RFID tag manufacturing method and RFID tag thereof

Abstract

The present invention discloses a method for manufacturing an RFID tag and an RFID tag thereof, and relates to the technical field of RFID tags; the RFID tag manufacturing method is applied to a tag coil, the tag coil includes a coil substrate and a plurality of tag structures arrayed on the coil substrate, wherein each of the tag structures includes an antenna portion and a wafer chip connected to a feeding point of the antenna portion; specifically, the RFID tag manufacturing method includes the following steps: performing an opening process on the coil substrate around the wafer chip of each of the tag structures to form an opening portion; and / or performing an encapsulation process on the wafer chip of each of the tag structures to form an encapsulation portion. The technical solution provided by the present invention can reduce the probability of wafer chips falling off and being lost, so as to ensure that the RFID tag can operate normally.

Description

Technical Field

[0001] The present invention relates to the field of RFID technology, and in particular to an RFID tag manufacturing method and an RFID tag thereof. Background Art

[0002] With the continuous development of wireless radio frequency technology, radio frequency identification (RFID) has been widely used in bus cards, access cards, attendance cards, etc. Among them, RFID tags equipped with RFID technology usually consist of an antenna part and a wafer chip connected to the feeding point of the antenna part.

[0003] In the prior art, RFID tags have the defect of wafer chips falling off and being lost, which leads to the abnormal situation of RFID tags not performing properly. Research has found that the main reason for the falling off and loss of wafer chips is that during the manufacturing process of RFID tags, after the wafer chip is labeled to the antenna part located on the coil substrate to form a label structure, the label coil will pass through multiple rollers as it is transported. During this period, the wafer chip is subjected to tensile forces on the front and rear sides of the material feeding direction and tension on the left and right sides of the material feeding direction, and the reaction force given by the rollers on the other hand. The combined effect of multiple aspects will cause the wafer chip to be damaged by force and then fall off and be lost. The combined effect of multiple aspects will cause the wafer chip to be damaged by force and then fall off and be lost.

[0004] Therefore, there is an urgent need for an improvement in the RFID tag manufacturing method to reduce the probability of wafer chip falling off and being lost, so as to ensure that the RFID tag can operate normally.

[0005] It should be noted that the above contents are only used to assist in understanding the technical solution of the present invention, and do not constitute an admission that the above contents are prior art. Summary of the invention

[0006] The main purpose of the present invention is to provide an RFID tag manufacturing method and an RFID tag thereof, aiming to reduce the probability of wafer chip falling off and being lost, so as to ensure that the RFID tag can operate normally.

[0007] To achieve the above object, the present invention provides an RFID tag manufacturing method, which is applied to a tag roll, wherein the tag roll comprises a roll substrate and a plurality of tag structures arranged in an array on the roll substrate, wherein each of the tag structures comprises an antenna portion and a wafer chip connected to a feeding point of the antenna portion;

[0008] Specifically, the RFID tag manufacturing method comprises the following steps:

[0009] Performing a hole-opening process on the coil substrate around the wafer chip of each label structure to form an opening portion;

[0010] And / or, encapsulation processing is performed on the wafer chip of each tag structure to form an encapsulation part.

[0011] In one embodiment, the step of performing a hole-opening process on the roll substrate around the wafer chip of each label structure to form an opening portion includes: providing the opening portion in the front and rear side areas and / or left and right side areas of the wafer chip along the feeding direction of the label roll material.

[0012] In one embodiment, the step of performing a hole-opening process on the coil substrate around the wafer chip of each label structure to form an opening portion comprises:

[0013] The opening portion is rectangular, and the distance between the opening portion and the wafer chip is 1 to 1.7 times the width of the wafer chip;

[0014] And, the opening portion is arranged in the front and rear side areas or the left and right side areas of the wafer chip along the feeding direction of the label roll, and the edge of the opening portion is located outside the edge of the wafer chip; each of the opening portions is provided with more than two partitions, wherein the length direction of the partitions extends along the feeding direction of the label roll to divide the opening portion into a plurality of rectangular sub-holes.

