gear 2. When the circuit board is placed in the placement groove of the base frame, the upper side of the circuit board is higher than the upper side of the base frame. Then, when the operator manually drives the turntable to rotate through the dial plate to release the components of the limit block, the rack 2 will drive the pushing rack to move forward a distance through the engagement of the gear 2, but the pushing rack does not contact the circuit board. Then, the operator continues to manually drive the turntable to rotate further through the dial plate, so as to make the pushing rack move forward further and push the released circuit board forward and out.

[0014] Preferably, it also includes a connecting rod connected to the lifting beam one, one side of the connecting rod is connected to the lifting beam two, and the lifting beam two is connected to the electric soldering iron two. When the lifting beam one drives the electric soldering iron to move down, the lifting beam one will also drive the electric soldering iron two to move down synchronously through the connecting rod and the lifting beam two. When there are pins on both sides of the component, the electric soldering iron one and the electric soldering iron two are used to respectively solder the pins on the front and back sides of the component to the pads on the circuit board; the wire feeding assemblies have two and the same structure, and the two wire feeding assemblies are rotationally symmetrically arranged on the left and right sides of the base frame. The principles of the two wire feeding assemblies are the same and will not be repeated here. When the electric guide rail is started to drive the lifting beam 1 to drive the electric soldering iron to move down in preparation for welding, tin wire is fed to the pins on both sides of the component through the two wire feeding assemblies respectively; the coating assembly has two and the same structure, and the two coating assemblies are rotationally symmetrically arranged on the left and right sides of the base frame. The principles of the two coating assemblies are the same and will not be repeated here. The two coating assemblies are used to spray flux on the pins on both sides of the component respectively, and when the electric soldering iron 1 and the electric soldering iron 2 move down in preparation for welding, the nozzle of the front coating assembly will rotate forward to the avoidance position of the electric soldering iron 1, and the nozzle of the rear coating assembly will rotate backward to the avoidance position of the electric soldering iron 2.

[0015] The present invention overcomes the shortcomings of the prior art and can achieve the following beneficial effects: 1. Before the electric soldering iron moves down to prepare for welding, the nozzle is pre-positioned and the flux is sprayed between the pads of the circuit board and the pins of the components, and the wire tube sends the tin wire to between the electric soldering iron and the nozzle. Then, when the electric soldering iron moves down for welding, the nozzle can be automatically and synchronously retracted, and the wire tube drives the tin wire into place.

[0016] 2. Under the meshing action of gear 1 and rack 1, each time the electric soldering iron 1 moves downward, the rotating rod drives the tin wire coil to rotate, thereby sending the tin wire on the tin wire coil to the wire tube, so that the tin wire is automatically and synchronously fed before welding, without the need for tedious manual pulling of the tin wire.

[0017] 3. Use the left and right limit blocks to limit the left rear corner and right front corner of the components on the circuit board respectively, so as to position the components on the circuit board so that the pins of the components correspond to the pads of the circuit board, thereby improving the stability of spraying flux and soldering with tin wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an assembly schematic diagram of the present invention.

[0019] Figure 2 It is a schematic diagram of the base frame, the sliding frame, the rotating rod and the nut of the present invention, wherein only a part of the base frame is shown schematically.

[0020] Figure 3 It is a cross-sectional view of the sliding sleeve of the present invention.

[0021] Figure 4 It is a schematic diagram of the support plate, the rotating disk and the torsion spring of the present invention.

[0022] Figure 5 It is a cross-sectional view of the support plate of the present invention.

[0023] Figure 6 For the present invention Figure 1 Schematic diagram of the rear side direction.

[0024] Figure 7 For the present invention Figure 6 Enlarged view of point A.

[0025] Figure 8 It is a schematic diagram of the guide sleeve, the slide rod and the limit block of the present invention.

[0026] Fig. 9 For the present invention Figure 8 Top view of the .

[0027] Fig.10 It is a schematic diagram of the present invention having two wire feeding assemblies and two coating assemblies.