[0015] In one embodiment, the step of performing a hole-opening process on the coil substrate around the wafer chip of each label structure to form an opening portion comprises the following steps:

[0016] The coil substrate is subjected to a hole-opening process by a roll die-cutting method to form the hole portion;

[0017] Alternatively, the coil substrate is subjected to a hole-forming process by laser punching to form the hole portion.

[0018] In one embodiment, the step of performing a hole-forming process on the coil substrate by laser punching includes: making the hole portion rectangular, and the size of the hole portion is 0.2 mm*0.2 mm or less.

[0019] In one embodiment, the step of encapsulating each wafer chip of the tag structure to form an encapsulation portion comprises the following steps:

[0020] Performing glue spraying treatment on the surface of the wafer chip to form a glue spraying area, wherein the glue spraying area covers the wafer chip;

[0021] The glue spraying area is cured to form the encapsulation portion.

[0022] In one embodiment, the step of performing glue spraying on the surface of the wafer chip to form a glue spraying area comprises the following steps:

[0023] UV glue is used for glue spraying, wherein the UV glue includes any one of black glue, white glue and transparent glue.

[0024] In one embodiment, the step of performing glue spraying treatment on the surface of the wafer chip to form a glue spraying area includes: making the size of the glue spraying area 1.2 to 1.5 times the size of the wafer chip.

[0025] In one embodiment, the step of curing the glue spraying area to form the encapsulation portion comprises the following steps:

[0026] The spray glue area is cured by using a UV lamp; wherein the UV lamp has an irradiation band of 320-400nm, an irradiation temperature of 25-40°C, and an irradiation intensity of 80-120mw / cm 2 , the irradiation time is 1-2s.

[0027] To achieve the above object, the present invention provides an RFID tag, which is manufactured using any of the RFID tag manufacturing methods described above.

[0028] In order to reduce the probability of wafer chip falling off and being lost, the present invention adopts the following two methods: Method 1: By opening holes in the coil substrate around the wafer chip of each label structure, the stretching force / tension / roller reaction force of the wafer chip during the transmission process is dispersed; Method 2: The wafer chip of each label structure is encapsulated, and a layer of encapsulation layer is covered on the surface of the wafer chip to improve the shear resistance of the wafer chip and the degree of integration between the wafer chip and the antenna part, so as to overcome the stretching force / tension of the wafer chip during the transmission process and the reaction force of the roller on the wafer chip; The above two methods, under the premise of small changes in the process procedures of the original RFID tag production line and low improvement cost, can effectively improve the abnormal falling of labels in the RFID industry during the preparation and transmission process, so as to ensure the normal operation of the RFID tags and greatly improve the yield rate of the RFID tags; both the time consumption and the cost are within the effective control limit, and the effect achieved is significant. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 This is one of the force analysis diagrams of the label roll when passing through the roller in the prior art;

[0031] Figure 2 The second is a force analysis diagram of a label roll passing through a roller in the prior art;

[0032] Figure 3 This is a structural schematic diagram of an embodiment of a method for manufacturing an RFID tag provided by the present invention;

[0033] Figure 4 The second structural schematic diagram of an embodiment of the RFID tag manufacturing method provided by the present invention;

[0034] Figure 5 The third structural schematic diagram of an embodiment of the RFID tag manufacturing method provided by the present invention;

[0035] Figure 6 This is a fourth structural schematic diagram of an embodiment of the RFID tag manufacturing method provided by the present invention.

[0036] Description of reference numerals:

[0037] 100, coil substrate; 200, label structure; 210, antenna part; 220, wafer chip; 300, opening part; 310, rectangular sub-hole; 320, separator; 330, tension buffer ring; 400, encapsulation part;

[0038] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0039] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solution in the present invention. Obviously, what is described is only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0040] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0041] In addition, it should be noted that the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0042] In the prior art, RFID tags have the defect of wafer chips falling off and being lost, which leads to the abnormal situation of RFID tags not being able to perform. Research has found that the main reason for the falling off and loss of wafer chips is that during the manufacturing process of RFID tags, after the wafer chips are labeled to the antenna part of the coil substrate to form a label structure, the label coil will pass through multiple rollers as it is transported. During this period, the wafer chips are subjected to tensile forces on the front and rear sides of the material feeding direction and tension on the left and right sides of the material feeding direction, and on the other hand, the wafer chips are subjected to the reaction force given by the rollers. Under the combined effect of multiple aspects, the wafer chips will be damaged by force and then fall off and be lost.

[0043] Specifically, as attached Figure 1 And attached Figure 2 As shown in the figure, when the label roll passes through the roller, the forces acting on the label roll mainly include: (1) the front side tensile force F along the feeding direction 1 And the rear tensile force F 2 ; (2) The tension on the left side along the feeding direction f 1 And the right tension f 2 ; (3) Friction force f between label roll and roller 摩擦 (Generally, it will not affect the force on the wafer chip and can be ignored); (4) Since the label roll has an angle θ after passing the roller, the tensile force F 1 and F 2 The resultant force F 合 , its direction is perpendicular to the roller and faces inward, and its force magnitude is also calculated according to the trigonometric formula: F 合 =2*F 1*Cos(θ / 2), where θ is 0~180°; therefore, the reaction force F given by the roller 反 It acts directly on the wafer chip, with its direction perpendicular to the roller and toward the outside.

[0044] During stable operation, the lateral tension f on both sides 1 and f 2 equal to ensure that the label roll will not have lateral deviation, that is, f 1 =f 2 For the material feeding direction, although there is an angle θ after passing through the roller, the tensile forces on both sides are still similar, that is, F 1 ≈F 2 To ensure that when passing through the roller, the label roll can still be smoothly transported forward by relying on inertia and the reverse force of the roller; therefore, the main forces affecting the wafer chip are: F 1 ≈F 2 , f 1 =f 2 , tensile force F 合 = Roller reaction force F 反 ;

[0045] The comprehensive effect is: the wafer chip is subjected to the tensile force on the front and rear sides of the material feeding direction and the tension on the left and right sides of the material feeding direction on the one hand, and the reaction force given by the roller on the other hand; under the combined effect of multiple aspects, the wafer chip will be subjected to force to damage the package and then fall off and be lost.

[0046] In order to solve the above technical problems, the present invention provides a method for manufacturing an RFID tag.

[0047] See also Figures 3 to 6 In one embodiment of the present invention, the RFID tag manufacturing method is applied to a tag roll, the tag roll includes a roll substrate 100 and a plurality of tag structures 200 arrayed on the roll substrate 100, wherein each tag structure 200 includes an antenna portion 210 and a wafer chip 220 connected to a feeding point of the antenna portion 210;

[0048] Specifically, the RFID tag manufacturing method includes the following steps:

[0049] Step S100: performing a hole-opening process on the coil substrate 100 around the wafer chip 220 of each label structure 200 to form an opening portion 300;

[0050] Step S200 : performing encapsulation processing on the wafer chip 220 of each tag structure 200 to form an encapsulation portion 400 .

[0051] In order to reduce the probability of the wafer chip 220 falling off and being lost, the present invention adopts the following two methods: Method 1: By performing a hole opening treatment on the coil substrate 100 around the wafer chip 220 of each label structure 200, the tensile force / tension / roller reaction force of the wafer chip 220 during the transmission process is dispersed; Method 2: The wafer chip 220 of each label structure 200 is encapsulated, and a layer of encapsulation layer is covered on the surface of the wafer chip 220 to improve the shear resistance of the wafer chip 220 and the degree of integration between the wafer chip 220 and the antenna part 210, so as to overcome the tensile force / tension on the wafer chip 220 during the transmission process and the reaction force of the roller on the wafer chip 220; The above two methods, under the premise of small changes to the process procedures of the original RFID label production line and low improvement cost, can effectively improve the abnormal falling of labels in the RFID industry during the preparation and transmission process, so as to ensure that the RFID label can operate normally and greatly improve the yield rate of the RFID label; both time consumption and cost are within effective control limits, and the effect achieved is significant.

[0052] It can be understood that the above-mentioned opening process and encapsulation process can be used in combination or one of them can be used selectively, and the present application does not impose any specific limitation thereto.