[0028] Fig.11 For the present invention Fig.10 Top view of the .

[0029] The marks in the drawings provided by the present invention are: 01-circuit board, 02-components, 11-base frame, 12-electric guide rail, 13-lifting beam 1, 133-contact wheel, 14-electric soldering iron 1, 2-wire feeding assembly, 21-telescopic rod, 211-support rod, 212-sliding sleeve, 213-spring 1, 221-conductor tube, 222-conductor wheel, 23-connecting beam, 24-sliding frame, 241-limiting plate, 242-lifting rod, 25-spring 2, 2 6- rotating rod, 27- nut, 28- gear one, 29- rack one, 3- coating assembly, 31- support plate, 32- turntable, 33- torsion spring, 34- nozzle, 35- resistance rod one, 36- stop rod, 37- paddle plate, 41- guide sleeve, 42- slide rod, 43- limit block, 44- resistance rod two, 45- spring three, 46- gear two, 47- rack two, 48- push rack, 141- connecting rod, 142- lifting beam two, 143- electric soldering iron two. DETAILED DESCRIPTION

[0030] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0031] In addition, the terms "first", "second" and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. It should be noted that the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0032] A component welding device for circuit board processing, such as Figure 1-Figure 5As shown, it includes a base frame 11, and a placement groove for placing the circuit board 01 is opened on the upper side of the base frame 11. Two electric guide rails 12 opposite to each other are installed on the upper side of the base frame 11. The sliders of the two electric guide rails 12 are connected with a lifting beam 13. The two lifting beams 13 are jointly installed with a bar-shaped electric soldering iron 14. First, the circuit board 01 is moved back and positioned in the placement groove, and then the pins on the component 02 are placed on the soldering pads on the upper side of the circuit board 01 to start soldering. At this time, the electric soldering iron 14 is correspondingly located just above the soldering pad of the circuit board 01 and the pins of the component 02. A wire feeding assembly 2 is provided on one side, and the wire feeding assembly 2 is used to feed tin wire between the pad of the circuit board 01 and the pin of the component 02. A coating assembly 3 is provided on one side of the base frame 11, and the coating assembly 3 is used to spray flux between the pad of the circuit board 01 and the pin of the component 02. When welding, the flux is first applied between the pad of the circuit board 01 and the pin of the component 02, and then the tin wire is fed between the pad of the circuit board 01 and the pin of the component 02, and then the electric guide rail 12 is controlled to drive the lifting beam 13 to drive the electric soldering iron 14 to move downward, and the electric soldering iron 14 will press and heat-melt the tin wire; the coating assembly 3 includes a connecting rod 12; a lifting beam 13 is driven by ... A support plate 31 is connected to the upper side of the base frame 11. A turntable 32 is rotatably mounted on the upper part of the support plate 31. A torsion spring 33 is connected between the turntable 32 and the support plate 31. The torsion spring 33 is used to reset the turntable 32 after rotation. A nozzle 34 located below the electric soldering iron 14 is connected to the eccentric part of the turntable 32. The nozzle portion of the left end of the nozzle 34 extends to the left above the placement slot of the base frame 11. The right end of the nozzle 34 is used to connect an external hose to transport soldering flux. After the circuit board 01 is moved back and positioned in the placement slot and the pins of the component 02 are placed on the pads on the upper side of the circuit board 01, the nozzle 34 is The nozzle part of the rotating disk 32 is located just above the soldering pad of the circuit board 01 and the pin of the component 02. The soldering flux delivered by the nozzle 34 can be conveniently sprayed from the nozzle part to the soldering pad of the circuit board 01 and the pin of the component 02. One side of the rotating disk 32 is connected to a resisting rod 35 located below the lifting beam 13. When the lifting beam 13 drives the electric soldering iron 14 to move downward to prepare for welding, the lifting beam 13 will squeeze the resisting rod 35 to move downward and drive the nozzle 34 to rotate forward through the rotating disk 32, so that when the electric soldering iron 14 moves downward for welding, the nozzle 34 that has sprayed the soldering flux will automatically and synchronously turn to the avoidance position of the electric soldering iron 14;The wire feeding assembly 2 includes a telescopic rod 21 connected to the lower side of the lifting beam 13, and the movable end of the telescopic rod 21 is connected to a wire tube 221 located between the electric soldering iron 14 and the nozzle 34. Initially, the wire tube 221 sends the tin wire between the electric soldering iron 14 and the nozzle 34, and the nozzle 34 can normally spray the solder flux between the pad of the circuit board 01 and the pin of the component 02. When the lifting beam 13 drives the electric soldering iron 14 to move downward, the lifting beam 13 will also pass through the telescopic rod 21. The wire tube 221 is driven to move downward. At this time, the electric soldering iron 14 does not touch the tin wire on the wire tube 221 until the turntable 32 drives the nozzle 34 to rotate forward and the telescopic rod 21 moves downward to the bottom frame 11. The tin wire on the wire tube 221 will contact between the pad of the circuit board 01 and the pin of the component 02. The lifting beam 13 continues to move downward to make the telescopic rod 21 shrink, driving the electric soldering iron 14 to move downward to press the tin wire on the wire tube 221 and then perform hot melting, thereby soldering the pin of the component 02 to the pad of the circuit board 01. ;

[0033] like Figure 6 and Figure 7 As shown, the lower part of the lifting beam 13 is rotated with a contact wheel 133 that contacts and cooperates with the contact rod 35, and the rolling of the contact wheel 133 is used to reduce the friction loss to the contact rod 35.

[0034] like Figure 2 and Figure 3 As shown, the telescopic rod 21 includes a support rod 211 connected to the lower side of the lifting beam 13, and a sliding sleeve 212 is slidably provided at the lower part of the support rod 211. The sliding sleeve 212 is the movable end of the telescopic rod 21, and a spring 213 located in the sliding sleeve 212 is connected between the sliding sleeve 212 and the support rod 211. The wire tube 221 is connected to the sliding sleeve 212. The downward movement of the lifting beam 13 will drive the wire tube 221 to move downward through the support rod 211, the spring 213 and the sliding sleeve 212. When the sliding sleeve 212 moves down to the bottom frame 11, the tin wire on the wire tube 221 will contact between the pad of the circuit board 01 and the pin of the component 02. The lifting beam 13 continues to move downward to drive the support rod 211 to squeeze the spring 213 and deform it.

[0035] like Figure 2 and Figure 3 As shown, the wire feeding assembly 2 also includes a connecting beam 23 connected to the sliding sleeve 212, and two upper and lower opposite wire wheels 222 are rotated on the connecting beam 23. The two wire wheels 222 are respectively located on the upper and lower sides of the left end of the wire tube 221. The wire wheels 222 are used to guide the tin wire into the wire tube 221, so as to increase the stability and smoothness of the tin wire feeding.