[0053] Among them, the above-mentioned roll substrate 100 can be selected from coated paper polyethylene, glassine paper, kraft paper or polyester PET, etc., and can also be compatible with conventional transparent PET, translucent PET, transparent OPP, translucent OPP, transparent PVC, glossy white PVC, matte white PVC, synthetic paper, etc.; the above-mentioned antenna part 210 is mainly metal aluminum foil, in which the conductor may contain gold / aluminum / silver / copper, etc.

[0054] As a preferred solution of the above embodiment, the above step S100 includes: the opening portion 300 is arranged in the front and rear side areas and / or the left and right side areas of the wafer chip 220 along the label roll material feeding direction. The above technical solution can be understood as the opening portion 300 is separately arranged in the front and rear side areas of the wafer chip 220 along the label roll material feeding direction (such as the attached Figure 3 ), or the opening portion 300 is separately arranged on the left and right side areas of the wafer chip 220 along the feeding direction of the label roll (as shown in the attached Figure 4 ), or the opening portion 300 is simultaneously arranged in the front and rear side regions and the left and right side regions of the wafer chip 220 along the feeding direction of the label roll (as shown in the attached Figure 5 Those skilled in the art may select the above technical solutions according to actual conditions, which shall also fall within the protection scope of this application.

[0055] Furthermore, the above-mentioned step S100 includes: making the opening portion 300 rectangular, and the distance between the opening portion 300 and the wafer chip 220 is 1 to 1.7 times the width of the wafer chip 220; in this way, by setting a limit on the distance between the opening portion 300 and the wafer chip 220, it is ensured that the wafer chip 220 is not damaged due to the opening portion 300 and the wafer chip 220 being too close during the opening process, and the purpose of dispersing the force on the wafer chip 220 cannot be achieved due to the opening portion 300 and the wafer chip 220 being too far away.

[0056] Furthermore, the openings 300 are arranged in the front and rear side regions or the left and right side regions of the wafer chip 220 along the feeding direction of the label coil, and the edges of the openings 300 are located outside the edges of the wafer chip 220; in this way, the openings 300 located around the wafer chip 220 are combined to form a tension buffer ring 330, and the wafer chip 220 located inside the tension buffer ring 330 can better offset the influence of its stretching force / tension / roller reaction force on it. In this case, the openings 300 can be arranged in the front and rear side regions or the left and right side regions of the wafer chip 220 along the feeding direction of the label coil, without the need to arrange the openings 300 in the front and rear side regions and the left and right side regions along the feeding direction of the label coil at the same time.

[0057] Furthermore, two or more separators 320 are provided inside each opening 300, wherein the length direction of the separators 320 extends along the feeding direction of the label roll to divide the opening 300 into a plurality of rectangular sub-holes 310. In this arrangement, the separators 320 are used as reinforcing ribs inside the opening 300 to avoid the opening area of ​​the opening 300 being too large to damage the structural stability of the label roll, thereby avoiding the risk of tearing during the feeding and transmission of the label roll.

[0058] In this embodiment, as shown in the attached Figure 3 As shown, since the rectangular size of the common wafer chip 220 on the market is 0.35mm*0.35mm~0.60mm*0.60mm, the spacing between the opening portion 300 and the wafer chip 220 is 0.5~1mm; and the opening portion 300 is arranged at the front and rear side areas of the wafer chip 220 along the feeding direction of the label roll material, and two partitions 320 are arranged inside each opening portion 300, and the opening portion 300 is divided into three rectangular sub-holes 310 by the two partitions 320, wherein the size of each rectangular sub-hole 310 is 0.1mm*0.25mm, so as to ensure that the total width of the opening portion 300 composed of the three rectangular sub-holes 310 is just larger than the wafer chip 220, and a perfect tension buffer circle 330 can be formed;

[0059] As a preferred solution of the above embodiment, the above step S100 includes the following steps:

[0060] Step S110 : performing a hole-forming process on the coiled substrate 100 by roller die-cutting to form the hole portion 300 ; or, step S120 : performing a hole-forming process on the coiled substrate 100 by laser punching to form the hole portion 300 .