[0036] like Figure 2, Figure 3 and Figure 6 As shown, the wire feeding assembly 2 also includes a sliding frame 24 connected to the connecting beam 23, the sliding frame 24 is slidably arranged on the upper part of the base frame 11, a spring 25 is connected between the sliding frame 24 and the base frame 11, a rotating rod 26 for supporting the tin wire roll is rotatably provided on the sliding frame 24, a nut 27 is threadedly connected to the first end (front end) of the rotating rod 26, and the nut 27 is used to fix the tin wire roll to the rotating rod 26. After fixing the tin wire roll, the end of the tin wire roll is pulled out from left to right and passes through the wire wheel 2 in sequence. 22 and the wire tube 221, the second end (rear end) of the rotating rod 26 is connected to a gear 28 through a one-way clutch, and one side of the base frame 11 is connected to a rack 29 meshing with the gear 28, the gear 28 moves down and meshes with the rack 29, under the action of the one-way clutch, the gear 28 will drive the rotating rod 26 to rotate, the gear 28 moves up and meshes with the rack 29, under the action of the one-way clutch, the gear 28 rotates by itself without driving the rotating rod 26 to rotate, the upper side of the sliding frame 24 is connected to a limiting plate 241, One side of the lifting beam 13 is connected with a lifting rod 242 suitable for contacting and cooperating with the lower side of the limit plate 241. Initially, the lifting rod 242 blocks the lower side of the limit plate 241, and the spring 25 is in a stretched state. When the lifting beam 13 drives the electric soldering iron 14 to move downward to prepare for welding, the lifting beam 13 will drive the lifting rod 242 to move downward and gradually loosen the limit plate 241, and the spring 25 will reset. Under the action of the spring 25, the sliding frame 24 will drive the tin wire roll to move downward through the rotating rod 26. At this time, the wire tube 221 moves downward synchronously. The rotating rod 26 will also drive the gear 28 to move downward and mesh with the rack 29, so that the gear 28 will drive the tin wire roll to rotate during the downward movement, thereby sending the tin wire on the tin wire roll to the wire tube 221, until the telescopic rod 21 moves down to the base frame 11, and the tin wire on the wire tube 221 will contact between the soldering pad of the circuit board 01 and the pin of the component 02. At this time, the sliding frame 24 stops moving downward, and the tin wire also stops being sent out. The lifting beam 13 continues to move downward, which will drive the electric soldering iron 14 to move downward to complete the welding of the circuit board 01 and the component 02.

[0037] like Figure 4 and Figure 5As shown, the coating assembly 3 also includes a dial plate 37 connected to one side of the turntable 32, and a baffle 36 is connected to the support plate 31 to contact and cooperate with the dial plate 37. The baffle 36 is used to limit the dial plate 37, thereby ensuring the positions of the turntable 32 and the nozzle 34 when they are reset, so that the nozzle 34 can accurately spray the flux onto the pads of the circuit board 01 and between the pins of the components 02; and when the circuit board 01 and the components 02 are placed on the placement groove on the upper side of the base frame 11, the turntable 32 is driven to rotate by the dial plate 37, so that the turntable 32 drives the nozzle 34 to rotate forward, so that the circuit board 01 and the components 02 are placed more conveniently.

[0038] like Figure 8 and Fig. 9 As shown, it also includes a guide sleeve 41, and two guide sleeves 41 are connected to the upper side of the base frame 11, and slide bars 42 are slidably arranged on the two guide sleeves 41. The two slide bars 42 are connected to the sides close to each other with limit blocks 43, and the left and right limit blocks 43 are rotationally symmetrical. The left and right limit blocks 43 are respectively used to limit the left rear corner part and the right front corner part of the component 02 on the circuit board 01, so as to position the component 02 on the circuit board 01 so that the pins of the component 02 correspond to the pads of the circuit board 01, and the upper side of the slide bar 42 is connected to a second resistance rod 44 sliding on the guide sleeve 41, and a third spring 45 is connected between the second resistance rod 44 and the guide sleeve 41. The limit block 43 positions the component 02 under the action of the third spring 45, so that the second resistance rod 44 drives the two limit blocks 43 away from each other through the slide bar 42 to release the component 02 on the circuit board 01.

[0039] like Figure 8 and Fig. 9 As shown, it also includes a gear 2 46 rotatably arranged on the upper part of the base frame 11, and the two sliding rods 42 are connected to the sides close to each other with racks 2 47, and the two racks 2 47 are relatively meshed on both sides of the gear 2 46. The resistance rod 1 35 is suitable for squeezing the resistance rod 2 44. In the process of the lifting beam 13 driving the electric soldering iron 14 to move down to prepare for welding, the lifting beam 13 squeezes the resistance rod 1 35 and rotates, and the resistance rod 1 35 will not directly contact the resistance rod 2 44. When the electric soldering iron 14 is welded and moved up to reset, it is necessary to loosen the limit block 43. When opening component 02, the operator manually drives the turntable 32 to rotate through the dial plate 37, so that the turntable 32 drives the nozzle 34 to rotate forward and away from component 02. At the same time, the turntable 32 will drive the resistance rod 1 35 to rotate backward until the resistance rod 1 35 squeezes the right resistance rod 2 44. The right resistance rod 2 44 will then drive the right limit block 43 to move rightward through the right slide bar 42 to release component 02. At the same time, the right slide bar 42 will also drive the left limit block 43 to move leftward through the engagement of gear 2 46 and rack 2 47 to release component 02.

[0040] like Figure 8 and Fig. 9 As shown, it also includes a push rack 48 slidably arranged on the base frame 11, and the push rack 48 is perpendicular to the rack 2 47. The push rack 48 is meshed with the gear 2 46. When the circuit board 01 is placed in the placement groove of the base frame 11, the upper side of the circuit board 01 is higher than the upper side of the base frame 11. Then, when the operator manually drives the turntable 32 to rotate through the dial plate 37 to make the limit block 43 release the component 02, the rack 2 47 will drive the push rack 48 to move forward a distance through the engagement of the gear 2 46, but the push rack 48 does not contact the circuit board 01. Then the operator continues to manually drive the turntable 32 to rotate further through the dial plate 37, so as to make the push rack 48 move forward further and push the released circuit board 01 forward and out.

[0041] like Fig.10 and Fig.11 As shown, it also includes a connecting rod 141 connected to the lifting beam 13, one side of the connecting rod 141 is connected to the lifting beam 2 142, and the lifting beam 2 142 is connected to the electric soldering iron 2 143. When the lifting beam 13 drives the electric soldering iron 14 to move downward, the lifting beam 13 will also drive the electric soldering iron 2 143 to move downward synchronously through the connecting rod 141 and the lifting beam 2 142. When both sides of the component 02 have pins, the electric soldering iron 14 and the electric soldering iron 2 143 are used to respectively solder the pins on the front and rear sides of the component 02 to the pads of the circuit board 01; the wire feeding assembly 2 has two and the same structure, and the two wire feeding assemblies 2 are rotationally symmetrically arranged on the left and right sides of the base frame 11. The two wire feeding assemblies 2 have the same principle. I will not elaborate on this. When the electric guide rail 12 is started to drive the lifting beam 13 to drive the soldering iron 14 to move downward in preparation for welding, the two wire feeding assemblies 2 are used to feed tin wire to the pins on both sides of the component 02 respectively. The coating assembly 3 has two and the same structure. The two coating assemblies 3 are rotationally symmetrically arranged on the left and right sides of the base frame 11. The principles of the two coating assemblies 3 are the same and I will not elaborate on them here. The two coating assemblies 3 are used to spray flux on the pins on both sides of the component 02 respectively, and when the soldering iron 14 and the soldering iron 2 143 move downward in preparation for welding, the nozzle 34 of the front coating assembly 3 will rotate forward to the soldering iron 14 avoidance position, and the nozzle 34 of the rear coating assembly 3 will rotate backward to the soldering iron 2 143 avoidance position.

[0042] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. They only express the preferred implementation modes of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention.

[0043] It should be pointed out that, for ordinary technicians in this field, several modifications, increases and decreases in quantity, improvements and substitutions can be made without departing from the concept of the present invention. Therefore, based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

Claims

1. A component welding device for circuit board processing, characterized in that: The invention comprises a base frame (11), wherein a placement groove for placing a circuit board (01) is formed on the upper side of the base frame (11), an electric guide rail (12) is installed on the base frame (11), a lifting beam (13) is connected to the slider of the electric guide rail (12), an electric soldering iron (14) is installed on the lifting beam (13), a wire feeding assembly (2) is provided on one side of the base frame (11), and a coating assembly (3) is provided on one side of the base frame (11); the coating assembly (3) comprises a support plate (31) connected to the base frame (11), a rotating disk (32) is rotatable on the support plate (31), and the wire feeding assembly (2) is provided on one side of the base frame (11). A torsion spring (33) is connected between the turntable (32) and the support plate (31); a nozzle (34) is connected to the eccentric portion of the turntable (32); a nozzle portion of the nozzle (34) extends above the placement slot of the base frame (11); one side of the turntable (32) is connected to a resistance rod (35) located below the lifting beam (13); the wire feeding assembly (2) comprises a telescopic rod (21) connected to the lifting beam (13); a movable end of the telescopic rod (21) is connected to a wire tube (221) located between the electric soldering iron (14) and the nozzle (34).