[0061] In this way, the coil substrate 100 is opened by roller die cutting or laser punching, so that an opening portion 300 is formed on the coil substrate 100 around the wafer chip 220. The opening portion 300 is used to isolate the coil substrate 100 from the stretching force / tension / roller reaction force when it is subjected to stretching force / tension / roller reaction force, so that the stretching force / tension / roller reaction force will not act on the wafer chip 220, so that the wafer chip 220 will not be subjected to force or will be subjected to very little force, thereby achieving the purpose of dispersing the stretching force / tension / roller reaction force and avoiding the wafer chip 220 from collapsing and falling off.

[0062] Among them, the use of roller die-cutting to open holes in the coil substrate 100 refers to a roller die-cutting method that can ensure that the opening portion 300 is flat, and the die-cutting pressure is controllable and reliable, but correspondingly different label structures 200 need to match blades with different spacings, and regardless of the size of the opening portion 300, a waste suction device must be configured to use the waste suction device to suck the waste of the substrate after die-cutting. Specifically, the positioning accuracy of roller die-cutting reaches ±0.025~±0.03mm, and the opening size accuracy reaches ±0.035~0.05mm.

[0063] Among them, the use of laser punching to open holes in the coil substrate 100 refers to the use of laser punching, in which the control of the opening portion 300 is more precise and the installation is convenient. At the same time, the position of the opening portion 300 can be effectively and conveniently adjusted according to the different positions of the wafer chip 220, that is, it can be compatible with different types of label structures 200 and wafer chip 220 positions, and the adjustment is more convenient; but compared with the roller die cutting method, the laser punching method is relatively slower, and a positioning device and a waste suction device are required; specifically, the laser mode positioning accuracy reaches ±0.01~±0.02mm, and the opening size accuracy reaches ±0.05mm.

[0064] Furthermore, the above step S120 includes: the opening is rectangular, and the rectangular size of the opening 300 is 0.2mm*0.2mm or less. In this way, the laser can effectively destroy the substrate waste, so there is no need to configure a waste suction device, further reducing the equipment investment cost.

[0065] As a preferred solution of the above embodiment, the above step S200 includes the following steps:

[0066] Step S210: performing glue spraying on the surface of the wafer chip 220 to form a glue spraying area, wherein the glue spraying area covers the wafer chip 220;

[0067] In the above steps, UV glue is used for spraying, wherein the UV glue includes any one of black glue, white glue and transparent glue. The size of the spraying area is 1.2~1.5 times the size of the wafer chip 220 to ensure that the spraying area can fully wrap and cover the wafer chip 220. Since the common rectangular size of the wafer chip 220 is 0.35*0.35mm~0.60*0.60mm, the diameter of the spraying area is set to about 0.5~0.8mm, and the thickness of 0.3~0.4mm can completely wrap the wafer chip 220. At the same time, it can also prevent the UV glue from being unable to effectively wrap the wafer chip 220 due to its volume shrinkage after curing.

[0068] Step S220 : performing a curing process on the sprayed glue area to form the encapsulation portion 400 .

[0069] In the above steps, a UV lamp is used to cure the glue spraying area; the irradiation band of the UV lamp is 320~400nm, the irradiation temperature is 25~40℃, the irradiation intensity is 80~120mw / cm2, and the irradiation time is 1-2s.

[0070] In this way, after the wafer chip 220 is labeled to the antenna part 210 located on the roll substrate 100 to form the label structure 200, the surface of the wafer chip 220 is completely covered and wrapped with UV glue by high-speed glue spraying to form a glue spraying area, and then irradiated with a UV lamp to quickly solidify the UV glue in the glue spraying area to form an encapsulation part 400. The encapsulation part 400 is used to fully wrap the wafer chip 220, so that when the label roll passes through the roller, the wafer chip 220 is pushed up by the reaction force of the roller. The part 400 wraps the wafer chip 220, and the wrapping force and the reaction force given by the roller offset each other, so that the wafer chip 220 will not fall off the label roll, thereby improving the shear resistance of the wafer chip 220 in a series of processes such as preparation and transportation; at the same time, it can also improve the degree of integration between the wafer chip 220 and the antenna part 210, ensuring that when the wafer chip 220 is subjected to stretching force / tension / roller reaction force, it can still be maintained and labeled on the antenna part 210, so as to reduce the situation of the wafer chip 220 falling off and being lost, and greatly improve the product qualification rate.