2. A component welding device for circuit board processing according to claim 1, characterized in that: The telescopic rod (21) comprises a support rod (211) connected to the lifting beam (13); a sliding sleeve (212) is slidably disposed at the lower portion of the support rod (211); the sliding sleeve (212) is a movable end of the telescopic rod (21); a spring (213) located inside the sliding sleeve (212) is connected between the sliding sleeve (212) and the support rod (211); and the wire tube (221) is connected to the sliding sleeve (212).

3. A component welding device for circuit board processing according to claim 1, characterized in that: The wire feeding assembly (2) further comprises a connecting beam (23) connected to the movable end of the telescopic rod (21), two guide wheels (222) rotatably mounted on the connecting beam (23), and the two guide wheels (222) are respectively located on two sides of the guide tube (221).

4. A component welding device for circuit board processing according to claim 3, characterized in that: The wire feeding assembly (2) further comprises a sliding frame (24) connected to the connecting beam (23), a spring 2 (25) being connected between the sliding frame (24) and the base frame (11), a rotating rod (26) being rotatable on the sliding frame (24), a nut (27) being threadedly connected to the first end of the rotating rod (26), the nut (27) being used to fix the tin wire roll to the rotating rod (26), a second end of the rotating rod (26) being connected to a gear 1 (28) via a one-way clutch, a rack 1 (29) being meshed with the gear 1 (28) being connected to one side of the base frame (11), a limiting plate (241) being connected to the upper side of the sliding frame (24), and a lifting rod (242) being suitable for contacting and cooperating with the lower side of the limiting plate (241) being connected to one side of the lifting beam 1 (13).

5. A component welding device for circuit board processing according to claim 1, characterized in that: The coating component (3) further comprises a dial plate (37) connected to one side of the rotating disk (32); the support plate (31) is connected to a stopper rod (36) which contacts and cooperates with the dial plate (37); the stopper rod (36) limits the position of the dial plate (37).

6. A component welding device for circuit board processing according to claim 5, characterized in that: It also includes a guide sleeve (41), two guide sleeves (41) are connected to the upper side of the base frame (11), a slide rod (42) is slidably mounted on the two guide sleeves (41), a limit block (43) is connected to the sides of the two slide rods (42) close to each other, a second resistance rod (44) is connected to the slide rod (42) and slides on the guide sleeve (41), and a third spring (45) is connected between the second resistance rod (44) and the guide sleeve (41).

7. A component welding device for circuit board processing according to claim 6, characterized in that: It also includes a second gear (46) rotatably arranged on the base frame (11), and the two sliding rods (42) are connected to a second rack (47) on one side close to each other, and the two second racks (47) are relatively meshed on both sides of the second gear (46), and the first abutment rod (35) is suitable for pressing the second abutment rod (44).

8. A component welding device for circuit board processing according to claim 7, characterized in that: It also includes a material pushing rack (48) slidably arranged on the base frame (11), the material pushing rack (48) is perpendicular to the second rack (47), and the material pushing rack (48) is meshed with the second gear (46).

9. A component welding device for circuit board processing according to claim 8, characterized in that: It also includes a connecting rod (141) connected to the first lifting beam (13), one side of the connecting rod (141) is connected to the second lifting beam (142), and the second lifting beam (142) is connected to the second electric soldering iron (143); the wire feeding assemblies (2) have two identical structures, and the two wire feeding assemblies (2) are rotationally symmetrically arranged on both sides of the base frame (11); the coating assemblies (3) have two identical structures, and the two coating assemblies (3) are rotationally symmetrically arranged on both sides of the base frame (11).

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