[0071] At the same time, the encapsulation treatment mode is adopted to realize the protection of the wafer chip 220, and no waste substrate caused by die cutting or laser punching is generated, making the overall operation cleaner and neater than the opening treatment mode; and after encapsulation, the wafer chip 220 will not collapse under force in the subsequent steps, even if other steps contact the surface of the wafer chip 220. And the opening treatment mode does not include protection against the possibility of damage caused by other steps contacting the surface of the wafer chip 220; in terms of overall investment and energy consumption, the encapsulation treatment will be higher than the opening treatment mode, but the encapsulation treatment will be better for the stability and subsequent protection of the label structure 200.

[0072] This embodiment also discloses an RFID tag, which is manufactured by using the RFID tag manufacturing method of any of the above embodiments. For the specific steps of the RFID tag manufacturing method, refer to the above embodiments. Since the RFID tag adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0073] The above are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any direct / indirect application of the present invention in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing an RFID tag, applied to a tag roll, the tag roll comprising a roll substrate and a plurality of tag structures arranged in an array on the roll substrate, wherein each of the tag structures comprises an antenna portion and a wafer chip connected to a feeding point of the antenna portion; It is characterized in that The RFID tag manufacturing method comprises the following steps: The coil substrate around the wafer chip of each label structure is subjected to a hole-opening process to form an opening portion; wherein the opening portion is arranged in the front and rear side regions or the left and right side regions of the wafer chip along the feeding direction of the label coil, and the edge of the opening portion is located outside the edge of the wafer chip; and more than two separators are arranged inside each of the opening portions, wherein the length direction of the separators extends along the feeding direction of the label coil to separate the opening portion into a plurality of rectangular sub-holes; Performing encapsulation processing on the wafer chip of each tag structure to form an encapsulation part; The step of encapsulating each wafer chip of the label structure to form an encapsulation portion comprises the following steps: Performing glue spraying treatment on the surface of the wafer chip to form a glue spraying area, wherein the glue spraying area covers the wafer chip; The glue spraying area is cured to form the encapsulation portion.

2. The RFID tag manufacturing method according to claim 1, wherein: The step of performing a hole-opening process on the coil substrate around the wafer chip of each label structure to form an opening portion comprises: The opening portion is rectangular, and the distance between the opening portion and the wafer chip is 1 to 1.7 times the width of the wafer chip.

3. The RFID tag manufacturing method according to claim 1, wherein: The step of performing a hole-opening process on the coil substrate around the wafer chip of each label structure to form an opening portion comprises the following steps: The coil substrate is subjected to a hole-opening process by a roll die-cutting method to form the hole portion; Alternatively, the coil substrate is subjected to a hole-forming process by laser punching to form the hole portion.

4. The RFID tag manufacturing method according to claim 3, wherein: The step of performing hole processing on the coil substrate by laser punching includes: making the hole portion rectangular, and the size of the hole portion is 0.2mm*0.2mm or less.

5. The RFID tag manufacturing method according to claim 1, wherein: The step of performing glue spraying treatment on the surface of the wafer chip to form a glue spraying area comprises the following steps: UV glue is used for glue spraying, wherein the UV glue includes any one of black glue, white glue and transparent glue.

6. The RFID tag manufacturing method according to claim 1, wherein: The step of performing glue spraying treatment on the surface of the wafer chip to form a glue spraying area includes: making the size of the glue spraying area 1.2 to 1.5 times the size of the wafer chip.

7. The RFID tag manufacturing method according to claim 1, wherein: The step of curing the glue spraying area to form the encapsulation portion comprises the following steps: The spray glue area is cured by using a UV lamp; wherein the UV lamp has an irradiation band of 320-400nm, an irradiation temperature of 25-40°C, and an irradiation intensity of 80-120mw / cm 2 , the irradiation time is 1-2s.

8. An RFID tag, characterized in that: The RFID tag is manufactured by the manufacturing method according to any one of claims 1 to 7.

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